JP2007019355A - Electronic control apparatus and manufacturing method thereof - Google Patents

Electronic control apparatus and manufacturing method thereof Download PDF

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Publication number
JP2007019355A
JP2007019355A JP2005201034A JP2005201034A JP2007019355A JP 2007019355 A JP2007019355 A JP 2007019355A JP 2005201034 A JP2005201034 A JP 2005201034A JP 2005201034 A JP2005201034 A JP 2005201034A JP 2007019355 A JP2007019355 A JP 2007019355A
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electronic control
substrate
control device
thermal via
opening width
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Takashi Kume
貴史 久米
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Hitachi Ltd
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Hitachi Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic control apparatus for dissipating heat produced from a high-heat generating electric component externally via a board and a metallic case. <P>SOLUTION: The electronic control apparatus includes the metallic case 1 configured with a heat dissipation member, the board 3 joined with the metallic case 1, and the high-heat generating electric component 5 connected to the board 3 via solder 8. A thermal vias 7 are formed to the board 3, a plurality of metallic balls 10 are provided to the inside of the thermal vias 7, and the electronic control apparatus is configured such that the heat produced from the high-heat generating electric component 5 is externally dissipated via the board 3 and the metallic case 1. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

本発明は、電子制御装置及びその製造方法に係り、特に、高発熱電子部品からの熱を基板及び筐体を介して外部に放出するようにした放熱構造を有する自動車用の電子制御装置及びその製造方法に関する。   The present invention relates to an electronic control device and a method for manufacturing the same, and more particularly, to an electronic control device for an automobile having a heat dissipation structure that releases heat from a highly heat-generating electronic component to the outside through a substrate and a housing, and the same. It relates to a manufacturing method.

従来、基板に搭載した高発熱電子部品の熱を基板及び筐体を介し外部へ放出することを目的とし、基板に設けられたサーマルビアへのはんだ付け方法として、例えば、特許文献１（特開２００５−５６３１号公報）がある。   Conventionally, as a method of soldering to a thermal via provided on a substrate with the purpose of releasing heat of a highly heat-generating electronic component mounted on the substrate to the outside through the substrate and the housing, for example, Patent Document 1 2005-5631).

特許文献１には、サーマルビアにリフロー工程よりはんだを充填し、その後、高発熱電子部品やその他電子部品を基板に実装させるため、基板の一方の部品搭載面に、印刷工法よりはんだ供給を行い、リフロー工程にてはんだ付けを行う方法が記載されている。   In Patent Document 1, solder is supplied to a thermal via via a reflow process, and then solder is supplied to one component mounting surface of the substrate by a printing method in order to mount high heat generation electronic components and other electronic components on the substrate. A method of soldering in a reflow process is described.

また、リフロー工程による基板のサーマルビア内へのはんだ充填を行わず、高発熱電子部品やその他電子部品を基板に実装させるため、基板の一方の部品搭載面に、印刷工法よりはんだ供給を行い、その後、リフロー工程にてはんだ付けを行う方法がある。   In addition, solder is not filled into the thermal vias of the board by the reflow process, and high heat generation electronic parts and other electronic parts are mounted on the board. Thereafter, there is a method of performing soldering in a reflow process.

特開２００５−５６３１号公報JP 2005-5631 A

しかしながら、上記の従来技術は、印刷工法によるはんだ供給前に、フロー工程によりサーマルビアにはんだが充填されているため、リフロー工程において基板下面にはんだの垂れが生じ、筐体との接着時に支障をきたす。   However, in the above prior art, the solder is filled in the thermal via in the flow process before supplying the solder by the printing method. Come on.

また、印刷工法のみによるはんだ供給においては、サーマルビアへのはんだ充填が不十分となり、放熱性に支障をきたす。   In addition, in the solder supply only by the printing method, the solder filling into the thermal via becomes insufficient and the heat dissipation is hindered.

本発明は従来技術による課題を解決するものであり、基板にサーマルビアを形成し、サーマルビアへはんだを充填させることにより、高発熱電子部品より発生した熱を、基板及び筐体を介して外部に放出することを目的とする。   The present invention solves the problems of the prior art, and by forming a thermal via on a substrate and filling the thermal via with solder, heat generated from a highly heat-generating electronic component is externally transmitted through the substrate and the casing. The purpose is to release.

上記の課題を解決するため、本発明の電子制御装置の代表的な一つは、サーマルビアが形成された基板と、サーマルビアの内部に設けられた金属部材と、サーマルビアの内部に充填されたはんだを介して、基板の上に搭載された発熱部品とを有するものである。   In order to solve the above problems, a representative electronic control device according to the present invention includes a substrate on which a thermal via is formed, a metal member provided inside the thermal via, and a thermal via filled. And a heat-generating component mounted on the substrate via the solder.

好ましくは、サーマルビアは、発熱部品が搭載された側の主面における第１開口幅に比べて、この主面の反対側の他の主面における第２開口幅が小さくなっている。さらに、好ましくは、金属部材の形状は球状（金属ボール）であり、また、金属部材の直径は、第１開口幅より小さく第２開口幅より大きい。   Preferably, in the thermal via, the second opening width in the other main surface opposite to the main surface is smaller than the first opening width in the main surface on the side where the heat generating component is mounted. Further preferably, the shape of the metal member is spherical (metal ball), and the diameter of the metal member is smaller than the first opening width and larger than the second opening width.

この金属部材は、銅を含んでいることが好ましく、また、金属部材の表面がニッケルまたはスズめっきされていることが好ましい。   The metal member preferably contains copper, and the surface of the metal member is preferably plated with nickel or tin.

また、本発明の電子制御装置の製造方法の代表的な一つは、基板にサーマルビアを形成する工程と、サーマルビアの内部に球状の金属部材を供給する工程と、基板の上にはんだを供給する工程と、はんだを介して、基板の上に発熱部品を搭載する工程と、リフロー処理を行ってはんだを溶解することにより、サーマルビアの内部にはんだを充填させ、発熱部品を基板と接合させる工程とを有するものである。   In addition, a representative method for manufacturing an electronic control device according to the present invention includes a step of forming a thermal via on a substrate, a step of supplying a spherical metal member inside the thermal via, and soldering on the substrate. The step of supplying, the step of mounting the heat generating component on the substrate via the solder, the solder is filled by performing the reflow process to melt the solder, and the heat generating component is joined to the substrate And a step of causing

本発明によれば、放熱性を向上させた電子制御装置及びその製造方法を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the electronic control apparatus which improved heat dissipation, and its manufacturing method can be provided.

以下、本発明の一実施例である、自動車を制御するための電子制御装置及びその製造方法について、図面を参照して詳細に説明する。   Hereinafter, an electronic control device for controlling an automobile and a manufacturing method thereof according to an embodiment of the present invention will be described in detail with reference to the drawings.

図１は、本実施例における電子制御装置の正面図である。電子制御装置は、箱型形状の金属ケース１（筐体）を有し、ケース１内に電子回路が配置された基板３が収容されている。ケース１の外周面には、ケース１内部と外部との信号入出力を行うコネクタが配置され、基板３とコネクタ端子２はボンディングワイヤ４ａで接続されている。なお、ボンディングワイヤ４ａには、アルミワイヤ及びフレキシブルケーブルを用いるのが好ましい。   FIG. 1 is a front view of the electronic control device according to this embodiment. The electronic control device has a box-shaped metal case 1 (housing), and a substrate 3 on which an electronic circuit is arranged is accommodated in the case 1. On the outer peripheral surface of the case 1, a connector for performing signal input / output between the inside and the outside of the case 1 is disposed, and the substrate 3 and the connector terminal 2 are connected by a bonding wire 4a. Note that an aluminum wire and a flexible cable are preferably used for the bonding wire 4a.

基板３上には、エンジン制御を行うための所定の機能を実現するための回路が実装されている。例えば、基板３の中央部に配置された高発熱ＬＳＩ５（発熱部品，高発熱電子部品）は、制御装置を集中制御するＣＰＵが実装されている。また、他の電子部品６ａ，
６ｂが実装されている。 A circuit for realizing a predetermined function for performing engine control is mounted on the substrate 3. For example, a high heat generation LSI 5 (heat generation component, high heat generation electronic component) arranged at the center of the substrate 3 is mounted with a CPU that centrally controls the control device. In addition, other electronic components 6a,
6b is mounted.

図２は、本実施例における電子制御装置の断面図（概要図）であり、ここでは、本発明の特徴である放熱構造部を強調して示している。金属ケース１と基板３は、Ｓｉ接着剤９を用いて接続されている。高発熱ＬＳＩ５は、はんだ８を介して基板３に搭載されている。   FIG. 2 is a cross-sectional view (schematic diagram) of the electronic control unit according to the present embodiment, and here, the heat dissipation structure which is a feature of the present invention is highlighted. The metal case 1 and the substrate 3 are connected using a Si adhesive 9. The high heat generation LSI 5 is mounted on the substrate 3 via the solder 8.

基板３の内部には、放熱用のサーマルビア（スルーホール）７が形成されている。このため、高発熱ＬＳＩ５から発生した熱は、基板３及び金属ケース１を介して外部に放出される。サーマルビア７の内部には、銅からなる金属ボール１０（金属部材）が投入されている。また、高発熱ＬＳＩ５と基板３との接続にはボンディングワイヤ４ｂが用いられ、これにより電気的接続が行われている。   A thermal via (through hole) 7 for heat dissipation is formed inside the substrate 3. For this reason, the heat generated from the high heat generation LSI 5 is released to the outside through the substrate 3 and the metal case 1. A metal ball 10 (metal member) made of copper is placed inside the thermal via 7. Further, a bonding wire 4b is used for the connection between the high heat generation LSI 5 and the substrate 3, whereby electrical connection is performed.

次に、図３〜図８を参照して、本実施例の電子制御装置の製造方法を詳細に説明する。   Next, with reference to FIGS. 3 to 8, a method for manufacturing the electronic control device of this embodiment will be described in detail.

まず、図３に示すように、基板３において、高発熱ＬＳＩ５からの熱を金属ケース１に逃がすためのサーマルビア７と呼ばれるスルーホールを形成する。このようなサーマルビア７を設けると、熱伝導率の小さい基板３に妨げられることなく、効率よく金属ケース１へ熱の移動が可能となる。   First, as shown in FIG. 3, a through-hole called a thermal via 7 for releasing heat from the high heat generation LSI 5 to the metal case 1 is formed in the substrate 3. When such a thermal via 7 is provided, heat can be efficiently transferred to the metal case 1 without being obstructed by the substrate 3 having a low thermal conductivity.

また、サーマルビア７には後述する銅で構成された金属ボール１０(金属部材)の落下を防止するためのテーパーが設けられている。すなわち、サーマルビア７は、高発熱ＬＳＩ５が搭載された側の基板主面における第１開口幅に比べて、この主面とは反対側の他の主面における第２開口幅が小さくなっている。   The thermal via 7 is provided with a taper for preventing a metal ball 10 (metal member) made of copper, which will be described later, from dropping. That is, in the thermal via 7, the second opening width on the other main surface opposite to the main surface is smaller than the first opening width on the main surface of the substrate on which the high heat generating LSI 5 is mounted. .

次に、図４に示すように、基板３に設けられたサーマルビア７の内部に銅で構成された金属ボール１０（金属部材）が投入される。金属ボール１０としては、熱伝導率がよく、はんだ接合が容易な銅（Ｃｕ）が用いられているが、他の金属で代替することもできる。   Next, as shown in FIG. 4, a metal ball 10 (metal member) made of copper is put into a thermal via 7 provided on the substrate 3. As the metal ball 10, copper (Cu) having good thermal conductivity and easy soldering is used, but other metal can be used instead.

また、金属ボール１０の直径は、基板３の裏面のサーマルビア７の径（第２開口幅）に比べて大きいことが好ましい。サーマルビア７は、テーパーが設けられている。このため、金属ボール１０の直径を、基板３の裏面のサーマルビア７の径（第２開口幅）に比べて大きくすれば、金属ボール１０の落下を防止することができる。   The diameter of the metal ball 10 is preferably larger than the diameter of the thermal via 7 on the back surface of the substrate 3 (second opening width). The thermal via 7 is provided with a taper. For this reason, if the diameter of the metal ball 10 is made larger than the diameter (second opening width) of the thermal via 7 on the back surface of the substrate 3, the metal ball 10 can be prevented from falling.

また、銅からなる金属ボール１０には、はんだ接合をより容易にするため、ニッケル
（Ｎｉ）めっき、または、スズ（Ｓｎ）めっき等の表面処理を行うことが好ましい。 Further, the metal ball 10 made of copper is preferably subjected to a surface treatment such as nickel (Ni) plating or tin (Sn) plating in order to facilitate solder bonding.

次に、図５に示すように、基板３の上に印刷工法を施すことにより、はんだ８を供給する。基板３へのはんだ８印刷は、基板３に金属性のマスクを押し当て、基板３面とは反対側のマスク面にペースト状のはんだ８を塗布し、スキージーを用いて均一に基板３にはんだ８を印刷させる。なお、マスクには、はんだ８を印刷させる部分にのみ穴が開いている。   Next, as shown in FIG. 5, the solder 8 is supplied by performing a printing method on the substrate 3. Solder 8 printing on the substrate 3 is performed by pressing a metallic mask against the substrate 3, applying paste solder 8 on the mask surface opposite to the substrate 3 surface, and uniformly soldering the substrate 3 using a squeegee. 8 is printed. Note that the mask has a hole only in a portion where the solder 8 is printed.

次に、図６に示すように、基板３に高発熱ＬＳＩ５を搭載する。例えば、高発熱ＬＳＩ５は、基板３の中央部に配置され、制御装置を集中制御するＣＰＵが搭載されている。また、高発熱ＬＳＩ５は、ボンディングワイヤ４ｂを用いて基板３に接続される。   Next, as shown in FIG. 6, the high heat generation LSI 5 is mounted on the substrate 3. For example, the high heat generation LSI 5 is disposed in the center of the substrate 3 and is equipped with a CPU that centrally controls the control device. The high heat generation LSI 5 is connected to the substrate 3 using bonding wires 4b.

なお、基板３の上には、エンジン制御を行うための所定の機能を実現するための回路が形成され、高発熱ＬＳＩ５以外にも、必要な電子部品６ａ，６ｂが搭載される。   A circuit for realizing a predetermined function for performing engine control is formed on the substrate 3, and necessary electronic components 6 a and 6 b are mounted in addition to the high heat generation LSI 5.

次に、図７に示すように、リフロー処理を行い、はんだ付けが実施される。基板３へのはんだ８印刷後、リフロー処理により、はんだ８を溶融させ、はんだ８の接続が行われる。ここで、サーマルビア７の内部には金属ボール１０が存在するため、はんだ８がサーマルビア７内に充分に濡れ広がる。このため、高発熱ＬＳＩ５からの熱を効率良く基板３の裏面へ移動させることが可能となる。   Next, as shown in FIG. 7, a reflow process is performed and soldering is performed. After printing the solder 8 on the substrate 3, the solder 8 is melted by reflow processing, and the solder 8 is connected. Here, since the metal ball 10 exists inside the thermal via 7, the solder 8 is sufficiently wet and spread in the thermal via 7. For this reason, the heat from the high heat generation LSI 5 can be efficiently transferred to the back surface of the substrate 3.

次に、図８に示すように、基板３と金属ケース１をＳｉ接着剤９を用いて接着する。金属ケース１上にＳｉ接着剤９を塗布し、基板３の固定後、Ｓｉ接着剤９を硬化させ、基板３と金属ケース１を接着させる。ここで、Ｓｉ接着剤９は、熱伝導率の高い接着剤が好ましい。また、Ｓｉ接着剤９の厚み制御のための突起１１を設けることが好ましい。   Next, as shown in FIG. 8, the substrate 3 and the metal case 1 are bonded using a Si adhesive 9. The Si adhesive 9 is applied on the metal case 1, and after fixing the substrate 3, the Si adhesive 9 is cured to bond the substrate 3 and the metal case 1. Here, the Si adhesive 9 is preferably an adhesive having high thermal conductivity. Further, it is preferable to provide a protrusion 11 for controlling the thickness of the Si adhesive 9.

本実施例の高放熱実装構造を備えた電子制御装置によれば、以下の効果が得られる。すなわち、基板に形成されたサーマルビアの内部に金属部材（金属ボール）を投入したことにより、サーマルビアの内部に供給されたはんだは、サーマルビアの内部に容易に濡れ広がる。また、基板に形成したサーマルビアにテーパーを設ければ、金属ボールの落下を防止することができる。   According to the electronic control device having the high heat dissipation mounting structure of the present embodiment, the following effects can be obtained. That is, by supplying a metal member (metal ball) into the thermal via formed on the substrate, the solder supplied into the thermal via easily wets and spreads inside the thermal via. Further, if the thermal via formed on the substrate is tapered, the metal ball can be prevented from dropping.

以上、本発明を具体的実施例に基づいて説明したが、本発明は上記実施例に限られるものではなく、発明思想の範囲内で種々の変更が可能である。例えば、本実施例は自動車を制御するための電子制御装置についてのものであるが、本発明は、自動車用以外に用いられる電子制御装置にも当然に適用されるものである。また、金属部材は銅で構成された球状部材（金属ボール）であることを説明したが、銅以外の材料や、立方体等他の形状のものを用いることもできる。   The present invention has been described based on the specific embodiments. However, the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the inventive idea. For example, the present embodiment relates to an electronic control device for controlling an automobile, but the present invention is naturally applied to an electronic control device used for other than an automobile. In addition, although it has been described that the metal member is a spherical member (metal ball) made of copper, materials other than copper or other shapes such as a cube can be used.

本発明を適用した電子制御装置の正面図。1 is a front view of an electronic control device to which the present invention is applied. 本発明を適用した電子制御装置の断面図（放熱構造概要図）。Sectional drawing (radiation structure schematic diagram) of the electronic controller to which this invention is applied. 本発明の電子制御装置の製造方法を示す図（基板概要）。The figure which shows the manufacturing method of the electronic control apparatus of this invention (board | substrate outline | summary). 本発明の電子制御装置の製造方法を示す図（金属ボール投入）。The figure which shows the manufacturing method of the electronic control apparatus of this invention (metal ball injection | throwing-in). 本発明の電子制御装置の製造方法を示す図（はんだ供給）。The figure which shows the manufacturing method of the electronic control apparatus of this invention (solder supply). 本発明の電子制御装置の製造方法を示す図（電子部品搭載）。The figure which shows the manufacturing method of the electronic control apparatus of this invention (electronic component mounting). 本発明の電子制御装置の製造方法を示す図（リフロー処理後）。The figure which shows the manufacturing method of the electronic control apparatus of this invention (after a reflow process). 本発明の電子制御装置の製造方法を示す図（完成）。The figure which shows the manufacturing method of the electronic control apparatus of this invention (completed).

符号の説明Explanation of symbols

１…金属ケース、２…コネクタ端子、３…基板、４ａ，４ｂ…ボンディングワイヤ、５…高発熱ＬＳＩ、６ａ，６ｂ…電子部品、７…サーマルビア、８…はんだ、９…Ｓｉ接着剤、１０…金属ボール、１１…突起。
DESCRIPTION OF SYMBOLS 1 ... Metal case, 2 ... Connector terminal, 3 ... Board | substrate, 4a, 4b ... Bonding wire, 5 ... High heat generation LSI, 6a, 6b ... Electronic component, 7 ... Thermal via, 8 ... Solder, 9 ... Si adhesive, 10 ... metal balls, 11 ... protrusions.

Claims (10)

サーマルビアが形成された基板と、
前記サーマルビアの内部に設けられた金属部材と、
前記サーマルビアの内部に充填されたはんだを介して、前記基板の上に搭載された発熱部品とを有することを特徴とする電子制御装置。 A substrate on which thermal vias are formed;
A metal member provided inside the thermal via;
An electronic control device comprising: a heat generating component mounted on the substrate through solder filled in the thermal via. 請求項１記載の電子制御装置において、
前記サーマルビアは、前記発熱部品が搭載された側の主面における第１開口幅に比べて、該主面とは反対側の他の主面における第２開口幅が小さくなっていることを特徴とする電子制御装置。 The electronic control device according to claim 1,
The thermal via is characterized in that the second opening width in the other main surface opposite to the main surface is smaller than the first opening width in the main surface on the side where the heat generating component is mounted. An electronic control device. 請求項１または２記載の電子制御装置において、
前記金属部材の形状は、球状であることを特徴とする電子制御装置。 The electronic control device according to claim 1 or 2,
The shape of the said metal member is spherical shape, The electronic control apparatus characterized by the above-mentioned. 請求項３記載の電子制御装置において、
前記金属部材の直径は、前記第１開口幅より小さく、前記第２開口幅より大きいことを特徴とする電子制御装置。 The electronic control device according to claim 3.
The diameter of the said metal member is smaller than the said 1st opening width, and is larger than the said 2nd opening width, The electronic control apparatus characterized by the above-mentioned. 請求項１乃至４のいずれか一に記載の電子制御装置において、
前記金属部材は、銅を含んでなることを特徴とする電子制御装置。 The electronic control device according to any one of claims 1 to 4,
The electronic control device according to claim 1, wherein the metal member includes copper. 請求項１乃至５のいずれか一に記載の電子制御装置において、
前記金属部材の表面は、ニッケルまたはスズめっきされていることを特徴とする電子制御装置。 The electronic control device according to any one of claims 1 to 5,
The surface of the metal member is plated with nickel or tin, and is an electronic control device. 放熱部材により構成された筐体と、
前記筐体に接着されている基板と、
前記基板にはんだ付けにより搭載されている高発熱電子部品とを有する電子制御装置であって、
前記基板には、サーマルビアが形成されており、
前記サーマルビアの内部には、複数の金属ボールが設けられており、
前記高発熱電子部品から発生された熱を、前記基板及び前記筐体を介して外部に放出するようにした電子制御装置。 A housing constituted by a heat dissipation member;
A substrate bonded to the housing;
An electronic control device having a high heat generation electronic component mounted on the substrate by soldering,
Thermal vias are formed on the substrate,
A plurality of metal balls are provided inside the thermal via,
An electronic control device that releases heat generated from the highly heat-generating electronic component to the outside through the substrate and the housing. 請求項７記載の電子制御装置において、
前記サーマルビアにテーパーを設け、前記金属ボールの落下を防止することを特徴とする電子装置の放熱構造。 The electronic control device according to claim 7.
A heat dissipation structure for an electronic device, wherein the thermal via is tapered to prevent the metal ball from falling. 基板にサーマルビアを形成する工程と、
前記サーマルビアの内部に球状の金属部材を供給する工程と、
前記基板の上にはんだを供給する工程と、
前記はんだを介して、前記基板の上に発熱部品を搭載する工程と、
リフロー処理を行って前記はんだを溶解することにより、前記サーマルビアの内部に前記はんだを充填させ、前記電子部品を前記基板と接合させる工程とを有することを特徴とする電子制御装置の製造方法。 Forming thermal vias on the substrate;
Supplying a spherical metal member inside the thermal via;
Supplying solder onto the substrate;
Mounting the heat-generating component on the substrate via the solder;
A method of manufacturing an electronic control device, comprising: performing a reflow process to melt the solder, filling the solder into the thermal via, and joining the electronic component to the substrate. 請求項９記載の電子制御装置の製造方法において、
前記サーマルビアは、前記発熱部品が搭載される側の主面における第１開口幅に比べて、反対側の他の主面における第２開口幅が小さくなるように形成され、
前記金属部材の直径は、前記第１開口幅より小さく、前記第２開口幅より大きいものが用いられていることを特徴とする電子制御装置の製造方法。
In the manufacturing method of the electronic control unit according to claim 9,
The thermal via is formed such that the second opening width on the other main surface on the opposite side is smaller than the first opening width on the main surface on the side where the heat generating component is mounted,
The diameter of the said metal member is smaller than the said 1st opening width, and the thing larger than the said 2nd opening width is used, The manufacturing method of the electronic control apparatus characterized by the above-mentioned.
JP2005201034A 2005-07-11 2005-07-11 Electronic control apparatus and manufacturing method thereof Pending JP2007019355A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011505077A (en) * 2007-11-27 2011-02-17 ヤザキ・ヨーロッパ・リミテッド Junction box

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011505077A (en) * 2007-11-27 2011-02-17 ヤザキ・ヨーロッパ・リミテッド Junction box

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