JP2007018860A - Charge reducing apparatus, exposure apparatus, measuring apparatus, and manufacturing method of device - Google Patents

Charge reducing apparatus, exposure apparatus, measuring apparatus, and manufacturing method of device Download PDF

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JP2007018860A
JP2007018860A JP2005198838A JP2005198838A JP2007018860A JP 2007018860 A JP2007018860 A JP 2007018860A JP 2005198838 A JP2005198838 A JP 2005198838A JP 2005198838 A JP2005198838 A JP 2005198838A JP 2007018860 A JP2007018860 A JP 2007018860A
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electron beam
charged
charge
charged particle
particle beam
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Kazuhiko Kato
和彦 加藤
Shin Sakakibara
慎 榊原
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Canon Inc
Hitachi High Tech Corp
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Hitachi High Technologies Corp
Canon Inc
Hitachi High Tech Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a charge reducing apparatus used in an exposing device or a measuring device which irradiates a charged particle beam from a charged particle source to a sample, by applying deflection control by deflection electrodes disposed face to face in a vacuum column to reduce the charge of a portion charged with positive or negative electricity by the charged particle beam in the deflection electrodes, the exposure apparatus and the measuring apparatus equipped with the charge reducing apparatus, and to provide a manufacturing method for a device that uses the exposure device. <P>SOLUTION: This charge reducing device has an electron beam irradiation means to irradiate an electron beam to the charged portion of the deflection electrodes which are charged with positive or negative electricity by the charged particle beam, and a means of changing the irradiation energy of the electron beam. Thereby, charge of the deflection electrodes is reduced; and since even if the deflection electrodes are charged with both positive and negative electricity, two of positive and negative beam sources are not used, but charge can be reduced by using only the electron beam, the constitution of the device can be simplified. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、荷電粒子源からの荷電粒子ビームを真空カラム内に対向配置された偏向電極により偏向制御して試料に照射する露光装置または測定装置に用いられる帯電低減装置、その帯電低減装置を備える露光装置、測定装置およびその露光装置を用いるデバイス製造方法に関する。   The present invention includes a charge reducing device used in an exposure apparatus or a measuring apparatus that controls a deflection of a charged particle beam from a charged particle source by a deflection electrode disposed opposite to the inside of a vacuum column and irradiates a sample, and the charge reducing apparatus. The present invention relates to an exposure apparatus, a measurement apparatus, and a device manufacturing method using the exposure apparatus.

従来、例えば、特開平5−291100号公報(特許文献1)により放電により帯電を除去する帯電除去技術が提案され、荷電粒子を発生させ被処理物(試料)に照射する第一の放電と、放電領域と被処理物を隔壁により分離して被処理物に荷電粒子を照射しないように行う第二の放電とを交互に行う等により、荷電粒子を発生させ被処理物に照射する第一の放電により従来同様の帯電除去を実現し、被処理物の帯電除去が行われる。
また、特開平11−174008号公報(特許文献2)により、帯電とは反対の電荷を持つ荷電粒子を照射する機構が提案され、1次荷電粒子を試料に照射し、該試料から放出される2次荷電粒子を検出する荷電粒子装置において、前記試料の帯電個所にその帯電した電荷と逆符号の電荷を補給して帯電を打ち消す帯電除去装置を具備する。
これらの特開平5−291100号公報(特許文献1)および特開平11−174008号公報(特許文献2)は主に試料の帯電を低減するものである。
特開平5−291100号公報 特開平11−174008号公報
Conventionally, for example, Japanese Patent Laid-Open No. 5-291100 (Patent Document 1) proposes a charge removal technique for removing charge by discharge, and generates a charged particle and irradiates a workpiece (sample) with a first discharge; First, the charged region is generated to irradiate the object by separating the discharge region and the object to be processed by the partition and alternately performing the second discharge that is performed so that the object is not irradiated with the charged particles. The same charge removal as before is realized by discharging, and the charge removal of the object to be processed is performed.
Japanese Patent Application Laid-Open No. 11-174008 (Patent Document 2) proposes a mechanism for irradiating charged particles having a charge opposite to that of charging, irradiating the sample with primary charged particles, and releasing the sample from the sample. The charged particle device for detecting secondary charged particles includes a charge removing device that replenishes the charged portion of the sample with a charge opposite in sign to the charged charge to cancel the charge.
These JP-A-5-291100 (Patent Document 1) and JP-A-11-174008 (Patent Document 2) mainly reduce the charging of the sample.
JP-A-5-291100 Japanese Patent Laid-Open No. 11-174008

ほぼ真空のカラム内で荷電粒子ビームが電子源から照射され、対向して配置される偏向電極の間を通過して試料に照射される露光装置または顕微鏡において、装置を構成する偏向電極の各部位にコンタミネーション等の帯電物質が付着し、そこが荷電粒子ビームによって帯電し、この帯電によって露光、もしくは観察のために用いる荷電粒子ビーム自身が影響を受けてしまうため、帯電を極力無くす、または、少なくする必要がある。
そこで、本発明は、荷電粒子源からの荷電粒子ビームを真空カラム内に対向配置された偏向電極により偏向制御して試料に照射する露光装置または測定装置に用いられ、偏向電極における荷電粒子ビームにより正または負に帯電された部位の帯電を低減する帯電低減装置、その帯電低減装置を備える露光装置、測定装置およびその露光装置を用いるデバイス製造方法を提供することを目的とする。
In an exposure apparatus or microscope in which a charged particle beam is irradiated from an electron source in an almost vacuum column, and passes through the deflecting electrodes arranged opposite to each other to irradiate the sample, each part of the deflecting electrode constituting the apparatus Charged substances such as contamination adhere to the surface, which is charged by a charged particle beam, and the charged particle beam itself used for exposure or observation is affected by this charging. There is a need to reduce it.
Therefore, the present invention is used in an exposure apparatus or a measurement apparatus that irradiates a sample by controlling the deflection of a charged particle beam from a charged particle source with a deflection electrode disposed opposite to the vacuum column. It is an object of the present invention to provide a charge reduction device that reduces the charge of a positively or negatively charged portion, an exposure apparatus including the charge reduction device, a measurement apparatus, and a device manufacturing method using the exposure apparatus.

上記の目的を達成するために本発明の帯電低減装置は、荷電粒子源からの荷電粒子ビームを真空カラム内に対向配置された偏向電極により偏向制御して試料に照射する露光装置または測定装置に用いられる帯電低減装置において、
前記荷電粒子ビームによって正または負に帯電された前記偏向電極の帯電部位に対して電子ビームを照射する電子ビーム照射手段と、
前記電子ビームの照射エネルギーを変化させる手段と、を有することを特徴とする。
さらに、本発明の帯電低減装置は、前記偏向電極の帯電部位における帯電電位に基づいて、前記電子ビームの照射エネルギーを変化させることを特徴とする。
さらに、本発明の帯電低減装置は、前記電子ビーム照射手段は、電子銃および加速電圧印加手段を有しており、前記加速電圧印加手段における加速電圧を変化させることで、所望の照射エネルギーを得ることを特徴とする。
さらに、本発明の帯電低減装置は、前記電子ビームは、前記荷電粒子ビームよりもエネルギー強度が低く、エネルギー分散が大きいことを特徴とする。
さらに、本発明の帯電低減装置は、荷電粒子源からの荷電粒子ビームを真空カラム内に対向配置された偏向電極により偏向制御して試料に照射する露光装置または測定装置に用いられる帯電低減装置において、
前記荷電粒子ビームが照射された際に2次的電子ビームを反射する反射部位を備え、
前記反射部位からの2次的電子ビームを、前記荷電粒子ビームによって正または負に帯電された前記偏向電極の帯電部位に対して照射することで、前記帯電部位の帯電を低減することを特徴とする。
さらに、本発明の帯電低減装置は、前記反射部位は、金属材料としてはAu,Cu、化合物材料としては CsI, Alから構成される。
さらに、本発明の帯電低減装置は、前記2次的電子ビームは、前記荷電粒子ビームよりもエネルギー強度が低く、エネルギー分散が大きいことを特徴とする。
さらに、本発明の露光装置は、前記帯電低減装置を備える。
さらに、本発明の測定装置は、前記帯電低減装置を備える。
さらに、本発明のデバイス製造方法は、前記露光装置を用いて試料を露光する工程と、露光された前記試料を現像する工程と、を備える。
In order to achieve the above object, an electrification reducing apparatus according to the present invention is an exposure apparatus or a measurement apparatus that irradiates a sample by controlling the deflection of a charged particle beam from a charged particle source by a deflection electrode disposed oppositely in a vacuum column. In the charge reduction device used,
An electron beam irradiation means for irradiating the charged portion of the deflection electrode charged positively or negatively by the charged particle beam with an electron beam;
And means for changing irradiation energy of the electron beam.
Furthermore, the charge reducing device of the present invention is characterized in that the irradiation energy of the electron beam is changed based on a charging potential at a charging portion of the deflection electrode.
Furthermore, in the charge reduction device of the present invention, the electron beam irradiation means includes an electron gun and an acceleration voltage application means, and a desired irradiation energy is obtained by changing the acceleration voltage in the acceleration voltage application means. It is characterized by that.
Furthermore, the charge reducing device of the present invention is characterized in that the electron beam has a lower energy intensity and a larger energy dispersion than the charged particle beam.
Furthermore, the charge reduction device of the present invention is a charge reduction device used in an exposure apparatus or a measurement apparatus that irradiates a sample by controlling the deflection of a charged particle beam from a charged particle source using a deflection electrode disposed opposite to the vacuum column. ,
A reflective portion for reflecting a secondary electron beam when irradiated with the charged particle beam;
The charging of the charged portion is reduced by irradiating the charged portion of the deflection electrode, which is positively or negatively charged by the charged particle beam, with a secondary electron beam from the reflective portion. To do.
Furthermore, in the electrification reducing apparatus of the present invention, the reflection portion is made of Au or Cu as a metal material and CsI or Al 2 O 3 as a compound material.
Furthermore, the charge reducing device of the present invention is characterized in that the secondary electron beam has a lower energy intensity and a larger energy dispersion than the charged particle beam.
Furthermore, the exposure apparatus of the present invention includes the above-described charging reduction device.
Furthermore, the measuring device of the present invention includes the above-described charging reduction device.
Furthermore, the device manufacturing method of the present invention includes a step of exposing a sample using the exposure apparatus, and a step of developing the exposed sample.

本発明の帯電除去装置によれば、前記荷電粒子ビームによって正または負に帯電された前記偏向電極の帯電部位に対して電子ビームを照射する電子ビーム照射手段と、前記電子ビームの照射エネルギーを変化させる手段と、を有する。
このため、偏向電極の帯電が低減され、正負どちらの帯電に対しても、正負二つの線源ではなく、電子ビームのみを用いて帯電を低減させることができ、装置構成が簡略化される。
さらに、本発明の帯電低減装置によれば、前記荷電粒子ビームが照射された際に2次的電子ビームを反射する反射部位を備え、前記反射部位からの2次的電子ビームを、前記荷電粒子ビームによって正または負に帯電された前記偏向電極の帯電部位に対して照射することで、前記帯電部位の帯電を低減する。
このため、偏向電極の帯電が低減され、正負どちらの帯電に対しても、正負二つの線源ではなく、電子ビームのみを用いることで帯電を低減させることができ、装置構成が簡略化される。
さらに、本発明の帯電低減装置によれば、前記電子ビームまたは前記2次的電子ビームは、前記荷電粒子ビームに比べて十分に低エネルギーで、広いエネルギー分散を有し、正負どちらの帯電に対しても十分に帯電電位を低減させる。
さらに、本発明の露光装置および測定装置は、前記帯電低減装置を備え、偏向電極の帯電が低減される。
さらに、本発明のデバイス製造方法は、前記露光装置を用いて試料を露光する工程と、露光された前記試料を現像する工程と、を備え、偏向電極の帯電が低減される。
According to the charging removal device of the present invention, the electron beam irradiation means for irradiating the charged portion of the deflection electrode positively or negatively charged by the charged particle beam with the electron beam and the irradiation energy of the electron beam are changed. Means.
For this reason, the charging of the deflection electrode is reduced. For both positive and negative charges, the charge can be reduced using only the electron beam instead of the two positive and negative radiation sources, and the apparatus configuration is simplified.
Furthermore, according to the charge reducing device of the present invention, the apparatus includes a reflection portion that reflects a secondary electron beam when the charged particle beam is irradiated, and the secondary electron beam from the reflection portion is converted into the charged particle. By irradiating the charged portion of the deflection electrode, which is positively or negatively charged by a beam, charging of the charged portion is reduced.
For this reason, the charging of the deflection electrode is reduced, and the charging can be reduced by using only the electron beam instead of the two positive and negative sources for both positive and negative charging, and the apparatus configuration is simplified. .
Further, according to the charge reducing device of the present invention, the electron beam or the secondary electron beam has sufficiently low energy and wide energy dispersion compared to the charged particle beam, and the charge beam is positive or negative. However, the charging potential is sufficiently reduced.
Furthermore, the exposure apparatus and the measurement apparatus of the present invention include the charge reducing device, and the charging of the deflection electrode is reduced.
Furthermore, the device manufacturing method of the present invention comprises a step of exposing a sample using the exposure apparatus and a step of developing the exposed sample, and the charging of the deflection electrode is reduced.

以下、本発明を、その実施例に基づいて、図面を参照して説明する。   Hereinafter, the present invention will be described with reference to the drawings based on the embodiments.

図1は、本発明の実施例1の帯電低減装置が適用される電子ビーム露光装置のカラム内部の構成図である。電子ビーム露光装置の代わりに顕微鏡等の測定装置に本発明の実施例1の帯電低減装置が適用される場合も有る。
電子ビーム露光装置を構成するほぼ真空のカラム6内で、荷電粒子ビーム2が図示されない電子源から照射され、対向して配置される偏向電極1,1の間を通過して図示されない試料に照射される。偏向電極1,1は、金、銅、アルミニウム、白金、パラジウム等から成る。帯電除去用の電子ビーム発生手段である電子ビーム発生源3は電子ビーム17を発生する装置で、図2に詳細図が示されるように電子ビーム発生源3は電子銃11および駆動高圧電源12とから成る。電子銃11はフィラメントと加速用のウェネルトから成り、通常の電子ビーム発生装置と同様、フィラメントにはタングステンやLaB6を用いる。駆動高圧電源12は電子銃11から電子ビーム17を発生加速させるための電源で、加速電圧を時間的に変化させて必要なエネルギー分散を得るようにする。周期は帯電が緩和するように十分短い時間に設定する。
この電子ビーム17を偏向電極1,1における荷電粒子ビーム2により正または負に帯電された部位4に対して照射し、帯電された部位4の帯電を低減する。帯電された部位4にはコンタミネーション5が付着し、そこが荷電粒子ビーム2によって帯電し、この帯電によって露光、もしくは観察のために用いる荷電粒子ビーム2自身が影響を受けてしまうため、帯電を極力なくす、または少なくする必要がある。
FIG. 1 is a configuration diagram of the inside of a column of an electron beam exposure apparatus to which the charge reduction device of Embodiment 1 of the present invention is applied. In some cases, the charge reducing device according to the first embodiment of the present invention is applied to a measuring device such as a microscope instead of the electron beam exposure device.
In a substantially vacuum column 6 constituting an electron beam exposure apparatus, a charged particle beam 2 is irradiated from an electron source (not shown), passes between deflection electrodes 1 and 1 arranged opposite to each other, and irradiates a sample (not shown). Is done. The deflection electrodes 1 and 1 are made of gold, copper, aluminum, platinum, palladium or the like. An electron beam generating source 3 which is an electron beam generating means for removing electrification is a device for generating an electron beam 17. As shown in detail in FIG. 2, the electron beam generating source 3 includes an electron gun 11, a driving high voltage power source 12, and the like. Consists of. The electron gun 11 is composed of a filament and an acceleration Wehnelt, and tungsten or LaB6 is used for the filament as in a normal electron beam generator. The driving high-voltage power source 12 is a power source for generating and accelerating the electron beam 17 from the electron gun 11, and obtains necessary energy dispersion by changing the acceleration voltage with time. The period is set to a sufficiently short time so that charging is eased.
The electron beam 17 is applied to the portion 4 that is positively or negatively charged by the charged particle beam 2 in the deflection electrodes 1, 1, thereby reducing the charging of the charged portion 4. Contamination 5 adheres to the charged portion 4 and is charged by the charged particle beam 2, and the charged particle beam 2 itself used for exposure or observation is affected by this charging. It is necessary to eliminate or reduce as much as possible.

電子ビーム発生源3から発生照射される電子ビーム17は、図3に示されるように荷電粒子ビーム2のエネルギー分散8に比べて十分に低エネルギーで広いエネルギー分散7を有する。駆動高圧電源12の電圧を周期的に変化させることでこのエネルギー分散7を得ることができる。
図4に電子ビーム発生源3から発生される電子ビーム17を照射したときの帯電された部位4の電子ビーム−帯電応答性が示され、正の帯電と負の帯電が両方現れ、結果として中和し帯電がなくなるか、比較的低電圧の帯電に緩和する。電子ビーム発生源3から発生される電子ビーム17の照射エネルギーを変化させることで、図4に示されるように帯電電圧が正から負まで変化する。
このことから正負をまたぐ図3に示される領域の広い分布のエネルギー分散7を有する電子ビーム17を照射することで、正負の帯電が中和し帯電が減少する。
As shown in FIG. 3, the electron beam 17 generated and irradiated from the electron beam generation source 3 has a sufficiently low energy and a wide energy dispersion 7 compared to the energy dispersion 8 of the charged particle beam 2. This energy dispersion 7 can be obtained by periodically changing the voltage of the driving high-voltage power supply 12.
FIG. 4 shows the electron beam-charging responsiveness of the charged portion 4 when the electron beam 17 generated from the electron beam generating source 3 is irradiated. Both positive charging and negative charging appear, and as a result Add up to eliminate charge or relax to charge at a relatively low voltage. By changing the irradiation energy of the electron beam 17 generated from the electron beam generation source 3, the charging voltage changes from positive to negative as shown in FIG.
Therefore, by irradiating the electron beam 17 having the energy distribution 7 having a wide distribution of the region shown in FIG. 3 across the positive and negative, the positive and negative charges are neutralized and the charge is reduced.

次に、図5を参照して本発明の実施例2の帯電低減装置を説明する。
本発明の実施例2の帯電低減装置は、ほぼ真空のカラム6内で荷電粒子ビーム2が図示されない電子源から照射され、対向して配置される偏向電極1,1の間を通過して図示されない試料に照射される露光装置に適用される。露光装置の代わりに顕微鏡等の測定装置に本発明の実施例2の帯電低減装置が適用される場合も有る。
荷電粒子ビーム2は、偏向電極1,1及び偏向器9,9により偏向制御される。例えば、金属材料としては Au,Cu、化合物材料としては CsI, Alから構成される反射部位10,10は、荷電粒子ビーム2が照射され反射される。反射部位10,10から反射された2次的電子ビーム2aを、偏向電極1,1における荷電粒子ビーム2により正または負に帯電された部位4に対して照射することにより帯電された部位4の帯電を低減する。
ここで、2次的電子ビーム2aは、荷電粒子ビーム2に比べて十分に低エネルギーで、広いエネルギー分散を有する。
露光装置および顕微鏡等の測定装置が本発明の実施例1および2の帯電低減装置を備える場合も有る。
Next, referring to FIG. 5, a description will be given of an electrification reducing apparatus according to Embodiment 2 of the present invention.
The charge reduction device according to the second embodiment of the present invention is illustrated by passing a charged particle beam 2 from an electron source (not shown) in a substantially vacuum column 6 and passing between deflecting electrodes 1 and 1 arranged opposite to each other. The present invention is applied to an exposure apparatus that irradiates a sample that is not performed. In some cases, the charge reduction device according to the second embodiment of the present invention may be applied to a measurement device such as a microscope instead of the exposure device.
The deflection of the charged particle beam 2 is controlled by the deflection electrodes 1 and 1 and the deflectors 9 and 9. For example, the reflective parts 10 and 10 made of Au or Cu as the metal material and CsI or Al 2 O 3 as the compound material are irradiated with the charged particle beam 2 and reflected. The secondary electron beam 2 a reflected from the reflective parts 10, 10 is irradiated on the part 4 charged positively or negatively by the charged particle beam 2 in the deflection electrode 1, 1. Reduce electrification.
Here, the secondary electron beam 2a has a sufficiently low energy and a wide energy dispersion compared to the charged particle beam 2.
In some cases, an exposure apparatus and a measuring apparatus such as a microscope include the charge reduction apparatuses according to the first and second embodiments of the present invention.

次に、図6を参照して、本発明の実施例1および2の帯電低減装置を備えた露光装置を用いて半導体デバイスを製造する本発明の実施例3のデバイス製造方法を説明する。
図6は微小デバイス(ICやLSI等の半導体チップ、液晶パネル、CCD、薄膜磁気ヘッド、マイクロマシン等)の製造のフローを示す。
ステップ1(回路設計)では半導体デバイスの回路設計を行う。ステップ2(露光制御データ作成)では設計した回路パターンに基づいて露光装置の露光制御データを作成する。一方、ステップ3(ウエハ製造)ではシリコン等の材料を用いてウエハを製造する。ステップ4(ウエハプロセス)は前工程と呼ばれ、上記用意した露光制御データが入力された露光装置とウエハを用いて、リソグラフィ技術によってウエハ上に実際の回路を形成する。次のステップ5(組み立て)は後工程と呼ばれ、ステップ4によって作製されたウエハを用いて半導体チップ化する工程であり、アッセンブリ工程(ダイシング、ボンディング)、パッケージング工程(チップ封入)等の工程を含む。ステップ6(検査)ではステップ5で作製された半導体デバイスの動作確認テスト、耐久性テスト等の検査を行う。こうした工程を経て半導体デバイスが完成し、これが出荷(ステップ7)される。
Next, with reference to FIG. 6, a device manufacturing method according to a third embodiment of the present invention in which a semiconductor device is manufactured using the exposure apparatus provided with the charge reducing apparatus according to the first and second embodiments of the present invention will be described.
FIG. 6 shows a manufacturing flow of a microdevice (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc.).
In step 1 (circuit design), a semiconductor device circuit is designed. In step 2 (exposure control data creation), exposure control data for the exposure apparatus is created based on the designed circuit pattern. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the wafer and the exposure apparatus to which the prepared exposure control data is input. The next step 5 (assembly) is referred to as a post-process, and is a process for forming a semiconductor chip using the wafer produced in step 4, such as an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. including. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, the semiconductor device is completed and shipped (step 7).

近年、微細加工技術が発達しサブミクロン以下のパターン精度が露光装置において要求され、また、顕微鏡においても同程度の精度が必要とされ、帯電問題は精度問題と関連するため微細な荷電粒子の制御を必要とする。このため、荷電粒子ビームが電子源から試料に照射される露光装置または顕微鏡を構成する真空コラムにおいて本発明の帯電低減装置が適用され帯電が低減される。   In recent years, fine processing technology has been developed, and sub-micron pattern accuracy is required in exposure apparatuses, and the same level of accuracy is required in microscopes. Since charging problems are related to accuracy problems, control of fine charged particles is required. Need. For this reason, the charge reducing device of the present invention is applied to an exposure apparatus in which a charged particle beam is irradiated from an electron source onto a sample or a vacuum column constituting a microscope, and the charge is reduced.

本発明の実施例1の帯電低減装置が適用される電子ビーム露光装置のカラム内部の構成図である。It is a block diagram of the inside of a column of an electron beam exposure apparatus to which the charge reducing device of Embodiment 1 of the present invention is applied. 本発明の実施例1を構成する帯電除去用の電子ビーム発生源の構成図である。It is a block diagram of the electron beam generation source for the charge removal which comprises Example 1 of this invention. 本発明の実施例1を構成する帯電除去用の電子ビーム発生源が発生する電子ビームのエネルギー分散の一例の説明図である。It is explanatory drawing of an example of the energy dispersion | distribution of the electron beam which the electron beam generation source for electrification which comprises Example 1 of this invention generate | occur | produces. 本発明の実施例1における電子ビーム発生源から発生される電子ビームを照射したときの帯電された部位の電子ビーム−帯電応答性の説明図である。It is explanatory drawing of the electron beam-charging responsiveness of the charged site | part when irradiated with the electron beam generated from the electron beam generation source in Example 1 of this invention. 本発明の実施例2の帯電低減装置が適用される電子ビーム露光装置のカラム内部の構成図である。It is a block diagram inside the column of the electron beam exposure apparatus to which the charge reduction apparatus of Example 2 of this invention is applied. 本発明の実施例3のデバイス製造方法のフローの説明図である。It is explanatory drawing of the flow of the device manufacturing method of Example 3 of this invention.

符号の説明Explanation of symbols

1 偏向電極 2 荷電粒子ビーム 2a 2次電子ビーム
3 電子ビーム発生源 4 帯電された部位
5 コンタミネーション 6 カラム
9 偏向器 10 反射部位
11 電子銃 12 駆動高圧電源
DESCRIPTION OF SYMBOLS 1 Deflection electrode 2 Charged particle beam 2a Secondary electron beam 3 Electron beam generation source 4 Charged part 5 Contamination 6 Column 9 Deflector 10 Reflection part 11 Electron gun 12 Drive high voltage power supply

Claims (10)

荷電粒子源からの荷電粒子ビームを真空カラム内に対向配置された偏向電極により偏向制御して試料に照射する露光装置または測定装置に用いられる帯電低減装置において、
前記荷電粒子ビームによって正または負に帯電された前記偏向電極の帯電部位に対して電子ビームを照射する電子ビーム照射手段と、
前記電子ビームの照射エネルギーを変化させる手段と、を有することを特徴とする帯電低減装置。
In a charge reduction device used in an exposure apparatus or a measurement apparatus that irradiates a sample by controlling the deflection of a charged particle beam from a charged particle source by a deflection electrode disposed opposite to the inside of a vacuum column.
An electron beam irradiation means for irradiating the charged portion of the deflection electrode charged positively or negatively by the charged particle beam with an electron beam;
And a means for changing the irradiation energy of the electron beam.
前記偏向電極の帯電部位における帯電電位に基づいて、前記電子ビームの照射エネルギーを変化させることを特徴とする請求項1に記載の帯電低減装置。   The charging reduction device according to claim 1, wherein irradiation energy of the electron beam is changed based on a charging potential at a charging portion of the deflection electrode. 前記電子ビーム照射手段は、電子銃および加速電圧印加手段を有しており、前記加速電圧印加手段における加速電圧を変化させることで、所望の照射エネルギーを得ることを特徴とする請求項1または2に記載の帯電低減装置。   3. The electron beam irradiation means includes an electron gun and an acceleration voltage application means, and a desired irradiation energy is obtained by changing an acceleration voltage in the acceleration voltage application means. The charge reducing device described in 1. 前記電子ビームは、前記荷電粒子ビームよりもエネルギー強度が低く、エネルギー分散が大きいことを特徴とする請求項1〜3のいずれか1つに記載の帯電低減装置。   The charge reduction device according to claim 1, wherein the electron beam has lower energy intensity and greater energy dispersion than the charged particle beam. 荷電粒子源からの荷電粒子ビームを真空カラム内に対向配置された偏向電極により偏向制御して試料に照射する露光装置または測定装置に用いられる帯電低減装置において、
前記荷電粒子ビームが照射された際に2次的電子ビームを反射する反射部位を備え、
前記反射部位からの2次的電子ビームを、前記荷電粒子ビームによって正または負に帯電された前記偏向電極の帯電部位に対して照射することで、前記帯電部位の帯電を低減することを特徴とする帯電低減装置。
In a charge reduction device used in an exposure apparatus or a measurement apparatus that irradiates a sample by controlling the deflection of a charged particle beam from a charged particle source by a deflection electrode disposed opposite to the inside of a vacuum column.
A reflective portion for reflecting a secondary electron beam when irradiated with the charged particle beam;
The charging of the charged portion is reduced by irradiating the charged portion of the deflection electrode, which is positively or negatively charged by the charged particle beam, with a secondary electron beam from the reflective portion. To reduce charge.
前記反射部位は、Au、Cu、CsIおよびAlの内のいずれかから構成される請求項5に記載の帯電低減装置。 The charging reduction device according to claim 5, wherein the reflection portion is made of any one of Au, Cu, CsI, and Al 2 O 3 . 前記2次的電子ビームは、前記荷電粒子ビームよりもエネルギー強度が低く、エネルギー分散が大きいことを特徴とする請求項5または6に記載の帯電低減装置。   The charge reducing device according to claim 5 or 6, wherein the secondary electron beam has lower energy intensity and larger energy dispersion than the charged particle beam. 請求項1〜7のいずれか1つに記載の帯電低減装置を備える露光装置。   An exposure apparatus comprising the charge reducing device according to claim 1. 請求項1〜7のいずれか1つに記載の帯電低減装置を備える測定装置。   A measuring device comprising the charge reducing device according to claim 1. 請求項8記載の露光装置を用いて試料を露光する工程と、露光された前記試料を現像する工程と、を備えるデバイス製造方法。   A device manufacturing method, comprising: exposing a sample using the exposure apparatus according to claim 8; and developing the exposed sample.
JP2005198838A 2005-07-07 2005-07-07 Charge reducing apparatus, exposure apparatus, measuring apparatus, and manufacturing method of device Pending JP2007018860A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015175012A (en) * 2014-03-13 2015-10-05 日本電子株式会社 Three-dimensional lamination molding device and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015175012A (en) * 2014-03-13 2015-10-05 日本電子株式会社 Three-dimensional lamination molding device and method

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