JP2007005265A

JP2007005265A - Static electricity intrusion preventing structure of circuit board

Info

Publication number: JP2007005265A
Application number: JP2005187366A
Authority: JP
Inventors: Takashi Akimoto; 孝秋本; Shigeaki Kinoshita; 茂明木下; Shinji Mizuno; 伸二水野; Shunji Naito; 俊司内藤; Masahiro Kitahara; 将弘北原
Original assignee: Teikoku Tsushin Kogyo Co Ltd
Current assignee: Teikoku Tsushin Kogyo Co Ltd
Priority date: 2005-06-27
Filing date: 2005-06-27
Publication date: 2007-01-11
Anticipated expiration: 2025-06-27
Also published as: JP4632877B2

Abstract

<P>PROBLEM TO BE SOLVED: To provide a static electricity intrusion preventing structure of a circuit board capable of effectively preventing static electricity from intruding into a circuit pattern formed on the circuit board from the outside by a simple structure. <P>SOLUTION: In this static electricity intrusion preventing structure, electricity intrusion preventing patterns 83, 84, 85 for preventing static electricity from intruding into the circuit pattern 80 by grounding static electricity entering from the outside of the circuit pattern 80 are formed at a position surrounding the circuit pattern 80 of a circuit board 71, a position surrounding the circuit pattern 80 on a surface side earth board 72 mounted by being placed on the surface side of the circuit board 71, and a position surrounding the circuit pattern 80 on a back side earth board 73 mounted by being placed on the back side of the circuit board 71, respectively. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、回路基板に形成した回路パターンへの外部からの静電気の侵入を防止する回路基板の静電気侵入防止構造に関するものである。 The present invention relates to a static electricity intrusion prevention structure for a circuit board that prevents external static electricity from entering a circuit pattern formed on the circuit board.

従来、抵抗体パターンやスイッチパターンなどの各種回路パターンを形成した回路基板を具備してなる電子部品として、例えばケース内に収納した回路基板に形成された回路パターン上に摺動子や接点部材などが載置され、これら摺動子や接点部材をつまみによって操作して回路パターンに摺接させたり当接させたりすることで、この回路パターンの電気的出力を変化させるように構成された電子部品がある。
特開平１１−３５３９６５号公報 Conventionally, as an electronic component comprising a circuit board on which various circuit patterns such as a resistor pattern and a switch pattern are formed, for example, a slider or a contact member on a circuit pattern formed on a circuit board housed in a case The electronic component is configured to change the electrical output of the circuit pattern by operating the slider or the contact member with a knob to be in sliding contact with or coming into contact with the circuit pattern. There is.
JP 11-353965 A

ところでこの種の電子部品では、つまみに静電気が帯電した指が触れると、その静電気がつまみとケースの隙間などからケース内に入り込んで、回路基板に形成した回路パターンに侵入してしまい、それにより電子部品の誤動作や故障などが生じる恐れがあった。静電気は、つまみとケースの隙間以外にも、例えばケースの他の隙間などからもケース内に入り込んで回路基板に入射するなど、あらゆる方向から回路基板に入射するおそれがあり、この静電気の回路パターンへの侵入を効果的に防止する対策が必要である。従来この対策としては、ケースに別部品の金属板などからなるシールド部材を取り付けたり、ケースの内面にシールド用のアルミ箔などを貼り付けたりして、回路基板の周囲をシールドしていたが、その方法では、電子部品の構造が複雑になり部品点数が増大するという問題があった。 By the way, in this kind of electronic component, when a finger charged with static electricity touches the knob, the static electricity enters the case through the gap between the knob and the case, and enters the circuit pattern formed on the circuit board. There was a risk of malfunction or failure of electronic components. Static electricity can enter the circuit board from any direction, for example, from the gap between the knob and the case, but also from other gaps in the case and enter the circuit board. It is necessary to take measures to effectively prevent intrusions. Conventionally, as measures against this, a shield member made of a separate metal plate or the like was attached to the case, or an aluminum foil for shielding was attached to the inner surface of the case to shield the periphery of the circuit board. This method has a problem that the structure of the electronic component is complicated and the number of components increases.

本発明は上述の点に鑑みてなされたものでありその目的は、簡単な構造で回路基板に形成した回路パターンへの外方からの静電気の侵入を効果的に防止できる回路基板の静電気侵入防止構造を提供することにある。 The present invention has been made in view of the above points, and an object of the present invention is to prevent electrostatic intrusion of a circuit board that can effectively prevent external static electricity from entering a circuit pattern formed on the circuit board with a simple structure. To provide a structure.

上記課題を解決するため本願の請求項１に記載の発明は、回路基板に形成した回路パターンへの外方からの静電気の侵入を防止する回路基板の静電気侵入防止構造であって、少なくとも前記回路基板の回路パターンを形成した面又はその裏面の回路パターンの少なくとも周囲を囲む位置に、回路パターンの外方から入射する静電気をアースしてこの回路パターンへの静電気の侵入を防止する静電気侵入防止パターンを形成したことを特徴とする。 In order to solve the above-mentioned problem, the invention described in claim 1 of the present application is a circuit board static electricity intrusion prevention structure for preventing static electricity from entering the circuit pattern formed on the circuit board from the outside. A static electricity intrusion prevention pattern that prevents static electricity from entering the circuit pattern by grounding the static electricity that enters from the outside of the circuit pattern at a position surrounding at least the periphery of the circuit pattern on the surface of the circuit board or the back surface of the circuit pattern. Is formed.

本願の請求項２に記載の発明は、回路基板に形成した回路パターンへの外方からの静電気の侵入を防止する回路基板の静電気侵入防止構造であって、前記回路基板の回路パターンを形成した面側に重ねて載置した表面側アース基板上の前記回路パターンの少なくとも周囲を囲む位置に、回路パターンの外方から入射する静電気をアースしてこの回路パターンへの静電気の侵入を防止する静電気侵入防止パターンを形成したことを特徴とする。 The invention according to claim 2 of the present application is a circuit board static electricity intrusion prevention structure for preventing static electricity from entering the circuit pattern formed on the circuit board from the outside, wherein the circuit pattern of the circuit board is formed. Static electricity that prevents static electricity from entering the circuit pattern by grounding static electricity that enters from the outside of the circuit pattern at a position that surrounds at least the periphery of the circuit pattern on the surface-side ground substrate placed on the surface side. An intrusion prevention pattern is formed.

本願の請求項３に記載の発明は、請求項２に記載の回路基板の静電気侵入防止構造において、前記回路パターンは、前記回路基板の表面に露出した状態で形成される回路パターンであり、前記表面側アース基板は、前記回路パターンを露出させる開口部を備えて前記回路パターンの周囲を囲む形状に形成されていることを特徴とする。 Invention of Claim 3 of this application is the circuit pattern formed in the state exposed to the surface of the said circuit board in the electrostatic intrusion prevention structure of the circuit board of Claim 2, wherein the said circuit pattern is exposed, The surface-side ground substrate has an opening for exposing the circuit pattern and is formed in a shape surrounding the periphery of the circuit pattern.

本願の請求項４に記載の発明は、回路基板に形成した回路パターンへの外方からの静電気の侵入を防止する回路基板の静電気侵入防止構造であって、前記回路基板の回路パターンを形成した面の裏面側に重ねて載置した裏面側アース基板上の前記回路パターンの少なくとも周囲を囲む位置に、回路パターンの外方から入射する静電気をアースしてこの回路パターンへの静電気の侵入を防止する静電気侵入防止パターンを形成したことを特徴とする。 The invention according to claim 4 of the present application is a circuit board static electricity intrusion prevention structure for preventing static electricity from entering the circuit pattern formed on the circuit board from the outside, wherein the circuit pattern of the circuit board is formed. Static electricity incident from the outside of the circuit pattern is grounded at a position surrounding at least the periphery of the circuit pattern on the back-side ground substrate placed on the back side of the surface to prevent entry of static electricity into the circuit pattern. It is characterized in that an anti-static intrusion pattern is formed.

本願の請求項５に記載の発明は、請求項１に記載の回路基板の静電気侵入防止構造において、前記静電気侵入防止パターンはさらに、少なくとも前記回路基板の回路パターンを形成した面側に重ねて載置した表面側アース基板上の前記回路パターンの少なくとも周囲を囲む位置、又は前記回路基板の回路パターンを形成した面の裏面側に重ねて載置した裏面側アース基板上の少なくとも前記回路パターンの周囲を囲む位置にも形成されていることを特徴とする。 The invention according to claim 5 of the present application is the circuit board electrostatic intrusion prevention structure according to claim 1, wherein the electrostatic intrusion prevention pattern is further stacked on at least a surface side of the circuit board on which the circuit pattern is formed. A position surrounding at least the periphery of the circuit pattern on the placed front-side ground substrate, or at least the periphery of the circuit pattern on the back-side ground substrate placed on the back side of the surface on which the circuit pattern of the circuit board is formed It is also formed at a position that surrounds.

本願の請求項６に記載の発明は、請求項５に記載の回路基板の静電気侵入防止構造において、前記回路基板と前記表面側アース基板と前記裏面側アース基板とを互いに接続部で接続した一枚のフレキシブル回路基板で構成すると共に、前記回路基板と前記表面側アース基板と前記裏面側アース基板に形成した各静電気侵入防止パターンを前記接続部を介して互いに連結し、前記接続部を折り返して、前記回路基板と前記表面側アース基板と前記裏面側アース基板とを重ね合わせたことを特徴とする。 According to a sixth aspect of the present invention, in the circuit board static electricity intrusion prevention structure according to the fifth aspect, the circuit board, the front surface side ground substrate, and the rear surface side ground substrate are connected to each other by a connecting portion. The circuit board, the front surface side ground substrate, and the back surface side ground substrate are connected to each other through the connection portion, and the connection portion is folded back. The circuit board, the front surface side ground substrate and the back surface side ground substrate are superposed.

本願の請求項７に記載の発明は、請求項６に記載の回路基板の静電気侵入防止構造において、前記一枚のフレキシブル回路基板は、そのいずれか一方の面側に前記回路パターンを形成し、他方の面側に前記連結した静電気侵入防止パターンを形成したことを特徴とする。 The invention according to claim 7 of the present application is the structure for preventing static electricity intrusion of the circuit board according to claim 6, wherein the one flexible circuit board forms the circuit pattern on any one surface side thereof, The connected static intrusion prevention pattern is formed on the other surface side.

本願の請求項１に記載の発明によれば、少なくとも回路基板の回路パターンを形成した面又はその裏面の回路パターンの少なくとも周囲を囲む位置に静電気侵入防止パターンを形成したので、簡単な構造で部品点数を増加させずに回路パターンへの静電気の侵入を効果的に防止でき、回路基板を設置する電子部品の構造を複雑化せずに、静電気による誤動作や故障などの不具合の発生を防止できる。 According to the invention described in claim 1 of the present application, since the electrostatic intrusion prevention pattern is formed at least on the surface of the circuit board on which the circuit pattern is formed or at least the periphery of the circuit pattern on the back surface thereof, the component has a simple structure. Intrusion of static electricity into the circuit pattern can be effectively prevented without increasing the number of points, and malfunctions such as malfunctions and failures due to static electricity can be prevented without complicating the structure of the electronic component on which the circuit board is installed.

本願の請求項２に記載の発明によれば、回路基板の回路パターンを形成した面側に重ねて載置した表面側アース基板上の回路パターンの少なくとも周囲を囲む位置に静電気侵入防止パターンを形成したので、回路基板の回路パターンを形成した面側から入射する静電気の回路パターンへの侵入を効果的に防止でき、回路基板を設置する電子部品の静電気による誤動作や故障などの不具合の発生を防止できる。 According to the invention described in claim 2 of the present application, the electrostatic intrusion prevention pattern is formed at a position surrounding at least the periphery of the circuit pattern on the surface-side ground substrate placed on the surface side of the circuit board on which the circuit pattern is formed. As a result, it is possible to effectively prevent static electricity entering from the surface side of the circuit board on which the circuit pattern is formed from entering the circuit pattern and prevent malfunctions such as malfunctions and failures of the electronic components on which the circuit board is installed. it can.

本願の請求項３に記載の発明によれば、回路パターンが回路基板の表面に露出した状態で形成される回路パターンであり、表面側アース基板は、回路パターンを露出させる開口部を備えて回路パターンの周囲を囲む形状に形成されているので、例えば摺接パターンなどの露出した状態で設置する回路パターンを備える場合に、この回路パターンの周囲を囲む位置に静電気侵入防止パターンを形成して静電気の侵入を効果的に防止することができ、回路基板を設置する電子部品の静電気による誤動作や故障などの不具合の発生を防止できる。 According to the invention of claim 3 of the present application, the circuit pattern is formed in a state where the circuit pattern is exposed on the surface of the circuit board, and the surface-side ground substrate has an opening for exposing the circuit pattern. Since it is formed in a shape surrounding the periphery of the pattern, for example, when a circuit pattern to be installed in an exposed state such as a sliding contact pattern is provided, an electrostatic intrusion prevention pattern is formed at a position surrounding the periphery of the circuit pattern to Intrusion can be effectively prevented, and malfunctions such as malfunctions and failures due to static electricity of electronic components on which circuit boards are installed can be prevented.

本願の請求項４に記載の発明によれば、回路基板の回路パターンを形成した面の裏面側に重ねて載置した裏面側アース基板上の回路パターンの少なくとも周囲を囲む位置に静電気侵入防止パターンを形成したので、回路基板の回路パターンを形成した面の裏面側から入射する静電気の回路パターンへの侵入を効果的に防止でき、回路基板を設置する電子部品の静電気による誤動作や故障などの不具合の発生を防止できる。 According to the invention described in claim 4 of the present application, the electrostatic intrusion prevention pattern is provided at a position surrounding at least the periphery of the circuit pattern on the back side ground substrate placed on the back side of the surface of the circuit board on which the circuit pattern is formed. As a result, it is possible to effectively prevent static electricity entering from the back side of the circuit board surface on which the circuit pattern is formed from entering the circuit pattern. Can be prevented.

本願の請求項５に記載の発明によれば、静電気侵入防止パターンはさらに、少なくとも表面側アース基板上の回路パターンの少なくとも周囲を囲む位置、又は裏面側アース基板上の回路パターンの少なくとも周囲を囲む位置にも形成されているので、回路基板の回路パターンを形成した面側やその裏面側などの多くの方向から回路基板に入射する静電気の回路パターンへの侵入を効果的に防止でき、回路基板を設置する電子部品の静電気による誤動作や故障などの不具合の発生を防止できる。 According to the invention described in claim 5 of the present application, the electrostatic intrusion prevention pattern further surrounds at least a position surrounding at least the periphery of the circuit pattern on the front surface side ground substrate, or surrounds at least the periphery of the circuit pattern on the back surface side ground substrate. Since it is also formed at the position, it is possible to effectively prevent the static electricity entering the circuit board from entering from many directions such as the side of the circuit board on which the circuit pattern is formed and the back side thereof. It is possible to prevent the occurrence of malfunctions such as malfunctions and breakdowns caused by static electricity of the electronic components in which the equipment is installed.

本願の請求項６に記載の発明によれば、回路基板と表面側アース基板と裏面側アース基板とを互いに接続部で接続した一枚のフレキシブル回路基板で構成したので、部品点数を増大させることなく回路基板の回路パターンを形成した面側やその裏面側など多くの方向から回路基板に入射する静電気の回路パターンへの侵入を効果的に防止できる回路基板を提供できる。 According to the invention described in claim 6 of the present application, since the circuit board, the front surface side ground substrate, and the back surface side ground substrate are configured by one flexible circuit board connected to each other by the connecting portion, the number of components can be increased. In addition, it is possible to provide a circuit board that can effectively prevent intrusion of static electricity that enters the circuit board from many directions such as the surface side on which the circuit pattern of the circuit board is formed and the back side thereof.

本願の請求項７に記載の発明によれば、フレキシブル回路基板のいずれか一方の面側に回路パターンを形成し、他方の面側に連結した静電気侵入防止パターンを形成したので、簡単な工程で一枚のフレキシブル回路基板に回路パターンと静電気侵入防止パターンを形成することが可能となる。 According to the invention described in claim 7 of the present application, the circuit pattern is formed on one surface side of the flexible circuit board, and the static electricity intrusion prevention pattern connected to the other surface side is formed. It is possible to form a circuit pattern and an electrostatic intrusion prevention pattern on a single flexible circuit board.

以下、本発明の実施形態を図面に基づいて詳細に説明する。
〔第１実施形態〕
図１、図２は、本発明の第１実施形態にかかる静電気侵入防止構造を備えた回路基板を具備する電子部品（以下「回転式電子部品」という）１の分解斜視図であり、図１はその上側部分を示す図で、図２はその下側部分を示す図である。これらの図に示すように回転式電子部品１は、つまみ１０と、クリック板３０を取り付けたケース２０と、クリックバネ４０と摺動子６０を取り付けた回転型物５０と、本発明にかかる静電気侵入防止構造を備えた回路基板（以下「フレキシブル回路基板」という）７０と、支持部材９０と、取付部材９５とを備えて構成されている。以下、回転式電子部品１の各構成部品について説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
1 and 2 are exploded perspective views of an electronic component (hereinafter referred to as “rotary electronic component”) 1 including a circuit board having a static electricity intrusion prevention structure according to a first embodiment of the present invention. FIG. 2 is a view showing the upper portion, and FIG. 2 is a view showing the lower portion. As shown in these drawings, the rotary electronic component 1 includes a knob 10, a case 20 with a click plate 30 attached thereto, a rotary object 50 with a click spring 40 and a slider 60 attached thereto, and static electricity according to the present invention. A circuit board (hereinafter referred to as “flexible circuit board”) 70 having an intrusion prevention structure, a support member 90, and an attachment member 95 are provided. Hereinafter, each component of the rotary electronic component 1 will be described.

つまみ１０は、略円形の平板形状に形成された合成樹脂の成型品で、その外周側面が指などでつまんで操作する操作部１１になっている。一方、下面の中央には、下方に向かって突出する中空筒状の軸部１２が設けられ、軸部１２の下端には、いずれも下方に向かって突出する柱状の突起である３個の固定部１２ａが形成されている。 The knob 10 is a synthetic resin molded product formed in a substantially circular flat plate shape, and an outer peripheral side surface of the knob 10 is an operation unit 11 that is operated by a finger or the like. On the other hand, a hollow cylindrical shaft portion 12 that protrudes downward is provided at the center of the lower surface, and three fixed portions that are columnar protrusions that protrude downward are provided at the lower end of the shaft portion 12. A portion 12a is formed.

ケース２０は、合成樹脂の成形品で、略円形の平板状に形成された上壁２１の外周に下方に向かう側壁２２が設けられ、側壁２２の内側に下面側に開口する凹部である収納部２３が形成されている。上壁２１の中央には収納部２３に連通する開口部２４が設けられていて、開口部２４の外周には上方に向かって突出するリング状の突出部２５が形成されている。一方、側壁２２の下端面の等間隔の４箇所には、下方に向かって突出する突起状の固定部２６が形成され、収納部２３の底面（上壁２１の下面）の開口部２４の両外側には、下方に向かって突出する突起状の固定部２７が形成されている。 The case 20 is a molded product made of synthetic resin, and is provided with a side wall 22 that extends downward on the outer periphery of the upper wall 21 formed in a substantially circular flat plate shape. 23 is formed. An opening 24 that communicates with the storage portion 23 is provided at the center of the upper wall 21, and a ring-shaped protrusion 25 that protrudes upward is formed on the outer periphery of the opening 24. On the other hand, projecting fixing portions 26 projecting downward are formed at four equally spaced positions on the lower end surface of the side wall 22, and both the openings 24 on the bottom surface of the storage portion 23 (the lower surface of the upper wall 21). On the outer side, a projecting fixing portion 27 that protrudes downward is formed.

クリック板３０は、金属板をリング状に形成して構成されており、全周にわたって貫通穴からなるクリック係合部３１を等間隔に設け、また外周の両端からクリック板３０の外側に向けて二つの舌片状の突起３２を突出し、その中にケース２０の固定部２７を固定する小孔からなる取付固定部３３を設けて構成されている。 The click plate 30 is formed by forming a metal plate in a ring shape, and is provided with click engagement portions 31 made of through holes over the entire circumference at equal intervals, and from both ends of the outer periphery toward the outside of the click plate 30. Two tongue-like projections 32 are projected, and an attachment fixing portion 33 formed of a small hole for fixing the fixing portion 27 of the case 20 is provided therein.

クリックバネ４０は、弾性金属板をリング状に形成して構成されており、その１８０度対向する位置に貫通穴からなる一対の取付固定部４１を設け、両取付固定部４１の間にそれぞれリング状部分の周方向に沿って形成された一対のスリット部４２を設け、両スリット部４２の外側の円弧状部分をその根元部分から上方向に折り曲げることで構成される一対のアーム部４３を備えている。そして両アーム部４３の中央には、上方向に突出する突起状のクリック弾接部４４を設けている。 The click spring 40 is formed by forming an elastic metal plate into a ring shape, and a pair of attachment fixing portions 41 each including a through hole are provided at positions opposed to each other by 180 degrees. A pair of slit portions 42 formed along the circumferential direction of the slit-shaped portions, and a pair of arm portions 43 configured by bending the arc-shaped portions outside the slit portions 42 upward from the root portions thereof. ing. At the center of both arm portions 43, a protruding click elastic contact portion 44 protruding upward is provided.

回転型物５０は、合成樹脂を略円形の板状に成形して構成されており、その外周側面の寸法が、ケース２０の収納部２３の内周側面の寸法よりも若干小さく形成されている。そして上面の中央には上方に向かって突出する円柱状の突起部５１を形成し、この突起部５１につまみ１０の固定部１２ａを挿通させる３個の貫通孔からなる取付固定部５１ａを設けている。また回転型物５０の上面の突起部５１の両外側にはそれぞれクリックバネ４０の取付固定部４１に固定される突起状の固定部５２が設けられている。また回転型物５０の下面の外周近傍には、摺動子６０を固定する突起状の固定部５３が設けられている。 The rotary mold 50 is formed by molding a synthetic resin into a substantially circular plate shape, and the outer peripheral side surface thereof is formed to be slightly smaller than the inner peripheral side surface of the housing portion 23 of the case 20. . A cylindrical protrusion 51 protruding upward is formed at the center of the upper surface, and an attachment fixing part 51a including three through holes through which the fixing part 12a of the knob 10 is inserted is provided in the protrusion 51. Yes. In addition, on both outer sides of the protrusion 51 on the upper surface of the rotary mold 50, a protrusion-like fixing portion 52 that is fixed to the attachment fixing portion 41 of the click spring 40 is provided. Further, in the vicinity of the outer periphery of the lower surface of the rotary mold 50, a protruding fixing portion 53 for fixing the slider 60 is provided.

摺動子６０は、導電性を有する弾性金属板によって構成され、平板状の基部６１の一端から二本の摺動冊子６２を突出しこれらを基部６１の下面側に折り曲げて形成されている。基部６１には貫通穴からなる取付固定部６３が設けられている。 The slider 60 is made of an elastic metal plate having conductivity, and is formed by projecting two sliding booklets 62 from one end of a flat base 61 and bending them to the lower surface side of the base 61. The base 61 is provided with an attachment fixing portion 63 made of a through hole.

次に、図３はフレキシブル回路基板７０を展開した状態を示す図であり、同図（ａ）は上面側から見た図で、同図（ｂ）は下面側から見た図である。図２及び図３に示すようにフレキシブル回路基板７０は、一枚の可撓性を有する合成樹脂フイルム（ポリエチレンテレフタレートフイルム〔ＰＥＴフイルム〕等）からなる薄板状の部材の上に回路パターンを形成した構成であり、このフレキシブル回路基板７０は、回路基板部７１と、表面側アース基板部７２と、裏面側アース基板部７３と、接地側アース基板部７４の４つの基板部を備えている。そして、回路基板部７１は、表面側アース基板部７２と接続部７５で接続され、さらに回路基板部７１は、裏面側アース基板部７３と接続部７６で接続され、その裏面側アース基板部７３は接地側アース基板部７４と接続部７７で接続され、さらに接地側アース基板部７４から引出部７８が引き出されている。なお図２では、フレキシブル回路基板７０はその接続部７５，７６，７７がいずれも折り返されて、回路基板部７１と表面側アース基板部７２と裏面側アース基板部７３と接地側アース基板部７４とが互いに重ね合わされた状態の分解図を示しており、さらに同図では図示の都合上、各接続部７５，７６，７７が切断された状態を示している。 Next, FIG. 3 is a diagram showing a state in which the flexible circuit board 70 is unfolded. FIG. 3A is a diagram viewed from the upper surface side, and FIG. 3B is a diagram viewed from the lower surface side. As shown in FIGS. 2 and 3, the flexible circuit board 70 has a circuit pattern formed on a thin plate member made of a single flexible synthetic resin film (polyethylene terephthalate film [PET film] or the like). This flexible circuit board 70 includes four circuit board parts, that is, a circuit board part 71, a front surface side ground board part 72, a back surface side ground board part 73, and a ground side ground board part 74. The circuit board portion 71 is connected to the front surface side ground substrate portion 72 by the connection portion 75, and the circuit board portion 71 is further connected to the back surface side ground substrate portion 73 by the connection portion 76, and the back surface side ground substrate portion 73. Are connected to the ground side earth substrate part 74 at the connection part 77, and a lead-out part 78 is drawn out from the ground side earth board part 74. In FIG. 2, the connection portions 75, 76, and 77 of the flexible circuit board 70 are all folded back, and the circuit board portion 71, the front surface side ground substrate portion 72, the back surface side ground substrate portion 73, and the ground side ground substrate portion 74. Are shown in an exploded view in a state where and are overlapped with each other, and further, for convenience of illustration, the connection portions 75, 76, and 77 are shown in a disconnected state.

そしてこのフレキシブル回路基板７０の一方の面については、回路基板部７１と裏面側アース基板部７３と接地側アース基板部７４に回路パターンが形成され、その裏面については、回路基板部７１と表面側アース基板部７２と裏面側アース基板部７３と接地側アース基板部７４のすべてに静電気侵入防止パターンが形成されている。なお以下では、このフレキシブル回路基板７０の回路パターンを形成した面を表面側と称し、その裏面である静電気侵入防止パターンを形成した面を裏面側と称す。以下、４つの基板部の構成を詳細に説明する。 A circuit pattern is formed on the circuit board 71, the back-side ground board 73, and the ground-side ground board 74 for one surface of the flexible circuit board 70, and the circuit board 71 and the front side for the back side. An electrostatic intrusion prevention pattern is formed on all of the ground substrate portion 72, the back surface side ground substrate portion 73, and the ground side ground substrate portion 74. Hereinafter, the surface of the flexible circuit board 70 on which the circuit pattern is formed is referred to as the front surface side, and the surface on which the electrostatic intrusion prevention pattern is formed, which is the back surface thereof, is referred to as the back surface side. Hereinafter, the configuration of the four substrate portions will be described in detail.

回路基板部７１は、ケース２０の下面（側壁２２の下端面）の外形と略同一の円形形状に形成され、その上面の中央には、円形のリング状のコモンパターン８１と、コモンパターン８１の両外側に配置された円弧状の一対の抵抗体パターン８２とを設けてなる回路パターン８０が形成されている。この回路パターン８０は、摺動子６０の摺動冊子６２を摺接させる摺接パターンであり、回路基板部７１の表面に露出した状態で形成されている。そしてコモンパターン８１からは回路パターンである配線パターン８１ａが引き出され、両抵抗体パターン８２の一端側からは、それぞれ回路パターンである配線パターン８２ａが引き出されて、これらは共に裏面側アース基板部７３と接地側アース基板部７４を通って引出部７８に導かれ、その先で図示しない他の回路に接続されている。 The circuit board portion 71 is formed in a circular shape that is substantially the same as the outer shape of the lower surface of the case 20 (the lower end surface of the side wall 22), and a circular ring-shaped common pattern 81 and a common pattern 81 are formed at the center of the upper surface. A circuit pattern 80 is formed by providing a pair of arc-shaped resistor patterns 82 arranged on both outer sides. The circuit pattern 80 is a sliding contact pattern for slidingly contacting the sliding booklet 62 of the slider 60, and is formed in a state of being exposed on the surface of the circuit board portion 71. A wiring pattern 81a, which is a circuit pattern, is drawn from the common pattern 81, and a wiring pattern 82a, which is a circuit pattern, is drawn from one end of each of the resistor patterns 82. Are led to the lead-out portion 78 through the ground-side ground substrate portion 74 and connected to another circuit (not shown).

そして図３（ｂ）に示すように、回路基板部７１の裏面側の回路パターン８０の周囲を囲む位置に、回路基板部７１の外周に沿って所定幅のリング形状に形成された静電気侵入防止パターン８３が設けられている。この静電気侵入防止パターン８３は、銀などの導電粉を樹脂バインダーに混練して分散させた樹脂含有導電ペーストを回路基板部７１に塗布して形成されたものである。以下の他の静電気侵入防止パターンも同様の方法で形成されている。一方、回路基板部７１の外周近傍の４箇所には、貫通穴からなる取付固定部７１ａが設けられている。各取付固定部７１ａは、それぞれケース２０の各固定部２６に対応する位置に設けられている。 Then, as shown in FIG. 3B, the static electricity intrusion prevention formed in a ring shape with a predetermined width along the outer periphery of the circuit board portion 71 at a position surrounding the circuit pattern 80 on the back side of the circuit board portion 71. A pattern 83 is provided. The electrostatic intrusion prevention pattern 83 is formed by applying a resin-containing conductive paste in which conductive powder such as silver is kneaded and dispersed in a resin binder to the circuit board portion 71. The following other static electricity intrusion prevention patterns are formed in the same manner. On the other hand, attachment fixing portions 71 a made of through holes are provided at four locations near the outer periphery of the circuit board portion 71. Each attachment fixing portion 71 a is provided at a position corresponding to each fixing portion 26 of the case 20.

表面側アース基板部７２は、その外形が回路基板部７１の外形と同形状で、中央に回路パターン８０を露出させるための開口部７２ｂを設けて回路パターン８０の周囲を囲むリング形状に形成されている。またそのケース２０の各固定部２６に対応する位置には貫通穴からなる取付固定部７２ａが設けられている。そして、この表面側アース基板部７２の裏面側の全面には、静電気侵入防止パターン８４が形成されている。次に、裏面側アース基板部７３は、回路基板部７１と同形状で、そのケース２０の各固定部２６に対応する位置に貫通穴からなる取付固定部７３ａが設けられている。そしてその裏面側には、その外周に沿って所定幅のリング形状に形成された静電気侵入防止パターン８５が設けられている。次に、接地側アース基板部７４は、回路基板部７１と同形状に形成され、そのケース２０の各固定部２６に対応する位置には貫通穴からなる取付固定部７４ａが設けられている。またその裏面側には、その外周に沿って所定幅の略円弧形状に形成された静電気侵入防止パターンからなる接地パターン８６が設けられている。この接地パターン８６は、回転式電子部品１を組み立てた際に取付部材９５に当接してアースされる。 The outer surface of the surface-side ground substrate portion 72 has the same outer shape as that of the circuit board portion 71, and is formed in a ring shape surrounding the circuit pattern 80 by providing an opening 72 b for exposing the circuit pattern 80 at the center. ing. In addition, attachment fixing portions 72 a each having a through hole are provided at positions corresponding to the respective fixing portions 26 of the case 20. An electrostatic intrusion prevention pattern 84 is formed on the entire back surface of the front surface side ground substrate portion 72. Next, the back surface side ground board portion 73 has the same shape as the circuit board portion 71, and mounting fixing portions 73 a each including a through hole are provided at positions corresponding to the respective fixing portions 26 of the case 20. An electrostatic intrusion prevention pattern 85 formed in a ring shape with a predetermined width is provided on the back side of the back surface. Next, the ground-side earth substrate part 74 is formed in the same shape as the circuit board part 71, and attachment fixing parts 74 a made of through holes are provided at positions corresponding to the respective fixing parts 26 of the case 20. On the back surface side, a grounding pattern 86 made of an electrostatic intrusion prevention pattern formed in a substantially arc shape having a predetermined width is provided along the outer periphery. The ground pattern 86 is grounded by contacting the mounting member 95 when the rotary electronic component 1 is assembled.

また、各接続部７５，７６，７７の裏面側にもそれぞれ静電気侵入防止パターン８７，８８，８９が形成されていて、回路基板部７１と表面側アース基板部７２と裏面側アース基板部７３それぞれの裏面側に形成された静電気侵入防止パターン８３，８４，８５と接地側アース基板部７４に形成された接地パターン８６とがこれら静電気侵入防止パターン８７，８８，８９を介して互いに連結されている。 Also, electrostatic intrusion prevention patterns 87, 88, 89 are formed on the back surfaces of the connecting portions 75, 76, 77, respectively, and the circuit board portion 71, the front surface side ground substrate portion 72, and the back surface side ground substrate portion 73, respectively. Static intrusion prevention patterns 83, 84, 85 formed on the back surface side of the substrate and a ground pattern 86 formed on the ground side ground substrate portion 74 are connected to each other via these electrostatic intrusion prevention patterns 87, 88, 89. .

次に、支持部材（支持板）９０は、ケース２０の下面（側壁２２の下端面）の外形と略同一形状に形成された合成樹脂製の硬質板で、その外周近傍のケース２０の固定部２６に対応する位置に、貫通穴からなる取付固定部９１を設けて構成されている。 Next, the support member (support plate) 90 is a synthetic resin hard plate formed in substantially the same shape as the outer shape of the lower surface of the case 20 (the lower end surface of the side wall 22). 26 is provided with a mounting fixing portion 91 made of a through hole at a position corresponding to 26.

取付部材（取付板）９５は、ケース２０の下面（側壁２２の下端面）の外形と略同一形状に形成された金属板などの導電性を有する硬質板で、その外周近傍のケース２０の固定部２６に対応する位置に、貫通穴からなる取付固定部９６を設けて構成されている。 The attachment member (attachment plate) 95 is a hard plate having conductivity such as a metal plate formed in substantially the same shape as the outer shape of the lower surface of the case 20 (the lower end surface of the side wall 22). An attachment fixing part 96 made of a through hole is provided at a position corresponding to the part 26.

次に、回転式電子部品１の組み立て方法を説明する。まずケース２０の収納部２３内にクリック板３０を設置する。その際、ケース２０の固定部２７をクリック板３０の取付固定部３３に挿通させて、突起３２の下面側に突出した固定部２７の先端を熱カシメすることで、クリック板３０を収納部２３内の上壁２１の下面の開口部２４の周囲に固定する。一方、クリックバネ４０を回転型物５０に取り付ける。その際クリックバネ４０を回転型物５０の突起部５１の周囲に取り付けて、回転型物５０の固定部５２をクリックバネ４０の取付固定部４１に挿通してクリックバネ４０の上面側に突出させ、その先端を熱カシメすることで、回転型物５０の上面にクリックバネ４０を載置して固定する。また、回転型物５０の下面の固定部５３に摺動子６０の取付固定部６３を取り付けて、基部６１の下面側に突出した固定部５３の先端を熱カシメすることで、摺動子６０を回転型物５０の下面に取り付ける。そしてこのクリックバネ４０と摺動子６０を取り付けた回転型物５０をケース２０の収納部２３内に収納すると共に、ケース２０の開口部２４にその上側からつまみ１０の軸部１２を挿入して固定部１２ａを回転型物５０の取付固定部５１ａに挿通させて、回転型物５０の下面側に突出した固定部１２ａの先端を熱カシメして固定する。これにより、ケース２０の開口部２４の上下でつまみ１０と回転型物５０が一体に固定され、且つ回転型物５０はケース２０の収納部２３内に回転自在に収納される。さらにこのとき、クリックバネ４０のクリック弾接部４４がクリック板３０に弾接していずれかのクリック係合部３１に係合した状態となる。 Next, a method for assembling the rotary electronic component 1 will be described. First, the click plate 30 is installed in the storage portion 23 of the case 20. At that time, the click plate 30 is inserted into the mounting fixing portion 33 of the click plate 30 through the fixing portion 27 of the case 20, and the tip of the fixing portion 27 protruding to the lower surface side of the protrusion 32 is thermally crimped, whereby the click plate 30 is stored in the storage portion 23. It is fixed around the opening 24 on the lower surface of the inner upper wall 21. On the other hand, the click spring 40 is attached to the rotary object 50. At this time, the click spring 40 is attached to the periphery of the protrusion 51 of the rotary mold 50, and the fixing portion 52 of the rotary mold 50 is inserted through the mounting fixing portion 41 of the click spring 40 and protrudes to the upper surface side of the click spring 40. The click spring 40 is placed on and fixed to the upper surface of the rotary mold 50 by caulking the tip. Further, the attachment fixing portion 63 of the slider 60 is attached to the fixing portion 53 on the lower surface of the rotary mold 50, and the tip of the fixing portion 53 protruding to the lower surface side of the base portion 61 is thermally crimped, whereby the slider 60 is obtained. Is attached to the lower surface of the rotary mold 50. The rotary mold 50 to which the click spring 40 and the slider 60 are attached is housed in the housing portion 23 of the case 20, and the shaft portion 12 of the knob 10 is inserted into the opening portion 24 of the case 20 from above. The fixing portion 12a is inserted into the mounting fixing portion 51a of the rotary mold 50, and the tip of the fixing section 12a protruding to the lower surface side of the rotary mold 50 is caulked and fixed. As a result, the knob 10 and the rotary mold 50 are integrally fixed above and below the opening 24 of the case 20, and the rotary mold 50 is stored rotatably in the storage section 23 of the case 20. Further, at this time, the click elastic contact portion 44 of the click spring 40 is in elastic contact with the click plate 30 and is engaged with any of the click engagement portions 31.

一方、フレキシブル回路基板７０の接続部７５を折り返して、回路基板部７１の表面側の面に表面側アース基板部７２の表面側の面を対向させて重ね合わせ、開口部７２ｂから回路基板部７１の回路パターン８０を露出させた状態にする。また回路基板部７１の下側（裏面側）に支持部材９０を設置すると共に、接続部７６を折り返して支持部材９０の下面に裏面側アース基板部７３の裏面側の面を対向させて重ね合わせる。さらに接続部７７を折り返して裏面側アース基板部７３の表面側の面に接地側アース基板部７４の表面側の面を対向させて重ね合わせる。このようにして重ね合わせたフレキシブル回路基板７０と支持部材９０とを、先に組み立てた回転式電子部品１の上側部分のケース２０の下面（側壁２２の下端面）に取り付けて、さらにその下面に取付部材９５を取り付ける。この際、ケース２０の固定部２６をフレキシブル回路基板７０の各取付固定部７１ａ，７２ａ，７３ａ，７４ａと、支持部材９０の取付固定部９１と、取付部材９５の取付固定部９６とにそれぞれ挿通させて、取付部材９５の下面側に突出する固定部２６の先端を熱カシメしてこれら各部材を一体に固定することで、回転式電子部品１の組み立てが完了する。 On the other hand, the connecting portion 75 of the flexible circuit board 70 is folded back and overlapped with the surface side surface of the circuit board portion 71 facing the surface side surface of the circuit side ground substrate portion 72, and the circuit board portion 71 is opened from the opening 72b. The circuit pattern 80 is exposed. In addition, the support member 90 is installed on the lower side (rear surface side) of the circuit board portion 71, and the connection portion 76 is folded back so that the rear surface side surface of the rear surface side ground substrate portion 73 is opposed to the lower surface of the support member 90. . Further, the connecting portion 77 is folded and overlapped with the surface on the surface side of the ground side earth substrate portion 74 facing the surface on the surface side of the back surface side earth substrate portion 73. The flexible circuit board 70 and the support member 90 that are superposed in this way are attached to the lower surface of the case 20 (the lower end surface of the side wall 22) of the upper part of the rotary electronic component 1 that has been assembled previously, and further to the lower surface thereof. The attachment member 95 is attached. At this time, the fixing portion 26 of the case 20 is inserted into the mounting fixing portions 71a, 72a, 73a, 74a of the flexible circuit board 70, the mounting fixing portion 91 of the support member 90, and the mounting fixing portion 96 of the mounting member 95, respectively. The assembly of the rotary electronic component 1 is completed by crimping the tip of the fixing portion 26 protruding to the lower surface side of the mounting member 95 and fixing these members together.

図４は、組み立てた回転式電子部品１の概略側断面図である。同図に示すように回転式電子部品１では、回路基板部７１の裏面側の回路パターン８０の周囲を囲む位置に静電気侵入防止パターン８３が形成され、回路基板部７１の表面側に重ねて載置した表面側アース基板部７２の回路パターン８０の周囲を囲む位置に静電気侵入防止パターン８４が形成され、回路基板部７１の裏面側に支持部材９０を介して重ねて載置した裏面側アース基板部７３の回路パターン８０の周囲を囲む位置に静電気侵入防止パターン８５が形成され、これら各静電気侵入防止パターン８３，８４，８５で回路パターン８０の周囲が囲まれた状態になっている。また、回路基板部７１と表面側アース基板部７２と裏面側アース基板部７３とは、接続部７５，７６で接続された一枚のフレキシブル回路基板７０で構成されると共に、各接続部７５，７６が折り返されてこれら回路基板部７１と表面側アース基板部７２と裏面側アース基板部７３とが重ね合わされている。また、静電気侵入防止パターン８３，８４，８５は、接続部７５，７６を介して互いに連結されており、さらに静電気侵入防止パターン８５は、接続部７７を介して接地パターン８６に連結されており、この接地パターン８６は、取付部材９５に当接してアースされている。したがって、静電気侵入防止パターン８３，８４，８５は、いずれもアースされている。 FIG. 4 is a schematic sectional side view of the assembled rotary electronic component 1. As shown in the figure, in the rotary electronic component 1, an electrostatic intrusion prevention pattern 83 is formed at a position surrounding the circuit pattern 80 on the back side of the circuit board portion 71, and is placed on the surface side of the circuit board portion 71. An electrostatic intrusion prevention pattern 84 is formed at a position surrounding the periphery of the circuit pattern 80 of the placed front surface side ground substrate portion 72, and is placed on the rear surface side of the circuit substrate portion 71 with a support member 90 placed thereon. An electrostatic intrusion prevention pattern 85 is formed at a position surrounding the periphery of the circuit pattern 80 in the portion 73, and the circuit pattern 80 is surrounded by these electrostatic intrusion prevention patterns 83, 84, 85. The circuit board portion 71, the front surface side ground substrate portion 72, and the back surface side ground substrate portion 73 are configured by a single flexible circuit board 70 connected by connection portions 75 and 76, and each connection portion 75, The circuit board portion 71, the front surface side ground substrate portion 72, and the rear surface side ground substrate portion 73 are overlapped with each other. The static intrusion prevention patterns 83, 84, 85 are connected to each other through the connection portions 75, 76, and the static intrusion prevention pattern 85 is connected to the ground pattern 86 through the connection portion 77, The ground pattern 86 is grounded in contact with the mounting member 95. Therefore, all of the static electricity intrusion prevention patterns 83, 84, 85 are grounded.

次に、回転式電子部品１の動作を説明する。つまみ１０の操作部１１を指などでつまんで回転させると、つまみ１０と一体に回転型物５０が回転し、クリックバネ４０のクリック弾接部４４がクリック板３０に弾接して各クリック係合部３１に順に係合することで、つまみ１０と回転型物５０が一体に所定角度ずつ回転してクリック感覚を生じる。そのとき、摺動子６０の摺動冊子６２が回路パターン８０のコモンパターン８１と抵抗体パターン８２の上を摺接移動することで、コモンパターン８１と抵抗体パターン８２に接続された配線パターン８１ａ，８２ａ（図３参照）間の電気的出力が順に変化する。 Next, the operation of the rotary electronic component 1 will be described. When the operation portion 11 of the knob 10 is pinched with a finger or the like and rotated, the rotary mold 50 rotates integrally with the knob 10, and the click elastic contact portion 44 of the click spring 40 elastically contacts the click plate 30 to each click engagement. By sequentially engaging the portion 31, the knob 10 and the rotary mold 50 are integrally rotated by a predetermined angle to generate a click feeling. At that time, the sliding booklet 62 of the slider 60 is slidably moved on the common pattern 81 and the resistor pattern 82 of the circuit pattern 80, so that the wiring pattern 81 a connected to the common pattern 81 and the resistor pattern 82. , 82a (refer to FIG. 3) change in order.

ここで、つまみ１０を操作する指などが帯電していると、高圧の静電気が例えばつまみ１０の操作部１１の下端とケース２０との隙間δなどからケース２０内に入り込み、ケース２０内の各部品の間などを通って回路基板部７１の表面に入射して、この回路基板部７１の表面に露出した状態で形成されている回路パターン８０に侵入しようとする。しかしながら回転式電子部品１では、回路パターン８０に侵入しようとする静電気は、回路パターン８０の周囲を囲む位置に配置されてアースされている静電気侵入防止パターン８３，８４，８５のいずれかに入射するので、回路パターン８０に侵入するおそれがない。すなわち図４に示すように、回路基板部７１の表面側に載置された表面側アース基板部７２に静電気侵入防止パターン８４が形成されていることで、つまみ１０を介してケース２０内に入射し、ケース２０と回転型物５０の隙間などを通って回路基板部７１の表面側から回路パターン８０に侵入しようとする静電気を遮断できる。また、回路基板部７１の裏面の回路パターン８０の周囲を囲む位置にも静電気侵入防止パターン８３が形成されているので、ケース２０の下面と支持部材９０との隙間などから侵入して回路基板部７１の側方から回路パターン８０に侵入しようとする静電気を遮断できる。さらに、回路基板部７１の裏面側に載置された裏面側アース基板部７３にも静電気侵入防止パターン８５が形成されているので、回路基板部７１の裏面側から回路パターン８０に侵入しようとする静電気も遮断できる。このように、多くの方向から回路基板部７１に入射する静電気の回路パターン８０への侵入を効果的に防止できる。したがって、回転式電子部品１の静電気による誤動作や故障などの不具合の発生を防ぐことができる。 Here, when a finger or the like that operates the knob 10 is charged, high-voltage static electricity enters the case 20 from, for example, a gap δ between the lower end of the operation unit 11 of the knob 10 and the case 20. The light enters the surface of the circuit board portion 71 through the parts or the like and tries to enter the circuit pattern 80 formed in a state of being exposed on the surface of the circuit board portion 71. However, in the rotary electronic component 1, static electricity entering the circuit pattern 80 is incident on any of the static electricity intrusion prevention patterns 83, 84, and 85 that are arranged at positions surrounding the circuit pattern 80 and are grounded. Therefore, there is no possibility of entering the circuit pattern 80. That is, as shown in FIG. 4, since the static electricity intrusion prevention pattern 84 is formed on the front surface side ground substrate portion 72 placed on the front surface side of the circuit board portion 71, the incident light enters the case 20 through the knob 10. In addition, static electricity that enters the circuit pattern 80 from the surface side of the circuit board 71 through the gap between the case 20 and the rotary mold 50 can be blocked. Further, since the static electricity intrusion prevention pattern 83 is also formed at a position surrounding the periphery of the circuit pattern 80 on the back surface of the circuit board portion 71, the circuit board portion enters from the gap between the lower surface of the case 20 and the support member 90. The static electricity which is going to enter the circuit pattern 80 from the side of 71 can be cut off. Further, since the static electricity intrusion prevention pattern 85 is also formed on the back surface side ground substrate portion 73 placed on the back surface side of the circuit board portion 71, it tries to enter the circuit pattern 80 from the back surface side of the circuit board portion 71. Static electricity can also be cut off. In this way, it is possible to effectively prevent the static electricity entering the circuit board portion 71 from many directions from entering the circuit pattern 80. Accordingly, it is possible to prevent the malfunction of the rotary electronic component 1 due to static electricity or the occurrence of a malfunction.

また、回路基板部７１と表面側アース基板部７２と裏面側アース基板部７３とを接続部７５，７６で接続した一枚のフレキシブル回路基板７０で構成し、接続部７５，７６を折り返すことで、これら各基板部７１，７２，７３を重ね合わせたので、部品点数を増大させることなく、回路基板部７１の表面側や裏面側や側方などの多くの方向から回路基板部７１に入射する静電気の回路パターン８０への侵入を効果的に防止する静電気侵入防止構造を実現できる。また図３に示すように、フレキシブル回路基板７０は、そのいずれか一方の面側に回路パターン８０を形成し、他方の面側に静電気侵入防止パターン８３，８４，８５と接地パターン８６とを形成した構造なので、簡単な工程で一枚のフレキシブル回路基板７０に回路パターン８０と静電気侵入防止パターン８３，８４，８５及び接地パターン８６を形成することが可能となり、その製作工程が簡素化できる。 Further, the circuit board portion 71, the front surface side ground substrate portion 72, and the back surface side ground substrate portion 73 are configured by a single flexible circuit board 70 connected by connection portions 75 and 76, and the connection portions 75 and 76 are folded back. Since these substrate portions 71, 72, and 73 are overlapped, the light enters the circuit substrate portion 71 from many directions such as the front side, the back side, and the side of the circuit substrate portion 71 without increasing the number of components. An electrostatic intrusion prevention structure that effectively prevents intrusion of static electricity into the circuit pattern 80 can be realized. Further, as shown in FIG. 3, the flexible circuit board 70 has a circuit pattern 80 formed on one surface side thereof, and electrostatic intrusion prevention patterns 83, 84, 85 and a ground pattern 86 formed on the other surface side thereof. With this structure, it is possible to form the circuit pattern 80, the static electricity intrusion prevention patterns 83, 84, 85, and the ground pattern 86 on a single flexible circuit board 70 by a simple process, and the manufacturing process can be simplified.

なお静電気侵入防止パターン８３，８４，８５と接地パターン８６は、各基板部７１，７２，７３，７４上であって回路パターン８０の周囲を囲む位置に形成されていれば、どのように形成されていてもよく、その形状や形成する位置は上記に限られない。例えば上記以外にも、表面側アース基板部７２や裏面側アース基板部７３に形成する静電気侵入防止パターン８４，８５は、これら表面側アース基板部７２や裏面側アース基板部７３の表面側と裏面側の両方に形成することもできる。また、裏面側アース基板部７３に形成する静電気侵入防止パターン８５は、裏面側アース基板部７３の外周のみでなくその全面に形成することもできる。また接地側アース基板部７４に形成される接地パターン８６の形状やその形成位置は、図示した形状等に限られるものではない。また上記では、回路基板部７１と表面側アース基板部７２と裏面側アース基板部７３と接地側アース基板部７４とが接続されてこれらが一枚のフレキシブル回路基板７０で構成されている場合を示したが、これら各基板部７１，７２，７３，７４は、互いに分離した別の基板で構成することもできる。 The electrostatic intrusion prevention patterns 83, 84, 85 and the ground pattern 86 are formed in any way as long as they are formed on the respective substrate portions 71, 72, 73, 74 around the circuit pattern 80. The shape and the position to be formed are not limited to the above. For example, in addition to the above, the static electricity intrusion prevention patterns 84 and 85 formed on the front surface side ground substrate portion 72 and the rear surface side ground substrate portion 73 are the surface side and the rear surface of the front surface side ground substrate portion 72 and the back surface side ground substrate portion 73. It can also be formed on both sides. Further, the static electricity intrusion prevention pattern 85 formed on the back surface side ground substrate portion 73 can be formed not only on the outer periphery of the back surface side ground substrate portion 73 but also on the entire surface thereof. Further, the shape of the ground pattern 86 formed on the ground-side ground substrate 74 and the formation position thereof are not limited to the illustrated shape. In the above description, the circuit board 71, the front-side ground board 72, the back-side ground board 73, and the ground-side ground board 74 are connected to each other and are constituted by a single flexible circuit board 70. Although shown, each of these substrate portions 71, 72, 73, 74 can also be composed of separate substrates separated from each other.

〔第２実施形態〕
次に、本発明の第２実施形態にかかる静電気侵入防止構造を備えた回路基板を説明する。本実施形態にかかる図面及びその説明においては、第１実施形態と共通する構成部分には同一の符号を付す。なお以下で説明する事項以外の事項については、第１実施形態と同じである。以下の他の実施形態においても同様とする。図５は、本発明の第２実施形態にかかる静電気侵入防止構造を備えたフレキシブル回路基板７０−２の一部を示す図である。即ち同図では、フレキシブル回路基板７０−２の回路基板部７１と接続部７５，７６の一部分のみを図示しており、その他の部分は図示を省略している。本実施形態が第１実施形態と異なるのは、回路基板部７１の回路パターン８０を形成した面（表面側）の回路パターン８０の周囲を囲む位置に静電気侵入防止パターン９７を形成した点である。そして図示は省略するがこの静電気侵入防止パターン９７は、例えばスルーホールなどを用いて回路基板部７１の裏面の静電気侵入防止パターン８３に接続され、これによって取付部材９５にアースされる接地パターン８６に連結してアースされている。さらにこれ以外にも図示は省略するが、回路基板部７１の裏面側の静電気侵入防止パターン８３を省略して、表面側の静電気侵入防止パターン９７だけを形成してこれをアースすることも可能である。 [Second Embodiment]
Next, a circuit board provided with an electrostatic intrusion prevention structure according to a second embodiment of the present invention will be described. In the drawings and the description thereof according to the present embodiment, the same reference numerals are given to the components common to the first embodiment. Items other than those described below are the same as those in the first embodiment. The same applies to other embodiments below. FIG. 5 is a view showing a part of a flexible circuit board 70-2 provided with an electrostatic intrusion prevention structure according to a second embodiment of the present invention. That is, in the drawing, only a part of the circuit board 71 and the connecting parts 75 and 76 of the flexible circuit board 70-2 are shown, and the other parts are not shown. This embodiment is different from the first embodiment in that an electrostatic intrusion prevention pattern 97 is formed at a position surrounding the periphery of the circuit pattern 80 on the surface (surface side) of the circuit board portion 71 on which the circuit pattern 80 is formed. . Although not shown, the static electricity intrusion prevention pattern 97 is connected to the static electricity intrusion prevention pattern 83 on the back surface of the circuit board portion 71 by using, for example, a through hole, thereby forming a ground pattern 86 grounded to the mounting member 95. Connected and grounded. Further, although not shown in the drawings, it is possible to omit the static electricity intrusion prevention pattern 83 on the back surface side of the circuit board portion 71 and form only the front surface electrostatic intrusion prevention pattern 97 to be grounded. is there.

〔第３実施形態〕
図６は、本発明の第３実施形態にかかる静電気侵入防止構造を備えたフレキシブル回路基板７０−３の構成を示す図である。また、図７は、フレキシブル回路基板７０−３を具備してなる電子部品（以下「押圧式電子部品」という）１−２の概略側断面図である。このフレキシブル回路基板７０−３が第１実施形態のフレキシブル回路基板７０と異なるのは、回路パターン８０にかえて接点パターン９８と接続パターン９９とからなる回路パターン８０−２を設置すると共に、裏面側アース基板部７３と接地側アース基板部７４を省略して構成されている点である。回路パターン８０−２は、導電ペーストを印刷形成することで回路基板部７１の中央に形成された接点パターン９８と、接点パターン９８の外周にこれを囲むように導電ペーストを印刷形成した円弧状の接続パターン９９とを備えてなるスイッチパターンである。接点パターン９８と接続パターン９９からはそれぞれ回路パターンである配線パターン９８ａ，９９ａが引き出されて、これらは共に回路基板部７１から引き出された引出部７９に導かれて、その先の図示しない他の回路に接続されている。そしてこの回路パターン８０−２上に、弾性金属板をドーム形状に形成してなる反転板１００が載置されている。反転板１００は、その下面外周が接続パターン９９上に当接し、その中心部が接点パターン９８の真上に位置するように載置されている。これらにより、反転板１００の反転時にその中心部が接点パターン９８に接触することで接点パターン９８と接続パターン９９とが導通すると共に、クリック感覚を生じるスイッチ１０１（図７参照）が構成される。そしてこのフレキシブル回路基板７０−３は、接続部７５を折り返すことで回路基板部７１の上側（表面側）に表面側アース基板部７２をその裏面側を上にして載置し、開口部７２ｂから回路基板部７１の回路パターン８０−２上に載置した反転板１００を露出させた状態としている。 [Third Embodiment]
FIG. 6 is a diagram showing a configuration of a flexible circuit board 70-3 provided with an electrostatic intrusion prevention structure according to the third embodiment of the present invention. FIG. 7 is a schematic sectional side view of an electronic component (hereinafter referred to as “pressing electronic component”) 1-2 including the flexible circuit board 70-3. The flexible circuit board 70-3 is different from the flexible circuit board 70 of the first embodiment in that a circuit pattern 80-2 including a contact pattern 98 and a connection pattern 99 is installed instead of the circuit pattern 80, and the back surface side. The ground substrate 73 and the ground-side ground substrate 74 are omitted. The circuit pattern 80-2 has a contact pattern 98 formed at the center of the circuit board portion 71 by printing a conductive paste, and an arc shape formed by printing the conductive paste on the outer periphery of the contact pattern 98 so as to surround it. This is a switch pattern including a connection pattern 99. Wiring patterns 98a and 99a, which are circuit patterns, are drawn out from the contact pattern 98 and the connection pattern 99, respectively, and both are led to a lead-out portion 79 drawn out from the circuit board portion 71, and other wiring patterns 98a and 99a are not shown. Connected to the circuit. On the circuit pattern 80-2, the reversing plate 100 formed by forming an elastic metal plate in a dome shape is placed. The reversing plate 100 is placed such that the outer periphery of the lower surface abuts on the connection pattern 99 and the central portion thereof is positioned directly above the contact pattern 98. As a result, when the reversal plate 100 is reversed, the center portion thereof contacts the contact pattern 98, whereby the contact pattern 98 and the connection pattern 99 are brought into conduction, and a switch 101 (see FIG. 7) that generates a click feeling is configured. Then, the flexible circuit board 70-3 folds the connection portion 75 so that the front surface side ground substrate portion 72 is placed on the upper side (front surface side) of the circuit board portion 71 with the back surface side up, and the flexible circuit board 70-3 is opened from the opening 72b. The reversing plate 100 placed on the circuit pattern 80-2 of the circuit board 71 is exposed.

図７に示すように、このフレキシブル回路基板７０−３を設置する押圧式電子部品１−２は、ケース１１０の開口部１１１内に上下動自在に設置された押圧キートップ１２０を備えている。押圧キートップ１２０の下面には、突起状の押圧部１２１が設けられている。そしてこの押圧キートップ１２０を設置したケース１１０の下面に、組み立てたフレキシブル回路基板７０−３が取り付けられて押圧キートップ１２０の押圧部１２１が反転板１００上に載置された状態になっており、さらにフレキシブル回路基板７０−３の下側に金属板製の取付部材１３０が取り付けられている。この押圧式電子部品１−２では、回路パターン８０−２の周囲を囲む位置に静電気侵入防止パターン８３，８４が設置されていて、これら静電気侵入防止パターン８３，８４は、取付部材１３０を介してアースされている。 As shown in FIG. 7, the pressing electronic component 1-2 on which the flexible circuit board 70-3 is installed includes a pressing key top 120 that is installed in the opening 111 of the case 110 so as to be movable up and down. On the lower surface of the pressing key top 120, a protruding pressing portion 121 is provided. The assembled flexible circuit board 70-3 is attached to the lower surface of the case 110 where the pressing key top 120 is installed, and the pressing portion 121 of the pressing key top 120 is placed on the reversing plate 100. Further, a metal plate attachment member 130 is attached to the lower side of the flexible circuit board 70-3. In the press-type electronic component 1-2, electrostatic intrusion prevention patterns 83 and 84 are installed at positions surrounding the periphery of the circuit pattern 80-2, and these electrostatic intrusion prevention patterns 83 and 84 are interposed via the attachment member 130. Grounded.

この押圧式電子部品１−２は、指などで押圧キートップ１２０を押圧して下降させると、押圧部１２１が反転板１００を押圧して反転させ、スイッチ１０１がオンする。一方、押圧キートップ１２０の押圧を解除すると、反転板１００の復帰力により押圧キートップ１２０が上昇してスイッチ１０１がオフする。この押圧式電子部品１−２では、回路基板部７１の表面（表面側）に露出した状態で形成された回路パターン８０−２に侵入しようとする静電気は、回路パターン８０−２の周囲を囲む位置に設置されてアースされている各静電気侵入防止パターン８３，８４に入射し、回路パターン８０−２に侵入するおそれがないので、押圧式電子部品１−２の静電気による誤動作や故障などの不具合の発生を防ぐことができる。なお、本実施形態では表面側アース基板部７２をリング形状に形成したが、これ以外にも表面側アース基板部７２は、その開口部７２ｂを省略した円形の平板形状に形成して、反転板１００の上部を覆うように設置してもよい。 When the pressing-type electronic component 1-2 is moved down by pressing the pressing key top 120 with a finger or the like, the pressing unit 121 presses and reverses the reversing plate 100, and the switch 101 is turned on. On the other hand, when the pressing of the pressing key top 120 is released, the pressing key top 120 is raised by the restoring force of the reversing plate 100 and the switch 101 is turned off. In the press-type electronic component 1-2, static electricity that tries to enter the circuit pattern 80-2 formed in a state exposed on the surface (front side) of the circuit board portion 71 surrounds the circuit pattern 80-2. Since there is no possibility of entering the circuit pattern 80-2 by being incident on each of the static electricity intrusion prevention patterns 83 and 84 installed at the position, there is a malfunction such as malfunction or failure due to static electricity of the pressing electronic component 1-2. Can be prevented. In the present embodiment, the surface-side ground substrate portion 72 is formed in a ring shape. However, the surface-side ground substrate portion 72 is formed in a circular flat plate shape in which the opening 72b is omitted. You may install so that the upper part of 100 may be covered.

以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載のない何れの形状・構造・材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。例えば、回転式電子部品１や押圧式電子部品１−２の構造は、本発明の静電気侵入防止構造を備えた回路基板を具備する電子部品の一例であり、本発明がこれらの実施形態に限定されるものではない。また、フレキシブル回路基板７０，７０−２，７０−３に形成した回路パターン８０，８０−２の構造は一例である。即ち、上記の各実施形態における回路基板部７１の表面に露出して形成された回路パターンは摺接パターン８０やスイッチパターン８０−２であるが、これ以外にも本発明にかかる静電気防止構造を備えた回路基板が備える回路パターンは、他の回路と接続するための引き出し用端子として機能を有する露出した電極パターン（回路パターン）などでもよい。さらに上記した摺接パターン８０やスイッチパターン８０−２のように回路基板の表面に露出させた状態で形成する回路パターンのみならず、例えば固定抵抗パターンのようにその表面に絶縁層が塗布されていて回路基板の表面に露出していない回路パターンであってもよく、回路基板上に形成しうるあらゆる回路パターンが含まれる。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, the structure of the rotary electronic component 1 and the pressing electronic component 1-2 is an example of an electronic component including a circuit board having the static electricity intrusion prevention structure of the present invention, and the present invention is limited to these embodiments. It is not done. The structure of the circuit patterns 80 and 80-2 formed on the flexible circuit boards 70, 70-2, and 70-3 is an example. That is, the circuit pattern exposed on the surface of the circuit board portion 71 in each of the above embodiments is the sliding contact pattern 80 or the switch pattern 80-2. In addition to this, the antistatic structure according to the present invention is provided. The circuit pattern provided on the provided circuit board may be an exposed electrode pattern (circuit pattern) having a function as a lead-out terminal for connection to another circuit. Furthermore, not only the circuit pattern formed in the state exposed on the surface of the circuit board, such as the sliding contact pattern 80 and the switch pattern 80-2 described above, but an insulating layer is applied to the surface thereof, for example, a fixed resistance pattern. The circuit pattern may be a circuit pattern that is not exposed on the surface of the circuit board, and includes any circuit pattern that can be formed on the circuit board.

また、静電気侵入防止パターンは、回路基板部７１上に形成された静電気侵入防止パターン８３だけを備えたものでもよいし（その場合は表面側アース基板部７２と裏面側アース基板部７３は不要となる。）、また、表面側アース基板部７２に形成された静電気侵入防止パターン８４だけを備えたものでもよいし、裏面側アース基板部７３に形成された静電気侵入防止パターン８５だけを備えたものでもよい。また、各実施形態における回路基板部７１、裏面側アース基板部７３、接地側アース基板部７４の各基板部は、その外周のみに静電気侵入防止パターンを設けているが、静電気侵入防止パターンは、各基板部の全面に設けることもできる。また、表面側アース基板部７２については、回路パターン８０を露出させる必要が無い場合は、開口部７２ｂを有しない形状に形成して、その全面に静電気侵入防止パターン８４を設けるものでもよい。 Further, the static electricity intrusion prevention pattern may be provided with only the static electricity intrusion prevention pattern 83 formed on the circuit board portion 71 (in this case, the front surface side ground substrate portion 72 and the back surface side ground substrate portion 73 are unnecessary). In addition, it may be provided with only the static electricity intrusion prevention pattern 84 formed on the front surface side ground substrate portion 72 or only provided with the static electricity intrusion prevention pattern 85 formed on the back surface side ground substrate portion 73. But you can. In addition, each of the circuit board portions 71, the back-side ground substrate portion 73, and the ground-side ground substrate portion 74 in each embodiment has an electrostatic intrusion prevention pattern only on the outer periphery thereof. It can also be provided on the entire surface of each substrate portion. Further, when it is not necessary to expose the circuit pattern 80, the surface-side ground substrate portion 72 may be formed in a shape that does not have the opening 72b and the electrostatic intrusion prevention pattern 84 is provided on the entire surface thereof.

また、上記第１実施形態の支持部材９０は、回路基板部７１をその下面側から支持するために設置しているものであり、回路基板部７１を支持する必要がない場合はこれを省略することもできる。また、各実施形態では、回路基板部７１や表面側アース基板部７２や裏面側アース基板部７３にフレキシブル基板を用いたが、これら回路基板部７１や表面側アース基板部７２や裏面側アース基板部７３は、硬質基板で構成してもよい。 Further, the support member 90 of the first embodiment is installed to support the circuit board portion 71 from the lower surface side, and this is omitted when it is not necessary to support the circuit board portion 71. You can also. Moreover, in each embodiment, although the flexible substrate was used for the circuit board part 71, the surface side earth board part 72, and the back surface side earth board part 73, these circuit board parts 71, the surface side earth substrate part 72, and the back surface side earth board are used. The part 73 may be formed of a hard substrate.

ここで、上記の第１実施形態にかかる回転式電子部品１では、回路パターン８０が回路基板部７１の表面に露出した状態で形成されている。そしてこの回路パターン８０は、摺動冊子６２を摺接させる摺接パターンであるため、回路パターン８０の上にこれを覆うように静電気防止シートなどを設置して静電気の侵入を防止する構造は採用できない。そこで第１実施形態のように、回路基板部７１の表面側に重ねて設置する表面側アース基板部７２に、回路パターン８０を露出させるための開口部７２ｂを設けて回路パターン８０の周囲を囲むリング形状に形成し、この表面側アース基板部７２に静電気侵入防止パターン８４を形成している。こうすることで、露出させた状態で設置しなければならない回路パターン８０への静電気の侵入を効果的に防止できる静電気侵入防止構造を実現している。 Here, in the rotary electronic component 1 according to the first embodiment, the circuit pattern 80 is formed in a state of being exposed on the surface of the circuit board portion 71. Since the circuit pattern 80 is a sliding contact pattern for slidingly contacting the sliding booklet 62, a structure that prevents static electricity from entering by installing an antistatic sheet or the like on the circuit pattern 80 so as to cover the circuit pattern 80 is employed. Can not. Therefore, as in the first embodiment, an opening 72b for exposing the circuit pattern 80 is provided on the surface-side ground substrate portion 72 that is placed on the surface side of the circuit substrate portion 71 to surround the circuit pattern 80. It is formed in a ring shape, and an electrostatic intrusion prevention pattern 84 is formed on the surface side ground substrate portion 72. By doing so, a static electricity intrusion prevention structure that can effectively prevent static electricity from entering the circuit pattern 80 that must be installed in an exposed state is realized.

また、第１実施形態のように回路基板部７１の表面側に載置された表面側アース基板部７２に静電気侵入防止パターン８４を形成する以外にも、図５に示す第２実施形態のフレキシブル基板７０−２のように、回路基板部７１の表面側の回路パターン８０の周囲を囲む位置に静電気侵入防止パターン９７を形成することも可能であるが、その場合、回路基板部７１の外形寸法を小型化すると、回路基板部７１の表面側に露出する回路パターン８０や配線パターン８１ａ，８２ａに接近する位置に静電気侵入防止パターンを形成しなければならなくなり、ショートのおそれが生じる。特に、第２実施形態のフレキシブル基板７０−２のようなスルーホールを用いずに、接続部７６の表面側から静電気侵入防止パターン９７の引出用の配線パターンを引き出そうとすると、そこに形成されている配線パターン８１ａ，８２ａに非常に接近してしまいショートのおそれが生じる。接続部７６でのショートを防止するために、第２実施形態のフレキシブル基板７０−２のように、接続部７６には静電気侵入防止パターン９７用の配線パターンを形成せず、スルーホールなどを介して回路基板部７１の裏面側に形成した静電気侵入防止パターン８３にアースすることもできるが、そうするとフレキシブル基板７０−２の製造工程が煩雑になりコストアップにつながってしまう。 Further, in addition to forming the static electricity intrusion prevention pattern 84 on the surface side ground substrate part 72 placed on the surface side of the circuit board part 71 as in the first embodiment, the flexible structure of the second embodiment shown in FIG. It is possible to form the electrostatic intrusion prevention pattern 97 at a position surrounding the periphery of the circuit pattern 80 on the front surface side of the circuit board portion 71 as in the case of the substrate 70-2. If the circuit board is reduced in size, an electrostatic intrusion prevention pattern must be formed at a position approaching the circuit pattern 80 and the wiring patterns 81a and 82a exposed on the surface side of the circuit board portion 71, which may cause a short circuit. In particular, if a wiring pattern for drawing out the electrostatic intrusion prevention pattern 97 is to be drawn from the surface side of the connecting portion 76 without using a through hole like the flexible board 70-2 of the second embodiment, the wiring pattern is formed there. The wiring patterns 81a and 82a are very close to each other, which may cause a short circuit. In order to prevent a short-circuit at the connecting portion 76, a wiring pattern for the electrostatic intrusion prevention pattern 97 is not formed on the connecting portion 76 as in the flexible substrate 70-2 of the second embodiment, but through a through hole or the like. Then, the static electricity intrusion prevention pattern 83 formed on the back surface side of the circuit board portion 71 can be grounded. However, in this case, the manufacturing process of the flexible board 70-2 becomes complicated and the cost increases.

その点、第１実施形態の回転式電子部品１が備える表面側アース基板部７２は、一枚のフレキシブル基板７０の一部であり、且つ回路パターン８０を形成した面の裏面側に静電気侵入防止パターン８４が形成されていて、これが接続部７５の裏面側に形成した静電気侵入防止パターン８７を介してアースされているので、既述したようにフレキシブル基板７０の裏面側だけに静電気侵入防止パターンを形成すればよく、その製造工程が簡単になる。またこのように構成したことで、接続部７５を折り曲げて表面側アース基板部７２を回路基板部７１の表面側に重ね合わせるだけで、露出する回路パターン８０への上方からの静電気の侵入を効果的に防止できる静電気侵入防止構造を簡単に実現できる。また回路基板部７１の表面側に重ねて設置した表面側アース基板部７２に静電気侵入防止パターン８４を形成していることで、配線パターン８１ａ，８２ａの上部にもこれを覆うように静電気侵入防止パターン８４を設置することができるので、配線パターン８１ａ，８２ａに静電気が侵入することも効果的に防止できる。 In that respect, the surface-side ground substrate portion 72 provided in the rotary electronic component 1 of the first embodiment is a part of one flexible substrate 70 and prevents electrostatic intrusion on the back side of the surface on which the circuit pattern 80 is formed. Since the pattern 84 is formed and is grounded via the electrostatic intrusion prevention pattern 87 formed on the back surface side of the connection portion 75, the electrostatic intrusion prevention pattern is formed only on the back surface side of the flexible substrate 70 as described above. What is necessary is just to form, and the manufacturing process becomes simple. Further, with this configuration, it is possible to effectively prevent static electricity from entering the exposed circuit pattern 80 simply by bending the connecting portion 75 and superimposing the surface-side ground substrate portion 72 on the surface side of the circuit substrate portion 71. Can be easily realized. Further, by forming a static electricity intrusion prevention pattern 84 on the surface side ground board portion 72 placed on the front surface side of the circuit board portion 71, it prevents the static electricity intrusion so as to cover the wiring patterns 81a and 82a. Since the pattern 84 can be installed, it is possible to effectively prevent static electricity from entering the wiring patterns 81a and 82a.

本発明の第１実施形態にかかる静電気侵入防止構造を備えた回路基板を具備する回転式電子部品１の上側部分の分解斜視図である。1 is an exploded perspective view of an upper portion of a rotary electronic component 1 including a circuit board provided with a static electricity intrusion prevention structure according to a first embodiment of the present invention. 回転式電子部品１の下側部分の分解斜視図である。FIG. 3 is an exploded perspective view of a lower part of the rotary electronic component 1. フレキシブル回路基板７０の展開図で、同図（ａ）はその上面側から見た図で、同図（ｂ）はその下面側から見た図である。FIG. 4A is a development view of the flexible circuit board 70, in which FIG. 1A is a view seen from the upper surface side, and FIG. 1B is a view seen from the lower surface side. 回転式電子部品１の概略側断面図である。1 is a schematic sectional side view of a rotary electronic component 1. フレキシブル回路基板７０−２の一部を示す図である。It is a figure which shows a part of flexible circuit board 70-2. フレキシブル回路基板７０−３の展開図で、同図（ａ）はその上面側から見た図で、同図（ｂ）はその下面側から見た図である。FIG. 3A is a development view of the flexible circuit board 70-3, in which FIG. 1A is a view seen from the upper surface side, and FIG. 1B is a view seen from the lower surface side. フレキシブル回路基板７０−３を具備する押圧式電子部品１−２の概略側断面図である。It is a schematic sectional side view of the press-type electronic component 1-2 which comprises the flexible circuit board 70-3.

Explanation of symbols

１回転式電子部品
１−２押圧式電子部品
１０つまみ
２０ケース
２３収納部
３０クリック板
４０クリックバネ
５０回転型物
６０摺動子
７０フレキシブル回路基板
７１回路基板部
７２表面側アース基板部
７３裏面側アース基板部
７４接地側アース基板部
７５接続部
７６接続部
７７接続部
８０回路パターン
８０−２回路パターン
８１コモンパターン
８２抵抗体パターン
８３静電気侵入防止パターン
８４静電気侵入防止パターン
８５静電気侵入防止パターン
８６接地パターン
９０支持部材（支持板）
９５取付部材（取付板）
９７静電気侵入防止パターン
９８接点パターン
９９接続パターン DESCRIPTION OF SYMBOLS 1 Rotation type electronic component 1-2 Press type | mold electronic component 10 Knob 20 Case 23 Storage part 30 Click board 40 Click spring 50 Rotation type | mold 60 Slider 70 Flexible circuit board 71 Circuit board part 72 Front surface side earth board part 73 Back side Ground substrate portion 74 Ground side ground substrate portion 75 Connection portion 76 Connection portion 77 Connection portion 80 Circuit pattern 80-2 Circuit pattern 81 Common pattern 82 Resistor pattern 83 Static intrusion prevention pattern 84 Static intrusion prevention pattern 85 Static intrusion prevention pattern 86 Ground Pattern 90 Support member (support plate)
95 Mounting member (Mounting plate)
97 Electrostatic intrusion prevention pattern 98 Contact pattern 99 Connection pattern

Claims

A circuit board static electricity intrusion prevention structure for preventing static electricity from entering the circuit pattern formed on the circuit board from the outside,
Static electricity that prevents static electricity from entering the circuit pattern by grounding static electricity that enters from the outside of the circuit pattern at least at a position surrounding at least the periphery of the circuit pattern on the circuit board on which the circuit pattern is formed. A circuit board static electricity intrusion prevention structure characterized in that an intrusion prevention pattern is formed.

A circuit board static electricity intrusion prevention structure for preventing static electricity from entering the circuit pattern formed on the circuit board from the outside,
Static electricity incident from the outside of the circuit pattern is grounded at a position surrounding at least the periphery of the circuit pattern on the surface side ground substrate placed on the surface side of the circuit board on which the circuit pattern is formed. A circuit board static electricity intrusion prevention structure, characterized in that a static electricity intrusion prevention pattern is formed to prevent static electricity from entering the circuit board.

In the structure for preventing electrostatic intrusion of the circuit board according to claim 2,
The circuit pattern is a circuit pattern formed in a state exposed on the surface of the circuit board,
The structure for preventing electrostatic intrusion of a circuit board, wherein the surface-side ground substrate is formed in a shape surrounding an opening of the circuit pattern with an opening for exposing the circuit pattern.

A circuit board static electricity intrusion prevention structure for preventing static electricity from entering the circuit pattern formed on the circuit board from the outside,
Static electricity incident from the outside of the circuit pattern is grounded at a position surrounding at least the periphery of the circuit pattern on the back-side ground substrate placed on the back side of the surface of the circuit board on which the circuit pattern is formed. A structure for preventing electrostatic intrusion on a circuit board, wherein an electrostatic intrusion preventing pattern for preventing invasion of static electricity into a circuit pattern is formed.

In the structure for preventing electrostatic intrusion of the circuit board according to claim 1,
The electrostatic intrusion prevention pattern further includes at least a position surrounding the circuit pattern on the surface side ground substrate placed on the surface side of the circuit board on which the circuit pattern is formed, or a circuit pattern of the circuit board. A structure for preventing electrostatic intrusion of a circuit board, which is also formed at a position surrounding at least the periphery of the circuit pattern on a back surface side ground substrate placed on the back surface side of the formed surface.

In the structure for preventing electrostatic intrusion of the circuit board according to claim 5,
The circuit board, the front surface side ground substrate, and the back surface side ground substrate are configured by a single flexible circuit substrate connected to each other by a connecting portion, and the circuit board, the front surface side ground substrate, and the back surface side ground substrate are connected to each other. Each formed electrostatic intrusion prevention pattern is connected to each other through the connection portion,
An electrostatic intrusion prevention structure for a circuit board, wherein the connection portion is folded and the circuit board, the front surface side ground substrate, and the back surface side ground substrate are overlapped.

In the structure for preventing electrostatic intrusion of the circuit board according to claim 6,
The one flexible circuit board has the circuit pattern formed on one surface side thereof, and the connected electrostatic intrusion prevention pattern is formed on the other surface side. Construction.