JP2007005203A - Closure processor - Google Patents

Closure processor Download PDF

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JP2007005203A
JP2007005203A JP2005186083A JP2005186083A JP2007005203A JP 2007005203 A JP2007005203 A JP 2007005203A JP 2005186083 A JP2005186083 A JP 2005186083A JP 2005186083 A JP2005186083 A JP 2005186083A JP 2007005203 A JP2007005203 A JP 2007005203A
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induction heating
frequency induction
high frequency
transformer
matching
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Toshihiro Yokoo
横尾  敏浩
Munehide Abo
宗秀 阿保
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DKK Co Ltd
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Denki Kogyo Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Abstract

<P>PROBLEM TO BE SOLVED: To provide a closure processor with a matching structure for a high frequency induction heating apparatus saving on a space reducing cost without using any expensive high current resistant type water cooled cable, and reducing current loss. <P>SOLUTION: The matching part 26 for the high frequency induction heating apparatus 40 is composed from a single flat plate 20, a transformer 12, and a capacitor 11 for resonance placed on the flat plate 20. While the transformer 12 and the capacitor 11 for resonance of the matching part 26 are installed in the vicinity of a processing subject (for example, a hollow pipe 14), and a high frequency induction heating coil 13 is connected to the transformer 12, the capacitor for resonance is connected to a main body of the high frequency induction heating apparatus provided with an invertor 4 in a position separated from the matching part 26. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、高周波誘導加熱装置に設けられた高周波誘導加熱コイルを処理対象物(例えば、中空パイプ)の端部に対応する位置に配置し、高周波電源から高周波誘導加熱装置のインバータ及び整合部を順次に介して前記高周波誘導加熱コイルに高周波電力を供給することにより、前記処理対象物の端部を高周波誘導加熱しながら該端部を成形型に押圧して前記処理対象物の端部開口を閉止(クロージング)する閉止処理装置に関し、特に、コンパクトに形成されて省スペース化や電流損失の低減が可能な高周波誘導加熱装置の整合部構造に関する。   In the present invention, a high-frequency induction heating coil provided in a high-frequency induction heating device is disposed at a position corresponding to an end of a processing object (for example, a hollow pipe), and an inverter and a matching unit of the high-frequency induction heating device are connected from a high-frequency power source. By sequentially supplying high-frequency power to the high-frequency induction heating coil via the high-frequency induction heating, the end of the object to be processed is pressed against the mold while the end of the object to be processed is subjected to high-frequency induction heating. More particularly, the present invention relates to a matching unit structure of a high-frequency induction heating device that is compact and can be made space-saving and reduce current loss.

高周波誘導加熱装置としては、各種のワークを誘導加熱のために各種の構造のものがあり、高周波誘導加熱装置に設けられる高周波誘導加熱コイルの周辺の構造に関する公知技術として、特開2001−273975(特許文献1)に記載のものがある。   As the high-frequency induction heating device, there are various types of structures for induction heating of various workpieces. As a known technique related to the structure around the high-frequency induction heating coil provided in the high-frequency induction heating device, Japanese Patent Application Laid-Open No. 2001-273975 ( There exists a thing as described in patent document 1).

また、中空パイプの端部開口を閉止する際に中空パイプの端部を高周波誘導加熱する高周波誘導加熱装置の一例として、図3に示すものがある。図3に示す高周波誘導加熱装置1は、直流電源2を有するループ回路3と、このループ回路3内に設けられたコンデンサ5及び2つのブリッジ回路6,7とを有するインバータ4を備えており、これらのブリッジ回路6,7にはスイッチング素子(例えば、トランジスタ8及びダイオード9)が設けられている。なお、このインバータ4は、電圧型インバータであり、一例として表示したものである。このインバータ4のブリッジ回路6,7は、整合トランス10の一次側に連結され、この整合トランス10の二次側には共振用コンデンサ11が設けられている。そして、整合トランス10の二次側及び共振用コンデンサ11は、ポータブル型変成器12の一次側に連結され、このポータブル型変成器12の二次側が高周波誘導加熱コイル13に連結されている。かくして、高周波誘導加熱コイル13には所要の高周波電力が供給されて中空パイプ14の一端部14aを高周波誘導加熱しながらこの一端部14aを成形型(図示せず)に押圧して中空パイプ14の端部開口S(図3参照)を閉止するように構成されている。
特開2001−273975
Moreover, there exists what is shown in FIG. 3 as an example of the high frequency induction heating apparatus which carries out high frequency induction heating of the edge part of a hollow pipe when closing the edge part opening of a hollow pipe. A high frequency induction heating apparatus 1 shown in FIG. 3 includes a loop circuit 3 having a DC power source 2, an inverter 4 having a capacitor 5 and two bridge circuits 6 and 7 provided in the loop circuit 3, These bridge circuits 6 and 7 are provided with switching elements (for example, transistor 8 and diode 9). In addition, this inverter 4 is a voltage type inverter, and is displayed as an example. The bridge circuits 6 and 7 of the inverter 4 are connected to the primary side of the matching transformer 10, and a resonance capacitor 11 is provided on the secondary side of the matching transformer 10. The secondary side of the matching transformer 10 and the resonance capacitor 11 are connected to the primary side of the portable transformer 12, and the secondary side of the portable transformer 12 is connected to the high frequency induction heating coil 13. Thus, the high-frequency induction heating coil 13 is supplied with the required high-frequency power, and the one end 14a of the hollow pipe 14 is pressed against a mold (not shown) while high-frequency induction heating the one end 14a of the hollow pipe 14. It is comprised so that the edge part opening S (refer FIG. 3) may be closed.
JP2001-273975

しかしながら、上述のような高周波誘導加熱装置1を備えた閉止処理装置では、次のような不具合がある。すなわち、中空パイプ14の一端部14aを高周波誘導加熱する高周波誘導加熱コイル13やポータブル型変成器12は、中空パイプ14の一端部14aの近傍に配置されることが必要があり、高周波誘導加熱装置1の本体(インバータ4や整合トランス10等が配設される高周波誘導加熱装置1の本体)は、通常、比較的大型のものから成るため、この装置本体を高周波誘導加熱コイル13の近傍に配置することができないのが実状である。そのため、共振用コンデンサ11とポータブル型変成器12との間は、図3に示す如く、高耐圧高電流型の冷却銅パイプ若しくは水冷式の電力ケーブル15で連結するようにしている。従って、この冷却パイプ若しくは水冷式の電力ケーブル15は高価のものとなる上に、配管スペースや高価な漏水防止手段が必要となるといった不具合がある。   However, the closure processing apparatus provided with the high-frequency induction heating apparatus 1 as described above has the following problems. That is, the high frequency induction heating coil 13 and the portable transformer 12 for high frequency induction heating of the one end portion 14a of the hollow pipe 14 need to be disposed in the vicinity of the one end portion 14a of the hollow pipe 14, and the high frequency induction heating apparatus The main body of 1 (the main body of the high-frequency induction heating apparatus 1 in which the inverter 4 and the matching transformer 10 and the like are disposed) is normally made of a relatively large size, and therefore this apparatus main body is disposed in the vicinity of the high-frequency induction heating coil 13. The reality is that we cannot do it. Therefore, the resonance capacitor 11 and the portable transformer 12 are connected by a high-voltage, high-current cooling copper pipe or a water-cooled power cable 15 as shown in FIG. Therefore, the cooling pipe or the water-cooled power cable 15 is expensive and has a disadvantage that a piping space and expensive water leakage prevention means are required.

一方、上述の特許文献1に記載の高周波誘導加熱装置にあっては、高周波誘導加熱コイルが高周波誘導加熱装置の本体の側に固定されてその本体の近傍に配置される。しかしながら、このような高周波誘導加熱装置を上述のような閉止処理装置に備えるようにした場合には、高周波誘導加熱装置の本体(装置本体)が、処理対象物である中空パイプや、中空パイプの端部に押圧する成形型が設置される機構部分に干渉し、中空パイプの端部を加熱・閉止(クロージング)することは難しい。   On the other hand, in the high frequency induction heating apparatus described in Patent Document 1, the high frequency induction heating coil is fixed to the main body side of the high frequency induction heating apparatus and disposed in the vicinity of the main body. However, when such a high-frequency induction heating apparatus is provided in the above-described closing processing apparatus, the main body (apparatus main body) of the high-frequency induction heating apparatus is a hollow pipe that is a processing target or a hollow pipe. It is difficult to heat and close (close) the end portion of the hollow pipe by interfering with the mechanism portion where the mold that presses the end portion is installed.

上述の如く、従来の閉止処理装置に備えられる図3に示す高周波誘導加熱装置における整合部構造では、高周波誘導加熱コイル13及びポータブル型変成器12とインバータ1とが互いに離れており、かつ、共振用コンデンサ11の電流値も極めて大きいため、共振用コンデンサ11とポータブル型変成器12とを連結(接続)する連結線構造が複雑で高価なものとなる。しかも、連結線構造箇所の冷却も重要であるため、水冷ケーブル等の高価な部材を用いる必要がある。また、一般に、処理対象物(ワーク)である中空パイプ14やその一端部14aが押圧される成形型が設置される領域は比較的狭いため、インバータ4を備える高周波誘導加熱装置1の本体を中空パイプ14に近接させて配置することは難しい。一方、特許文献1に示されるような高周波誘導加熱装置にあっては、その構造上、高周波誘導加熱装置の本体を処理対象物である中空パイプ14の近傍に設置することは難しい。   As described above, in the matching portion structure in the high frequency induction heating apparatus shown in FIG. 3 provided in the conventional closing processing apparatus, the high frequency induction heating coil 13 and the portable transformer 12 and the inverter 1 are separated from each other, and resonance occurs. Since the current value of the capacitor 11 is extremely large, the connecting line structure for connecting (connecting) the resonance capacitor 11 and the portable transformer 12 becomes complicated and expensive. And since cooling of a connection line structure location is also important, it is necessary to use expensive members, such as a water cooling cable. Moreover, since the area | region where the shaping | molding die in which the hollow pipe 14 which is a process target (workpiece | work) and its one end part 14a are pressed is generally set narrow, the main body of the high frequency induction heating apparatus 1 provided with the inverter 4 is hollow It is difficult to arrange them close to the pipe 14. On the other hand, in the high-frequency induction heating device as shown in Patent Document 1, it is difficult to install the main body of the high-frequency induction heating device in the vicinity of the hollow pipe 14 that is the object to be processed due to its structure.

本発明は、上述の如き実状に鑑みてなされたものであって、その目的は、省スペース化を図ると共に、高価な耐高電流型の水冷ケーブルを使用せず、コスト低減を図り、かつ電流損失を低減させることができる高周波誘導加熱装置の整合部構造を備えた閉止処理装置を提供することにある。   The present invention has been made in view of the actual situation as described above. The object of the present invention is to save space, reduce the cost without using an expensive high-current-resistant water-cooled cable, and reduce the current. An object of the present invention is to provide a closing treatment device having a matching portion structure of a high-frequency induction heating device that can reduce loss.

上述の目的を達成するために、本発明では、高周波誘導加熱装置に設けられた高周波誘導加熱コイルを処理対象物の端部に対応する位置に配置し、高周波電源から前記高周波誘導加熱装置のインバータ及び整合部を順次に介して前記高周波誘導加熱コイルに高周波電力を供給することにより、前記処理対象物の端部を高周波誘導加熱しながら該端部を成形型に押圧して前記処理対象物の端部開口を閉止する閉止処理装置において、前記高周波誘導加熱装置の整合部を、単一の平板と、前記平板の上に載置された変成器及び共振用コンデンサとで構成し、前記整合部の変成器及び共振用コンデンサを、前記処理対象物の近傍に配置し、前記変成器に前記高周波誘導加熱コイルを連結すると共に、前記整合部から離隔した位置にある前記インバータを有する前記高周波誘導加熱装置の本体に前記共振用コンデンサを連結するようにしている。
また、本発明では、前記変成器及び共振用コンデンサの漏洩冷却水を前記整合部から排水するための排水機構を前記平板に設けるようにしている。
また、本発明では、前記高周波誘導加熱装置の本体と前記整合部とを連結するケーブルを、編組線、若しくは、厚さの薄い平型の銅板を複数枚重ね合わせてその周囲に絶縁チューブを被せて成る空冷タイプのものとしている。
また、本発明では、前記処理対象物が中空パイプであるようにしている。
In order to achieve the above-described object, in the present invention, a high-frequency induction heating coil provided in a high-frequency induction heating device is disposed at a position corresponding to an end of a processing object, and an inverter of the high-frequency induction heating device is provided from a high-frequency power source. And by supplying high-frequency power to the high-frequency induction heating coil sequentially through the matching portion, the end of the object to be processed is pressed against the mold while the end of the object to be processed is subjected to high-frequency induction heating. In the closing processing device for closing the end opening, the matching portion of the high-frequency induction heating device includes a single flat plate, a transformer and a resonance capacitor mounted on the flat plate, and the matching portion The transformer and the resonance capacitor are arranged in the vicinity of the object to be processed, the high frequency induction heating coil is connected to the transformer, and the inverter is located away from the matching portion. The so that connecting the resonant capacitor to the body of the high-frequency induction heating apparatus having a.
In the present invention, a drainage mechanism for draining the cooling water of the transformer and the resonance capacitor from the matching portion is provided on the flat plate.
In the present invention, the cable connecting the main body of the high-frequency induction heating device and the alignment portion is formed by overlapping a plurality of braided wires or thin flat copper plates with an insulating tube around them. Air-cooled type.
In the present invention, the object to be treated is a hollow pipe.

請求項1に記載の本発明は、閉止処理装置に備えられる高周波誘導加熱装置の整合部を、単一の平板と、平板の上に載置された変成器及び共振用コンデンサとで構成し、整合部の変成器及び共振用コンデンサを、処理対象物の近傍に配置し、変成器に高周波誘導加熱コイルを連結すると共に、整合部から離隔した位置にあるインバータを有する高周波誘導加熱装置の本体に共振用コンデンサを連結するようにしたものであるから、高周波誘導加熱装置の整合部をコンパクトにすることができて省スペース化を図ることができると共に、電流損失を低減させることができ、しかも高価なケーブルを使用せずにコスト低減を図ることが可能となる。   In the first aspect of the present invention, the matching portion of the high-frequency induction heating device provided in the closing treatment device is constituted by a single flat plate, a transformer and a resonance capacitor mounted on the flat plate, The matching section transformer and the resonance capacitor are arranged in the vicinity of the object to be processed, the high frequency induction heating coil is connected to the transformer, and the main body of the high frequency induction heating apparatus having an inverter located at a position separated from the matching section. Since the resonance capacitor is connected, the matching portion of the high frequency induction heating device can be made compact, space saving can be achieved, current loss can be reduced, and expensive. It is possible to reduce the cost without using a simple cable.

また、請求項2に記載の本発明は、変成器及び共振用コンデンサの漏洩冷却水を整合部から排水するための排水機構を平板に設けるようにしたものであるから、整合部の冷却水の漏水を排水機構によって整合部から排出することができ、装置周辺の清浄化を図ることができる。   Further, in the present invention described in claim 2, since the drainage mechanism for draining the leakage cooling water of the transformer and the resonance capacitor from the matching part is provided on the flat plate, the cooling water of the matching part is provided. Water leakage can be discharged from the alignment portion by the drainage mechanism, and the vicinity of the apparatus can be cleaned.

また、請求項3に記載の本発明は、高周波誘導加熱装置の本体と整合部とを連結するケーブルが、編組線、若しくは、厚さの薄い平型の銅板を複数枚重ね合わせてその周囲に絶縁チューブを被せて成る空冷タイプのものにしたものであるから、高周波誘導加熱装置の本体と整合部との間の連結線構造箇所の冷却を有効に行うことができる。   According to the third aspect of the present invention, there is provided a cable for connecting the main body of the high-frequency induction heating device and the aligning portion, wherein a plurality of braided wires or thin flat copper plates are overlapped around the cable. Since the air-cooled type is formed by covering the insulating tube, it is possible to effectively cool the connecting line structure portion between the main body and the matching portion of the high-frequency induction heating device.

また、請求項4に記載の本発明は、前記処理対象物が中空パイプであるようにしたものであるから、中空パイプの端部開口の閉止作業をコンパクトな閉止処理装置により円滑に行うことができる。   Further, in the present invention according to claim 4, since the object to be processed is a hollow pipe, the closing operation of the end opening of the hollow pipe can be smoothly performed by a compact closing processing device. it can.

以下、本発明に係る閉止処理装置に備えられる高周波誘導加熱装置の整合部構造の一実施形態について、図1及び図2を参照して説明する。なお、図1及び図2において図3と同様の部材には同一の符号を付することとする。   Hereinafter, an embodiment of a matching portion structure of a high-frequency induction heating device provided in a closing processing device according to the present invention will be described with reference to FIGS. 1 and 2. In FIGS. 1 and 2, the same members as those in FIG. 3 are denoted by the same reference numerals.

図1(a),(b),及び(c)は、本発明に係る閉止処理装置に備えられる高周波誘導加熱装置の整合部構造を示す平面図、正面図、及び側面図である。これらの図に示すように、樹脂材等の絶縁材から成る単一の平板20上には、公知構造のポータブル型変成器12並びに共振用コンデンサ11が少し浮いた状態で載置されている。ポータブル型変成器12と共振用コンデンサ11とは図外の高電圧用の連結具(リード線若しくは接続導体)を介して連結されているが、ポータブル型変成器12と共振用コンデンサ11とは互いに近接した位置において連結されるため、この連結具は短長のものから成っている。また、ポータブル型変成器12や共振用コンデンサ11には、これらを冷却するために複数の冷却パイプ21が連結されており(図1(a),(b)参照)、これらの冷却パイプ21は、図外の冷却源に連結されている。   FIGS. 1A, 1B, and 1C are a plan view, a front view, and a side view showing a matching portion structure of a high-frequency induction heating device provided in a closing treatment apparatus according to the present invention. As shown in these figures, on a single flat plate 20 made of an insulating material such as a resin material, a portable transformer 12 having a known structure and a resonance capacitor 11 are placed in a slightly floating state. The portable transformer 12 and the resonance capacitor 11 are connected via a high-voltage coupling tool (lead wire or connecting conductor) (not shown), but the portable transformer 12 and the resonance capacitor 11 are mutually connected. Since the connectors are connected at close positions, the connector is short. A plurality of cooling pipes 21 are connected to the portable transformer 12 and the resonance capacitor 11 in order to cool them (see FIGS. 1A and 1B). , Connected to a cooling source not shown.

また、ポータブル型変成器12には、高周波誘導加熱コイル13が連結されている。この高周波誘導加熱コイル13は、中空パイプ14の一端部14aを囲むリング形状の導体から構成されている(図1(a)参照)。   A high frequency induction heating coil 13 is connected to the portable transformer 12. The high frequency induction heating coil 13 is composed of a ring-shaped conductor surrounding one end portion 14a of the hollow pipe 14 (see FIG. 1A).

平板20には、図1(a),(c)に示すように、複数の長溝22が形成されると共に、長溝22に連通する排水溝23,24,25が形成されている。これらの長溝22や排水溝23,24,25により、ポータブル型変成器12並びに共振用コンデンサ11の冷却機構(図市せず)からの漏洩冷却水が平板20の外部に排水されるようになっている。   As shown in FIGS. 1A and 1C, a plurality of long grooves 22 are formed in the flat plate 20, and drainage grooves 23, 24, and 25 communicating with the long grooves 22 are formed. Through these long grooves 22 and drain grooves 23, 24, 25, leakage cooling water from the portable transformer 12 and the cooling mechanism (not shown) of the resonance capacitor 11 is drained to the outside of the flat plate 20. ing.

図2は、上述のような構造を有する高周波誘導加熱装置の整合部26(単一の平板20,ポータブル型変成器12,及び共振用コンデンサ11を有する)と高周波誘導加熱装置のインバータ4との連結構造を示すものである。なお、ここでは、電流型インバータ30が用いられているが、図3に示す如き電圧型インバータ4であってもよい。電流型インバータ30は、直流電源31と直流リアクトル32とを有するループ回路33と、スイッチング素子34とダイオード35とを有する一対のブリッジ回路36,37とから構成され、ブリッジ回路36,37は整合トランス10に連結され、この整合トランス10の二次側は連結線38,39を介して整合部26の共振用コンデンサ11に連結されている。なお、連結線38,39は普通の電線であってよく、特別の耐高電性のものでなくてもよい。   FIG. 2 shows the matching between the matching section 26 (having the single flat plate 20, the portable transformer 12 and the resonance capacitor 11) of the high-frequency induction heating apparatus having the above-described structure and the inverter 4 of the high-frequency induction heating apparatus. The connection structure is shown. In addition, although the current type inverter 30 is used here, the voltage type inverter 4 as shown in FIG. 3 may be used. The current type inverter 30 includes a loop circuit 33 having a DC power source 31 and a DC reactor 32, and a pair of bridge circuits 36 and 37 having a switching element 34 and a diode 35. The bridge circuits 36 and 37 are matched transformers. 10 and the secondary side of the matching transformer 10 is connected to the resonance capacitor 11 of the matching unit 26 via connection lines 38 and 39. The connecting wires 38 and 39 may be ordinary electric wires and may not have special high electric resistance.

このような構成の図2の高周波誘導加熱装置40を用いて、例えば中空パイプ14の端部開口Sの閉止処理(閉止加工)を行うに際しては、図外の成形型の凹部と相対向する位置に中空パイプ14を配置し、この中空パイプ14の一端部14aのまわりをリング形状の高周波誘導加熱コイル13にて囲んだ状態の下でこの高周波誘導加熱コイル13を中空パイプ14の一端部14aに対して僅かな間隔を隔てた位置に配置する。次いで、インバータ4から整合トランス10を介して高周波電力を高周波誘導加熱コイル13に供給することにより、中空パイプ14の一端部14aを所要温度に高周波誘導加熱する。そして、この状態の下で中空パイプ14の他端部側に軸線方向に沿う方向の押圧力を加えることにより、中空パイプ14の一端部14aを図外の成形型の凹部に圧接させる。この際、前記一端部14aは高周波誘導加熱されて変形可能な状態にあるため、前記一端部14aは押し潰されて端部開口Sを閉塞する閉止部を形成することになる。   When performing the closing process (closing process) of the end opening S of the hollow pipe 14 using the high-frequency induction heating device 40 of FIG. The high-frequency induction heating coil 13 is placed on the one end portion 14 a of the hollow pipe 14 in a state where the hollow pipe 14 is disposed around the one-end portion 14 a of the hollow pipe 14 and surrounded by the ring-shaped high-frequency induction heating coil 13. It arrange | positions with respect to the position slightly spaced apart. Next, high-frequency power is supplied from the inverter 4 to the high-frequency induction heating coil 13 via the matching transformer 10, whereby the one end portion 14 a of the hollow pipe 14 is high-frequency induction heated to a required temperature. And under this state, the one end part 14a of the hollow pipe 14 is press-contacted with the recessed part of a shaping | molding die outside a figure by applying the pressing force of the direction along an axial direction to the other end part side of the hollow pipe 14. At this time, since the one end portion 14a is in a deformable state by high frequency induction heating, the one end portion 14a is crushed to form a closing portion that closes the end opening S.

以上のような閉塞処理装置によれば、共振用コンデンサ11及びポータブル型変成器12を単一の平板20上に載置して配置することにより、閉塞処理装置に備えられる高周波誘導加熱装置40の整合部26をコンパクトに構成することができる。また、高周波誘導加熱装置40のインバータ30(装置本体側)が大型のものであっても、中空パイプ14の側には、単一の平板20の上に設けた整合部26のみを設置すればよいため、処理対象物である中空パイプ14の周りのスペース(すなわち、ワーク配置スペース)が狭くても、その狭いスペース内に整合部26及び中空パイプ14を配置することができ、省スペース化が可能になる。また、上述のように、ポータブル型変成器12及び共振用コンデン11は平板20上に互いに近接して配置されているため連結具(リード線)は短くてもよく、ひいては電流損失が少なくなり、効果的な高周波誘導加熱を行なうことが可能となる。   According to the blockage processing apparatus as described above, the resonant capacitor 11 and the portable transformer 12 are placed and disposed on the single flat plate 20, whereby the high frequency induction heating device 40 provided in the blockage processing apparatus is arranged. The matching unit 26 can be configured compactly. Even if the inverter 30 (device main body side) of the high-frequency induction heating device 40 is large-sized, only the matching portion 26 provided on the single flat plate 20 is installed on the hollow pipe 14 side. For this reason, even if the space around the hollow pipe 14 that is the object to be processed (that is, the work placement space) is narrow, the alignment portion 26 and the hollow pipe 14 can be disposed in the narrow space, thereby saving space. It becomes possible. Further, as described above, since the portable transformer 12 and the resonance condenser 11 are arranged close to each other on the flat plate 20, the connecting tool (lead wire) may be short, and the current loss is reduced. Effective high-frequency induction heating can be performed.

ポータブル型変成器12としては目的に応じて任意のものを用いてよいが、例えば、500kVAの変圧比6:1のものが一例として採用される。また、共振用コンデンサ11としては、例えば、4個設けられ、平型の水冷コンデンサ(例えば、セレム社製の水冷コンデンサ)が使用される。勿論、これらに限定されるものでない。また、図1に示す整合部26の概要の容積としては、比較的にコンパクトな、630mm(長さ)×140mm(高さ)×140mm(奥行)のものから成る。   Any portable transformer 12 may be used according to the purpose. For example, a transformer of 500 kVA with a transformation ratio of 6: 1 is adopted as an example. For example, four resonance capacitors 11 are provided, and a flat water-cooled capacitor (for example, a water-cooled capacitor manufactured by Selem Co., Ltd.) is used. Of course, it is not limited to these. Further, the volume of the outline of the aligning portion 26 shown in FIG. 1 is a relatively compact 630 mm (length) × 140 mm (height) × 140 mm (depth).

以上、本発明の一実施形態について述べたが、本発明はこの実施形態に限定されるものではなく、本発明の技術的思想に基づいて各種の変形及び変更が可能である。例えば、既述の実施形態では、中空パイプ14の端部開口Sを閉止するための閉止処理装置について述べたが、端部開口を有するワーク(処理対象物)の閉止処理を行う場合にも本発明の閉止処理装置を適用可能である。   Although one embodiment of the present invention has been described above, the present invention is not limited to this embodiment, and various modifications and changes can be made based on the technical idea of the present invention. For example, in the above-described embodiment, the closing processing device for closing the end opening S of the hollow pipe 14 has been described. However, the present embodiment is also applicable to the case of performing a closing process on a workpiece (processing object) having an end opening. The closing processing device of the invention can be applied.

本発明一実施形態に係る閉止処理装置に備えられる高周波誘導加熱装置の整合部の構造を示す図であって、図1(a)は整合部の平面図、図1(b)は整合部の正面図(b)、図1(c)は整合部の側面図である。It is a figure which shows the structure of the matching part of the high frequency induction heating apparatus with which the closing processing apparatus which concerns on one Embodiment of this invention is equipped, Comprising: Fig.1 (a) is a top view of a matching part, FIG.1 (b) is a matching part. Front view (b) and FIG. 1 (c) are side views of the alignment portion. 図1の整合部と高周波誘導加熱装置のインバータとの間の連結構造を示す回路図である。It is a circuit diagram which shows the connection structure between the matching part of FIG. 1, and the inverter of a high frequency induction heating apparatus. 中空パイプの閉止(クロージング)処理を行うための従来の閉止処理装置における高周波誘導加熱装置のインバータと高周波誘導加熱コイルとを連結する構造を示す回路図である。It is a circuit diagram which shows the structure which connects the inverter and high frequency induction heating coil of the high frequency induction heating apparatus in the conventional closing processing apparatus for performing the closing (closing) process of a hollow pipe.

符号の説明Explanation of symbols

1, 40 高周波誘導加熱装置
2 直流電源
4,30 インバータ
10 整合トランス
11 共振用コンデンサ
12 ポータブル型変成器
13 高周波誘導加熱コイル
14 中空パイプ
14a 一端部
20 平板
21 冷却パイプ
22 長溝
23,24,25 排水溝
26 整合部
38,39 連結線
S 端部開口
DESCRIPTION OF SYMBOLS 1, 40 High frequency induction heating apparatus 2 DC power supply 4,30 Inverter 10 Matching transformer 11 Resonance capacitor 12 Portable transformer 13 High frequency induction heating coil 14 Hollow pipe 14a One end 20 Flat plate 21 Cooling pipe 22 Long groove 23, 24, 25 Drainage Groove 26 Alignment part 38,39 Connecting line S End opening

Claims (4)

高周波誘導加熱装置に設けられた高周波誘導加熱コイルを処理対象物の端部に対応する位置に配置し、高周波電源から前記高周波誘導加熱装置のインバータ及び整合部を順次に介して前記高周波誘導加熱コイルに高周波電力を供給することにより、前記処理対象物の端部を高周波誘導加熱しながら該端部を成形型に押圧して前記処理対象物の端部開口を閉止する閉止処理装置において、
前記高周波誘導加熱装置の整合部を、単一の平板と、前記平板の上に載置された変成器及び共振用コンデンサとで構成し、
前記整合部の変成器及び共振用コンデンサを、前記処理対象物の近傍に配置し、
前記変成器に前記高周波誘導加熱コイルを連結すると共に、前記整合部から離隔した位置にある前記インバータを有する前記高周波誘導加熱装置の本体に前記共振用コンデンサを連結するようにしたこと、
を特徴とする閉止処理装置。
The high frequency induction heating coil provided in the high frequency induction heating device is disposed at a position corresponding to the end of the object to be processed, and the high frequency induction heating coil is sequentially passed from the high frequency power source through the inverter and matching unit of the high frequency induction heating device. In the closing processing apparatus for closing the end opening of the processing object by pressing the end against the mold while supplying high-frequency power to the end of the processing object while induction-heating the end of the processing object,
The matching part of the high-frequency induction heating device is composed of a single flat plate, a transformer and a resonance capacitor placed on the flat plate,
The matching section transformer and the resonance capacitor are arranged in the vicinity of the object to be processed,
The high frequency induction heating coil is connected to the transformer, and the resonance capacitor is connected to the main body of the high frequency induction heating apparatus having the inverter at a position spaced apart from the matching portion,
A closing processing device.
前記変成器及び共振用コンデンサの漏洩冷却水を前記整合部から排水するための排水機構を前記平板に設けたことを特徴とする請求項1に記載の閉止処理装置。   The closing processing apparatus according to claim 1, wherein a drainage mechanism for draining leakage cooling water of the transformer and the resonance capacitor from the matching portion is provided on the flat plate. 前記高周波誘導加熱装置の本体と前記整合部とを連結するケーブルを、編組線、若しくは、厚さの薄い平型の銅板を複数枚重ね合わせてその周囲に絶縁チューブを被せて成る空冷タイプのものとしたことを特徴とする請求項1又は2に記載の閉止処理装置。   An air-cooling type cable in which a plurality of braided wires or thin flat copper plates are stacked and covered with an insulating tube around the cable for connecting the main body of the high-frequency induction heating device and the matching portion. The closing processing device according to claim 1 or 2, wherein 前記処理対象物が中空パイプであることを特徴とする請求項1乃至3の何れか1項に記載の閉止処理装置。   The closing processing apparatus according to claim 1, wherein the processing object is a hollow pipe.
JP2005186083A 2005-06-27 2005-06-27 Closure processor Pending JP2007005203A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008084858A1 (en) 2007-01-12 2008-07-17 The Furukawa Electric Co., Ltd. Electrical contact member, method for producing the same, and electrical contact
JP2009095886A (en) * 2007-09-28 2009-05-07 Neturen Co Ltd Power control device and pipe pressure welding system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151794A (en) * 1984-08-20 1986-03-14 電気興業株式会社 Induction heating coil
JPH0499220A (en) * 1990-08-10 1992-03-31 Fuji Denshi Kogyo Kk High-frequency quenching apparatus
JP2003347018A (en) * 2002-05-24 2003-12-05 High Frequency Heattreat Co Ltd High frequency induction heating apparatus
JP2004327375A (en) * 2003-04-28 2004-11-18 Mitsubishi Heavy Ind Ltd High-frequency induction heating device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151794A (en) * 1984-08-20 1986-03-14 電気興業株式会社 Induction heating coil
JPH0499220A (en) * 1990-08-10 1992-03-31 Fuji Denshi Kogyo Kk High-frequency quenching apparatus
JP2003347018A (en) * 2002-05-24 2003-12-05 High Frequency Heattreat Co Ltd High frequency induction heating apparatus
JP2004327375A (en) * 2003-04-28 2004-11-18 Mitsubishi Heavy Ind Ltd High-frequency induction heating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008084858A1 (en) 2007-01-12 2008-07-17 The Furukawa Electric Co., Ltd. Electrical contact member, method for producing the same, and electrical contact
JP2009095886A (en) * 2007-09-28 2009-05-07 Neturen Co Ltd Power control device and pipe pressure welding system

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