JP2006522911A - How to cool hot gas instantaneously - Google Patents

How to cool hot gas instantaneously Download PDF

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JP2006522911A
JP2006522911A JP2006504470A JP2006504470A JP2006522911A JP 2006522911 A JP2006522911 A JP 2006522911A JP 2006504470 A JP2006504470 A JP 2006504470A JP 2006504470 A JP2006504470 A JP 2006504470A JP 2006522911 A JP2006522911 A JP 2006522911A
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cooling
gas
circuit
region
quenching device
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キッス,ギュンター・ハー
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Thermoselect AG
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Thermoselect AG
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28CHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA COME INTO DIRECT CONTACT WITHOUT CHEMICAL INTERACTION
    • F28C3/00Other direct-contact heat-exchange apparatus
    • F28C3/06Other direct-contact heat-exchange apparatus the heat-exchange media being a liquid and a gas or vapour
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10KPURIFYING OR MODIFYING THE CHEMICAL COMPOSITION OF COMBUSTIBLE GASES CONTAINING CARBON MONOXIDE
    • C10K1/00Purifying combustible gases containing carbon monoxide
    • C10K1/04Purifying combustible gases containing carbon monoxide by cooling to condense non-gaseous materials
    • C10K1/06Purifying combustible gases containing carbon monoxide by cooling to condense non-gaseous materials combined with spraying with water
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28CHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA COME INTO DIRECT CONTACT WITHOUT CHEMICAL INTERACTION
    • F28C3/00Other direct-contact heat-exchange apparatus
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28CHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA COME INTO DIRECT CONTACT WITHOUT CHEMICAL INTERACTION
    • F28C3/00Other direct-contact heat-exchange apparatus
    • F28C3/06Other direct-contact heat-exchange apparatus the heat-exchange media being a liquid and a gas or vapour
    • F28C3/08Other direct-contact heat-exchange apparatus the heat-exchange media being a liquid and a gas or vapour with change of state, e.g. absorption, evaporation, condensation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0075Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for syngas or cracked gas cooling systems

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Heat Treatment Of Articles (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Heat Treatment Of Strip Materials And Filament Materials (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Industrial Gases (AREA)
  • Furnace Details (AREA)

Abstract

The invention relates to a quench device for suddenly cooling a hot gas stream with the aid of quench water. The inventive quench device comprises a gas supply line and a gas drainage pipe. Said quench water is at least partially cooled by means of a heat exchanger. In addition, said quench device is provided with a cooling water circuit for cooling the first area of the gas stream and with a second separate cooling circuit which cools a second area of the gas stream and is arranged downstream.

Description

発明の分野Field of Invention

本発明は、本願の請求項1に記載の装置及び請求項9に記載の方法による高温ガスの瞬間的冷却に関する。更に、本発明は、本発明による装置及び方法を請求項15による高温再循環プロセスにおいて使用する方法に関する。   The invention relates to the instantaneous cooling of hot gas by means of the device according to claim 1 and the method according to claim 9 of the present application. The invention further relates to a method of using the apparatus and method according to the invention in a hot recirculation process according to claim 15.

高温プロセス技術における多数の用途においては、廃棄ガスは、例えば水のような液体を添加することによって瞬間的に冷却される。これは、“急冷”方法と称され、このために使用される装置は所謂“急冷装置”である。   In many applications in high temperature process technology, the waste gas is instantaneously cooled by adding a liquid such as water. This is referred to as the “quenching” method, and the device used for this is the so-called “quenching device”.

水は急冷ポンプによって循環せしめられる。水の入口と出口との間で、冷却水は約10乃至30℃だけ加熱される。この熱エネルギは、急冷熱交換器によって装置から取り出される。   Water is circulated by a quench pump. Between the water inlet and outlet, the cooling water is heated by about 10-30 ° C. This thermal energy is extracted from the apparatus by a quench heat exchanger.

ガスの冷却に加えて、ガス内に含まれる異物もまた液体内で凝結せしめられる。熱交換器、パイプライン及び冷却水を搬送する装置の汚染は避けることができない。従って、繰り返しの洗浄が必要である。   In addition to the cooling of the gas, foreign substances contained in the gas are also condensed in the liquid. Contamination of heat exchangers, pipelines and equipment for conveying cooling water is inevitable. Therefore, repeated cleaning is necessary.

本発明は、第一に、ガスを極めて効率良く冷却することができ、第二に、洗浄作業を最小限まで減らすことができる装置及び方法を提供することを目的とする。更に、本発明は、このような装置及び方法の使用方法を提供することを目的とする。   An object of the present invention is to provide an apparatus and a method that can cool a gas extremely efficiently and secondly reduce a cleaning operation to a minimum. Furthermore, the present invention aims to provide a method of using such an apparatus and method.

この目的は、請求項1に記載の装置、請求項9に記載の方法及び請求項15に記載の使用方法によって達成される。   This object is achieved by an apparatus according to claim 1, a method according to claim 9 and a method of use according to claim 15.

好ましい実施形態の説明DESCRIPTION OF PREFERRED EMBODIMENTS

高温ガスを急冷するという本発明の解決課題のために、二段階急冷プロセスの開発が提案されている。高温ガスの流れる方向に沿って連続的に配置されている高温ガスの流れの2つの段階又は領域において、冷却は、2つの別個の回路によって行われる。従って、冷却水は、2つの別個の回路内で循環状態に維持される。   In order to solve the problem of the present invention of rapidly cooling a hot gas, the development of a two-stage quenching process has been proposed. In two stages or regions of hot gas flow that are arranged continuously along the direction of hot gas flow, the cooling is performed by two separate circuits. Thus, the cooling water is maintained in a circulating state in two separate circuits.

回路1は、ガスの流れ方向に沿った第1の領域内での高温ガスの実際の急冷のために使用され、ガス内に含まれる固体粒子もまたここで凝結せしめられる。回路2は、ガスの流れ方向に沿った第2の領域内で最終的な温度までの最終的な冷却のために使用される。   The circuit 1 is used for the actual quenching of the hot gas in the first region along the gas flow direction, where the solid particles contained in the gas are also condensed here. The circuit 2 is used for final cooling to a final temperature in a second region along the gas flow direction.

本発明に従って、高温の再循環プロセスにおいて発生する合成ガスを冷却するためのこのような装置又は方法の各々の使用方法も提供される。
本発明の効果は、限定された冷却領域における急冷によって凝結せしめられる固体粒子の局在化にある。以下に説明する実施形態と組み合わせて、凝結せしめられた固体粒子によって、熱交換器の汚染を完全に避けることが可能になる。
In accordance with the present invention, there is also provided a method of use of each such apparatus or method for cooling synthesis gas generated in a hot recirculation process.
The effect of the present invention resides in the localization of solid particles that are condensed by quenching in a limited cooling zone. In combination with the embodiments described below, the condensed solid particles make it possible to completely avoid contamination of the heat exchanger.

急冷用熱交換器は、洗浄回路2内に単独で配置されるのが好ましい。高温ガス内に含まれるエネルギは、これらの急冷用熱交換器によって消費される。結局、回路1すなわち実際的な急冷回路は、熱交換器無しで実施化される。従って、第1の冷却回路の汚染は著しく排除される。   The quenching heat exchanger is preferably arranged alone in the cleaning circuit 2. The energy contained in the hot gas is consumed by these quenching heat exchangers. Eventually, circuit 1 or a practical quench circuit is implemented without a heat exchanger. Thus, contamination of the first cooling circuit is significantly eliminated.

急冷装置は、同心状に配置された内側パイプを備えた細い装置であるのが好ましく、頂部からこの内側パイプ内に入る高温ガスは、頂部から底部へと装置内を流れる。下方領域において、ガスは、偏向装置によって偏向せしめられ、その後、外側の環状ガス内を上方へ流れ、上端において装置から出て行く。内側パイプ内で1000℃乃至2000℃から95℃乃至70℃まで特に好ましくは85℃までの冷却がなされ、外側の環状空隙内で85℃乃至70℃から40℃好ましくは60℃までの冷却がなされる。   The quenching device is preferably a narrow device with inner pipes arranged concentrically, and hot gas entering the inner pipe from the top flows through the device from the top to the bottom. In the lower region, the gas is deflected by the deflecting device and then flows upward in the outer annular gas and leaves the device at the upper end. The inner pipe is cooled to 1000 ° C. to 2000 ° C. to 95 ° C. to 70 ° C., particularly preferably 85 ° C., and the outer annular gap is cooled to 85 ° C. to 70 ° C. to 40 ° C., preferably 60 ° C. The

本発明の装置の好ましい変更例においては、冷却水は、回路2から回路1への自由な溢流によって排出される。
別の好ましい実施形態においては、回路1及び2内の冷却水の液面は、回路1内の冷却水の液面によって制御される。液面を調整するための機構は、回路1への水の供給又は回路1からの水の排出によって実現されるのが好ましい。
In a preferred variant of the device according to the invention, the cooling water is discharged by free overflow from circuit 2 to circuit 1.
In another preferred embodiment, the coolant level in circuits 1 and 2 is controlled by the coolant level in circuit 1. The mechanism for adjusting the liquid level is preferably realized by supplying water to the circuit 1 or discharging water from the circuit 1.

本発明による方法においは、1000℃乃至2000℃好ましくは1200℃の温度の廃棄ガスは急冷されるのが好ましい。好ましくは内側パイプを含む第1の領域で、1200℃以上の温度から95℃乃至70℃好ましくは85℃までの高温ガスの急冷が起こる。   In the process according to the invention, waste gas at a temperature of 1000 ° C. to 2000 ° C., preferably 1200 ° C. is preferably quenched. In the first region, preferably including the inner pipe, rapid cooling of the hot gas from a temperature of 1200 ° C. to 95 ° C. to 70 ° C., preferably 85 ° C. occurs.

本発明の方法は、10乃至70体積%特に好ましくは30体積%の水分を有する廃棄ガスに対して行われるのが好ましい。
The process according to the invention is preferably carried out on waste gas having a water content of 10 to 70% by volume, particularly preferably 30% by volume.

Claims (15)

冷却水の助けによって高温ガスの流れを急冷するための急冷装置であり、該供給ラインとガス排出パイプとを備え、前記冷却水が熱交換器によって少なくとも部分的冷却される急冷装置であって、
前記ガスの流れの第1の領域を冷却するための冷却水回路と、前記第1の領域の下流のガスの流れの領域を冷却する別個の第2の冷却水回路とが備えられていることを特徴とする冷却装置。
A quenching device for quenching a flow of hot gas with the aid of cooling water, comprising a supply line and a gas discharge pipe, wherein the cooling water is at least partially cooled by a heat exchanger,
A cooling water circuit for cooling the first region of the gas flow, and a separate second cooling water circuit for cooling the region of the gas flow downstream of the first region. A cooling device characterized by.
請求項1に記載の急冷装置であって、
前記第2の冷却回路のみに前記冷却水を冷却する熱交換器が備えられていることを特徴とする急冷装置。
The quenching device according to claim 1,
The rapid cooling apparatus, wherein only the second cooling circuit is provided with a heat exchanger for cooling the cooling water.
請求項1乃至2のうちのいずれか一項に記載の急冷装置であって、
前記第2の冷却回路から前記第1の冷却回路への溢流部が設けられていることを特徴とする急冷装置。
The quenching device according to any one of claims 1 to 2,
A quenching device comprising an overflow portion from the second cooling circuit to the first cooling circuit.
請求項1乃至3のうちのいずれか一項に記載の急冷装置であって、
前記第1の冷却回路内の前記冷却水の液面を制御するための機構が設けられていることを特徴とする急冷装置。
The quenching device according to any one of claims 1 to 3,
A quenching device characterized in that a mechanism for controlling the liquid level of the cooling water in the first cooling circuit is provided.
請求項4に記載の急冷装置であって、
前記第1の冷却回路内の冷却水の液面を制御するための前記機構が、前記第1の回路に冷却水を供給こと及び前記第1の回路から冷却水を排出することによって、前記冷却水の液面を調整することを含んでいることを特徴とする急冷装置。
The quenching device according to claim 4,
The mechanism for controlling a coolant level in the first cooling circuit supplies the cooling water to the first circuit and discharges the cooling water from the first circuit, thereby cooling the cooling water. A quenching device comprising adjusting the level of water.
請求項1乃至5のうちのいずれか一項に記載の急冷装置であって、
前記ガスの流れの第1の領域が、直立している円筒形の内側パイプの内壁によって境界が定められており、当該急冷装置のためのガス供給ラインが前記パイプの上端に位置していることを特徴とする急冷装置。
The quenching device according to any one of claims 1 to 5,
The first region of the gas flow is bounded by the inner wall of an upright cylindrical inner pipe, and the gas supply line for the quenching device is located at the upper end of the pipe A quenching device characterized by.
請求項6に記載の急冷装置であって、
前記ガスの流れの前記第2の領域が、前記内側パイプの外壁と、前記内側パイプの周囲に同心状に配置された外側パイプの内壁とによって境界が定められていることを特徴とする急冷装置。
The quenching device according to claim 6,
The quenching device characterized in that the second region of the gas flow is bounded by an outer wall of the inner pipe and an inner wall of the outer pipe arranged concentrically around the inner pipe. .
請求項7に記載の急冷装置であって、
前記内側パイプの下方領域に取り付けられ、前記内側パイプ内を下方へ流れているガスの流れを前記外側パイプ内を上方へ流れているガスの流れ内に偏向させるための偏向装置を備えていることを特徴とする急冷装置。
The quenching device according to claim 7,
A deflecting device attached to a lower region of the inner pipe and for deflecting a gas flow flowing downward in the inner pipe into a gas flow flowing upward in the outer pipe; A quenching device characterized by.
冷却水の添加によって高温ガスの流れを急冷するための方法であって、
第1の冷却回路からの冷却水によってガスの流れの第1の領域内で冷却が行われ、前記第1の領域の下流にあるガスの流れの第2の領域内で、前記第1の水冷回路とは別個の第2の水冷回路からの冷却水によって冷却が行われることを特徴とする急冷方法。
A method for quenching a flow of hot gas by adding cooling water,
Cooling is performed in the first region of the gas flow by the cooling water from the first cooling circuit, and the first water cooling is performed in the second region of the gas flow downstream of the first region. A rapid cooling method characterized in that cooling is performed by cooling water from a second water cooling circuit separate from the circuit.
請求項9に記載の急冷方法であって、
前記第2の冷却回路内の冷却水のみが、熱交換器によって冷却されることを特徴とする急冷方法。
The rapid cooling method according to claim 9,
Only the cooling water in the second cooling circuit is cooled by a heat exchanger.
請求項9又は10に記載の急冷方法であって、
前記ガスの流れの前記第1の領域内のガスが、前記ガスの流れの前記第2の領域内のガスと逆の方向に流れることを特徴とする急冷方法。
The rapid cooling method according to claim 9 or 10,
The rapid cooling method, wherein the gas in the first region of the gas flow flows in a direction opposite to the gas in the second region of the gas flow.
請求項9乃至11のうちのいずれか一項に記載の急冷方法であって、
前記ガスの流れの前記第1の領域内のガスが、冷却前の最初の温度が1000℃乃至2000℃好ましくは1200℃であり、冷却後の温度が95℃乃至70℃好ましくは85℃であることを特徴とする急冷方法。
The rapid cooling method according to any one of claims 9 to 11,
The gas in the first region of the gas flow has an initial temperature before cooling of 1000 ° C. to 2000 ° C., preferably 1200 ° C., and a temperature after cooling of 95 ° C. to 70 ° C., preferably 85 ° C. A rapid cooling method characterized by that.
請求項9乃至12のうちのいずれか一項に記載の急冷方法であって、
前記ガスの流れ内の前記第2の領域内のガスが、冷却前の最初の温度が95℃乃至70℃好ましくは85℃であり、冷却後の温度が70℃乃至40℃好ましくは60℃であることを特徴とする急冷方法。
The rapid cooling method according to any one of claims 9 to 12,
The gas in the second region of the gas flow has an initial temperature before cooling of 95 ° C to 70 ° C, preferably 85 ° C, and a temperature after cooling of 70 ° C to 40 ° C, preferably 60 ° C. A rapid cooling method characterized by being.
請求項9乃至13のうちのいずれか一項に記載の急冷方法であって、
冷却されるべきガスが、10ないし70体積%好ましくは30体積%の水分を含んでいることを特徴とする急冷方法。
The rapid cooling method according to any one of claims 9 to 13,
A rapid cooling method characterized in that the gas to be cooled contains 10 to 70% by volume, preferably 30% by volume, of water.
請求項1乃至8のうちのいずれか一項に記載の装置及び請求項9乃至15のうちのいずれか一項に記載の方法の使用方法であって、
高温再循環プロセスにおいて生じる合成ガスを急冷するために使用することを特徴とする使用方法。
Use of the apparatus according to any one of claims 1 to 8 and the method according to any one of claims 9 to 15,
A method of use characterized in that it is used to quench the synthesis gas produced in a high temperature recirculation process.
JP2006504470A 2003-04-11 2004-02-25 How to cool hot gas instantaneously Pending JP2006522911A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10316874A DE10316874B4 (en) 2003-04-11 2003-04-11 Process for the shock cooling of high-temperature gases
PCT/EP2004/001879 WO2004090447A1 (en) 2003-04-11 2004-02-25 Method for suddenly cooling high-temperature gas

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JP2006522911A true JP2006522911A (en) 2006-10-05

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EP (1) EP1613912B1 (en)
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KR (1) KR20060004662A (en)
CN (1) CN1768243A (en)
AT (1) ATE430295T1 (en)
DE (2) DE10316874B4 (en)
DK (1) DK1613912T3 (en)
ES (1) ES2323640T3 (en)
PT (1) PT1613912E (en)
SI (1) SI1613912T1 (en)
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DE2416167A1 (en) * 1974-04-03 1976-02-05 Werner Ing Grad Minkler Cooling and partial drying of hot moist gases - by direct cooling with pre-cooled condensate
DE2538611C2 (en) * 1975-08-29 1983-09-08 Linde Ag, 6200 Wiesbaden Process for cooling a raw gas mixture containing different boiling hydrocarbons
GB2065500B (en) * 1979-12-19 1983-09-28 Heat Extractor Corp Heat extractor
US5765546A (en) * 1996-05-30 1998-06-16 Sofame Direct contact water heater with dual water heating chambers
DE19633830C2 (en) * 1996-08-22 2002-01-17 Intensiv Filter Gmbh Cooling device based on the evaporation principle for hot, dusty gases
SE514866C2 (en) * 1997-09-23 2001-05-07 Svensk Roekgasenergi Intressen Device for cooling gases
DE10004138C2 (en) * 2000-01-31 2002-05-16 Thermoselect Ag Vaduz Process and device for the disposal and recycling of waste goods

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DK1613912T3 (en) 2009-06-22
KR20060004662A (en) 2006-01-12
CN1768243A (en) 2006-05-03
EP1613912B1 (en) 2009-04-29
SI1613912T1 (en) 2009-10-31
ATE430295T1 (en) 2009-05-15
DE10316874A1 (en) 2004-11-04
ES2323640T3 (en) 2009-07-22
DE10316874B4 (en) 2008-04-03
EP1613912A1 (en) 2006-01-11
WO2004090447A1 (en) 2004-10-21
PT1613912E (en) 2009-06-09

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