JP2006514161A5

JP2006514161A5 -

Info

Publication number: JP2006514161A5
Application number: JP2004568825A
Authority: JP
Filing date: 2003-02-20
Publication date: 2006-06-15

Claims

An apparatus 200 for depositing a uniform coating 232 on a flat surface 234 of a substrate 230 comprising:
a) One or more arrays 210 including a plurality of plasma sources 212 for generating a plurality of plasmas, each of the plurality of plasma sources 212 being disposed in a cathode 214, an anode 216, and a plasma chamber 202. One or more arrays 210 including a non-reactive plasma source gas inlet 218;
b) a deposition chamber 204 for accommodating the substrate 230, wherein the deposition chamber 204 is in fluid communication with the plasma chamber 202, and the plasma chamber 202 is maintained at a first predetermined pressure; 204 is maintained at a second predetermined pressure, the second predetermined pressure being lower than the first predetermined pressure; and c) one or more reactant gases at a constant flow rate of the plurality of plasmas. One or more common reactant gas injectors 220 disposed within the deposition chamber 204 for supply to each.
A device 200 comprising:

The apparatus (200) of claim 1, wherein one or more of the plurality of plasma sources (212) is an expanded thermal plasma source.

The apparatus 200 of claim 1, wherein the one or more arrays 210 include one or more linear arrays of the plurality of plasma sources 212.

The apparatus (200) of claim 1, wherein the one or more arrays (210) comprise one or more two-dimensional arrays of the plurality of plasma sources (212).

A common reactant gas injector 220 for injecting a uniform flow of one or more reactant gases into a plurality of plasmas generated by an array 210 of a plurality of plasma sources 212;
a) a reactant gas inlet comprising a tube wall structure having an internal space useful for supplying said one or more reactant gases from a reactant gas source;
b) a first plurality of orifices 240 proximate to the first plasma, each of the first plurality of orifices 240 passing through the tube wall structure from the interior space to the outer surface of the reactant gas inlet. The first plurality of orifices 240 pass through the first plurality of orifices 240 from the internal space and pass through the first plurality of orifices 240 into the first plasma. A first plurality of orifices 240 that are directed to be injected at a flow rate of c, and c) a second plurality of orifices 242 proximate to the second plasma, the second plurality of orifices 242 Each extending through the tube wall structure from the internal space to the outer surface of the reactant gas inlet, and the second plurality of orifices 242 contain the one or more reactant gases in the internal space. From Directed to pass through the second plurality of orifices 242 and into the second plasma at a second flow rate, the second flow rate being substantially equal to the first flow rate. , Second plurality of orifices 242
A common reactant gas injector 220 comprising:

An apparatus 200 for depositing a uniform coating 232 on a surface 234 of a substrate 230, comprising:
a) one or more arrays 210 comprising a plurality of plasma sources 212 for generating a plurality of plasmas, wherein one or more of the plurality of plasma sources 212 is an expanded thermal plasma source; One or more arrays 210, each including a cathode 214, an anode 216, and a non-reactive plasma source gas inlet 218 disposed within the plasma chamber 202;
b) a deposition chamber 204 for accommodating the substrate 230, wherein the deposition chamber 204 is in fluid communication with the plasma chamber 202, and the plasma chamber 202 is maintained at a first predetermined pressure; 204 is maintained at a second predetermined pressure, the second predetermined pressure being lower than the first predetermined pressure, and c) a uniform flow of one or more reactant gases in the plurality of reactant gases. One or more common reactant gas injectors 220 disposed within the deposition chamber 204 for injecting into each of the plasmas, (i) for supplying the reactant gas from one or more reactant gas sources. And (ii) a first plurality of orifices 240 proximate to the first plasma, each of the first plurality of orifices 240 comprising: Above The first plurality of orifices 240 extend from the internal space through the wall structure to the outer surface of the reactant gas inlet, and the first plurality of orifices 240 pass from the internal space to the first plurality of orifices 240. A first plurality of orifices 240 directed to be injected at a first flow rate into the first plasma and (iii) a second plurality of proximate to the second plasma An orifice 242, each of the second plurality of orifices 242 extending through the tube wall structure from the internal space to an outer surface of the reactant gas inlet, the second plurality of orifices 242 is directed so that the reactant gas passes from the internal space through the second plurality of orifices 242 and is injected into the second plasma at a second flow rate. Said Flow rate substantially equal to a common reactant gas injector 220 comprising a second plurality of orifices 242
A device 200 comprising:

A method for depositing a uniform coating 232 on a flat surface 234 of a substrate 230 comprising:
a) supplying a substrate 230 having a flat surface 234 to the deposition chamber 204;
b) evacuating the deposition chamber 204 to a predetermined deposition pressure;
c) generating a plurality of plasmas from one or more arrays 210 comprising a plurality of plasma sources 212;
d) such that the first flow rate of the one or more reactant gases into the first plasma is substantially equal to the second flow rate of the one or more reactant gases into the second plasma. Injecting one or more reactant gases into each of a plurality of plasmas through one or more common reactant gas injectors 220;
e) flowing one or more reactant gases and a plurality of plasmas into the deposition chamber 204 toward the substrate 230; and f) reacting one or more reactant gases with the plurality of plasmas to flatten the substrate 230. Forming the coating 232 on the surface 234;

The method of claim 7, wherein one or more of the plurality of plasma sources 212 is an expanded thermal plasma source having a cathode 214, an anode 216, and a non-reactive plasma source gas inlet 218 disposed in the plasma chamber 202. .

The first flow rate of the one or more reactant gases into the first plasma is substantially equal to the second flow rate of the one or more reactant gases into the second plasma. A method for injecting one or more reactant gases into a plurality of plasmas generated by an array 210 of a plasma source 212 of
a) supplying one or more reactant gases from a reactant gas source to a common reactant gas injector 220;
b) passing one or more reactant gases through a first plurality of orifices 240 in a common reactant gas injector 220 proximate to the first plasma, wherein the first plurality of orifices 240 is 1 A stage in which the one or more reactant gases are directed to be injected into the first plasma at a first predetermined flow rate; and c) one or more reactant gases in common adjacent to the second plasma. Passing through a second plurality of orifices 242 in the reactant gas injector 220, wherein the second plurality of orifices 242 has one or more reactant gases in the second plasma at a second predetermined flow rate. A method which is directed to be injected and wherein the second predetermined flow rate comprises a step substantially equal to the first predetermined flow rate.

A substrate 230 having a uniform coating 232 deposited on a flat surface 234, the uniform coating 232 being
a) supplying a substrate 230 having a surface 234 to the deposition chamber 204, wherein the deposition chamber 204 is in fluid communication with one or more arrays 210 of a plurality of plasma sources 212, one of the plurality of plasma sources 212. The above is an expanded thermal plasma source having a cathode 214, an anode 216, and a non-reactive plasma source gas inlet 218 disposed in the plasma chamber 202, and the plasma chamber 202 is in fluid communication with the deposition chamber 204. ,
b) exhausting the deposition chamber 204 to a predetermined deposition pressure and evacuating the plasma chamber 202 to a first predetermined pressure, wherein the predetermined deposition pressure is lower than the first predetermined pressure;
c) generating a plurality of plasmas in a plurality of plasma sources 212 and flowing a plurality of plasmas into the deposition chamber 204;
d) When a plurality of plasmas flow into the deposition chamber 204, the first flow rate of the one or more reactant gases into the first plasma is such that the one or more reactant gases into the second plasma Injecting one or more reactant gases into each of the plurality of plasmas through one or more common reactant gas injectors to be substantially equal to the second flow rate;
e) flowing one or more reactant gases and a plurality of plasmas into the deposition chamber 204 toward the substrate 230; and f) reacting one or more reactant gases with each of the plurality of plasmas. A substrate 230 that has been deposited by forming a coating 232 on the surface 234.