JP2006503766A5 - - Google Patents
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- Publication number
- JP2006503766A5 JP2006503766A5 JP2004546944A JP2004546944A JP2006503766A5 JP 2006503766 A5 JP2006503766 A5 JP 2006503766A5 JP 2004546944 A JP2004546944 A JP 2004546944A JP 2004546944 A JP2004546944 A JP 2004546944A JP 2006503766 A5 JP2006503766 A5 JP 2006503766A5
- Authority
- JP
- Japan
- Prior art keywords
- hot melt
- melt adhesive
- layer
- multilayer film
- packaged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004831 Hot glue Substances 0.000 claims 19
- 238000000034 method Methods 0.000 claims 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 4
- 239000005977 Ethylene Substances 0.000 claims 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims 4
- 229920001577 copolymer Polymers 0.000 claims 4
- 238000002844 melting Methods 0.000 claims 3
- 230000008018 melting Effects 0.000 claims 3
- 239000004698 Polyethylene Substances 0.000 claims 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims 2
- HGVPOWOAHALJHA-UHFFFAOYSA-N ethene;methyl prop-2-enoate Chemical compound C=C.COC(=O)C=C HGVPOWOAHALJHA-UHFFFAOYSA-N 0.000 claims 2
- 239000005038 ethylene vinyl acetate Substances 0.000 claims 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 claims 2
- 239000005043 ethylene-methyl acrylate Substances 0.000 claims 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims 2
- -1 polyethylene Polymers 0.000 claims 2
- 229920000573 polyethylene Polymers 0.000 claims 2
- 229920001169 thermoplastic Polymers 0.000 claims 2
- 239000004416 thermosoftening plastic Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/274,827 US7350644B2 (en) | 2002-10-21 | 2002-10-21 | Multi-layer film packaging of hot melt adhesive |
| PCT/US2003/033281 WO2004037671A1 (en) | 2002-10-21 | 2003-10-20 | Packaged hot melt adhesive and method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009239608A Division JP5080542B2 (ja) | 2002-10-21 | 2009-10-16 | 包装されたホットメルト接着剤及びその包装方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006503766A JP2006503766A (ja) | 2006-02-02 |
| JP2006503766A5 true JP2006503766A5 (https=) | 2006-12-07 |
| JP4550581B2 JP4550581B2 (ja) | 2010-09-22 |
Family
ID=32093153
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004546944A Expired - Fee Related JP4550581B2 (ja) | 2002-10-21 | 2003-10-20 | 包装されたホットメルト接着剤及びその包装方法 |
| JP2009239608A Expired - Fee Related JP5080542B2 (ja) | 2002-10-21 | 2009-10-16 | 包装されたホットメルト接着剤及びその包装方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009239608A Expired - Fee Related JP5080542B2 (ja) | 2002-10-21 | 2009-10-16 | 包装されたホットメルト接着剤及びその包装方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7350644B2 (https=) |
| EP (1) | EP1567424A1 (https=) |
| JP (2) | JP4550581B2 (https=) |
| KR (1) | KR101122685B1 (https=) |
| CN (1) | CN100556766C (https=) |
| AU (1) | AU2003279990A1 (https=) |
| WO (1) | WO2004037671A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8225963B2 (en) * | 2005-10-06 | 2012-07-24 | Henkel Ag & Co. Kgaa | Integrated low application temperature hot melt adhesive processing system |
| CN101678925A (zh) | 2007-05-10 | 2010-03-24 | 国际壳牌研究有限公司 | 石蜡组合物 |
| CA2752085C (en) * | 2009-02-24 | 2015-08-18 | Gala Industries, Inc. | Continuous bagging processes and systems |
| US9925694B2 (en) | 2009-02-24 | 2018-03-27 | Gala Industries, Inc. | Continuous bagging processes and systems |
| US8671647B2 (en) * | 2009-06-22 | 2014-03-18 | Gala Industries, Inc. | Continuous pelletizing, drying and bagging systems with improved throughput |
| WO2011082049A1 (en) | 2009-12-31 | 2011-07-07 | Bostik Inc. | Process for packaging tacky polyester resins |
| DE102010003896A1 (de) * | 2010-04-13 | 2011-10-13 | Heimbach Gmbh & Co. Kg | Klebstoffkonfektionierung |
| KR101258406B1 (ko) | 2010-12-29 | 2013-04-26 | 주식회사 성우하이텍 | 스티커형 구조물 접착 패드 |
| US9272795B2 (en) | 2012-05-17 | 2016-03-01 | Henkel IP & Holding GmbH | Integral hot melt adhesive packaging films and use thereof |
| US9630737B2 (en) | 2013-09-25 | 2017-04-25 | Neil Draper | Method of making an asphalt container |
| DK2954995T3 (en) | 2014-06-12 | 2017-05-01 | Organik Kimya Sanayi Ve Tic A S | Process for producing a hot-melt pressure-sensitive adhesive HMPSA having a non-adhesive coating |
| CN107323065B (zh) * | 2017-07-28 | 2019-06-21 | 吴江市东旅织造有限公司 | 一种绣布衬膜去除设备 |
| JP2019108144A (ja) * | 2017-12-18 | 2019-07-04 | ヘンケルジャパン株式会社 | フィルム包装型ホットメルト接着剤 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3314536A (en) | 1962-12-10 | 1967-04-18 | Swift & Co | Packaging adhesives in casings |
| FR2544654B1 (fr) | 1983-04-21 | 1985-11-22 | Keller Dorian Papiers | Procede et moyen de conditionnement d'un produit solide ou pateux possedant un pouvoir collant et produit nouveau obtenu |
| CN1005399B (zh) * | 1984-07-13 | 1989-10-11 | 住友化学工业株式会社 | 拉伸多层聚丙烯薄膜 |
| WO1992002348A1 (en) * | 1990-08-01 | 1992-02-20 | H.B. Fuller Licensing And Financing Inc. | Method of packaging an adhesive composition and corresponding packaged article |
| DE4205418C2 (de) * | 1992-02-22 | 1993-11-18 | Du Pont | Bei der Verarbeitung in der Schmelze verbrauchbare Packung |
| US5373682A (en) | 1992-05-18 | 1994-12-20 | National Starch And Chemical Investment Holding Corporation | Method for tackless packaging of hot melt adhesives |
| US6138441A (en) * | 1993-08-30 | 2000-10-31 | Henkel Kommanditgesellschaft Auf Aktien | Process for production of hotmelt adhesives |
| US5525659A (en) | 1993-09-08 | 1996-06-11 | The Dow Chemical Company | Batch inclusion packages |
| AU672555B2 (en) | 1994-08-12 | 1996-10-03 | National Starch And Chemical Investment Holding Corporation | A production technique for blocks of hot melt adhesives |
| US5804610A (en) * | 1994-09-09 | 1998-09-08 | Minnesota Mining And Manufacturing Company | Methods of making packaged viscoelastic compositions |
| WO1996007522A1 (en) * | 1994-09-09 | 1996-03-14 | Minnesota Mining And Manufacturing Company | Method of making a packaged hot melt adhesive |
| US6006497A (en) * | 1997-03-26 | 1999-12-28 | Reichhold Chemicals, Inc. | Methods and apparatus for preparing a hot melt adhesive |
| WO1999033704A1 (en) | 1997-12-24 | 1999-07-08 | National Starch & Chemical Investment Holding Corporation | Method for packaging of hot melt adhesives |
| US5987852A (en) * | 1998-02-17 | 1999-11-23 | Croda Adhesives, Inc. | Method for the tack-free packaging of a hot-melt pressure sensitive adhesive |
| DE19934705A1 (de) | 1998-08-17 | 2000-02-24 | Henkel Kgaa | Verfahren zum Verpacken von Schmelzklebstoff und ein derart verpackter Schmelzklebstoff |
| EP1330391B1 (en) | 2000-11-04 | 2008-08-13 | National Starch and Chemical Investment Holding Corporation | Packaging of low application hot melt adhesive formulations |
-
2002
- 2002-10-21 US US10/274,827 patent/US7350644B2/en not_active Expired - Lifetime
-
2003
- 2003-10-20 JP JP2004546944A patent/JP4550581B2/ja not_active Expired - Fee Related
- 2003-10-20 WO PCT/US2003/033281 patent/WO2004037671A1/en not_active Ceased
- 2003-10-20 EP EP03773296A patent/EP1567424A1/en not_active Withdrawn
- 2003-10-20 KR KR1020057006789A patent/KR101122685B1/ko not_active Expired - Fee Related
- 2003-10-20 AU AU2003279990A patent/AU2003279990A1/en not_active Abandoned
- 2003-10-20 CN CNB2003801071964A patent/CN100556766C/zh not_active Expired - Fee Related
-
2009
- 2009-10-16 JP JP2009239608A patent/JP5080542B2/ja not_active Expired - Fee Related
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