JP2006344633A - Substrate-mounting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate-packaging structure corresponding to high-density packaging without increasing the number of components and assembly working hours. <P>SOLUTION: The substrate-packaging structure 11 comprises a main substrate 12, a sub substrate 13, a choke coil 14, and a support member 21. The choke coil 14 is arranged between both the substrates 12, 13, and has a core 15, a coil 16, a bobbin 17, and a pin terminal 18. The bobbin 17 has a planar section 17a at the side of the main substrate 12, and a plane section 17b at the side of the sub substrate 13. Respective planar sections 17a, 17b are in surface-contact with the main substrate 12 and the sub substrate 13. The pin terminal 18 is arranged at the side of the main substrate 12 and the side of the sub substrate 13 of the bobbin 17, a pin terminal 18a at one side is arranged, at a position in which the pin terminal 18a is inserted into a through hole 19 on the main substrate 12, and a pin terminal 18b at the other side is arranged, at a position in which the pin terminal 18b is inserted into the through hole 19 on the sub substrate 13 before being jointed by solder 20. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a board mounting structure for mounting electronic components on a plurality of boards.

As shown in FIG. 3, an electronic component 34 is mounted and integrated in a state where a plurality of substrates 33 are stacked via spacers 32 as a substrate mounting structure 31 for high-density mounting on a substrate on which electronic components are mounted. There is. In such a substrate mounting structure 31, high-density mounting can be realized by increasing the number of stacked substrates from two to three or more, or by reducing the thickness of the substrate.
Further, Patent Document 1 proposes a board mounting structure in which parts are fixedly attached to a board and a board and the board are integrally fixed by a common screw.
JP-A-9-283949 (FIG. 1, paragraphs 0008 to 0012 of the specification)

  However, since the board mounting structure described in FIG. 3 and Patent Document 1 requires a common screw, the number of components increases. In addition, the number of assembling steps increases because fastening work using screws or the like is required.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a board mounting structure that supports high-density mounting without increasing the number of parts and the number of assembly steps.

  In order to achieve the above object, the invention according to claim 1 is a board mounting structure in which a mounting component including an electronic component is mounted on a plurality of substrates, the substrate has a mounting portion for mounting the electronic component, The electronic component has a holding body and a terminal portion fixed to the holding body, and is disposed between a plurality of substrates. The terminal portion is formed on one side of the holding body and the other substrate side, and the attachment portion and the terminal portion are soldered together. Thus, the substrate and the electronic component are integrated.

  In this invention, the electronic component holding body can support a plurality of substrates via the terminal portions, and a substrate mounting structure can be realized without increasing the number of components. Also, since the board and the electronic component can be integrated by soldering together with other mounting components, the number of assembly steps is not increased.

  According to a second aspect of the present invention, in the first aspect of the invention, the first flat surface portion is formed on one substrate side of the holding body, and the second flat surface portion is formed on the other substrate side of the holding body, The first planar portion is in surface contact with one substrate, and the second planar portion is in surface contact with the other substrate. Therefore, since the first plane portion and the second plane portion are integrated by bringing the respective substrates into surface contact, the integration of the substrate and the electronic component can be ensured.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, a dedicated support for integrating the substrates is provided. Therefore, since the integration of the substrate and the electronic component is reinforced by the support body, it is not necessary to increase the strength of the electronic component holding body.

  The invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein the attachment portion is a through hole, and the terminal portion is inserted into the through hole and soldered. And Therefore, since the terminal portion is inserted through the through hole and soldered, the bonding strength between the terminal portion and the substrate can be further increased.

  According to the present invention, it is possible to provide a board mounting structure compatible with high-density mounting without increasing the number of parts and the number of assembly steps.

  Hereinafter, an embodiment embodying the present invention will be described with reference to FIG. FIG. 1A is a schematic view of a substrate mounting structure, and FIG.

  As shown in FIG. 1A, the board mounting structure 11 has a main board 12 and a sub board 13 that are boards, a choke coil 14 that is an electronic component, and a support member 21. Both substrates 12 and 13 are obtained by forming a conductor pattern on a planar insulating substrate, and a component (not shown) other than the choke coil 14 is mounted, and a through hole 19 as an attachment portion is provided. The choke coil 14 is disposed between the substrates 12 and 13.

  The choke coil 14 includes a core 15, a coil 16 wound around the core 15, a bobbin 17 that is a holding body, and a pin terminal 18 that is a terminal portion. The pin terminal 18 has such a size that it can be inserted into a through hole 19 (see FIG. 1B) that is an attachment portion between the main board 12 and the sub board 13. The bobbin 17 has a structure for holding the core 15 and the coil 16 and is formed so as to surround the core 15 and the coil 16. The pin terminal 18 is electrically connected to the coil 16 and is fixed to the bobbin 17.

  The bobbin 17 has a planar portion 17a that is a first planar portion on the main substrate 12 side, and a planar portion 17b that is a second planar portion on the sub-substrate 13 side. The flat portions 17 a and 17 b are in surface contact with the main board 12 and the sub board 13.

  The pin terminal 18 is disposed so as to extend to the main board 12 side and the sub board 13 side of the bobbin 17, and the pin terminal 18 a on one side is positioned so as to be inserted into the through hole 19 of the main board 12, and the pin terminal 18 b on the other side. Are respectively arranged at positions where they pass through the through holes 19 of the sub-board 13. As shown in FIG. 1B, the pin terminal 18 is inserted into the through hole 19 and joined by the solder 20, whereby the sub-board 13 and the pin terminal 18 b are integrated.

  The support member 21 is integrated with both the boards 12 and 13 by screwing in a portion where the choke coil 14 is not provided to stabilize the board mounting structure and increase the strength. The support member 21 of this embodiment has a size corresponding to the height of the choke coil 14.

  As a board mounting method, the pin terminal 18a is inserted into the through hole 19 of the main board 12 to be temporarily fixed, and then mounted together with other components to be mounted on the main board 12 by a flow soldering method. Similarly, the pin terminal 18b is inserted into the through hole 19 of the sub-board 13 and temporarily fixed, and is mounted together by the flow soldering method simultaneously with other components mounted on the sub-board 13. Thereby, in the present embodiment, the main board 12 and the sub board 13 are integrated via the choke coil 14.

  This embodiment has the following effects.

  (1) Since the pin terminals 18a and 18b of the choke coil 14 to be attached to both the boards 12 and 13 are used, the support member 21 which is a dedicated attachment member for integrating a plurality of boards is eliminated or the number of use is reduced. Can do. As a result, the assembly man-hour is also reduced.

  (2) Since the planar portion 17a and the main substrate 12 and the planar portion 17b and the sub-substrate 13 are brought into surface contact with each other, the bobbin 17 supports both the substrates together with the pin terminals 18. Therefore, the choke coil 14, the main board 12, and the sub board 13 are easily integrated and the strength is increased and stabilized.

  The present invention is not limited to the above, and may be embodied as follows, for example.

  If the bonding force between the through hole 19 and the pin terminal 18 is sufficient, the flat portions 17a and 17b of the bobbin 17 and the substrates 12 and 13 do not need to be in surface contact as shown in FIG. In this case, a mounting component larger than the bobbin 17 can be mounted, and the design freedom of the board mounting structure 11 is increased.

  The number of choke coils 14 integrated with the main board 12 and the sub board 13 is not limited to two, but may be one or more.

  If it has a housing like the bobbin 17, an electronic component other than the choke coil 14 may be used.

  The mounting portion for soldering to the pin terminal 18 is not limited to the through-hole 19 and may be a land as long as a bonding force can be secured.

(A) The schematic diagram of the board | substrate mounting structure of one Embodiment, (b) A part sectional drawing. The schematic diagram of the board | substrate mounting structure in another embodiment. The schematic diagram of the board | substrate mounting structure of a prior art.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Board mounting structure, 12 ... Main board, 13 ... Sub board | substrate, 14 ... Choke coil, 15 ... Core, 16 ... Coil, 17 ... Bobbin, 18 ... Pin terminal, 19 ... Through-hole, 20 ... Solder.

Claims (4)

In board mounting structure where mounting parts including electronic parts are mounted on multiple boards,
The substrate has a mounting portion for mounting the electronic component,
The electronic component has a holding body and a terminal portion fixed to the holding body and is arranged between the plurality of substrates.
The terminal portions are formed on one and other substrate sides of the holding body,
A board mounting structure in which the board and the electronic component are integrated by soldering the attachment part and the terminal part. Forming a first planar portion on one substrate side of the holder;
Forming a second planar portion on the other substrate side of the holder;
Bringing the first planar portion into surface contact with the one substrate;
The board mounting structure according to claim 1, wherein the second flat surface portion is in surface contact with the other substrate. The board mounting structure according to claim 1, further comprising a dedicated support for integrating the plurality of boards. The mounting portion is a through hole,
The board mounting structure according to any one of claims 1 to 3, wherein the terminal portion is inserted into the through hole and soldered.

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