JP2006334598A - Gas jetting type soldering iron - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a new gas jetting type soldering iron with which heated inert gas is efficiently jetted from the tip of the iron by providing distribution tubes in the hollow part of a heater and causing the inert gas to pass through these distribution tubes without making the main body of the solder iron larger. <P>SOLUTION: This iron is provided with a hollow holding member 1 which is communicated from one end to the other end, the hollow heater 2 which is provided inside this holding member 1 and extended from one end to the other end, a distribution tubular body 4 which has a plurality of the distribution tubes 3 extended from one end to the other end in the hollow part of this heater 2 and with which the inert gas flown from one end to the other end is heated and an iron tip member 5 which is heated with the heater 2 by bringing into contact with the other end of the heater 2. By forming a plurality of jetting holes 6 which are penetrated from the inside where this iron tip member 5 is brought into contact with the other end of the heater 2 to the side face of the iron tip member 5, the inert gas which is passed through the distribution tubular body 4 is jetted from the jetting holes 6. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention mainly relates to a gas injection type soldering iron that performs soldering by injecting a heated inert gas or a mixed gas of an inert gas and a reducing gas onto lead-free solder.

  Conventionally, a gas flow path for circulating a mixed gas is formed on the outer periphery of the rivet body, and there is an opening at the tip of the solder rivet so as to surround the rivet tip. , See Patent Document 1). Further, there is a description that only one heater may be provided and shared without separately providing the gas heater and the soot heater.

JP 2000-263223 A (FIG. 1)

  However, since a gas flow path for circulating the mixed gas is formed on the outer periphery of the main body, the size of the solder iron main body is increased, and if the gas heater and the iron heater are provided separately, the solder iron main body is further enlarged. There was a problem of becoming. Also, give sufficient heat to both the gas and solder to avoid temperature drop between the heated soldering tip and the soldered pre-heated part (because the melting point of lead-free solder is higher than eutectic solder). However, when the gas heater and the soot heater are shared, there is a problem that adjustment of the heater is difficult.

  The present invention has been made to solve the above-described problems. A flow pipe is provided in the hollow portion of the heating body without increasing the size of the solder iron body, and an inert gas is passed through the flow pipe. An object of the present invention is to provide a novel gas-injection soldering iron that injects an inert gas heated more efficiently from the iron tip.

  A gas injection type soldering iron according to the invention of claim 1 includes a hollow holding member communicating from one end to the other end, a hollow heating body provided inside the holding member and extending from one end to the other end, The hollow portion of the heating body has a plurality of flow pipes extending from one end to the other end, the flow pipe body for heating the inert gas flowing from one end to the other end, and the other end of the heating body in contact with the A tip member heated by a heating body, and a plurality of injection holes penetrating from the inside contacting the other end of the heating body of the tip member to the side surface of the tip member, The inert gas that has passed through the body is jetted from the jet hole.

  A gas injection type soldering iron according to the invention of claim 2 includes a hollow holding member communicating from one end to the other end, a hollow heating body provided inside the holding member and extending from one end to the other end, A plurality of flow pipes extending from one end to the other end in a hollow portion of the heating body, a flow pipe body for heating an inert gas flowing from one end to the other end, and a portion on a peripheral surface at the other end of the heating body; An inert gas that has passed through the flow pipe through a gap formed on the peripheral surface of the other end of the heating body. The guide member is guided to the periphery of the side surface of the tip member.

  A gas injection type soldering iron according to a third aspect of the invention includes a hollow holding member communicating from one end to the other end, a hollow heating body provided inside the holding member and extending from one end to the other end, A plurality of flow pipes extending from one end to the other end in a hollow portion of the heating body, provided with a flow pipe body for heating an inert gas flowing from one end to the other end, and the other end of the holding member; A reflective member that surrounds the tip member, and a tip member that contacts the other end of the heating body and is heated by the heating body, and an inner side of the tip member that contacts the other end of the heating body A plurality of injection holes penetrating from the side of the tip member to the side surface of the tip member, or an inert gas injected from a gap formed in the peripheral surface at the other end of the heating body is reflected by the reflecting member to It is intended to be concentrated at the tip.

  A gas injection type soldering iron according to a fourth aspect of the present invention is a hollow holding member communicating from one end to the other end, a hollow heating body provided inside the holding member and extending from one end to the other end, The hollow portion of the heating body has a plurality of flow pipes extending from one end to the other end, and contacts the flow pipe body for heating the inert gas flowing from one end to the other end, and the peripheral surface at the other end of the heating body. A tip member heated by the heating body, and an injection hole is formed in the tip end portion of the tip member from the inside contacting the other end of the heating body of the tip member, and the flow pipe The inert gas that has passed through the body is jetted from the jet hole.

  A gas injection type soldering iron according to a fifth aspect of the present invention is the gas injection type soldering iron according to any one of the first to fourth aspects, wherein the flow tube is a polygonal mesh tube.

  As described above, according to the first to fifth aspects of the present invention, since the plurality of flow pipes are provided in the hollow portion of the heating body that heats the tip member, the inert gas passing through the flow pipe is effectively used. The effect that the heated inert gas can be injected can be produced.

Embodiment 1 FIG.
Embodiment 1 of the present invention will be described below with reference to FIGS. FIG. 1 is a configuration diagram of a gas-injected solder rod according to Embodiment 1, FIG. 1 (a) is an overview of the gas-injected solder rod, and FIG. 1 (b) is a cross-sectional view of the gas-injected solder rod. It is a perspective view of a distribution pipe body. 1 (a) and 1 (b), 1 is a hollow holding member, 2 is provided inside the holding member 1, and is a hollow cylindrical or wound heating body extending from one end to the other end. A flow pipe having a hexagonal cross section provided in a hollow portion of the heating body 2 and extending from one end to the other end, 4 is a flow pipe having a structure (honeycomb structure) having a plurality of hexagonal flow pipes 3, 5 Is a tip member that contacts the peripheral surface of the other end of the heating body 2 and is heated by the heating body 2, and 6 is a side surface of the tip member 5 from the inside that contacts the tip member 5 of the other end of the heating body 2. A plurality of injection holes that penetrate and communicate with the flow tube 4 are an inert gas or a mixed gas of an inert gas and a reducing gas (hereinafter referred to as a mixed gas of an inert gas and a reducing gas). Gas pipe for supplying the flow pipe 4 (flow pipe 3) to the flow pipe 4 (generally referred to as an inert gas). Compensating for the difference in diameter between the flow pipe 3) and the gas pipe 7, connecting gas pipe connecting members, 9 is a power supply line for supplying power to the heating element 2, 10 is a power supply line 9, gas pipe 7, gas It is a grip member that houses the pipe connecting member 8 and fixes the holding member 1. In FIG. 1, the gas pipe connecting member 8 has a tapered shape, but may be any shape that can compensate for the difference in diameter between the flow pipe body 4 (flow pipe 3) and the gas pipe 7.

  2 is a diagram of the tip of the tip of the gas injection type soldering iron according to the first embodiment and its cross-sectional view, FIG. 2A is a schematic view of the tip of the tip, and FIG. 2B is a cross-sectional view of the tip of the tip. Example 1) and FIG. 2 (c) are cross-sectional views (example 2) of the tip member, and FIG. 2 (d) is a cross-sectional view (example 3) of the tip member. 2 (a), (b), (c) and (d), 51 and 52 are tip members having different shapes from the tip member 5, and 61 and 62 are injection holes of the tip members 51 and 52, respectively. is there. FIG. 3 is a view of the periphery of the tip member of the gas-injection type soldering iron according to the first embodiment and a gas atmosphere, and 11 is a conductive material on which the connection terminal of the electronic component to be soldered is mounted. The conductive wiring pad 12 is a gas atmosphere created by an inert gas or mixed gas injected from the injection hole 6. Moreover, in FIG. 3, the object to be soldered and the solder itself are not shown. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  Next, the operation will be described. When the inert gas or mixed gas passes through the flow pipe body 4 from the gas pipe 7 connected to the supply source (not shown) of the inert gas or mixed gas via the gas pipe connecting member 8, heating is performed. Since the flow tube 4 is in the hollow portion of the body 2, the flow tube 4 is heated by the radiant heat or direct heat of the heating body 2, and then the inert gas or mixed by the radiant heat or direct heat of the heated flow tube 4. The gas is heated. Here, since the flow tube 4 is composed of a plurality of flow tubes 3, the heat transfer rate into the tube is high. In the pipe having the same diameter as the honeycomb structure in the embodiment of the present application, the heat transfer rate to the inert gas or mixed gas is approximately 30% higher in the honeycomb structure, and therefore the inert gas or mixed gas and the tip member 8 It is easier to adjust both the heating and the heating of the soldering iron body without reducing the temperature of the preheated soldering target part (not shown) and the tip member 5 (small diameter). Can be realized. Further, the fixing method of the tip member 5 of the holding member 1 includes a method of inserting the tip member into the holding member, a screwing method, a method of fixing with an attachment, etc., and the flow tube 4 is not limited to the honeycomb structure, A structure having a large surface area of the tube may be used.

  The heated inert gas or mixed gas is injected from the injection hole 6 provided in the tip member 5 after passing through the flow pipe 3 to form a gas atmosphere 12 around the tip member 5 and the wiring pad 11. (Figure 3). The communication method of the flow pipe 3 and the injection hole 6 may be connected in a one-to-one manner, or may be connected in a bundle. In addition, a recess is provided in the heating body 2 or the tip member 5, 51, 52 (FIG. 2) or both between the connection of the flow pipe 3 and the injection hole 6 and communicated via the space. Also good. Then, soldering is performed with the tip member 5 heated by the heating body 2 in the gas atmosphere 12. Here, when the gas to be injected is an inert gas, the concentration of oxygen is reduced in the gas atmosphere 12, and the oxidation of the tip member 5 during soldering is suppressed. When the gas to be injected is a mixed gas, in addition to the effect of the inert gas described above, a portion oxidized by the tip member 5 and an oxide film applied on the surface of the wiring pad 11 for preventing oxidation are reduced gas. Since the wettability of the lead-free solder is improved by the reduction by the above, the use of flux for improving the wettability can be suppressed, and the process of removing the residual flux after soldering can be omitted. This gas injection function may be used as a preheating device for the soldering target portion (wiring pad 11), or a vacuum pump and a suction hole connected to the vacuum pump around the tip member 5 are provided. You may use together with a solder suction device.

  When the molten lead-free solder is cooled (solidified), trace element alloys represented by bismuth (Bi) and copper (Cu), which have a different melting point (freezing point) from the lead-free solder contained in the lead-free solder, Although segregation in which the concentration distribution is non-uniform between the outside and inside of the lead-free solder occurs, the opening surface provided in the tip member 5 that is close to the wiring pad 11 during soldering has a spiral shape (FIG. 2). (A) Since the inert gas or mixed gas is injected from the injection hole 6 that has been made, it is easy to maintain the shape of the good gas atmosphere 12 for soldering, and it is injected from the injection hole 6 even after the lead-free solder is melted. Inert gas or mixed gas becomes a heated gas flow, lead-free solder is not cooled rapidly, but gradually cooled, segregation is mitigated, and solidified lead-free solder has a uniform concentration distribution of trace element alloy Fine Since the solid tissue, improved heat shock resistance, can be performed effectively soldering.

  The plurality of injection holes 6 for injecting the inert gas or the mixed gas have holes from the communication portion with the flow tube 4 as shown in FIGS. 1 (a), 1 (b) and 2 (a), 2 (b). Not only an independent structure but also a structure (FIG. 2 (c)) in which a main hole is provided in the central portion of the tip member 51 and a hole connecting from the main hole to the opening surface of the injection hole 61 is formed. The structure which penetrated the inside of this and opened the hole connected with the opening surface of the injection hole 62 (FIG.2 (d)) may be sufficient. Further, if the flow tube 4 and the injection hole 6 are in contact with each other inside the connection between the holding member 1 and the tip member 5, the heat transfer rate to the tip member 5 is improved. The tip member 5 is made of copper, which has good thermal conductivity and is easy to process, and the surface is plated with iron in order to prevent copper wear. The tip members 5, 51, 52 are manufactured by drilling by machining, electric discharge machining, or laser machining. Note that the tip member can be mass-produced by using a method of melting the portion where the hole is provided by etching.

Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIGS. FIG. 4 is a configuration diagram of a gas-injected solder rod according to the second embodiment, FIG. 4 (a) is an overview of the gas-injected solder rod, and FIG. 4 (b) is a cross-sectional view of the gas-injected solder rod. FIGS. 4A and 4B are cross-sectional views of three portions in the axial direction of the flow tube body and the tip member. In FIGS. 4A and 4B, 13 is in contact with the peripheral surface at the other end of the heating body 2 and heated by the heating body 2. A tip member (no injection hole) 14 is formed on the peripheral surface of the other end of the heating body 2 and is a gap portion communicating with the flow tube 4. FIG. 5 is a view of the periphery of the tip member of the gas-injection type soldering iron according to the second embodiment and a gas atmosphere. The inert gas that has passed through the flow tube 4 through the gap 14 is a side surface of the tip member 13. It is shown that a gas atmosphere 12 is formed around. Moreover, in FIG. 5, the object to be soldered and the solder itself are not shown. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  In the first embodiment, a plurality of injection holes 6 communicating with the flow tube 4 are provided on the side surface of the tip member 5, and the gas atmosphere 12 is formed and soldered (FIGS. 1 to 3). Depending on the specifications of the tip member and the soldering environment, the inert gas that has passed through the flow tube 4 is guided to the periphery of the side surface of the tip member (no injection hole) 13 through the gap portion 14. Also, the same effect as in the first embodiment can be obtained. The gap portion 14 is provided with a gap so that contact between the tip member 5 and the heating body 2 can be ensured, and the inert gas or mixed gas that has passed through the flow pipe 3 (flow pipe 4) passes therethrough. As long as the gas atmosphere 12 can be formed around the side surface of the tip member 13, the shape does not have to be the three-hole (arc-shaped) shape shown in FIG. Further, the shape of the gas atmosphere 12 may be adjusted by making the opening surface of the gap portion 14 into a nozzle-like injection hole.

Embodiment 3 FIG.
A third embodiment of the present invention will be described with reference to FIGS. 6 and 7 are configuration diagrams of the gas-injection type soldering iron according to the third embodiment, FIG. 6A is an overview of the gas-injection type soldering iron, and FIG. 6B is a cross-sectional view of the gas-injection type soldering iron. 7 (a) is a schematic view of the gas jet soldering iron, and FIG. 7 (b) is a cross sectional view of the gas jet soldering iron and three cross sectional views in the axial direction of the flow pipe body and the tip member. 6 (a), 6 (b), 7 (a) and 7 (b), 15 is in contact with the heating body 2 and is connected to the peripheral surface of the holding member 1 to connect the tip member 5 (tip member 13). It is the surrounding reflection member. 8 shows the periphery of the tip member of the gas injection type soldering iron according to the third embodiment and the gas atmosphere, FIG. 8A shows the gas atmosphere of the tip member having the injection hole, and FIG. 8B shows the injection hole. FIG. 9 is a gas atmosphere diagram of a tipless member, and FIG. 8 does not show an object to be soldered and the solder itself. In addition, the same code | symbol in a figure shows the same or an equivalent part, and detailed description about them is abbreviate | omitted.

  In the third embodiment, a reflective member 15 is provided that is connected to the peripheral surface of the holding member 1 and surrounds the tip member 5 (tip member 13) to the gas injection type solder rod of the first and second embodiments. It is a thing. The operation will be described. The heated inert gas or mixed gas is injected from the injection hole 6 (FIG. 8A) or the gap portion 14 (FIG. 8B) provided in the tip member 5 after passing through the flow pipe 3. The scattering of the inert gas or mixed gas at a location away from the wiring pad 11 is prevented by reflecting the inert gas or mixed gas by the reflecting member 15, and the periphery of the tip member 5 (tip member 13) and the wiring pad 11. A gas atmosphere 12 is formed. Moreover, since the reflecting member 15 is in contact with the heating body 2 and heated, and the inert member or mixed gas comes into contact with the reflecting member 15 and reflects, the tip member is not deprived of heat by the reflecting member 15. Since the gas atmosphere 12 can be formed around 5 (tip member 13) and the wiring pad 11, the shape of the gas atmosphere 12 can be maintained better than in the first and second embodiments.

Embodiment 4 FIG.
Embodiment 4 of the present invention will be described with reference to FIG. FIG. 9 is a configuration diagram of a gas injection type soldering iron according to the fourth embodiment, FIG. 9A is a schematic view of the gas injection type soldering iron, and FIG. 9B is a cross-sectional view of the gas injection type soldering iron. 9 (a) and 9 (b), 16 is a tip member (tip injection hole) that contacts the peripheral surface of the other end of the heating body 2 and is heated by the heating body 2, and 17 is the other of the heating body 2. This is an injection hole (tip) that penetrates the tip of the tip member 16 from the inside contacting the tip member 5 and communicates with the flow tube 4. Note that a plurality of injection holes 17 may be provided at the tip of the tip member 16. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. Since the injection hole 17 is provided at the tip of the tip member 16, the heated inert gas or mixed gas is injected from the injection hole 17 provided in the tip member 16 after passing through the flow pipe 3. Thus, a non-contact gas jet soldering iron that directly melts the solder can be obtained. As in the other embodiments, the communication method between the pipe 3 and the injection hole 6 may be one-to-one or may be connected in a bundle. In addition, a recess may be provided in the heating body 2 or the tip member 16 or both of them between the connection of the flow pipe 3 and the injection hole 6 so as to communicate with each other via the space. This structure may be used as a hot air welder for welding or pressure bonding of polyethylene or resin film packaging.

Embodiment 5. FIG.
Embodiment 5 of the present invention will be described with reference to FIG. FIG. 10 is a configuration diagram of a heating temperature control gas injection type solder iron according to the fifth embodiment. In FIG. 10, reference numeral 18 denotes any of the gas injection type solder irons according to the first to fourth embodiments. 19 is a substrate on which the wiring pads 11 are formed, 20 is an electronic component placed on the substrate 19, 21 is a connection terminal for connecting the electronic component 20 and the wiring pad 11, and 22 is in contact with or close to the electronic component 20. The temperature sensor 23 is a controller sensor that measures the temperature and controls the temperature. A connection cable 23 connects the temperature sensor 22 and the gas injection soldering iron 18. In FIG. 10, solder is not shown. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  When the electronic component 20 is a weak heat-resistant component, the temperature sensor 22 relieves the influence of a rapid temperature rise. Therefore, when the preset upper limit temperature exceeds the actually measured value, the power supply to the heating element is performed. When the power is turned off and the value measured by the temperature sensor 22 falls below the upper limit set temperature, the power supply to the heating element is turned on. Further, the temperature sensor 22 may perform ON / OFF control around the upper limit set temperature by PID control. In order to control the temperature of the tip member, an internal temperature sensor may be provided inside the gas injection solder rod 18 to control the temperature of the heating body, and the heating temperature of the heating body is located near the tip member. If an internal temperature sensor (controller sensor) is installed to control the temperature, and the internal temperature sensor is inserted into the tip of the heating element to form a ceramic casting, the conductor is energized, or the heating element is insulated and wired To do.

  11 is a modified view of the tip member of the first to fifth embodiments. In FIG. 11, 53, 54, and 55 are tip members having shapes different from the shape of the tip member 5. . Further, in FIG. 11, the injection holes are not shown for simplicity. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. The shape of the tip member may be selected according to the application (for example, the one shown in FIG. 11), and the tip member 5 of the gas injection type solder rod 18 may be replaceable.

It is a block diagram of the gas injection type soldering iron by Embodiment 1 of this invention. It is a tip member figure of the gas injection type soldering iron by Embodiment 1 of this invention. It is a tip member periphery of a gas injection type soldering iron by Embodiment 1 of this invention, and a gas atmosphere figure. It is a block diagram of the gas injection type soldering iron by Embodiment 2 of this invention. It is a tip member periphery of a gas injection type soldering iron by Embodiment 2 of this invention, and a gas atmosphere figure. It is a block diagram of the gas injection type soldering iron by Embodiment 3 of this invention. It is a block diagram of the gas injection type soldering iron by Embodiment 3 of this invention. It is a tip member periphery of a gas injection type soldering iron by Embodiment 3 of this invention, and a gas atmosphere figure. It is a block diagram of the gas injection type soldering iron by Embodiment 4 of this invention. It is a block diagram of the heating temperature control gas injection type soldering iron by Embodiment 5 of this invention. It is a modification figure of the tip member of Embodiment 1 thru | or Embodiment 5 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Holding member, 2 ... Heating body, 3 ... Flow pipe, 4 ... Flow pipe body 5, 51, 52, 53, 54, 55 ... Tip member, 6, 61, 62 ... Injection hole, 7 ... Gas piping 8 DESCRIPTION OF SYMBOLS ... Gas piping connection member, 9 ... Feed line, 10 ... Grip member, 11 ... Wiring pad 12 ... Gas atmosphere, 13 ... Tip member (no injection hole), 14 ... Gap part, 15 ... Reflective member 16 ... Tip member (Tip injection hole), 17 ... injection hole (tip), 18 ... gas injection type soldering iron 19 ... substrate, 20 ... electronic component, 21 ... connection terminal, 22 ... temperature sensor, 23 ... connection cable

Claims (5)

A hollow holding member communicating from one end to the other end, a hollow heating body provided inside the holding member and extending from one end to the other end, and a plurality of hollow portions of the heating body extending from one end to the other end A circulation pipe body for heating an inert gas flowing from one end to the other end, and a tip member that is heated by the heating body in contact with the other end of the heating body, A plurality of injection holes penetrating from the inside of the tip member contacting the other end of the heating body to the side surface of the tip member are formed, and the inert gas that has passed through the flow tube is injected from the injection hole. Gas jet type soldering iron. A hollow holding member communicating from one end to the other end, a hollow heating body provided inside the holding member and extending from one end to the other end, and a plurality of hollow portions of the heating body extending from one end to the other end A flow tube that heats the inert gas flowing from one end to the other end, and a tip that is partially in contact with the peripheral surface of the other end of the heating body and heated by the heating body And a gas that guides the inert gas that has passed through the flow tube to the periphery of the side surface of the tip member through a gap formed on the peripheral surface of the other end of the heating body. Spray-type soldering iron. A hollow holding member communicating from one end to the other end, a hollow heating body provided inside the holding member and extending from one end to the other end, and a plurality of hollow portions of the heating body extending from one end to the other end A flow tube that heats an inert gas flowing from one end to the other end, a reflective member that is provided at the other end of the holding member and surrounds the tip member, and A plurality of injection holes penetrating from the inner side of the tip member contacting the other end of the heating body to the side surface of the tip member. Alternatively, a gas injection type soldering iron in which an inert gas injected from a gap portion formed on a peripheral surface at the other end of the heating body is reflected by the reflecting member and concentrated on a tip portion of the tip member. A hollow holding member communicating from one end to the other end, a hollow heating body provided inside the holding member and extending from one end to the other end, and a plurality of hollow portions of the heating body extending from one end to the other end A circulation pipe body that heats an inert gas that flows from one end to the other end, and a tip member that is in contact with the peripheral surface at the other end of the heating body and is heated by the heating body. The injection hole is formed in the front-end | tip part of the said tip member from the inner side which contacts and the other end of the said heating body of this tip member, and the inert gas which passed the said flow pipe body is injected from the said injection hole Gas jet type soldering iron. The gas injection type soldering iron according to any one of claims 1 to 4, wherein the flow tube is a polygonal mesh tube.

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