JP2000176637A - Non-contacting type soldering iron - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contacting type soldering iron which is capable of soldering in a short time by quickly forming a heating gas flow at a prescribed temperature and which is also capable of an intermittent soldering operation. SOLUTION: The soldering iron is provided with a bar-shaped heater 14 which has an internal heating passage 18 penetrating through the inside in the axial direction; a heating chamber 17 which has the main nozzle 24 at the tip end, which covers a heating part 14a of the heater 14 with an external heating passage 27 between the heating part and its outer circumferential face, and which forms a heating gas flow G1; an outer peripheral cover 10 which has a blocked tip end and which covers the outer circumference of the heating chamber 17 with a gas space 28 provided holding a heating gas G3 between the cover and the heating chamber 17; and a gas feeding passage 33, 41 which supplies an inert gas or air from an outside gas source to the external and internal heating passage 18, 27 and which injects the gas or the air from the tip end of the main nozzle 24 to a part to be soldered as the heating gas G1, G2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to, for example, electronic components,
In particular, the present invention relates to a non-contact soldering iron suitable for intermittently and non-contactly soldering electronic components, such as ICs and LSIs, which are easily affected by heat to a circuit board.

[0002]

2. Description of the Related Art A contact-type soldering iron in which a tip chip heated by a heater or the like is brought into contact with a land or a work of a circuit board to melt the solder is used to leak current, noise, and harmonics from the tip chip to a circuit board or an electronic component. In addition, there is a concern that the characteristics of electronic components may deteriorate due to transmission of static electricity and the like, and they are not suitable for soldering electronic components such as ICs and LSIs that are easily affected by heat. It is preferable to use a non-contact soldering iron. As a conventional non-contact type soldering iron of this type, one having a structure as shown in FIG. 4 is known (see Japanese Patent Publication No. 7-83940).

The non-contact type soldering iron is heated by a hollow heater 3 toward a work W placed on a cream solder 7 applied on a conductor pattern 6 of a circuit board 5 for reflow soldering. The hot air H1 is blown from the inner nozzle 1 and the preheated air H2 heated by the hollow heater 4 to a temperature suitable for preheating the cream solder 7 is blown from the outer nozzle 2 so as to wrap the high-temperature hot air H1. ing. As a result, the preheated air H2 is sprayed around the cream solder 7 and preheated, and
Is sprayed onto the cream solder 7, and the high-temperature hot air H1 is
By enclosing with 2 and shielding from outside air, soldering is performed in a state where the soldering temperature is stabilized.

[0004]

However, the above-mentioned non-contact type soldering iron has the following problems.
That is, the hollow heaters 3 and 4 used for generating hot air have a heating element such as a nichrome wire or platinum inside a container such as a quartz tube. However, since there is a large space inside and the thermal efficiency is extremely low, the gas flow of air or nitrogen passing through the inside is required to melt the cream solder 7 unless the static pressure is increased to increase the density. It does not reach the specified temperature of ℃ ~ 600 ℃. Therefore, in order to increase the static pressure, the flow rate of the gas flow is set to a relatively large value, for example, 5 to 15 Nl / min, but the cream solder 7 and the work W are blown by a large flow of hot air. This makes it very difficult to perform soldering because the solder is easily moved or displaced from a predetermined soldering position. Therefore, the above-mentioned non-contact type soldering iron can be used only for soldering in a low temperature region where only a small amount of hot air is required, and even in this case, it takes about 5 to 15 seconds for soldering per work W. Since it takes a relatively long time and is not practical, it is mainly used exclusively for removing soldered electronic components.

Further, when the hollow heaters 3 and 4 are continuously driven, if the gas flow is not continuously supplied to the heating element, the hollow heaters are overheated and disconnected in a short time. When the hollow heaters 3 and 4 are driven intermittently, it takes a considerable time until the gas flow reaches a predetermined temperature required for soldering. That is, it is difficult to control the above-mentioned soldering iron to blow out hot air at a constant temperature intermittently.
Since intermittent soldering cannot be performed, it is inevitably used in a state in which a high-temperature gas stream is continuously jetted. Therefore, when an electronic component is present between a plurality of soldering spots, hot air is applied to the electronic component during the movement of the soldering iron, causing a bad thermal effect.

Accordingly, the present invention has been made in view of the above technical problems, and an object of the present invention is to quickly generate a heating gas flow at a predetermined temperature to perform soldering in a short time without any trouble. It is an object of the present invention to provide a non-contact type soldering iron which is capable of performing intermittent soldering work.

[0007]

In order to achieve the above object, a non-contact soldering iron according to a first aspect of the present invention comprises a rod-shaped heater having an inner heating passage penetrating in an axial direction therein, and a main nozzle. A heating chamber that has an outer heating passage between the heater and the outer peripheral surface of the heater of the heater to cover the heater, and that generates a heating gas flow; An outer peripheral cover that covers the outer periphery of the heating chamber with a gas space in which a heating gas exists,
A gas supply passage for supplying an inert gas or air from an external gas source to the outer and inner heating passages and ejecting the same as the heating gas from the tip of the main nozzle toward the soldering portion. .

In this soldering iron, the inner heating passage is provided inside the heating portion of the heater, and the outer heating passage is provided outside the heater. Therefore, the contact area between the heating gas and the heater is significantly increased, and The generated heat can be transferred to the heating gas extremely efficiently. Further, a gas space is formed between the outer peripheral surface of the heating chamber and the inner peripheral surface of the outer peripheral cover, so that heat generated by the heater can be prevented from being dissipated to the outside.
Thermal efficiency is further increased. Therefore, even a small amount of inert gas or air having a low static pressure can be heated to a predetermined temperature in a short time with high thermal efficiency. Moreover,
The generated heating gas flow has a small flow rate, and is diffused and slightly decelerated when ejected from the main nozzle into the atmosphere, so that the cream solder flows or the soldering member is brought into a predetermined shape. Since it is not displaced in a direction deviating from the position, soldering can be performed without any trouble. Furthermore, since the thermal efficiency is high and the flow rate is small, the inert gas or air can be heated to reach the predetermined temperature in a very short time, so that intermittent soldering is also possible.

According to a second aspect of the present invention, there is provided a non-contact type soldering iron having a rod-shaped heater having an inner heating passage penetrating in the axial direction therein, a main nozzle at a tip, and an outer peripheral surface of a heating portion of the heater. A heating chamber that covers the heating section with an outer heating passage therebetween and generates a heating gas flow, and an annular sub-nozzle located at the outer periphery of the main nozzle at the tip, and has an outer periphery of the heating chamber. An outer peripheral cover for generating a gas flow for shielding in a sub-heating passage between the heating chamber and the heating chamber; and supplying an inert gas or air from an external gas source to the outer and inner heating passages and the sub-heating passage. And a gas supply passage for supplying the heating gas and the shielding gas from the tip of the main nozzle and the tip of the sub nozzle toward the soldering portion.

This soldering iron can obtain the same effect as that of the first invention, and in addition, wraps the part of the main nozzle exposed to the outside with the shielding gas flow spouted from the sub-nozzle. , While preventing the main nozzle from being cooled by outside air, it can always be maintained at a high temperature,
The heating gas flow spouted from the main nozzle can also be wrapped in the shielding gas flow to prevent a temperature drop. Further, in the soldering portion, a large area of the circuit board can be preheated by the shielding gas flow, and there is an advantage that the temperature of the portion facing the main nozzle, that is, the temperature of the soldering spot can be maintained high.

In each of the above inventions, the heating chamber is preferably formed of a low metal having a thermal conductivity of less than 150 k / W · m ⁻¹ · K ⁻¹ at 300 ° C. An example of such a metal is stainless steel. Accordingly, the heating chamber does not significantly reduce the surface temperature of the heater because the heat absorption amount of the radiant heat from the heater is small. In addition, since the heating portion of the heater is covered with a heating chamber that is not heated to a high temperature due to low thermal conductivity when the inert gas is intermittently supplied while being continuously heated and driven, the outer peripheral portion is covered. In addition, the generated heat is effectively dissipated, and the heater disconnection due to overheating hardly occurs. Thereby, the intermittent soldering can be more easily performed.

In each of the above inventions, it is preferable that the heater is made of alumina ceramic.

Further, in each of the above-mentioned inventions, it is preferable that the heater is detachably connected to the grip via a connector, and the outer peripheral cover is detachably connected via a connecting member. This facilitates maintenance and replacement of the heater and the outer peripheral cover.

[0014]

Preferred embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a longitudinal sectional view showing a non-contact type soldering iron according to one embodiment of the present invention. The soldering iron has a nipple (holding member) 12 in which a rear end (upper end in the figure) of the outer peripheral cover 10 of the iron body 8 is fixed to a grip 11 of the iron support 9.
In addition, a structure is provided in which the lock nut 13 is detachably connected by fastening the lock nut 13.

The iron body 8 includes an outer peripheral cover 10, a solid rod (cylindrical) heater 14 made of alumina ceramic disposed at the center of the outer peripheral cover 10, and an outer peripheral surface of the heater 14 having a gap. And a heating chamber 17 arranged so as to cover the space. Heater 14
Has a plurality of inner heating passages 18 penetrating therethrough in the axial direction.
The inner heating passage 18 has a hole diameter of 0.3.
A heating gas flow G1 is generated by heating an inert gas which is as small as about 1.0 mm and passes through the inside. The heater 14 has two power supply pin terminals 20 projecting from the rear end thereof and connected by silver brazing 19.
One end (lower end) of the resin connector 21 fitted and fixed inside the nipple 12 is inserted into a two-piece tubular connector pin 22, so that the outer periphery can be detachably attached to the grip 11. It is held concentrically with the cover 10. The other end (upper end) of the connector pin 22 is connected to a power supply (not shown) via a heater lead wire 23 wound around and soldered thereto.

The heating chamber 17 is made of stainless steel having a small thickness and has a substantially cylindrical shape.
7 has a main nozzle 2 protruding from a front end (lower end in the figure).
4 are integrally formed. The main nozzle 24 is a divergent nozzle in which the diameter of the nozzle port 24a at the tip is enlarged. The heating chamber 17 is set to have a short length that covers almost only a half of the heater 14 on the front end side serving as the heating unit 14 a, and has a distance of 0.05 to 0.15 between the heater 14 and the outer peripheral surface of the heater 14.
The heater 14 is arranged concentrically with a small clearance of mm. The clearance forms an annular outer heating passage 27 for generating the heating gas flow G2. The outer peripheral cover 10 is configured such that the distal end portion of the heating chamber 17 is fitted into the distal end portion whose diameter is reduced.
Is fixedly supported, and a gas space 28 in which the front end is closed by the front end portion of the heating chamber 17 and the heating gas G3 is confined between the outer peripheral surface of the heating chamber 17 and heat is stored.
Is formed.

At the tip of the heating portion 14a of the heater 14, the gas temperature of the heating gas flow mixed with the heating gas flows G1 and G2 ejected from the inner and outer heating passages 18 and 27, respectively, is detected. The sensor 29 is mounted. The sensor 29 includes a wiring 30 inserted into the inside of the heater 14, a pair of thin lead terminals 31 attached to the heater 14 so as to protrude from a rear end thereof, and a connector pin 22 of the connector 21 through which the lead terminal 31 is inserted. The sensor is connected to a temperature controller (not shown) via a sensor lead wire 32 soldered to.

Since the grip 11 is connected to the outer peripheral cover 10 at a relatively low temperature via the nipple 12 and the lock nut 13 forming the iron support 9, the grip 11 is not strongly heated, so that the grip 11 is used for soldering. No problem occurs when the operator grips the device or mounts it on a robot hand of an automatic soldering device. The connector 21 is pressed via an O-ring 37 to a locking piece 38 projecting annularly from the inner peripheral surface of the nipple 12, and is airtightly attached to the nipple 12. On the other hand, the nipple 12 has an inner flange 39 projecting annularly from the inner peripheral surface of the distal end of the nipple 12 through an O-ring 40 to be airtightly fitted to the rear portion of the heater 14, that is, the outer peripheral surface of the non-heating portion. The rear portion of the heater 14 is held in a state where the internal spaces of the main body 8 and the iron support 9 are airtightly closed.

At the rear end of the gas supply pipe 33 inserted and fixed to the connector 21, a gas transport tube 34 to which an inert gas such as N ₂ (nitrogen gas) is supplied from a gas supply source (not shown). Are linked. A gas supply hole 41 having a diameter of 0.3 to 0.5 mm is formed in the inner flange 39 of the nipple 12. Therefore, the gas supply pipe 33 and the gas supply hole 41 form a gas supply passage for supplying the inert gas from the gas supply source to the inner and outer heating passages 18 and 27.

Next, the operation of the non-contact type soldering iron will be described. In this embodiment, the heater 14 is controlled so as to be heated until the surface temperature of the heating portion 14a rises to about 950 ° C. Gas supply pipe 3 from gas supply source
3 and an inert gas such as compressed nitrogen (0.05 MPa to 0.1 MPa) supplied through the gas supply hole 41 are fed into the small-diameter inner heating passage 18 as described above, so that the static pressure is increased. Since it flows inside the heating portion 14a where the temperature of the heater 14 is high, it is heated with a high thermal energy absorption efficiency and is jetted from the tip of the inner heating passage 18 as a high-temperature small flow rate heating gas flow G1.

On the other hand, through the gas supply hole 41, the heater 14
The inert gas that has flowed into the outer heating passage 27 between the outer peripheral surface of the outer cover 10 and the inner periphery of the outer peripheral cover 10 is heated while being in contact with the outer peripheral surface of the heater 14, and the heating gas flow ejected from the tip of the inner heating passage 18. Under the suction force of the ejector effect of G1, the heating gas flow G2 at a high temperature and a small flow rate is formed into the outer heating passage 2
7, and mixed with the heating gas flow G1 ejected from the tip of the inner heating passage 18 and ejected from the main nozzle 24 toward the soldering section 42. Here, the outer heating passage 27 is a narrow passage of 0.05 to 0.15 mm as described above.
The inert gas smoothly enters 7 and is ejected from the front end of the passage. In the soldering section 42, for example, after the cream solder 7 applied or printed with a predetermined thickness on the conductor pattern 44 of the circuit board 43 is melted by the heating gas flows G1 and G2, The solidification is performed by stopping the spraying, and for example, the lead terminals 48 of the electronic component 47 mounted on the cream solder 7 are soldered to the circuit board 43.

In the above-mentioned soldering iron, the heating unit 1 of the heater 14
4a, an inner heating passage 18 provided inside the heater 14 and an outer heating passage 27 provided between the outer peripheral surface of the heater 14 and the heating chamber 17, so that the contact area between the inert gas and the heater 14 is remarkably large. And the heat of the heater 14 can be transferred to the inert gas very efficiently. Therefore, unlike the conventional non-contact soldering irons, which increase the flow rate of the inert gas to increase the static pressure in order to increase the thermal efficiency, this soldering iron has a small static pressure and a small flow rate. Even a gas can be heated with high thermal efficiency, so that the heating gas flows G1 and G2 at a very high temperature and a small flow rate can be obtained. The heating gas flows G1, G2 are formed by the main nose 24
Is jetted at high speed from the nozzle port 24a of the main nozzle 2 which has a small flow rate and is a divergent nozzle.
By being diffused and slightly decelerated when ejected into the atmosphere from the nozzle opening 24a of No. 4, the cream solder 7 does not flow or the lead terminals 48 are displaced in a direction deviating from a predetermined position, so that there is no problem. Can be soldered.

Further, since the flow rate of the inert gas may be small, the passage areas of the inner and outer heating passages 18 and 27 can be correspondingly extremely reduced as described above. As the static pressure increases, the thermal conductivity from the heater 14 to the inert gas increases, which further increases the thermal efficiency. Further, the heating chamber 17 has a lower heat conductivity than copper (heat conductivity: about 400 k / W · m ⁻¹ · K ⁻¹ at 300 ° C.) and is thin (small heat capacity) stainless (heat capacity). Since the conductivity is about 19 k / W · m ⁻¹ · K ⁻¹ at 300 ° C., the amount of heat absorbed by the radiant heat from the heater 14 is small, and the surface temperature of the heater 14 is not significantly reduced. Further, a gas space 28 is formed between the outer peripheral surface of the heating chamber 17 and the inner peripheral surface of the outer cover 10,
The heat generated by the heater 14 is prevented from being dissipated to the outside. As a result, the surface temperature of the heater 14 can be always maintained at a substantially constant high temperature. The material of the heating chamber 17 has a thermal conductivity of 150 k / W · m ⁻¹ · K at 300 ° C.
⁻¹ (= brass) or less, preferably 50 k / W · m ⁻¹ · K ⁻¹ (= carbon steel) or less, more preferably 30 k / W · m ⁻¹ · K ⁻¹ (= silicon steel) or less .

As a result, the inert gas is more efficiently heated by the heater 14 and becomes the high-temperature gas flows G1 and G2. By the way, the measured values show that, with this soldering iron, when the surface temperature of the heater 14 is 950 ° C., the heating gas flows G1 and G1 having the temperature of 750 ° C. can be obtained. Therefore, the soldering work takes 0.5 seconds to
It can be performed in a very short time of 1.5 seconds. On the other hand, when the heating chamber 17 is made of copper having a high thermal conductivity, for example, copper, the heating chamber 17 having a large surface area absorbs the radiant heat of the heater 14 even if the surface temperature of the heater 14 is set to 950 ° C. The temperature of the resulting heating gas stream dropped to 460 ° C.

Since the heating portion 14a of the heater 14 is covered with a small clearance in the outer peripheral portion by the heating chamber 17 which is not heated to a high temperature due to its low thermal conductivity, it is continuously heated and driven. However, even when the inert gas is intermittently supplied, the heat generated by the heater 14 is effectively dissipated, and the disconnection of the heater 14 due to overheating hardly occurs. Moreover, since the heater 14 efficiently heats a small flow rate of the inert gas by utilizing both the inside and the outer peripheral surface, the heater 14 can heat the inert gas to reach the predetermined temperature in a very short time. According to actual measurements, nitrogen gas with a purity of 99.9% is applied at a pressure of 0.05 MPa to 0.1 MPa,
0.7 N l / min to 1.2 N l / min
When the heater 14 is driven at 100 V and an output power of 50 W and the diameter of the main nozzle 24 is 0.6 mm, the inert gas is raised from 0 ° to a predetermined temperature of 750 ° C. Was less than 2 seconds. Thus, the soldering iron can perform the intermittent soldering operation without any trouble, and does not adversely affect the electronic components around the electronic component 47 to be soldered.

Further, this soldering iron is of a non-contact type, and generally the tip nozzle opening of the main nozzle 24 is opposed to the cream solder 7 at an interval of 2 mm to 10 mm. Since the room-temperature air layer existing between the nozzle port 24a and the cream solder 7 functions as a heat blocking layer, the cream solder 7 and the electronic component can be used even when the soldering time is short by 0.5 to 1.5 seconds as described above. There is almost no rapid thermal effect on 47. In addition, the above-mentioned room temperature air layer performs the same function as the preheating portion in the reflow soldering device until the cream solder 7 reaches the melting temperature by spraying the heating gas flows G1 and G2, so that the solder ball or the like is used. Almost no scattering of flux, square shape of solder, occurrence of bridges, etc. occurs.

In the soldering iron, PID control of the heater power is performed by a temperature controller based on the detected temperatures of the heating gas flows G1 and G2 by the sensor 29. The pressure and the flow rate of the inert gas are adjusted based on the detected value, and the temperatures of the heating gas flows G1 and G2 are controlled so as to maintain a constant value suitable for the soldering conditions. This PID control can be performed very effectively because the temperatures of the heating gas flows G1 and G2 can be quickly raised as described above.

Further, since the heater 14 is removably connected to the grip 11 via the connector 21 and the outer peripheral cover 10 is connected to the grip 11 via the connecting member 13, respectively, the heater 14, the heating chamber 17 and the outer peripheral cover are connected. Maintenance and replacement of 10 are facilitated.

FIG. 2 is a longitudinal sectional view showing a non-contact type soldering iron according to another embodiment of the present invention.
The same or equivalent components as those described above are denoted by the same reference numerals, description thereof will be omitted, and only different configurations will be described. That is, the outer peripheral cover 10A is formed with an annular sub-nozzle 49 whose lower end is opened and is positioned so as to surround the outer periphery of the main nozzle 24. The inner peripheral surface of the outer peripheral cover 10A and the heating chamber 14 An annular sub-heating passage 50 is formed between the sub-nozzle 49 and the heating section 14a. Here, the inert gas smoothly enters not only the sub-heating passage 50 but also the narrow outer heating passage 27 due to the ejector effect of the gas flow G1, and the nozzle opening 24a of the main nozzle 24.
Squirted from.

A toothed washer 51 made of stainless steel is fitted and fixed between the inner peripheral surface near the distal end of the outer peripheral cover 10A and the outer peripheral surface near the distal end of the heating chamber 17. It is supported by the outer peripheral cover 10A via a toothed washer 51. The toothed washer 51 has an inner diameter of a plurality of (in this embodiment, eight) teeth 52 protruding inward as shown in FIG. 3 showing a cross-sectional view taken along the line III-II of FIG. By forcibly inserting the heating chamber 17 into this inner peripheral portion, only the end of the tooth portion 52 is pressed against the heating chamber 17 and heat transfer from the heating chamber 17 is performed. Installed in a suppressed state. Further, the shielding gas flow G4 is provided with the teeth 52 of the toothed washer 51,
It is ejected from the sub nozzle 49 through a space 53 between the nozzles 52.

Therefore, this soldering iron can obtain substantially the same effect as that of the soldering iron of FIG.
The main nozzle 24 is prevented from being cooled by the outside air by being wrapped in the shielding gas flow G4 ejected from the nozzle opening of the nozzle, and can always be kept at a high temperature, and the heating nozzle ejected from the main nozzle 24 The gas flows G1, G2 also
The temperature can be prevented from dropping by wrapping in the shielding gas flow G4. In the soldering section 42, the shielding gas flow G4
This has the advantage that a large area of the circuit board 43 can be preheated, and the temperature of the portion facing the main nozzle 24, that is, the temperature of the soldering spot, can be kept high.

Further, when oxidation of the soldered portion does not pose a problem, air may be used instead of the inert gas (N _{2 in} this example) shown in the above embodiments.

[0033]

As described above, according to the non-contact type soldering iron of the present invention, the inner heating passage is provided inside the heating portion of the heater and the outer heating passage is provided outside the heater. The contact area with the heater is significantly increased, and the heat generated by the heater can be extremely efficiently transferred to the heating gas.
Further, a gas space is formed between the outer peripheral surface of the heating chamber and the inner peripheral surface of the outer peripheral cover, so that heat generated by the heater can be prevented from being dissipated to the outside, so that the thermal efficiency is further increased. Therefore, even a small flow of inert gas having a low static pressure can be heated to a predetermined temperature in a short time with high thermal efficiency. In addition, the generated heating gas flow has a small flow rate, and is diffused and slightly decelerated when ejected from the main nozzle into the atmosphere, so that the cream solder can flow or the soldering member can be used. Since it is not displaced in a direction deviating from a predetermined position, soldering can be performed without any trouble. Furthermore, since the inert gas or air can be heated to reach the predetermined temperature in a very short time, intermittent soldering is also possible.

Further, a non-contact type soldering iron according to another invention has an annular sub-nozzle at the tip of an outer peripheral cover, which is located on the outer periphery of the main nozzle, and covers the outer periphery of the heating chamber to connect with the heating chamber. The main nozzle is cooled by the outside air by wrapping the part of the main nozzle exposed to the outside with the shielding gas flow ejected from the sub-nozzle because the shape of the shield gas flow is generated in the sub-heating passage between In addition, the temperature can be kept high at all times, and the heating gas flow jetted from the main nozzle can be wrapped in the shielding gas flow to prevent the temperature from dropping. Further, in the soldering portion, there is an advantage that a large area of the circuit board can be preheated by the shielding gas flow, and the temperature of the soldering spot facing the main nozzle can be kept high.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a non-contact type soldering iron according to one embodiment of the present invention.

FIG. 2 is a longitudinal sectional view showing a non-contact type soldering iron according to another embodiment of the present invention.

FIG. 3 is a sectional view taken along line III-III of FIG. 2;

FIG. 4 is a longitudinal sectional view showing a conventional non-contact soldering iron.

[Explanation of symbols]

10, 10A: outer peripheral cover, 11: grip, 12: nipple (holding member), 14: heater, 14a: heating unit,
17 ... heating chamber, 18 ... inner heating passage, 24 ... main nozzle, 27 ... outer heating passage, 28 ... gas space, 33 ...
Gas supply pipe (gas supply passage), 41: gas supply hole (gas supply passage), 42: soldering portion, 49: sub nozzle, 50
... sub-heating passage, G1, G2: heating gas flow, G4: shielding gas flow.

Claims (5)

[Claims] 1. A rod-shaped heater having an inner heating passage penetrating in the axial direction therein, and an outer heating passage having a main nozzle at an end thereof and an outer peripheral surface of a heating portion of the heater. A heating chamber that covers the heating section and generates a heating gas flow; and an outer peripheral cover that is closed at the tip and covers the outer periphery of the heating chamber with a gas space in which the heating gas exists between the heating chamber and the heating chamber. A gas supply passage for supplying an inert gas or air from an external gas source to the outer and inner heating passages and ejecting the same as the heating gas from the tip of the main nozzle toward the soldering portion. Non-contact soldering iron. 2. A rod-shaped heater having an inner heating passage penetrating in the axial direction therein, and an outer heating passage having a main nozzle at an end thereof and an outer peripheral surface of a heating portion of the heater. A heating chamber that covers a heating unit and generates a heating gas flow; and an annular sub-nozzle located at an outer periphery of the main nozzle at an end, and a sub-nozzle between the heating chamber that covers an outer periphery of the heating chamber. An outer peripheral cover for generating a shielding gas flow in the heating passage; an inert gas or air from an external gas source being supplied to the outer and inner heating passages and the sub-heating passage to provide a tip of the main nozzle and the sub-heating passage; A non-contact soldering iron including a gas supply passage for ejecting the heating gas and the shielding gas from the tip of the nozzle toward the soldering portion. 3. The heating chamber according to claim 1, wherein the heating chamber has a thermal conductivity of 150 k / W · m ⁻¹ · K at 300 ° C.
Non-contact soldering iron made of metal lower than ^-1 . 4. The non-contact soldering iron according to claim 1, wherein the heater is made of alumina ceramic. 5. The non-contact type soldering iron according to claim 1, wherein the heater is detachably connected to the grip via a connector, and the outer peripheral cover is connected via a connecting member. hand.