JP2006324598A5 - - Google Patents

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Publication number
JP2006324598A5
JP2006324598A5 JP2005148425A JP2005148425A JP2006324598A5 JP 2006324598 A5 JP2006324598 A5 JP 2006324598A5 JP 2005148425 A JP2005148425 A JP 2005148425A JP 2005148425 A JP2005148425 A JP 2005148425A JP 2006324598 A5 JP2006324598 A5 JP 2006324598A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005148425A
Other languages
Japanese (ja)
Other versions
JP4397349B2 (en
JP2006324598A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005148425A priority Critical patent/JP4397349B2/en
Priority claimed from JP2005148425A external-priority patent/JP4397349B2/en
Priority to TW095112349A priority patent/TW200735233A/en
Priority to KR1020060038587A priority patent/KR100741740B1/en
Publication of JP2006324598A publication Critical patent/JP2006324598A/en
Publication of JP2006324598A5 publication Critical patent/JP2006324598A5/ja
Application granted granted Critical
Publication of JP4397349B2 publication Critical patent/JP4397349B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2005148425A 2005-05-20 2005-05-20 Chip bonding equipment Active JP4397349B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005148425A JP4397349B2 (en) 2005-05-20 2005-05-20 Chip bonding equipment
TW095112349A TW200735233A (en) 2005-05-20 2006-04-07 Bonding device for chip
KR1020060038587A KR100741740B1 (en) 2005-05-20 2006-04-28 Chip bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005148425A JP4397349B2 (en) 2005-05-20 2005-05-20 Chip bonding equipment

Publications (3)

Publication Number Publication Date
JP2006324598A JP2006324598A (en) 2006-11-30
JP2006324598A5 true JP2006324598A5 (en) 2007-09-13
JP4397349B2 JP4397349B2 (en) 2010-01-13

Family

ID=37544022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005148425A Active JP4397349B2 (en) 2005-05-20 2005-05-20 Chip bonding equipment

Country Status (3)

Country Link
JP (1) JP4397349B2 (en)
KR (1) KR100741740B1 (en)
TW (1) TW200735233A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5468313B2 (en) * 2009-06-08 2014-04-09 Ｊｕｋｉ株式会社 Component mounting equipment
JP4897033B2 (en) * 2009-12-01 2012-03-14 キヤノンマシナリー株式会社 Semiconductor manufacturing equipment
JP2013026267A (en) * 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd Two-axis drive mechanism, die bonder and method for driving die bonder
JP2013026268A (en) * 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd Two-axis drive mechanism and die bonder
JP5705052B2 (en) * 2011-07-26 2015-04-22 株式会社新川 Die bonding equipment
JP5997448B2 (en) * 2012-01-31 2016-09-28 ファスフォードテクノロジ株式会社 Die bonder and bonding method
JP5941705B2 (en) * 2012-02-29 2016-06-29 ファスフォードテクノロジ株式会社 2-axis drive mechanism and die bonder
TWI734434B (en) * 2019-04-11 2021-07-21 日商新川股份有限公司 Joining device
TWI784622B (en) * 2020-08-12 2022-11-21 日商捷進科技有限公司 Die bonding device and method for manufacturing semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH691719A5 (en) 1997-04-11 2001-09-14 Etel Sa XY table for moving a load, such as a tool, in two perpendicular directions.

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