JP2006324408A - Light emitting diode element with lens, light emitting device, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting diode element with a lens which copes with a demand in recent years for an improvement in brightness and an enhancement in output power. <P>SOLUTION: A light emitting diode element 2 with a lens is equipped with a light emitting diode element 4 provided with a light extracting plane 7A covered with a lens 5. The lens 5 is equipped with an optically shaped plane 5A. The plane includes a first light projecting plane 5a directed to a lighting target side, and a second light projecting plane 5b swelling out in the direction of a virtual plane located on a side opposite to the lighting target side of the first light projecting plane 5a, and kept in parallel with the light extracting plane 7A. The lens 5 thereby condenses enough light, and the light emitting device is improved in light extraction efficiency. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting diode element with a lens formed by covering a light extraction surface with a lens, a light emitting device, and a method for manufacturing the same.

  In recent years, light emitting devices have been designed to eliminate adverse effects of mercury gas on the environment (human body), prevent deterioration of components due to ultraviolet light irradiation, reduce power consumption costs, and achieve good color reproduction. From the standpoint of obtaining high performance, a light emitting diode (LED) element is employed instead of a cold cathode fluorescent tube containing mercury gas.

For example, a light emitting diode element in this kind of light emitting device includes a sapphire (Al ₂ O ₃ ) substrate having a light emitting layer as a light emitting portion and a light extraction surface for emitting light from the light emitting layer, and is made of a sapphire substrate. A device that is flip-mounted on an element mounting substrate is known.

  In such a light emitting diode element, when the light emitting layer emits light, this light is transmitted through the sapphire substrate and emitted to the outside from the light extraction surface.

  However, since this type of light emitting diode element has different refractive indexes and planar shapes of the layers (sapphire substrate, light emitting layer), so-called Fresnel loss occurs due to total reflection at the interface of each layer, and the light extraction efficiency is lowered. There is an inconvenience of doing.

  Therefore, in order to avoid the above-described disadvantages, a light-emitting diode element with a lens formed by covering the light extraction surface of a sapphire substrate with a lens is also used.

Conventionally, a light emitting diode element with a lens of this type has been proposed that includes a semiconductor light emitting element chip having a light exit window and a microlens laminated on the semiconductor light emitting element chip via a buffer layer (for example, a patent). Reference 1).
Japanese Patent Laid-Open No. 6-151972

  However, according to Patent Document 1, the lens (microlens) that covers the light extraction surface (buffer layer) of the semiconductor light-emitting element chip is formed by melting and hardening the lens base material on the buffer layer. A microlens having a lens thickness larger than the lens height (thickness) of the spherical lens cannot be formed on the buffer layer. As a result, there is a problem that sufficient light condensing performance by the lens cannot be obtained, the light extraction efficiency is deteriorated, and it is impossible to respond to the recent increase in luminance and output.

  Therefore, the present inventor has started to study increasing the lens thickness (increasing the lens thickness), but in the process, a liquid lens material is dropped on the light extraction surface to form a spherical lens. As a result, it is possible to increase the lens height (dimension in the normal direction of the light extraction surface), and further, the higher the lens height, the greater the on-axis luminous intensity improvement rate of the light-emitting diode element. It was.

  Accordingly, an object of the present invention is to provide a light-emitting diode element with a lens, a light-emitting device, and a method for manufacturing the same, which can increase the light extraction efficiency and can respond to the recent increase in luminance and output. .

(1) In order to achieve the above object, the present invention is a light-emitting diode element with a lens including a light-emitting diode element having a light extraction surface covered with a lens, and the lens is provided with a side to be illuminated. An optical shape surface including a first light emitting surface that is directed and a second light emitting surface that bulges in a virtual plane direction parallel to the light extraction surface on a side opposite to the illumination target of the first light emitting surface is provided. A lens-equipped light-emitting diode device is provided.

(2) To achieve the above object, the present invention provides a case that opens to the illumination target side, an element mounting substrate that is fixed to the case and has an element mounting portion, and is mounted on the element mounting portion, A light-emitting device comprising: a light-emitting diode element having a light extraction surface covered with a light-emitting diode element; and a sealing member for sealing the light-emitting diode element in the case, wherein the lens is described in (1) above. Provided is a light-emitting device characterized by being a lens.

(3) In order to achieve the above object, the present invention is a method of manufacturing a light-emitting diode element with a lens including a light-emitting diode element having a light extraction surface covered with a lens, A step of forming the lens by dropping a liquid lens material, and in forming the lens, the first light exit surface directed toward the illumination target side and the anti-illumination target side of the first light exit surface; Provided is a method for manufacturing a lens-equipped light-emitting diode element, wherein an optically shaped surface including a second light emitting surface that bulges in a virtual plane direction parallel to a light extraction surface is provided on the lens material.

(4) In order to achieve the above object, the present invention provides a case that opens to the illumination target side, an element mounting substrate that is fixed to the case and has an element mounting portion, and is mounted on the element mounting portion, A light emitting diode element having a light extraction surface coated with a light emitting surface, and a sealing member for sealing the light emitting diode element in the case, the method comprising: Forming a lens by dropping a liquid lens material on a light extraction surface of the light emitting diode element mounted on the light emitting diode, and sealing the light emitting diode element with a lens with a sealing member in the case. And in forming the lens, the first light exit surface directed toward the illumination target side and the opposite side of the first light exit surface swell in a virtual plane direction parallel to the light extraction surface. The optical shape surface including the second light emitting surface to provide a method of manufacturing a light emitting device, characterized in that provided on the lens material.

  According to the present invention, the light extraction efficiency can be increased, and it is possible to meet the recent increase in luminance and output.

[First embodiment]
FIG. 1 is a cross-sectional view for explaining a light emitting device according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view for explaining the lens-equipped light-emitting diode element of the light-emitting device according to the first embodiment of the present invention.

[Overall configuration of light emitting device]
In FIG. 1, the light emitting device denoted by reference numeral 1 is roughly configured by a light emitting diode element 2 with a lens as a light source and a case 3 that can accommodate the light emitting diode element 2 with a lens.

(Configuration of light-emitting diode element 2 with lens)
As shown in FIG. 1, the light-emitting diode element 2 with a lens covers a flip-chip type light-emitting diode element 4 made of a nitride compound semiconductor material and a light extraction surface 7A (described later) of the light-emitting diode element 4. And a lens 5 made of transparent silicone and mounted on an element mounting substrate 6 (sub-element mounting substrate).

<Configuration of Light-Emitting Diode Element 4>
As shown in FIG. 2, the light-emitting diode element 4 is composed of a blue LED element for high output having contact electrodes 4A and 4B, and is buffered on a sapphire (Al ₂ O ₃ ) substrate 7 having a light extraction surface 7A. The AlN layer 8, the n-type semiconductor (GaN) layer 9, the light emitting layer 10, and the p-type semiconductor (GaN) layer 11 are formed by sequentially growing crystals. The contact electrode 4A is made of rhodium (Rh) and is disposed on the surface of the p-type semiconductor layer 11. The contact electrode 4B is made of aluminum (Al) and is disposed on the externally exposed surface of the n-type semiconductor layer 9. The plane vertical and horizontal dimensions of the light emitting diode element 4 are set to a plane size (square size) in which the vertical dimension and the horizontal dimension are each 1 mm. The thermal expansion coefficient α of the light emitting diode element 4 is set to α = 7 × 10 ⁻⁶ / ° C.

<Configuration of lens 5>
As shown in FIG. 2, the lens 5 is formed of a convex lens made of silicone having a lens height H larger than the plane vertical and horizontal dimensions of the light extraction surface 7A (the dimension of each side is 1 mm). The lens 5 includes a first light emitting surface 5a that is directed toward the illumination target side and a second light emitting surface that bulges in a virtual plane direction parallel to the light extraction surface 7A on the opposite side of the first light emitting surface 5a. An optically shaped surface 5A including 5b is provided. As a material of the lens 5, an epoxy coating resin (potting resin) can be used in addition to silicone. Further, in order to make it easy to extract the light emitted from the light emitting diode element 4 from the sapphire substrate 7 to the lens 5, the material of the lens 5 is a refractive index close to n = 1.7, which is the refractive index of the sapphire substrate 7. It is preferable to select a material of 4 to 2.0.

<Configuration of element mounting substrate 6>
As shown in FIG. 1, the element mounting substrate 6 includes two main and sub element mounting substrates 6A and 6B, and is configured to mount the light emitting diode element 2 with a lens as described above. The main element mounting substrate 6A constitutes a part (bottom surface portion) of the case 3 and is formed of a ceramic (Al ₂ O ₃ ) substrate having circuit patterns 600 and 601. The sub element mounting substrate (submount) 6B has an element mounting surface 6b parallel to the light extraction surface 7A, and is mounted on the main element mounting substrate 6A. Then, as in the main element mounting substrate 6A, ceramics (Al ₂ O ₃₎ is formed by the substrate. The sub-element mounting machine 6B is formed with circuit patterns 602 and 603 connected to the circuit patterns 600 and 601 via bonding wires 12 such as gold (Au), respectively. The semiconductor diode element 4 is mounted on the circuit patterns 602 and 603 via stud bumps 13 and 14 such as gold (Au). The thermal expansion coefficient α of the element mounting board 6 (the main element mounting board 6A and the sub element mounting board 6B) is set to α = 7 × 10 ⁻⁶ / ° C.

(Case 3 configuration)
The case 3 is a frame member that opens to the illumination target side and the counter-illumination target side. The main element mounting board 6A that closes the counter-illumination target side opening of the frame member is fixed, and the whole opens to the illumination target side. It is formed by a bottomed cylinder. Further, the case 3 is formed with a frustoconical internal space 3a extending from the anti-illumination target side toward the illumination target side. The inner surface of the case 3 is formed by an inclined surface 3b that receives the radiated light from the light emitting diode element 4 and reflects it to the illumination target side. As the material of the case 3, for example, nylon having good moldability is used. In the internal space 3 a of the case 3, a phosphor such as YAG (Yttrium Aluminum Garnet) that emits wavelength-converted light (yellow light) when excited by receiving light (blue light) from the light-emitting diode element 4. A sealing member 15 made of silicone is contained. As a result, the light emitting diode element 4 and the sub-element mounting substrate 6 </ b> B / bonding wire 12 are sealed in the case 3.

  In the present embodiment, the case 3 and the main element mounting substrate 6 </ b> A are described as separate members. However, the present invention is not limited to this, and the members may be formed integrally.

[Operation of Light Emitting Device 1]
When a voltage is applied to the light emitting diode element 4 from the power source, the light emitting layer 10 emits light, and this light is emitted into the lens 5. Next, the emitted light passes through the lens 5 and enters the phosphor-containing sealing member 15. In this case, the sealing member 15 emits yellow wavelength-converted light by being excited by receiving radiated light (blue light) radiated from the light emitting diode element 4. For this reason, the blue radiation light emitted from the light emitting diode element 4 and the yellow wavelength conversion light emitted from the sealing member 15 are mixed to form white light. After that, the illumination target side is irradiated as white light from the exit surface of the sealing member 15.

  Next, a method for manufacturing the light emitting device according to the first embodiment will be described with reference to FIGS.

  FIGS. 3A to 3E are cross-sectional views for explaining the method for manufacturing the light emitting device according to the first embodiment. 3A shows a process for forming an element mounting substrate, FIG. 3B shows a process for mounting a light emitting diode element, FIG. 3C shows a process for forming a case, and FIG. 3D shows a process for forming a lens. FIG. 3E is a cross-sectional view for explaining the sealing process of the light-emitting diode element with a lens.

  The manufacturing method of the light-emitting device shown in this embodiment includes “formation of an element mounting substrate” and “mounting of a light-emitting diode element”, “formation of a case”, “formation of a lens”, “sealing of a light-emitting diode element with a lens” Since each process of "is performed sequentially, each of these processes is demonstrated sequentially.

"Formation of element mounting substrate (main element mounting substrate)"
First, a screen printing process using paste-like tungsten (W) corresponding to the circuit patterns 600 and 601 is performed on the front surface, back surface, and side surfaces of the ceramic (Al ₂ O ₃ ) substrate.

  Next, paste-like tungsten is baked by performing a heat treatment on the ceramic substrate that has been subjected to the screen printing process, and further, a gold (Au) plating process is performed on the baked tungsten (circuit patterns 600 and 601). In this case, when a gold plating process is performed on tungsten, a main element mounting substrate 6A is formed as shown in FIG.

"Mounting light-emitting diode elements"
The circuit patterns 602 and 603 of the sub-element mounting substrate 6B on which the light-emitting diode elements 4 are previously mounted via the stud bumps 13 and 14 are soldered to the circuit patterns 600 and 601 (element mounting portions) of the main element mounting substrate 6A, respectively. Join by.

  Next, the circuit patterns 600 and 601 of the main element mounting board 6A and the circuit patterns 602 and 603 of the sub element mounting board 6B are connected by the bonding wires 12. In this case, when the circuit patterns 600 and 601 are connected to the circuit patterns 602 and 603, the light emitting diode element 4 is placed on the main element mounting board 6A via the sub element mounting board 6B as shown in FIG. Implemented.

"Case formation"
The case 3 is pasted with an adhesive on the element mounting side of the main element mounting board 6A at a position where the light emitting diode element 4, the sub element mounting board 6B, and the bonding wire 12 are housed inside. In this case, when the case 3 is affixed on the main element mounting substrate 6A, the case 3 and the main element mounting substrate 6A are integrated as shown in FIG.

"Lens formation"
A predetermined amount of lens material (liquid silicone having a predetermined viscosity) is dropped onto the light extraction surface 7A of the light emitting diode element 4 from the needle-shaped nozzle N (shown in FIG. 3D). In this case, when the lens material is dropped on the light extraction surface 7A, the lens material on the light extraction surface 7A is formed into a spherical lens intermediate body having a predetermined lens height by the surface tension. In this case, the lens intermediate body includes a first light emitting surface 5a directed to the illumination target side and a first surface that bulges in a virtual plane direction parallel to the light extraction surface 7A on the opposite side of the first light emitting surface 5a. A curvature surface serving as the optical shape surface 5A including the two light emission surfaces 5b is provided.

  Next, heat treatment (thermosetting treatment) is performed on the lens intermediate. In this case, when the lens intermediate is thermally cured, the first light exit surface has a lens height H (H> 0.5 mm) set to a dimension larger than ½ of the plane vertical and horizontal dimensions of the light extraction surface 7A. A lens 5 having an optical shape surface 5A including 5a and the second light exit surface 5b is formed on the light extraction surface 7A. As a result, as shown in FIG. 3D, the lens-equipped light-emitting diode element 2 including the light-emitting diode element 4 having the light extraction surface 7 </ b> A covered with the lens 5 is formed in the case 3.

"Encapsulation of light emitting diode element with lens"
A liquid resin for sealing (silicone containing a phosphor such as YAG) is injected into the internal space 3 a in the case 3.

Next, the liquid resin in the case 3 is subjected to a heat treatment (thermosetting process), thereby filling the case 3 with the sealing member 15. In this case, when the sealing member 15 is filled in the case 3, the light emitting diode element 2 with lens, the bonding wire 12, and the sub-element mounting substrate 6 </ b> B are sealed by the sealing member 15 as shown in FIG. Is done.
In this manner, the light emitting device 1 including the light emitting diode element 2 with a lens can be manufactured.

  In the present embodiment, the sealing member 15 contains a phosphor that emits yellow wavelength-converted light when excited by receiving radiation light (blue light) emitted from the light-emitting diode element 4. Although the case has been described, the present invention is not limited to this, and the light emitting diode element is a light emitting diode element that emits violet light (wavelength 370 to 390 nm), and is excited by receiving radiation emitted from this light emitting diode element. The sealing member containing the fluorescent substance which radiates | emits white wavelength conversion light by doing may be sufficient.

  In the first embodiment, the sealing member containing the phosphor is described. However, the sealing member may be sealed with a sealing member not containing the phosphor. Furthermore, the light emitting diode element 4 is not limited to one that emits blue light. Other visible light (370 to 700 nm) may be emitted. In the first embodiment, the square type light emitting diode element 4 having a vertical dimension and a horizontal dimension of 1 mm is used. However, the present invention is not limited to this, and square type light emitting elements of other vertical dimensions and horizontal dimensions are used. The present invention can also be applied to the diode element 4, and can also be applied to a rectangular light emitting diode element 4 having a different vertical dimension and horizontal dimension.

[Effect of the first embodiment]
According to the first embodiment described above, the following effects can be obtained.

(1) The lens 5 that covers the light extraction surface 7A of the light emitting diode element 4 includes a first light emission surface 5a that is directed toward the illumination target side, and a light extraction surface 7A that is opposite to the illumination target side of the first light emission surface 5a. Since the optical shape surface 5A including the second light emitting surface 5b bulging in the direction of the virtual plane parallel to the lens is provided, the lens height (thickness) larger than the lens height (radius) of the hemispherical spherical lens The lens 5 having H can be formed on the light extraction surface 7A. Thereby, since sufficient light condensing property by the lens 5 can be obtained, the light extraction efficiency can be increased, and it is possible to meet the recent increase in luminance and output.

(2) Since the inner surface of the case 3 is formed by the inclined surface 3b that receives the radiated light from the light emitting diode element 4 and reflects it toward the illumination target side, the radiated light from the light emitting diode element 4 is reflected by the inclined surface 3b. Further, the light extraction efficiency in the case of obtaining a circular planar light source that is emitted as white light from the emission surface of the sealing member 15 toward the illumination target side can be enhanced.

(3) Since the forming process of the lens 5 and the sealing process of the light emitting diode element 2 with the lens can be performed in the same process, the number of processes can be reduced, and the manufacturing cost can be reduced. .

(4) Since the material of the lens 5 is made of silicone, the durability can be increased as compared with, for example, an epoxy resin, and the lens 5 can be used for a long period of time.

(5) Since the sub-element mounting substrate 6B having the element mounting surface 6b parallel to the light extraction surface 7A is disposed on the electrode side of the light-emitting diode element 4, the light-emitting diode element with a lens with respect to the main element mounting substrate 6A 2 can be smoothly positioned, and the mounting efficiency of the lens-equipped light-emitting diode element 2 can be increased.

(6) Since the planar shape of the light extraction surface 7A is a square having a dimension of 1 mm on one side, a large amount of illumination light can be obtained, and the light extraction surface 7A is applied to a lighting device for high luminance and high output. Can do.

  Next, the lens height H (shown in FIG. 4A) of the lens 5 in the present embodiment (light-emitting diode element 2 with lens) will be considered.

(1) A plurality of light emitting diode elements 4 are prepared, and a predetermined amount of lens material (liquid silicone having a predetermined viscosity) is dropped on the light extraction surface 7A of each of the light emitting diode elements 4 and thermally cured. Each of the light extraction surfaces 7A is composed of a plurality of lenses 5 (refractive index n1 = 1.4) in which each lens height H (dimension in the normal direction of the light extraction surface) is set to a different size (H = 0 to 1100 μm). A plurality of light emitting diode elements 2 with a lens is formed, and the on-axis luminous intensity improvement rate of each of the light emitting diode elements 2 with a lens <(on-axis luminous intensity of the light emitting diode element with lens−on the axis of the lensless light emitting diode element) Luminous intensity) × 100% / On-axis luminous intensity of lensless light emitting diode element> was measured. From this, it was confirmed that the higher the lens height (dimension in the normal direction of the light extraction surface) H, the higher the on-axis luminous intensity improvement rate. In particular, when the lens height H is larger than H = 1000 μm, the on-axis luminous intensity improvement rate is significantly increased.

(2) A plurality of light emitting diode elements 4 are prepared in the same manner as in (1) above, and a lens material (silicone) having a composition different from that of the lens material in (1) is dropped onto the light extraction surface 7A of each light emitting diode element 4. Each light extraction surface 7A is covered with a plurality of lenses 5 (refractive index n2 = 1.5) having different lens heights H (H = 0 to 1100 μm) and light emission with a plurality of lenses. When the diode element 2 was formed and the on-axis luminous intensity improvement rate of each light-emitting diode element 2 with a lens was measured in the same manner as in the above (1), a measurement result substantially similar to the measurement result in the above (1) was obtained. That is, when the lens height H is 300 μm, a constant on-axis luminous intensity improvement rate is obtained. Furthermore, when the thickness is increased to 1000 μm or more, the temperature increases significantly. Therefore, the lens height H is preferably 300 μm and 1200 μm or less, and more preferably 1000 μm or more and 1200 μm or less. In the present embodiment, considering that the light emitting diode element 4 has a side of 1 mm, the ratio of the lens height to one side of the light emitting diode element 4 is preferably 0.3 or more and 1.2 or less. More preferably, it is 1.0 or more and 1.2 or less.

  Therefore, in order to increase the on-axis luminous intensity improvement rate, the lens height H should be increased regardless of the material of the lens material. This is shown by the graph in FIG. 4B (the measurement result for the lens 5 having a refractive index n1 = 1.4 is a solid line, and the measurement result for the lens 5 having a refractive index n2 = 1.5 is a one-dot chain line. Respectively).

[Second Embodiment]
FIG. 5 is a cross-sectional view for explaining a light emitting device (only a light emitting diode element with a lens is shown in FIG. 5) according to a second embodiment of the present invention. 5, the same members as those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 5, the lens-equipped light-emitting diode element 51 shown in the second embodiment is characterized in that a light diffusing material (silica) is contained in the lens 52.

  Therefore, when forming the lens 52, it is necessary to drop a predetermined amount of lens material (liquid silicone having a predetermined viscosity) containing a light diffusing material onto the light extraction surface 7A of the light emitting diode element 4.

  In addition, about the other structure of the light-emitting device (not shown) provided with the light emitting diode element 51 with a lens in 2nd Embodiment, it is the same as that of the structure of the light-emitting device 1 in 1st Embodiment.

[Effect of the second embodiment]
According to the second embodiment described above, the following effects can be obtained in addition to the effects (1) to (6) of the first embodiment.

  Since the lens 52 of the lens-equipped light-emitting diode element 51 contains a light diffusing material, the blue radiation emitted from the light-emitting diode element 4 and the yellow radiation emitted from the sealing member 15 (shown in FIG. 1). A uniform mixed state with wavelength-converted light can be obtained, and good white light can be irradiated on the illumination target side.

[Third embodiment]
FIG. 6 is a cross-sectional view for explaining a light emitting device according to the third embodiment of the present invention. 6, the same members as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 6, in the light emitting device 61 shown in the third embodiment, the sealing member 15 does not contain a phosphor, and the lens 62 has a phosphor (blue emitted light emitted from the light emitting diode element 4). It is characterized in that it includes a light-emitting diode element 63 with a lens containing a phosphor that emits yellow wavelength-converted light when excited by light.

  Therefore, when forming the lens 62, it is necessary to drop a predetermined amount of lens material (liquid silicone having a predetermined viscosity) containing phosphor (YAG) onto the light extraction surface 7A of the light emitting diode element 4. .

[Effect of the third embodiment]
According to the third embodiment described above, the following effects can be obtained in addition to the effects (1) to (6) of the first embodiment.

  Since the sealing member 15 does not contain a phosphor, the amount of phosphor used can be reduced when the internal volume of the case 3 is larger than the volume of the lens 5, which also reduces the manufacturing cost. Can be planned.

It is sectional drawing shown in order to demonstrate the light-emitting device which concerns on the 1st Embodiment of this invention. It is sectional drawing shown in order to demonstrate the light emitting diode element with a lens of the light-emitting device which concerns on the 1st Embodiment of this invention. (A)-(e) is sectional drawing shown in order to demonstrate the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a graph which shows the relationship between the lens height of a light emitting diode element with a lens, and its axial luminous intensity improvement rate. It is sectional drawing shown in order to demonstrate the light-emitting device (light emitting diode element with a lens) which concerns on 2nd Embodiment of this invention. It is sectional drawing shown in order to demonstrate the light-emitting device which concerns on 3rd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,61 ... Light-emitting device, 2,51,63 ... Light-emitting diode element with a lens, 3 ... Case, 3a ... Internal space, 3b ... Inclined surface, 4 ... Light-emitting diode element, 4A, 4B ... Contact electrode, 5,52, 62 ... lens, 5A ... optical shape surface, 5a ... first light emitting surface, 5b ... second light emitting surface, 6 ... element mounting substrate, 6A ... main element mounting surface, 600, 601 ... circuit pattern, 6B ... subelement Mounting substrate, 602, 603 ... circuit pattern, 7 ... sapphire substrate, 7A ... light extraction surface, 8 ... buffer layer, 9 ... n-type semiconductor layer, 10 ... light emitting layer, 11 ... p-type semiconductor layer, 12 ... bonding wire, 13, 14 ... Stud bump, 15 ... Sealing member, H ... Lens height

Claims (9)

A light-emitting diode element with a lens including a light-emitting diode element having a light extraction surface covered with a lens,
The lens includes a first light exit surface directed toward the illumination target side and a second light exit surface that bulges in a virtual plane direction parallel to the light extraction surface on the side opposite to the illumination target side of the first light exit surface. A light-emitting diode element with a lens, wherein an optically shaped surface is provided.   The light-emitting diode element with a lens according to claim 1, wherein the lens is formed of a coating resin made of silicone.   The circuit board mounted on a main element mounting board | substrate, Comprising: The subelement mounting board | substrate which has an element mounting surface parallel to the said optical extraction surface is arrange | positioned at the electrode side of the said light emitting diode element. The light emitting diode element with a lens of 2.   The lens-equipped light emitting device according to any one of claims 1 to 3, wherein the lens contains a phosphor that emits wavelength-converted light when excited by receiving radiation emitted from the light-emitting diode element. Diode element.   The light-emitting diode element with a lens according to claim 1, wherein the lens contains a light diffusing material. A case that opens to the illumination target side;
An element mounting substrate fixed to the case and having an element mounting portion;
A light emitting diode element mounted on the element mounting portion and having a light extraction surface covered with a lens;
A light emitting device including a sealing member for sealing the light emitting diode element in the case,
The said lens is a lens in any one of Claims 1-5, The light-emitting device characterized by the above-mentioned.   The light emitting device according to claim 6, wherein an inner surface of the case is formed by an inclined surface that receives radiation light from the light emitting diode element and reflects the light toward an illumination target side. A method for producing a light-emitting diode element with a lens comprising a light-emitting diode element having a light extraction surface covered with a lens,
Comprising the step of forming the lens by dropping a liquid lens material onto the light extraction surface;
In forming the lens, a first light exit surface directed toward the illumination target side and a second light exit surface bulging in a virtual plane direction parallel to the light extraction surface on the side opposite to the illumination target side of the first light exit surface A method for manufacturing a light-emitting diode element with a lens, comprising providing the lens material with an optically shaped surface. A case that opens to the illumination target side;
An element mounting substrate fixed to the case and having an element mounting portion;
A light emitting diode element mounted on the element mounting portion and having a light extraction surface covered with a lens;
A method of manufacturing a light emitting device comprising a sealing member for sealing the light emitting diode element in the case,
Forming the lens by dropping a liquid lens material on the light extraction surface of the light emitting diode element mounted on the element mounting portion in advance;
A step of sealing the light emitting diode element with a lens by a sealing member in the case,
In forming the lens, a first light exit surface directed toward the illumination target side and a second light exit surface bulging in a virtual plane direction parallel to the light extraction surface on the side opposite to the illumination target side of the first light exit surface A method for manufacturing a light emitting device, comprising: providing an optically shaped surface including:

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