JP2006324336A - Heat treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat treatment apparatus where a whole face of a substrate can efficiently be heated to a sufficiently uniform temperature. <P>SOLUTION: The heat treatment apparatus is provided with: a chamber 10 having an opening part 13 for substrate W passage; a heating plate 21 which is arranged in the chamber 10 and in which the substrate W is placed on an upper part; and an opening/closing door 30 where the opening part 13 in the chamber 10 can be opened/closed/moved. The chamber 10 is provided with an outer layer 12 and an inner layer 11 covering a whole region of an inner peripheral face of the outer layer 12. A whole region of an inner face of the inner layer 11 is heat-reflected. The opening/closing door 30 is provided with an opening/closing door outer layer 32 and an opening/closing inner layer 31 covering a face facing an inner part of the chamber 10 in the opening/closing door outer layer 32. The face facing the inner part of the chamber 10 in the opening/closing door inner layer 31 is heat-reflected. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a heat treatment apparatus that heats and processes a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, or a mask substrate for a semiconductor manufacturing apparatus using a heat treatment plate.

As such a heat treatment apparatus, Patent Document 1 discloses an apparatus that includes a heating plate and a frame body that is arranged so that an inner surface that has undergone a mirror-finishing process faces the side surface of the substrate. According to the apparatus described in Patent Document 1, since the structure surrounds the periphery of the substrate with a frame, it is possible to prevent a temperature drop from the substrate side surface while preventing particles from adhering to the substrate. The in-plane uniformity of the substrate temperature can be improved.
JP 2004-247345 A

  However, in the apparatus described in Patent Document 1, since the frame body faces only the side surface of the substrate, it is difficult to set the entire surface of the substrate to a sufficiently uniform temperature.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a heat treatment apparatus capable of efficiently heat-treating the entire substrate surface to a sufficiently uniform temperature.

  The invention according to claim 1 is a heat treatment apparatus including a chamber having an opening for passing a substrate and a substrate holding means for holding the substrate in the chamber. It is characterized by that.

  The invention according to claim 2 is a heat treatment apparatus including a chamber having an opening for passing a substrate and a substrate holding means for holding the substrate in the chamber, wherein the chamber is an inner side made of a heat-permeable material. And an outer layer having an inner peripheral surface that is heat-reflected over the entire outer peripheral surface of the inner layer.

  According to a third aspect of the present invention, in the heat treatment apparatus according to the first or second aspect, the substrate holding means includes a heating plate disposed in the chamber and mounting a substrate thereon.

  According to a fourth aspect of the present invention, in the heat treatment apparatus according to any one of the first to third aspects of the present invention, a gap between a closed position for closing the opening in the chamber and a release position for opening the opening is provided. A movable opening / closing door is further provided.

  According to a fifth aspect of the present invention, in the heat treatment apparatus according to the fourth aspect, the open / close door is heat-reflected on a surface of the open / close door facing the chamber.

  A sixth aspect of the present invention is the heat treatment apparatus according to the fourth aspect, wherein the open / close door includes an open / close door inner layer made of a heat-permeable material, and an entire area of the open / close door opposite to the surface facing the chamber. And an open / close door outer layer having an inner peripheral surface subjected to heat reflection treatment.

  According to a seventh aspect of the present invention, in the heat treatment apparatus according to any one of the first to sixth aspects, the heat reflection treatment is performed such that the heat reflectance is 95% or more.

  According to an eighth aspect of the present invention, in the heat treatment apparatus according to the seventh aspect, the heat reflection process is a mirror surface process.

  According to a ninth aspect of the present invention, in the heat treatment apparatus according to any one of the third to eighth aspects, the heating plate is made of a heat permeable material.

  According to a tenth aspect of the present invention, in the heat treatment apparatus according to the ninth aspect, a linear heating means is disposed on the side surface of the heating plate opposite to the substrate mounting surface.

  According to the first aspect of the present invention, since the chamber having the substrate passage opening and the entire inner surface of the chamber are subjected to the heat reflection treatment, it is possible to prevent heat from being released to the outside of the chamber. . This makes it possible to efficiently heat the entire surface of the substrate to a sufficiently uniform temperature.

  According to the second aspect of the invention, the chamber includes an inner layer made of a heat-permeable material and an outer layer having an inner peripheral surface that is heat-reflected with respect to the entire outer peripheral surface of the inner layer. Heat can be prevented from being released outside the chamber. This makes it possible to efficiently heat the entire surface of the substrate to a sufficiently uniform temperature.

  According to the third aspect of the present invention, the substrate holding means includes the heating plate that is disposed in the chamber and places the substrate on the upper portion thereof, so that the substrate can be held with a simple configuration. It becomes possible.

  According to invention of Claim 4 thru | or 6, since it further has an opening-and-closing door which can move between the closed position which closes the opening part in a chamber, and the open position which opens the said opening part, a chamber It is possible to further prevent heat from being released to the outside.

  According to the invention described in claim 7, since the heat reflection process is performed so that the heat reflectivity becomes 95% or more, the consumption of heat energy by absorbing heat in the chamber or the door itself is reduced. In addition, it is possible to efficiently heat the entire surface of the substrate to a sufficiently uniform temperature.

  According to the invention described in claim 8, since the heat reflection process is a mirror surface process, it is possible to efficiently heat the entire surface of the substrate to a sufficiently uniform temperature while having a simple configuration.

  According to the ninth aspect of the present invention, since the heating plate is made of a heat-permeable material, it is possible to perform heat treatment on the lower surface of the substrate to a sufficiently uniform temperature.

  According to the invention described in claim 10, since the linear heating means is disposed on the side surface opposite to the substrate mounting surface of the heating plate, the heat dissipated from the linear heating means is heated. It becomes possible to reach the substrate without being cut off by itself.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic plan view showing a heat treatment apparatus according to the first embodiment of the present invention, and FIGS. 2 and 3 are schematic side views thereof.

  The heat treatment apparatus according to the first embodiment includes a chamber 10 having an opening 13 for passing a substrate W, and a heating plate 21 that is disposed in the chamber 10 and places the substrate W thereon. The chamber 10 includes an outer layer 12 and an inner layer 11 that covers the entire inner peripheral surface of the outer layer 12. The inner layer 11 is heat-reflected on the entire inner surface. For this reason, it is possible to prevent heat from being released outside the chamber 10. This makes it possible to efficiently heat the entire surface of the substrate W to a sufficiently uniform temperature.

  In addition, the heat | fever reflection process of the inner layer 11 is processed so that a heat | fever reflectance may be 95% or more. For this reason, it is possible to prevent consumption of heat energy by absorbing heat in the chamber 10 itself, and to efficiently heat the entire surface of the substrate to a sufficiently uniform temperature.

  Moreover, as the material of the inner layer 11, a metal material whose inner peripheral surface is mirror-finished is preferable, and nickel, aluminum, and silver are more preferable as the metal material. In this case, it is possible to efficiently heat the entire surface of the substrate to a sufficiently uniform temperature with a simple configuration. Here, in this specification, the metal material whose inner peripheral surface is mirror-finished includes a metal material plated on the entire outer peripheral surface of the inner layer 41.

  The heat treatment apparatus according to the first embodiment further includes an opening / closing door 30 capable of opening and closing the opening 13 in the chamber 10. The opening / closing door 30 is movable means 70 (see FIG. 2) so as to be movable between a closed position for closing the opening 13 as shown in FIG. 2 and an open position for opening the opening 13 as shown in FIG. 4). For this reason, it is possible to further prevent heat from being released to the outside of the chamber 10.

  The open / close door 30 includes an open / close door outer layer 32 and an open / close door inner layer 31 that covers a surface of the open / close door outer layer 32 facing the inside of the chamber 10. And the surface which faces the inside of the chamber 10 of this open / close door inner layer 31 is heat-reflected.

  In addition, the heat reflection process of the door inner layer 31 is processed so that the heat reflectivity is 95% or more, like the inner layer 11 of the chamber 10. For this reason, consumption of heat energy by absorbing heat by the opening / closing door 30 itself can be prevented, and the entire surface of the substrate can be efficiently heat-treated to a sufficiently uniform temperature.

  Moreover, as a material of the door inner layer 31, a metal material whose inner peripheral surface is mirror-finished is preferable, and nickel, aluminum, and silver are more preferable as the metal material.

  The heating plate 21 is made of a heat permeable material. As the heat-transmitting material constituting the heating plate 21, sapphire that emits infrared rays, barium fluoride, zinc selenide, and zinc sulfide are preferable, as is the case with the inner layer 41 of the chamber 40, and quartz is more preferable.

  A plurality of linear resistance heaters 22 are disposed on the side surface of the heating plate 21 opposite to the substrate W placement surface. Since the resistance heater 22 is linear, the heat dissipated from the resistance heater 22 is reflected by the inner peripheral surface of the inner layer 11 or the inner peripheral surface of the open / close door inner layer 31 subjected to heat reflection. Even if it exists, the heat can reach the substrate W without being blocked by the resistance heater 22 itself.

  Next, the main electrical configuration of this heat treatment apparatus will be described.

  FIG. 4 is a block diagram showing the main electrical configuration of the heat treatment apparatus.

  The heat treatment apparatus includes a control unit 60 including a ROM 61 that stores a program necessary for controlling the apparatus, a RAM 62 that temporarily stores data and the like during control, and a CPU 63 that executes a logical operation.

  The control unit 60 is connected to a moving mechanism 70 of the open / close door 30 and a resistance heater driving unit 80 that drives the resistance heater 22 via an interface 64.

  In the heat treatment apparatus having such a configuration, when heating the substrate W placed on the heating plate 21, the opening / closing door 30 is moved to the closing position, and the opening 13 of the chamber 10 is closed. In this state, the resistance heater 22 is driven. The heat dissipated from the resistance heater 22 toward the substrate W passes through the heating plate 21 made of a heat-permeable material and reaches the substrate W. Further, the heat dissipated from the resistance heater 22 in the direction other than the direction of the substrate W is reflected by the inner peripheral surface of the inner layer 11 or the inner peripheral surface of the open / close door inner layer 31 subjected to the heat reflection treatment, and this reflection is reflected. The substrate W is reached by repeating a plurality of times.

  Next, another embodiment of the present invention will be described with reference to the drawings. FIG. 5 is a schematic plan view showing a heat treatment apparatus according to the second embodiment of the present invention, and FIGS. 6 and 7 are schematic side views thereof.

  The heat treatment apparatus according to the second embodiment includes a chamber 40 having an opening 43 for passing a substrate W, and a heating plate 21 that is disposed in the chamber 40 and on which the substrate W is placed. The chamber 40 includes an inner layer 41 made of a heat-permeable material, and an outer layer 42 having an inner peripheral surface that is heat-reflected over the entire outer peripheral surface of the inner layer 41. For this reason, even if the heat is emitted from the resistance heater 22 in a direction other than the direction of the substrate W, the outer side having an inner peripheral surface that is transmitted through the inner layer 41 made of a heat-permeable material and is heat-reflected. Reflected by layer 42. Then, by repeating this reflection a plurality of times, the heat dissipated from the resistance heater 22 generally reaches the substrate W. Since the heat treatment apparatus according to the second embodiment employs such a configuration, it is possible to prevent heat from being released outside the chamber 40. This makes it possible to efficiently heat the entire surface of the substrate W to a sufficiently uniform temperature.

  The material of the inner layer 41 is preferably sapphire that transmits infrared rays, barium fluoride, zinc selenide, or zinc sulfide, and more preferably quartz. This is because if quartz is used, particles are not likely to be generated by heating, and contamination of the substrate W can be prevented. On the other hand, the material of the outer layer 42 is preferably a metal material whose inner peripheral surface is mirror-finished, and more preferably nickel, aluminum, silver, or gold as the metal material.

  This heat treatment apparatus further includes an opening / closing door 50 capable of opening and closing the opening 43 in the chamber 40. As shown in FIG. 5, the open / close door 50 is moved by a moving means 70 (see FIG. 6) between a closed position for closing the opening 43 and a release position for opening the opening 43 as shown in FIG. 4). For this reason, it is possible to further prevent heat from being released outside the chamber 40.

  The open / close door 50 includes an open / close door inner layer 51 made of a heat-permeable material, and an open / close door outer layer having an inner peripheral surface that is heat-reflected on the entire surface of the open / close door 50 opposite to the surface facing the chamber 40. 52.

  As the material of the door inner layer 51, sapphire that transmits infrared rays, barium fluoride, zinc selenide, and zinc sulfide are preferable as in the inner layer 41 of the chamber 40, and quartz is more preferable. On the other hand, as the material of the open / close door outer layer 52, like the outer layer 42 of the chamber 40, a metal material whose inner peripheral surface is mirror-finished is preferable. Further, nickel, aluminum, silver, and gold are used as the metal material. More preferred.

  Similar to the heat treatment apparatus according to the first embodiment, the heating plate 21 is made of a heat-permeable material. As the heat-transmitting material constituting the heating plate 21, sapphire that emits infrared rays, barium fluoride, zinc selenide, and zinc sulfide are preferable, as is the case with the inner layer 41 of the chamber 40, and quartz is more preferable.

  A plurality of linear resistance heaters 22 are disposed on the side surface of the heating plate 21 opposite to the substrate W placement surface. Since the resistance heater 22 is linear, the heat dissipated from the resistance heater 22 passes through the inner layer 41 or the door inner layer 51 and is reflected by the outer layer 42 or the door outer layer 52. Even so, the heat can reach the substrate W without being blocked by the resistance heater 22 itself.

  The heat treatment apparatus according to the second embodiment has the same electrical configuration as the heat treatment apparatus according to the first embodiment. That is, as shown in FIG. 4, the heat treatment apparatus includes a ROM 61 that stores a program necessary for controlling the apparatus, a RAM 62 that temporarily stores data during control, and a CPU 63 that executes a logical operation. The control unit 60 is provided.

  In the heat treatment apparatus having such a configuration, when the substrate W placed on the heating plate 21 is heated, the opening / closing door 50 is moved to the closing position, and the opening 43 of the chamber 40 is closed. In this state, the resistance heater 22 is driven. The heat dissipated from the resistance heater 22 toward the substrate W passes through the heating plate 21 made of a heat-permeable material and reaches the substrate W. Further, the heat dissipated from the resistance heater 22 in the direction other than the direction of the substrate W is transmitted through the inner layer 41 made of a heat-permeable material and reflected by the outer layer 42 having the heat-reflected inner peripheral surface. Or by passing through the open / close door inner layer 31 made of a heat-permeable material and reflected by the open / close door outer layer 52 having the heat-reflected inner peripheral surface, and repeating this reflection a plurality of times, The substrate W is reached.

  In addition, in the 1st Embodiment mentioned above, although the door 30 is employ | adopted, it may replace with the door 30 and the door 50 in 2nd Embodiment may be employ | adopted.

  Moreover, in the second embodiment described above, the opening / closing door 50 is employed, but the opening / closing door 30 in the first embodiment may be employed instead of the opening / closing door 50.

  In the above-described embodiment, the plurality of linear resistance heaters 22 disposed on the heating plate 21 are employed, but one or a plurality of meandering resistance heaters may be employed.

  Further, in the above-described embodiment, the resistance heater 22 disposed on the heating plate 21 is employed as the heating means for the substrate W. However, other heating means such as an infrared lamp may be employed.

1 is a schematic plan view showing a heat treatment apparatus according to a first embodiment of the present invention. It is a side surface schematic diagram showing the heat treatment apparatus concerning a 1st embodiment of this invention. It is a side surface schematic diagram showing the heat treatment apparatus concerning a 1st embodiment of this invention. It is a block diagram which shows the main electrical structures of this heat processing apparatus. It is a plane schematic diagram which shows the heat processing apparatus which concerns on 2nd Embodiment of this invention. It is a side surface schematic diagram which shows the heat processing apparatus which concerns on 2nd Embodiment of this invention. It is a side surface schematic diagram which shows the heat processing apparatus which concerns on 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Chamber 11 Inner layer 12 Outer layer 13 Opening part 21 Heating plate 22 Resistance heater 30 Opening / closing door 31 Opening / closing door inner layer 32 Opening / closing door outer layer 40 Chamber 41 Inner layer 42 Outer layer 43 Opening part 50 Opening / closing door 51 Opening / closing door inner layer 52 Opening door outer layer

Claims (10)

In a heat treatment apparatus comprising a chamber having an opening for passing a substrate, and substrate holding means for holding the substrate in the chamber,
The heat treatment apparatus characterized in that the entire inner surface of the chamber is heat-reflected. In a heat treatment apparatus comprising a chamber having an opening for passing a substrate, and substrate holding means for holding the substrate in the chamber,
The chamber is
An inner layer of heat permeable material;
An outer layer having an inner peripheral surface that is heat-reflected with respect to the entire outer peripheral surface of the inner layer;
A heat treatment apparatus comprising: In the heat treatment apparatus according to claim 1 or 2,
The substrate holding means is a heat treatment apparatus comprising a heating plate disposed in the chamber and placing a substrate thereon. In the heat treatment apparatus according to any one of claims 1 to 3,
The heat processing apparatus further provided with the opening-and-closing door which can move between the closed position which closes the opening part in the said chamber, and the open position which opens the said opening part. The heat treatment apparatus according to claim 4, wherein
The open / close door is a heat treatment apparatus in which a surface of the open / close door facing the chamber is heat-reflected. The heat treatment apparatus according to claim 4, wherein
The door is
A door inner layer made of a heat-permeable material;
An open / close door outer layer having an inner peripheral surface that is heat-reflected with respect to the entire surface opposite to the surface facing the inside of the chamber in the open / close door;
A heat treatment apparatus comprising: The heat treatment apparatus according to any one of claims 1 to 6,
The heat reflection process is a heat treatment apparatus that is processed so that the heat reflectivity is 95% or more. The heat treatment apparatus according to claim 7,
The heat treatment is a heat treatment apparatus in which the heat reflection treatment is a mirror surface treatment. In the heat treatment apparatus according to any one of claims 3 to 8,
The heating plate is a heat treatment apparatus made of a heat-permeable material. The heat treatment apparatus according to claim 9, wherein
A heat treatment apparatus in which linear heating means is disposed on a side surface of the heating plate opposite to the substrate mounting surface.

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