JP2006319065A5 - - Google Patents
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- Publication number
- JP2006319065A5 JP2006319065A5 JP2005138949A JP2005138949A JP2006319065A5 JP 2006319065 A5 JP2006319065 A5 JP 2006319065A5 JP 2005138949 A JP2005138949 A JP 2005138949A JP 2005138949 A JP2005138949 A JP 2005138949A JP 2006319065 A5 JP2006319065 A5 JP 2006319065A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- exposure apparatus
- plate
- liquid
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000007788 liquid Substances 0.000 claims 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 1
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
Claims (5)
レチクルのパターンを前記ウェハに投影する投影光学系と、
前記ウェハをチャックで保持し、移動するステージとを備え、
前記ステージは、前記チャックで保持された前記ウェハの周辺に配置され、前記ウェハとともに前記液体を支持する板を有し、
その板の前記液体と接触する表面には、配列間隔が５０ｎｍ乃至５００μｍ，突起高さが５０ｎｍ乃至２００μｍである微細構造が形成されていることを特徴とする露光装置。 An exposure apparatus for exposing a wafer through the liquid body,
A projection optical system for projecting a reticle pattern onto the wafer;
A stage for holding and moving the wafer with a chuck;
The stage is arranged in the circumferential side of the wafer held by the chuck, prior SL has a plate for supporting the liquid to the wafer together with,
The surface in contact with the liquid of the plate, the arrangement interval is 50nm to 500 [mu] m, the exposure apparatus characterized by microstructure projection height is Ru 50nm to 200μm der is formed.
その露光されたウェハを現像するステップとを有することを特徴とするデバイス製造方法。 Exposing the wafer using the exposure apparatus according to any one of claims 1 to 4 ,
Device manufacturing method characterized by a step of developing the exposed wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005138949A JP2006319065A (en) | 2005-05-11 | 2005-05-11 | Exposure apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005138949A JP2006319065A (en) | 2005-05-11 | 2005-05-11 | Exposure apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006319065A JP2006319065A (en) | 2006-11-24 |
| JP2006319065A5 true JP2006319065A5 (en) | 2008-08-07 |
Family
ID=37539476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005138949A Withdrawn JP2006319065A (en) | 2005-05-11 | 2005-05-11 | Exposure apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006319065A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009054784A (en) | 2007-08-27 | 2009-03-12 | Canon Inc | Auxiliary plate, and exposure device having it |
| JP2010251745A (en) * | 2009-04-10 | 2010-11-04 | Asml Netherlands Bv | Immersion lithography device and device manufacturing method |
| JP6155581B2 (en) * | 2012-09-14 | 2017-07-05 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
| JP6418281B2 (en) * | 2017-06-07 | 2018-11-07 | 株式会社ニコン | Exposure equipment |
-
2005
- 2005-05-11 JP JP2005138949A patent/JP2006319065A/en not_active Withdrawn
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