JP2006313945A - Manufacturing method of multilayer wiring board, component for connection between wiring films, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve cost reduction of a wiring board having wiring films on both surfaces, and to raise positioning precision between bumps. <P>SOLUTION: A method for manufacturing a multilayer wiring board comprises preparing an object 17 in which a plurality of nearly konide-shaped bumps 14 are formed on one major surface of a carrier 13, laminating an insulation film 18 for inter layer dielectric on the one major surface of the carrier 13 such that the insulation film 18 itself is penetrated by the bumps 14, laminating a metal foil 23a for forming a wiring film on the surface of the insulation film 18 opposite to the carrier 13, removing the carrier 13, and laminating a metal foil 23b for forming a wiring film different from the metal foil 23a for forming a wiring film on the surface of the insulation film 18 from which the carrier 13 has been removed, for integrating the bumps 14, the insulation film 18 and the two metal foils 23a, 23b for forming two wiring films. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a multilayer wiring board, a wiring film connecting member used therefor, and a method for manufacturing the same.

Various proposals have been made by JP-A-2001-326459 for a technique for connecting wiring films of a multilayer wiring board, and one conventional technique is, for example, a technique using bumps made of copper. This method will be briefly described with reference to FIG.
(A) First, as shown in FIG. 26 (A), a multilayer metal plate 1 is prepared. The multilayer metal plate 1 has a thickness of, for example, 18 μm, on one main surface of a bump forming metal layer 2 made of, for example, a copper foil having a thickness of 100 μm, with an etching stop layer 3 made of, for example, nickel having a thickness of, for example, 1 μm. A wiring film forming metal layer 4 made of copper foil is laminated.

(B) Next, as shown in FIG. 26 (B), the bump forming metal layer 2 of the multilayer metal plate 1 is selectively etched to form bumps 2a for connection between wiring films.
(C) After this etching is completed, as shown in FIG. 26C, the etching stop layer 3 is etched using copper, which is a material for forming the bump 2a and the wiring film forming metal layer 4, as a mask.
(D) Next, as shown in FIG. 26D, the insulating film 5 made of, for example, a thermosetting resin is bonded to the formation surface of the bump 2a so that the top of the bump 2a is exposed.
(E) After that, as shown in FIG. 26 (E), a wiring film forming metal thin plate 6 made of, for example, copper is allowed to face the surface of the multilayer metal plate 1 on which the tops of the bumps 2a protrude.

(F) Next, as shown in FIG. 26 (F), the wiring film forming metal thin plate 6 is connected to the bump 2a and laminated on the bump 2a formation surface side.
(G) Next, the wiring film forming metal layer 4 of the multilayer metal plate 1 and the wiring film forming metal thin plate 6 are patterned by selective etching to form wiring films 4a and 6a. Thus, as shown in FIG. 26G, the multilayer wiring board 7 is completed, and the wiring film 4a becomes the upper wiring film and the wiring film 6a becomes the lower wiring film. To further increase the number of layers, for example, a wiring board in the state shown in FIG.
JP 2001-326459 A

  In the conventional method, the multilayer metal plate 1 is used. As described above, the multilayer metal plate 1 has a three-layer structure of, for example, copper, nickel, and copper, and is not a general-purpose product such as a simple copper foil but a custom-made product. Therefore, the unit price is high. Further, in the conventional method, it is necessary to perform different types of etching at least twice, that is, etching for forming the bumps 2a for the first time and etching for removing the etching stop layer 3 for the second time. For this reason, man-hours are required, and the etching material is different for the selective etching.

  In the conventional technique, when the number of layers is increased, for example, the wiring film 4a is formed on the wiring film forming metal layer 4 by etching, and then the wiring substrate in the state shown in FIG. It is necessary to repeat the procedure of forming the next wiring film 4a by etching on the forming metal layer 4a and then stacking the next wiring substrate in the state shown in FIG. 26D. It was not possible to press all at once.

In the conventional method, as shown in FIG. 27, an etching resist pattern 8 corresponding to the bump is formed on the bump forming metal layer 2, and etching is performed using the pattern 8 as a mask to form the bump 2a. In this case, due to the etching depth, the diameter of each etching resist pattern 8 cannot be less than a certain value, and a gap G that is greater than a certain value is provided between the etching resist patterns 8. It is necessary to keep.
For this reason, the pitch of the etching resist pattern 8, in other words, the pitch of the bumps 2a cannot be set to a certain value or less. For example, when the thickness of the metal layer is 0.1 mm, the limit is 0.4 mmP ( At this time, the diameter of the hem portion of the bump is 0.15 mm).

In the conventional method, the metal layer 4 for forming the wiring film needs to have a thickness that can withstand conveyance by the conveyor in order to support the bumps 2a to be formed. Scratches and tears will occur and it will be virtually impossible to employ. Although it is convenient to use a semi-additive method that can be made finer than the subtract method if a metal foil having a thickness of about 3 to 5 μm can be used on both sides of the insulating film 5, the wiring layer is made to have a thickness of about 3 to 5 μm. That was difficult for the reasons mentioned above.
Further, in the above conventional method, when the bump 2a is raised, the diameter of the skirt portion of the bump 2a inevitably increases. For this reason, in a state where the bumps 2a are raised, the pitch of the bumps 2a cannot be reduced to a certain extent.

  The object of the present invention is to eliminate the above-mentioned drawbacks of the prior art, and to stack the required number of layers at once and press them together, or to arrange the bumps at a pitch smaller than the limit of the pitch of the etching resist pattern. Or a method of manufacturing a multilayer wiring board that can form a fine wiring pattern on both sides of an insulating film by a semi-additive method, or can maintain a fine pitch even if bumps are raised An object of the present invention is to provide a wiring film connecting member and a method of manufacturing the same.

  According to a first aspect of the present invention, there is provided a method for manufacturing a multilayer wiring board, comprising: preparing a plurality of substantially conical bumps on one main surface of a carrier; and providing an insulating film for interlayer insulation on the one main surface of the carrier. The insulating film itself is laminated so as to penetrate the bumps, the wiring film forming metal foil is laminated on the surface of the insulating film opposite to the carrier, the carrier is removed, and the insulating film The wiring film forming metal foil different from the wiring film forming metal foil is laminated on the surface from which the carrier is removed, and the bump, the insulating film, and the two wiring film forming metal foils are integrated. .

  A method for manufacturing a multilayer wiring board according to claim 2 is prepared by forming a plurality of substantially conical bumps on one main surface of a carrier to be an interlayer insulating film, and the bumps penetrate the carrier, The metal foil for forming a wiring film is laminated on both surfaces of the carrier, and the carrier, the bump, and the two metal foils for forming a wiring film are integrated.

  The method for producing a multilayer wiring board according to claim 3 includes a member in which a plurality of bumps are formed on one main surface of one wiring film forming metal foil, and one main surface of another wiring film forming metal foil. An insulating film for interlayer insulation is laminated, and a member in which a plurality of bump-corresponding holes corresponding to the plurality of bumps are formed in the insulating film is prepared. The bump, the insulating film, and the two metal foils for forming the wiring film are integrated by aligning and stacking so as to align with the corresponding bump corresponding holes of the member.

  According to a fourth aspect of the present invention, there is provided a method for producing a multilayer wiring board comprising: laminating a member having a plurality of bumps formed on one main surface of one mold and another mold on one main surface of an insulating film for interlayer insulation; A member in which a bump corresponding hole corresponding to the bump is formed is prepared, and the insulating film of another member is provided on the side on which the bump is formed on the member on which the bump is formed. Are applied so that the corresponding parts are aligned with each other, and pressure is applied to the two molds so that the insulating film penetrates the bumps, and after removing the two molds, both surfaces of the insulating film are applied. A metal foil for forming a wiring film is stacked on the insulating film, the bump, and the two metal foils for forming a wiring film.

  The method for manufacturing a multilayer wiring board according to claim 5 is the method for manufacturing a multilayer wiring board according to claim 4, wherein the mold having the bump corresponding holes formed therein is an adhesive on the surface opposite to the insulating film of the mold. When the two molds are removed after applying the pressure to the two molds so that the insulating film penetrates the bumps The mold having the bump-corresponding holes is removed by peeling the resin film through the adhesive.

  The method for manufacturing a multilayer wiring board according to claim 6 includes a step of forming a plurality of half bumps by half-etching from one main surface side of the bump forming metal foil, and the one main surface of the bump forming metal foil. A step of laminating an insulating film for interlayer insulation on the surface so as to be penetrated by the half bump, a step of laminating a metal foil for forming a wiring film connected to the half bump on the surface of the insulating layer, and the bump Forming a plurality of half-bumps that are integrated with the half-bumps by half-etching from the other main surface side of the metal foil for forming, and forming an interlayer on the other main surface of the metal foil for bump-forming Laminating an insulating film for insulation so as to be penetrated by the half bump, and laminating a metal foil for forming a wiring film connected to the half bump on the surface of the insulating layer And having a step.

  According to a seventh aspect of the present invention, there is provided a method for manufacturing a wiring film connecting member comprising: a step of laminating a carrier layer on a bump forming metal layer; and a surface opposite to the surface of the bump forming metal layer on which the carrier layer is laminated. Forming a resist pattern; etching the bump-forming metal layer using the resist pattern as a mask to form a first member having substantially cone-shaped bumps projecting from the carrier layer; and Forming a second member by laminating an insulating film on the member so that the top of the bump is exposed from the insulating film, and removing the carrier layer from the second member for connecting one wiring film Forming a member; laminating a carrier layer different from the carrier layer on a bump forming metal layer different from the bump forming metal layer; and Carrier layer is stacked Forming a resist pattern different from the resist pattern on a surface opposite to the formed surface, and etching the other bump-forming metal layer using the another resist pattern as a mask to substantially form the other carrier layer. A step of forming another first member on which the conical bump is protruded, and a top portion of the bump of the other first member is exposed from the insulating film of the one wiring film connecting member. Laminating the other first member and the one wiring film connecting member to form a second member different from the second member; and from the second member to the other carrier And a step of removing a layer and forming a new inter-wiring-film connecting member in which substantially conical bumps are embedded in an insulating film.

The method of manufacturing a multilayer wiring board according to claim 8 includes: a step of forming a conductive film on a member for connecting between wiring films in which substantially conical bumps are embedded in an insulating film; and a wiring pattern by plating on the conductive film And a step of removing the conductive film by quick etching.
According to a ninth aspect of the present invention, there is provided a member for connecting between wiring films, wherein a plurality of members each having a substantially conical bump embedded in an insulating film are laminated so that the bumps overlap each other.

  According to the method for manufacturing a multilayer wiring board according to claim 1, an insulating film for interlayer insulation formed on one main surface of a carrier in which a plurality of substantially conical bumps are formed on one main surface, the insulating film itself Is laminated so as to penetrate the bumps, and then a metal foil for wiring film formation is laminated on the surface of the insulating film opposite to the carrier, the carrier is removed, and another wiring film is formed on the removal surface. Since the above metal foil is laminated to integrate the bump, insulating film, and two metal foils for forming a wiring film, a wiring board having a wiring film on both sides is used as a general-purpose product, such as a cheap copper foil. Can be manufactured as. Accordingly, the cost can be kept low accordingly.

  And, since the two metal foil copper foils for wiring film formation are laminated by separate presses in two times, the two layers of the insulating film for interlayer insulation and the carrier are used in the first lamination. The positional relationship can be defined and integrated with the metal foil for forming the wiring film, and the deviation of the positional relationship between the bumps can be extremely reduced. Then, the lamination of the metal foil for forming another wiring film is performed in a state where the positional relationship between the bumps is defined by the metal foil for forming the wiring film, so that the wiring is maintained while maintaining high accuracy with respect to the positional relationship. A substrate can be formed.

  According to the method for manufacturing a multilayer wiring board according to claim 2, a carrier to be an interlayer insulating film in which a plurality of substantially conical bumps are formed on one main surface is prepared, and the bumps pass through the carrier. Since the metal foil for forming a wiring film is laminated and integrated on both surfaces of the carrier, a wiring board having a wiring film on both surfaces can be manufactured using a normal copper foil or the like that is inexpensive as a general-purpose product. . Accordingly, the cost can be kept low accordingly. Since the carrier is used as it is as an interlayer insulating film, it is not necessary to waste the carrier, and as a result, the material cost can be reduced.

  According to the method for manufacturing a multilayer wiring board according to claim 3, a wiring board having wiring films on both sides can be manufactured not only by using an ordinary copper foil as a general-purpose product, but also by wiring. A bump-corresponding hole corresponding to the bump is formed in advance in an insulating film for interlayer insulation to be laminated on a member in which a bump is formed on the film-forming metal foil. Therefore, when the insulating film is laminated, It can be smoothly penetrated by the bump, and contamination caused by dust and debris caused by the insulating film forming material can be reduced.

  According to the method for manufacturing a multilayer wiring board according to claim 4, not only a wiring board having wiring films on both sides can be manufactured using a normal copper foil or the like that is inexpensive as a general-purpose product, but also between layers. The insulating film for insulation is laminated by pressing the bump-corresponding hole and the bump in a state where the bump-corresponding hole and the bump are aligned with each other through the mold having the bump-corresponding hole formed thereon. When the films are laminated, the insulating film is sharply penetrated by the mold having bump-corresponding holes and the bumps, and dust and debris generated by the insulating film forming material generated at that time can be reduced, and contamination is further reduced. be able to.

  According to the method for manufacturing a multilayer wiring board according to claim 5, in the method for manufacturing a multilayer wiring board according to claim 10, an adhesive is formed on the surface of the mold opposite to the insulating film as a mold in which bump corresponding holes are formed. Use the one with the adhesive resin film attached with the adhesive, and remove the resin film by removing the mold with the bump-corresponding hole by peeling the resin film through the adhesive. It is possible to remove the dust generated when penetrating the mold. Therefore, dust and waste can be reduced, and contamination can be reduced.

  According to the multilayer wiring board manufacturing method of the sixth aspect, the bumps can be made high without restricting increasing the arrangement density. That is, the selective etching usually involves side etching, and the side etching amount is approximately proportional to the etching depth. Therefore, the side etching amount is increased as the bumps are higher, and the integration density is lowered. However, according to the manufacturing method of this multilayer wiring board, half bumps are formed by half etching (different or simultaneous half etching) from both sides of a thick bump forming copper foil, and one half bump is formed by combining two half bumps. Since bumps are formed, high bumps can be formed with a small amount of side etching.

  According to the method for manufacturing a member for connecting wiring films according to claim 7, a wiring board having wiring films on both surfaces can be manufactured using a normal copper foil or the like that is inexpensive as a general-purpose product, and the cost accordingly. Not only can be kept low, but also the bumps can be arranged with a smaller pitch beyond the limit of the pitch of the etching resist pattern.

According to the method for manufacturing a multilayer wiring board according to claim 8, a wiring board having wiring films on both sides can be manufactured using a normal copper foil or the like which is inexpensive as a general-purpose product, and the cost is reduced accordingly. In addition, there is an effect that a fine pattern which is a feature of the semi-additive method can be formed on both sides of the insulating film.
According to the wiring film connecting member of the ninth aspect, there is an effect that the fine pitch can be maintained even if the bumps are raised.

  In the best mode of the present invention, for example, one main surface of a carrier made of resin is prepared by forming a plurality of substantially conical bumps made of, for example, copper, and interlayer insulation is formed on the one main surface of the carrier. An insulating film made of resin, for example, is laminated so that the insulating film itself penetrates the bumps, and a metal foil for forming a wiring film made of copper, for example, is laminated on the surface of the insulating film opposite to the carrier. And removing the carrier, and laminating a wiring film forming metal foil made of, for example, copper different from the wiring film forming metal foil on the surface of the insulating film from which the carrier has been removed, Two metal foils for forming a wiring film are integrated.

Hereinafter, the details of the present invention will be described based on illustrated embodiments.
FIGS. 1A to 1H show a first embodiment, and are sectional views showing a method of forming a multilayer wiring board in the order of steps.

(A) First, a first resin film 13 as a carrier layer is laminated (adhered) to the copper foil 12 as a bump forming metal layer via an adhesive or directly (FIG. 1A). The thickness of the copper foil 12 is arbitrary, and is determined according to the height of the bump 14 to be formed. For example, the thickness is 100 μm. Instead of the first resin film 13, for example, a metal foil made of aluminum or the like may be laminated on the copper foil 12 as a carrier layer.

(B) Next, an etching resist pattern 16 for forming a bump is formed on the surface of the two surfaces of the copper foil 12 which is not the surface on which the first resin film 13 is laminated (FIG. 1B )).
(C) Next, the copper foil 12 is etched using the etching resist pattern 16 as a mask.

  Thus, the first member 17 is formed in which the substantially conical bumps 14 project from the first resin film 13 (FIG. 1C). The size of the bump 14 is arbitrary. For example, when the height is 100 μm, the diameter of the top is 100 μm, the diameter of the skirt is 150 μm, and the like.

(D) Next, a second resin film 18 that is an insulating film corresponding to the insulating film of the wiring board is placed from the side of the first member 17 where the bumps 14 are projected (FIG. 1D). . The thickness of the second resin film 18 is also arbitrary, but is, for example, 50 μm. Also suitable as materials are thermoplastic resins such as liquid crystal polymer, polyether ether ketone resin, polyether sulfone resin, polyphenylene sulfide resin, fluorine resin, polyimide resin or thermosetting resin B-stage epoxy prepreg. is there.
(E) Next, the second member 19 is formed by laminating the first member 17 on the second resin film 18 so that the top of the bump 14 is exposed (FIG. 1E).

  In addition, the lamination | stacking to the 1st member 17 of the 2nd resin film 18 is specifically performed in the procedure as shown, for example in FIG. 2 (A)-(C). That is, first, the second resin film 18 is brought into contact with the bumps 14 of the first member 17 from the side where the bumps 14 are projected (FIG. 2A). Next, the second resin film 18 is rubbed with a grindstone 21 (FIG. 2B). As a result, the resin corresponding to the top of the bump 14 is removed by polishing, and the resin penetrates into the second resin film 18 and eventually breaks through the second resin film 18 so that the top of the bump 14 extends from the second resin film 18. It will be exposed. A polishing roller or the like may be used instead of the grindstone 21.

(F) Next, when the bumps bite into the resin film 18 and is held, the first resin film 13 is peeled off from the second member 19 (FIG. 1F). Thus, the inter-wiring film connecting member 22 is formed in which the substantially conical bump 14 is embedded in the second resin film 18 as an insulating film. Note that the wiring film connecting member 22 as shown in FIG. 1F, that is, the wiring film connecting member 22 in which the hem portion (base) of the substantially conical bump 14 protrudes from the second resin film. Instead, an inter-wiring film connecting member 22 as shown in FIG. 1 ((F ′)), that is, an inter-wiring film connecting member 22 in which the top of the bump 14 protrudes from the second resin film 18 is obtained. You can also.

  3A to 3C show a method of obtaining the wiring film connecting member 22 as shown in FIG. Specifically, the state shown in FIG. 3A (same as the state shown in FIG. 1C) is applied, and then the second resin film 18 is made of an elastic sheet such as polyethylene, polypropylene, paper, A sheet of vinylidene chloride or rubber 70 is placed, and the entire surface is pressed to the state shown in FIG. 3B, and then the sheet 70 and the first resin film 13 are removed to the state shown in FIG. 3C. To do. Then, the inter-wiring film connecting member 22 shown in FIG. 1 (F ′) can be obtained.

  Further, as the resin film 18, a member 22 for connecting between wiring films shown in FIG. 1 (F ') is obtained by using a resin film 18 that has been previously drilled at a predetermined position by a method of drilling, punching or laser beam. May be. FIGS. 4A to 4C show a method for obtaining such a wiring film connecting member 22. That is, in the process shown in FIG. 1D and the process shown in FIG. 2, the second resin film 18 having no holes is prepared. In this method, as shown in FIG. The second resin film 18 is prepared by forming a hole 71 having a diameter smaller than the diameter of at least the base (bottom portion) of the bump 14 at a position corresponding to.

  After that, the second resin film 18 is positioned on the first resin film 13 on which the bumps 14 are formed so that the holes 71 and the bumps 14 correspond to each other, and crimping at room temperature or thermocompression bonding. To integrate. FIG. 4B shows a state after the integration. Thereafter, as shown in FIG. 4C, the first resin film 13 is peeled off. Also by such a method, the inter-wiring film connecting member 22 as shown in FIG.

Next, the description will be continued from the step (G) next to the step shown in FIG.
(G) The two copper foils 23 for wiring film formation are contacted from both sides of the wiring film connecting member 22 (FIG. 1G).
(H) Next, the wiring film forming copper foil 23 and the wiring film connecting member 22 are pressed at a high temperature of 300 ° C. or more in the case of a liquid crystal polymer, for example (FIG. 1 (H)). As a result, the bumps 14 made of the same copper as the wiring film forming copper foils 23 are firmly joined together because they are the same metal (Cu-Cu bonding), and a good conduction state is realized.

(Modification)
FIGS. 5A to 5C show modifications of the first embodiment, and are cross-sectional views sequentially showing the steps of the method of manufacturing the wiring board.
(A) First, as shown in FIG. 5A, a resin film 18a having a three-layer structure is prepared. The resin film 18a is obtained by bonding polyimide films 182, 182, which can be thermocompression bonded, such as thermoplastic polyimide or epoxy-modified thermosetting adhesive, to both surfaces of a polyimide film 181 constituting a core material. In this modification, one of the differences from the manufacturing method of the first embodiment shown in FIG. 1 is that a resin film 18a having a three-layer structure is used instead of the second resin film 18 serving as an interlayer insulating film. .

(B) Next, as shown in FIG. 5 (B), a member 17a in which bumps 14, 14,... Are formed on one main surface of the wiring film forming copper foil 23, and the bumps 14, 14,. .. is laminated on one main surface of the resin film 18a so as to penetrate the resin film 18a having the three-layer structure, and thermocompression-bonded. The member 17a is formed by, for example, laminating a copper foil for forming a bump on a resin film, selectively etching the copper foil, and then forming the copper foil for forming a wiring film on the surface opposite to the resin film. Then, the resin film can be removed by a method such as removing the resin film.

(C) Next, as shown in FIG. 5C, another wiring film forming copper foil 23 is provided on the surface of the resin film 18a opposite to the side on which the wiring film forming copper foil 23 is laminated. Lamination and thermocompression bonding. As a result, a modified wiring board 11 ′ is obtained. As described above, the wiring board 11 shown in FIG. 1 has a modification 11 ′ as shown in FIG.

  In addition, you may perform the press with respect to the copper foil 23 for wiring film formation, the member 22 for connecting between wiring films, etc., for example to pass between the two high temperature rollers 24, as shown in FIG. If it carries out like this, a press will be performed continuously and it will become possible to raise production efficiency. Thereafter, the copper foil 23 for forming a wiring film is etched to form a required wiring pattern (not shown, as in the conventional multilayer wiring board shown in FIG. 26G) as in the conventional case. Note that, in the steps shown in FIGS. 1G and 1H, the wiring film connecting member 22 shown in FIG. 1F ′ is used in place of the wiring film connecting member 22 shown in FIG. It goes without saying that it is possible to do so. Moreover, the roller shown in FIG. 6 can also be used for the modified example shown in FIG. 5 or various laminations described later.

FIGS. 7A to 7E show a second embodiment of the present invention and are cross-sectional views sequentially showing the steps of the method for manufacturing a wiring board.
(A) The first member 17 shown in FIG. 1C is formed by the method shown in FIGS. Reference numeral 13 denotes a first resin film, and reference numeral 14 denotes a substantially cone-like bump protruding from the first resin film 13.

  Here, the method shown in FIGS. 1A to 1C will be briefly described. The first resin film 13 serving as a carrier layer is laminated (adhered) to the copper foil 12 serving as the bump forming metal layer, and one of the two surfaces of the copper foil 12 that is not the surface on which the first resin film 13 is laminated. An etching resist pattern 16 for forming bumps is formed on the surface, and then the copper foil 12 is etched using the etching resist pattern 16 as a mask. Then, the first member 17 shown in FIG. 7A [FIG. 1C] is completed.

(B) Next, the second resin film 18 which is an insulating film corresponding to the insulating film of the wiring board is brought into contact with the bump 14 of the first member 17 from the side where the bump 14 is projected, and the top of the bump 14 is exposed. As described above, the second member 19 is formed by laminating the first member 17 on the second resin film 18. FIG. 7B shows a state after the second member 19 is formed. In this case, the second resin film 18 is laminated so as to be in close contact with the first resin film 13. This can be easily done, for example, by the method shown in FIGS. 4 (A) and 4 (B).

(C) Next, the wiring film forming copper foil 23 a is applied to the side opposite to the side on which the first resin film 13 of the second member 19 is formed, and is laminated by pressing the resin film 13. FIG. 7C shows a state after the lamination.
(D) Next, as shown in FIG. 7D, the first resin film 13 is peeled off.
(E) Thereafter, the copper foil 23b for wiring film formation is applied to the surface from which the resin film 13 has been peeled off, and in this state, the second member 19 is laminated by pressing. Then, as shown in FIG. 7E, the multilayer wiring board 11a of the second embodiment is completed.

  Thus, without removing the resin film 13 from the second member 19, the wiring film forming copper foil 23 a is pressed only on the opposite side of the film 13, and then the resin film 13 is removed. Thereafter, the second copper foil for forming a wiring film 23b is pressed on the removed surface, as in the first embodiment shown in FIG. This is because variations in the formation positions of the bumps 14 and 14 can be reduced as compared with the case where the foils 23 and 23 are laminated by pressing.

  That is, as in the embodiment shown in FIG. 1, when the two copper foils 23, 23 are pressed from both sides at a time and integrated with the member, the positional relationship between the bumps 14, 14,. Since it is only held by the second resin film 18, a slight shift occurs due to the impact pressure applied during pressing, and the bumps 14, 14,. Therefore, when the positional accuracy of the bumps 14, 14,... Is required to be considerably high, it may be difficult to meet the request.

  However, as in the embodiment shown in FIG. 7, when the two copper foils 23a, 23b are divided into two portions and laminated by separate presses, the first resin film 13 and the second resin layer are laminated at the first lamination. It is possible to define the positional relationship between the bumps 14, 14,... By the two resin films of the resin film 28, and to extremely reduce the positional relationship between the bumps 14, 14,. Can do. Since the bumps 14, 14,... Are laminated by pressing the copper foil 23b in a state where the mutual positional relationship is defined by the copper foil 23a, the wiring board 11a is maintained while maintaining high accuracy with respect to the positional relationship. Can be formed. Therefore, even if the number of processes increases, if it is required that the positional accuracy between the bumps 14, 14,... Is extremely high, the manufacturing method shown in FIG. If the height is sufficient and there is a strong demand for reducing the manufacturing cost by reducing the manufacturing process, the manufacturing method shown in FIG. 1 may be used.

FIGS. 8A to 8D show a third embodiment of the present invention, and are cross-sectional views sequentially showing the steps of a method for manufacturing a wiring board.
(A) The first member 17 shown in FIG. 8 (A) is manufactured by the same method as shown in FIGS. 1 (A) to 1 (C). 13 is a resin film, 14, 14,... Are bumps made of copper. The resin film 13 initially serves as a base for forming the bumps 14, 14,..., But later serves as an interlayer insulating film and is not removed.

(B) Next, a cushion material (not shown) is placed on the lower side of the resin film 13 and is pressed to allow the bumps 14, 14,... FIG. 8B shows the state of penetration. Thereby, the resin film 13 can be used as an interlayer insulating film. As the cushion material, a foaming agent, for example, foamed polypropylene, foamed urethane, thick paper, rubber sheet or the like is suitable.
(C) Next, as shown in FIG. 8C, two wiring film forming copper foils 23 are brought into contact from both sides of the inter-wiring film connecting member 22.

(D) Thereafter, the wiring film forming copper foil 23 and the wiring film connecting member 22 are pressed at a high temperature. Thereby, a wiring substrate 11b as shown in FIG. The difference between this wiring board 11b and the above-mentioned wiring boards 11 and 11a is that the resin film 13 used as a base when forming the bumps 14, 14,. Therefore, it is possible to avoid useless use of the resin film 13 and to reduce the material cost.

FIGS. 9A to 9E show a fourth embodiment of the present invention and are cross-sectional views sequentially showing steps of a method for manufacturing a wiring board.
(A) A single-sided copper-clad laminate in which a resin film (for example, made of polyimide or LCP) 18 serving as an interlayer insulating film is laminated on the wiring film forming copper foil 23 is prepared, and the resin serving as the interlayer insulating film of the laminated plate The protective film 13 is stuck on the surface opposite to the side on which the copper foil 23 of the film 18 is laminated. FIG. 9A shows a state after the protective film 13 is pasted. Here, the protective film 13 is affixed in order to prevent attacks and surface contamination due to desmear processing performed later. In addition, a polyimide resin may be used as the resin 18 on the wiring film forming copper foil 23, and a polyimide that can be thermocompression bonded such as a thermoplastic polyimide or an epoxy-modified thermosetting adhesive may be used as the resin 18. . In this example, the protective film 13 is formed by thermocompression bonding.

(B) Next, bump-corresponding holes are selectively formed in the protective film 13 and the resin film 18 by a laser beam. 18h is a bump corresponding hole, and a bump is inserted later. Then, a desmear process is performed. Specifically, after drilling with a laser beam, the organic matter remaining on the surface of the copper foil 23 exposed on the inner bottom surface of the bump corresponding hole 18h is removed with, for example, a potassium permanganate solution. Further, dry desmear may be performed by ozone, plasma, sand blasting, liquid homing or the like. FIG. 9B shows the state after the perforation and desmear treatment. Instead of drilling with a laser beam, a resin film provided with photosensitivity is used as the resin film 18, and the bump corresponding hole 18h is formed by selectively drilling by exposure and development. Also good.

(C) Next, as shown in FIG. 9C, the protective film 13 is removed.
(D) Next, a member 17a in which bumps 14, 14,... Are formed on one main surface of the wiring film forming copper foil 23 is prepared, and the member 17a is formed on each of the bumps 14, 14,. · Is aligned so as to correspond to the bump-corresponding holes 18h, 18h, ... of the laminated body (laminated body obtained by laminating the resin film 18 on the copper foil 23) and face the hole forming surface of the laminated body. . FIG. 9D shows a state in which the member 17 faces the laminated body.

(E) Thereafter, when the member 17a and the laminated body are laminated by pressing, the resin film 18 is used as an interlayer insulating film, and the bumps corresponding to the bump corresponding holes 18h, 18h,. The positioned wiring board 11c is completed. FIG. 9E shows the wiring board 11c.

  A wiring board can also be obtained by such a method. According to such a method, the bumps 14, 14,... Corresponding to the bumps 14, 14,. It is possible to reduce contamination by dust and debris caused by the resin film 18 that is generated when the resin film 18 is pushed into and inserted into the resin film 18.

  As the upper member 17a, a member 17 formed by the method shown in FIGS. 1A to 1C is prepared, and the bump corresponding holes 18h, 18h,. After that, the resin film 13 is peeled off before pressing the resin film 13 [refer to the first resin film 13 in FIGS. 1A to 1C], and further, copper for forming the wiring film It can be obtained by stacking the foils 23 and then pressing them.

  Further, the protective film 13 shown in FIG. 9A is made of a photoresist, patterned by exposure and development, and etched by using the patterned protective film 13 as a mask to etch the bumps. Corresponding holes 18h, 18h, ... may be formed. In this embodiment, a porous polyimide resin (for example, manufactured by Nitto Denko) may be used as the resin film 18. This is because, since it is porous, the penetrability by the bumps 14, 14,... Is good, and contamination or the like does not occur. That is, as described above, when a normal resin that is not porous is penetrated by the bumps 14, 14,..., The resin is not easily penetrated, and the resin is distorted and dust and debris are generated, which becomes a contamination source. Therefore, as described above, a cleaning process is required. However, if the penetrability is good, there is little contamination and the cleaning process is simple or unnecessary. By the way, there are a closed cell type and an open cell type of porous resin such as a porous polyimide resin, and the closed cell type has better penetrability and is less likely to cause contamination.

  FIGS. 10A to 10G show a fifth embodiment of the present invention and are cross-sectional views sequentially showing the steps of a method for manufacturing a wiring board. (A) First, as shown in FIG. 10 (A), a laminate is prepared in which an upper mold 80 is laminated on a resin film 18 to be an interlayer insulating film. The upper mold 80 is made of metal (for example, SUS) or resin, and has bump corresponding holes 82, 82,... Corresponding to bumps (14, 14,...) Described later. The bump-corresponding holes 82, 82,... Are masked by, for example, applying a photoresist on the upper die 80 adhered on the resin film 18, and exposing and developing the photoresist. It can be formed by etching the upper mold 80 using the mask film made of the photoresist as a mask. However, the bump corresponding holes 82, 82,... Of the upper mold 80 may be formed at a stage where the upper mold 80 is not adhered to the resin film 18.

(B) Next, as shown in FIG. 10B, a member 17b in which bumps 14, 14,... Are formed on a lower mold 84 made of metal (for example, SUS) or resin is prepared. Bumps 14, 14,... 17 b above the formation surface, the bumps 14 corresponding to the bumps 82, 82,. 14... Are aligned so that they are aligned.
(C) Next, as shown in FIG. 10C, the upper mold 80 is pressurized toward the lower mold 84 so that the resin film 18 is penetrated by the bumps 14, 14,. To do.

(D) Next, as shown in FIG. 10 (D), the upper mold 80 is removed. Here, resin penetration, debris, and the like are generated by this penetration, and thereby the surface of the resin film 18 is contaminated. Therefore, it is preferable to clean after the pressurizing step.
(E) Next, as shown in FIG. 10 (E), the lower mold 84 is removed.
(F) Next, as shown in FIG. 10 (F), the copper foils 23 and 23 for forming a wiring film are allowed to face both surfaces of the resin film 18 penetrated by the bumps 14, 14.
(G) Thereafter, the copper foils 23 and 23 for forming a wiring film are pressed and laminated on the resin film 18. Then, the wiring board 11d is completed.

Also in this embodiment, as in the fourth embodiment, a porous polyimide resin (for example, manufactured by Nitto Denko) may be used as the resin film 18.
(Modification)

11A to 11E are cross-sectional views showing the main part of the modification of the manufacturing method shown in FIG. 10 in the order of steps.
(A) First, as shown in FIG. 11 (A), an upper mold 80a is prepared on a resin film 18 serving as an interlayer insulating film. The upper mold 80a is the same as in the manufacturing method shown in FIG. 10 in that the material is made of metal (for example, SUS) or resin, but a material thinner than that is used. Specifically, a material having a thickness that is only about the height of the bump 14 minus the thickness of the resin film 18 is used.

(B) Next, as shown in FIG. 11B, bump corresponding holes 82a, 82a,... Corresponding to the bumps 14, 14,. The formation method of the bump corresponding holes 82a, 82a,... May be the same as the manufacturing method shown in FIG.
(C) Next, the adhesive-attached film 86 is bonded onto the upper mold 80a. Reference numeral 88 denotes a main body of the film 86, and reference numeral 90 denotes an adhesive. This adhesive-attached film 86 is for reducing contamination by dust and debris from the resin by penetrating the resin film 18 with bumps 14, 14,... In a later step.

Then, the film 86 with the adhesive, the upper mold 80a and the resin film 18 adhered to the film, and the member 17b [with the bumps 14, 14,... Formed on one main surface of the lower mold 84: FIG. The bump corresponding holes 82a, 82a,... Are aligned and faced with the bumps 14, 14,. . FIG. 11 (C) shows the state where it is faced.
(D) Next, the upper mold 80 is pressed against the lower mold 84 so that the resin film 18 is penetrated by the bumps 14, 14. FIG. 11D shows this state. In addition, it can be said that resin dust, debris, etc. are generated by this penetration.

(E) Next, the film 86 with the adhesive is removed together with the upper mold 80a adhered to the film 86 by the adhesive 90. Then, the resin dust, debris, etc. generated by the penetration are removed together with the adhesive-attached film 86 and the upper mold 80a, and the contamination of the wiring board by the resin debris, debris, etc. is almost eliminated. FIG. 11 (E) shows a state after removal of the adhesive-attached film 86 and the upper mold 80a. Thereafter, the wiring substrate 11d is obtained by the same method as shown in FIGS. According to such a manufacturing method, as described above, there is almost no contamination of the wiring board due to dust, debris, etc. due to resin, so that it can be said that it is superior to the method shown in FIG.
In this modification as well, in order to further reduce contamination, a porous polyimide resin (for example, manufactured by Nitto Denko) may be used as the resin film 18 forming the interlayer insulating film.

FIGS. 12A to 12E show a sixth embodiment of the present invention and are cross-sectional views sequentially showing steps of a method of manufacturing a wiring board. In the present embodiment, the bump height is, for example, twice or more higher than that of the embodiment shown in FIGS.
(A) First, as shown in FIG. 12A, a bump forming copper foil 110 is prepared that is appropriately thicker (eg, 150 μm) than the desired bump height (eg, 100 μm).

(B) Next, as shown in FIG. 12B, half bumps 14a, 14a,... Are selectively performed by half-etching (for example, 75 μm etching) from one main surface of the bump-forming copper foil 110. .. form.
(C) Next, a resin film 112 forming an interlayer insulating film is penetrated by the half bumps 14a, 14a, ... on the formation surface of the half bumps 14a, 14a, ... of the bump forming copper foil 110. Then, the wiring film forming copper foil 114 is pressed and integrated with the resin film 112 and the half bumps 14a, 14a,. FIG. 12C shows a state after integration by the press.

(D) Next, the half bumps 14a, 14a are selectively etched by half etching (about 75 μm etching) from the other surface (surface opposite to the surface on which the half bumps 14a are formed). Are formed as half bumps 14b, 14b,... Forming bumps 14, 14,. FIG. 12D shows a state after the half bumps 14b are formed.
(E) A resin film 112 forming an interlayer insulating film is penetrated by the half bumps 14b, 14b, ... on the formation surface of the half bumps 14b, 14b, ... of the bump forming copper foil 110. Further, the wiring film forming copper foil 114 is pressed onto the resin film 112 and the half bumps 14b, 14b,. FIG. 12E shows a state after the integration by the press.

  In such a wiring board 11h, the bumps 14 can be made high without restricting increasing the arrangement density. That is, there may be a case where a low wiring board having a bump 14 height of about 50 μm is required, or a bump wiring board having a higher height, for example, about 100 μm. A high-bump wiring board can be formed by selectively etching a thick copper foil as a base, but the selective etching usually involves side etching, and the side etching amount is approximately equal to the etching depth. Proportional. Therefore, the side etching amount is increased as the bumps are higher, and the integration density is lowered. However, half bumps (14a, 14b) are formed by half etching from both sides of the thick bump forming copper foil 110 (half etching at the same time or simultaneous), and one half bump (14a, 14b) is combined. If the bumps 14 are formed, the high bumps 14, 14,... Can be formed with a small amount of side etching. Therefore, it is possible to obtain the wiring board 11 in which the bumps 14 are increased without restricting the increase in the arrangement density.

FIGS. 13A to 13C show a seventh embodiment of the present invention and are cross-sectional views sequentially showing the steps of a method for manufacturing a wiring board. In this embodiment, the limit on the pitch of the bumps 14 is to be overcome by laminating a plurality of members.
(A) First, a part of the steps of the first embodiment, that is, steps (A) to (F) of FIG. 1 are executed to form one wiring film connecting member 22 (FIG. 13A). )).

  Next, a part of the steps of the first embodiment, that is, (A) to (C) of FIG. 1 are executed to form another first member 32 (FIG. 13 (A)). Here, the reason for refusing “another” is that the first member 17 is formed even during the formation of the one inter-wiring film connecting member 22 (FIGS. 1A to 1F). (C)) in the middle of ()) for the sake of clarity that it is a first member formed separately (the same shall apply hereinafter).

(B) Next, both of them are overlapped in the positional relationship as shown in FIG. 13A, and the top of the bump 14 of another first member 32 is the second resin of the wiring film connecting member 22. The other first member 32 and one wiring film connecting member 22 are laminated so as to be exposed from the film 18. Thus, another second member 33 is formed (FIG. 13B).
(4) Next, the other first resin film 34 is removed from the other second member 33. Thus, a new inter-wiring-film connecting member 31 is formed in which the substantially conical bumps 14 are embedded in the second resin film 18 (FIG. 13C).

  The P (: pitch) of the bumps 14 of this new wiring film connecting member 31 is, for example, 0.2 mmP, and each of the original wiring film connecting member 22 and the other first member 32 is the original. The pitch of the bumps 14 is, for example, half of 0.4 mmP. Although the stacking direction is, the stacking may be performed such that the direction of the bumps 14 is opposite to each other as in the wiring film connecting member 36 shown in FIG. Further, the number of times of lamination is not limited to once as in the wiring film connecting member 31 of the second embodiment, and may be twice or three times. Further, the diameter of the bumps 14 may be different between another first member 32 and one wiring film connecting member 22.

FIGS. 15A and 15B show an eighth embodiment of the present invention, and are sectional views showing a method of manufacturing a wiring board in the order of steps. In this embodiment, the multilayer wiring board 41 is formed by batch pressing.
(A) First, for example, three wiring film connecting members 46 to 48 are arranged between four double-sided wiring boards 42 to 45 (FIG. 15A).

(B) Next, these are collectively pressed at high temperature. Thereby, the multilayer wiring board 41 is completed (FIG. 15B). In this case, each of the four double-sided wiring boards 42 to 45 is formed by performing all of the steps of the first embodiment and further patterning the copper foil 23 for forming the wiring film. The inter-connection members 46 to 48 are formed by executing a part of the steps of the first embodiment (FIGS. 1A to 1F).

FIGS. 16A to 16E show a ninth embodiment of the present invention and are sectional views sequentially showing the steps of a method of manufacturing a wiring board.
(A) As shown in FIG. 16A, a three-layered metal laminate 90 is prepared. The three-layer metal laminate 90 is formed on the surface of a bump forming copper foil 92 having a thickness of, for example, about 100 μm via an etching barrier layer 92 made of, for example, nickel having a thickness of about 0.1. For example, a copper foil 94 having a thickness of, for example, about 18 μm is laminated.

(B) Selective etching for the copper foil 94 (patterning is performed by applying a photoresist, exposing and developing the photoresist, and then using the patterned photoresist as a mask), and then patterning the pattern. The etching barrier layer 92 is etched using the copper foil 94 as a mask, and then the resin film 98 is adhered to the surface of the three-layered metal laminate 90 on the copper foil 94 and the etching barrier layer 92 side. FIG. 16B shows the state after the bonding. The resin film 98 has a property that the adhesive strength disappears due to heat or ultraviolet rays and the resin does not transfer to another film (for example, as a sheet whose adhesiveness disappears due to heat, Nitto Denko, product name: Riba Alpha).

(C) Next, as shown in FIG. 16C, bumps 14, 14,... Are formed by selectively etching the bump forming copper foil 92 from the back surface (lower surface) side.
(D) Next, as shown in FIG. 16 (D), a state in which the resin film 18 to be an interlayer insulating film is laminated on the resin film 98 so as to penetrate the bumps 14, 14,. To.

(E) Next, the resin film 98 is irradiated with, for example, ultraviolet rays to remove its adhesive force and removed. FIG. 16E shows a wiring board 11e formed by removing the resin film 98. FIG. The wiring board 11e is greatly different from the wiring boards 11 and 11a to 11d in that a wiring film is formed only on one main surface.

17A and 17B show an example of a manufacturing method in which a large number of such wiring boards 11d are stacked to obtain a highly integrated multilayer wiring board.
(A) First, as shown in FIG. 17A, a predetermined number of wiring boards 11d, 11d,... Are prepared and overlapped in a predetermined positional relationship.

(B) Next, as shown in FIG. 17 (B), the predetermined number of wiring boards 11d, 11d,... Thus, a highly integrated multilayer wiring board can also be obtained by laminating and integrating a large number of wiring boards 11d each having a wiring film formed on only one main surface.

FIGS. 18A to 18E show a tenth embodiment of the present invention and are sectional views sequentially showing the steps of a method for manufacturing a wiring board.
(A) First, as shown in FIG. 18A, a wiring film forming copper foil 23 bonded to one main surface of the adhesive sheet 100 is prepared.
(B) Next, as shown in FIG. 18B, the wiring film forming copper foil 23 is patterned by, for example, photoetching to form a wiring film.

(C) Next, as shown in FIG. 18C, bumps 14a, 14a,... Made of a conductive pace film are formed on the wiring films 23, 23,. The conductive paste is a paste formed by mixing a metal powder such as silver or copper, a binder, and a solvent.
(D) Next, as shown in FIG. 18D, a state in which the resin film 18 serving as an interlayer insulating film is bonded to the adhesive sheet 100 so as to penetrate the bumps 14a, 14a,. To.

(E) Thereafter, the adhesive sheet 100 is removed. Accordingly, FIG. 18E shows the wiring board 11f formed by removing the adhesive sheet 100. FIG. This wiring board 11f is greatly different from the wiring boards 11 and 11a to 11d in that the wiring film is formed only on one main surface, and the bump 14a is formed from a conductive paste. It is different from any of the wiring boards 11 and 11a to 11e.

19A and 19B show an example of a manufacturing method in which a large number of such wiring boards 11f are stacked to obtain a highly integrated multilayer wiring board.
(A) First, as shown in FIG. 19A, a predetermined number of wiring boards 11f, 11f,... Are prepared and overlapped in a predetermined positional relationship.

(B) Next, as shown in FIG. 19 (B), the predetermined number of wiring boards 11f, 11f,... Thus, a highly integrated multilayer wiring board can also be obtained by forming a wiring film only on one main surface and stacking and integrating a large number of wiring boards 11f with bumps 14a made of a conductive paste.

FIGS. 20A to 20D show an eleventh embodiment of the present invention, which is a cross-sectional view sequentially showing the steps of a method for forming a multilayer wiring board. A wiring pattern is formed on both surfaces of the member 22 by a semi-additive method.
(A) First, a copper foil 53 having a thickness of 3 μm carried on an aluminum carrier 52 is laminated and pressed on both surfaces of the inter-wiring film connecting member 22 (FIG. 20A).

(B) Next, the aluminum carrier 52 is peeled off by etching to expose the copper foil 53 laminated on both surfaces of the wiring film connecting member 22 (FIG. 20B).
(C) Next, a plating resist reverse to the required pattern is formed (not shown). Using these copper foils 53 as conductive films, wiring patterns 54 are formed on the surfaces of the respective copper foils 53 by plating. The resist is removed (FIG. 20C).

(D) Next, the 3 μm copper foil 53 is etched away by quick etching. At this time, the pattern 54 is etched at the same time, but the amount is a little, and there is no problem as a pattern. Thereby, the multilayer wiring board 51 provided with the wiring patterns 54 on both sides is completed (FIG. 20D).

  A porous polyimide resin (for example, manufactured by Nitto Denko) may be used as the resin film 18. This is because, since it is porous, the penetrability by the bumps 14, 14,... Is good, and contamination or the like does not occur. That is, when a normal resin that is not porous is penetrated by the bumps 14, 14,... However, when a porous resin film is used, since the penetrability is good, there is little such contamination. In addition, there are a closed cell type and an open cell type of porous resin such as a porous polyimide resin, and the closed cell type has better penetrability and is less prone to contamination.

FIGS. 21A and 21B show a twelfth embodiment, which is a cross-sectional view sequentially showing the steps of the method for forming a multilayer wiring board. In this embodiment, bumps 14 are stacked in two stages. is there.
(A) First, two wiring film connecting members 22 are stacked and a copper foil 23 serving as a wiring film is disposed above and below (FIG. 21A).

(B) Next, these are collectively pressed at high temperature. Thus, the multilayer wiring board 61 in which the bumps 14 are stacked in two stages is completed (FIG. 21B). Originally, when it is desired to increase the bump, simply increasing the thickness of the bump forming metal layer 12 increases the diameter of the skirt as a result of the higher bump, even if the top diameter of the bump is the same. The bump pitch must be large. However, when the method of overlapping the bumps 14 as in the fifth embodiment is used, the diameter of the hem portion of each bump 14 is maintained to be a thin ridge because there is no height of each bump 14. As a result, the pitch of the bumps 14 can be kept small. In addition, in the said Example, it was trying to overlap in 2 steps | paragraphs, However, it is also possible to overlap | stack in more stages.

FIGS. 22A to 22D show a thirteenth embodiment of the present invention and are cross-sectional views sequentially showing steps of a method of manufacturing a wiring board.
(A) First, as shown in FIG. 22A, a three-layer structure metal laminate 90 is prepared. The three-layered metal laminate 90 is formed on the surface of a bump forming copper foil 92 having a thickness of about 100 μm, for example, via an etching barrier layer 94 made of nickel having a thickness of about 0.1 μm. For example, a copper foil 96 having a thickness of, for example, about 9 μm is laminated.

(B) Next, as shown in FIG. 22B, bumps 14, 14,... Are formed by subjecting the copper foil 92 for bump formation of the metal laminate 90 to selective etching. To do. In this case, the etching barrier layer 94 prevents etching of the wiring film forming copper foil 96. Then, in order to avoid a state in which the bumps 14, 14,... Are electrically connected via the etching barrier layer 94, the etching barrier layer 94 using the bumps 14, 14,. Is selectively removed.

(C) Next, a bump-forming surface of the laminate 90 is formed such that a resin film 98 such as a polyimide resin film or a thermosetting resin, which becomes an interlayer insulating film, is penetrated by the bumps 14, 14. Laminate to. FIG. 22C shows the stacked state.
(D) Thereafter, a selective etching process is performed on the wiring film forming copper foil 96 to form a wiring film 96 as shown in FIG. 22D, thereby forming a wiring board 11h.

  The wiring board 11h is optimal as a contactor for a bare chip or wafer burn-in test, for example. FIG. 23 is a cross-sectional view showing a state in which the wiring board 11h is used as a contact burner for wafer burn-in. In FIG. 23, reference numeral 100 denotes a semiconductor wafer, reference numerals 102, 102,. The test circuit side connector 16, 106,... Is a terminal thereof, and a wiring board 11 h is interposed as a contactor between the terminals 106, 106,. The electrical connection between them is maintained during the burn-in test.

  A porous polyimide resin (for example, manufactured by Nitto Denko) may be used as the polyimide resin. This is because, since it is porous, the penetrability by the bumps 14, 14,... Is good, and contamination or the like does not occur. Porous resins, such as porous polyimide resins, are classified into closed cell type and open cell type. The closed cell type has better penetrability and is less prone to contamination.

  FIGS. 24A to 24D show a fourteenth embodiment and sequentially show the steps of the method of forming the multilayer wiring board. In this embodiment, as the wiring film connecting member 22, the upper and lower ends of each bump 14 protrude from the upper and lower surfaces of the second resin film 18, and the insulating resin film 72 is formed on the upper and lower surfaces of the member 22. In this method, a multilayer wiring board having two wiring films 73 formed on one surface and having wiring films 73 on both surfaces is obtained.

(A) As shown in FIG. 24A, a sheet (which may be insulative or metal) 72 is laminated with a metal foil 73 such as copper, which becomes a wiring film.
(B) Next, the metal foil 73 is selectively etched to be patterned to form a wiring film 73 (FIG. 24B), whereby a single-sided wiring board 74 in which the wiring film 73 is formed only on one side. Get.

(C) Next, as shown in FIG. 24C, the upper and lower ends of each bump 14 project from the upper and lower surfaces of the second resin film 18 as wiring film connecting members, and FIG. A) and two single-sided wiring boards 74 obtained as shown in (B) are prepared, and the single-sided wiring boards 74 and 74 and the wiring film 73 are used as members on both sides of the wiring film connecting member 22. It faces in the direction facing 22 side, and it faces (position which makes the positional relationship between the bump 14 and the wiring films 73 and 73 of each single-sided wiring boards 74 and 74 as predetermined) face.

(D) Next, the wiring film connecting member 22 and the single-sided wiring boards 74, 74 are integrated at room temperature or by thermocompression bonding. Then, it integrated so that the surface of the wiring film 73 of each single-sided wiring board 74 and the surface of the 2nd resin film 18 may be located on the same plane, ie, the surface of the wiring film 73 is the surface of the resin film 18 A multilayer wiring board having wiring films 43 on both surfaces embedded so as to be located on the same plane is obtained. Thereafter, the upper and lower sheets 72, 72 are peeled off and removed. FIG. 24D shows a state after the peeling.

  The multilayer wiring board having the double-sided wiring shown in FIG. 24D has no unevenness on both sides with the wiring film 73, that is, it is flat, so that it is difficult to warp, and the solder resist film can be easily formed. Film defects are less likely to occur, and a good solder resist film can be formed. In addition, when one or more other wiring boards are laminated on such a multilayer wiring board to obtain a multilayer wiring board having a larger number of layers, it is necessary to use a board having both sides flat as the multilayer wiring board. It becomes a factor that facilitates the lamination, and improves reliability and quality.

FIGS. 25A to 25C show a fifteenth embodiment and sequentially show the steps of a method for forming a multilayer wiring board. In this embodiment, a multi-layer wiring board having through holes is prepared as a wiring board to be a core, inter-wiring connecting members having bumps are laminated on both surfaces, and the metal foil on the surface is selectively etched to perform wiring. A film is formed.
(A) As shown in FIG. 25 (A), a multi-layered wiring board 75 that has a through hole as a core, two wiring film connecting members 22 shown in FIG. 1 (G), a wiring film, Two metal foils 23 are prepared, and the inter-wiring film connecting members 22 and 22 are aligned and faced on both surfaces of the multilayer wiring board 75 serving as a core. Further, the inter-wiring film connecting members 22 and 22 The metal foils 23 and 23 are exposed to the outside.

Here, the wiring board 75 serving as the core will be described. 77 is an insulating plate, 78 is a through-hole formed in the insulating plate 77, 79 is a wiring film for connecting the upper and lower wirings formed on the surface of the through-hole 77, and is made of, for example, a plating film, so-called through holes, It can be formed by a technique known as a via hole forming technique.
(B) Next, the multilayer wiring board 75 having the through hole as the core, the two members 22 for connecting the wiring films, and the two metal foils 23 as the wiring films are pressed or heated at room temperature. As shown in FIG. 25B, they are integrated by pressure bonding.

(C) Next, as shown in FIG. 25C, the metal foils 23, 23 on both the upper and lower surfaces are photoetched to form a wiring film. As a result, a four-layer wiring board is completed.
According to such an embodiment, the multilayer wiring board 75 that can sufficiently secure the mechanical strength manufactured by the conventional general method is used as the core, and the inter-wiring film connecting members 22 and 22 are formed on the multilayer wiring board 75. By applying the utilized multilayer wiring technology, a thick and strong multilayer wiring board can be obtained.

  INDUSTRIAL APPLICABILITY The present invention has wide industrial applicability to a multilayer wiring board manufacturing method, a wiring film connecting member used therefor, and a manufacturing method therefor.

(A)-(H) show the first embodiment, and are cross-sectional views showing a method of forming a multilayer wiring board in the order of steps, and (F ') shows a modification of (F). (A)-(C) are sectional drawings which show an example of the method of laminating | stacking the 2nd resin film which is an insulating film of the said 1st Example, and a 1st member in order of a process. (A)-(C) are sectional drawings which show one example of the manufacturing method of the member for wiring film connection shown in FIG.1 (F ') in order of a process. (A)-(C) are sectional drawings which show another example of the manufacturing method of the member for wiring film connection shown in FIG.1 (F ') in order of a process. (A)-(C) show the modification of a 1st Example, and are sectional drawings which show the process of the manufacturing method of a wiring board in order. It is sectional drawing which shows an example of the process of laminating | stacking the copper foil for wiring film formation on the member for wiring film connection. (A)-(E) show the 2nd example of the present invention and are sectional views which show the process of the manufacturing method of a wiring board in order. (A)-(D) show the 3rd Example of this invention, and are sectional drawings which show the process of the manufacturing method of a wiring board in order. (A)-(E) show the 4th example of the present invention and are sectional views which show the process of the manufacturing method of a wiring board in order. (A)-(G) show the 5th example of the present invention and are sectional views which show the process of the manufacturing method of a wiring board in order. (A)-(E) are sectional drawings which show the principal part of the modification of the manufacturing method shown in the said FIG. 10 in order of a process. (A)-(E) show the 6th example of the present invention and are sectional views which show the process of the manufacturing method of a wiring board in order. (A)-(C) show the 7th example of the present invention and are sectional views which show the process of the manufacturing method of a wiring board in order. FIG. 14 is a cross-sectional view showing an example of a member for connecting between wiring films, which is a modification of the embodiment shown in FIG. 13, and is alternately laminated so that the directions of bumps are adjacent to each other. (A), (B) shows the 8th example of the present invention and is a sectional view showing a manufacturing method of a wiring board in order of a process. (A)-(E) show the 9th example of the present invention and are sectional views which show the process of the manufacturing method of a wiring board in order. (A) and (B) show an example of a manufacturing method for obtaining a highly integrated multilayer wiring board by laminating a number of wiring boards manufactured by the method shown in FIG. (A)-(E) are the 10th Examples of this invention, and are sectional drawings which show the process of the manufacturing method of a wiring board in order. (A) and (B) show an example of a manufacturing method for obtaining a highly integrated multilayer wiring board by laminating a number of wiring boards manufactured by the method shown in FIG. (A)-(D) show the 11th Example of this invention, and are sectional drawings which show the process of the method of forming a multilayer wiring board in order. (A), (B) shows a twelfth embodiment and is a cross-sectional view sequentially showing the steps of a method for forming a multilayer wiring board. (A), (B) is a sectional view showing steps of a method for forming a multilayer wiring board in order, showing a twelfth embodiment. (A)-(D) show the 13th Example of this invention, and are sectional drawings which show the process of the manufacturing method of a wiring board in order. (A)-(D) show the 14th Example and show the process of the formation method of a multilayer wiring board in order. (A) to (C) show the fifteenth embodiment, which sequentially shows the steps of the method of forming the multilayer wiring board. (A)-(G) are sectional drawings which show the process of the formation method of the conventional multilayer wiring board in order. It is sectional drawing which shows the example of the limit of the pitch of a bump.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Multilayer wiring board, 12 ... Copper foil, 13 ... 1st resin film, 14 ... Bump,
16 ... etching resist pattern, 17 ... first member,
18 ... 2nd resin film (insulating film for interlayer insulation), 19 ... 2nd member,
21 ... Grinding stone, 22 ... Member for connecting between wiring films, 23 ... Metal (copper) foil for forming wiring films,
24 ... high temperature roller, 31 ... member for connecting between wiring films, 32 ... another first member,
33 ... Another second member, 34 ... Another first resin film, 36 ... Wiring film connecting member, 41 ... Multi-layer wiring board, 42-45 ... Double-sided wiring board, 46-48 ... Wiring film connecting Materials,
51 ... Multilayer wiring board, 52 ... Aluminum carrier, 53 ... Copper foil, 54 ... Wiring pattern, 61 ... Multilayer wiring board, 72 ... Carrier, 73 ... Copper foil,
75: A wiring board having through holes. 80 ... mold (upper mold), 82 ... bump corresponding hole,
84 ... Mold (lower mold), 86 ... Resin with adhesive, 110 ... Metal foil for bump formation,
112 ... Insulating film for interlayer insulation, 114 ... Metal foil for forming a wiring film.

Claims (9)

Prepare one with multiple conical-shaped bumps on one main surface of the carrier,
Laminating an insulating film for interlayer insulation on the one main surface of the carrier so that the insulating film itself penetrates the bump,
Laminating a metal foil for forming a wiring film on the surface of the insulating film opposite to the carrier,
Remove the carrier,
A wiring film forming metal foil different from the wiring film forming metal foil is laminated on the surface of the insulating film from which the carrier has been removed, and the bump, the insulating film, and the two wiring film forming metal foils are integrated. A method for manufacturing a multilayer wiring board. Prepare one that has a plurality of bumps in the shape of a conical shape on one main surface of the carrier that will be the interlayer insulation film,
The bumps penetrate the carrier,
A method for producing a multilayer wiring board, comprising: laminating a metal foil for forming a wiring film on both surfaces of the carrier, and integrating the carrier, the bump, and the two metal foils for forming a wiring film. A member having a plurality of bumps formed on one main surface of one metal foil for forming a wiring film and an insulating film for interlayer insulation are stacked on one main surface of another metal foil for forming a wiring film. Prepare a member in which a plurality of bump corresponding holes corresponding to the plurality of bumps are formed in the film,
The two members are aligned and laminated so that each bump of the one member is aligned with each corresponding bump hole corresponding to that of the other member, and the bump, insulating film, and two wiring films are formed. A method for producing a multilayer wiring board, comprising integrating a metal foil. A member having a plurality of bumps formed on one main surface of one mold and another mold on one main surface of an insulating film for interlayer insulation, and corresponding bump holes corresponding to the bumps are formed on the mold. Prepare the parts
Apply the insulating film of the other member to the bump forming side of the member on which the bump is formed so that the corresponding ones of the bump corresponding hole and the bump are aligned with each other,
Applying pressure to the two molds so that the insulating film penetrates the bumps,
After removing the two molds, a metal foil for forming a wiring film is laminated on both surfaces of the insulating film, and the insulating film, the bump, and the two metal foils for forming a wiring film are integrated. A method for manufacturing a multilayer wiring board. As the mold in which the bump-corresponding hole is formed, a type in which a resin film with an adhesive is adhered to the surface opposite to the insulating film of the mold with the adhesive,
After applying pressure to the two molds so that the insulating film penetrates the bumps, when removing the two molds, the mold having the bump corresponding holes is removed by peeling the resin film. It removes through the said adhesive agent. The manufacturing method of the multilayer wiring board of Claim 4 characterized by the above-mentioned. Forming a plurality of half bumps by half-etching from one main surface side of the metal foil for bump formation;
Laminating an insulating film for interlayer insulation on the one main surface of the bump forming metal foil so as to be penetrated by the half bumps;
Laminating a metal foil for forming a wiring film connected to the half bumps on the surface of the insulating layer;
Forming a plurality of half bumps that form a bump by integrating with the half bump by half etching from the other main surface side of the bump forming metal foil; and
Laminating an insulating film for interlayer insulation on the other main surface of the bump forming metal foil so as to be penetrated by the half bumps;
Laminating a metal foil for forming a wiring film connected to the half bumps on the surface of the insulating layer;
A method for producing a multilayer wiring board, comprising: Laminating a carrier layer on the bump forming metal layer;
Forming a resist pattern on a surface opposite to the surface on which the carrier layer of the bump forming metal layer is laminated;
Etching the bump-forming metal layer using the resist pattern as a mask to form a first member in which a substantially cone-shaped bump protrudes from the carrier layer;
Stacking an insulating film on the first member so that the top of the bump is exposed from the insulating film, and forming a second member;
Removing the carrier layer from the second member to form one wiring film connecting member;
Laminating a carrier layer different from the carrier layer on a bump forming metal layer different from the bump forming metal layer;
Forming a resist pattern different from the resist pattern on a surface opposite to the surface on which the another carrier layer of the another bump forming metal layer is laminated;
Etching the other bump forming metal layer using the other resist pattern as a mask to form another first member having substantially conical bumps protruding from the other carrier layer;
The another first member and the one wiring film connecting member are laminated so that the tops of the bumps of the other first member are exposed from the insulating film of the one wiring film connecting member. Forming a second member different from the second member;
Removing the other carrier layer from the second member to form a new inter-wiring film connecting member in which substantially conical bumps are embedded in the insulating film;
A method for producing a member for connecting between wiring films, comprising: Forming a conductive film on a wiring film connecting member in which substantially conical bumps are embedded in an insulating film; and
Forming a wiring pattern by plating on the conductive film;
Removing the conductive film by quick etching;
A method for producing a multilayer wiring board, comprising: A member for interconnecting wiring films, wherein a plurality of members each having a substantially conical-shaped bump embedded in an insulating film are laminated so that each bump overlaps.

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