JP2006311575A - Two-dimensional image pickup apparatus - Google Patents

Two-dimensional image pickup apparatus Download PDF

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JP2006311575A
JP2006311575A JP2006127554A JP2006127554A JP2006311575A JP 2006311575 A JP2006311575 A JP 2006311575A JP 2006127554 A JP2006127554 A JP 2006127554A JP 2006127554 A JP2006127554 A JP 2006127554A JP 2006311575 A JP2006311575 A JP 2006311575A
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photoelectric conversion
dimensional
container
housing
substrate
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JP3815792B1 (en
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Fumio Hata
文夫 畑
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Canon Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To structurally adapt a two-dimensional image pickup apparatus to absorb external impacts and deformation such as the deflection of the cabinet so that the interior is protected against damage and keep restorableness even if the cabinet is deformed by an external load. <P>SOLUTION: The two-dimensional image pickup apparatus contains in an apparatus cabinet 8, a two-dimensional photoelectric converting device including a plurality of photoelectric converters 2a formed on a substrate 2b, and a phosphor 1 arranged on the plurality of photoelectric converters 2a. A shock absorber 9 is included between the phosphor 1 and a portion of the apparatus cabinet 8 facing a light-receiving portion of the photoelectric converting device. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、二次元撮像装置に関し、更に詳しくは、X線撮影などに用いることができる二次元撮像装置に関するものである。   The present invention relates to a two-dimensional imaging apparatus, and more particularly to a two-dimensional imaging apparatus that can be used for X-ray imaging and the like.

X線撮影などに用いる撮像装置は、例えば、図1に示されるように、X線を可視光に変換する蛍光板1と、この可視光を電気信号に変換する光電変換素子2aと、この光電変換素子2aをその上に形成した基板2bと、この基板2bを支持する基台7と、光電変換された電気信号を処理する回路基板5a、5bと、これらの配線と、これらを収容する装置筐体8とを有している。   As shown in FIG. 1, for example, an imaging apparatus used for X-ray imaging includes a fluorescent plate 1 that converts X-rays into visible light, a photoelectric conversion element 2a that converts this visible light into an electrical signal, and this photoelectric conversion. A substrate 2b on which the element 2a is formed, a base 7 for supporting the substrate 2b, circuit boards 5a and 5b for processing photoelectrically converted electric signals, these wirings, and a device housing for housing them. And a body 8.

ここで、光電変換素子2aの基板2b(以下、基板という)には、半導体素子との化学作用のないこと、半導体形成プロセスの温度に耐えること、寸法安定性、などの必要性から、ガラス板が多く用いられる。また、蛍光体である蛍光板1には、金属化合物の蛍光物質を樹脂板に塗布したものが用いられる。蛍光板1と光電変換素子2aの間隔は、光電変換素子2aの画素寸法(例えば、数百マイクロメートル程度)に比べ、充分小さい値(例えば、数十マイクロメートル以下)に保持する必要があり、実用上は、蛍光板1と基板2bとを接着している。なお、図では蛍光板1および不透湿フィルム6を含めて、基板2b上に形成された部材を総称して、光学変換装置102と称している。   Here, the substrate 2b (hereinafter referred to as the substrate) of the photoelectric conversion element 2a is made of a glass plate because of the necessity of having no chemical action with the semiconductor element, withstanding the temperature of the semiconductor formation process, dimensional stability, and the like. Is often used. In addition, as the fluorescent plate 1 which is a fluorescent material, a metal plate fluorescent material applied to a resin plate is used. The distance between the fluorescent plate 1 and the photoelectric conversion element 2a must be kept at a sufficiently small value (for example, several tens of micrometers or less) compared to the pixel size (for example, about several hundred micrometers) of the photoelectric conversion element 2a. In the upper part, the fluorescent plate 1 and the substrate 2b are bonded. In the figure, members formed on the substrate 2 b including the fluorescent plate 1 and the moisture-impermeable film 6 are collectively referred to as an optical conversion device 102.

また、光電変換素子2aに耐湿性が求められる場合、不透湿性で、しかも、X線透過性のフィルム6により、蛍光板1と光電変換素子2aとを密封することがある。そして、これらを基台7に接着固定した上で、装置筐体8に収め、X線撮像装置が構成される。   Moreover, when moisture resistance is calculated | required by the photoelectric conversion element 2a, the fluorescent plate 1 and the photoelectric conversion element 2a may be sealed with the film 6 which is impermeable to moisture and X-ray transmissive. These are bonded and fixed to the base 7 and then housed in the apparatus housing 8 to constitute an X-ray imaging apparatus.

この種の撮像装置は、定置式のX線撮影装置に利用されていたが、より迅速かつ高精度な撮影を可能にするため、近年、軽量で小型な、可搬型の撮像装置が求められるようになってきた。   This type of imaging apparatus has been used in stationary X-ray imaging apparatuses, but in recent years, a lightweight, small, and portable imaging apparatus has been required to enable faster and more accurate imaging. It has become.

そして、上記の構成では、運搬時に加わる衝撃から、基板2bなどを保護する目的、及び、X線撮影時に加わる外部荷重201(主に、被写体である人体の荷重など)による変形を防止することが要求されるため、基台7、装置筐体8を強固な構造とする必要があり、これを満足するために、前述の撮像装置の小型化、軽量化の妨げになっていた。   In the configuration described above, it is possible to protect the substrate 2b and the like from an impact applied during transportation, and to prevent deformation due to an external load 201 (mainly a human body load that is a subject) applied during X-ray imaging. Therefore, it is necessary to make the base 7 and the apparatus housing 8 have a strong structure. In order to satisfy this requirement, the above-described imaging apparatus is hindered from being reduced in size and weight.

本発明は、上記事情に基づいてなされたもので、その目的とするところは、外部から加えられる衝撃や筐体の撓みなどの変形を吸収して、外部荷重で筐体が変形しても、内部保護が確保され、復元性を維持することができる二次元撮像装置の実装構造を提供することにある。   The present invention has been made based on the above circumstances, and the purpose thereof is to absorb deformations such as impacts applied from the outside and bending of the housing, and even if the housing is deformed by an external load, An object of the present invention is to provide a mounting structure for a two-dimensional imaging device that can ensure internal protection and maintain recoverability.

このため、本発明の二次元撮像装置では、基板上に形成された複数の光電変換素子を有する二次元光電変換装置と、複数の前記光電変換素子上に配置された蛍光体とを、装置筐体内に収納した二次元撮像装置において、前記蛍光体と前記装置筐体の前記光電変換装置の受光部に対向する部分との間には、緩衝手段を有することを特徴とする。   For this reason, in the two-dimensional imaging device of the present invention, a two-dimensional photoelectric conversion device having a plurality of photoelectric conversion elements formed on a substrate and a phosphor disposed on the plurality of photoelectric conversion elements are arranged in an apparatus housing. In the two-dimensional imaging device housed in the body, a buffer unit is provided between the phosphor and a portion of the device housing facing the light receiving unit of the photoelectric conversion device.

なお、前記緩衝手段は容器であり、前記容器は気体を封入したもの、更に前記容器は気嚢であることが好ましい。   In addition, it is preferable that the said buffer means is a container, the said container encloses gas, and also the said container is an air sac.

また、二次元撮像装置は前記光電変換装置を固定する基台を有するものである。   The two-dimensional imaging device has a base for fixing the photoelectric conversion device.

また、前記光電変換素子の電気信号を処理する回路基板を、前記装置筐体内に有し、前記回路基板上の電子部品に接して冷却手段を設けことができる。前記冷却手段は冷却液を内部に有する容器としてもよい。   In addition, a circuit board for processing an electric signal of the photoelectric conversion element may be provided in the apparatus housing, and a cooling unit may be provided in contact with the electronic component on the circuit board. The cooling means may be a container having a coolant inside.

更に、本発明の二次元X線撮像装置では、基板上に配置された複数の光電変換素子を有する二次元光電変換装置を、装置筐体内に収納した二次元X線撮像装置において、前記光電変換装置のX線の受光部と前記装置筐体の光電変換装置の受光部に対向する部分との間には、緩衝手段を有することを特徴とする。   Furthermore, in the two-dimensional X-ray imaging apparatus of the present invention, in the two-dimensional X-ray imaging apparatus in which a two-dimensional photoelectric conversion apparatus having a plurality of photoelectric conversion elements arranged on a substrate is housed in an apparatus housing, the photoelectric conversion is performed. A buffer means is provided between the X-ray light receiving part of the device and a part of the device housing facing the light receiving part of the photoelectric conversion device.

本発明は、耐衝撃および/または耐荷重性に優れた構成とすることで、より一層の装置の小型化、軽量化を達成することができる。また、それによって、良好な可搬性を有する二次元撮像装置を提供することができる。   The present invention can achieve further downsizing and weight reduction of the apparatus by adopting a configuration excellent in impact resistance and / or load resistance. Thereby, it is possible to provide a two-dimensional imaging device having good portability.

特に、基板とこの上に形成された二次元光電変換素子とを、装置筐体内に収納した二次元X線撮像装置において、前記基板と前記装置筐体の間隙に複数の容器、例えば、気嚢のような緩衝部材を挿入し、前記装置筐体の内壁面と前記基板とが互いに接触しないようにすることで、筐体やトッププレートが変形しても、内部の構成要素への損傷の可能性を、より一層、低減するので、更なる装置の小型化、軽量化が達成され、良好な可搬性が保持され、また、容器の幾つかに冷却液を収納することで、回路の放熱を良好にする効果も期待できる。   In particular, in a two-dimensional X-ray imaging apparatus in which a substrate and a two-dimensional photoelectric conversion element formed on the substrate are housed in an apparatus housing, a plurality of containers, for example, air sac are disposed in the gap between the substrate and the apparatus housing. By inserting such a buffer member so that the inner wall surface of the device housing and the substrate do not come into contact with each other, even if the housing or the top plate is deformed, the internal components may be damaged. Therefore, further downsizing and weight reduction of the device can be achieved, good portability can be maintained, and cooling liquid can be stored in some of the containers to improve the heat dissipation of the circuit. We can expect effect to make.

以下、本発明の実施の形態を、図面を参照して、具体的に説明する。なお、図2は、参考例を説明するための模式的断面図、図3の(a)、図4、図5は、それぞれ、本発明の二次元撮像装置の一例を説明するための模式的断面図であり、図3の(b)は、図3の(a)に示される二次元撮像装置の模式的斜視図である。また、本発明は、以下の説明および使用図面に限定されるものではなく、本発明の主旨の範囲において、適宜変形が可能である。   Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. 2 is a schematic cross-sectional view for explaining a reference example, and FIG. 3A, FIG. 4 and FIG. 5 are schematic views for explaining an example of the two-dimensional imaging device of the present invention. FIG. 3B is a cross-sectional view, and FIG. 3B is a schematic perspective view of the two-dimensional imaging apparatus shown in FIG. Further, the present invention is not limited to the following description and drawings used, and can be appropriately modified within the scope of the gist of the present invention.

(参考例)
まず、本発明の参考例を図2に示す。なお、図2においては、図1に示したのと同じ構成部材について、同一の符号を用いている。特に、この参考例では、少なくとも筐体を構成するトッププレート81を変位可能な材質で構成している。これにより、小さい衝撃に関してはトッププレート81と光電変換装置102との間に設けられた空間中でトッププレート81が変位することで光電変換装置102に衝撃を伝達しないか、伝達しても、その影響を低減することができる。
(Reference example)
First, a reference example of the present invention is shown in FIG. In FIG. 2, the same reference numerals are used for the same constituent members as shown in FIG. In particular, in this reference example, at least the top plate 81 constituting the casing is made of a displaceable material. Thereby, regarding a small impact, the top plate 81 is displaced in the space provided between the top plate 81 and the photoelectric conversion device 102 so that the impact is not transmitted to the photoelectric conversion device 102 or even if it is transmitted, The influence can be reduced.

また、この参考例では、光電変換装置102が載置固定される基台7の剛性(力を加えることによる変位のし難さ)がトッププレート81より大きくなっているので、図2に示されるように、荷重201がトッププレート81に加えられても、加えられた力はトッププレート81より変位量(変形量)が少ない基台7で受け止められ、光電変換装置102を変形損傷させることがなくなる。   Further, in this reference example, the rigidity of the base 7 on which the photoelectric conversion device 102 is placed and fixed (difficult to be displaced by applying a force) is larger than that of the top plate 81, and thus is shown in FIG. Thus, even when the load 201 is applied to the top plate 81, the applied force is received by the base 7 having a smaller displacement (deformation amount) than the top plate 81, and the photoelectric conversion device 102 is not deformed and damaged. .

なお、トッププレート81は耐衝撃性を有し、かつ、荷重などの力が除去された後の復元性に優れる材質とすることが好ましい。具体的には、カーボンやケブラーなどを用いた強化樹脂、ポリアミド樹脂、ポリイミド樹脂などを、好適に使用することができる。中でも、カーボンを用いた炭素繊維強化樹脂はX線の透過特性なども含めて好ましい材質であるといえる。   The top plate 81 is preferably made of a material that has impact resistance and is excellent in resilience after a force such as a load is removed. Specifically, a reinforced resin using carbon or Kevlar, a polyamide resin, a polyimide resin, or the like can be preferably used. Among them, carbon fiber reinforced resin using carbon can be said to be a preferable material including X-ray transmission characteristics.

(第1の実施の形態)
以下、本発明の第1の実施の形態を、図3の(a)および(b)を参照して、具体的に説明する。なお、ここで、符号1は蛍光板、2aは二次元光電変換素子、2bはガラスなどの基板、6は不透湿フィルムで、不透湿フィルム6と蛍光板1と基板2bとは、互いに一体に接着されている。
(First embodiment)
The first embodiment of the present invention will be specifically described below with reference to (a) and (b) of FIG. Here, reference numeral 1 is a fluorescent plate, 2a is a two-dimensional photoelectric conversion element, 2b is a substrate such as glass, 6 is a moisture-impermeable film, and the moisture-impermeable film 6, the phosphor plate 1 and the substrate 2b are integrated with each other. It is glued.

また、符号5aは光電変換素子の信号を取り出すためのフレキシブル回路基板、5bは信号処理に用いられる回路基板であり、これらは、小型化のために、基板2bの裏側に折り畳まれて、装置されている。なお、上記の部品は、いずれも、ガラス板及び半導体部品など、きわめて、脆く衝撃に弱い材料である。   Reference numeral 5a denotes a flexible circuit board for taking out a signal of the photoelectric conversion element, and 5b denotes a circuit board used for signal processing. These are folded and installed on the back side of the board 2b for miniaturization. ing. Note that all of the above components are extremely brittle and vulnerable to impact, such as glass plates and semiconductor components.

これらと装置筐体8との隙間には、緩衝手段として、内部に空気などの気体を封入した容器9、例えば、気嚢が、万遍なく挿入されている。容器9は、X線透過性の弾性素材で形成され、装置筐体8に対して光電変換素子2aの位置を規定すると共に、その内部気体の圧縮変形性によって、衝撃荷重を吸収し、基板2bなどの脆い部品を、運搬などの衝撃から保護している。   A container 9, for example, an air sac, in which a gas such as air is enclosed is inserted as a buffering means in the gap between these and the apparatus housing 8 uniformly. The container 9 is formed of an X-ray transparent elastic material, defines the position of the photoelectric conversion element 2a with respect to the apparatus housing 8, absorbs an impact load by compressive deformability of the internal gas, and the substrate 2b. Protects fragile parts from impacts such as transportation.

また、X線撮影時には、前述のように、装置筐体8に被写体の荷重が加わり、装置筐体8が撓むなどの変形を起こすこともあるが、容器9により、荷重が分散され、基板2bなどの一部に集中荷重が加わることを防止し、これらが破損することを防止している。   In addition, during X-ray imaging, as described above, a load of a subject is applied to the apparatus housing 8 and the apparatus housing 8 may be deformed. However, the container 9 disperses the load, and the substrate 9 The concentrated load is prevented from being applied to a part of 2b and the like, and these are prevented from being damaged.

なお、装置筐体8自体は、前述のように、X線透過の性能、そして、軽量であることが必要なため、金属板およびCFRP(炭素繊維強化樹脂)などの素材を組み合わせて構成されるが、耐荷重性能については、容器9の弾性変形が強度上の補填をなし、内部部品の保護を果たしているので、従来のような、特別な配慮(板厚を増すなど、軽量化に反する配慮)をする必要がない。   As described above, the apparatus housing 8 itself needs to be X-ray transmission performance and lightweight, and thus is configured by combining a metal plate and a material such as CFRP (carbon fiber reinforced resin). However, with regard to load-bearing performance, the elastic deformation of the container 9 compensates for strength and protects internal parts, so special considerations (considerations such as increasing the plate thickness and counteracting weight reduction) ) Is not necessary.

(第2の実施の形態)
また、図4には本発明の第2の実施の形態が示されている。ここでは、回路基板5bに搭載された電子部品5cの多くが、電力を消費し、発熱するために、少なくとも、これに接する容器9については、その内部に冷却液9aを封入し、冷却効果を発揮させている。即ち、これによって、電子部品の放熱を促し、熱による回路の誤動作を防止すると共に、筐体の一層の小型化を達成できるのである。
(Second Embodiment)
FIG. 4 shows a second embodiment of the present invention. Here, since most of the electronic components 5c mounted on the circuit board 5b consume electric power and generate heat, at least the container 9 in contact with the cooling liquid 9a is sealed in the inside thereof, and the cooling effect is obtained. It is demonstrated. That is, this facilitates heat dissipation of the electronic components, prevents malfunction of the circuit due to heat, and achieves further downsizing of the housing.

なお、この冷却液を封入した容器9は、前記電子部品5cと装置筐体8とに同時に接していることが望ましい。また、筐体8の、この容器9と接する部分は、金属などの熱伝導率に優れた材料で構成することが有利であることは、言うまでもない。更に、その大きさが許される範囲で、装置筐体8には、放熱フィン(図示せず)を取り付けることも有効である。   It is desirable that the container 9 filled with the cooling liquid is in contact with the electronic component 5c and the apparatus housing 8 at the same time. Needless to say, the portion of the housing 8 that contacts the container 9 is advantageously made of a material having excellent thermal conductivity such as metal. Furthermore, it is also effective to attach heat radiating fins (not shown) to the apparatus housing 8 within a range where the size is allowed.

(第3の実施の形態)
本発明における緩衝手段として働く容器9の形状および大きさには、特に限定はないが、図5には、X線101の入射側の容器9を、1つの容器9で受光面全体が、あるいは、少なくとも大部分が覆われるような大きさにした例を示す。
(Third embodiment)
There is no particular limitation on the shape and size of the container 9 serving as a buffering means in the present invention, but in FIG. 5, the container 9 on the incident side of the X-ray 101 is the entire light receiving surface with one container 9 or An example in which at least a large part is covered is shown.

このようにすることで、容器9の、X線透過方向における僅かなX線の吸収も抑え、より一層、透過X線量の分解能を向上することができる。なお、容器9内には、気体、液体以外にも、ゲル状、変形可能な固体状の物質を用いてもよい。但し、受光面側においては、所望とする波長の電磁波の透過特性を十分に考慮することが望ましい。   By doing so, absorption of slight X-rays in the X-ray transmission direction of the container 9 can be suppressed, and the resolution of the transmitted X-ray dose can be further improved. In addition, in the container 9, besides a gas and a liquid, a gel-like or deformable solid substance may be used. However, on the light receiving surface side, it is desirable to sufficiently consider the transmission characteristics of electromagnetic waves having a desired wavelength.

通常の二次元撮像装置の一例を示す模式的断面図である。It is typical sectional drawing which shows an example of a normal two-dimensional imaging device. 本発明の参考例を示す断面図である。It is sectional drawing which shows the reference example of this invention. 本発明の第1の実施の形態を示す(a)断面図、および(b)斜視図である。It is (a) sectional drawing and (b) perspective view which show the 1st Embodiment of this invention. 本発明の第2の実施の形態を示す断面図である。It is sectional drawing which shows the 2nd Embodiment of this invention. 本発明の第3の実施の形態を示す断面図である。It is sectional drawing which shows the 3rd Embodiment of this invention.

符号の説明Explanation of symbols

1 蛍光板(蛍光体)
2a 光電変換素子
2b 基板
5a フレキシブル回路基板
5b 回路基板
5c 電子部品
6 不透湿フィルム
8,8′ 筐体
9 容器(緩衝手段、緩衝部材)
9a 冷却液
101 X線
102 光電変換装置
201 荷重
1 Fluorescent screen (phosphor)
2a Photoelectric conversion element 2b Substrate 5a Flexible circuit board 5b Circuit board 5c Electronic component 6 Moisture impermeable film 8, 8 'Case 9 Container (buffer means, buffer member)
9a Coolant 101 X-ray 102 Photoelectric conversion device 201 Load

Claims (8)

基板上に形成された複数の光電変換素子を有する二次元光電変換装置と、複数の前記光電変換素子上に配置された蛍光体とを、装置筐体内に収納した二次元撮像装置において、
前記蛍光体と前記装置筐体の前記光電変換装置の受光部に対向する部分との間には、緩衝手段を有することを特徴とする二次元撮像装置。
In a two-dimensional imaging device in which a two-dimensional photoelectric conversion device having a plurality of photoelectric conversion elements formed on a substrate and a phosphor disposed on the plurality of photoelectric conversion elements are housed in an apparatus housing,
A two-dimensional image pickup apparatus comprising a buffer unit between the phosphor and a portion of the device casing facing the light receiving unit of the photoelectric conversion device.
前記緩衝手段は容器であることを特徴とする請求項1に記載の二次元撮像装置。   The two-dimensional imaging apparatus according to claim 1, wherein the buffer means is a container. 前記容器は気体を封入したものであることを特徴とする請求項2に記載の二次元撮像装置。   The two-dimensional imaging apparatus according to claim 2, wherein the container is filled with gas. 前記容器は気嚢であることを特徴とする請求項3に記載の二次元撮像装置。   The two-dimensional imaging apparatus according to claim 3, wherein the container is an air sac. 更に前記光電変換装置を固定する基台を有することを特徴とする請求項1に記載の二次元撮像装置。   The two-dimensional imaging device according to claim 1, further comprising a base for fixing the photoelectric conversion device. 更に前記光電変換素子の電気信号を処理する回路基板を、前記装置筐体内に有し、前記回路基板上の電子部品に接して冷却手段が設けられていることを特徴とする請求項1に記載の二次元撮像装置。   2. The circuit board according to claim 1, further comprising a circuit board for processing an electrical signal of the photoelectric conversion element in the apparatus housing, wherein cooling means is provided in contact with an electronic component on the circuit board. 2D imaging device. 前記冷却手段は冷却液を内部に有する容器を含むことを特徴とする請求項6に記載の二次元撮像装置。   The two-dimensional imaging apparatus according to claim 6, wherein the cooling unit includes a container having a coolant inside. 基板上に配置された複数の光電変換素子を有する二次元光電変換装置を、装置筐体内に収納した二次元X線撮像装置において、
前記光電変換装置のX線の受光部と前記装置筐体の光電変換装置の受光部に対向する部分との間には、緩衝手段を有することを特徴とする二次元X線撮像装置。
In a two-dimensional X-ray imaging device in which a two-dimensional photoelectric conversion device having a plurality of photoelectric conversion elements arranged on a substrate is housed in a device housing,
A two-dimensional X-ray imaging apparatus, comprising: a buffer unit between an X-ray light receiving unit of the photoelectric conversion device and a portion of the device housing facing the light receiving unit of the photoelectric conversion device.
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