JP2006311441A - Detector for light or radiation - Google Patents

Detector for light or radiation Download PDF

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JP2006311441A
JP2006311441A JP2005134316A JP2005134316A JP2006311441A JP 2006311441 A JP2006311441 A JP 2006311441A JP 2005134316 A JP2005134316 A JP 2005134316A JP 2005134316 A JP2005134316 A JP 2005134316A JP 2006311441 A JP2006311441 A JP 2006311441A
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signal processing
divided signal
detection
light
processing boards
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JP4770259B2 (en
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Akihiro Nishimura
暁弘 西村
Shoichi Okamura
昇一 岡村
Susumu Adachi
晋 足立
Koichi Tanabe
晃一 田邊
Toshinori Yoshimuta
利典 吉牟田
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Shimadzu Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To suppress the generation of a difference in output levels of electric signals outputted from each separation signal processing substrate to detection signals at the same level. <P>SOLUTION: The separation signal processing substrates 5a, 5b are separately arranged on one side of a detection substrate 1 for detecting X-rays, electric charge information obtained from the detection substrate 1 is processed to output the electric signals. Connectors 7a, 8a, 9a, connectors 7b, 8b, 9b are provided at edges of the separation signal processing substrates 5a, 5b, respectively and connected via electric wiring 10, 11 and 12. Thus, a potential difference is adjusted between the separation signal processing substrate 5a and 5b. Thus, the generation of a difference in the output levels of the electric signals outputted by each of the separation signal processing substrates 5a, 5b to the detection signals at the same level is suppressed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、医療分野、工業分野等に用いられて放射線を検出する二次元放射線検出器に関する。   The present invention relates to a two-dimensional radiation detector that is used in the medical field, industrial field, and the like to detect radiation.

光または放射線用検出器として近年、フラットパネル型検出器（または、「二次元センサー」ともいい、以下では適宜「ＦＰＤ」と記載する）が用いられる。図５に示すように、ＦＰＤは、大きく光または放射線を検出する検出基板５１と、この検出基板５１の１辺側に沿って設けられる信号処理基板５３と、他の１辺側に設けられる駆動基板５５とに分けられる。検出基板５１は、行列状に配置される検出素子を有しており、各検出素子は光感応型または放射線感応型のセンサとスイッチング素子等で構成される。駆動基板５５は、各検出素子のスイッチング素子を駆動して、センサが検出した検出信号を読み出す。信号処理基板５３は読み出された検出信号を増幅する等の信号処理を行い、電気信号として出力する。出力された電気信号は、画像データ生成に用いられる。   In recent years, a flat panel detector (or also referred to as a “two-dimensional sensor”, which will be referred to as “FPD” where appropriate) is used as a light or radiation detector. As shown in FIG. 5, the FPD has a detection board 51 that detects light or radiation largely, a signal processing board 53 provided along one side of the detection board 51, and a drive provided on the other side. The substrate 55 is divided. The detection substrate 51 has detection elements arranged in a matrix, and each detection element includes a light-sensitive or radiation-sensitive sensor and a switching element. The drive board 55 drives the switching element of each detection element, and reads the detection signal which the sensor detected. The signal processing board 53 performs signal processing such as amplifying the read detection signal and outputs it as an electrical signal. The output electrical signal is used for image data generation.

大型化する検出基板５１との接続不良を抑制するために、信号処理基板５３を分割信号処理基板５３ａ、５３ｂに分割することが行われる。これにより、検出面の大型化に伴う組立工程管理上の問題を回避することができる。   In order to suppress poor connection with the detection substrate 51 that is increased in size, the signal processing substrate 53 is divided into divided signal processing substrates 53a and 53b. Thereby, the problem in the assembly process management accompanying the enlargement of the detection surface can be avoided.

特開２００４−２４１６４０号公報JP 2004-241640 A

しかしながら、このような構成を有する従来例の場合には、次のような問題がある。
２つの分割信号処理基板５３ａ、５３ｂにより検出信号を処理すると、同一レベルの検出信号に対して各分割信号処理基板５３ａ、５３ｂから出力される電気信号のレベルが相互に異なる場合がある。すなわち、検出領域の一部に非常に強い光または放射線が入射すると、当該領域に関わる分割信号処理基板が影響を受け、その他の検出領域に同一の強さの光または放射線が入射しても、それらの検出信号を読み出す分割信号処理基板が異なれば、出力される電気信号の値が異なってしまう場合がある。そして、このような電気信号に基づいて生成される画像は、各分割信号処理基板５３ａ、５３ｂに対応した画素領域間で意図しない輝度（濃淡）差が生じる。たとえば、画像の右半分が左半分に比べて明るくなったり、暗くなったりする。また、各画素領域の境界には輝度差による線が視認される。 However, the conventional example having such a configuration has the following problems.
When the detection signals are processed by the two divided signal processing boards 53a and 53b, the levels of the electric signals output from the respective divided signal processing boards 53a and 53b may be different from each other with respect to the detection signal having the same level. That is, when very strong light or radiation is incident on a part of the detection region, the divided signal processing substrate related to the region is affected, and even if light or radiation of the same intensity is incident on other detection regions, If the divided signal processing boards for reading out these detection signals are different, the value of the output electric signal may be different. And the image produced | generated based on such an electrical signal produces the brightness | luminance (shading) difference which is not intended between the pixel areas corresponding to each division | segmentation signal processing board | substrate 53a, 53b. For example, the right half of the image becomes brighter or darker than the left half. In addition, a line due to a luminance difference is visually recognized at the boundary of each pixel region.

特に、各分割信号処理基板５３ａ、５３ｂに対応する検出基板５１上の検出領域間で、入射する光または放射線の総量に差が大きいほど、各分割信号処理基板５３ａ、５３ｂから出力される電気信号の出力レベルの差が大きくなり、得られる画像もその影響を大きく受ける傾向がある。   In particular, the greater the difference in the total amount of incident light or radiation between the detection regions on the detection substrate 51 corresponding to the divided signal processing substrates 53a and 53b, the greater the electrical signal output from the divided signal processing substrates 53a and 53b. The difference between the output levels of the images increases, and the obtained image tends to be greatly affected by the difference.

この発明は、このような事情に鑑みてなされたものであって、同一レベルの検出信号に対して各分割信号処理基板間から出力される電気信号の出力レベルに差が生じることを抑制することができる光または放射線用検出器を提供することを目的とする。   The present invention has been made in view of such circumstances, and suppresses the occurrence of a difference in the output level of the electric signal output from between the divided signal processing boards with respect to the detection signal of the same level. An object of the present invention is to provide a detector for light or radiation that can be used.

この発明は、このような目的を達成するために、次のような構成をとる。
すなわち、請求項１に記載の発明は、入射する光または放射線に応じた電気信号を出力する光または放射線用検出器において、光または放射線を検出し、電気的情報に変換する検出基板と、前記検出基板から出力された検出信号を処理して電気信号を出力する複数個の分割信号処理基板とを備え、前記検出基板の少なくとも１辺に沿って複数個の分割信号処理基板が並べられ、かつ、同じ辺に沿って並ぶ各分割信号処理基板を電気的に接続していることを特徴とするものである。 In order to achieve such an object, the present invention has the following configuration.
That is, the invention according to claim 1 is a light or radiation detector that outputs an electrical signal corresponding to incident light or radiation, and detects the light or radiation and converts it into electrical information; A plurality of divided signal processing boards that process detection signals output from the detection boards and output electrical signals, and a plurality of divided signal processing boards are arranged along at least one side of the detection boards; and The divided signal processing boards arranged along the same side are electrically connected.

［作用・効果］請求項１に記載の発明によれば、同じ辺に沿って並ぶ各分割信号処理基板を相互に電気的に接続することで、分割信号処理基板間で電位差を調整することができる。これにより、同一レベルの検出信号に対して各分割信号処理基板が出力する電気信号の出力レベルに差が生じることを抑制することができる。   [Operation / Effect] According to the first aspect of the present invention, the potential difference between the divided signal processing boards can be adjusted by electrically connecting the divided signal processing boards arranged along the same side. it can. Thereby, it can suppress that a difference arises in the output level of the electric signal which each division | segmentation signal processing board | substrate outputs with respect to the detection signal of the same level.

なお、放射線とは、Ｘ線、γ線のような電磁波である。   Radiation is electromagnetic waves such as X-rays and γ-rays.

また、請求項２に記載の発明は、請求項１に記載の光または放射線用検出器において、前記分割信号処理基板はそれぞれ、検出信号を増幅する増幅器と、前記増幅器に給電する電源系とを有し、同じ辺に沿って並ぶ各分割信号処理基板が有する電源系を、相互に電気的に接続していることを特徴とするものである。   According to a second aspect of the present invention, in the light or radiation detector according to the first aspect, each of the divided signal processing boards includes an amplifier that amplifies a detection signal and a power supply system that supplies power to the amplifier. And the power supply systems of the divided signal processing boards arranged along the same side are electrically connected to each other.

［作用・効果］請求項２に記載の発明によれば、同じ辺に沿って並ぶ各分割信号処理基板に設けられる増幅器の電源系の電位を調整する。これにより、分割信号処理基板間で増幅器の出力値にばらつきが生じることを防止する。この結果、各分割信号処理基板が出力する電気信号の出力レベルに差が生じることを効果的に抑制することができる。   [Operation and Effect] According to the invention described in claim 2, the potential of the power supply system of the amplifier provided on each divided signal processing board arranged along the same side is adjusted. This prevents variations in the output value of the amplifier between the divided signal processing boards. As a result, it is possible to effectively suppress a difference in the output level of the electrical signal output from each divided signal processing board.

また、請求項３に記載の発明は、請求項１または請求項２に記載の光または放射線用検出器において、前記分割信号処理基板はそれぞれ、前記検出基板の基準電位と電気的に接続されている共通電位を有し、同じ辺に沿って並ぶ各分割信号処理基板に含まれる前記共通電位を、相互に電気的に接続していることを特徴とするものである。   According to a third aspect of the present invention, in the light or radiation detector according to the first or second aspect, each of the divided signal processing boards is electrically connected to a reference potential of the detection board. The common potentials included in the divided signal processing boards arranged along the same side are electrically connected to each other.

［作用・効果］請求項３に記載の発明によれば、同じ辺に並ぶ各割信号処理基板に含まれる各共通電位を相互に調整し、各分割信号処理基板間で当該電位を等しくすることができる。これにより、各分割信号処理基板が出力する電気信号の出力レベルに差が生じることを効果的に抑制することができる。なお、共通電位は、増幅器の電源系とは異なるものである。   [Operation / Effect] According to the invention described in claim 3, the common potentials included in the split signal processing boards arranged on the same side are adjusted to each other, and the potentials are made equal among the split signal processing boards. Can do. Thereby, it can suppress effectively that a difference arises in the output level of the electric signal which each divided signal processing board outputs. The common potential is different from the power supply system of the amplifier.

また、請求項４に記載の発明は、請求項１から請求項３のいずれかに記載の光または放射線用検出器において、各分割信号処理基板は、その端部に接続部材を設け、隣接する分割信号処理基板の接続部材間が電気配線で接続されていることを特徴とするものである。   According to a fourth aspect of the present invention, in the light or radiation detector according to any one of the first to third aspects of the present invention, each divided signal processing board is provided with a connecting member at an end thereof and is adjacent. The connection members of the divided signal processing boards are connected by electrical wiring.

［作用・効果］請求項４に記載の発明によれば、接続部材および電気配線によって、分割信号処理基板間を好適に電気的に接続することができる。また、接続部材を分割信号処理基板の端部に設けることで、電気配線の長さを最短にすることができる。これにより、電気配線固有の抵抗成分を極力低減でき、分割信号処理基板間で電位差をより厳密に調整することができる。   [Operation and Effect] According to the invention described in claim 4, the divided signal processing boards can be suitably electrically connected by the connecting member and the electric wiring. Moreover, the length of the electrical wiring can be minimized by providing the connection member at the end of the divided signal processing board. Thereby, the resistance component peculiar to the electrical wiring can be reduced as much as possible, and the potential difference between the divided signal processing boards can be adjusted more strictly.

この発明に係る光または放射線用検出器によれば、同じ辺に沿って並ぶ各分割信号処理基板を相互に電気的に接続することで、分割信号処理基板間で電位差を調整することができる。これにより、各分割信号処理基板が出力する電気信号の出力レベルに差が生じることを抑制することができる。   According to the light or radiation detector according to the present invention, the potential difference between the divided signal processing boards can be adjusted by electrically connecting the divided signal processing boards arranged along the same side. Thereby, it can suppress that a difference arises in the output level of the electric signal which each divided signal processing board outputs.

以下、図面を参照してこの発明の実施例１を説明する。
図１は、実施例に係るＸ線検出器の概略構成を示す平面図であり、図２は検出基板の垂直断面図であり、図３はＸ線検出器の詳細構成を示す平面図である。 Embodiment 1 of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view showing a schematic configuration of an X-ray detector according to an embodiment, FIG. 2 is a vertical sectional view of a detection substrate, and FIG. 3 is a plan view showing a detailed configuration of the X-ray detector. .

本実施例のＸ線検出器は、フラットパネル型検出器であり、入射するＸ線を検出する検出基板１と、駆動基板３と、２個の分割信号処理基板５ａ、５ｂとを有する。駆動基板３は、この検出基板１の１辺側に設けられ、検出基板１を駆動する。また、２個の分割信号処理基板５ａ、５ｂは、その他の１辺に沿って並べられ、検出基板１から得られた電荷情報を処理する。この各分割信号処理基板５ａ、５ｂが並ぶ１辺は、駆動基板３に対向しない辺である。なお、電荷情報は、この発明における検出信号に相当する。   The X-ray detector according to the present embodiment is a flat panel detector, and includes a detection substrate 1 that detects incident X-rays, a drive substrate 3, and two divided signal processing substrates 5a and 5b. The drive substrate 3 is provided on one side of the detection substrate 1 and drives the detection substrate 1. The two divided signal processing boards 5a and 5b are arranged along the other one side and process the charge information obtained from the detection board 1. One side on which the divided signal processing boards 5a and 5b are arranged is a side that does not face the drive board 3. The charge information corresponds to the detection signal in the present invention.

検出基板１と駆動基板３との間はフレキシブルケーブル４で電気的に接続されている。また、検出基板１と２個の分割信号処理基板５ａ、５ｂとの間もそれぞれフレキシブルケーブル６ａ、６ｂで電気的に接続されている。   The detection board 1 and the drive board 3 are electrically connected by a flexible cable 4. Further, the detection board 1 and the two divided signal processing boards 5a and 5b are also electrically connected by flexible cables 6a and 6b, respectively.

分割信号処理基板５ａが分割信号処理基板５ｂと隣接する端部にはコネクタ７ａ、８ａ、９ａが設けられている。また、これらコネクタ７ａ、８ａ、９ａに隣り合う分割信号処理基板５ｂの端部にも、コネクタ７ｂ、８ｂ、９ｂが設けられている。コネクタ７ａ、７ｂには電気配線１０の両端が接続され、コネクタ８ａ、８ｂには電気配線１１の両端が接続されている。同様に、コネクタ９ａ、９ｂには電気配線１２の両端が接続されている。なお、コネクタ７ａ、７ｂ、８ａ、８ｂ、９ａ、９ｂは、この発明における接続部材に相当する。   Connectors 7a, 8a, and 9a are provided at the ends of the divided signal processing board 5a adjacent to the divided signal processing board 5b. Connectors 7b, 8b, and 9b are also provided at the ends of the divided signal processing board 5b adjacent to the connectors 7a, 8a, and 9a. Both ends of the electrical wiring 10 are connected to the connectors 7a and 7b, and both ends of the electrical wiring 11 are connected to the connectors 8a and 8b. Similarly, both ends of the electrical wiring 12 are connected to the connectors 9a and 9b. The connectors 7a, 7b, 8a, 8b, 9a, 9b correspond to the connecting members in the present invention.

検出基板１は、図２に示すように、Ｘ線感応型の半導体膜１４とキャリア収集電極１５とアクティブマトリクス基板１６とを有し、Ｘ線の入射側からこれらが順に積層されている。   As shown in FIG. 2, the detection substrate 1 includes an X-ray sensitive semiconductor film 14, a carrier collection electrode 15, and an active matrix substrate 16, which are sequentially stacked from the X-ray incident side.

半導体膜１４としては、Ｘ線を直接、電荷情報に変換するアモルファスセレン（a-Se）等が例示される。キャリア収集電極１５は、平面視２次元マトリクス状に分離形成されている。また、アクティブマトリクス基板１６としては、電気的絶縁性を有するガラス上に回路を蒸着したものなどが例示される。   Examples of the semiconductor film 14 include amorphous selenium (a-Se) that directly converts X-rays into charge information. The carrier collection electrodes 15 are separately formed in a two-dimensional matrix in plan view. Examples of the active matrix substrate 16 include those obtained by vapor-depositing a circuit on glass having electrical insulation.

このアクティブマトリクス基板１６には、キャリア収集電極１５ごとに電荷情報を蓄積するコンデンサＣａと、これらキャリア収集電極１５及びコンデンサＣａをソースＳに接続し、電荷情報を取り出すスイッチング素子である薄膜トランジスタ（Thin Film Transistors）Ｔｒとが分離形成されている。これら１組のキャリア収集電極１５とコンデンサＣａと薄膜トランジスタＴｒとは、１個の検出素子ｄを構成する。よって、平面視すると、図３に示すように、行列状に検出素子ｄが配列されている。また、以下の説明では、検出素子ｄの水平方向の並びを行と、垂直方向の並びを列と呼ぶ。   The active matrix substrate 16 includes a capacitor Ca that accumulates charge information for each carrier collection electrode 15, and a thin film transistor (Thin Film) that is a switching element that connects the carrier collection electrode 15 and the capacitor Ca to the source S and extracts charge information. Transistors) Tr is formed separately. The one set of carrier collection electrode 15, capacitor Ca, and thin film transistor Tr constitute one detection element d. Therefore, when viewed in a plan view, the detection elements d are arranged in a matrix as shown in FIG. In the following description, the horizontal arrangement of the detection elements d is referred to as a row, and the vertical arrangement is referred to as a column.

さらに、各検出素子ｄは、それぞれ検出基板１の基準電位Ｇｋに接地されている。   Further, each detection element d is grounded to the reference potential Gk of the detection substrate 1.

アクティブマトリクス基板１６上には、さらに、行ごとにゲートバスライン１７が敷設されるとともに、列ごとにデータバスライン１９が敷設されている。各ゲートバスライン１７は、各行の薄膜トランジスタＴｒのゲートに共通接続されている。また、各データバスライン１９は、各列の薄膜トランジスタＴｒのドレインに共通接続されている。   On the active matrix substrate 16, gate bus lines 17 are further laid for each row, and data bus lines 19 are laid for each column. Each gate bus line 17 is commonly connected to the gates of the thin film transistors Tr in each row. Each data bus line 19 is commonly connected to the drains of the thin film transistors Tr in each column.

各ゲートバスライン１７の一端は、フレキシブルケーブル４を介して駆動基板３に接続されている。また、各データバスライン１９は、２個のフレキシブルケーブル６ａ、６ｂに分けて検出基板１から引き出されている。各フレキシブルケーブル６ａ、６ｂの他端には、それぞれ分割信号処理基板５ａ、５ｂが接続されている。   One end of each gate bus line 17 is connected to the drive substrate 3 via the flexible cable 4. Each data bus line 19 is led out from the detection board 1 by being divided into two flexible cables 6a and 6b. Divided signal processing boards 5a and 5b are connected to the other ends of the flexible cables 6a and 6b, respectively.

駆動基板３は、選択的に各ゲートバスライン１７にゲートパルスを出力する。   The drive substrate 3 selectively outputs a gate pulse to each gate bus line 17.

分割信号処理基板５ａ、５ｂは同様の構成であるので、以下では分割信号処理基板５ａのみについて説明し、分割信号処理基板５ｂについては説明を省略する。分割信号処理基板５ａは、フレキシブルケーブル６ａを介して各データバスライン１９に接続される複数個の増幅器２１ａと、各増幅器２１ａに接続されるＡ／Ｄ変換器２５ａとを備える。   Since the divided signal processing boards 5a and 5b have the same configuration, only the divided signal processing board 5a will be described below, and the description of the divided signal processing board 5b will be omitted. The divided signal processing board 5a includes a plurality of amplifiers 21a connected to each data bus line 19 via the flexible cable 6a, and an A / D converter 25a connected to each amplifier 21a.

各増幅器２１ａには、増幅器用電源配線（以下、単に「電源ライン」という）２７ａと、増幅器用グラウンド配線（以下、単に「グラウンドライン」という）２９ａとが並列に接続されている。電源ライン２７ａ、およびグラウンドライン２９ａの一端側は、それぞれコネクタ７ａ、８ａに接続されている。電源ライン２７ａ、２７ｂ、およびグラウンドライン２９ａ、２９ｂは、この発明における増幅器の電源系に相当する。   Each amplifier 21a is connected in parallel with an amplifier power line (hereinafter simply referred to as “power line”) 27a and an amplifier ground line (hereinafter simply referred to as “ground line”) 29a. One end sides of the power line 27a and the ground line 29a are connected to the connectors 7a and 8a, respectively. The power supply lines 27a and 27b and the ground lines 29a and 29b correspond to the power supply system of the amplifier in the present invention.

各増幅器２１ａは、入力される電荷情報を電圧信号に変換して増幅する。Ａ／Ｄ変換器２５ａは、各増幅器２１ａの出力値をデジタル値に変換する。変換された複数のデジタル値は図示省略のマルチプレクサによって１つにまとめられ、分割信号処理基板５ａ、５ｂから外部に電気信号を出力する。   Each amplifier 21a converts input charge information into a voltage signal and amplifies it. The A / D converter 25a converts the output value of each amplifier 21a into a digital value. The converted digital values are combined into one by a multiplexer (not shown), and an electric signal is output to the outside from the divided signal processing boards 5a and 5b.

なお、図３において、Ｄ１は、分割信号処理基板５ａが信号処理を行う電荷情報を出力する検出素子ｄ群を指している。同様に、Ｄ２は、分割信号処理基板５ｂが信号処理を行う電荷情報を出力する検出素子ｄ群をさしている。また、図１における検出領域Ａ１、Ａ２は、検出素子群Ｄ１、Ｄ２が配置される領域にそれぞれ対応しているものとする。   In FIG. 3, D <b> 1 indicates a detection element d group that outputs charge information on which the divided signal processing substrate 5 a performs signal processing. Similarly, D2 indicates a detection element d group that outputs charge information for signal processing performed by the divided signal processing board 5b. Further, it is assumed that the detection areas A1 and A2 in FIG. 1 respectively correspond to areas where the detection element groups D1 and D2 are arranged.

検出素子群Ｄ１に対応した検出基板１の基準電位Ｇｋは、複数本の配線によって引き出され、分割信号処理基板５ａに含まれる共通電位３１ａと電気的に接続されている。この共通電位３１ａについても、その一端側は、コネクタ９ａに接続されている。   The reference potential Gk of the detection substrate 1 corresponding to the detection element group D1 is drawn out by a plurality of wires and is electrically connected to the common potential 31a included in the divided signal processing substrate 5a. One end of the common potential 31a is also connected to the connector 9a.

なお、共通電位３１ａは、増幅器の電源系を構成する電源ライン２７ａ、またはグラウンドライン２９ａとはまったく異なるものである。   The common potential 31a is completely different from the power supply line 27a or the ground line 29a constituting the power supply system of the amplifier.

次に、この実施例の動作を説明する。
検出基板１にＸ線が入射すると、半導体膜１４において電荷が発生する。この電荷は各キャリア収集電極１５を介してコンデンサＣａに電荷情報として蓄積される。 Next, the operation of this embodiment will be described.
When X-rays enter the detection substrate 1, charges are generated in the semiconductor film 14. This charge is stored as charge information in the capacitor Ca via each carrier collecting electrode 15.

駆動基板３は、フレキシブルケーブル４を介して、各ゲートバスライン１７にゲートパルスを出力する。ゲートバスライン１７は、接続されている各薄膜トランジスタＴｒにゲートパルスを通じる。ゲートパルスがゲートに与えられた各薄膜トランジスタＴｒは、オン状態に移行する。これにより、オン状態に移行した各薄膜トランジスタＴｒを経由して、コンデンサＣａに蓄積された電荷情報がデータバスライン１９に読み出される。各データバスライン１９、および、これらに接続されるフレキシブルケーブル６ａ、６ｂは、読み出された電荷情報を分割信号処理基板５ａ、５ｂに伝播する。   The drive substrate 3 outputs a gate pulse to each gate bus line 17 via the flexible cable 4. The gate bus line 17 passes a gate pulse to each connected thin film transistor Tr. Each thin film transistor Tr to which the gate pulse is applied to the gate shifts to the ON state. As a result, the charge information stored in the capacitor Ca is read out to the data bus line 19 via each thin film transistor Tr that has been turned on. Each data bus line 19 and the flexible cables 6a and 6b connected thereto propagate the read charge information to the divided signal processing boards 5a and 5b.

なお、検出素子群Ｄ１、Ｄ２に対応する検出基板１の基準電位Ｇｋは、各分割信号処理基板５ａ、５ｂに含まれる共通電位３１ａ、３１ｂ、および電気配線１２を介して、電気的に接続されている。よって、検出基板１の基準電位Ｇｋは、検出素子群Ｄ１、Ｄ２間で調整されている。   Note that the reference potential Gk of the detection substrate 1 corresponding to the detection element groups D1 and D2 is electrically connected through the common potentials 31a and 31b included in the divided signal processing substrates 5a and 5b and the electric wiring 12. ing. Therefore, the reference potential Gk of the detection substrate 1 is adjusted between the detection element groups D1 and D2.

分割信号処理基板５ａ、５ｂの各増幅器２１ａ、２１ｂは、電源ライン２７ａ、２７ｂ、および、グラウンドライン２９ａ、２９ｂによって給電を受けている。また、電気配線９によって、電源ライン２７ａ、２７ｂは相互に電気的に接続されており、電気配線１０によって、グラウンドライン２９ａ、２９ｂは相互に電気的に接続されている。よって、増幅器２１ａ、２１ｂの供給電源の電位ＶDCは、等しくなるように調整されている。 The amplifiers 21a and 21b of the divided signal processing boards 5a and 5b are supplied with power by the power supply lines 27a and 27b and the ground lines 29a and 29b. Further, the power supply lines 27 a and 27 b are electrically connected to each other by the electrical wiring 9, and the ground lines 29 a and 29 b are electrically connected to each other by the electrical wiring 10. Therefore, the potentials V DC of the power supplies of the amplifiers 21a and 21b are adjusted to be equal.

分割信号処理基板５ａ、５ｂの各増幅器２１ａ、２１ｂは、伝播された電荷情報を電圧信号に変換し、増幅する。増幅器２１ａ、２１ｂから出力される出力値は、Ａ／Ｄ変換器２５ａ、２５ｂ、および図示省略のマルチプレクサ等を通じ、電気信号として分割信号処理基板５ａ、５ｂから外部に出力される。   The amplifiers 21a and 21b of the divided signal processing boards 5a and 5b convert the propagated charge information into voltage signals and amplify them. Output values output from the amplifiers 21a and 21b are output to the outside from the divided signal processing boards 5a and 5b as electric signals through the A / D converters 25a and 25b, a multiplexer (not shown), and the like.

このように、実施例１に係るＸ線検出器は、電源ライン２７ａ、２７ｂとグラウンドライン２９ａ、２９ｂとがそれぞれ電気的に接続されて、増幅器２１ａ、２１ｂの供給電源の電位ＶDCは調整されているので、増幅器２１ａ、２１ｂの出力値がばらつくことがない。この結果、各分割信号処理基板５ａ、５ｂから出力される電気信号の出力レベルに差が生じない。よって、電気信号に基づいて生成される画像についても、輝度差が生じることはない。 As described above, in the X-ray detector according to the first embodiment, the power supply lines 27a and 27b and the ground lines 29a and 29b are electrically connected to each other, and the potential V DC of the power supply of the amplifiers 21a and 21b is adjusted. Therefore, the output values of the amplifiers 21a and 21b do not vary. As a result, there is no difference in the output level of the electrical signal output from each of the divided signal processing boards 5a and 5b. Therefore, there is no difference in luminance between images generated based on electrical signals.

特に、検出基板１上の検出領域Ａ１、Ａ２間で、入射するＸ線の線量が大きく異なる場合であっても、その影響を受けることなく、各分割信号処理基板５ａ、５ｂの出力レベルに差が生じることを効果的に防止することができる。   In particular, even if the doses of incident X-rays differ greatly between the detection areas A1 and A2 on the detection substrate 1, the output levels of the divided signal processing substrates 5a and 5b are not affected by the difference. Can be effectively prevented.

また、共通電位３１ａ、３１ｂと配線１２とを備えることで、検出素子群Ｄ１、Ｄ２に対応する検出基板１の基準電位Ｇｋも調整することができる。   Further, by providing the common potentials 31a and 31b and the wiring 12, the reference potential Gk of the detection substrate 1 corresponding to the detection element groups D1 and D2 can also be adjusted.

また、各分割信号処理基板５ａ、５ｂは、それぞれコネクタ７ａ、８ａ、９ａ、コネクタ７ｂ、８ｂ、９ｂを設けることで、分割信号処理基板５ａ、５ｂ間を好適に電気的に接続することができる。   Further, each of the divided signal processing boards 5a and 5b is provided with connectors 7a, 8a and 9a, and connectors 7b, 8b and 9b, respectively, so that the divided signal processing boards 5a and 5b can be suitably electrically connected. .

また、コネクタ７ａ〜９ａ、コネクタ７ｂ〜９ｂを、分割信号処理基板５ａ、５ｂが隣接する端部に設けることで、電気配線１０、１１、１２の長さを極力短くすることができる。これにより、電気配線固有の抵抗成分を極力低減でき、増幅器２１ａ、２１ｂの供給電源の電位ＶDCを、より厳密に調整することができる。 Further, by providing the connectors 7a to 9a and the connectors 7b to 9b at the end portions where the divided signal processing boards 5a and 5b are adjacent, the lengths of the electric wirings 10, 11, and 12 can be shortened as much as possible. Thereby, the resistance component peculiar to the electrical wiring can be reduced as much as possible, and the potential V DC of the power supply of the amplifiers 21a and 21b can be adjusted more strictly.

この発明は、上記実施形態に限られることはなく、下記のように変形実施することができる。   The present invention is not limited to the above-described embodiment, and can be modified as follows.

（１）更に電気的に安定させるため、Ａ／Ｄ変換器２５ａ、２５ｂ等の電源系を、分割信号処理基板５ａ、５ｂ間で電気的に接続しても問題ない。なお、上記のような変形実施に伴い、コネクタの個数は適宜に変更される。   (1) There is no problem even if a power supply system such as the A / D converters 25a and 25b is electrically connected between the divided signal processing boards 5a and 5b in order to further stabilize the electric power. Note that the number of connectors is changed as appropriate in accordance with the above modification.

（２）上述した実施例では、２個の分割信号処理基板５ａ、５ｂを設けていたが、図４に示すように、３個以上の分割信号処理基板３３に分割してもよい。   (2) In the above-described embodiment, the two divided signal processing boards 5a and 5b are provided. However, the divided signal processing boards 33 may be divided into three or more divided signal processing boards 33 as shown in FIG.

（３）上述した実施例では、各分割信号処理基板５ａ、５ｂは、検出基板１の１辺側に設けられていたが、これに限られるものではない。たとえば、図４に示すように、検出基板１の２辺のそれぞれに沿って、複数の分割信号処理基板３３を並べてもよい。   (3) In the above-described embodiment, each of the divided signal processing boards 5a and 5b is provided on one side of the detection board 1. However, the present invention is not limited to this. For example, as shown in FIG. 4, a plurality of divided signal processing boards 33 may be arranged along each of the two sides of the detection board 1.

（４）上述した実施例では、コネクタ７ａ、８ａ等は、分割信号処理基板５ａ、５ｂが互いに隣接する片側のみに設けられらていたが、これに限られるものではない。たとえば、図４に示すように、分割信号処理基板３３の両側にコネクタ３５を設けるように構成してもよい。これにより、分割信号処理基板３３の共通化を図ることができる。   (4) In the above-described embodiments, the connectors 7a, 8a, etc. are provided only on one side where the divided signal processing boards 5a, 5b are adjacent to each other. However, the present invention is not limited to this. For example, as shown in FIG. 4, connectors 35 may be provided on both sides of the divided signal processing board 33. Thereby, the division | segmentation signal processing board | substrate 33 can be shared.

（５）上述した実施例では、電気配線１０、１１、１２を接続するために、コネクタ７ａ、８ａ、９ａ等を設けていたが、これに限られるものではない。例えば、はんだ等、分割信号処理基板５ａ、５ｂに電気配線を接続することができれば、コネクタ７ａ、８ａ、９ａを省いてもよい。   (5) In the above-described embodiment, the connectors 7a, 8a, 9a and the like are provided in order to connect the electric wires 10, 11, and 12. However, the present invention is not limited to this. For example, the connectors 7a, 8a, and 9a may be omitted as long as electrical wiring can be connected to the divided signal processing boards 5a and 5b such as solder.

（６）上述した実施例の分割信号処理基板５ａ、５ｂの構成は、信号処理の内容に応じて適宜に設計変更することができる。たとえば、各増幅器２１ａ、２１ｂの出力信号を時分割多重化するように、増幅器２１ａ、２１ｂとＡ／Ｄ変換器２５ａ、２５ｂとの各間にマルチプレクサを設けてもよい。   (6) The configuration of the divided signal processing boards 5a and 5b of the above-described embodiments can be appropriately changed in design according to the contents of signal processing. For example, a multiplexer may be provided between the amplifiers 21a and 21b and the A / D converters 25a and 25b so that the output signals of the amplifiers 21a and 21b are time-division multiplexed.

（７）上述した実施例の検出素子ｄは、入射したＸ線を半導体膜１４によって電荷情報に直接的に変換するものであったが、これに限られない。たとえば、入射したＸ線をシンチレータによって光に変換し、光感応型の物質で形成された半導体層によってその光を電荷情報に変換する間接型の検出素子であってもよい。   (7) Although the detection element d of the above-described embodiment converts the incident X-rays directly into charge information by the semiconductor film 14, it is not limited to this. For example, an indirect detection element that converts incident X-rays into light by a scintillator and converts the light into charge information by a semiconductor layer formed of a photosensitive material may be used.

（８）また、上述した実施例においては、Ｘ線の入射を検出するＸ線検出器であったが、入射するものはＸ線に限定されない。Ｘ線以外の放射線、または、光を入射させる場合にも適用できる。   (8) In the above-described embodiments, the X-ray detector detects the incidence of X-rays. However, what is incident is not limited to X-rays. The present invention can also be applied when radiation other than X-rays or light is incident.

（９）上述した実施例では、Ｘ線検出器の用途を特定していないが、たとえば、医用分野に用いられるＸ線撮影装置に適用してもよい。また、Ｘ線以外の放射線を用いる装置にも適用することができ、また、非破壊検査、ＲＩ（Radio Isotope）検査、および光学検査などの工業分野などに用いられる放射線撮影装置にも適用できる。   (9) Although the application of the X-ray detector is not specified in the above-described embodiment, it may be applied to, for example, an X-ray imaging apparatus used in the medical field. Further, the present invention can be applied to apparatuses using radiation other than X-rays, and can also be applied to radiation imaging apparatuses used in industrial fields such as non-destructive inspection, RI (Radio Isotope) inspection, and optical inspection.

実施例に係るＸ線検出器の概略構成を示す平面図である。It is a top view which shows schematic structure of the X-ray detector which concerns on an Example. 検出基板の垂直断面図である。It is a vertical sectional view of a detection substrate. Ｘ線検出器の詳細構成を示す平面図である。It is a top view which shows the detailed structure of a X-ray detector. 変形実施例に係るＸ線検出器の概略構成を示す平面図である。It is a top view which shows schematic structure of the X-ray detector which concerns on a modified example. 従来のＸ線検出器の概略構成を示す平面図である。It is a top view which shows schematic structure of the conventional X-ray detector.

符号の説明Explanation of symbols

１ …検出基板
５ａ、５ｂ、３３ …分割信号処理基板
７ａ、７ｂ、８ａ、８ｂ、９ａ、９ｂ、３５ …コネクタ
１０、１１、１２ …電気配線
２１ａ、２１ｂ …増幅器
２７ａ、２７ｂ …増幅器用電源配線（電源ライン）
２９ａ、２９ｂ …増幅器用グラウンド配線（グラウンドライン）
３１ａ、３１ｂ …共通電位
ｄ …検出素子
ＶDC …増幅器の供給電源の電位
Ｇｋ …検出基板の基準電位

DESCRIPTION OF SYMBOLS 1 ... Detection board 5a, 5b, 33 ... Divided signal processing board 7a, 7b, 8a, 8b, 9a, 9b, 35 ... Connector 10, 11, 12 ... Electric wiring 21a, 21b ... Amplifier 27a, 27b ... Amplifier power supply wiring (Power line)
29a, 29b ... Ground wiring for amplifier (ground line)
31a, 31b ... common potential d ... detection element V DC ... potential of power supply of amplifier Gk ... reference potential of detection substrate

Claims (4)

入射する光または放射線に応じた電気信号を出力する光または放射線用検出器において、光または放射線を検出し、電気的情報に変換する検出基板と、前記検出基板から出力された検出信号を処理して電気信号を出力する複数個の分割信号処理基板とを備え、前記検出基板の少なくとも１辺に沿って複数個の分割信号処理基板が並べられ、かつ、同じ辺に沿って並ぶ各分割信号処理基板を電気的に接続していることを特徴とする光または放射線用検出器。   In a light or radiation detector that outputs an electrical signal corresponding to incident light or radiation, a detection substrate that detects light or radiation and converts it into electrical information, and a detection signal output from the detection substrate is processed. A plurality of divided signal processing boards for outputting electric signals, and each of the divided signal processing boards arranged along the same side, wherein the plurality of divided signal processing boards are arranged along at least one side of the detection board. A detector for light or radiation, wherein the substrate is electrically connected. 請求項１に記載の光または放射線用検出器において、前記分割信号処理基板はそれぞれ、検出信号を増幅する増幅器と、前記増幅器に給電する電源系とを有し、同じ辺に沿って並ぶ各分割信号処理基板が有する電源系を、相互に電気的に接続していることを特徴とする光または放射線用検出器。   The light or radiation detector according to claim 1, wherein each of the divided signal processing boards includes an amplifier that amplifies a detection signal and a power supply system that supplies power to the amplifier, and the divided signal processing boards are arranged along the same side. A light or radiation detector, wherein a power supply system of a signal processing board is electrically connected to each other. 請求項１または請求項２に記載の光または放射線用検出器において、前記分割信号処理基板はそれぞれ、前記検出基板の基準電位と電気的に接続されている共通電位を有し、同じ辺に沿って並ぶ各分割信号処理基板に含まれる前記共通電位を、相互に電気的に接続していることを特徴とする光または放射線用検出器。   3. The light or radiation detector according to claim 1, wherein each of the divided signal processing boards has a common potential electrically connected to a reference potential of the detection board, and is along the same side. A light or radiation detector, wherein the common potentials included in the divided signal processing boards arranged in series are electrically connected to each other. 請求項１から請求項３のいずれかに記載の光または放射線用検出器において、各分割信号処理基板は、その端部に接続部材を設け、隣接する分割信号処理基板の接続部材間が電気配線で接続されていることを特徴とする光または放射線用検出器。
4. The light or radiation detector according to claim 1, wherein each divided signal processing board is provided with a connection member at an end thereof, and an electric wiring is provided between the connection members of the adjacent divided signal processing boards. A light or radiation detector, characterized by being connected by
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JPH0786541A (en) * 1993-09-16 1995-03-31 Rohm Co Ltd Photoelectric transducer
JP2002236054A (en) * 2001-02-07 2002-08-23 Sharp Corp Electromagnetic wave detector
JP2002369078A (en) * 2001-06-08 2002-12-20 Canon Inc Radiation image pickup device and its system
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