JP2006310689A5 - - Google Patents

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Publication number
JP2006310689A5
JP2006310689A5 JP2005134140A JP2005134140A JP2006310689A5 JP 2006310689 A5 JP2006310689 A5 JP 2006310689A5 JP 2005134140 A JP2005134140 A JP 2005134140A JP 2005134140 A JP2005134140 A JP 2005134140A JP 2006310689 A5 JP2006310689 A5 JP 2006310689A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005134140A
Other languages
Japanese (ja)
Other versions
JP2006310689A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005134140A priority Critical patent/JP2006310689A/en
Priority claimed from JP2005134140A external-priority patent/JP2006310689A/en
Priority to KR1020060039241A priority patent/KR20060114647A/en
Priority to TW095115470A priority patent/TWI384915B/en
Priority to CN2006100819121A priority patent/CN1870859B/en
Publication of JP2006310689A publication Critical patent/JP2006310689A/en
Publication of JP2006310689A5 publication Critical patent/JP2006310689A5/ja
Pending legal-status Critical Current

Links

JP2005134140A 2005-05-02 2005-05-02 Manufacturing method of double-access flexible circuit board Pending JP2006310689A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005134140A JP2006310689A (en) 2005-05-02 2005-05-02 Manufacturing method of double-access flexible circuit board
KR1020060039241A KR20060114647A (en) 2005-05-02 2006-05-01 Method for producing flexible circuit board of double access type
TW095115470A TWI384915B (en) 2005-05-02 2006-05-01 Method for manufacturing double-access-type flexible circuit board
CN2006100819121A CN1870859B (en) 2005-05-02 2006-05-08 Manufacturing method of two-face exposed flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005134140A JP2006310689A (en) 2005-05-02 2005-05-02 Manufacturing method of double-access flexible circuit board

Publications (2)

Publication Number Publication Date
JP2006310689A JP2006310689A (en) 2006-11-09
JP2006310689A5 true JP2006310689A5 (en) 2007-11-22

Family

ID=37444381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005134140A Pending JP2006310689A (en) 2005-05-02 2005-05-02 Manufacturing method of double-access flexible circuit board

Country Status (4)

Country Link
JP (1) JP2006310689A (en)
KR (1) KR20060114647A (en)
CN (1) CN1870859B (en)
TW (1) TWI384915B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008288422A (en) * 2007-05-18 2008-11-27 Kinsus Interconnect Technology Corp Flexible printed wiring board, and manufacturing method thereof
US9161712B2 (en) * 2013-03-26 2015-10-20 Google Inc. Systems and methods for encapsulating electronics in a mountable device
TWI577251B (en) * 2015-12-01 2017-04-01 同泰電子科技股份有限公司 Rigid-flex circuit board and manufacturing method thereof
KR102260413B1 (en) 2019-10-02 2021-06-02 한화솔루션 주식회사 Fpcb manufacturing method of double access method
KR102260416B1 (en) 2019-10-02 2021-06-02 한화솔루션 주식회사 Fpcb manufacturing method of double access method
KR102260412B1 (en) 2019-10-02 2021-06-02 한화솔루션 주식회사 Fpcb manufacturing method of double access method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4883744A (en) * 1988-05-17 1989-11-28 International Business Machines Corporation Forming a polymide pattern on a substrate
JPH04206677A (en) * 1990-11-30 1992-07-28 Hitachi Chem Co Ltd Manufacture of double-access flexible printed wiring board
JP3750140B2 (en) * 1994-05-10 2006-03-01 日立化成工業株式会社 Wiring board manufacturing method
JP2869969B2 (en) * 1995-04-28 1999-03-10 ソニーケミカル株式会社 Method for manufacturing flexible circuit board
JP3666955B2 (en) * 1995-10-03 2005-06-29 日本メクトロン株式会社 Method for manufacturing flexible circuit board
JPH10224013A (en) * 1997-02-12 1998-08-21 Nippon Mektron Ltd Production of circuit board
JP3261064B2 (en) * 1997-03-24 2002-02-25 日本メクトロン株式会社 Method of manufacturing flexible circuit board for semiconductor device
JPH1117331A (en) * 1997-06-26 1999-01-22 Nippon Mektron Ltd Manufacture of flexible circuit board
JP3541697B2 (en) * 1998-11-20 2004-07-14 ソニーケミカル株式会社 Manufacturing method of flexible wiring board
JP2001313451A (en) * 2000-04-28 2001-11-09 Nitto Denko Corp Manufacturing method for flexible wiring board
JP4459406B2 (en) * 2000-07-27 2010-04-28 ソニーケミカル＆インフォメーションデバイス株式会社 Flexible wiring board manufacturing method
JP2002156758A (en) * 2000-11-16 2002-05-31 Ube Ind Ltd Method for producing high-density flexible board using photosensitive polyimide
JP4570799B2 (en) * 2001-02-16 2010-10-27 日東電工株式会社 Method for manufacturing printed circuit board
JP4673507B2 (en) * 2001-06-29 2011-04-20 オプトレックス株式会社 Flexible wiring board alignment method

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