JP2006309738A - Wireless chip and electronic device having wireless chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wireless chip which can improve the mechanical strength and has high durability. <P>SOLUTION: The wireless chip includes a chip having a field-effect transistor, an antenna having a dielectric layer and a plurality of conductive layers holding the dielectric layer between them, and a conductive layer for connecting the chip and the antenna. Further, the wireless chip includes a chip having a field-effect transistor, an antenna having a dielectric layer and a plurality of conductive layers holding the dielectric layer between them, a sensor apparatus, a conductive layer for connecting the chip and the antenna, and a conductive layer connecting the chip and the sensor apparatus. Moreover, the wireless chip includes a chip having a field-effect transistor, an antenna having a dielectric layer and a plurality of conductive layers holding the dielectric layer between them, a battery, a conductive layer for connecting the chip and the antenna, and a conductive layer connecting the chip and the battery. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a wireless chip capable of communicating data by wireless communication and an electronic device having the wireless chip.

  In recent years, development of a wireless chip including a plurality of circuits and antennas has been advanced. Such wireless chips are called ID tags, IC tags, IC chips, RF (Radio Frequency) tags, wireless tags, electronic tags, and RFID (Radio Frequency Identification) tags, and have already been introduced in some markets. .

Many of these wireless chips currently in practical use have a circuit (also called an IC (Integrated Circuit) chip) using a semiconductor substrate such as silicon and an antenna. The antenna is formed by a printing method, a method of etching a conductive thin film, a plating method, or the like (see, for example, Patent Document 1).
JP-A-9-1970

  The antenna formed by the above method is a thin film or a thick film. An antenna attached to a flexible material such as paper or plastic is vulnerable to bending and bending, and part of the antenna is easily disconnected. In addition, a wireless chip having such an antenna has a problem of low durability.

  In view of the above-described problems, the present invention provides a wireless chip that can increase mechanical strength. In addition, a highly durable wireless chip is provided. Furthermore, it is an object to provide an article having a wireless chip.

One embodiment of the present invention is a wireless chip including a chip including a field effect transistor, an antenna including a dielectric layer and a plurality of conductive layers sandwiching the dielectric layer, and a conductive layer connecting the chip and the antenna.

Another aspect of the present invention is a chip having a field effect transistor, an antenna having a dielectric layer and a plurality of conductive layers sandwiching the dielectric layer, a sensor device, a conductive layer connecting the chip and the antenna, A wireless chip having a chip and a conductive layer connecting the sensor device. Note that the chip, the antenna, and the sensor device are mounted on a wiring board. Furthermore, the chip and the sensor device are mounted on the opposite side of the antenna on the wiring board.

According to another aspect of the present invention, a chip including a field effect transistor, an antenna including a dielectric layer and a plurality of conductive layers sandwiching the dielectric layer, a battery, a conductive layer connecting the chip and the antenna, and the chip And a conductive chip connecting the battery. Note that the chip, the antenna, and the battery are mounted on a wiring board. Furthermore, the chip and the battery are mounted on the opposite side of the antenna on the wiring board.

According to another aspect of the present invention, a chip having a field effect transistor, an antenna having a dielectric layer and a plurality of conductive layers sandwiching the dielectric layer, a battery, a sensor device, and a conductive material for connecting the chip and the antenna are provided. A wireless chip having a layer, a conductive layer connecting the chip and the battery, and a conductive layer connecting the chip and the sensor device. The chip, antenna, sensor device, and battery are mounted on a wiring board. Furthermore, the chip, the sensor device, and the battery are mounted on the opposite side of the antenna on the wiring board.

  Note that the plurality of conductive layers sandwiching the dielectric layer in the antenna function as a radiation electrode and a grounding body, respectively.

The dielectric layer of the antenna is formed of ceramic or organic resin, or a mixture of ceramic and organic resin. Representative examples of ceramics include alumina, glass, forsterite, barium titanate, lead titanate, strontium titanate, lead zirconate, lithium diobate, and lead zirconate titanate. Representative examples of the dielectric layer include epoxy resin, phenol resin, polybutadiene resin, bismaleimide triazine resin, vinyl benzyl, and polyfumarate.

Another embodiment of the present invention is an electronic device including the above wireless chip. Typical examples of electronic devices include liquid crystal display devices, EL display devices, television devices, mobile phones, printers, cameras, personal computers, speaker devices, headphones, navigation devices, on-board devices for ETC, and electronic keys. .

Further, since the patch antenna has high mechanical strength, it can be used repeatedly. Therefore, it can be provided in a highly recyclable container such as a returnable container.

In addition, a wireless chip including a sensor device can read information detected by the sensor device using a reader / writer. For this reason, it is possible to manage quality information and storage status of articles.

In addition, a wireless chip having a battery can spontaneously transmit a signal to a reader / writer. In addition, the communication distance with the reader / writer can be increased.

In addition, a wireless chip including a battery and a sensor device can spontaneously transmit information detected by the sensor device to the outside. For this reason, the detected information can be stored in the database in real time.

Embodiments of the present invention will be described below with reference to the drawings.
However, the present invention can be implemented in many different modes, and those skilled in the art can easily understand that the modes and details can be variously changed without departing from the spirit and scope of the present invention. Is done. Therefore, the present invention is not construed as being limited to the description of this embodiment mode. Note that in all the drawings for describing the embodiments, the same portions or portions having similar functions are denoted by the same reference numerals, and repetitive description thereof is omitted.

(Embodiment 1)
One embodiment of a wireless chip of the present invention is shown in FIG. FIG. 1 is a cross-sectional view of a wireless chip.

In the wireless chip of this embodiment, a chip 101 having a field effect transistor and an antenna (hereinafter referred to as a patch antenna 103) are connected by conductive layers 102a and 102b. Specifically, the connection terminal 104a formed on the surface of the chip 101 having the field effect transistor and the feeder layer 113 of the patch antenna are connected by the conductive layer 102a, and the connection formed on the surface of the chip 101 having the field effect transistor. Terminal 104b and conductive layer 112 functioning as a grounding body of the patch antenna are connected by conductive layer 102b. Further, the connection portion between the patch antenna 103 and the chip 101 having the field effect transistor may be filled with an underfill 104.

The patch antenna 103 includes a dielectric layer 110, a first conductive layer 111 formed on one surface of the dielectric layer 110, the first conductive layer 111 facing the dielectric layer 110, and a dielectric material. A second conductive layer 112 formed on the other surface of the layer 110 and a power feeding layer 113 are provided. The first conductive layer 111 functions as a radiation electrode. Further, the second conductive layer 112 functions as a grounding body. The power feeding layer 113 is provided so as not to contact the first conductive layer 111 and the second conductive layer 112. In addition, power is supplied from the patch antenna to the chip having the field effect transistor or from the chip having the field effect transistor to the patch antenna through the power supply layer 113. Note that power feeding may be performed using a power feeding point instead of the power feeding body layer 113.

Here, the structure of the patch antenna will be described.

The dielectric layer 110 of the patch antenna can be formed of ceramics, organic resin, a mixture of ceramics and organic resin, or the like. Representative examples of ceramics include alumina, glass, forsterite and the like. Further, a plurality of ceramics may be mixed and used. In order to obtain a high dielectric constant, the dielectric layer 110 is preferably formed of a ferroelectric material. Typical examples of the ferroelectric material include barium titanate (BaTiO ₃ ), lead titanate (PbTiO ₃ ), strontium titanate (SrTiO ₃ ), lead zirconate (PbZrO ₃ ), lithium diobate (LiNbO ₃ ). And lead zirconate titanate (PZT). Further, a plurality of ferroelectric materials may be mixed and used.

As the organic resin, a thermosetting resin or a thermoplastic resin is used as appropriate. As a typical example of the organic resin, a resin material such as an epoxy resin, a phenol resin, a polybutadiene resin, BT resin, vinyl benzyl, polyfumarate, and a fluorinated resin can be used. Furthermore, a plurality of organic resin materials may be mixed and used.

When the dielectric layer 110 is formed of a mixture of ceramics and an organic resin, it is preferable to form by dispersing particulate ceramic particles in the organic resin. At this time, the content of the particulate ceramic with respect to the dielectric layer 110 is preferably 20% by volume or more and 60% by volume or less. The particle size of the ceramic is preferably 1 to 50 μm.

The relative dielectric constant of the dielectric layer 110 is 2.6 to 150, and preferably 2.6 to 40. By using a ferroelectric material having a high relative dielectric constant, the volume of the patch antenna can be reduced.

For the first conductive layer 111, the second conductive layer 112, and the power feeding layer 113 of the patch antenna, a metal selected from gold, silver, copper, palladium, platinum, aluminum, an alloy, or the like can be used. Further, the first conductive layer 111, the second conductive layer 112, and the power feeding layer 113 of the patch antenna can be formed using a printing method or a plating method. In addition, after a conductive film is formed on the dielectric layer by vapor deposition, sputtering, or the like, each conductive layer can be formed by etching a part of the conductive film.

The planar area of the patch antenna 103 is preferably several mm × several mm to several tens mm × several tens mm. Typically, it is 7 mm × 7 mm to 12 mm × 12 mm. The patch antenna has a thickness of 1 mm to 15 mm, typically 1.5 mm to 5 mm. Further, the shape of the patch antenna is preferably a flat plate having a rectangular plane, but is not limited thereto. It is also possible to use a flat plate having a circular plane. Here, the plane is a surface on which a first conductive layer functioning as a radiation electrode or a second conductive layer functioning as a grounding body is formed.

The structure of the patch antenna will be described with reference to FIG.

FIG. 5A illustrates a first conductive layer 202 that functions as a radiation electrode, a dielectric layer 201, a second conductive layer 203 that functions as a grounding body, a feeding point 204, and a first conductive layer 202. , A patch antenna having a feeding body formed in through holes provided in the dielectric layer 201 and the second conductive layer 203 and connected to the feeding point 204. Note that the power supply body is connected to the first conductive layer 202 at the power supply point 204, but is not connected to the second conductive layer 203. When the first conductive layer 202 functioning as a radiation electrode is circular and has a degenerate molecular element 205 in two regions that are point-symmetric, a circularly polarized antenna is obtained. In addition, when the first conductive layer 202 is circular, the patch antenna is a linearly polarized antenna.

FIG. 5B shows a first conductive layer 212 that functions as a radiation electrode, a dielectric layer 211, a second conductive layer 213 that functions as a grounding body, a feeding point 214, and a first conductive layer 212. , A patch antenna having a feeding body formed in through holes provided in the dielectric layer 211 and the second conductive layer 213 and connected to the feeding point 214. Note that the power supply body is connected to the first conductive layer 212 at the power supply point 214, but is not connected to the second conductive layer 213. The first conductive layer 212 functioning as a radiation electrode is a rectangular and is a circularly polarized patch antenna when there are degenerate molecular elements 215 at two corners that are point-symmetric. In addition, when the first conductive layer 212 is rectangular, the patch antenna is a direct-polarized patch antenna.

FIG. 5C illustrates a patch antenna including a first conductive layer 222 that functions as a radiation electrode, a dielectric layer 221, a second conductive layer 223 that functions as a grounding body, and a feeder layer 224. . The first conductive layer 222 functioning as a radiation electrode is a circularly polarized patch antenna having a rectangular shape and having degenerate molecular elements 225 at two corners that are point-symmetric. When the first conductive layer 222 is a rectangle that does not have the degenerate molecular element 225, the patch antenna is a directly polarized patch antenna. The first conductive layer 222 functioning as a radiation electrode and the power feeding layer 224 are capacitively coupled through a gap. Further, since the power feeding layer 224 is formed on the side surface of the dielectric layer, surface mounting is possible.

The patch antenna shown in FIGS. 5A to 5C is provided with second conductive layers 203, 213, and 223 that function as a grounding body on one surface of the dielectric layers 201, 211, and 221. Therefore, the first conductive layers 202, 212, and 222 have directivity, and radio waves are radiated to the first conductive layer side.

FIG. 5D illustrates a patch antenna including a first conductive layer 242 that functions as a radiation electrode, a dielectric layer 241, a second conductive layer 243 that functions as a grounding body, and a power feeding layer 244. . As shown in FIG. 5D, orthogonal slits are formed on the diagonal line in the first conductive layer 242. In other words, the first conductive layer 242 functioning as a radiation electrode is provided with a cross notch. For this reason, the dielectric layer 241 is exposed in a cross shape. The first conductive layer 242 functioning as a radiation electrode and the power feeding layer 244 are capacitively coupled through a gap. Typical examples of patch antennas having such a shape include CABPB 1240, CABPB0730, and CABPB0715 (manufactured by TDK). Further, since the power feeding layer 244 is formed on the side surface of the dielectric layer 241, surface mounting is possible. Since the patch antenna having such a structure is non-directional due to the orthogonal slit of the first conductive layer 242 functioning as a radiation electrode, it can radiate radio waves in all directions. For this reason, it is not necessary to select a mounting place and an installation angle. For this reason, it is possible to expand the freedom degree of design of an electronic device.

In addition to the patch antenna shown in FIG. 5, a known patch antenna can be used.

In particular, by using a circularly polarized patch antenna, satellite transmission / reception such as GPS (Global Positioning System (1.5 GHz)) and satellite digital broadcasting (2.6 GHz), wireless LAN (Local Area Network) (2.4 GHz, PAN (Personal Area Network) such as 5.2 GHz), Bluetooth (trademark) (2.4 GHz), UWB (Ultra Wide Band) (3 to 10 GHz), third generation data communication, packet communication Etc. can be transmitted and received.

Next, the chip 101 having a field effect transistor will be described with reference to FIG.

  FIG. 4 is a cross-sectional view of a part of a chip 101 having field effect transistors. Element isolation regions 501a to 501e are formed on a substrate 500, and a field effect transistor 502 is formed between the element isolation regions 501a to 501e. .

The field effect transistor 502 includes a gate insulating film 503 formed over a single crystal semiconductor substrate, a gate electrode 504 formed over the gate insulating film, source and drain regions 505a and 505b in the single crystal semiconductor substrate, and over the gate electrode. An interlayer insulating layer 508 is formed, and source and drain wirings 509a and 509b connected to the source and drain regions 505a and 505b are provided. Note that sidewalls 507a and 507b formed on the sidewalls of the gate electrode 504 and the gate insulating film 503, or low-concentration impurity regions 506a and 506b covered with the sidewalls 507a and 507b in the single crystal semiconductor substrate may be provided.

The substrate 500 is a single crystal semiconductor substrate or a compound semiconductor substrate, and is typically an n-type or p-type single crystal silicon substrate, GaAs substrate, InP substrate, GaN substrate, SiC substrate, sapphire substrate, ZnSe substrate, or the like. Is mentioned. An SOI substrate (Silicon On Insulator) can also be used. In this embodiment, an n-type single crystal silicon substrate is used as the substrate 500.

The element isolation regions 501a to 501e can be formed using a known selective oxidation method (LOCOS (Local Oxidation of Silicon) method) or a trench isolation method as appropriate. Here, as the element isolation regions 501a to 501e, silicon oxide layers are formed by a trench isolation method.

The gate insulating film 503 is formed by thermally oxidizing a single crystal semiconductor substrate. The gate electrode 504 can have a stacked structure in which a polycrystalline silicon layer with a thickness of 100 to 300 nm or a silicide layer such as a tungsten silicide layer, a molybdenum silicide layer, or a cobalt silicide layer is provided over the polycrystalline silicon layer. Further, a tungsten nitride layer and a tungsten layer may be stacked over the polycrystalline silicon layer.

As the source and drain regions 505a and 505b, an n ⁺ region in which phosphorus is added to the p well region or a p ⁺ region in which boron is added to the n well region can be used. Further, the low concentration impurity regions 506a, 506b is, p-well region phosphorus is added to the n ^- can be used region ^- p with boron in the region and n-well region has been added. Since an n-type single crystal silicon substrate is used here, boron is added to the substrate to form a source region and a drain region made of p ⁺ regions and a low-concentration impurity region made of p ⁻ regions. Note that the source and drain regions 505a and 505b may include silicide such as manganese silicide, tungsten silicide, titanium silicide, cobalt silicide, or nickel silicide. By having silicide on the surface of the source region and the drain region, it is possible to reduce the connection resistance between the source wiring and the drain wiring and the source region and the drain region.

  The sidewalls 507a and 507b are formed by forming an insulating layer formed of silicon oxide on a substrate by a CVD method and anisotropically etching the insulating layer by a RIE (Reactive ion etching) method. it can.

The interlayer insulating layer 508 is formed using an inorganic insulating material such as silicon oxide or silicon oxynitride, or an organic insulating material such as an acrylic resin or a polyimide resin. When a coating method such as spin coating or roll coater is used, silicon oxide in which an insulating layer is formed by heat treatment after coating an insulating film material dissolved in an organic solvent can also be used. Here, the interlayer insulating layer 508 is formed using silicon oxide.

  The source and drain wirings 509a and 509b are formed of a low resistance material such as aluminum (Al), such as a laminated structure of titanium (Ti) and aluminum (Al), a laminated structure of molybdenum (Mo) and aluminum (Al), and the like. It is preferably formed by a combination with a barrier metal using a refractory metal material such as titanium (Ti) or molybdenum (Mo).

Note that the chip 101 having a field effect transistor may include a resistance element, a capacitor, and the like in addition to the field effect transistor.

  In addition, an interlayer insulating layer 511 is formed over the interlayer insulating layer 508 and the source and drain wirings 509a and 509b. The interlayer insulating layer 511 is formed in the same manner as the interlayer insulating layer 508. Further, connection terminals 512 and 513 connected to the field effect transistor 502 are provided over the interlayer insulating layer 508.

  In addition, an insulating layer 514 that covers part of the connection terminals 512 and 513 and the interlayer insulating layer 511 may be formed. The insulating layer 514 functions as a protective layer, and is preferably formed using silicon nitride, silicon oxide, silicon nitride oxide, silicon oxynitride, DLC (diamond-like carbon), or the like.

  The conductive layers 102a and 102b that connect the patch antenna 103 and the chip 101 having a field effect transistor are formed of a bump, a conductive paste, an anisotropic conductive adhesive, an anisotropic conductive film, or the like. Further, a pump and a conductive paste may be used. Furthermore, bumps and anisotropic conductive adhesives, bumps and anisotropic conductive films may be used. In these cases, the conductive layer and the connection terminal are connected by the bump and the conductive particles.

    An anisotropic conductive film and an anisotropic conductive adhesive are adhesive organic resins in which conductive particles having a particle size of several nm to several μm are dispersed, and examples of the organic resins include epoxy resins and phenol resins. . The conductive particles are formed of one element or a plurality of elements selected from gold, silver, copper, palladium, or platinum. Moreover, the particle | grains which have the multilayer structure of these elements may be sufficient. Furthermore, even if it uses the electroconductive particle by which the surface of the particle | grains formed with resin was coated with the thin film formed with one metal selected from gold | metal | money, silver, copper, palladium, or platinum, or several metals. Good.

    The underfill 104 has functions such as reinforcement of a connection portion between the chip 101 having a field effect transistor and the patch antenna 103 and protection of moisture intrusion from the outside, using an epoxy resin, an acrylic resin, a polyimide resin, or the like. It is formed.

  Next, a configuration of the wireless chip 900 described in this embodiment is described with reference to FIG. The wireless chip 900 of this embodiment includes a chip 901 having a field effect transistor and an antenna 902.

    A chip 901 having a field effect transistor includes an arithmetic processing circuit portion 903, a memory portion 904, a communication circuit portion 905, and a power supply circuit portion 907. The memory unit 904 includes one or both of a read-only memory and a rewritable memory. The memory unit 904 includes one or more selected from static RAM (Static RAM), EEPROM (Electrically Erasable Programmable Read-Only Memory), flash memory, and organic memory, and is received via the antenna 902. Information from outside can be recorded at any time.

Note that an organic memory is a memory in which a layer having an organic compound is interposed between a pair of electrodes. An organic memory is a memory in which a mixed layer of an organic compound and an inorganic compound is provided between a pair of electrodes. As a typical example of an organic compound, a substance whose crystal state, conductivity, and shape change by voltage application or light irradiation can be given. Typically, a conjugated polymer doped with a compound that generates an acid by absorbing light (a photoacid generator), an organic compound having a hole transporting property, or an organic compound having an electron transporting property is used. it can.

  Since the organic memory can simultaneously realize downsizing, thinning, and large capacity, the wireless chip can be reduced in size and weight by providing the memory portion 904 as an organic memory.

  Note that the memory portion 904 may be configured by a storage element having a floating gate structure in which data can be sequentially written and data is not lost. In particular, a memory element having a floating gate structure which can be written only once can be used, and the wireless chip can be reduced in size by simplifying the function. In addition, power can be saved.

  The communication circuit unit 905 includes a demodulation circuit 912 and a modulation circuit 913, respectively. The demodulation circuit 912 demodulates signals input via the antenna 902 and outputs the demodulated signals to the arithmetic processing circuit unit 903. The signal includes information to be stored in the memory unit 904. Information read from the memory unit 904 is output to the modulation circuit 913 through the arithmetic processing circuit unit 903. The modulation circuit 913 modulates this signal into a signal capable of wireless communication, and outputs the signal to an external device via the antenna 902.

  Electric power necessary for operating the arithmetic processing circuit unit 903, the memory unit 904, and the communication circuit unit 905 is supplied via the antenna 902.

  The antenna 902 receives electromagnetic waves supplied from an external device called a reader / writer and generates necessary power in the power supply circuit unit 907. The antenna 902 may be appropriately designed according to the frequency band for communication. As the electromagnetic wave frequency band, a long wave band of 30 to 135 kHz, a short wave band of 6 to 60 MHz (typically 13.56 MHz), an ultra short wave band of 400 to 950 MHz, a microwave band of 2 to 25 GHz, or the like may be used. it can. As the long wave band or short wave band antenna, an antenna using electromagnetic induction by a loop antenna is used. In addition, a mutual inductive action (electromagnetic coupling method) or an electrostatic induction action (electrostatic coupling method) may be used. Power is generated by the power supply circuit unit 907. As the antenna 902, a data communication antenna and a power supply antenna may be provided separately.

  The patch antenna 103 shown in FIG. 1 can be used for the antenna 902 shown in FIG. 6, and the chip 101 having the field effect transistor shown in FIG. 1 can be used for the chip 901 having the field effect transistor shown in FIG. As a result, the durability of the wireless chip is increased.

(Embodiment 2)
One embodiment of a wireless chip of the present invention is shown in FIG. FIG. 2 is a cross-sectional view of the wireless chip. In this embodiment mode, a structure of a wireless chip including a chip having a field effect transistor, a patch antenna, and a sensor device will be described.

In the wireless chip of this embodiment, a chip 101 having a field effect transistor is mounted on a wiring substrate 121. Specifically, the connection terminals 104a to 104c formed on the surface of the chip 101 having a field effect transistor and the connection terminals 125a to 125c formed on the wiring substrate 121 are connected by conductive layers 102a to 102c, respectively.

In addition, the sensor device 122 is mounted on the wiring board 121. Specifically, the connection terminal 126 formed on the surface of the sensor device 122, the connection terminal 127 formed on the wiring substrate 121, and the conductive layer 129 are connected.

Note that the connection terminals 125a to 125c formed on the wiring board 121 and the connection terminal 127 are connected by a conductive layer formed in a wiring formed in the wiring board 121, a via hole, a through hole, or the like. That is, the chip 101 having a field effect transistor and the sensor device 122 are electrically connected.

The patch antenna 103 is mounted on the wiring board 121. Specifically, the feeder layer 113 of the patch antenna 103 and the connection terminal 123a formed on the wiring substrate 121 are connected by the conductive layer 124a, and the conductive layer 112 functioning as a grounding body of the patch antenna and the wiring substrate. The connection terminal 123b formed on the substrate is connected by the conductive layer 124b.

Further, although not shown, the connection terminal 123a and the connection terminal 125a are connected by a conductive layer formed in a via hole, a through hole, or the like of the wiring board 121. Similarly, the connection terminal 123b and the connection terminal 125b are connected by a conductive layer formed in a via hole, a through hole, or the like of the wiring board 121. That is, the chip 101 having a field effect transistor and the patch antenna 103 are electrically connected.

Here, the patch antenna 103 and the chip 101 having a field effect transistor are mounted on the opposite side of the wiring substrate 121. For this reason, the connection terminals 123 a and 123 b are formed on one surface of the wiring substrate 121, and the connection terminals 125 a and 125 b are formed on the other surface of the wiring substrate 121. However, the connection terminals 123a and 123b and the connection terminals 125a and 125b are formed on one surface of the wiring substrate 121, and the patch antenna 103 and the chip 101 having a field effect transistor are mounted on one surface of the wiring substrate. May be.

The wiring board 121 is a plate-like board or a flexible board, and a multilayer wiring board having a plurality of wiring layers in the board is used. Examples of the hard wiring board include a board formed using glass epoxy resin, ceramics, alumina, alumina nitride, or the like. Typical examples of the flexible wiring board include a board formed of polyimide such as a TAB (Tape Automated Bonding) board and an FPC (Flexible Printed Board).

The connection terminals 123a, 123b, 125a to 125c, and 127 formed on the wiring board 121 are formed using copper, gold, or the like. Each connection terminal is connected to the wiring formed on the surface of the wiring board 121 and inside.

In addition, a connection portion between the patch antenna 103 and the wiring substrate 121, a connection portion between the chip 101 having a field effect transistor and the wiring substrate 121, and a connection portion between the sensor device 122 and the wiring substrate 121 are filled with underfills 114 to 116. May be.

The conductive layers 102c, 124a to 124b, and 129 are formed in the same manner as the conductive layers 102a and 102b described in Embodiment 1. The underfills 114 to 116 are formed in the same manner as the underfill 104 of the first embodiment.

Here, the structure of the wireless chip of the present invention will be described with reference to FIG. In addition to the wireless chip described in Embodiment 1, the wireless chip of this embodiment includes a sensor device 908 that is connected to the arithmetic processing circuit portion 903 through a bus 910. The sensor device 908 includes a sensor element 906 and a sensor circuit 909.

The sensor device uses a device that can detect temperature, pressure, flow rate, light, magnetism, sound wave, acceleration, humidity, gas component, liquid component, and other characteristics by physical or chemical means. The sensor device 908 includes a sensor element 906 and a sensor circuit 909 that controls the sensor element 906. The sensor element 906 is formed of an element such as a low resistance element, a capacitive coupling element, an inductive coupling element, a photovoltaic element, a photoelectric conversion element, a thermoelectric element, a transistor, a thermistor, a diode, a capacitance element, or a piezoelectric element. The A plurality of sensor elements 906 may be provided. In this case, a plurality of physical quantities or chemical quantities can be detected simultaneously.

The physical quantity here refers to temperature, pressure, flow rate, light, magnetism, sound wave, acceleration, humidity, etc., and the chemical quantity refers to chemicals such as components contained in gas components such as gases and liquids such as ions. It refers to substances. In addition, the chemical amount includes organic compounds such as specific biological substances (for example, blood glucose level contained in blood) contained in blood, sweat, urine and the like. In particular, when a chemical quantity is to be detected, a specific substance is necessarily selectively detected. Therefore, a substance that selectively reacts with a substance to be detected is provided in advance in the detection element 31. . For example, when detecting a biological substance, it is preferable that an enzyme, an antibody molecule, a microbial cell, or the like that selectively reacts with the biological substance to be detected by the detection element 31 is fixed to a polymer or the like. Here, as the sensor element 906, an optical sensor formed using single crystal silicon is used.

The sensor circuit 909 detects a change in impedance, reactance, inductance, voltage, or current, performs analog / digital conversion (A / D conversion), and outputs a signal to the arithmetic processing circuit unit 903.

Information detected by the sensor device 908 is output to the modulation circuit 913 through the bus 910 and the arithmetic processing circuit unit 903, respectively. The modulation circuit 913 modulates this signal into a signal capable of wireless communication, and outputs the signal to an external device via the antenna 902.

Further, this embodiment and Embodiment 1 can be combined as appropriate.

The wireless chip of this embodiment can transmit information detected by the sensor device to the outside. Further, it is possible to convert information detected by the sensor device into a signal and transmit the signal to the reader / writer via the antenna. For this reason, it is possible to improve confidentiality. In addition, since information detected by the sensor can be recorded in the memory portion, a device having a sensor function can be downsized.

(Embodiment 3)
One embodiment of a wireless chip of the present invention is shown in FIG. FIG. 3 is a cross-sectional view of the wireless chip.

The wireless chip of this embodiment is a wireless chip that includes a battery in the wireless chip described in Embodiment 1. Specifically, the connection terminals 104a to 104c formed on the surface of the chip 101 having a field effect transistor and the connection terminals 125a to 125c formed on the wiring substrate 121 are connected by conductive layers 102a to 102c, respectively.

In addition, the battery 141 is mounted on the wiring board 121. Specifically, the connection terminal 142 formed on the surface of the battery 141 and the connection terminal 143 formed on the wiring substrate 121 are connected by the conductive layer 144.

The connection terminals 125a to 125c formed on the wiring board 121 and the connection terminal 143 are connected by a conductive layer such as a wiring, a via hole, or a through hole formed on the wiring board 121. That is, the chip 101 having a field effect transistor and the battery 141 are connected. Specifically, the power supply circuit unit 907 of the chip 101 having a field effect transistor and the battery 141 are connected.

In addition, the patch antenna 103 is mounted on the wiring board 121. Specifically, the feeder layer 113 of the patch antenna 103 and the connection terminal 123a formed on the wiring substrate 121 are connected by the conductive layer 124a, and the conductive layer 112 functioning as a grounding body of the patch antenna and the wiring substrate. The connection terminal 123b formed on the substrate is connected by the conductive layer 124b. That is, the chip 101 having a field effect transistor and the patch antenna 103 are connected.

The battery 141 is preferably small, and more preferably in the form of a sheet having a thickness of 0.5 mm or less and 0.1 mm or more. The battery is preferably rectangular from the viewpoint of ease of production, but it may be circular, elliptical, or polygonal. Further, the battery 141 may be a primary battery or a secondary battery. The battery 141 can be miniaturized by using a lithium battery, preferably a lithium polymer battery using a gel electrolyte, an organic radical battery using a gel electrolyte, a lithium ion battery, or the like.

Note that in the case where the battery 141 is a secondary battery, a device having a photovoltaic effect such as a solar cell using single crystal silicon or amorphous silicon or a dye-sensitized solar cell is provided on the wiring substrate 121. preferable. Further, a piezoelectric element that converts energy generated by a load or movement into an electric signal by a piezoelectric effect may be provided.

In addition, a connection portion between the patch antenna 103 and the wiring substrate 121, a connection portion between the chip 101 having a field effect transistor and the wiring substrate 121, and a connection portion between the battery 141 and the wiring substrate are filled with underfills 114 to 116. Also good.

Note that this embodiment and Embodiment 1 can be combined as appropriate. Alternatively, the battery 141 may be provided for a wireless chip including the sensor device as described in Embodiment 2.

The wireless chip including the battery 141 can spontaneously transmit a signal to the reader / writer.

The wireless chip of the present invention has a wide range of uses. For example, vehicles (bicycles 3901 (see FIG. 11B), automobiles, etc.), foods, plants, clothing, household goods (類 3900 (FIG. 11 ( A) and the like), electronic devices, inspection devices, fireworks balls (see FIG. 11G) and other articles, animals, and human bodies can be used with the wireless chip 20 provided. Electronic devices include a liquid crystal display device, an EL (Electro Luminescence) display device, a television device (also simply referred to as a television, a television receiver, or a television receiver), a mobile phone 3902 (see FIG. 11C), a printer, Camera, personal computer, goggles with earphones 3903 (see FIG. 11D), speaker device 3904 (see FIG. 11E), headphones 3905 (see FIG. 11F), navigation device, ETC (Electronic Toll Collection: This refers to on-board devices and electronic keys for automatic toll collection systems such as toll roads.

By providing the wireless chip 20 of the present invention on the eaves 3900, the bicycle 3901, etc., it is possible to detect these locations by GPS. As a result, it is possible to find a stolen bicycle. It also makes it easier to search for missing persons.

Further, by mounting the wireless chip 20 of the present invention on the mobile phone 3902, information can be transmitted and received and a call can be made.

In addition, by mounting the wireless chip of the present invention on the goggles with earphones 3903, the speaker device 3904, and the headphones 3905, music played back on the audio device can be enjoyed without connecting the audio device and the electronic device with a cord. Is possible. Further, a small hard disk (storage device) may be provided in the goggles with earphones 3903 together with the wireless chip 20. In addition, when the wireless chip 20 includes a central processing unit, the audio signal encrypted by the audio device can be received, demodulated, and amplified by the goggles with earphones 3903, the headphones 3905, and the speaker device 3904. High voice can be heard. In addition, since it is cordless, it is easy to attach the goggles with earphones 3903 and the headphones 3905, and the speaker device 3904 can be easily installed. In this case, the goggles with headphones, headphones, and speaker device are preferably provided with a battery.

In addition, by providing the wireless chip 20 of the present invention in the firework ball 3906, the quality control of the firework ball can be performed. Specifically, by providing the wireless chip 20 having the sensor device on the split medicine filled in the inside of the fireworks ball or on the skin of the surface of the firework ball, the humidity, temperature, etc. of the firework ball detected by the sensor device Information can be transmitted to the reader / writer. As a result, it is possible to perform quality control of the firework balls, avoid launching the wet firework balls, and prevent accidents due to falling of the misfire balls.

The wireless chip of the present invention is fixed to an article by being mounted on a printed board, pasted on a surface, or embedded. For example, a package made of an organic resin is embedded in the organic resin and fixed to each article. In addition, by providing the wireless chip of the present invention to foods, plants, clothing, daily necessities, electronic devices, etc., animals, and human bodies, the efficiency of inspection systems, inspection systems, etc. should be improved. Can do.

Next, one mode of an electronic device on which the wireless chip of the present invention is mounted will be described with reference to the drawings. The electronic device illustrated here is a mobile phone, which includes housings 2700 and 2706, a panel 2701, a housing 2702, a printed wiring board 2703, operation buttons 2704, and a battery 2705 (see FIG. 12). The panel 2701 is detachably incorporated in the housing 2702, and the housing 2702 is fitted on the printed wiring board 2703. The shape and dimensions of the housing 2702 are changed as appropriate in accordance with the electronic device in which the panel 2701 is incorporated. A plurality of packaged semiconductor devices and the wireless chip 2710 of the present invention are mounted on the printed wiring board 2703.

The panel 2701 is connected to the printed wiring board 2703 through the connection film 2708. The panel 2701, the housing 2702, and the printed wiring board 2703 are housed in the housings 2700 and 2706 together with the operation buttons 2704 and the battery 2705. A pixel region 2709 included in the panel 2701 is arranged so as to be visible from an opening window provided in the housing 2700.

Note that the housings 2700 and 2706 are examples of the appearance of a mobile phone, and the electronic device according to the present embodiment can be transformed into various modes depending on the function and application.

  Here, a block diagram of a high-frequency circuit typified by a data demodulation and modulation circuit of a mobile phone will be described with reference to FIG.

First, a process of sending a signal received by the antenna to the baseband unit will be described. The received signal input to the antenna 301 is input from the duplexer 302 to the low noise amplifier (LNA) 303 and amplified to a predetermined signal. The received signal input to the low noise amplifier (LNA) 303 is input to the mixer 305 via the band-pass filter (BPF) 304. An RF signal from the hybrid circuit 306 is input to the mixer 305, and an RF signal component is removed by a band-pass filter (BPF) 307 and demodulated. The reception signal output from the mixer 305 is amplified by the amplifier 309 through the SAW filter 308 and then input to the mixer 310. A local transmission signal having a predetermined frequency is input to the mixer 310 from the local transmission circuit 311, converted to a desired frequency, amplified to a predetermined level by the amplifier 312, and then sent to the baseband unit 313. The antenna 301, the duplexer 302, and the low-pass filter 328 are referred to as an antenna front end module 331.

Next, a process of transmitting a signal transmitted from the baseband unit with an antenna will be described. The transmission signal transmitted from the baseband unit 313 is mixed with the RF signal from the hybrid circuit 306 by the mixer 321. A voltage control transmission circuit (VCO) 322 is connected to the hybrid circuit 306 so that an RF signal having a predetermined frequency is supplied.

The transmission signal RF-modulated by the mixer 321 is amplified by a power amplifier (PA) 324 through a band pass filter (BPF) 323. A part of the output of the power amplifier (PA) 324 is taken out from the coupler 325, adjusted to a predetermined level by an attenuator (APC) 326, and then input to the power amplifier (PA) 324 again. PA) 324 is adjusted so that the gain is constant. The transmission signal transmitted from the coupler 325 is input to the duplexer 302 via the isolator 327 for preventing backflow and the low pass filter (LPF) 328, and is transmitted from the antenna 301 connected thereto. The attenuator (APC) 326, the power amplifier (PA) 324, the coupler 325, and the isolator 327 are referred to as an isolator power amplifier module 332.

Since the wireless chip of the present invention includes a high-frequency circuit and an antenna typified by the demodulation and modulation circuit, the number of components can be reduced. Since the number of components mounted on the wiring board can be reduced, the area of the wiring board can be reduced. As a result, the mobile phone can be reduced in size.

Next, an example of an inspection apparatus capable of wirelessly transmitting detected biological function data will be described with reference to FIG. In the inspection device 3950 shown in FIG. 13A, a wireless chip 3951 of the present invention is provided in a capsule 3952 coated with a protective layer. A filler 3953 may be filled between the capsule 3952 and the wireless chip 3951.

In the inspection device 3955 shown in FIG. 13B, a wireless chip 3951 of the present invention is provided in a capsule 3952 coated with a protective layer. In addition, the electrode 3956 of the wireless chip is exposed outside the capsule 3952. A filler 3953 may be filled between the capsule 3952 and the wireless chip 3951.

The wireless chip 3951 of the inspection devices 3950 and 3955 is a wireless chip having a sensor device as shown in the second or third embodiment. In the sensor device, physical quantities and chemical quantities are measured to detect functional data of the living body. In addition, the detected result can be converted into a signal and transmitted to the reader / writer. As the physical quantity, when detecting pressure, light, sound wave, or the like, an inspection device 3950 in which the electrode is not exposed to the outside of the capsule 3952 as shown in FIG. In addition, when detecting a chemical substance such as a gas component such as temperature, flow rate, magnetism, acceleration, humidity, gas, or a component contained in a liquid such as ions, an electrode 3956 as a capsule is used as shown in FIG. It is preferable to use an inspection device 3955 exposed to the outside of 3952.

Note that in the case where the inspection apparatus is an apparatus that images the inside of the body, the inspection apparatus may be provided with a light emitting device such as an LED (Light Emitting Diode) or an EL. As a result, the inside of the body can be imaged.

The protective layer provided on the surface of the capsule preferably contains diamond-like carbon (DLC), silicon nitride, silicon oxide, silicon nitride, silicon oxynitride, or carbon nitride. Known capsules and fillers are appropriately used. By providing a protective layer on the capsule, it is possible to prevent the capsule and the wireless chip from being dissolved and denatured in the body.

Note that a wireless chip having a battery as described in Embodiment 3 may be used for the sensor device in order to spontaneously transmit detection result data from the inspection device to the reader / writer.

Next, a method for using the inspection apparatus will be described. As shown in FIG. 13C, the subject 3962 swallows the inspection device 3950 or 3955 and moves the body cavity 3963. The result detected by the sensor device of the wireless chip is transmitted to a reader / writer 3961 installed in the vicinity of the subject. The reader / writer receives this result. As a result, it is possible to detect the functional data of the subject's living body on the spot without collecting the wireless chip. Moreover, it is possible to image the state of the body cavity and digestive organs.

In addition, as shown in FIG. 13D, the test device 3950 or 3955 is embedded in the body of the subject 3962, and the result detected by the sensor device of the wireless chip is transmitted to the reader / writer 3964 installed in the vicinity of the subject. To do. In this case, it is embedded in the inspection apparatus 3955 so that the electrode 3957 is in contact with the measurement target portion of the subject. The reader / writer receives this result. It is possible to manage the biological information of the subject by recording and processing the reception result by the biological information management computer. In addition, by providing the reader / writer 3964 on the bed 3960, it is possible to always detect the biological information of the subject whose physical function is incomplete and difficult to move, and to manage the medical condition and health state of the subject. .

This example can be combined with any of the above embodiments as appropriate.

In this embodiment, in a wireless chip having a sensor device, a detection method by the sensor device and a transmission / reception method of the detection information will be described with reference to FIGS.

FIG. 8A illustrates an example of a sensor device that detects ambient brightness or the presence or absence of light irradiation. The sensor device 908 includes a sensor element 906 and a sensor circuit 909. The sensor element 906 is formed of a photodiode, a phototransistor, or the like. The sensor circuit 909 includes a sensor drive circuit 952, a detection circuit 153, and an A / D conversion circuit 954.

  FIG. 8B is a circuit diagram illustrating the detection circuit 953. When the reset TFT 955 is turned on, a reverse bias voltage is applied to the sensor element 906. Here, an operation in which the potential of the negative terminal of the sensor element 906 is charged to the potential of the power supply voltage is referred to as “reset”. Thereafter, the reset TFT 955 is turned off. At that time, due to the electromotive force of the sensor element 906, the potential state changes with time. That is, the potential of the negative terminal of the sensor element 906 that has been charged to the potential of the power supply voltage gradually decreases due to the charge generated by the photoelectric conversion. When the bias TFT 957 is turned on after a certain time has elapsed, a signal is output to the output side through the amplification TFT 956. In this case, the amplification TFT 956 and the bias TFT 957 operate as a so-called source follower circuit. Although FIG. 8B shows an example in which the source follower circuit is formed of an n-channel TFT, it can of course be formed of a p-channel TFT. A power supply voltage Vdd is applied to the amplification side power supply line 958. The bias-side power supply line 959 is given a reference potential of 0 volts. The drain side terminal of the amplification TFT 956 is connected to the amplification side power supply line, and the source side terminal is connected to the drain terminal of the bias TFT 957. The source side terminal of the bias TFT 957 is connected to the bias side power line 959. A bias voltage Vb is applied to the gate terminal of the bias TFT 957, and a bias current Ib flows through the TFT. The bias TFT 957 basically operates as a constant current source. The input voltage Vin is applied to the gate terminal of the amplifying TFT 956, and the source terminal becomes the output terminal. The input / output relationship of this source follower circuit is Vout = Vin−Vb. This output voltage Vout is converted into a digital signal by the A / D conversion circuit 954. The digital signal is output to the arithmetic processing circuit unit 903.

  FIG. 9 is a flowchart for explaining the operation of the data management device 401 and the wireless chip 900 having the sensor device 908. The data management device 401 transmits control signals such as a sensor device activation signal, a data read signal, and a data write signal. The wireless chip 900 receives the control signal. The wireless chip 900 identifies a control signal with an arithmetic processing circuit. Then, it is determined which operation is to be performed among the operation of measuring and recording data by operating the sensor element 906, the operation of reading data recorded in the memory unit, and the operation of writing data to the memory unit. In the operation of measuring and recording data, the sensor circuit 909 is operated, the signal of the sensor element 906 is read, binarization is performed via the sensor circuit 909, and the data is recorded in the memory unit. In the operation of writing data, the data transmitted from the data management device 401 is written into the memory unit 904. In the operation of reading the data recorded in the memory unit, the operation of reading the data in the memory unit 904 and transmitting it to the data management device 401 is performed. The power necessary for the operation of the circuit is generated at the same time as signal transmission or at any time.

  Next, a system for transmitting / receiving information detected by the sensor device 908 of the wireless chip to / from the reader / writer of the data management device 401 will be described with reference to FIG. FIG. 10 illustrates an example of a wireless chip 900 of the present invention and a reader / writer 920 that transmits and receives information of the wireless chip 900. The reader / writer 920 includes an antenna 921, a communication circuit unit 922 including a transmitter 923, a demodulation circuit 924, and a modulation circuit 925. In addition, an arithmetic processing circuit unit 926 and an external interface unit 927 are provided. In order to encrypt and transmit the control signal, an encryption / decryption circuit unit 928 and a memory unit 929 may be provided. The power supply circuit unit 930 supplies power to each circuit, and supplies the power supplied from the external power supply 931 to each circuit.

  Information detected by the sensor device 908 of the wireless chip 900 is processed by the arithmetic processing circuit unit 903 and then held in the memory unit 904. A signal 942 transmitted as a radio wave via the modulation circuit 925 of the reader / writer 920 is converted into an AC electrical signal by electromagnetic induction in the antenna 902 of the wireless chip 900. The demodulation circuit 912 of the communication circuit unit 905 demodulates the alternating electrical signal and transmits it to the arithmetic processing circuit unit 903 at the subsequent stage. The arithmetic processing circuit unit 903 calls information detected by the sensor device held in the memory unit 904 in accordance with the input signal. Then, a signal is sent from the arithmetic processing circuit unit 903 to the modulation circuit 913, and modulated by the modulation circuit 913 into an AC electrical signal. Then, the AC electrical signal 941 is transmitted to the antenna 921 of the reader / writer 920 via the antenna 902.

  An AC electrical signal 941 received by the antenna 921 of the reader / writer 920 is demodulated by the demodulation circuit 924 of the communication circuit unit 922 and transmitted to the subsequent arithmetic processing circuit unit 926 and the external interface unit 927. Information detected by the sensor device is displayed on a data management device 401 such as a display or a computer connected to the external interface unit 927.

In this embodiment, a management system for greenhouses and cultivated plants will be described with reference to FIG.

The greenhouse and cultivated plant management system shown in FIG. 15 includes wireless chips 605 to 607 in the greenhouses 601 to 603, respectively. The wireless chips 605 to 607 have a battery and a sensor device. The sensor device uses a sensor device that detects temperature, humidity, illuminance, and the like.

The sensor device of the wireless chip measures information such as the temperature, humidity, and illuminance of the greenhouses 601 to 603 and transmits the measurement result to the reader / writer 608. Since the wireless chip of this embodiment has a battery and can set a long transmission distance, it is not necessary to provide a reader / writer for each greenhouse, and the number of reader / writers can be reduced.

The reader / writer 608 is connected to the interface 611, and information such as the temperature, humidity, and illuminance of the greenhouse received by the reader / writer 608 is transmitted to the database 612 of the producer's house, management center, etc. via the interface 611. The Information such as temperature, humidity, and illuminance is stored in a database and displayed on a terminal 613 provided in a producer's house, management center, or the like.

The interface 611 is an information transmission / reception unit that transmits information detected by the sensor devices of the wireless chips 605 to 607 to the outside, and the Internet, a telephone line, or the like can be used.

By providing the wireless chip of the present invention in a greenhouse, it is possible to remotely grasp information such as the temperature, humidity, and illuminance of the greenhouse in real time and to perform detailed cultivation records.

This example and any of the above embodiments can be combined as appropriate.

1 is a cross-sectional view illustrating a wireless chip according to the present invention. 1 is a cross-sectional view illustrating a wireless chip according to the present invention. 1 is a cross-sectional view illustrating a wireless chip according to the present invention. It is sectional drawing explaining the chip | tip which has the field effect transistor effect based on this invention. It is a perspective view explaining the patch antenna applicable to this invention. FIG. 10 illustrates a wireless chip according to the present invention. FIG. 10 illustrates a wireless chip according to the present invention. FIG. 10 illustrates a wireless chip according to the present invention. It is a figure explaining the operation | movement method of the radio | wireless chip based on this invention. It is a figure explaining the transmission / reception method of the radio | wireless chip and reader / writer concerning this invention. It is a figure explaining the application example of the radio | wireless chip of this invention. It is an expanded view explaining the application example of the radio | wireless chip of this invention. It is a figure explaining the application example of the radio | wireless chip of this invention. It is a figure explaining the high frequency circuit applicable to this invention. It is a figure explaining the application example of the radio | wireless chip of this invention.

Claims (13)

An antenna having a first conductive layer, a second conductive layer functioning as a grounding body, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer;
A chip having a field effect transistor;
A third conductive layer connecting the antenna and the chip;
A wireless chip comprising: An antenna having a first conductive layer, a second conductive layer functioning as a grounding body, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer;
A wiring board;
A chip having a field effect transistor;
A sensor device;
A third conductive layer connecting the wiring board and the antenna;
A fourth conductive layer connecting the wiring substrate and the chip;
A fifth conductive layer connecting the wiring board and the sensor device;
A wireless chip comprising: An antenna having a first conductive layer, a second conductive layer functioning as a grounding body, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer;
A wiring board;
A chip having a field effect transistor;
A sensor device;
Battery,
A third conductive layer connecting the wiring board and the antenna;
A fourth conductive layer connecting the wiring substrate and the chip;
A fifth conductive layer connecting the wiring board and the sensor device;
A sixth conductive layer connecting the wiring board and the battery;
A wireless chip comprising:   4. The wireless chip according to claim 3, wherein the battery and the chip are electrically connected using the fourth conductive layer and the sixth conductive layer.   5. The wireless device according to claim 2, wherein the sensor device and the chip are electrically connected to each other using the fourth conductive layer and the fifth conductive layer. Chip. An antenna having a first conductive layer, a second conductive layer functioning as a grounding body, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer;
A wiring board;
A chip having a field effect transistor;
Battery,
A third conductive layer connecting the wiring board and the antenna;
A fourth conductive layer connecting the wiring substrate and the chip;
A fifth conductive layer connecting the wiring board and the battery;
A wireless chip comprising:   7. The wireless chip according to claim 6, wherein the battery and the chip are electrically connected using the fourth conductive layer and the fifth conductive layer.   8. The radio according to claim 2, wherein the antenna and the chip are electrically connected to each other using the third conductive layer and the fourth conductive layer. Chip.   9. The wireless chip according to claim 1, wherein the wireless chip has a high-frequency circuit.   10. The dielectric layer according to claim 1, wherein the dielectric layer comprises alumina, glass, forsterite, barium titanate, lead titanate, strontium titanate, lead zirconate, lithium diobate, and titanium. A wireless chip formed of one or more selected from lead zirconate acid.   11. The dielectric layer according to claim 1, wherein the dielectric layer is formed of one or more selected from an epoxy resin, a phenol resin, a polybutadiene resin, a bismaleimide triazine resin, vinyl benzyl, and polyfumarate. A wireless chip characterized by that.   An electronic device comprising the wireless chip according to any one of claims 1 to 11. 13. The electronic device according to claim 12, wherein the electronic device is a liquid crystal display device, an EL display device, a television device, a mobile phone, a printer, a camera, a personal computer, goggles with earphones, a speaker device, headphones, a navigation device, or an electronic key. Electronic equipment characterized by

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