JP2006306916A5 - - Google Patents

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Publication number
JP2006306916A5
JP2006306916A5 JP2005127768A JP2005127768A JP2006306916A5 JP 2006306916 A5 JP2006306916 A5 JP 2006306916A5 JP 2005127768 A JP2005127768 A JP 2005127768A JP 2005127768 A JP2005127768 A JP 2005127768A JP 2006306916 A5 JP2006306916 A5 JP 2006306916A5
Authority
JP
Japan
Prior art keywords
component
resin molded
phase mainly
molded body
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005127768A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006306916A (ja
JP4907898B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005127768A priority Critical patent/JP4907898B2/ja
Priority claimed from JP2005127768A external-priority patent/JP4907898B2/ja
Publication of JP2006306916A publication Critical patent/JP2006306916A/ja
Publication of JP2006306916A5 publication Critical patent/JP2006306916A5/ja
Application granted granted Critical
Publication of JP4907898B2 publication Critical patent/JP4907898B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005127768A 2005-04-26 2005-04-26 熱可塑性樹脂成形体 Expired - Fee Related JP4907898B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005127768A JP4907898B2 (ja) 2005-04-26 2005-04-26 熱可塑性樹脂成形体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005127768A JP4907898B2 (ja) 2005-04-26 2005-04-26 熱可塑性樹脂成形体

Publications (3)

Publication Number Publication Date
JP2006306916A JP2006306916A (ja) 2006-11-09
JP2006306916A5 true JP2006306916A5 (OSRAM) 2008-06-05
JP4907898B2 JP4907898B2 (ja) 2012-04-04

Family

ID=37474181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005127768A Expired - Fee Related JP4907898B2 (ja) 2005-04-26 2005-04-26 熱可塑性樹脂成形体

Country Status (1)

Country Link
JP (1) JP4907898B2 (OSRAM)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4748178B2 (ja) * 1999-07-28 2011-08-17 株式会社Ｓｕｍｃｏ 点欠陥の凝集体が存在しないシリコンウェーハの製造方法
WO2011149294A2 (ko) * 2010-05-28 2011-12-01 (주)Lg화학 용융 가공용 수지 혼합물, 펠렛 및 이를 이용한 수지 성형품의 제조 방법 및 수지 성형품
CN102917875B (zh) * 2010-05-28 2015-07-01 Lg化学株式会社 熔融加工的树脂制品
WO2012050400A2 (ko) * 2010-10-14 2012-04-19 주식회사 엘지화학 용융 가공용 수지 혼합물
KR101587304B1 (ko) * 2010-10-14 2016-01-21 주식회사 엘지화학 용융 가공용 수지 혼합물

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003175537A (ja) * 2001-09-20 2003-06-24 Asahi Kasei Corp 樹脂組成物の射出圧縮成形法及び該成形品
JP2004352823A (ja) * 2003-05-28 2004-12-16 Mitsubishi Engineering Plastics Corp 熱可塑性樹脂組成物
JP2005120322A (ja) * 2003-10-20 2005-05-12 Mitsubishi Engineering Plastics Corp 導電性熱可塑性樹脂組成物

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