JP2006305152A - Adhesive tape for false nail, false nail, method of manufacturing the tape, and method of manufacturing the false nail - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily and precisely manufacture an adhesive tape for a false nail excellent in adhesive power. <P>SOLUTION: The adhesive tape 100 for the false nail is manufactured by a step of pouring an adhesive agent into a mold (120) for manufacturing the adhesive tape for the false nail formed by a recessed mold (125) corresponding to the shape of the curved surface of the adhesive application area of the false nail (200), a step of drying the adhesive agent and forming the adhesive tape (100) having a shape of the mold (120), and a step of taking out the adhesive tape (100) from the mold (120). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a removable adhesive nail adhesive tape, an artificial nail, a method for manufacturing an artificial nail adhesive tape, and a method for manufacturing an artificial nail.

Conventionally, artificial artificial nails have been used for various purposes. The artificial nail is usually manufactured by processing various synthetic resin materials into a nail shape.
As a method for bonding the artificial nail to the nail of the human body, a method is known in which an adhesive is applied to the back surface of the artificial nail or the surface of the human nail and the two are joined. There is also known a method in which a sheet-like adhesive tape having a shape corresponding to the shape of an artificial nail is attached to the back surface of the artificial nail or the surface of a human nail, and both are joined via the adhesive tape.

The adhesive strength between the artificial nail and the nail varies depending on the shape of the user's nail. If the curvature of the artificial nail is different from that of the human nail, a part of the adhesive layer may not adhere to the human nail, and the artificial nail may be lifted or peeled off during use.
In order to solve this, the artificial nail described in Patent Document 1 does not make the thickness of the adhesive layer constant, but changes it depending on the part. This is because, as the thickness of the adhesive layer increases, the adhesive strength increases and the shape of the adhesive surface can be flexibly adapted to various types of nails.
JP-A-10-215946

However, conventionally, the adhesive layer is formed by applying a pressure-sensitive adhesive, and it has been difficult to process the adhesive layer by changing the thickness of the adhesive layer depending on the method.
Then, an object of this invention is to provide the adhesive tape for artificial nails which is excellent in adhesive force, and is easy to manufacture, its manufacturing method, an artificial nail, and its manufacturing method.

  An artificial nail bonding tape according to the present invention is formed on a sticky curved surface portion corresponding to a curved surface shape of an adhesive application region of an artificial nail and forming an adhesive surface with the adhesive application region, and the curved surface portion. It has a sticky flat part that forms an adhesive surface with a human nail, and the thickness of the shape surrounded by the curved part and the flat part decreases as it goes from the central part to the side part, and from the central part to the nail The thickness reduction rate in the tip direction is smaller than the thickness reduction rate from the center to the base of the nail. Thereby, the adhesive strength of an artificial nail can be raised with respect to the nail | claw of various shapes.

  Further, by providing a first release layer that is processed into a shape corresponding to the curved surface portion and is in close contact with the curved surface portion, and a second release layer that is in close contact with the flat surface portion, the artificial nail adhesive tape alone can be used as a product. It is also possible to do.

  Also, the pressure-sensitive adhesive suitable for forming the artificial nail adhesive tape according to the present invention is a water-soluble pressure-sensitive adhesive having a viscosity of 80 to 30000 cps and a pressure of 200 to 3000 g, a viscosity of 100 to 10000 cps and a pressure of 5 to 5. 3500 g of solvent-based adhesive.

  The artificial nail according to the present invention has the artificial nail bonding tape in the adhesive application region. Thereby, the adhesive strength of an artificial nail can be raised with respect to the nail | claw of various shapes.

The method for manufacturing an artificial nail adhesive tape according to the present invention includes a step of pouring an adhesive into a mold formed from a concave portion corresponding to a curved surface shape of an adhesive application area of an artificial nail, and drying the adhesive to form the mold. And a step of forming the artificial nail bonding tape having the following shape and a step of taking out the artificial nail bonding tape from the mold.
Thereby, it is possible to easily and precisely manufacture an artificial nail bonding tape capable of increasing the adhesive strength of the artificial nail with respect to various shapes of the nail.

  Moreover, it has the process of making the peeling layer processed according to the shape of the metal mold | die on the surface of the said mold before the process of pouring an adhesive into the said mold, and pouring the said adhesive on the said peeling layer Is desirable. Thereby, it becomes easy to take out the adhesive nail adhesive tape from the mold.

Alternatively, before the step of pouring the pressure-sensitive adhesive into the mold, there is a step of subjecting the surface of the mold to surface treatment, and the pressure-sensitive adhesive is poured into the surface-treated mold. An effect is obtained.
In this case, by providing an extruding pin at the bottom of the recess and pushing up the extruding pin, it is possible to easily take out the artificial nail bonding tape from the mold.

  Also, after the step of forming the artificial nail adhesive tape having the shape of the mold, the adhesive surface of the artificial nail adhesive tape is protected by having a step of forming a release layer on the surface of the artificial nail adhesive tape. can do.

In addition, after the step of pouring the pressure-sensitive adhesive into the mold, a step of placing a release layer that has been processed according to the shape of the mold in advance on the flowed-in pressure-sensitive adhesive is sandwiched between the upper and lower release layers. The adhesive may be dried to form an artificial nail adhesive tape.
As a result, the artificial nail adhesive tape for the artificial nail can be manufactured easily and precisely.

  The pressure-sensitive adhesive is preferably a water-soluble pressure-sensitive adhesive having a viscosity of 80 to 30000 cps and an adhesive strength of 200 to 3000 g, and a solvent-based pressure-sensitive adhesive having a viscosity of 100 to 10000 cps and an adhesive strength of 5 to 3500 g.

The method of manufacturing an artificial nail according to the present invention includes a step of installing an artificial nail chip group having a plurality of artificial nails on a processing table capable of fitting the artificial nail chip group without a gap, and an artificial nail installed on the processing table. A step of covering the artificial nail adhesive tape sheet formed so that the adhesive nail adhesive tape part fits the adhesive application area of the artificial nail from above the chip group; A step of pressing down the work table and pressing the adhesive claw adhesive tape on the artificial nail.
Thereby, the artificial nail which can raise the adhesive strength of an artificial nail with respect to the nail | claw of various shapes can be manufactured easily and precisely.

  In the step of pressure-bonding the artificial nail adhesive tape to the artificial nail, a more preferable shape is obtained by using an elastic body formed from a convex portion corresponding to the curved surface shape of the adhesive application area of the artificial nail. Can be formed.

  In addition, the surface of the artificial nail bonding tape portion of the artificial nail bonding tape portion that is not bonded to the artificial nail is in intimate contact with one release paper, and the release paper is the tape bonding adhesive portion. A dotted line cut line is provided around the tape, and the release paper is cut along the cut line while the processing table is pressed down, so that the processing after adhering the adhesive nail tape is efficient. Can be

Example 1.
FIG. 1A is a plan view showing a surface to be bonded to an artificial nail of an artificial nail bonding tape according to the present invention, and FIG. 1B is a cross-sectional view taken along the line A-A in FIG. c) is a sectional view taken along line BB in FIG. (A) The lower side of the figure corresponds to the base of the nail.
The adhesive nail adhesive tape 100 is entirely formed of a sticky material. Examples of the material include Olivevine BPS1109 (Toyo Ink Manufacturing Co., Ltd.) or Cybinol AT-500, AT-181 (Siden Co., Ltd.). Etc. can be used as appropriate. In addition, various commercially available products such as water-soluble, solvent-based, and hot-melt properties can be used.
In the case of a water-soluble adhesive, it is desirable that the viscosity is 80 to 30000 cps and the adhesive strength is in the range of 200 to 3000 g. In the case of a solvent-based pressure-sensitive adhesive, it is desirable that the viscosity is 100 to 10,000 cps and the pressure-sensitive adhesive force is 5 to 3500 g. Here, the viscosity indicates a value measured by a viscometer B type (No. 2, 60 rotations). Moreover, the adhesive force has shown the value measured on the conditions prescribed | regulated to JISZ0237.

  As shown in FIGS. 1B and 1C, the artificial nail bonding tape 100 has a thickness toward the center and gradually becomes thinner toward the side. However, in the upper direction of the same figure (a), the rate at which the thickness decreases is gentler than the other directions. The greater the thickness of the artificial nail adhesive tape 100, the higher the adhesive strength. For example, the thickest part can be 0.6 mm and the thinnest part can be 0.1 mm.

  FIG. 2 shows how to use the artificial nail adhesive tape 100. 2A is a diagram showing the back surface (surface to be bonded to the finger) of the artificial nail 200, and FIG. 2B is a diagram showing a method for bonding the human body to the nail 900. FIG. As shown in the figure, the artificial nail adhesive tape 100 is attached to a region overlapping the human nail 900 on the back surface of the artificial nail 200. At the time of use, the artificial nail 200 is bonded to the human nail 900 by bonding the artificial nail adhesive tape 100 to the human nail 900.

  The width of the artificial nail 200 and the shape of the curved surface are determined in accordance with the shape of the left and right ten finger nails obtained from the statistical data. The length in the vertical direction is longer than a standard human nail. As a material of the artificial nail 200, a synthetic resin material such as polyethylene, polypropylene, ABS, AES, EVA, EEA is used and manufactured by injection molding.

Next, a method for manufacturing the artificial nail adhesive tape 100 will be described.
FIG. 3A is a perspective view of a mold 120 for manufacturing an artificial nail adhesive tape, and FIG. 3B is a cross-sectional view taken along line AA of FIG. As shown in the figure, a plurality of concave molds 125 are provided in the mold 120 for manufacturing an artificial nail adhesive tape. The concave mold 125 corresponds to the curved surface shape of the region to which the artificial nail adhesive tape 100 of the artificial nail 200 is attached.
The mold 120 for manufacturing an artificial nail adhesive tape can be made of, for example, stainless steel. Further, the surface may be subjected to Teflon (registered trademark) processing.

A method for manufacturing the artificial nail bonding tape 100 using the artificial nail bonding tape manufacturing mold 120 will be described with reference to FIG. First, as shown in FIG. 4A, the recoil sheet 110 is placed on the mold 120 for manufacturing an artificial nail adhesive tape and heated and pressurized, and the recoil sheet 110 is embossed according to the concave mold 125. FIG. 4B shows a state where the recoil sheet 110 is processed.
For the recoil sheet 110, a polyethylene film or the like having stretch properties can be used.

Next, as shown in FIG. 4 (c), an adhesive that forms the artificial nail bonding tape 100 is poured into the concave mold 125 of the mold 120 for manufacturing the artificial nail bonding tape. Excess adhesive is removed and the surface is flattened as shown in FIG.
After the pressure-sensitive adhesive is dried, the liquefied sheet 130 is placed on top as shown in FIG.
Finally, when the artificial nail bonding tape 100 is pulled away from the die 120 for manufacturing the artificial nail bonding tape together with the recoil sheets 110 and 130, the artificial nail adhesion sandwiched between the reclamation sheets 110 and 130 as shown in FIG. The tape 100 for use is obtained.

Next, a method for bonding the artificial nail bonding tape 100 to the artificial nail 200 will be described.
5A is a perspective view of a processing table 300 for bonding the artificial nail bonding tape 100 to the artificial nail 200, and FIG. 5B is a perspective view of an artificial nail chip group 250 placed on the processing table 300. FIG. It is. 6A is a top view of the processing table 300, FIG. 6B is a cross-sectional view taken along line AA in FIG. 6A, and FIG. 6C is a cross-sectional view taken along line BB in FIG. 7 (a) is a plan view of the artificial nail chip group 250 placed on the processing table 300, FIG. 7 (b) is a cross-sectional view taken along the line AA of FIG. c) The figure is the BB sectional drawing of the figure (a).

The processing table 300 is provided with two guide pins 320, an artificial nail receiving groove 330, and a guide groove 340 on a main body 310. The processing table 300 can be made of, for example, silicon.
The artificial nail chip group 250 includes two guide pin holes 251 fitted into the guide pins 320 of the processing table 300, a plurality of artificial nails 200, and branch parts 253. Each artificial nail 200 is formed such that the branch portion 253 side is the tip side of the nail.

  The artificial nail chip group 250 is formed so that there is no gap between the artificial nail receiving groove 330 and the guide groove 340 of the processing table 300. When the guide pin hole 251 is fitted into the guide pin 320, the branch portion 253 guides. Individual artificial claws 200 are accommodated in artificial groove receiving grooves 330 in the artificial grooves 340. The surface shown in FIG. 7 (a) is a surface that is upward when the artificial nail chip group 250 is placed on the processing table 300, and the back side of the artificial nail 200 (the side that joins the nail of the human body) is upward. Become.

When the artificial nail chip group 250 is set on the processing table 300, the artificial nail bonding tape sheet 150 shown in FIG. 8 is placed on the artificial nail chip group 250.
FIG. 8A is a top surface when the artificial nail adhesive tape sheet 150 is placed on the artificial nail chip group 250, and FIG. 8B is a cross-sectional view taken along the line AA of FIG. The artificial nail adhesive tape sheet 150 is manufactured by the method shown in FIG. However, in the artificial nail bonding tape manufacturing mold 120 used in this case, the arrangement of the concave mold 125 corresponds to the bonding position of the artificial nail bonding tape 100 of the artificial nail chip group 250. The artificial nail bonding tape sheet 150 is formed so that the portion of the artificial nail bonding tape 100 matches the tape bonding position of each artificial nail 200 when the guide pin hole 154 is fitted into the guide pin 320 of the processing table 300. ing.

  A dotted cut line 152 is processed on the recoil sheet 151 so as to surround the periphery of the artificial nail adhesive tape 100. In addition, a dotted line 153 that connects the plurality of lines 152 is further provided. The recoil sheet on the artificial nail chip group 250 side is peeled off during the bonding process.

  FIG. 9 is a cross-sectional view taken along line AA of FIG. 8A in a state in which the artificial nail chip group 250 and the artificial nail bonding tape sheet 150 are set on the processing table 300. As shown in FIG. 9, the artificial nail 200 contacts the inner surface of the artificial nail receiving groove 330 without any gap, and the position of the artificial nail bonding tape 100 is exactly aligned with the bonding position of the artificial nail 200.

  Next, the artificial nail bonding tape 100 is bonded to the artificial nail 200 using the processing compression plate 400 shown in FIG. The processing compression plate 400 is provided with a plurality of convex portions 420 on the main body 410. Each convex portion 420 is arranged corresponding to the tape bonding position of the artificial nail 200 installed on the processing table 300. As shown in FIG. 10B, when the processing compression plate 400 is pressed onto the processing table 300 from above the artificial nail bonding tape sheet 150 with the surface of the convex portion 420 facing down, the artificial nail bonding tape 100 is removed. It can be brought into close contact with the back surface of the artificial nail 200.

  FIG. 11 is a diagram for explaining the bonding process of the artificial nail bonding tape 100 by the processing compression plate 400. As shown in FIG. 11A, the tip of the convex portion 420 is made of, for example, silicon rubber, and corresponds to the curved surface shape of the adhesion portion of the artificial nail bonding tape 100 of the artificial nail 200. By crimping the convex portion 420 from the top of the recoil sheet 151, the artificial nail bonding tape 100 can be brought into close contact with the artificial nail 200 as shown in FIG.

Next, as shown in FIG. 12 (a), the recoil sheet 151 is pulled in the direction A in the drawing while the compression plate 400 for processing is pressure-bonded to the processing table 300, and the outer side along the cut lines 152 and 153 When the recoil sheet 151 is cut out, the artificial nail chip group 250 in the state shown in FIG. When the inner recoil sheet 151 is peeled off, the reclamation sheet 151 remains only in the portion of the artificial nail adhesive tape 100 as shown in FIG.
FIG. 13A is a perspective view of the artificial nail 200 in this state, and FIG. 13B is a sectional view taken along line AA of FIG.
By the above procedure, it is possible to obtain an artificial nail that can be adhered to the fingernail simply by peeling off the recoil sheet during use.

Example 2
A method for manufacturing the artificial nail bonding tape 100 different from the method shown in FIG. 4 will be described with reference to FIG.
The artificial nail bonding tape manufacturing die 121 shown in FIG. 14A is matched to the shape of the artificial nail bonding tape 100 in the same manner as the artificial nail bonding tape manufacturing die 120 shown in FIG. A concave mold is formed. However, an eject pin 122 is provided at the deepest portion of the concave mold of the mold 121 for manufacturing the artificial nail bonding tape. The eject pin 122 is provided so that it can be easily taken out by pushing up the artificial nail bonding tape 100 formed in the concave mold from below.

  In the method shown in FIG. 4, the adhesive is poured after the recoil sheet 110 is laid on the mold 120 for manufacturing the artificial nail adhesive tape. However, in Example 2, as shown in FIG. Instead of laying, the surface processed layer 123 is provided on the concave wall surface of the artificial nail bonding tape manufacturing mold 121 so that the adhesive does not stick to the artificial nail bonding tape manufacturing mold 121. The surface processed layer 123 can be formed by surface processing such as Teflon (registered trademark) processing or silicon processing.

Next, as shown in FIG. 14 (c), a pressure-sensitive adhesive that forms the artificial nail bonding tape 100 is poured into the concave mold of the mold 121 for manufacturing the artificial nail bonding tape that has been subjected to surface processing. Excess adhesive is removed and the surface is flattened as shown in FIG.
After the pressure-sensitive adhesive is dried, a recoil sheet 130 is placed on top as shown in FIG.
When the artificial nail bonding tape 100 is taken out from the mold 120 for producing the artificial nail adhesive tape, the artificial nail bonding tape 100 is lifted from the wall surface of the concave mold 125 by pushing up the eject pin 122.

Through the above steps, as shown in FIG. 5F, the artificial nail bonding tape 100 in a state where the recoil sheet 130 is bonded to one side is obtained.
The artificial nail adhesive tape sheet 150 shown in FIG. 8 can be manufactured by the above method.

Example 3
A method for manufacturing the artificial nail bonding tape 100 different from the method shown in FIGS. 4 and 14 will be described with reference to FIG.
As shown in FIG. 15 (a), the recoil sheet 130 is embossed using a mold having a concave shape different from the mold 120 for manufacturing the artificial nail bonding tape. As shown in FIG. 15 (b), an adhesive was poured from above the recipe sheet 110 into the concave mold 125 of the mold 120 for manufacturing the artificial nail adhesive tape, and embossed in advance as shown in FIG. 15 (c). Place the recoil sheet 130 from above.
After drying the adhesive, as shown in FIG. 15 (d), when the adhesive nail adhesive tape 100 is taken out together with the recoil sheets 110 and 130 from the mold 120 for manufacturing the artificial nail adhesive tape, it is sandwiched between the recoil sheets 110 and 130. A tape 100 for tacking nails is obtained.
If the artificial nail adhesive tape 100 according to the third embodiment is used, when the artificial nail adhesive tape 100 is affixed to the back surface of the artificial nail 200, there is no need to use a processing compression plate 400 as shown in FIG. .

FIG. 1A is a plan view of an artificial nail adhesive tape, FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A, and FIG. 1C is B of FIG. FIG. FIG. 2 is an explanatory view showing how to use the artificial nail adhesive tape. 3A is a perspective view of a mold for manufacturing an artificial nail adhesive tape, and FIG. 3B is a cross-sectional view taken along line AA of FIG. 4 (a) to 4 (f) are explanatory views showing a method for manufacturing an artificial nail bonding tape. FIG. 5A is a perspective view of a processing table for bonding processing, and FIG. 5B is a perspective view of an artificial nail chip placed on the processing table. 6A is a plan view of the processing table, FIG. 6B is a cross-sectional view taken along line AA of FIG. 6A, and FIG. 6C is a line BB of FIG. It is sectional drawing. 7A is a plan view of the artificial nail chip group, FIG. 7B is a cross-sectional view taken along the line AA in FIG. 7A, and FIG. 7C is a cross-sectional view taken along the line B- in FIG. It is B line sectional drawing. FIG. 8 (a) is a plan view of the artificial nail adhesive tape sheet, and FIG. 8 (b) is a cross-sectional view taken along line AA of FIG. 8 (a). FIG. 9 is a cross-sectional view showing a state in which an artificial nail chip group and an artificial nail bonding tape sheet are set on a processing table. FIG. 10A is a perspective view of the processing compression plate, and FIG. 10B is an explanatory view of a method of using the processing compression plate. FIG. 11 is a view for explaining adhesion processing by the processing compression plate. FIG. 12 is a diagram for explaining a method for cutting a recoil sheet. FIG. 13 (a) is a perspective view of an attachment claw with an adhesive tape, and FIG. 13 (b) is a cross-sectional view taken along line AA of FIG. 13 (a). FIG. 14A to FIG. 14F are explanatory views showing a method for manufacturing an artificial nail bonding tape. FIG. 15A to FIG. 15D are explanatory views showing a method for manufacturing an artificial nail adhesive tape.

Explanation of symbols

100 Adhesive nail adhesive tape, 110, 130, 151 Recipe sheet (release layer, release paper), 120, 121 Die for manufacturing nail adhesive tape, 122 Eject pin, 123 Surface processed layer, 125 Concave type, 150 Adhesive nail adhesion Tape sheet, 152, 153 cut line, 154 guide pin hole, 200 flaw nail, 250 flaw nail chip group, 251 guide pin hole, 253 branch part, 300 processing table, 310 body, 320 guide pin, 330 flaw nail Receiving groove, 340 guide groove, 400 processing compression plate, 410 body, 420 convex portion, 900 human body claw

Claims (16)

Corresponding to the curved surface shape of the adhesive application region of the artificial nail, an adhesive curved surface part forming an adhesive surface with the adhesive application region;
It has a sticky flat part that forms an adhesive surface with a human nail that is formed on the opposite side of the curved part,
The thickness of the shape surrounded by the curved surface portion and the flat surface portion decreases from the central portion toward the side portion, and the decreasing rate of the thickness from the central portion to the tip of the nail is from the central portion to the base of the nail. Adhesive nail adhesive tape that is smaller than the thickness reduction rate. A first release layer that is processed into a shape corresponding to the curved portion and is in close contact with the curved portion;
The false nail bonding tape according to claim 1, further comprising a second release layer that is in close contact with the planar portion. The artificial nail adhesive tape according to claim 1 or 2, wherein the adhesive tape is formed of a water-soluble adhesive having a viscosity of 80 to 30000 cps and an adhesive strength of 200 to 3000 g. The artificial nail bonding tape according to claim 1 or 2, wherein the adhesive tape is formed of a solvent-based pressure-sensitive adhesive having a viscosity of 100 to 10000 cps and an adhesive strength of 5 to 3500 g. 5. An artificial nail having the artificial nail adhesion tape according to claim 1, 3 or 4 in an adhesive application region. A step of pouring the adhesive into a mold formed from a recess corresponding to the curved surface shape of the adhesive application area of the artificial nail;
Drying the pressure-sensitive adhesive to form an artificial nail adhesive tape having the shape of the mold; and
A method for producing an artificial nail adhesive tape, comprising a step of taking out the artificial nail adhesive tape from the mold. Before the step of pouring the pressure-sensitive adhesive into the mold, it has a step of forming a release layer processed in accordance with the shape of the mold on the surface of the mold,
The method for producing an artificial nail adhesive tape according to claim 6, wherein the pressure-sensitive adhesive is poured onto the release layer. The method according to claim 6, further comprising a step of performing a surface treatment on a surface of the mold before the step of pouring the pressure-sensitive adhesive into the mold, and pouring the pressure-sensitive adhesive into the mold subjected to the surface treatment. A method for producing an adhesive nail adhesive tape. An extrusion pin is provided at the bottom of the recess,
The method of manufacturing an artificial nail bonding tape according to claim 8, wherein the artificial nail bonding tape is taken out of the mold by pushing up the extrusion pin. 10. The method according to claim 6, further comprising a step of forming a release layer on a surface of the artificial nail bonding tape after the step of forming the artificial nail bonding tape having the shape of the mold. The manufacturing method of the tape for adhesive nail | claw description of description. After the step of pouring the adhesive into the mold, the step of placing a release layer that has been processed according to the shape of the mold in advance on the poured adhesive,
The method for manufacturing an artificial nail bonding tape according to any one of claims 6 to 9, wherein the adhesive is dried in a state of being sandwiched between upper and lower release layers to form an artificial nail bonding tape. The adhesive nail adhesive tape according to any one of claims 6 to 11, wherein the adhesive is a water-soluble adhesive having a viscosity of 80 to 30000 cps and an adhesive strength of 200 to 3000 g. The adhesive nail adhesive tape according to any one of claims 6 to 11, wherein the adhesive is a solvent-based adhesive having a viscosity of 100 to 10000 cps and an adhesive force of 5 to 3500 g. Installing an artificial nail chip group having a plurality of artificial nails on a processing table capable of fitting the artificial nail chip group without gaps;
From the top of the artificial nail chip group installed on the processing table, the step of covering the artificial nail adhesion tape sheet formed so that the artificial nail adhesion tape portion matches the adhesive application area of the artificial nail,
A method for manufacturing an artificial nail, comprising a step of pressing the processing base from above the artificial nail bonding tape sheet and crimping the artificial nail bonding tape to the artificial nail. The step of pressure-bonding the artificial nail adhesive tape to the artificial nail is crimped using an elastic body formed of a convex portion corresponding to the curved surface shape of the adhesive application region of the artificial nail. A method for manufacturing artificial nails. In the artificial nail adhesive tape sheet, the surface of the artificial nail adhesive tape portion that does not adhere to the artificial nail is in close contact with one release paper,
The release paper is provided with a dotted cut line around the artificial nail adhesive tape portion,
The artificial nail manufacturing method according to claim 14 or 15, further comprising a step of separating the release paper along the cut line in a state in which the processing table is pressed down.

Images