JP2006303023A - Package of solid-state imaging device, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the package of a solid-state imaging device, wherein the solid-state imaging device is fixed in an appropriate positional accuracy, and to provide a manufacturing method thereof. <P>SOLUTION: The package of a solid-state imaging device is provided with a solid-state imaging device and a package container where a housing is formed to house the solid-state imaging device and the solid-state imaging device is secured to the die attach at the bottom of the housing by a die bonding agent. A reservoir is formed in the bottom to house the die-bonding agent and regulate the flowing thereof, the solid-state imaging device is placed inside the reservoir and is secured to the package container by the die-bonding agent housed therein. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a package of a solid-state imaging device that accommodates and holds the solid-state imaging device.

  In general, a solid-state imaging device such as a CCD image sensor includes a solid-state imaging device package that houses and holds a solid-state imaging device such as a CCD chip (see, for example, Patent Documents 1 and 2 below). ).

  FIG. 7 is a diagram showing a configuration of a package of a conventional solid-state imaging device. As shown in FIG. 7, the package of the solid-state imaging device includes a ceramic package container 1, and a recess 8 smaller than the outer dimensions of the semiconductor chip 3 is provided on the substrate surface 2 of the package container 1. The die-bonding agent 4 is applied to the inside of the recess 8 and on it, and the semiconductor chip 3 is die-bonded. The semiconductor chip 3 and the bonding lead 7 are connected by the metal wire 5, and the package container 1 is hermetically sealed with the sealing glass 6 with an adhesive.

JP-A-6-151902 JP 2001-298032 A

  By the way, it is important to stabilize the accuracy of the position of the solid-state imaging device to be fixed to the package container in order to adhere and fix the solid-state imaging device such as a semiconductor chip to the package container. When the solid-state image sensor is bonded, the solid-state image sensor is bonded by pressing it with a pressing member such as a collet (not shown) against a region where the solid-state image sensor called die attach in the package container is fixed. . At this time, the die bond agent has fluidity and is spread on the surface of the package container by the pressure from the solid-state image sensor. As a result, the solid-state image sensor is displaced in the horizontal direction as the die bond agent flows. There was a thing. Then, the position of the solid-state imaging device in the package container becomes unstable, and there is room for improvement in that the position accuracy is deteriorated.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a solid-state image pickup device package in which the solid-state image pickup device is fixed with good positional accuracy and a method for manufacturing the solid-state image pickup device package. .

  The object of the present invention is to provide a solid-state image sensor and a package container in which a storage unit for storing the solid-state image sensor is formed, and the solid-state image sensor is fixed to a die attach at the bottom of the storage unit by a die bond agent. In the bottom portion, the die bond agent is accommodated, and a storage portion that restricts the flow of the die bond material is formed. The solid-state imaging element is disposed inside the storage portion, and the storage portion This is achieved by a package of a solid-state imaging device, which is fixed to the package container by the die bond agent accommodated therein.

  Further, the object of the present invention is to form a storage part around a die attach for fixing the solid-state imaging device at the bottom of the package container, to supply a die bond agent to the storage part, It is achieved by a method for manufacturing a package of a solid-state image sensor, comprising the step of adhering the solid-state image sensor inside.

  According to the present invention, the storage portion is formed at the bottom of the package container, and when the solid-state imaging device is bonded and fixed to the die attach by the die-bonding agent, the die-bonding agent is stored by being pressed by the pressed solid-state imaging device. It is controlled by the part and is prevented from flowing on the bottom part. If it carries out like this, it can prevent that the solid-state image sensor pressed with the flow of a die-bonding agent shifts | deviates, and can stabilize the position of the solid-state image sensor with respect to a package container. For this reason, a solid-state image sensor can be fixed to a package container with favorable positional accuracy.

  In the solid-state imaging device package and the manufacturing method thereof, in the state where the storage portion is surrounded by the inner wall so as to have an area larger than the surface to which the solid-state imaging device adheres, and the solid-state imaging device is disposed, It is preferable that the flow of the die bond agent is regulated by the inner wall. In this way, the die bond agent that flows at the bottom of the package container abuts against the inner wall of the storage unit and is sandwiched between the pressed solid-state imaging device and the storage unit, thereby restricting the flow at the bottom, and the solid-state imaging device The position is difficult to shift.

  In the solid-state imaging device package, the storage portion is preferably a recess formed in the bottom portion. Or it is preferable that a storage part is the cyclic | annular partition erected so that the flow of a die-bonding agent may be restrict | limited around the said die attach.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the package of a solid-state image sensor in which a solid-state image sensor is fixed with favorable position accuracy, and the package of a solid-state image sensor can be provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a plan view showing a part of the package in the solid-state imaging device of the present embodiment as seen through. FIG. 2 is a plan view showing the package of the solid-state imaging device of the present embodiment.

  As shown in FIGS. 1 and 2, the solid-state imaging device package 10 is configured such that the solid-state imaging device 14 is hermetically sealed with a sealing glass 12 in a state where the solid-state imaging device 14 is housed and fixed in the package body 11. have.

  The package body 11 is a plate-like member having a rectangle or a square in a plan view (a front view of FIG. 1), and has a package container 13 made of ceramic or resin. As shown in FIG. 2, the package container 13 includes a plate-like member 13a, first to third frame-like members 13b, 13c, and 13d having the same outer dimensions as the plate-like member 13a and having an open center. It is composed by overlapping. The central opening 15 of the first frame member 13b is slightly smaller than the central opening 16 of the second frame member 13c, and the central opening 16 of the second frame member 13c is the third opening. It is slightly smaller than the central opening 17 of the frame-shaped member 13d. In the package container 13, the recesses defined by the openings 15, 16, and 17 of the first to third frame members 13 b, 13 c, and 13 d function as a storage unit that stores the solid-state imaging device 14.

  In the package container 13, a planar area defined inside the opening 15 of the frame-shaped member 13 b superimposed on the plate-shaped member 13 a is a die attach 21 to which the solid-state imaging device 14 is bonded and fixed by a die bonding material 18 described later. Function.

  In the frame-shaped member 13c superimposed on the frame-shaped member 13b, a plurality of (in the present embodiment, each frame side) is provided on each upper surface of two opposing frame sides among the four frame sides that define the opening 16. The inner leads 19 are formed. The inner leads 19 are electrically connected to outer leads (not shown) extending from the package container 13, respectively. The outer lead functions as a terminal for connecting the package 10 of the solid-state imaging device to the driving circuit board on the solid-state imaging device side.

  A bonding wire (not shown) such as a gold wire is connected between the solid-state imaging device 14 fixed to the die attach 21 and each inner lead 19.

  In the package 10 of the solid-state imaging device of the present embodiment, the opening 15 of the frame-like member 13 b of the package container 13 is formed with a size slightly larger than the external size of the solid-state imaging device 14 disposed on the die attach 21. Here, the gap between the opening 15 and the solid-state imaging device 14 is configured to be in the range of 0.05 mm to 0.1 mm. On the plate-like member 13a, the portion surrounded by the opening 15 functions as a storage portion, and when the solid-state imaging device 14 is bonded to the package container 13, the die bond agent 18 applied to the die attach 21 is stored in the storage portion. It is regulated that the fluid flows indefinitely at the bottom. In other words, the storage portion is a recess formed in the bottom of the package container 13, and the package container 13 may be changed as long as it has such a recess.

  A sealing glass 12 is bonded to the upper part of each side wall of the package container 13 via a sealing resin 17, and the solid-state imaging device 14 accommodated in the recess is held in an airtight state.

Next, a procedure for manufacturing the package container of the solid-state imaging device of the present embodiment will be described. FIG. 3 is a cross-sectional view showing a state in which a die bond agent is supplied to the package container. FIG. 4 is a cross-sectional view showing a state in which the solid-state imaging device is bonded to the die attach.
First, as shown in FIGS. 1 and 2, first to third frame members 13b, 13c, and 13d are sequentially overlapped and joined to the upper surface of the plate member 13a. In this way, the package container 13 is configured, and a storage part is formed by the frame-like member 13b at the bottom of the storage part.

  After the storage portion is formed in the package container 13, the die bond agent 18 is supplied to the storage portion of the package container 13 as shown in FIG. 3. Next, as shown in FIG. 4, the solid-state imaging device 14 is disposed in the storage portion, the collet 41 as a pressing unit is pressed from above the solid-state imaging device 14, and the solid-state imaging device 14 is attached to the die attach 21 of the package container 13. Press on. At this time, the storage portion regulates that the die bond agent 18 protruding from the lower surface of the solid-state imaging device 14 flows to the periphery. In this way, the solid-state imaging device 14 is bonded and fixed to the die attach 21 partitioned inside the storage unit.

  FIG. 5 is a diagram schematically showing a solid-state imaging device at the time of bonding. As shown in FIG. 5, when the collet 41 is pressed against the solid-state imaging device 14 disposed in the storage portion, the die bond agent 18 between the solid-state imaging device 14 and the plate-like member 13a is pushed out and flows toward the opening 15 side. To do. Then, the flowed die bond 18 abuts against the inner surface of the opening 15 that partitions the storage portion, and is sandwiched between the pressed solid-state imaging device 14 and the inner wall surface of the storage portion, thereby restricting the flow at the bottom portion. Is done. Thus, the position of the solid-state image sensor 14 is less likely to be shifted with respect to the package container 13.

  According to the present embodiment, the storage portion is formed at the bottom of the package container 13, and when the solid-state imaging device 14 is bonded and fixed to the die attach 21 with the die bond agent 18, the storage unit 14 is pressed against the pressed solid-state imaging device 14. Even when the die bond agent 18 flows, the die bond agent 18 is prevented from being regulated by the storage portion and flowing on the bottom portion. If it carries out like this, it can prevent that the solid-state image sensor 14 pressed with the flow of the die-bonding agent 18 slip | deviates, and the position of the solid-state image sensor 14 with respect to the package container 13 can be stabilized. For this reason, the solid-state imaging device 14 can be fixed to the package container 13 with good positional accuracy.

  Another embodiment of the package of the solid-state imaging device according to the present invention will be described. FIG. 6 is a cross-sectional view of a package in the solid-state imaging device of the present embodiment. In the embodiments described below, members having the same configuration / action as those already described are denoted by the same or corresponding reference numerals in the drawings, and description thereof is simplified or omitted.

  As shown in FIG. 6, the package 20 of the solid-state imaging device of the present embodiment includes a package container 23 formed by superposing a plate-like member 23a and two frame-like members 23b and 23c, and the frame-like member 23b. , 23c are provided with storage portions for storing the solid-state imaging device 14 in the central openings 26, 27, respectively.

  Inside the opening 26 of the frame-like member 23b on the upper surface of the plate-like member 23a, an annular partition wall 24 having a substantially quadrangular shape is provided when viewed from above (when viewed from above in FIG. 6). A die attach 21 for fixing the solid-state imaging device 14 is defined in an internal region 25 surrounded by the partition wall 24, and the internal region 25 functions as a storage unit that stores the die bond agent 18.

  Further, the package 20 of the present embodiment is configured to hermetically seal the solid-state imaging device by sticking a seal glass to the package container 23 as in the embodiment shown in FIGS.

  That is, the package 20 of the solid-state imaging device of the present embodiment has a configuration in which the storage portion is an annular partition wall 24 provided around the die attach 21 so as to restrict the flow of the die bond agent 18.

  According to the present embodiment, the storage portion is formed by the partition wall 24 at the bottom of the package container 23, and the solid-state image sensor that is pressed when the solid-state image sensor 14 is bonded and fixed to the die attach 21 by the die bond agent 18. Even if the die bond agent 18 is pushed from 14 and flows, the die bond agent 18 is regulated by the partition wall 24 which is a storage portion and is prevented from flowing on the bottom portion. If it carries out like this, it can prevent that the solid-state image sensor 14 pressed with the flow of the die-bonding agent 18 slip | deviates, and the position of the solid-state image sensor 14 with respect to the package container 23 can be stabilized. For this reason, the solid-state imaging device 14 can be fixed to the package container 23 with good positional accuracy.

It is a top view shown in the state which saw through a part of package in the solid-state image sensing device concerning the present invention. It is a top view which shows the package of the solid-state image sensor of FIG. It is sectional drawing which shows the state which supplies a die-bonding agent to a package container. It is sectional drawing which shows the state which adhere | attaches a solid-state image sensor on die attachment. It is a figure which shows typically the solid-state image sensor at the time of adhesion | attachment. It is sectional drawing which shows another embodiment of the package in the solid-state image sensor concerning this invention. It is a figure which shows the structure of the package of the conventional solid-state image sensor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,20 Solid imaging device package 11 Package body 12 Seal glass 13, 23 Package container 14 Solid imaging device 15 Opening 18 Die bonding agent 19 Inner lead 21 Die attach

Claims (6)

A solid-state image sensor;
A storage unit for storing the solid-state image sensor is formed, and the solid-state image sensor has a package container fixed to a die attach at the bottom of the storage unit by a die bond agent,
In the bottom portion, the die bond agent is accommodated, and a storage portion that restricts the flow of the die bond material is formed, and the solid-state imaging device is disposed inside the storage portion, and is accommodated in the storage portion. A package of a solid-state imaging device, wherein the package is fixed to the package container by the die bond agent.   The storage portion is a region surrounded by an inner wall so as to have an area larger than the surface to which the solid-state image sensor is bonded, and in the state where the solid-state image sensor is disposed, the flow of the die bond agent is caused by the inner wall. The package of the solid-state imaging device according to claim 1, wherein the package is regulated.   3. The solid-state imaging device package according to claim 1, wherein the storage portion is a recess formed in the bottom portion.   3. The package of the solid-state imaging device according to claim 1, wherein the storage portion is an annular partition wall erected so as to restrict the flow of the die bond agent around the die attach. Forming a reservoir around a die attach for fixing the solid-state imaging device at the bottom of the package container; and
Supplying a die bond agent to the reservoir;
And a step of adhering the solid-state imaging device to the inside of the storage section.   The storage portion is a region surrounded by an inner wall so as to have an area larger than the surface to which the solid-state image sensor is bonded, and in the state where the solid-state image sensor is disposed, the flow of the die bond agent is caused by the inner wall. The method for manufacturing a package of a solid-state imaging device according to claim 5, wherein the package is regulated.

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