JP2006302642A - Contact module and its manufacturing method, and member with contact using above contact module and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact module and its manufacturing method easier to mount on an electronic component, a mother board, or the like than conventional one, and also to provide a member with a contact using the above contact module and its manufacturing method. <P>SOLUTION: The contact module 1 comprising a spiral contactor 2 and a bump 3 under the spiral contactor 2 is inserted into a through-hole 11 formed on the mother board 10, and the bump 3 is caulked from a rear-face 10a of the mother board 10. With this, the contact module 1 is easily and appropriately fixed to and held by the mother board 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a contact module that can easily attach a contact module to, for example, an electronic component, a mother board, and the like, a manufacturing method thereof, a member with a contact using the contact module, and a manufacturing method thereof.

Patent Document 1 discloses a structure in which a plurality of spiral contactors are attached to an insulating substrate or the like. Usually, each of the plurality of spiral contactors is held by an insulating sheet so as not to be separated, and the insulating sheet is attached to the insulating substrate via a conductive adhesive or the like.
JP 2002-175859 A

  As described above, when the insulating sheet holding a plurality of spiral contactors is attached to the insulating substrate, when the spiral contactor is formed, it is electrically connected to each electrode portion provided on the insulating substrate side. It is necessary to form each mount part of the spiral contactor with high precision in accordance with the formation position of the electrode part, and when attaching the insulating sheet on the insulating substrate, each mount part and each electrode part Needed to be aligned with high accuracy.

  Further, in the above structure, if the arrangement of the electrode portions is changed, naturally, the arrangement of the spiral contactor with respect to the insulating sheet needs to be changed accordingly.

  Thus, with the conventional structure, the spiral contactor cannot be easily attached to an insulating substrate, an electronic component, or the like.

  Accordingly, the present invention is for solving the above-described conventional problems, and in particular, a contact module capable of easily attaching a contact module to an electronic component, a mother board, or the like, and a method for manufacturing the same, and the contact module. It is an object to provide a member with a contact and a manufacturing method thereof.

The contact module in the present invention,
It has a contact having a mount and an elastic arm extending from the mount, and a protrusion provided on the lower side of the contact.

  In the present invention, it is possible to easily attach the contact module to an electronic component, a mother board or the like as compared with the prior art.

  In the present invention, the protrusion may be provided at a position facing the elastic arm in the height direction, and the protrusion is displaced from a position facing the elastic arm in the height direction. May be provided.

  In the present invention, it is preferable that the lower surface of the mount portion is bonded to the upper surface of the protruding portion.

  In addition, a sheet member may be provided on the upper surface of at least a part of the mount portion.

  In the present invention, the protrusion is preferably a bump. Thereby, the protrusion can be used as an electrode.

  In the present invention, it is preferable that the elastic arm is formed in a spiral shape from the proximal end to the distal end of the mount portion. More preferably, the elastic arm is three-dimensionally shaped upward.

  In the present invention, one contactor and one protrusion may be provided, or a plurality of the contactors and protrusions may be provided.

In addition, a member with a contact in the present invention includes the contact module described in any of the above, and a holding member having a recess or a through hole formed on a surface facing the protrusion, and the protrusion includes the protrusion The contact is inserted into the recess or the through hole, and the contact is exposed on the surface of the holding member.
Thereby, a member with a contact can be easily formed as compared with the prior art.

  In the present invention, it is preferable that the protruding portion is press-fitted into the concave portion or the through hole because the contact module is appropriately fixed and held on the holding member.

  In the present invention, it is preferable that the protruding portion is inserted into the through hole, and the protruding portion is formed with a caulking portion extending to a peripheral edge portion of the through hole on the back surface side of the holding substrate. . Thereby, it is possible to appropriately prevent the contact module from coming out of the holding member.

  Moreover, the manufacturing method of the contact module in this invention has the following processes, It is characterized by the above-mentioned.

(A) joining a contact sheet, on which a plurality of contacts each having a mount portion and an elastic arm extending from the mount portion are formed, on a substrate;
(B) A step of digging the substrate from the back surface to form a plurality of protrusions.
The contact module can be manufactured by the above simple method.

  Further, in the present invention, a protrusion adjustment hole is formed in the substrate at a position facing a part of the elastic arm of each contact, and after the step (a), a protrusion adjustment member is inserted into the protrusion adjustment hole, The elastic arm is preferably three-dimensionally molded upward.

  Moreover, in this invention, it is preferable to form the said projection part in the position which opposes each elastic arm in a height direction at the said (b) process.

Moreover, in this invention, it is preferable to have the following processes after the said (b) process.
(C) A step of forming a plurality of contact modules by assembling the contacts and protrusions one by one and dividing the contact sheet for each set.

  Thereby, a plurality of contact modules each having one contact and one protrusion can be formed at a time.

  The method for manufacturing a member with a contact according to the present invention is characterized in that the protrusion of the contact module manufactured by any of the above is press-fitted into a recess or a through hole formed in the holding member. Thereby, the said contact module can be appropriately hold | maintained at the said holding member, and a member with a contact can be formed easily.

  Further, in the present invention, a part of the protrusion inserted into the through hole is crushed so as to spread from the back surface side of the holding member to the peripheral edge of the through hole, and the contact module is caulked and fixed to the holding member. It is preferable that the contact joule can be fixed and held on the holding member more firmly.

  In the present invention, the contact module can be easily attached to an electronic component, a mother board, or the like as compared with the conventional case.

  1 is a partial cross-sectional view of the contact module according to the first embodiment, FIG. 2 is a partial cross-sectional view of the contact module, the mother substrate, and the like showing one process when the contact module shown in FIG. 1 is attached to the mother substrate. FIG. 4 is a partial cross-sectional view of the contact module and the mother board in a state where the contact module of FIG. 2 is attached (fixed and held) to the mother board. FIG. 4 is attached by a method different from that in FIGS. 5 is a partial cross-sectional view of the contact module and the mother board. FIG. 5 is a partial cross-sectional view of the contact module and the mother board attached by a method different from that shown in FIGS. 7 is a partial plan view of the contact module in a form different from that of FIG. 6, FIG. 8 is a partial sectional view of the contact module of the second embodiment, and FIG. 9 is a contact shown in FIG. FIG. 10 is a partial cross-sectional view of the contact module and the mother board showing a state in which a plurality of contact modules are attached to the mother board. 11 is a partial sectional view of the contact module and the electronic component showing a state in which the contact module is attached to the electronic component, and FIG. 12 is a diagram illustrating the contact module showing one step when attaching a plurality of contact modules to the mother board. FIG. 13 is a partial sectional view of a contact module according to another embodiment, and FIG. 14 is a partial side view of a spiral contactor.

  The Z direction in the figure indicates the thickness direction and the height direction, the X direction in the figure indicates the width direction, and the Y direction in the figure indicates the length direction. Each direction is orthogonal to the remaining two directions.

  In the present specification, the “partial sectional view” refers to a cut surface when cut from a direction parallel to the surface formed of the width direction and the height direction.

  A contact module 1 shown in FIG. 1 includes a spiral contact 2 and a bump 3. As shown in FIG. 6, the spiral contact 2 includes a conductive mount portion 4 formed in a substantially ring shape, and a base end 6 that is integrally connected to the mount portion 4 and hits the boundary with the mount portion 4. And a conductive elastic arm 5 extending in a spiral shape from the tip 7 to the tip 7. As shown in FIG. 7, the planar shape of the mount portion 4 is formed in a rectangular shape (regular square in FIG. 7), and has a substantially circular hole 4a formed in the center of the mount portion 4 and the height. The spiral elastic arms 5 are formed at positions facing each other in the direction.

  As shown in FIG. 14, the mount portion 4 is formed in a planar shape with a predetermined film thickness, and the elastic arm 5 is formed in a three-dimensional manner in a spiral step shape upward (Z1 direction in the drawing). ing. The tip 7 is located at the approximate center point of the spiral shape.

  The spiral contact 2 is formed by an etching method or a plating method. In the etching method, a thin plate-like copper film is etched to form the same shape as a spiral contact, and the surface thereof is plated for diffusion protection with nickel or heat. Or it can also form with the laminated body of copper and nickel. In this structure, the nickel or alloy layer mainly exhibits an elastic function, and copper functions so as to lower the specific resistance.

  Alternatively, the spiral contact 2 can be formed by plating a copper layer, or can be formed by laminating copper and nickel by continuous plating.

  As shown in FIG. 1 and FIG. 6, the peripheral edge 3a of the upper surface of the bump 3 is located on the inner side of the peripheral edge 2a of the mount part 2, so that the contact module 1 can be seen even when viewed from directly above. The peripheral edge 3a on the upper surface of the bump 3 is covered with the mount portion 2 and cannot be seen. Thus, the mount 2 is partially protruded outside the peripheral edge 3a of the upper surface of the bump 3.

  As shown in FIG. 1, the bump 3 has a substantially inverted trapezoidal cross section. A protrusion adjusting hole 8 penetrating the inside of the bump 3 in the height direction is formed at substantially the center in the plane of the bump 3. As shown in FIG. 6, the planar shape of the protrusion adjustment hole 8 is formed in a substantially circular shape, but is not limited to such a shape. The protrusion adjusting hole 8 may not be formed. In the contact module 1 in which the protrusion adjustment hole 8 is formed as shown in FIG. 1, the elastic arm 5 of the spiral contactor 2 is three-dimensionally formed upward (in the Z1 direction in the drawing) using the protrusion adjustment hole 8. ing. The bump 8 is made of a conductive material. The bump 8 may be a solder bump.

  The lower surface of the mount portion 4 of the spiral contactor 2 and the upper surface of the bump 3 are joined together with, for example, a conductive adhesive 9. The mount portion 4 of the spiral contact 2 and the bump 3 are electrically connected. As shown in FIG. 1, the bump 3 is provided at a position facing the elastic arm 5 of the spiral contactor 2 in the height direction (Z1-Z2 direction in the drawing). The mounting portion 4 of the spiral contactor 2 and the bump 3 are not limited to the form fixed by the conductive adhesive 9. The mount 4 of the spiral contact 2 may be directly bonded to the bump 3 by chemical bonding.

  As shown in FIG. 2, the contact module 1 is inserted into, for example, a through-hole 11 formed in the mother substrate 10 while being held by the conveying member 12. A concave portion 12a is formed on the lower surface of the conveying member 12 at a position facing the elastic arm 5 in the height direction (Z1-Z2 direction in the drawing), and the contact module 1 is conveyed by the conveying member 12. In this case, the elastic arm 5 does not come into contact with the conveying member 12. In the form shown in FIG. 2, the planar shape of the through hole 11 formed in the mother substrate 10 is substantially circular like the bump 3, and the area in a direction parallel to the plane of the through hole 11 is It is almost constant from the upper surface to the lower surface of the through hole 11. The plane area of the through hole 11 is slightly larger than or approximately the same as the maximum area in the direction parallel to the plane of the bump 3 of the contact module 1. Therefore, when the contact module 1 is inserted into the through hole 11 of the mother substrate 10, a slight gap is generated between the side wall 11 a of the through hole 11 and the bump 3 in the through hole 11.

  As shown in FIG. 2, a part of the bump 3 protrudes from the back surface 10a of the mother substrate 10 downward (Z2 direction in the drawing). In FIG. 2, when a pressing member 13 having a flat upper surface is opposed to the back surface 10a side of the mother substrate 10, and the pressing member 13 is pushed upward (in the Z1 direction in the drawing), the pressing member 13 and the bump 3 Come into contact with each other, and the contact module 1 is sandwiched between the conveying member 12 and the pressing member 13. When the pressing member 13 is further pushed upward, the bump 3 protruding downward from the back surface 10a of the mother substrate 10 is crushed, and thereby, between the side wall 11a of the through hole 11 and the bump 3. The generated gap is filled by the bump 3 spreading inside the through hole 11, and a part of the bump 3 extends to the peripheral portion 11 b of the through hole 11 on the back surface 10 a of the mother substrate 10. The bump 3 extending to the peripheral edge portion 11b serves as a caulking portion 3b to prevent the contact module 1 from coming out of the mother substrate 10 upward. As described above, in the embodiment shown in FIG. 3, the bump 3 of the contact module 1 is caulked on the back surface 10a of the mother substrate 10, and the bump 3 is pressed against the side wall 11a of the through hole 11 by the caulking. The contact module 1 does not come out of both the upper and lower surfaces of the mother board 10. Since the bump 3 is exposed on the back surface 10a of the mother substrate 10, the bump 3 exposed from the back surface 10a of the mother substrate 10 can be used as an electrode.

  The pressing member 13 may be provided with a heating means (not shown), and the bump 3 in contact with the pressing member 13 may be melted by the heating means.

  In the embodiment shown in FIG. 4, the bump 3 of the contact module 1 is press-fitted into the through hole 11 of the mother substrate 10. As a result, the contact module 1 does not come out of both the upper surface and the lower surface of the mother substrate 10 and is firmly fixed and held on the mother substrate 10. In FIG. 4, since a part of the bump 3 protrudes downward from the back surface 10a of the mother substrate 10, the protruding bump 3 may be caulked as shown in FIG.

  In the embodiment shown in FIG. 5, the area of the plane of the through hole 11 formed in the mother substrate 10 is slightly larger than the maximum area in the direction parallel to the plane of the bump 3 of the contact module 1, and A gap A is formed between the wall surface 11 a of the hole 11 and the bump 3. In the embodiment shown in FIG. 5, an adhesive 14 is filled in the gap A, and the contact module 1 is fixedly held on the mother substrate 10 by the adhesive 14. The kind of the adhesive 14 is not limited. For example, anisotropic conductive paste or non-conductive paste can be used. Since both are thermosetting adhesives, the adhesive 14 is heated to cure the adhesive 14 after filling the gap A in the gap A.

  Unlike the contact module 1 shown in FIG. 1, the contact module 20 shown in FIG. 8 is provided with a sheet member 21 on the upper surface of a part of the mount portion 4 of the spiral contact 2. The sheet member 21 is an insulating resin sheet or the like, specifically a polyimide resin sheet. Since the sheet member 21 is provided on the mount portion 4, the mount portion 4 of the spiral contactor 2 is appropriately protected by the sheet member 21, and for example, an electrode portion such as an electronic component BGA is It is possible to prevent electrical contact with the mount portion 4. Appropriately, only the elastic arm 5 functions as a contact point with the electronic component, and electrical stability can be achieved.

  The contact module 20 shown in FIG. 8 is press-fitted into the through hole 23 of the mother board 22 as shown in FIG. As shown in FIG. 9, a conductive portion 24 is formed on the side wall 23a of the through hole 23 of the mother substrate 22 by sputtering or the like. An upper electrode portion 25 and a lower electrode portion 26 are respectively provided on the upper surface and the lower surface of the mother substrate 22, and the upper electrode portion 25 and the lower electrode portion 26 are electrically connected via the conductive portion 24. In the embodiment shown in FIG. 9, the mounting portion 4 of the spiral contact 2 is electrically connected to the upper electrode portion 25, and a printed board under the mother substrate 22 (not shown) and the spiral contact 2 are connected. The upper electrode part 25, the conduction part 24, and the lower conduction part 26 are conductively connected. For this reason, even if the bump 3 is formed of an insulating protrusion, the spiral contact 2 and the printed circuit board can be electrically connected. If the spiral contactor 2 is not directly connected to the conductive part 24 and the lower electrode part 26 due to a form in which the upper electrode part 25 is not formed, the bump 3 is used for the contact module 20. Thus, a path connecting the spiral contact 2 → the bump 3 → the conductive portion 24 → the lower electrode portion 26 can be formed.

  In the embodiment shown in FIG. 10, the contact module 1 shown in FIG. 1 is inserted and fixedly held in a plurality of through holes 31 provided in the mother board 30. The fixing and holding may be either the caulking described with reference to FIGS. 2 and 3, the press-fitting described with reference to FIG. 4 or the bonding described with reference to FIG. 5, or a combination of a plurality of these fixing methods. Similarly to FIG. 9, the structure may be such that the conductive portion 24 is provided in the through hole 31 of the mother substrate 30 and the electrode portions 25 and 26 are provided on the upper and lower surfaces of the mother substrate 30. Naturally, the contact module 20 shown in FIG. 8 may be inserted and fixedly held in the plurality of through holes 31 provided in the mother board 30.

  In the embodiment shown in FIG. 11, for example, a recess 40a is formed on the lower surface of an electronic component 40 such as a microphone, and an electrode portion 41 is formed in the recess 40a. The contact module 1 shown in FIG. 1 is reversed from the state shown in FIG. 1, and the contact module 1 is press-fitted into the recess 40a with the bump 3 facing upward. Since the bump 3 is made of a conductive material, the electrode 41 and the bump 3 are electrically connected, and the elastic arm 5 of the spiral contactor 2 electrically connected to the bump 3 is elastic of the electronic component 40. It functions as a contact.

  A contact module (also referred to as a contact module assembly) 50 shown in FIG. 12 is formed by connecting a plurality of contact modules 1 shown in FIG. For example, the mount portion 4 constituting the spiral contact 2 functions as a connecting portion for connecting the contact modules 1. Alternatively, the contact module 20 shown in FIG. 8 may be used, and the sheet member 21 may be a connecting portion that connects the plurality of contact modules 20. In the case of the contact module 50 shown in FIG. 12, since a plurality of provided spiral contacts 2 are electrically connected by the mount portion 4 functioning as a connecting portion, the spiral contacts 2 need to be electrically disconnected. 8 is used as the connecting portion, or the bumps 3 of the plurality of contact modules 1 are press-fitted into the through holes 61 of the mother substrate 60, and then spirals are formed. The mounts 4 of the contacts 2 are cut, and the spiral contacts 2 are electrically separated.

  In the contact module 65 shown in FIG. 13, the bump 3 is formed on the lower surface of the mount portion 4 that is displaced in the X2 direction from the position facing the elastic arm 5 of the spiral contactor 2 in the height direction (Z1-Z2 direction). Are provided, and the bump 3 and the elastic arm 5 are not in a positional relationship facing each other in the height direction. In the above-described “deviation” state, as shown in FIG. 13, the bump 3 and the elastic arm 5 are not in a positional relationship in which they face each other in the height direction. The elastic arm 5 is partially opposed in the height direction, but the center of the elastic arm 5 in the width direction (X1-X2 direction shown in the drawing) and the length direction (Y1-Y2 direction shown in the drawing) and the bump 3 in the width direction (X1-X2 direction in the figure) and the center in the length direction (Y1-Y2 direction in the figure) are not aligned in the height direction (Z1-Z2 direction in the figure). The contact module 65 is also fixedly held on the mother substrate 10 by press-fitting the bumps 3 into the through holes 11 provided in the mother substrate 10 or the recesses 41 of the electronic component 40. For example, when the electrode part such as BGA of the electronic component and the electrode part of the flexible printed circuit board are displaced in the X1-X2 direction shown in the figure, the elastic arm 5 and the bump 3 of the spiral contact 2 shown in FIG. By using the contact module 65 shifted in the X2 direction, it is possible to appropriately and easily electrically connect the electrode part such as the BGA of the electronic component and the electrode part of the flexible printed board.

  In the above-described embodiment, a contact module having one spiral contact 2 and one bump 3 provided below the spiral contact 2 is simply press-fitted into a through hole 11 provided in the mother substrate 10. It can be appropriately attached to the mother board 10 by a simple operation.

  In the present embodiment, when the contact modules are attached to the plurality of through holes 11 provided in the mother substrate 10 by press fitting or the like, the contact modules can be individually attached to the respective through holes 11. For this reason, it is not necessary to attach all the same contact modules to all the through holes 11. For example, a contact module 65 of the form shown in FIG. Thus, it is possible to attach a contact module of a different form to each through hole 11 such as attaching the contact module 1 shown in FIG. 1, and a contact board of a necessary form can be easily manufactured. .

  Further, the contact module can be easily attached not only to the mother substrate 11 but also to the electronic component 40 and the like.

  Further, by providing the contact module with the bump 3, the spiral contact 2 and the electrode portion of the flexible printed circuit board can be conducted through the bump 3. For example, as shown in FIG. 3, when the contact module 1 is caulked and fixed to the through hole 11 of the mother substrate 10, the spiral contact 2 is formed on the upper surface of the mother substrate 10, and the bump is formed on the lower surface of the mother substrate 10. Therefore, if a flexible printed circuit board is disposed under the bump 3, the electrode part of the flexible printed circuit board and the spiral contact 2 can be electrically connected through the bump 3. Conventionally, for example, as shown in FIG. 2 of Patent Document 1, it has been necessary to form a conduction portion on the inner wall of the through hole provided in the mother substrate. In the form), there is no such need.

  In addition, when the contact module is attached to a through-hole or the like of the mother board by press fitting, the contact module can be removed from the board and replaced with a new contact module.

  This embodiment is suitable for a case where a small number of contacts are provided rather than a case where a large number of contacts are provided on a mother board or the like, or when there is no regularity and the contacts need to be arranged on the mother board.

  15 to 20 are process diagrams showing a method of manufacturing the contact module 1 shown in FIG. 16 and 19 are partial plan views of the contact module 1 during the manufacturing process, and the remaining drawings are partial cross-sectional views of the contact module 1 during the manufacturing process.

  In the step shown in FIG. 15, a contact sheet 71 having a plurality of elastic arms 5 is formed. As shown in FIG. 16, the contact sheet 71 includes a plurality of elastic arms 5 and connecting plates 72 that connect the elastic arms 5. The elastic arm 5 and the connecting plate 72 are originally a single copper foil, and the elastic arm 5 is formed on the copper foil by etching or the like, and the remaining portion is connected to the connecting plate 72. Become. Further, after the etching, Ni or the like may be formed on the periphery of the elastic arm 5 and the periphery of the connecting plate 72 by plating. The connecting plate 71 is a portion that becomes the mount portion 4 of the spiral contact 2 shown in FIG.

  Reference numeral 70 shown in FIG. 15 is a substrate made of a conductive material. The substrate 70 is to be the bump 3 of the contact module 1 shown in FIG. As shown in FIG. 15, a plurality of protrusion adjustment holes 8 are formed in the substrate 70 at positions that coincide with a part of the elastic arm 5 in the height direction (Z1-Z direction in the drawing). The protrusion adjusting hole 8 is preferably formed at a position that coincides with at least the tip 17 of the elastic arm 5 in the height direction. The formation of the protrusion adjusting hole 8 is not essential.

  As shown in FIG. 15, the said board | substrate 70 and the connection board 72 of the said contactor sheet | seat 71 are affixed through the conductive adhesive 9 grade | etc.,.

  In the step shown in FIG. 17, a mask layer 73 is formed on the back surface 70 a of the substrate 70. When the mask layer 73 is formed of a resist, the resist is applied to the back surface 70a of the substrate 70, and the mask layer 73 is formed by exposure and development. The mask layer 73 is formed at a position that coincides with the elastic arm 5 in the height direction (Z1-Z2 direction in the drawing).

  Then, the substrate 70 is etched from the back surface 70a side. The etching is isotropic etching, and the substrate 70 between the mask layers 73 is removed along the dotted line shown in FIG. 17 by this etching process.

  As shown in FIG. 18, the substrate 70 shown in FIG. 17 is left as the bump 3 on the lower side of each elastic arm 5. In the step shown in FIG. 18, the mask layer 73 is removed after the bump 3 is formed.

  Next, when a protrusion adjusting member (not shown) is inserted into the protrusion adjusting hole 8 from below the protrusion adjusting hole 8 and the protrusion adjusting member is pushed up, the elastic arm 5 moves upward (in the Z1 direction in the figure). The elastic arm 5 is lifted and three-dimensionally formed into a spiral staircase shape (see FIG. 20).

  As shown in FIGS. 19 and 20, on the surface of the connecting plate 72 of the contact sheet 71, a separation line is provided as a mark for separating each elastic arm 5 from one contact sheet 71 individually. For example, it is formed by a V-shaped groove 75. The groove 75 is formed by etching, for example. In FIG. 19, the grooves 75 are formed between the elastic arms 5 along the width direction (X1-X2 direction in the drawing) and the length direction (Y1-Y2 direction in the drawing). If it is formed between 5, the forming direction of the groove 75 is not particularly limited. The formation of the groove 75 is not essential in the manufacturing process.

  As shown in FIG. 19, each connecting plate 72 surrounded by the groove 75 and the side edge portion 71 a of the contact sheet 71 constitutes the mount portion 4 of each spiral contact 2. As shown in FIG. 20, a plurality of contact modules 1 shown in FIG. 1 are obtained by cutting the contact sheet 71 along the groove 75 (along the alternate long and short dash line shown in FIG. 20) with a laser or the like. I can do it.

  21 to 25 are process diagrams showing a method of manufacturing the contact module 20 shown in FIG. 21 to 25 are partial cross-sectional views of the contact module 20 during the manufacturing process.

  In the process shown in FIG. 21, a plurality of spiral contacts 2 each having an elastic arm 5 and a mount portion 4 are formed, and formed on the mount portion 4 of the spiral contact 2 with polyimide resin or the like. The sheet member 21 is attached via a conductive adhesive (not shown) or the like. A through hole 21a is formed in the sheet member 21 at a position facing the elastic arm 5 in the height direction (Z1-Z2 direction in the drawing). A structure including the spiral contact 2 and the sheet member 21 shown in FIG. 21 is hereinafter referred to as a “contact sheet 80”.

  Next, in the step shown in FIG. 22, a protrusion adjustment member (not shown) is placed on the lower side of the elastic arm 5 of each spiral contact 2, and the protrusion adjustment member is pushed upward (in the direction of the arrow) to raise the elastic arm. Solid forming with 5 facing upward.

  In the step shown in FIG. 23, the sheet member 21 and the mount portion 4 of the contact sheet 80 and the substrate 70 made of a conductive material are attached via a conductive adhesive 9 or the like.

  In the step shown in FIG. 24, a mask layer 73 is formed on the back surface 70a of the substrate 70. When the mask layer 73 is formed of a resist, the resist is applied to the back surface 70a of the substrate 70, and the mask layer 73 is formed by exposure and development. The mask layer 73 is formed at a position that coincides with the elastic arm 5 in the height direction (Z1-Z2 direction in the drawing).

  Then, the substrate 70 is etched from the back surface 70a side. The etching is isotropic etching, and the substrate 70 between the mask layers 73 is removed along the dotted line shown in FIG. 24 by this etching process.

  As shown in FIG. 25, the substrate 70 shown in FIG. 24 is left as the bump 3 on the lower side of each spiral contact 2. In the step shown in FIG. 25, the mask layer 73 is removed after the bump 3 is formed.

  Next, as shown in FIG. 25, for example, a V-shaped groove is formed on the surface of the sheet member 21 as a mark for separating each spiral contactor 2 from the contactor sheet 80 individually. 81. The groove 81 is formed by etching, for example. The groove 81 is formed between the spiral contacts 2 along the width direction (X1-X2 direction in the drawing) and the length direction (Y1-Y2 direction in the drawing), for example, similarly to the groove 75 shown in FIG. . The formation of the groove 81 is not essential in the manufacturing process.

  As shown in FIG. 25, when the contactor sheet 80 is cut by a laser or the like along the groove 81 (along the alternate long and short dash line shown in FIG. 25), a plurality of contact modules 20 shown in FIG. 8 are obtained. I can do it.

  According to the manufacturing method of the contact modules 1 and 20 shown in FIGS. 15 to 24, a large number of contact modules 1 and 20 can be easily manufactured at a time through a series of manufacturing steps. Further, according to the method for manufacturing the contact modules 1 and 20 shown in FIGS. 15 to 24, the bumps 3 are appropriately disposed at positions facing the elastic arms 5 of the spiral contacts 1 and 20 of the contact module 1 in the height direction. Can be formed.

  Further, when it is desired to form a contact module assembly 50 in which a plurality of contact modules 1 are connected as shown in FIG. 12, in the separation step shown in FIG. 20 or FIG. do it.

  Further, as shown in FIG. 15, if the protrusion adjustment hole 8 is provided in the substrate 70, the protrusion adjustment member is inserted into the protrusion adjustment hole 8, and the protrusion adjustment member is pushed upward, the spiral contact can be easily and appropriately performed. Three-dimensional forming can be performed with the elastic arm 5 of the child 2 facing upward. When the substrate 70 is not provided with the protrusion adjusting hole 8, the three-dimensional forming can be performed by the following method. For example, in the state shown in FIG. 17, if the tip 7 of the elastic arm 5 is grasped and the tip 7 is pulled upward, the elastic arm 5 can be three-dimensionally formed into a spiral staircase shape. However, as shown in FIG. 15, the substrate 70 is provided with a protrusion adjustment hole 8, the protrusion adjustment member is inserted into the protrusion adjustment hole 8, and the protrusion adjustment member is pushed upward to form the elastic arm 5 in three dimensions. This is preferable because the elastic arm 5 can be three-dimensionally formed easily and appropriately. The bumps 3 of the contact modules 1 and 20 formed through the steps of FIGS. 15 to 20 or FIGS. 21 to 25 are, for example, press-fitted into the through holes formed in the mother substrate or the recesses formed in the electronic component. Thus, the contact modules 1 and 20 can be easily fixed and held on a mother board, an electronic component, or the like. In addition to press-fitting, the contact modules 1 and 20 may be fixed and held on a mother board, electronic component, or the like by caulking or fixing as described with reference to FIGS.

  The substrate 70 shown in FIGS. 15 and 23 is formed of a conductive material in the above embodiment, but may be formed of an insulating material. The material of the substrate 70 can be changed according to the application.

  26 and 27 are process diagrams showing manufacturing steps different from those shown in FIGS. 26 and 27 are partial cross-sectional views of the contact module during the manufacturing process.

  In the step shown in FIG. 26, a sacrificial layer 93 is formed on the entire surface of the substrate 70 with a resin layer mixed with Ti or a conductive filler, and a contact 90 is formed on the sacrificial layer 93. The contact 90 includes a mount portion 94 and an elastic arm 95, and different internal stress is applied to the contact 90 on the upper surface side and the lower surface side. Specifically, a tensile stress is applied to the lower surface side of the contact 90 and a compressive stress is applied to the upper surface side of the elastic arm 95. The contact 90 is made of a NiZr alloy (Ni added at about 1 at%), MoCr, or the like. When the contactor 90 is formed by a sputter deposition method, the contactor 90 is formed by sputtering while gradually changing the vacuum gas pressure (for example, using Ar gas), whereby the upper surface of the contactor 90 is formed. Different internal stresses can be applied on the side and the lower surface side.

  As shown in FIG. 26, a through hole 91 is formed in the substrate 70 at a position facing the elastic arm 95. For example, an etching solution that dissolves the sacrificial layer 93 is flowed through the through hole 91 so that the elasticity is increased. The sacrificial layer 93 under the arm 95 is removed. At this time, the sacrificial layer 93 under the mount 94 is not removed and is left as it is. If the through hole 91 is formed at a position separated from the mount portion 94 in the X1-X2 direction in the drawing, the etching liquid hardly reaches the mount portion 94, and the sacrificial layer 93 is appropriately placed under the mount portion 94. Can be left in.

  Next, in the step shown in FIG. 27, the contactor 90 is heat-treated. Due to the heat treatment, the elastic arm 95 that is not fixedly held on the substrate 70 by the sacrificial layer 93 bends and deforms due to a difference in internal stress. Specifically, a tensile stress is applied to the lower surface side of the contact 90. Since compressive stress is applied to the upper surface side of the elastic arm 95, the elastic arm 95 bends upward as shown in FIG.

  In this way, it is possible to use a contactor 90 that has a difference in internal stress and deforms due to the difference in its own internal stress instead of mechanical processing. Next to the step shown in FIG. 27, the same steps as in FIGS. 17 to 20 are performed to form a plurality of contact modules having the contact 90 and the bumps 3.

The elastic arm 95 shown in FIG. 27 may be formed in a spiral shape as shown in FIG.
Moreover, you may form the elastic arm 5 shown in FIG.1 and FIG.8 in forms other than a spiral shape. However, when the elastic arm 5 is formed in a spiral shape, the surface of the electrode part such as an electronic component that contacts the elastic arm 5 is easily deformed so that the elastic arm 5 wraps, and the continuity between the elastic arm 5 and the electrode part is easily achieved. Therefore, the elastic arm 5 is preferably formed in a spiral shape.

  In the present embodiment, the mother board and the electronic component have been described as the holding member for fixing and holding the contact module, but the holding member may be other than the mother board and the electronic component. For example, a resin sheet may be used. The holding member is formed with at least one of a through hole or a recess for press-fitting the contact module.

The fragmentary sectional view of the contact module of a 1st embodiment, FIG. 1 is a partial cross-sectional view of a contact module and a mother board, etc. showing one process when the contact module shown in FIG. 1 is attached to the mother board; FIG. 3 is a partial cross-sectional view of the contact module and the mother board in a state where the contact module of FIG. 2 is attached (fixed and held) to the mother board; FIG. 2 is a partial cross-sectional view of the contact module and the mother board attached by a method different from that of FIG. 2 is a partial cross-sectional view of the contact module and the mother board attached by a method different from that shown in FIGS. FIG. 1 is a partial plan view of the contact module shown in FIG. The fragmentary top view of the said contact module of the form different from FIG. The fragmentary sectional view of the contact module of 2nd Embodiment, The fragmentary sectional view of the said contact module and mother board which shows the state where the contact module shown in FIG. 8 was attached to the mother board, A partial cross-sectional view of the contact module and the mother board showing a state in which a plurality of contact modules are attached to the mother board; A partial cross-sectional view of the contact module and the electronic component showing a state in which the contact module is attached to the electronic component; A partial cross-sectional view of the contact module and the mother board, showing one step in attaching a plurality of contact modules to the mother board; The fragmentary sectional view of the contact module of other embodiments, Partial side view of spiral contact, 1 process drawing (partial sectional view) showing a manufacturing method of the contact module 1 shown in FIG. The fragmentary top view of the contact module in the manufacturing process shown in FIG. FIG. 15 is a process diagram (partial cross-sectional view) performed after FIG. 17 is a process diagram (partial cross-sectional view) performed after One process diagram (partial plan view) performed next to FIG. FIG. 19 is a process diagram (partial cross-sectional view) performed after FIG. 8 is a process diagram (partial cross-sectional view) showing a manufacturing method of the contact module 20 shown in FIG. 21 is a process diagram (partial cross-sectional view) performed after FIG. FIG. 22 is a process diagram (partial cross-sectional view) performed next to FIG. FIG. 23 is a process diagram (partial cross-sectional view) performed next to FIG. FIG. 24 is a process diagram (partial cross-sectional view) performed after FIG. 15 is a process diagram (partial cross-sectional view) showing a method for manufacturing a contact module formed by a manufacturing process different from that shown in FIG. 26 is a process diagram (partial sectional view) performed after FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,20 Contact module 2 Spiral contact 3 Bump 4, 94 Mount part 5, 95 Elastic arm 10, 22, 30, 60 Mother board 11, 23, 31, 61 Through-hole 14 Adhesive 21 Sheet member 40 Electronic component 40a Recessed part 41 Electrode 50 Contact Module (Contact Module Assembly)
70 Substrate 71, 80 Contact sheet 72 Connecting plate 75, 81 Groove 90 Contact 93 Sacrificial layer

Claims (19)

  A contact module comprising: a contact having a mount and an elastic arm extending from the mount; and a protrusion provided on the lower side of the contact.   The contact module according to claim 1, wherein the protrusion is provided at a position facing the elastic arm in a height direction.   The contact module according to claim 1, wherein the protrusion is provided at a position shifted from a position facing the elastic arm in a height direction.   The contact module according to claim 1, wherein a lower surface of the mount portion is joined to an upper surface of the protrusion portion.   The contact module according to claim 1, wherein a sheet member is provided on an upper surface of at least a part of the mount portion.   The contact module according to claim 1, wherein the protrusion is a bump.   The contact module according to claim 1, wherein the elastic arm is formed in a spiral shape from a base end to a tip end of the mount portion.   The contact module according to claim 1, wherein the elastic arm is three-dimensionally shaped upward.   The contact module according to claim 1, wherein the contact and the protrusion are provided one by one.   The contact module according to claim 9, wherein a plurality of contacts and protrusions are provided.   A contact module according to any one of claims 1 to 10, and a holding member having a recess or a through hole formed on a surface facing the protrusion, wherein the protrusion is formed in the recess or the through hole. A member with a contact, wherein the contact is inserted and the contact is exposed on the surface of the holding member.   The member with a contact according to claim 11, wherein the protrusion is press-fitted into the recess or the through hole.   The said protrusion part is inserted in the said through-hole, and the crimping part extended in the peripheral part of the said through-hole is formed in the said protrusion part at the back surface side of the said holding substrate. Member with contact. A method for manufacturing a contact module, comprising the following steps.
(A) joining a contact sheet, on which a plurality of contacts each having a mount portion and an elastic arm extending from the mount portion are formed, on a substrate;
(B) A step of digging the substrate from the back surface to form a plurality of protrusions.   A protrusion adjustment hole is formed in the substrate at a position facing a part of the elastic arm of each contact. After the step (a), a protrusion adjustment member is inserted into the protrusion adjustment hole, and the elastic arm is moved upward. The method of manufacturing a contact module according to claim 14, which is three-dimensionally molded.   The method for manufacturing a contact module according to claim 14 or 15, wherein, in the step (b), the protrusion is formed at a position facing each elastic arm in the height direction. The method for manufacturing a contact module according to claim 14, comprising the following steps after the step (b).
(C) A step of forming a plurality of contact modules by assembling the contacts and protrusions one by one and dividing the contact sheet for each set.   A method for manufacturing a member with a contact, wherein the protrusion of the contact module manufactured according to any one of claims 14 to 17 is press-fitted into a recess or a through hole formed in the holding member.   19. A part of the protrusion inserted into the through hole is crushed so as to spread from the back surface side of the holding member to the peripheral edge of the through hole, and the contact module is caulked and fixed to the holding member. Manufacturing method of member with contact.

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