JP2006294929A - Flexible printed wiring board, and camera module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the bending facility of a flexible printed wiring board and improve the bending durability thereof. <P>SOLUTION: In this flexible printed wiring board 40, a plurality of holes 40H are formed along the fold at the bending position 40Z of cover-lay layers 40B, 40C, and the bending rigidity at the bending position 40Z is lower than that at the position other than the bending position 40Z, so that this flexible printed wiring board 40 is easily bent at the bending position 40Z. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a flexible printed wiring board and a camera module including a flexible printed wiring board and a charge coupled device.

  Conventionally, in an electronic device such as a digital camera, an electronic component such as a CCD is electrically connected to another electronic component or a printed wiring board by a flexible printed wiring board. Since this flexible printed wiring board has flexibility, it is often used after being bent (see, for example, Patent Document 1). Here, when the flexible printed wiring board is bent and used, the bending position of the flexible printed wiring board is required to be easy to bend in order to improve the workability of the assembly work, and to transmit and receive signals by the wiring pattern. Bending durability is required so as not to cause trouble.

  In patent document 1, when processing the external shape of a flexible printed wiring board, it is easy to bend the flexible printed wiring board by making a crease in the flexible printed wiring board with a convex portion formed in the blade shape for external processing. It is improving.

However, in this method, since the wiring pattern is damaged during the crease operation, the wiring pattern may be disconnected during the operation of bending the flexible printed wiring board or after assembly.
JP-A-7-86719

  The present invention has been made in consideration of the above-described facts, and an object thereof is to improve the bending ease of a flexible printed wiring board and improve the bending durability of the flexible printed wiring board.

  The flexible printed wiring board according to claim 1, comprising: a base film on which a wiring pattern is formed; and a covering layer that covers the base film, the flexible printed wiring board being bent at a predetermined position, The bending rigidity at the predetermined position of the layer is lower than the bending rigidity at other than the predetermined position.

  The flexible printed wiring board according to claim 1 is configured such that a wiring pattern is formed on a base film, the base film is covered with a coating layer, and is bent at a predetermined position.

  Here, the bending rigidity at a predetermined position of the coating layer is lower than the bending rigidity other than the predetermined position, and the position where the bending rigidity is low is the bending position. This makes it easy to bend the flexible printed wiring board. Also, the wiring pattern is not treated to improve the flexibility of the flexible printed wiring board, and the flexible printed wiring board can be bent without damaging the wiring pattern. The bending durability of the wiring board can be improved.

  A flexible printed wiring board according to a second aspect is the flexible printed wiring board according to the first aspect, wherein a hole is formed in the predetermined position of the covering layer.

  In the flexible printed wiring board according to the second aspect, the bending rigidity at a predetermined position of the coating layer is lower than the bending rigidity at other positions than that at the predetermined position by making a hole at the bending position of the coating layer. Here, since the wiring pattern is not subjected to any measures for improving the bendability, it is possible to improve the bendability of the flexible printed wiring board without affecting the bending durability of the wiring pattern. Moreover, since the hole opened in the coating layer becomes a mark when the flexible printed wiring board is bent, workability can be improved.

  The flexible printed wiring board according to claim 3 is the flexible printed wiring board according to claim 2, wherein the coating layer is formed on the base film and grounds the wiring pattern, and the wiring. A first surface layer covering the pattern or the grounding layer; a shield layer covering the first surface layer and shielding electromagnetic waves; and a second surface layer covering the shield layer; 1 surface layer and the said 2nd surface layer were vacated.

  In the flexible printed wiring board according to the third aspect, the ground layer is formed on the base film, and the wiring pattern is grounded. Further, the wiring pattern or the ground layer is covered with the first surface layer, and the first surface layer is covered with the shield layer. The shield layer shields electromagnetic waves transmitted from the wiring pattern. The shield layer is covered with the second surface layer.

  Here, by making a hole at a predetermined position of the first surface layer and the second surface layer, the bending rigidity of the first surface layer and the second surface layer at a predetermined position is lower than the bending rigidity other than the predetermined position. . Thereby, the bending ease of the flexible printed wiring board can be improved without affecting the bending durability of the wiring pattern.

  A flexible printed wiring board according to claim 4 is the flexible printed wiring board according to claim 3, wherein the hole is formed in the shield layer.

  In the flexible printed wiring board according to claim 4, in addition to the predetermined positions of the first surface layer and the second surface layer, a hole is also formed at a predetermined position of the shield layer, so that the invention of claim 2 is further achieved. The bending rigidity at a predetermined position of the coating layer is lowered, and the flexible printed wiring board is easily bent.

  The flexible printed wiring board according to claim 5 is the flexible printed wiring board according to claim 4, wherein the wiring pattern includes a high-frequency signal line having a frequency higher than a predetermined value, and is provided in the shield layer. The hole is offset with respect to the high-frequency signal line.

  In the flexible printed wiring board according to the fifth aspect, the wiring pattern is provided with a high-frequency signal line having a frequency higher than a predetermined value, and a high-frequency electromagnetic wave is transmitted from the high-frequency signal line. On the other hand, a hole is formed in the shield layer in order to improve the bendability, but the hole is offset with respect to the high-frequency signal line, and the high-frequency signal line is covered with the shield layer. Therefore, it is possible to improve the bendability of the shield layer and shield high-frequency electromagnetic waves transmitted from the high-frequency signal line.

  A flexible printed wiring board according to a sixth aspect is the flexible printed wiring board according to any one of the third to fifth aspects, wherein the hole is formed in the grounding layer.

  In the flexible printed wiring board according to claim 6, the bending rigidity at a predetermined position of the coating layer is further increased by opening a hole at a predetermined position of the ground layer in addition to the predetermined position of the first surface layer and the second surface layer. It becomes low and it becomes easy to bend a flexible printed wiring board.

  A camera module according to a seventh aspect includes the flexible printed wiring board according to any one of the first to sixth aspects, and a charge coupled device connected to the wiring pattern of the flexible printed wiring board. Features.

  In the camera module according to the seventh aspect, as described above, the wiring pattern of the flexible printed wiring board connected to the charge coupled device has high bending durability and is less likely to be disconnected. Therefore, the charge coupled device can transmit and receive signals well over a long period of time.

  Since this invention was set as the said structure, while being able to improve the bending ease of a flexible printed wiring board, the bending durability of a flexible printed wiring board can be improved.

  Embodiments of the present invention will be described below with reference to the drawings.

  First, an external configuration of the digital camera 10 according to the present embodiment will be described with reference to FIG. As shown in FIG. 1, the digital camera 10 shoots a lens 21 for forming a subject image on the front surface of the camera housing 11, a strobe 62 that emits light to irradiate the subject as necessary during photographing, and photographing. A finder 88 used to determine the composition of the subject is provided. In addition, the digital camera 10 includes a release button (so-called shutter) 92 and a power switch 94 that are pressed by the user when shooting is performed on the upper surface of the camera housing 11.

  Note that the release button 92 of the digital camera 10 according to the present embodiment is pressed down to an intermediate position (hereinafter referred to as “half-pressed state S1”), and pressed to a final pressed position that exceeds the intermediate position. 2 states (hereinafter referred to as “fully pressed state S2”) can be detected. Then, in the digital camera 10, the release button 92 is half-pressed to the state S1 to activate the AE (Automatic Explosure) function and set the exposure state (shutter speed, aperture state), then AF (Auto Focus (automatic focus) function is activated to control the focus, and then the exposure (photographing) is performed when the fully-pressed state S2 is subsequently entered.

  On the other hand, the eyepiece of the finder 88 is provided on the back of the camera housing 11. Near the eyepiece of the finder 88 (downward in FIG. 1) is a liquid crystal display (hereinafter referred to as “LCD”) for displaying a subject image, various menu screens, messages and the like indicated by digital image data obtained by photographing. 44) is provided. Further, a mode change switch 96 is provided near the LCD 44 (upward in FIG. 1), and a cross cursor button 98 is provided near the LCD 44 (right side in FIG. 1). The mode switch 96 is either a shooting mode that is a mode for performing shooting by a slide operation by a user or a playback mode that is a mode for displaying (reproducing) a subject image indicated by digital image data obtained by shooting. It is for setting to one of these modes. The cross cursor button 98 is a total of five keys including four arrow keys indicating the upward, downward, left, and right movement directions in the display area of the LCD 44 and a determination key positioned at the center of the four arrow keys. The corresponding command is output when each key is pressed. In addition, in the vicinity of the cross cursor button 98 (upward in FIG. 1), a forced light emission switch 99 for setting a forced light emission mode, which is a mode in which the strobe 62 is forced to emit light at the time of shooting, is provided by a user pressing operation. It has been.

  Next, the configuration of the electrical system of the digital camera 10 according to the present embodiment will be described with reference to FIG.

  The digital camera 10 includes a camera module 12. The camera module 12 includes an optical unit 22 configured to include a lens 21, and a charge coupled device (hereinafter referred to as “CCD”) 24 is provided behind the optical axis of the lens 21 on the exit side of the optical unit 22. Is provided. The CCD 24 is connected to the system bus BUS via an analog signal processing unit 26, an analog / digital converter (hereinafter referred to as “ADC”) 28, and a digital signal processing unit 30. The analog signal processing unit 26 is configured to include a circuit that obtains accurate pixel data by reducing noise (particularly thermal noise) included in the output signal of the CCD. The ADC 28 is for converting an input analog signal into digital data. The digital signal processing unit 30 has a built-in line buffer having a predetermined capacity, and performs control for directly storing the input digital image data in a predetermined area of the memory 72, and various digital images are applied to the digital image data. The processing is performed.

  Note that the digital signal processing unit 30, the LCD interface 42, the CPU (central processing unit) 50, the memory interface 70, the external memory interface 80, and the compression / decompression processing circuit 86 are mutually connected to the system bus BUS. Is connected to accept and receive. The LCD interface 42 is an interface circuit that generates a signal for causing the LCD 44 to display an image or a menu screen indicated by the digital image data and supplies the signal to the LCD 44. A CPU (Central Processing Unit) 50 is a processing unit that controls the operation of the entire digital camera 10. The memory 72 is a memory constituted by a VRAM (Video RAM) that mainly stores digital image data obtained by photographing. The memory interface 70 is a control circuit for accessing the memory 72. The external memory interface 80 is an interface circuit that allows the digital camera 10 to access a memory card 82 formed of a recording medium such as Smart Media (registered trademark). The compression / decompression processing circuit 86 is a processing circuit that performs compression processing on digital image data in a predetermined compression format, and performs decompression processing on the compressed digital image data according to the compression format.

  Therefore, the CPU 50 controls the operation of the digital signal processing unit 30 and the compression / decompression processing circuit 86, displays various information via the LCD interface 42 to the LCD 44, the memory interface 70 to the memory 72 and the memory card 82, and the external memory interface. Access through 80.

  On the other hand, the digital camera 10 includes a timing generator 32 that mainly generates a timing signal for driving the CCD 24 and supplies the timing signal to the CCD 24, and the driving of the CCD 24 is controlled by the CPU 50 via the timing generator 32.

  The digital camera 10 also includes a drive unit 34, and the driving of the focus adjustment mechanism (details will be described later), the zoom mechanism, and the aperture drive mechanism provided in the optical unit 22 is also controlled by the CPU 50 via the drive unit 34. .

  When changing the optical zoom magnification, the CPU 50 drives and controls a zoom mechanism (not shown) to change the focal length of the lens 21 included in the optical unit 22. Further, the CPU 50 performs focus control by driving and controlling the focus adjustment mechanism (described later) so that the contrast value of the image obtained by imaging by the CCD 24 is maximized. The digital camera 10 according to the present embodiment employs a so-called TTL (Through The Lens) method in which the lens position is set so that the contrast of the read image is maximized as the focus control.

  Further, the release button 92, the power switch 94, the mode change switch 96, the cross cursor button 98, and various buttons and switches (generally referred to as “operation unit 90” in the figure) of the forced light emission switch 99 are connected to the CPU 50. Thus, the CPU 50 can always grasp the operation state of the operation unit 90.

  In addition, the digital camera 10 includes a charging unit 60 that is interposed between the strobe 62 and the CPU 50 and charges power for causing the strobe 62 to emit light under the control of the CPU 50. The strobe 62 is also connected to the CPU 50, and the light emission of the strobe 62 is controlled by the CPU 50.

  Next, the overall operation of the digital camera 10 according to the present embodiment will be briefly described.

  First, an image is picked up by the CCD 24 through the optical unit 22, and R (red), G (green), and B (blue) signals indicating the subject image are sequentially output to the analog signal processing unit 26. The analog signal processing unit 26 performs analog signal processing such as correlated double sampling processing on the signal input from the CCD 24 and then sequentially outputs the signal to the ADC 28. The ADC 28 converts the R, G, and B signals input from the analog signal processing unit 26 into 12-bit R, G, and B signals (digital image data) and sequentially outputs the signals to the digital signal processing unit 30. The digital signal processing unit 30 accumulates digital image data sequentially output from the ADC 28 in a built-in line buffer and temporarily stores it in a predetermined area of the memory 72.

  Digital image data stored in a predetermined area of the memory 72 is read out by the digital signal processing unit 30 under the control of the CPU 50, and a white balance is adjusted by applying a digital gain corresponding to a predetermined physical quantity to the gamma data. Processing and sharpness processing are performed to generate 8-bit digital image data, and further YC signal processing is performed to generate a luminance signal Y and chroma signals Cr and Cb (hereinafter referred to as “YC signal”), and a YC signal is generated. The data is stored in an area different from the predetermined area in the memory 72.

  The LCD 44 is configured to display a moving image (through image) obtained by continuous imaging by the CCD 24 and can be used as a finder. However, when the LCD 44 is used as a finder, The generated YC signal is sequentially output to the LCD 44 via the LCD interface 42. As a result, a through image is displayed on the LCD 44.

  Here, when the release button 92 is half-pressed by the user, after the AE function is activated and the exposure state is set as described above, the AF function is activated and focus control is performed, and then the fully-pressed state is continued. In this case, the YC signal stored in the memory 72 at this time is compressed in a predetermined compression format (JPEG format in the present embodiment) by the compression / decompression processing circuit 86 and then passed through the external memory interface 80. Shooting is performed by recording in the memory card 82.

  Next, the camera module 12 will be described.

  As shown in FIG. 3, the camera module 12 includes an optical unit 22, and a CCD 24 is provided behind the optical axis of the lens 21 on the exit side of the optical unit 22. The CCD 24 is soldered to the printed wiring board 13, and the IC 14 including the analog signal processing unit 26 and the ADC 28 is soldered to the printed wiring board 15, and the printed wiring board 13 and the printed wiring board 15 are connected to the flexible printed wiring board 16. Are electrically connected. Further, the connector 18 connected to the connector 17 connected to the system bus BUS (see FIG. 2) is soldered to the printed wiring board 19, and the printed wiring board 15 and the printed wiring board 19 are connected by the flexible printed wiring board 40. It is connected.

  Here, the direction in which the connector 19 is connected to the connector 17 (in the direction of arrow A in the figure) is substantially perpendicular to the printed wiring board 13, the printed wiring 15, and the like, and the flexible printed wiring board 40 is bent in a predetermined manner. It is bent at a substantially right angle at a position 40Z.

Hereinafter, the structure of the flexible printed wiring board 40 will be described.
[First Embodiment]
As shown in FIG. 4, the flexible printed wiring board 40 has a configuration in which a base film 40A on which a wiring pattern P is formed is covered with a covering layer 40X. The covering layer 40X includes two coverlay layers 40B and 40C and a ground layer 40D. The base film 40A is a flexible and insulating resin layer having a wiring pattern P formed of copper foil on one surface, and the coverlay layer 40B is laminated on the wiring pattern P and the wiring pattern P is formed. It is a resin layer having flexibility and insulation to protect. The ground layer 40D is a copper foil layer laminated on the other surface of the base film 40A and grounds the wiring pattern P. Further, the cover lay layer 40C is a layer of resin having flexibility and insulation that is laminated on the ground layer 40D and protects the ground layer 40D. As shown in FIG. 5, the flexible printed wiring board 40 is formed by pasting layers formed in advance.

  Incidentally, as shown in FIGS. 4 and 5, a plurality of holes 40H are formed along the folds at the folding positions 40Z of the coverlay layers 40B and 40C. As a result, the bending rigidity at the folding position 40Z of the coverlay layers 40B and 40C is lower than the bending rigidity other than at the folding position 40Z, and the flexible printed wiring board 40 is easily bent at the folding position 40Z.

Here, the wiring pattern P is not subjected to any measures for improving the flexibility of the flexible printed wiring board 40. For this reason, the ease of bending of the flexible printed wiring board 40 can be improved without affecting the bending durability of the wiring pattern P. Further, since the holes 40H formed in the coverlay layers 40B and 40C serve as marks when the flexible printed wiring board 40 is bent, workability can be improved.
[Second Embodiment]
As shown in FIG. 6, the flexible printed wiring board 100 has a configuration in which a base film 100A on which a wiring pattern P is formed is covered with a covering layer 100X. The covering layer 100X includes two coverlay layers 100B and 100C, a ground layer 100D, a shield layer 100E, and a topcoat layer 100F. The base film 100A, the two coverlay layers 100B and 100C, and the ground layer 100D have the same configuration as the base film 40A, the two coverlay layers 40B and 40C, and the ground layer 40D of the first embodiment. The shield layer 100E is a layer having flexibility and insulation laminated on the coverlay layer 100B and shields electromagnetic waves transmitted from the wiring pattern P. The topcoat layer 100F is a layer having flexibility and insulation laminated on the shield layer 100E, and protects the inner layers. As shown in FIG. 7, the flexible printed wiring board 100 is formed by pasting layers formed in advance.

  Incidentally, as shown in FIGS. 6 and 7, a plurality of holes 100H are formed along the folds at the folding positions 100Z of the coverlay layers 100B and 100C, as in the first embodiment. The hole 100H is also formed in 100F so as to face the hole 100H opened in the coverlay layers 100B and 100C. As a result, the bending rigidity at the folding position 100Z of the coverlay layers 100B and 100C and the topcoat layer 100F is lower than the bending rigidity other than the folding position 100Z, and the flexible printed wiring board 100 can be easily folded at the folding position 100Z. It has become.

Here, as in the first embodiment, the wiring pattern P is not subjected to any treatment for improving the flexibility of the flexible printed wiring board 100. For this reason, the bending ease of the flexible printed wiring board 100 can be improved without affecting the bending durability of the wiring pattern P. Further, since the holes 100H formed in the coverlay layer 100C and the topcoat layer 100F serve as marks when the flexible printed wiring board 100 is bent, workability can be improved.
[Third Embodiment]
As shown in FIG. 8, the flexible printed wiring board 110 has a configuration in which a base film 110A on which a wiring pattern P is formed is covered with a covering layer 110X. The covering layer 110X includes two coverlay layers 110B and 110C, a ground layer 110D, a shield layer 110E, and a topcoat layer 110F. The base film 110A, the two coverlay layers 110B and 110C, the ground layer 110D, and the topcoat layer 110F are the base film 100A of the second embodiment, the two coverlay layers 100B and 100C, the ground layer 100D, and the topcoat layer. The configuration is the same as 100F. The shield layer 110E is the same as the shield layer 100E of the second embodiment in that the shield layer 110E is laminated on the coverlay layer 110B and shields electromagnetic waves transmitted from the wiring pattern P, but the points described below are different. .

As shown in FIGS. 8 and 9, a plurality of holes 110H are formed along the folds at the folding positions 110Z of the coverlay layers 110B and 110C and the topcoat layer 110F, as in the second embodiment. The shield layer 110E also has a hole 110H facing the hole 110H opened in the coverlay layers 110B and 110C and the topcoat layer 110F. Thereby, the bending rigidity of the bending position 110Z of the coverlay layers 110B and 110C, the topcoat layer 110F, and the shield layer 110E is lower than the bending rigidity other than the bending position 110Z, and the bending position of the flexible printed wiring board 110 is reduced. The ease of bending at 110Z is improved as compared to the second embodiment.
[Fourth Embodiment]
As shown in FIG. 10, the flexible printed wiring board 120 has a configuration in which a base film 120A on which a wiring pattern P is formed is covered with a covering layer 120X. The covering layer 120X is formed by laminating two coverlay layers 120B and 120C, a ground layer 120D, a shield layer 120E, and a topcoat layer 120F in the same order as the flexible printed wiring board 110 of the third embodiment. . A plurality of holes 120H are formed along the folds at the folding positions 120Z of the coverlay layers 120B and 120C, the shield layer 120E, and the topcoat layer 120F.

Here, as shown in FIG. 11, the hole 120H is formed offset with respect to a high-frequency signal line (for example, 1 MHz or more) P1 included in the wiring pattern P, and the shield layer 120E is formed on the high-frequency signal line P1. It is covered. As a result, the ease of bending of the shield layer 120E can be improved, and high-frequency electromagnetic waves transmitted from the high-frequency signal line P1 can be shielded.
[Fifth Embodiment]
As shown in FIG. 12, the flexible printed wiring board 130 has a configuration in which a base film 130A on which a wiring pattern P is formed is covered with a covering layer 130X. The covering layer 130X is formed by laminating two coverlay layers 130B and 130C, a ground layer 130D, a shield layer 130E, and a topcoat layer 130F. The base film 130A, the two coverlay layers 130B and 130C, the shield layer 130E, and the topcoat layer 130F are the base film 110A, the two coverlay layers 110B and 110C, the shield layer 110E, and the topcoat layer of the third embodiment. The configuration is the same as 110F. The ground layer 130D is the same as the ground layer 110D of the third embodiment in that the ground layer 130D is laminated on the other surface of the base film 130A and grounds the wiring pattern P, but the points described below are different.

  As shown in FIGS. 12 and 13, a plurality of holes 130H are formed along the folds at the folding positions 130Z of the coverlay layers 130B and 130C, the shield layer 130E, and the topcoat layer 130F, as in the third embodiment. However, holes 130H are also formed in the ground layer 130D so as to face the holes 130H opened in the coverlay layers 130B and 130C, the shield layer 130E, and the topcoat layer 130F. As a result, the bending rigidity of the bending positions 130Z of the coverlay layers 130B and 130C, the topcoat layer 130F, the shield layer 130E, and the ground layer 130D is lower than the bending rigidity other than the bending positions 130Z. The easiness of bending at the folding position 130Z of 130 is improved as compared with the third and fourth embodiments.

  As described above, in the camera module 12, the wiring pattern P of the flexible printed wiring board 36 connected to the CCD 24 has high bending durability and there is no fear of disconnection, so that the CCD 24 can provide a good signal over a long period of time. Can be sent and received.

  In the present embodiment, the present invention has been described by taking a digital camera as an example, but the present invention can also be applied to other electronic devices such as a mobile phone including a flexible printed wiring board.

It is an external view of a digital camera provided with the flexible printed wiring board of embodiment of this invention. It is a schematic block diagram of the control system of a digital camera provided with the flexible printed wiring board of embodiment of this invention. It is a perspective view which shows the camera module of embodiment of this invention. It is sectional drawing which shows the flexible printed wiring board of 1st Embodiment of this invention. It is a disassembled perspective view which shows the flexible printed wiring board of 1st Embodiment of this invention. It is sectional drawing which shows the flexible printed wiring board of 2nd Embodiment of this invention. It is a disassembled perspective view which shows the flexible printed wiring board of 2nd Embodiment of this invention. It is sectional drawing which shows the flexible printed wiring board of 3rd Embodiment of this invention. It is a disassembled perspective view which shows the flexible printed wiring board of 3rd Embodiment of this invention. It is sectional drawing which shows the flexible printed wiring board of 4th Embodiment of this invention. It is a top view which shows the flexible printed wiring board of 4th Embodiment of this invention. It is sectional drawing which shows the flexible printed wiring board of 4th Embodiment of this invention. It is a disassembled perspective view which shows the flexible printed wiring board of 4th Embodiment of this invention.

Explanation of symbols

12 Camera Module 24 Charge Coupled Device 40 Flexible Printed Circuit Board 40A Base Film 40B Coverlay Layer (First Surface Layer)
40C coverlay layer (first surface layer)
40D ground layer (ground layer)
40E Shield layer 40F Top coat layer (second surface layer)
40H hole 40X coating layer 40Z bending position 100 flexible printed wiring board 100A base film 100B coverlay layer (first surface layer)
100C coverlay layer (first surface layer)
100D ground layer (ground layer)
100E Shield layer 100F Top coat layer (second surface layer)
100H hole 100X coating layer 100Z bending position 110 flexible printed wiring board 110A base film 110B coverlay layer (first surface layer)
110C coverlay layer (first surface layer)
110D ground layer (ground layer)
110E Shield layer 110F Top coat layer (second surface layer)
110H hole 110X coating layer 110Z bending position 120 flexible printed wiring board 120A base film 120B coverlay layer (first surface layer)
120C coverlay layer (first surface layer)
120D Ground layer (ground layer)
120E Shield layer 120F Top coat layer (second surface layer)
120H hole 120X coating layer 120Z bending position 130 flexible printed wiring board 130A base film 130B coverlay layer (first surface layer)
130C coverlay layer (first surface layer)
130D Ground layer (ground layer)
130E Shield layer 130F Top coat layer (second surface layer)
130H hole 130X coating layer 130Z bending position P wiring pattern P1 high frequency signal line (wiring pattern)

Claims (7)

A flexible printed wiring board comprising a base film on which a wiring pattern is formed, and a coating layer covering the base film, and is bent at a predetermined position,
The flexible printed wiring board, wherein the bending rigidity of the coating layer at the predetermined position is lower than the bending rigidity at other than the predetermined position.   The flexible printed wiring board according to claim 1, wherein a hole is formed in the predetermined position of the coating layer. The coating layer is
A grounding layer formed on the base film and grounding the wiring pattern;
A first surface layer covering the wiring pattern or the ground layer;
A shield layer that covers the first surface layer and shields electromagnetic waves;
A second surface layer covering the shield layer,
The flexible printed wiring board according to claim 2, wherein the hole is formed in the first surface layer and the second surface layer.   The flexible printed wiring board according to claim 3, wherein the hole is formed in the shield layer. The wiring pattern includes a high-frequency signal line having a frequency higher than a predetermined value;
The flexible printed wiring board according to claim 4, wherein the hole formed in the shield layer is offset with respect to the high-frequency signal line.   The flexible printed wiring board according to claim 3, wherein the hole is formed in the grounding layer. A flexible printed wiring board according to any one of claims 1 to 6,
A camera module comprising a charge coupled device connected to the wiring pattern of the flexible printed wiring board.

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