JP2006293551A - Radio tag ic circuit supporter, tag tape roll and radio tag cartridge - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the junction strength of a bonded structural body where an IC circuit part is connected to an antenna. <P>SOLUTION: This radio TAG IC circuit supporter H is provided with antennas 152a and 152b for transmitting/receiving information, an IC circuit part 151 for storing tag information, connecting terminals 159A and 159B for connecting the IC circuit part 151 to the antennas 152a and 152b and a protection film 160 for holding the IC circuit part 151, and configured by joining the connecting terminals 159A and 159B to the antennas 152a and 152b. A through-hole 160A or a comb-shaped part 160P are formed at the protection film 160 side or the antennas 152b and 152b side as a thickness deficiency section whose thickness direction dimension is at least partially deficient. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wireless tag capable of wireless communication of information with the outside, and more particularly to a wireless tag IC circuit holder provided in the wireless tag, a tag tape roll using the wireless tag IC circuit, and a wireless tag cartridge.

  An RFID (Radio Frequency Identification) system that reads / writes information in a non-contact manner between a small wireless tag and a reader (reading device) / writer (writing device) is known. For example, a wireless tag circuit element provided in a label-like wireless tag includes an IC circuit unit that stores predetermined wireless tag information and an antenna that is connected to the IC circuit unit and transmits and receives information. Even if the battery is dirty or placed in an invisible position, the reader / writer can access (read / write information) the RFID tag information in the IC circuit unit, and manage the product. Practical use is expected in various fields such as inspection processes.

Such a wireless tag is usually often formed by providing a wireless tag circuit element on a label-like or sheet-like material (base material). As a configuration of this wireless tag, for example, the one described in Patent Document 1 is known. In this prior art, two antennas (micro conductive antennas) are joined to both sides of one IC circuit portion (IC chip) via a conductive adhesive (ACP). And the adhesion structure provided with these two antennas and an IC circuit part is mounted on the substrate.
JP 2003-85513 A (paragraph number 0002, FIG. 2)

  However, the following problems exist in the above-described conventional technology. That is, when the IC circuit part and the antenna are joined by interposing a conductive adhesive therebetween, the adhesion part between the IC circuit part and the conductive adhesive is a simple (planar) surface adhesion structure. Similarly, the bonding portion between the conductive adhesive and the antenna also has the same surface bonding structure. For this reason, it has been difficult to ensure a large total bonding strength of the bonded structure using the conductive adhesive.

  An object of the present invention is to provide a wireless tag IC circuit holder, a tag tape roll, and a wireless tag cartridge that can improve the bonding strength of an adhesive structure that connects an IC circuit portion and an antenna.

  In order to achieve the above object, the first invention includes an antenna that transmits and receives information, an IC circuit unit that stores tag information, and a connection terminal that connects the IC circuit unit and the antenna. A wireless tag IC circuit holding body configured to join the connection terminal of the holding member and the antenna, the holding member side or the antenna side At least one of them is provided with a thickness defect portion in which a dimension in the thickness direction is at least partially lost.

  In the first invention of the present application, a thickness defect portion is provided on the holding member side or the antenna side. Accordingly, when the connection terminal on the holding member side that holds the IC circuit portion and the antenna side are bonded and bonded using an adhesive, the adhesive is allowed to enter the thickness defect portion to thereby hold the holding member. In addition to a simple surface adhesion structure between the planar shapes of the connection terminal and the antenna, a three-dimensional adhesion structure can be formed at a portion that enters the thickness defect portion. Therefore, compared with the case where the bonding is performed only with the surface bonding structure, the total bonding strength can be improved by the strong bonding force of the three-dimensional bonding structure.

  Alternatively, it is possible to reduce the bonding area of the surface bonding portion necessary for ensuring the same strength, and in this case, the size in the surface direction of the holding member can be reduced, so that, for example, a wireless tag on a tape base material When an IC circuit holder is arranged to form a tag tape, the uneven shape of the tape can be relaxed.

  The second invention is characterized in that, in the first invention, the thickness defect portion is a first through hole or a first recess provided at least on the joining side of the holding member.

  As a result, an adhesive that adheres between the connection terminal on the holding member side that holds the IC circuit portion and the antenna side is allowed to enter, for example, the first through hole or the first recess of the holding member, so that the first through hole is formed. Alternatively, a three-dimensional adhesion structure with the holding member can be formed at a portion that enters the first recess.

  A third invention is characterized in that, in the first invention, the thickness deficient portion is a first concave portion provided so as to cut out an end in a surface direction of the holding member.

  Thereby, by making the adhesive which adheres between the connecting terminal on the holding member side holding the IC circuit portion and the antenna side enter, for example, the first concave portion of the holding member, the portion where the entry has occurred is connected to the holding member. A three-dimensional adhesion structure can be formed.

  According to a fourth aspect of the present invention, in the second or third aspect of the present invention, an adhesive for bonding the holding member and the antenna enters the first through hole, the first concave portion, or the first concave portion. It is characterized by being provided in.

  Since a three-dimensional adhesion structure with the holding member can be realized with an adhesive provided so as to enter any of the first through hole, the first concave portion, and the first concave shape portion, compared to a case where adhesion is performed only with a surface adhesion structure The total bonding strength can be improved by the strong bonding force of the three-dimensional bonding structure.

  According to a fifth invention, in the first invention, the thickness defect portion is a second through hole or a second recess provided at least on the joining side of the antenna.

  Thereby, by making the adhesive which adheres between the connection terminal on the holding member side holding the IC circuit part and the antenna side enter, for example, the second through hole or the second recess of the antenna, the second through hole or A three-dimensional adhesion structure with the antenna can be formed at the portion entering the second recess.

  A sixth invention is characterized in that, in the first invention, the thickness defect portion is a second concave portion provided so as to cut out an end portion in the surface direction of the antenna.

  As a result, an adhesive that bonds between the connection terminal on the holding member side that holds the IC circuit portion and the antenna side is allowed to enter, for example, the second concave portion of the antenna, so that the three-dimensional relationship with the antenna is obtained at the portion of the entry. An adhesive structure can be formed.

  According to a seventh invention, in the fifth or sixth invention, an adhesive for adhering the holding member and the antenna enters any one of the second through hole, the second concave portion, and the second concave portion. It is characterized by being provided in.

  Since the three-dimensional adhesion structure with the antenna can be realized with an adhesive provided so as to enter any of the second through hole, the second concave portion, and the second concave shape portion, compared to the case of performing the adhesion only with the surface adhesion structure, The total bonding strength can be improved by the strong bonding force of the three-dimensional bonding structure.

  According to an eighth invention, in any one of the second and fifth inventions, any one of the first through hole, the first concave portion, the second through hole, and the second concave portion is a polygon whose cross-sectional shape is a triangle or more. It is characterized by being.

  Thereby, for example, by allowing the adhesive to enter the apex portion of the polygon, it becomes possible to realize a further three-dimensional and strong adhesive structure. More adhesive is applied to the apex due to surface tension.

  According to a ninth invention, in the second or fifth invention, any one of the first through hole, the first recess, the second through hole, and the second recess has a substantially serrated region on an inner diameter side thereof. Features.

  As a result, for example, an even more three-dimensional and strong adhesive structure can be realized by allowing the adhesive to enter more adhesive using the surface tension between the teeth of the substantially serrated region. It becomes possible.

  According to a tenth aspect of the present invention, in any one of the first to ninth aspects, a tag tape used for producing the tag label is provided.

  Thereby, it is possible to realize a tag tape in which an IC circuit part, an antenna, and the like are firmly fixed, and to improve the reliability of a tag label created using the tag tape.

  To achieve the above object, the eleventh invention comprises an antenna for transmitting and receiving information, an IC circuit section for storing tag information, a connection terminal for connecting the IC circuit section and the antenna, and the IC circuit section. A plurality of RFID tag IC circuit holders formed by joining the connection terminals of the holding members and the antennas in the longitudinal direction of the substantially tape-shaped tape base material. A tag tape roll in which a tag tape is wound, wherein the RFID tag circuit holder provided in the tag tape has at least one dimension in the thickness direction on at least one of the holding member side or the antenna side. It is characterized in that a partially defective thickness defect portion is provided.

  In the tag tape roll according to the eleventh aspect of the present invention, the plurality of RFID tag IC circuit holders arranged on the wound tag tape each have a thickness defect portion on the holding member side or the antenna side. Accordingly, when the connection terminal on the holding member side that holds the IC circuit portion and the antenna side are bonded and bonded using an adhesive, the adhesive is allowed to enter the thickness defect portion to thereby hold the holding member. In addition to a simple surface adhesion structure between the planar shapes of the connection terminal and the antenna, a three-dimensional adhesion structure can be formed at a portion that enters the thickness defect portion. Therefore, compared with the case where the bonding is performed only with the surface bonding structure, the total bonding strength can be improved by the strong bonding force of the three-dimensional bonding structure. As a result, it is possible to realize a tag tape in which an IC circuit portion, an antenna, and the like are firmly fixed, and a strong tag tape roll provided with the tag tape, and further improve the reliability of a tag label produced using the tag tape.

  Alternatively, in the RFID tag IC circuit holder, it is possible to reduce the adhesion area of the surface adhesion portion required when ensuring the same strength, and in this case, the size in the surface direction of the holding member can be reduced, The uneven shape of the tag tape formed by arranging the RFID tag circuit holder on the tape base material can be relaxed. As a result, there is an effect that the diameter of the roll or the spool can be reduced.

  In order to achieve the above object, the twelfth aspect of the present invention includes an antenna that transmits and receives information, an IC circuit unit that stores tag information, and a connection terminal that connects the IC circuit unit and the antenna. A plurality of RFID tag IC circuit holders formed by joining the connection terminals of the holding members and the antennas in the longitudinal direction of the substantially tape-shaped tape base material. A wireless tag cartridge configured to be detachable from a tag label producing apparatus for storing a tag tape roll wound with a tag tape arranged and producing a tag label using the tag tape fed out from the tag tape roll. The RFID tag IC circuit holder provided in the tag tape has a small dimension in the thickness direction on at least one of the holding member side or the antenna side. Also characterized in that a thickness defect was partially deficient.

  In the RFID tag cartridge according to the twelfth aspect of the present invention, a plurality of RFID tag IC circuit holders arranged on a tag tape wound as a tag tape roll each have a thickness defect portion on the holding member side or the antenna side. Yes. Accordingly, when the connection terminal on the holding member side that holds the IC circuit portion and the antenna side are bonded and bonded using an adhesive, the adhesive is allowed to enter the thickness defect portion to thereby hold the holding member. In addition to a simple surface adhesion structure between the planar shapes of the connection terminal and the antenna, a three-dimensional adhesion structure can be formed at a portion that enters the thickness defect portion. Therefore, compared with the case where the bonding is performed only with the surface bonding structure, the total bonding strength can be improved by the strong bonding force of the three-dimensional bonding structure. As a result, it is possible to realize a tag tape in which an IC circuit portion, an antenna, and the like are firmly fixed, and to improve the reliability of a tag label produced using the tag tape.

  Alternatively, in the RFID tag IC circuit holder, it is possible to reduce the adhesion area of the surface adhesion portion required when ensuring the same strength, and in this case, the size in the surface direction of the holding member can be reduced, The uneven shape of the tag tape formed by arranging the RFID tag circuit holder on the tape base material can be relaxed.

  ADVANTAGE OF THE INVENTION According to this invention, the joint strength of the adhesion structure which connects an IC circuit part and an antenna can be improved.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. This embodiment is an embodiment when the present invention is applied to a RFID label generation system.

  FIG. 1 is a system configuration diagram showing a wireless tag generation system to which a tag label producing device including a RFID tag IC circuit holder and a tag label producing device cartridge of the present embodiment is applied.

  In this RFID tag generating system 1 shown in FIG. 1, a tag label producing device (RFID tag information communication device) 2 includes a route server 4, a terminal 5, a general-purpose computer 6, and a plurality of information via a wired or wireless communication line 3. It is connected to the server 7.

  FIG. 2 is a conceptual configuration diagram showing a detailed structure of the tag label producing apparatus 2.

  In FIG. 2, the apparatus body 8 of the tag label producing apparatus 2 is provided with a cartridge holder portion (not shown) as a recess, and the cartridge 100 is detachably attached to the holder portion.

  The apparatus main body 8 includes the above-described cartridge holder portion into which the cartridge 100 is fitted and a casing 9 that forms an outer shell, a print head (thermal head) 10 that performs predetermined printing (printing) on the cover film 103, and a cover film. For label labels that have been printed while laminating the ribbon take-up roller drive shaft 11 that drives the ink ribbon 105 that has finished printing on the cover 103, the cover film (printed tape) 103, and the belt-like base tape (tag tape) 101. Wireless communication between the tape feed roller drive shaft 12 for feeding out from the cartridge 100 as the tape 110 and the RFID circuit element To (provided later) provided in the tag label tape 110 with print using high frequency such as UHF band. And the tag label tape 1 with the printed tag label. 10 is cut to a predetermined length at a predetermined timing to generate a label-like RFID tag T (details will be described later), and the RFID circuit element To is opposed to the antenna 14 at the time of signal transmission / reception by the wireless communication. A pair of transport guides 13 for setting and holding in a predetermined access area and guiding each RFID label T after being cut, and sending the guided RFID label T to the carry-out port (discharge port) 16 for transmission It has a roller 17 and a sensor 18 that detects the presence or absence of the RFID label T at the carry-out port 16.

  The sensor 18 is a reflective photoelectric sensor including, for example, a projector and a light receiver. When the RFID label T does not exist between the projector and the light receiver, the light output from the projector is input to the light receiver. On the other hand, when the RFID label T is present between the projector and the light receiver, the light output from the projector is shielded and the control output from the light receiver is inverted.

  On the other hand, the apparatus main body 8 also processes the signal read from the RFID circuit element To and the RF circuit 21 for accessing (reading or writing) the RFID circuit element To via the antenna 14. A signal processing circuit 22 for driving, a cartridge motor 23 for driving the ribbon take-up roller drive shaft 11 and the tape feed roller drive shaft 12 described above, a cartridge drive circuit 24 for controlling the drive of the cartridge motor 23, and A print drive circuit 25 that controls energization of the print head 10, a solenoid 26 that drives the cutter 15 to perform a cutting operation, a solenoid drive circuit 27 that controls the solenoid 26, and the delivery roller 17 are driven. Delivery roller motor 28 and delivery roller drive circuit for controlling the delivery roller motor 28 9 and control for controlling the overall operation of the tag label producing apparatus 2 through the high frequency circuit 21, the signal processing circuit 22, the cartridge drive circuit 24, the print drive circuit 25, the solenoid drive circuit 27, the feed roller drive circuit 29, and the like. Circuit 30.

  The control circuit 30 is a so-called microcomputer, and although not shown in detail, is composed of a central processing unit such as a CPU, a ROM, and a RAM, and is stored in advance in the ROM while using a temporary storage function of the RAM. Signal processing is performed according to the program. The control circuit 30 is connected to, for example, the communication line 3 via the input / output interface 31, and the route server 4, the other terminal 5, the general-purpose computer 6, the information server 7 and the like connected to the communication line 3 are connected to the control circuit 30. Information can be exchanged between the two.

  FIG. 3 is an explanatory diagram for explaining the detailed structure of the cartridge 100 according to the present embodiment provided in the tag label producing apparatus 2.

  In FIG. 3, a cartridge (wireless tag cartridge) 100 includes a first roll (tag tape roll) 102 around which the base tape 101 is wound, and the transparent cover having substantially the same width as the base tape 101. A second roll 104 around which the film 103 is wound, a ribbon supply side roll 111 for feeding out the ink ribbon 105 (thermal transfer ribbon, but not necessary when the cover film 103 is a thermal tape), and an ink ribbon 105 after printing are wound. The ribbon take-up roller 106, and the pressure-sensitive roller 107 that presses and bonds the base tape 101 and the cover film 103 to feed the tape in the direction indicated by the arrow A while forming the printed tag label tape 110. ing.

  The first roll 102 is wound with the base tape 101 in which a plurality of RFID tag circuit elements To are sequentially formed at predetermined equal intervals in the longitudinal direction around a reel member 102a.

  In this example, the base tape 101 has a four-layer structure (see a partially enlarged view in FIG. 3), from the side wound inside (right side in FIG. 3) to the opposite side (left side in FIG. 3), An adhesive layer 101a made of an appropriate adhesive material, a colored base film 101b made of PET (polyethylene terephthalate), an adhesive layer 101c made of an appropriate adhesive material, and a release paper 101d are laminated in this order.

  On the back side (left side in FIG. 3) of the base film 101b, antennas (antenna portions) 152A and 152B for transmitting and receiving information are integrally provided, and a protective film 160 (holding member 160) is connected so as to be connected thereto. IC protective film) is provided. The protective film 160 includes the IC circuit unit 151 and connection terminals 159A and 159B that connect the IC circuit unit 151 and the antennas 152A and 152B (for example, connected to the electrodes of the IC circuit unit 151 with silver paste). And are arranged so as to substantially cover them. At this time, the protective film 160 is bonded to the antennas 152A and 152B by bonding the connection terminals 159A and 159B to the end portions of the antennas 152A and 152B via the adhesive layer J. The RFID tag IC circuit holder H is configured by the protective film 160 including the IC circuit unit 151 and the connection terminals 159A and 159B, the antennas 152A and 152B, the adhesive layer J, and the like. The IC circuit unit 151 and the antennas 152A and 152B constitute the RFID circuit element To.

  The adhesive layer 101a for later bonding the cover film 103 is formed on the front side (right side in FIG. 3) of the base film 101b, and the RFID tag IC circuit is formed on the back side (left side in FIG. 3) of the base film 101b. The release paper 101d is bonded to the base film 101b by the adhesive layer 101c provided so as to enclose the holding body H. The release paper 101d is one that can be adhered to the product or the like by the adhesive layer 101c when the RFID label T finally completed in a label shape is attached to a predetermined product or the like by peeling it off. It is.

  The second roll 104 has the cover film 103 wound around a reel member 104a. The cover film 103 has an ink ribbon 105 driven by a ribbon supply side roll 111 and a ribbon take-up roller 106 disposed on the back side thereof (that is, the side to be bonded to the base tape 101). By being pressed, it is brought into contact with the back surface of the cover film 103.

  The ribbon take-up roller 106 and the pressure roller 107 are driven by the driving force of the cartridge motor 23 (see FIG. 2 described above), for example, a pulse motor provided outside the cartridge 100. By being transmitted to the feed roller drive shaft 12, it is rotationally driven.

  In the cartridge 100 configured as described above, the base tape 101 fed out from the first roll 102 is supplied to the pressure roller 107. On the other hand, as described above, the ink ribbon 105 is brought into contact with the back surface of the cover film 103 fed out from the second roll 104.

  When the cartridge 100 is mounted on the cartridge holder portion of the apparatus main body 8 and a roll holder (not shown) is moved from the separation position to the contact position, the cover film 103 and the ink ribbon 105 are moved to the print head 10 and the platen roller. The base tape 101 and the cover film 103 are sandwiched between the pressure roller 107 and the sub-roller 109. The ribbon take-up roller 106 and the pressure roller 107 are rotationally driven in synchronization with the directions indicated by the arrows B and D by the driving force of the cartridge motor 23, respectively. At this time, the tape feed roller drive shaft 12 is connected to the sub roller 109 and the platen roller 108 by a gear (not shown), and as the tape feed roller drive shaft 12 is driven, the pressure roller 107, the sub roller 109, Then, the platen roller 108 rotates and the four-layer base tape 101 is fed from the first roll 102 and supplied to the pressure roller 107 as described above. On the other hand, the cover film 103 is fed out from the second roll 104 and the plurality of heating elements of the print head 10 are energized by the print drive circuit 25. As a result, printing R (see FIG. 12 described later) such as predetermined characters, symbols, and barcodes is printed on the back surface (= the surface on the adhesive layer 101a side) of the cover film 103 (however, since it is printed from the back surface, it is viewed from the printing side. (Prints mirror-symmetric characters, etc.). The base tape 101 having the four-layer structure and the cover film 103 after the printing are bonded and integrated by the pressure roller 107 and the sub-roller 109 to form a tag label tape 110 with print. It is carried out to. The ink ribbon 105 that has finished printing on the cover film 103 is taken up by the ribbon take-up roller 106 by driving the ribbon take-up roller drive shaft 11.

  FIG. 4 is a functional block diagram showing detailed functions of the high-frequency circuit 21. In FIG. 4, the high-frequency circuit 21 receives a transmission unit 32 that transmits a signal to the RFID circuit element To through the antenna 14 and a reflected wave from the RFID circuit element To that is received by the antenna 14. The unit 33 and the transmission / reception separator 34 are configured.

The transmitting unit 32 generates a carrier wave for accessing (reading or writing) the RFID tag information of the IC circuit unit 151 of the RFID circuit element To, a crystal resonator 35, and a PLL (Phase
The generated carrier wave is modulated based on a signal supplied from the signal processing circuit 22 (Locked Loop) 36 and VCO (Voltage Controlled Oscillator) 37 (in this example, a “TX_ASK” signal from the signal processing circuit 22 Transmission multiplier circuit 38 (amplitude modulation based on the above) (in the case of amplitude modulation, an amplification factor variable amplifier or the like may be used), and a transmission amplifier 39 that amplifies the modulated wave modulated by the transmission multiplier circuit 38. ing. The generated carrier wave preferably uses a frequency in the UHF band or the microwave band, and the output of the transmission amplifier 39 is transmitted to the antenna 14 via the transmission / reception separator 34 to be a RFID circuit element. It is supplied to the IC circuit section 151 of To.

  The reception unit 33 is necessary from the reception first multiplication circuit 40 that multiplies the reflected wave from the RFID circuit element To received by the antenna 14 and the generated carrier wave, and the output of the reception first multiplication circuit 40. A first bandpass filter 41 for extracting only a signal in a wide band, a reception first amplifier 43 for amplifying the output of the first bandpass filter 41, and a digital signal obtained by further amplifying the output of the reception first amplifier 43. Reception of multiplying the first limiter 42 that converts to a signal, the reflected wave from the RFID circuit element To received by the antenna 14 and the carrier wave generated by the phase shifter 49 and then shifted in phase by 90 ° A second multiplier circuit 44; a second band-pass filter 45 for extracting only a signal of a necessary band from the output of the received second multiplier circuit 44; A reception second amplifier 47 that amplifies the output of the depass filter 45 and a second limiter 46 that further amplifies the output of the reception second amplifier 47 and converts it into a digital signal are provided. The signal “RXS-I” output from the first limiter 42 and the signal “RXS-Q” output from the second limiter 46 are input to the signal processing circuit 22 and processed.

  The outputs of the reception first amplifier 43 and the reception second amplifier 47 are also input to an RSSI (Received Signal Strength Indicator) circuit 48, and a signal “RSSI” indicating the strength of these signals is input to the signal processing circuit 22. It has become so. In this way, in the tag label producing apparatus 2 according to the present embodiment, the reflected wave from the RFID circuit element To is demodulated by IQ orthogonal demodulation.

  FIG. 5 is a conceptual side view showing a more detailed structure of the first roll 102 described above. As described above, the base tape 101 wound around the first roll 102 is formed by sequentially forming a plurality of RFID tag IC circuit holders H having RFID circuit elements To in the longitudinal direction at regular intervals, for example. Yes.

  6 shows the detailed structure of the RFID tag IC circuit holder H provided on the base tape 101 wound around the first roll 101 and the peripheral portion thereof, and is a partial enlarged view of FIG. It is a cross-sectional view taken along the arrow line. 7 is a partially enlarged top view showing an extracted portion A in FIG. 6, and FIG. 8 is a side sectional view taken along the line VIII-VIII ′ in FIG.

  6, 7, and 8, the protective film is disposed so as to substantially cover the IC circuit portion 151, the connection terminals 159 </ b> A and 159 </ b> B, and the connection ends 152 a and 152 b of the antennas 152 </ b> A and 152 </ b> B. 160, two antennas 152A and 152B each having a plurality of connection end portions 152a and 152b on the side connected to the IC circuit portion 151 provided in the protective film 160 and transmitting and receiving information, and the IC circuit Part 151 and the IC circuit part 151 and the two connection ends 152a and 152b are provided in the protective film 160 to connect the connection terminal 159A and 159B and the two connection ends 152a and 152b, respectively. And an adhesive layer J for bonding the connection terminals 159A and 159B. In other words, the protective film 160 is joined to the antennas 152A and 152B via the connection terminals 159A and 159B.

  The protective film 160 includes a thickness defect portion (in this example, a through hole) 160A in which at least a part of the dimension in the thickness direction is lost. It should be noted that the through-hole lacking the entire dimension in the thickness direction may be a recess (first recess) such as a bottomed hole in which at least a part of the joining side (lower side in FIG. 8) is missing. . Further, the cross-sectional shape of the through-hole (first through-hole) 160A may be substantially circular as shown, but may be an ellipse, an ellipse, a slit, or the like, or may be another shape (refer to a modification described later). The connection terminals 159A and 159B are provided with through holes 159Aa and 159Ba communicating with the through hole 160A, respectively. A part Ja of the adhesive layer J is provided below the through hole 160A of the protective film 160 so as to enter along the wall surface through the through holes 159Aa and 159Ba of the connection terminals 159A and 159B. Yes.

  FIG. 9 is an explanatory diagram illustrating an example of a manufacturing procedure for configuring the RFID tag IC circuit holder H illustrated in FIG. 8. In FIG. 9, in this example, antennas 152A and 152B are arranged at predetermined positions on the base film 101b. On the other hand, the IC circuit unit 151 and connection terminals 159A and 159B (including through-holes 159Aa and 159Ba) are attached to a predetermined position in advance so as to be connected to the IC circuit unit 151, and a predetermined adhesive (for example, thermoplastic) is not solidified in the lower part The protective film 160 in which the adhesive layer Jo is formed from the resin and the through-hole 160A is formed is in close contact with the connection ends 152a and 152b of the antenna 152 as shown by the white arrows in the figure while being pressed from above. Let By this pressing, most of the adhesive layer Jo positioned between the connection terminals 159A and 159B provided on the protective film 160 and the antenna connection end portions 152a and 152b is relatively thin and spreads in a planar shape, and the above-described adhesion is performed. In addition to forming the agent layer J, a part of the adhesive layer Jo (through the through-holes 159Aa and 159Ab) enters the through-hole 160A from the lower part in the drawing, and the part of the adhesive layer Jo adheres within the through-hole 160A The agent layer Ja is formed.

  FIG. 10 is an explanatory diagram showing another example of the manufacturing procedure for configuring the RFID tag IC circuit holder H shown in FIG. In FIG. 10, this example is a method of providing an adhesive on the antennas 152A and 152B side. That is, an adhesive layer Jo made of a predetermined adhesive that is not solidified is formed on the connection ends 152a and 152b of the antennas 152A and 152B arranged at predetermined positions on the base film 101b. On the other hand, an IC circuit unit 151 and connection terminals 159A and 159B (including through-holes 159Aa and 159Ba) are attached to predetermined positions in advance, and a protective film 160 in which through-holes 160A are formed is shown in FIG. As shown by the arrow, the adhesive layer Jo below the protective film 160 is brought into close contact with the connection terminals 159A and 159B while being pressed from above in the drawing. As a result of this pressing (preferably by applying a pressing force slightly obliquely from the radially outer side of the through-hole 160A toward the radially inner side as indicated by the arrow in the figure), as in the above, it is relatively thin and flat. The spread adhesive layer J is formed, and a part of the adhesive layer Jo (through the through holes 159Aa and 159Ab) enters the through hole 160A from the lower part in the figure, and the inside of the through hole 160A A part of the adhesive layer Ja can be formed.

  FIG. 11 is a functional block diagram showing a functional configuration of the RFID circuit element To. In FIG. 11, the RFID circuit element To is configured to transmit and receive a signal in a non-contact manner using the high frequency such as the UHF band with the antenna 14 on the tag label producing apparatus 2 side, and the antenna 152 connected to the antenna 152. IC circuit portion 151.

  The IC circuit unit 151 includes a rectification unit 153 that rectifies the carrier wave received by the antenna 152, and a power supply unit 154 that accumulates energy of the carrier wave rectified by the rectification unit 153 and serves as a driving power source for the IC circuit unit 151. A clock extraction unit 156 that extracts a clock signal from the carrier wave received by the antenna 152 and supplies the clock signal to the control unit 155; a memory unit 157 that functions as an information storage unit that can store a predetermined information signal; and the antenna 152 And a control unit 155 for controlling the operation of the RFID circuit element To through the rectification unit 153, the clock extraction unit 156, the modulation / demodulation unit 158, and the like.

  The modem 158 demodulates the communication signal received from the antenna 14 of the tag label producing apparatus 2 received by the antenna 152, and modulates and reflects the carrier wave received from the antenna 152 based on the response signal from the controller 155. To do.

  The control unit 155 interprets the received signal demodulated by the modulation / demodulation unit 158, generates a return signal based on the information signal stored in the memory unit 157, and performs basic control such as returning by the modulation / demodulation unit 158. Execute proper control.

  12 (a) and 12 (b) show the appearance of the RFID label T formed after the information reading (or writing) of the RFID circuit element To and the cutting of the printed tag label tape 110 are completed as described above. FIG. 12A is a top view, and FIG. 12B is a bottom view. 13 is a cross-sectional view taken along the XIII-XIII ′ cross section in FIG. 12 (corresponding to the xiii-xiii ′ cross section in FIG. 6), and FIG. 14 is the XIV-XIV ′ cross section in FIG. FIG. 6 is a cross-sectional view taken along xiv-xiv ′ cross-section).

  12 (a), 12 (b), 13 and 14, the RFID label T has a five-layer structure in which a cover film 103 is added to the four-layer structure shown in FIG. From the film 103 side (upper side in FIGS. 13 and 14) toward the opposite side (lower side in FIGS. 13 and 14), the cover film 103, the adhesive layer 101a, the base film 101b, the adhesive layer 101c, and the release paper 101d There are 5 layers. As described above, the antenna 152 provided on the back side of the base film 101b and the protective film 160 joined to the antenna 152 via the adhesive layer J are provided in the adhesive layer 101c and printed on the back surface of the cover film 103. R (in this example, “RF-ID” characters indicating the type of the RFID label T) is printed.

  FIG. 15 shows a screen displayed on the terminal 5 or the general-purpose computer 6 when accessing (reading or writing) the RFID tag information of the IC circuit unit 151 of the RFID circuit element To by the tag label producing apparatus 2 as described above. It is a figure showing an example.

  In FIG. 15, in this example, the tag label type, the printed character R printed in correspondence with the RFID circuit element To, the access (read or write) ID which is an ID unique to the RFID circuit element To, the information server 7 and the storage address of the corresponding information in the route server 4 can be displayed on the terminal 5 or the general-purpose computer 6. When the tag is created, the tag label producing device 2 is operated by the operation of the terminal 5 or the general-purpose computer 6 so that the print character R is printed on the cover film 103, and the reading stored in advance in the IC circuit unit 151 is performed. The wireless tag information such as ID and article information is read (or the information such as the write ID and article information is written in the IC circuit unit 151).

  In the above description, an example in which the conveyance guide 13 is held in the access area and accessed (read or written) with respect to the moving printed tag label tape 110 in connection with the printing operation is shown. However, the access may be performed with the printed tag label tape 110 stopped at a predetermined position and held by the transport guide 13.

  Further, at the time of reading or writing as described above, the ID of the generated RFID label T and the information read from the IC circuit unit 151 of the RFID label T (or information written to the IC circuit unit 151) The correspondence relationship is stored in the route server 4 and can be referred to as necessary.

  In the tag label producing apparatus 2 of the present embodiment configured as described above, the wirelessly taken out from the cartridge 100 as the printed tag label tape 110 and set and held at a predetermined position (access area) facing the antenna 14 by the transport guide 13. The tag circuit element To is sequentially accessed (reading of the RFID tag information of the IC circuit unit 151 or writing to the IC circuit unit 151), and is cut by the cutter 15 for each RFID tag IC circuit holding body H. A tag label T is generated. The generated RFID label T is used after being peeled off by the user from the release paper 101d and exposing the adhesive layer 101c, and then being attached to various articles or the like through the adhesive layer 101c.

  Here, in the RFID tag IC circuit holder H of the present embodiment, the protective film 160 that holds the IC circuit portion 151 is provided with a through hole 160A as a thickness defect portion. Then, when the antennas 152A and 152B and the connection terminals 159A and 159B provided on the protective film 160 are bonded with an adhesive, a part Ja of the adhesive layer J enters the through-hole 160A. As a result, in addition to a simple surface adhesion structure (most part of the adhesive layer J) between the planar shapes of the protective film 160 and the antennas 152A and 152B, the part of the adhesive layer Ja that has entered the through hole 160A. A three-dimensional adhesion structure can be formed. Therefore, compared with the case where the bonding is performed only with the surface bonding structure, the total bonding strength can be improved by the strong bonding force of the three-dimensional bonding structure.

  Or the adhesion area of the surface adhesion part (most part of the adhesive bond layer J) required when ensuring the same strength can be reduced, and in this case, the size in the surface direction of the protective film 160 can be reduced. . In particular, in the present embodiment, the uneven shape of the base tape 101 on which the RFID tag IC circuit holder H is arranged can be relaxed, and the base tape on which the IC circuit portion 151 and the antennas 152A and 152B are firmly fixed. 101 can be realized, and the reliability of the RFID label T created using this can be improved.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit and technical idea of the present invention. Hereinafter, such modifications will be described.

(1) Variation in cross-sectional shape of through-hole (or recess) FIG. 16 is a partially enlarged top view showing the detailed structure of the RFID tag IC circuit holder and its peripheral part in this modification, and FIG. FIG. Components equivalent to those in FIG. 7 are denoted by the same reference numerals, and description thereof is omitted as appropriate.

  In FIG. 16, in place of the substantially circular through hole 160A in the above-described embodiment, a through hole 160A having a substantially polygonal cross section (in this example, an octagonal shape, which may be other polygonal shapes than a triangle) is provided. A part Ja of the adhesive layer J is provided below the through hole 160A so as to enter along the wall surface.

  According to this modified example, when the adhesive layer Ja is formed, more adhesive can be applied by being applied to the apex portion of the polygon due to the surface tension, so that it is possible to realize a further three-dimensional and strong adhesive structure. . Further, the shape is not limited to a substantially polygonal shape, and a substantially serrated region (not shown) may be provided on the inner diameter side of the through hole 160A. In this case as well, as described above, when forming the adhesive layer Ja, the surface tension makes it possible to allow more adhesive to enter between the teeth of the substantially serrated region, thereby realizing a further three-dimensional and strong adhesive structure. is there.

  As described above in the above embodiment, the cross-sectional shape of the bottomed hole (concave portion) is not limited to the through hole 160A, and may be a substantially polygonal shape or a sawtooth shape as described above. Furthermore, they may not be the same through-holes and recesses, but may be combined (the shape, size, depth, etc. may be different). Also in these modified examples, the same effect as the above-described embodiment is obtained.

(2) In the case where a cut is provided at the end of the protective film FIG. 17 is a partially enlarged top view showing the detailed structure of the RFID tag IC circuit holder and its peripheral part in this modification, and FIG. It is an equivalent figure. 18 is a cross-sectional view taken along the XVIII-XVIII ′ section in FIG. 17 and corresponds to FIG. 8 of the above embodiment. Portions equivalent to those in FIGS. 7 and 8 are given the same reference numerals, and description thereof will be omitted as appropriate.

  17 and 18, in this modified example, instead of the through hole 160A or the like of the above-described embodiment or the modified example of (1) above, the surface direction end of the protective film 160 (in this example, the longitudinal end) Comb-shaped portion (first concave portion) 160P is provided so as to cut the portion. Then, a part Jp of the adhesive layer J is disposed below the comb-shaped portion 160P (via the comb-shaped portions 159Ap and 159Bp provided at the longitudinal end portions which are the end portions in the surface direction of the connection terminals 159A and 159B). It is provided so as to enter along the wall surface.

  Also by this modification, the same effect as the above-mentioned embodiment is acquired. That is, when the antennas 152A and 152B and the connection terminals 159A and 159B integrally provided on the protective film 160 are bonded with an adhesive, a part Jp of the adhesive layer J (comb-shaped portions 159Ap and 159Bp is attached). The three-dimensional adhesive structure can be formed by this part of the adhesive layer Jp by entering the comb-shaped portion 160P. Therefore, compared with the case where the bonding is performed only with the surface bonding structure, the total bonding strength can be improved by the strong bonding force of the three-dimensional bonding structure.

(3) In the case where a missing portion is provided in the antenna FIG. 19 is a partially enlarged side sectional view showing the detailed structure of the RFID tag IC circuit holder and its peripheral portion in this modification, and corresponds to FIG. 8 of the above embodiment. It is a figure to do. Portions equivalent to those in FIG. 8 are given the same reference numerals, and description thereof will be omitted as appropriate.

  In FIG. 19, in this modified example, the protective film 160 and the connecting terminals 159A, 159B have through-holes 160A, through-holes 159Aa, 159Ba, comb-shaped portions 160P and the like as in the above-described embodiment and the modified examples (1) and (2). Instead of providing the missing portions such as the comb-shaped portions 159Ap and 159Bp, through holes 152X and 152Y communicating with the antennas 152A and 152B are provided. Then, a part Jb of the adhesive layer J is provided above the through holes 152X and 152Y so as to enter along the wall surface.

  Also by this modification, the same effect as the above-mentioned embodiment is acquired. That is, when bonding between the antennas 152A and 152B and the connection terminals 159A and 159B provided in the protective film 160 with an adhesive, a part Jb of the adhesive layer J is caused to enter the through holes 152X and 152Y. The three-dimensional adhesive structure can be formed by the partial adhesive layer Jb. Therefore, compared with the case where the bonding is performed only with the surface bonding structure, the total bonding strength can be improved by the strong bonding force of the three-dimensional bonding structure.

  Even in the above-described modified examples, as described above, the cross-sectional shape of the through hole or the recess may be a substantially polygonal shape or a sawtooth shape, and not all the same through hole or the recess may be combined. (The shape, size, depth, etc. may be different).

(4) Others In the above, the example in which the RFID tag information is written / read / printed on the base tape 101 moving inside the cartridge 100 has been described, but the present invention is not limited thereto, and the base tape 101 or the like is used. May be stopped at a predetermined position (the reading and writing may be held by a predetermined conveyance guide), and the above printing, reading and writing may be performed.

  Further, in the above description, the cartridge 100 in which the base tape 101 in which a plurality of RFID tag circuit elements To are sequentially formed in the longitudinal direction is wound around the first roll 102 is used. However, the present invention is not limited to this. A tray member (so-called stack type) that stores a plurality of flat paper-like label materials on which the tag circuit element To is formed may be used as the RFID circuit element storage unit.

  In the above description, the apparatus is not limited to the RFID tag information communication apparatus main body side such as the cartridge 100, but a so-called installation type or integral type that cannot be attached to and detached from the apparatus main body side is used, and the first type is included therein. A roll 102 may be provided. In this case, the same effect is obtained.

  In the above description, the case where the tag label T is created by cutting the printed tag label tape 110 that has been printed and accessed (read or written) to the RFID circuit element To by the cutter 15 has been described. Not limited to. That is, in the case where a label mount (so-called die cut label) previously separated into a predetermined size corresponding to the label is continuously arranged on the tape fed out from the roll, even if it is not cut by the cutter 15, After the tape has been discharged from the discharge port 16, only the label mount (the one with the already accessed RFID circuit element To and the corresponding printing performed) may be peeled off from the tape to produce the tag label T. The invention can also be applied to such a case.

  Moreover, in the above, it was the system which prints on the cover film 103 different from the base-material tape 101 provided with the RFID circuit element To, and bonds these together, but it is not restricted to this, It is provided in a tag tape. The present invention may be applied to a method of printing on a cover film (a type in which bonding is not performed). Further, the present invention is not limited to reading or writing RFID tag information from the IC circuit unit 151 of the RFID circuit element To and printing for identifying the RFID circuit element To by the print head 10. This printing does not necessarily have to be performed, and the present invention can also be applied to those that only read or write the RFID tag information.

The “Scroll” used above
The “ID” signal, the “Ping” signal, the “Erase” signal, the “Verify” signal, the “Program” signal, and the like are assumed to conform to the specifications established by the EPC global. EPC global is a non-profit corporation established jointly by the International EAN Association, which is an international organization of distribution codes, and the United Code Code Council (UCC), which is an American distribution code organization. Note that signals conforming to other standards may be used as long as they perform the same function.

  In addition to those already described above, the methods according to the above-described embodiments and modifications may be used in appropriate combination.

  In addition, although not illustrated one by one, the present invention is implemented with various modifications within a range not departing from the gist thereof.

1 is a system configuration diagram showing a wireless tag generation system to which a tag label producing device including a RFID tag IC circuit holder and a tag label producing device cartridge according to an embodiment of the present invention is applied. It is a notional block diagram showing the detailed structure of the tag label production apparatus shown in FIG. It is explanatory drawing for demonstrating the detailed structure of the cartridge by one Embodiment of this invention with which the tag label production apparatus shown in FIG. 1 was equipped. It is a functional block diagram showing the detailed function of the high frequency circuit shown in FIG. It is a conceptual side view showing the more detailed structure of the 1st roll shown in FIG. FIG. 4 is a cross-sectional view taken along the line VI-VI ′ in the partially enlarged view of FIG. 3 showing the detailed structure of the wireless tag IC circuit holder and its peripheral part. FIG. 7 is a partially enlarged top view showing an A portion extracted from FIG. 6. FIG. 8 is a side sectional view taken along a section VIII-VIII ′ in FIG. 7. It is explanatory drawing showing an example of the manufacture procedure for comprising the RFID tag IC circuit holding body shown in FIG. FIG. 10 is an explanatory diagram illustrating another example of a manufacturing procedure for configuring the RFID tag IC circuit holder H illustrated in FIG. 8. It is a functional block diagram showing the functional structure of a wireless tag circuit element. It is the upper surface figure and bottom view showing an example of the appearance of a RFID tag label. FIG. 13 is a transverse sectional view taken along the XIII-XIII ′ section in FIG. 12. It is a cross-sectional view by the XIV-XIV 'cross section in FIG. It is a figure showing an example of the screen displayed on a terminal or a general purpose computer at the time of access to the RFID tag information of the IC circuit part of a RFID circuit element. It is a partial enlarged top view showing the detailed structure of the RFID tag IC circuit holder in the modification provided with different through-hole cross-sectional shape and its peripheral part. It is the elements on larger scale showing the detailed structure of the RFID tag IC circuit holder in the modification which provided the notch in the edge part of a protective film, and its peripheral part. FIG. 18 is a transverse sectional view taken along the XVIII-XVIII ′ section in FIG. 17. It is a partial expanded side sectional view showing the detailed structure of the radio | wireless tag IC circuit holder in the modification which provided the defect | deletion part in the antenna, and its peripheral part.

Explanation of symbols

2 Tag label production device 100 Cartridge (wireless tag cartridge)
101 Base tape (tag tape)
102 1st roll (tag tape roll)
151 IC circuit portion 152A Antenna 152a Connection end portion 152B Antenna 152b Connection end portion 152X Through hole (third through hole)
152Y through hole (third through hole)
159A connection terminal 159B connection terminal 160 protective film (holding member)
160A through hole (first through hole, thickness defect)
160P comb-shaped part (first concave part, thickness defect part)
H RFID tag circuit holder J Adhesive layer Ja Partial adhesive layer Jb Partial adhesive layer Jp Partial adhesive layer T RFID label (tag label)

Claims (12)

An antenna for transmitting and receiving information;
An IC circuit unit for storing tag information, a connection terminal for connecting the IC circuit unit and the antenna, and a holding member for holding the IC circuit unit;
A wireless tag IC circuit holder configured by joining the connection terminal of the holding member and the antenna,
A RFID tag IC circuit holder, wherein a thickness defect part having at least a part of a dimension in a thickness direction is provided on at least one of the holding member side or the antenna side. The wireless tag IC circuit holder according to claim 1,
The RFID tag circuit holder according to claim 1, wherein the thickness defect portion is a first through hole or a first recess provided at least on the joining side of the holding member. The wireless tag IC circuit holder according to claim 1,
The RFID tag circuit holder according to claim 1, wherein the thickness defect portion is a first concave portion provided so as to cut an end portion in the surface direction of the holding member. The wireless tag IC circuit holder according to claim 2 or 3,
A wireless tag IC circuit holder, wherein an adhesive for bonding the holding member and the antenna is provided so as to enter any one of the first through hole, the first concave portion, and the first concave portion. . The wireless tag IC circuit holder according to claim 1,
The RFID tag circuit holder according to claim 1, wherein the thickness defect portion is a second through hole or a second recess provided at least on the joining side of the antenna. The wireless tag IC circuit holder according to claim 1,
The RFID tag circuit holder according to claim 1, wherein the thickness defect portion is a second concave portion provided so as to cut an end portion in the surface direction of the antenna. The RFID tag IC circuit holder according to claim 5 or 6,
A wireless tag IC circuit holder, wherein an adhesive for bonding the holding member and the antenna is provided so as to enter any one of the second through hole, the second concave portion, and the second concave portion. .   6. The RFID tag IC circuit holder according to claim 2, wherein any one of the first through hole, the first recess, the second through hole, and the second recess is a polygon having a cross-sectional shape of a triangle or more. A wireless tag IC circuit holder characterized by the above.   6. The RFID tag IC circuit holder according to claim 2, wherein any of the first through hole, the first recess, the second through hole, and the second recess has a substantially serrated region on an inner diameter side thereof. A wireless tag IC circuit holder characterized by the above. The RFID tag IC circuit holder according to any one of claims 1 to 9,
A wireless tag IC circuit holder, which is provided on a tag tape used for producing the tag label. An antenna that transmits and receives information; an IC circuit unit that stores tag information; a connection terminal that connects the IC circuit unit and the antenna; and a holding member that holds the IC circuit unit, A tag tape roll formed by winding a tag tape in which a plurality of RFID tag IC circuit holders formed by joining the connection terminals of the holding member and the antenna are arranged in the longitudinal direction of a substantially strip-shaped tape base material. And
The RFID tag IC circuit holder provided in the tag tape is characterized in that a thickness defect portion having at least a partial loss in a thickness direction dimension is provided on at least one of the holding member side or the antenna side. Tag tape roll. An antenna that transmits and receives information; an IC circuit unit that stores tag information; a connection terminal that connects the IC circuit unit and the antenna; and a holding member that holds the IC circuit unit, Stores a tag tape roll formed by winding a tag tape in which a plurality of RFID tag IC circuit holders configured by joining the connection terminals of the holding member and the antenna are arranged in the longitudinal direction of a substantially strip-shaped tape base material. And
A wireless tag cartridge configured to be attachable to and detachable from a tag label creating apparatus that creates a tag label using the tag tape fed out from the tag tape roll,
The RFID tag IC circuit holder provided in the tag tape is characterized in that a thickness defect portion having at least a partial loss in a thickness direction dimension is provided on at least one of the holding member side or the antenna side. RFID tag cartridge to be used.

Images