JP2006290957A - Composition and method of temporarily fixing member using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of temporarily fixing an optical member during processing. <P>SOLUTION: The composition contains (A) a (meth)acrylate having not less than one (meth)acryloyl group at the terminal or in the side chain of the molecule and a molecular weight of not less than 500, (B) a multifunctional (meth)acrylate, (C) a (meth)acrylate other than (A) and (B) and (D) a photopolymerization initiator. Preferably, (A) is one kind selected from the group consisting of polybutadiene, polyisoprene and hydrogenated products of both of the formers. More preferably, (A), (B) and (C) are hydrophobic. The method of temporarily fixing a member comprises temporarily fixing the member using the adhesive composition, processing the member, immersing the processed member in warm water at a temperature not higher than 90°C and detaching the cured article of the composition. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a method for temporarily fixing a member when various members are processed, and to a composition and an adhesive suitable for the method. More specifically, the present invention relates to a method for temporarily fixing the optical member when processing the optical member, and a photocurable adhesive suitable for the application.

Double-sided tape and hot-melt adhesives are used as temporary fixing adhesives for optical lenses, prisms, arrays, silicon wafers, semiconductor mounting components, etc., and members bonded or laminated with these adhesives After cutting into a predetermined shape, the adhesive is removed to manufacture a processed member. For example, regarding semiconductor mounting components, after fixing these components to a base material with a double-sided tape, a desired part is cut, and further, the double-sided tape is irradiated with ultraviolet rays to be peeled off from the part. In the case of a hot-melt adhesive, after joining the members, the adhesive is infiltrated into the gap by heating, and then a desired part is cut and the adhesive is peeled off in an organic solvent.

However, in the case of double-sided tape, it is difficult to obtain thickness accuracy, or because the adhesive strength is weak, chipping property is inferior at the time of component processing, and it cannot be peeled off without applying heat of 100 ° C or higher, In the case of peeling by ultraviolet irradiation, there is a problem that peeling is not possible if the adherend has poor permeability.

In the case of a hot melt adhesive, it cannot be applied unless heat of 100 ° C. or higher is applied during bonding, and there are restrictions on the members that can be used. In addition, it is necessary to use an organic solvent at the time of peeling, and the cleaning process of the alkali solvent or the halogen-based organic solvent is complicated, and there has been a problem in the working environment.

In order to solve these drawbacks, a photo-curing or heating adhesive for temporary fixing containing a water-soluble compound such as a water-soluble vinyl monomer has been proposed. In these adhesive compositions, releasability in water is proposed. However, the adhesive strength at the time of component fixing is low, and there is a problem that the dimensional accuracy of the member after cutting is poor. In addition, adhesives for temporary fixing that have improved adhesion by using specific (meth) acrylates with high hydrophilicity and improved releasability by swelling and partial dissolution have also been proposed. In order to generate frictional heat with a cutting jig such as a blade or a diamond cutter, and by cooling with a large amount of water, the above highly hydrophilic composition swells and becomes soft when cured, Higher dimensional accuracy cannot be reached. In addition, since a partially dissolved cured product remains in the peeled member, 10 to 60 minutes are immersed in warm water for 2 minutes, which is a problem in appearance, and more than swollen (Patent Document 1) 2, 3).
JP-A-6-116534 Japanese Patent Laid-Open No. 11-71553 Japanese Patent Laid-Open No. 2001-226641

In order to improve the dimensional accuracy of the parts after cutting, it is hydrophobic, has high adhesive strength, has excellent releasability in water, and has excellent workability even in the environment where there is no adhesive residue on the parts after peeling. A photocurable adhesive is desired.

As a result of various investigations in order to solve the problems of the prior art, the present invention uses a specific hydrophobic (meth) acrylic monomer and combines it to provide high adhesive strength and peelability in warm water. A good adhesive composition was obtained, and the knowledge that the object of the present invention can be achieved was obtained, and the present invention was completed.

That is, the present invention provides (A) a (meth) acrylate having one or more (meth) acryloyl groups at the terminal or side chain of the molecule and a molecular weight of 500 or more, (B) a polyfunctional (meth) acrylate, (C) A composition comprising (meth) acrylates other than (A) and (B), and (D) a photopolymerization initiator.

The present invention is the above composition, wherein (A) is at least one selected from the group consisting of polybutadiene, polyisoprene, and the former two hydrogenated products.

In addition, the present invention is the above composition, wherein (A), (B) and (C) are all hydrophobic.

In a preferred embodiment of the present invention, (A) is 5 to 80 parts by mass, (B) is 1 to 50 parts by mass, (C) is 5 to 80 parts by mass, and (D) is 0.1 to 20 parts by mass. It is a composition characterized by containing a part, It is an adhesive agent which consists of the said composition.

Further, the present invention is to temporarily fix the member using the composition, and after processing the temporarily fixed member, immerse the processed member in hot water of 90 ° C. or less, and A method for temporarily fixing a member, comprising removing a cured body.

The composition of the present invention is photocurable due to its composition and is cured by visible light or ultraviolet light. For this reason, compared with the conventional hot melt adhesive, it is remarkably superior in terms of labor saving, energy saving, and work shortening in the bonding work. In addition, since the cured body can exhibit high adhesive strength without being affected by cutting water used at the time of processing, it is difficult to cause a shift during processing of the member, and an effect that a member excellent in dimensional accuracy can be easily obtained. Is obtained. Furthermore, the cured body has a feature that the member can be easily collected because it lowers the adhesive strength by contacting with warm water of 90 ° C. or less and reduces the bonding force between the members or between the member and the jig. In addition, it is possible to obtain a remarkable effect that it is not necessary to use an organic solvent that is expensive, strongly ignitable, or generates a gas harmful to the human body as compared with the case of a conventional adhesive. Furthermore, in the adhesive composition having a specific preferable composition range, the cured body swells upon contact with hot water of 90 ° C. or less and can be recovered from the member in a film form, so that an effect of excellent workability can be obtained.

As described above, the method for temporarily fixing the member of the present invention uses a composition that reduces the adhesive strength by contacting with hot water of 90 ° C. or lower, or an adhesive made of the composition. It has the feature that it can be easily recovered with only the material, and it has a remarkable effect that it is not necessary to use an organic solvent that is expensive, strongly ignitable, or generates a gas harmful to the human body, compared to the case of conventional adhesives. Is obtained.

The (meth) acrylate having at least one (meth) acryloyl group at the terminal or side chain of the molecule (A) used in the present invention and having a molecular weight of 500 or more includes 1,2-polybutadiene-terminated urethane (meta ) Acrylate (for example, TEDA-1000, TEA-1000 manufactured by Nippon Soda Co., Ltd.), the hydrogenated product (for example, TEAI-1000 manufactured by Nippon Soda Co., Ltd.), 1,4-polybutadiene-terminated urethane (meth) acrylate (for example, Osaka Organics) Chemical BAC-45), polyisoprene terminal (meth) acrylate, polyester urethane (meth) acrylate, polyether urethane (meth) acrylate, polyester (meth) acrylate, bis-A type epoxy (meth) acrylate (for example, Osaka Organic Chemical Company Biscoat # 540, Showa Polymer Co., Ltd. Biscoat Examples thereof include (meth) acrylates in which one or more (meth) acroylated oligomers / polymers having a molecular weight of 500 or more such as VR-77) are terminal or side chain.

About (A), it is 1 type or more chosen from the group which consists of a polybutadiene, a polyisoprene, and the former two hydrogenated substances, and when the hardening body of a composition is immersed in warm water, the said hardening body from an adherend Is preferable because it promotes the property of peeling (hereinafter simply referred to as “peelability”).

In the present invention, (A) the addition amount of (meth) acrylate having one or more (meth) acryloyl groups at the terminal or side chain of the molecule and having a molecular weight of 500 or more is (A) (B) and ( 5-100 mass parts is preferable in 100 mass parts of total amounts of C). If it is 5 mass parts or more, peelability is enough and it can ensure that the hardening body of a composition peels in a film form. Moreover, if it is 80 mass parts or less, a viscosity raise will be produced and workability | operativity will not fall.

(A) The (meth) acrylate having one or more (meth) acryloyl groups at the end or side chain of the molecule and having a molecular weight of 500 or more is preferably hydrophobic. In the case of water solubility, it is not preferable because the cured product of the composition may swell or partially dissolve at the time of cutting, which may cause misalignment and inferior processing accuracy. If the cured product is not greatly swollen or partially dissolved by water, it can be used.

(B) As polyfunctional (meth) acrylate, as bifunctional (meth) acrylate, 1,3-butylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexadiol Di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, 2-ethyl-2-butyl-propanediol (meth) Acrylate, neopentyl glycol modified trimethylolpropane di (meth) acrylate, stearic acid modified pentaerythritol diacrylate, polypropylene glycol di (meth) acrylate, 2,2-bis (4- (meth) acryloxydiethoxyphenyl) propane , 2,2-bis ( -(Meth) acryloxypropoxyphenyl) propane, 2,2-bis (4- (meth) acryloxytetraethoxyphenyl) propane, and the like. Examples of the trifunctional (meth) acrylate include tomethylolpropane tri (meth). Acrylate, tris [(meth) acryloyloxyethyl] isocyanurate and the like. Examples of the tetrafunctional or higher functional (meth) acrylate include dimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, and pentaerythritol ethoxy. Tetra (meth) acrylate, dipentaerystol penta (meth) acrylate, dipentaerystol hexa (meth) acrylate, etc.

(B) As for the addition amount of polyfunctional (meth) acrylate, 1-50 mass parts is preferable in the total amount of 100 mass parts of (A) (B) and (C). If it is 1 mass part or more, peelability is enough and it can ensure that the hardening body of a composition peels in a film form. Moreover, if it is 50 mass parts or less, there is no possibility that initial adhesiveness may fall.

(B) The polyfunctional (meth) acrylate is more preferably hydrophobic as in (A). When water-soluble, the cured product of the composition swells during cutting, resulting in misalignment and poor processing accuracy. Because there is a fear, it is not preferable. Even if it is hydrophilic, it can be used as long as the cured product of the composition is not greatly swollen or partially dissolved by water.

(C) As (meth) acrylates other than (A) and (B), methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate , Isooctyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, phenyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl ( (Meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, isobornyl (meth) acrylate, methoxylated cyclodecatriene (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxy Roxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, glycidyl (meth) Acrylate, caprolactone-modified tetrahydrofurfuryl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, N, N-diethylaminoethyl (meth) acrylate, t- Butylaminoethyl (meth) acrylate, ethoxycarbonylmethyl (meth) acrylate, phenol ethylene oxide modified acrylate, phenol (ethylene oxide 2 mol modified) acrylate , Phenol (ethylene oxide 4 mol modified) acrylate, paracumylphenol ethylene oxide modified acrylate, nonylphenol ethylene oxide modified acrylate, nonylphenol (ethylene oxide 4 mol modified) acrylate, nonylphenol (ethylene oxide 8 mol modified) acrylate, nonylphenol (propylene oxide 2) .5 mole modified) acrylate, 2-ethylhexyl carbitol acrylate, ethylene oxide modified phthalic acid (meth) acrylate, ethylene oxide modified succinic acid (meth) acrylate, trifluoroethyl (meth) acrylate, acrylic acid, methacrylic acid, maleic acid , Fumaric acid, ω-carboxy-polycaprolactone mono (meth) acrylate, phthalic acid monohydro Shiechiru (meth) acrylate, (meth) acrylic acid dimer, beta-(meth) acryloyloxyethyl hydrogen succinate, n-(meth) acryloyloxy alkyl hexahydrophthalimide and the like.

(C) The addition amount of (meth) acrylates other than (A) and (B) is preferably 5 to 80 parts by mass in 100 parts by mass of the total amount of (A), (B) and (C). If it is 5 parts by mass or more, there is no fear that the initial adhesiveness is lowered, and if it is 80 parts by mass or less, the releasability can be secured, and the cured product of the composition peels into a film.

(C) The (meth) acrylates other than (A) and (B) are more preferably hydrophobic as in (A) and (B). In particular, it is more preferable when (A), (B) and (C) are all hydrophobic. However, in the case of being water-soluble, the cured product of the composition may swell at the time of cutting, which may cause misalignment and inferior processing accuracy, but this can be reliably prevented. Even if it is hydrophilic, it can be used as long as the cured product of the composition does not swell or partially dissolve with water.

In addition, (Meth) acryloyloxyethyl acid phosphate, dibutyl 2- (meth) acryloyloxyethyl acid phosphate, dioctyl 2- (meth) acryloyl are added to the blended compositions of (A), (B) and (C). By using together with phosphate ester having vinyl group or (meth) acryl group such as oxyethyl phosphate, diphenyl 2- (meth) acryloyloxyethyl phosphate, (meth) acryloyloxyethyl polyethylene glycol acid phosphate, metal The adhesion to the surface can be further improved.

(D) The photopolymerization initiator is blended for sensitization with visible light or ultraviolet actinic light to promote photocuring of the composition, and various known photopolymerization initiators can be used. Specifically, benzophenone and derivatives thereof, benzyl and derivatives thereof, entraquinone and derivatives thereof, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether, benzoin derivatives such as benzyl dimethyl ketal, diethoxyacetophenone, Acetophenone derivatives such as 4-t-butyltrichloroacetophenone, 2-dimethylaminoethyl benzoate, p-dimethylaminoethyl benzoate, diphenyl disulfide, thioxanthone and derivatives thereof, camphorquinone, 7,7-dimethyl-2,3-dioxobicyclo [2.2.1] Heptane-1-carboxylic acid, 7,7-dimethyl-2,3-dioxobicyclo [2.2.1] heptane-1-carboxy-2 Bromoethyl ester, 7,7-dimethyl-2,3-dioxobicyclo [2.2.1] heptane-1-carboxy-2-methyl ester, 7,7-dimethyl-2,3-dioxobicyclo [2 2.1] Camphorquinone derivatives such as heptane-1-carboxylic acid chloride, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethyl Α-aminoalkylphenone derivatives such as amino-1- (4-morpholinophenyl) -butanone-1, benzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, benzoyldiethoxyphosphine oxide, 2, 4,6-trimethylbenzoyldimethoxyphenylphosphine oxide, 2 4,6-trimethyl-benzo dichloride acylphosphine oxide derivatives such as ethoxyphenyl phosphine oxide and the like. A photoinitiator can be used 1 type or in combination of 2 or more types.

As for the addition amount of a photoinitiator, 0.1-20 mass parts is preferable with respect to a total of 100 mass parts of (A) (B) and (C). More preferably, 3-20 mass parts is preferable. If it is 0.1 mass part or more, the effect of hardening acceleration | stimulation will be acquired reliably, and sufficient curing rate can be obtained if it is 20 mass parts or less. As a more preferred embodiment, the addition of 3 parts by mass or more of (D) makes it possible to cure without depending on the amount of light irradiation, further increases the degree of crosslinking of the cured product of the composition, and causes misalignment during cutting. It is more preferable at the point which loses, and the point which peels improves.

The composition of the present invention can use a small amount of a polymerization inhibitor in order to improve its storage stability. For example, polymerization inhibitors include methyl hydroquinone, hydroquinone, 2,2-methylene-bis (4-methyl-6-tertiary butylphenol), catechol, hydroquinone monomethyl ether, monotertiary butyl hydroquinone, 2,5-ditertiary butyl. Hydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-ditertiarybutyl-p-benzoquinone, picric acid, citric acid, phenothiazine, tertiary butylcatechol, 2-butyl-4-hydroxyanisole, and Examples include 2,6-ditertiary butyl-p-cresol.

0.001-3 mass parts is preferable with respect to 100 mass parts of (meth) acrylic acid ester monomers, and, as for the usage-amount of these polymerization inhibitors, 0.01-2 mass parts is more preferable. Storage stability is ensured at 0.001 part by mass or more, good adhesiveness is obtained at 3 parts by mass or less, and it does not become uncured.

The composition of the present invention includes various elastomers such as acrylic rubber, urethane rubber, acrylonitrile-butadiene-styrene rubber, inorganic filler, solvent, extender, reinforcing material, plasticizer, and thickener within the range not impairing the object of the present invention. Additives such as agents, dyes, pigments, flame retardants, silane coupling agents and surfactants may be used.

Next, in the present invention, a member is bonded using a composition that is brought into contact with warm water of 90 ° C. or lower to lower the adhesive strength, the composition is cured, temporarily fixed, and the temporarily fixed member is processed. After that, the processed member is temporarily fixed by immersing the processed member in warm water to remove the cured composition, thereby processing various members such as optical members with high processing accuracy without using an organic solvent. can do.

According to a preferred embodiment of the present invention, when the composition is removed, the cured body comes into contact with warm water of 80 ° C. or lower and swells, so that it can be recovered from the member in the form of a film. An effect is obtained.

In the temporary fixing method of the present invention, it is preferable to use an adhesive comprising the composition of the present invention because the effects of the invention can be obtained with certainty.

In the present invention, peelability can be achieved in a short time by using moderately heated hot water of 90 ° C. or less, which is preferable from the viewpoint of productivity. Regarding the temperature of the warm water, when using warm water of 30 ° C. to 90 ° C., preferably 40 ° C. to 90 ° C., the cured product of the composition swells in a short time and the residual strain stress generated when the composition is cured is increased. Since it is released, the adhesive strength decreases, and the cured product of the composition can be removed in a film form, which is preferable. In addition, about the method of contact with a hardening body and warm water, since the method of immersing the whole joined body in warm water is simple, it is recommended.

In the present invention, the material of the member that can be temporarily fixed is not particularly limited, and when used as an ultraviolet curable adhesive, a member made of a material that can transmit ultraviolet rays is preferable. Examples of such a material include a crystal member, a glass member, and a plastic member. Therefore, the temporary fixing method of the present invention can be applied to temporary fixing in processing of a crystal resonator, a glass lens, a plastic lens, and an optical disk. .

Regarding the method of using the adhesive in the temporary fixing method, assuming that a photocurable adhesive is used as the adhesive, for example, an appropriate amount of adhesive is applied to the adhesive surface of one member to be fixed or the support substrate, and then After applying the adhesive by a method of superimposing the other member or a method of laminating a number of members to be temporarily fixed in advance and applying the adhesive by infiltrating the gap into the gap, the member is applied to visible light or ultraviolet light. Is used to cure the photo-curable adhesive and temporarily fix the members together.

Thereafter, the temporarily fixed member is cut into a desired shape, ground, polished, drilled, etc., and then the cured product of the composition can be peeled from the member by immersing the member in warm water. it can.

Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited to these examples.

(Example 1) (A) As a (meth) acrylate having one or more (meth) acryloyl groups at the end or side chain of a molecule and having a molecular weight of 500 or more, TE-2000 (1, Soda Co., Ltd.) 2-polybutadiene-terminated urethane methacrylate (hereinafter abbreviated as “TE-2000”) 20 parts by mass, (B) polyfunctional (meth) acrylate, dicyclotentanyl diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD R-684, hereinafter “R”) -684 ") 15 parts by mass, (C) (A), (meth) acrylate other than (B) as 2- (1,2-cyclohexacarboximido) ethyl acrylate (TO-1429 manufactured by Toagosei Co., Ltd.) Hereinafter, 40 parts by mass of “TO-1429”), phenoxyethyl acrylate (Kyoeisha Chemical Co., Ltd. Light Acrylate PO-A), “PO” -A ") and a total of 100 parts by mass of 25 parts by mass, (D) 10 parts by mass of benzyldimethyl ketal (hereinafter abbreviated as" BDK ") as a photopolymerization initiator, and 2,2-methylene as a polymerization inhibitor Bis (4-methyl-6-tertiary butylphenol) (hereinafter abbreviated as “MDP”) 0.1 part by mass was added to prepare a composition. Using the obtained composition, the tensile shear bond strength was measured and a peel test was performed by the following evaluation method. The results are shown in Table 1.

(Evaluation methods)
Tensile shear bond strength: measured in accordance with JIS K 6850. Specifically, heat-resistant Pyrex (registered trademark) glass (25 mm × 25 mm × thickness 2.0 mm) was used as the adherend, and the bonded portion was 8 mm in diameter. (Registered Trademark) glass was laminated and cured by a fusion device made by Fusion Corporation using an electrodeless discharge lamp under the condition of an integrated light amount of 2000 mJ / cm ² at a wavelength of 365 nm to prepare a tensile shear bond strength test piece. The prepared test piece was measured for tensile shear bond strength at a tensile speed of 10 mm / min in an environment of a temperature of 23 ° C. and a humidity of 50% using a universal testing machine.

Peel test: Composition was made under the same conditions as above except that the composition prepared on the heat-resistant Pyrex (registered trademark) glass was applied and bonded to a blue plate glass (150 mm × 150 mm × 1.7 mm thick) as a support. The product was cured to produce a peel test specimen. The obtained specimen was immersed in warm water (80 ° C.), the time for the heat-resistant Pyrex (registered trademark) glass to peel was measured, and the peeled state was also observed.

Examples 2 to 11 Compositions were prepared in the same manner as in Example 1 except that the raw materials of the type shown in Table 1 were used in the composition shown in Table 1. About the obtained composition, the measurement of the tensile shear adhesive strength and the peeling test were performed similarly to Example 1. The results are shown in Table 1.

(Materials used)
TEA-1000: 1,2-polybutadiene-terminated urethane acrylate (TEA-1000 manufactured by Nippon Soda Co., Ltd.)
TMPTA: Trimethylolpropane triacrylate (KAYARAD TMPTA manufactured by Nippon Kayaku Co., Ltd.)
NPA: Neopentyl glycol diacrylate (Kyoeisha Chemical Co., Ltd. light acrylate NP-A)
M-101A: Phenolic ethylene oxide 2 mol modified acrylate (Aronix M-101A manufactured by Toagosei Co., Ltd.)
TPO: 2,4,6-trimethylbenzoyldiphenylphosphine oxide (Lucirin TPO manufactured by BASF)
I-907: 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one (IRGACURE907 manufactured by Ciba Specialty Chemicals)

Comparative Examples 1 to 4 Compositions were prepared in the same manner as in Example 1 except that the raw materials of the type shown in Table 2 were used in the composition shown in Table 2. About the obtained composition, the measurement of the tensile shear adhesive strength and the peeling test were performed similarly to Example 1. The results are shown in Table 2.

(Materials used)
MTEGMA: methoxytetraethylene glycol monomethacrylate (NK ester M-90G manufactured by Shin-Nakamura Chemical Co., Ltd.)

(Example 12) Using compositions having different amounts of photopolymerization initiators (D) of Examples 1, 2, and 11 respectively, by using a curing device manufactured by Fusion Corporation using an electrodeless discharge lamp, a wavelength of 365 nm. The tensile shear adhesive strength was the same as in Example 1, except that the integrated light quantity was changed to 200, 500, 1000, 4000 mJ / cm ² and the composition was cured to produce a peel test specimen and a tensile shear bond strength test piece. Measurement of the thickness and a peel test were performed. As a result, good peelability was exhibited while maintaining the adhesive strength at each integrated light quantity. The results are shown in Table 3.

(Example 13) Using the composition prepared in Example 1, 150 mm x 150 mm x 2 mm heat-resistant Pyrex (registered trademark) glass and blue plate glass used in Example 1 were bonded and cured in the same manner as in Example 1. I let you. Only the heat-resistant Pyrex (registered trademark) glass part of this adhesion test specimen was cut into 10 mm squares using a dicing machine. The heat-resistant Pyrex (registered trademark) glass was not dropped or damaged during cutting, and showed good chipping workability. When the adhesion test body which cut | disconnected only the heat-resistant Pyrex (trademark) glass part was immersed in 80 degreeC warm water, all peeled in 120 minutes.

The composition of the present invention has photocurability because of its composition, is cured by visible light or ultraviolet light, and the cured product can exhibit high adhesive strength without being affected by cutting water or the like. It is difficult to cause displacement, and an effect that a member excellent in terms of dimensional accuracy can be easily obtained is obtained. Furthermore, contact strength with hot water is reduced, and the bonding strength between members or between a member and a jig is reduced. Therefore, it is industrially useful as an adhesive for temporarily fixing optical lenses, prisms, arrays, silicon wafers, semiconductor mounting parts and the like.

The temporary fixing method of the member of the present invention uses the above-described characteristic composition, so that it is not necessary to use an organic solvent that has been necessary in the prior art, and it can be recovered from the member in the form of a film, thus improving workability. Since it has the feature of being excellent, it is very useful in industry.

Claims (6)

(A) a (meth) acrylate having one or more (meth) acryloyl groups at the terminal or side chain of the molecule and having a molecular weight of 500 or more, (B) a polyfunctional (meth) acrylate, (C) the above (A) A composition containing (meth) acrylates other than (B) and (D) a photopolymerization initiator. 2. The composition according to claim 1, wherein (A) is at least one selected from the group consisting of polybutadiene, polyisoprene, and the former two hydrogenated products. The composition according to claim 1 or 2, wherein (A), (B) and (C) are all hydrophobic. 5 to 80 parts by mass of (A), 1 to 50 parts by mass of (B), 5 to 80 parts by mass of (C), and 0.1 to 20 parts by mass of (D). The composition according to any one of 1 to 3. An adhesive comprising the composition according to any one of claims 1 to 4. Using the composition according to any one of claims 1 to 4, a member is temporarily bonded and fixed, and after the temporarily fixed member is processed, the processed member is immersed in warm water of 90 ° C or lower. A method for temporarily fixing a member, comprising removing a cured body of the composition.