JP2006289843A - Led print head - Google Patents

Led print head Download PDF

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Publication number
JP2006289843A
JP2006289843A JP2005115343A JP2005115343A JP2006289843A JP 2006289843 A JP2006289843 A JP 2006289843A JP 2005115343 A JP2005115343 A JP 2005115343A JP 2005115343 A JP2005115343 A JP 2005115343A JP 2006289843 A JP2006289843 A JP 2006289843A
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base
substrate
print head
led print
resin
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JP2005115343A
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JP4289503B2 (en
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Kazunori Hagi
和則 萩
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Suzuka Fuji Xerox Manufacturing Co Ltd
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Suzuka Fuji Xerox Manufacturing Co Ltd
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Priority to JP2005115343A priority Critical patent/JP4289503B2/en
Priority to PCT/JP2005/014992 priority patent/WO2006112043A1/en
Publication of JP2006289843A publication Critical patent/JP2006289843A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • B41J2/451—Special optical means therefor, e.g. lenses, mirrors, focusing means

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive LED print head by producing a base having a performance equivalent to that of a shave-out base inexpensively using resin. <P>SOLUTION: The LED print head comprises a substrate mounting a plurality of light emitting elements, a base member arranged with the substrate, a cover secured to the light emitting elements, and a lens array secured to the cover wherein the base member is obtained by resin molding a polygonal metal rod and the substrate integrally and any one ridgeline of the metal rod is opposing the rear surface of the substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、電子写真方式の複写機やプリンタ、ＦＡＸ等に使用されるＬＥＤプリントヘッドに関する。   The present invention relates to an LED print head used for an electrophotographic copying machine, a printer, a FAX, and the like.

複数の発光素子（例えば、ＬＥＤアレイチップ等）を略直線状に実装した長尺の基板を、長尺のアルミニウム製等のベースに配設したＬＥＤプリントヘッドが画像形成装置等において使用されている。
このＬＥＤプリントヘッドは、発光素子から出射された光を、レンズアレイにより感光体上に直線状に結像させるものである。このため、基板を配設するベースは、高い平面度および真直度が要求される。 An LED print head in which a long substrate on which a plurality of light emitting elements (for example, an LED array chip) are mounted in a substantially linear shape is arranged on a long base made of aluminum or the like is used in an image forming apparatus or the like. .
In this LED print head, light emitted from a light emitting element is linearly imaged on a photosensitive member by a lens array. For this reason, the base on which the substrate is disposed is required to have high flatness and straightness.

また、発光素子は、発光すると発熱するため、ベースは、放熱効率が高いものなければならない。ベースの放熱効率が低いと、ベースの温度が上昇し、ベースと基板にソリが生じるからである。
このため、従来は、高い平面度と真直度を有し、かつ放熱効率の高い金属（例えば、アルミニウム等）の加工部材をベースとして用いるのが一般的であった。
特開平０３−１５１９６３号公報 特開平０６−１１５１６０号公報 特開平１１−２７７７９５号公報 Further, since the light emitting element generates heat when it emits light, the base must have high heat dissipation efficiency. This is because if the heat dissipation efficiency of the base is low, the temperature of the base rises and warping occurs between the base and the substrate.
For this reason, conventionally, it has been common to use a metal (for example, aluminum) processed member having high flatness and straightness and high heat dissipation efficiency as a base.
Japanese Patent Laid-Open No. 03-151963 Japanese Patent Laid-Open No. 06-115160 Japanese Patent Laid-Open No. 11-277795

しかし、フライス等で金属を加工して製造した、いわゆる削り出しのベースは、前記した所望の性能を出すことができるが、ベースの製造に多くの工数を要するため、ベースのコストが高くなり、ひいては、ＬＥＤプリントヘッドのコストを高くするという問題がある。   However, the so-called machined base manufactured by processing a metal with a milling machine or the like can produce the desired performance as described above, but it requires a lot of man-hours to manufacture the base, which increases the cost of the base, As a result, there is a problem of increasing the cost of the LED print head.

本発明は、かかる従来の問題点に鑑みてなされたものであり、削り出しのベースと同等の性能を有するベースを、樹脂を用いて安価に製造することにより、安価なＬＥＤプリントヘッドを提供することを目的とする。   The present invention has been made in view of such conventional problems, and provides an inexpensive LED print head by manufacturing a base having the same performance as a machined base at low cost using a resin. For the purpose.

請求項１に記載のＬＥＤプリントヘッドは、複数の発光素子を実装した基板と、基板を配設したベースと、ベースに固定されたカバーと、発光素子に対向した位置で、カバーに固定されたレンズアレイとを有するＬＥＤプリントヘッドにおいて、ベースは、多角形の金属棒と、基板とを樹脂により一体的に成形したものであり、金属棒のいずれかの稜線が、基板の裏面と対向しているため、基板の裏面と金属棒の間に樹脂が入り込み易いので、基板の裏面と金属棒の間に空気の気泡が形成されることがない。また、発光素子から生じた熱は、金属棒に伝えやすいため、ベースの放熱効率が損なわれることはない。さらに、金属棒により、ベースの剛性、真直度および平面度を保つことができる。すなわち、安価なベースを用いることにより安価なＬＥＤプリントヘッドを提供することができる。   The LED print head according to claim 1 is fixed to the cover at a position facing the light emitting element, a substrate on which the plurality of light emitting elements are mounted, a base on which the substrate is disposed, a cover fixed to the base, and the light emitting element. In an LED print head having a lens array, a base is formed by integrally forming a polygonal metal rod and a substrate with a resin, and one of the ridge lines of the metal rod faces the back surface of the substrate. Therefore, since the resin easily enters between the back surface of the substrate and the metal rod, air bubbles are not formed between the back surface of the substrate and the metal rod. In addition, since heat generated from the light emitting element is easily transmitted to the metal rod, the heat dissipation efficiency of the base is not impaired. Further, the metal rod can maintain the rigidity, straightness and flatness of the base. That is, an inexpensive LED print head can be provided by using an inexpensive base.

請求項２に記載のＬＥＤプリントヘッドは、請求項１において、金属棒のいずれかの稜線の全部または一部が、基板の裏面と接触しているので、基板の熱を金属棒に伝え易くなっており、前記した効果に加えて、より放熱効率の高いＬＥＤプリントヘッドを提供することができる。   According to a second aspect of the present invention, in the LED print head according to the first aspect, since all or part of the ridge line of any of the metal bars is in contact with the back surface of the board, the heat of the board can be easily transmitted to the metal bar. In addition to the effects described above, an LED print head with higher heat dissipation efficiency can be provided.

請求項３に記載のＬＥＤプリントヘッドは、請求項１または請求項２において、金属棒は、ベースの長手方向の一端または両端から突出しているので、前記した効果に加えて、より放熱効率の高いＬＥＤプリントヘッドを提供することができる。   According to a third aspect of the present invention, in the first or second aspect of the present invention, the metal bar protrudes from one end or both ends in the longitudinal direction of the base. An LED print head can be provided.

請求項４に記載のＬＥＤプリントヘッドは、請求項１〜３において、樹脂が液晶ポリマーであるので、ベースの樹脂部分の肉厚が薄くても成形ができ、長手方向の成形収縮率を小さくできるため、発光素子の発熱により基板の温度が上昇しても、変形しにくいＬＥＤプリントヘッドを提供することができる。   The LED print head according to claim 4 can be molded even if the thickness of the resin portion of the base is thin because the resin is a liquid crystal polymer in claims 1 to 3, and the molding shrinkage in the longitudinal direction can be reduced. Therefore, it is possible to provide an LED print head that is not easily deformed even when the temperature of the substrate rises due to heat generation of the light emitting element.

本発明は、ベースの高精度な削り出し加工や、ベースへの基板の高精度な位置決め配設を不要にし、基板と金属棒と樹脂からなるベースを一体成形することにより、ＬＥＤプリントヘッドを安価にできるという効果を奏する。   The present invention eliminates the need for high-precision cutting of the base and high-precision positioning of the substrate to the base, and makes the LED print head inexpensive by integrally forming the base made of the substrate, the metal rod, and the resin. There is an effect that can be made.

本発明を図面を用いて以下に詳細に説明する。   The present invention will be described in detail below with reference to the drawings.

図１〜図３に、本発明に係るＬＥＤプリントヘッドの一実施例を示す。
図１はＬＥＤプリントヘッド７の側面図であり、図２はベース１の平面図、図３は図２におけるベース１の断面ＡＡを示した断面図である。 1 to 3 show an embodiment of an LED print head according to the present invention.
1 is a side view of the LED print head 7, FIG. 2 is a plan view of the base 1, and FIG. 3 is a cross-sectional view showing a cross section AA of the base 1 in FIG.

図１に示すように、ＬＥＤプリントヘッド７は、基板２と多角形の金属棒４が樹脂１０により一体成形されたベース１と、レンズアレイ８（レンズ２列、レンズ長３４９ｍｍ）が樹脂により一体成形されたカバー９とからなる。   As shown in FIG. 1, the LED print head 7 has a base 1 in which a substrate 2 and a polygonal metal rod 4 are integrally molded with a resin 10, and a lens array 8 (two lens rows, a lens length of 349 mm) integrated with a resin. And a molded cover 9.

カバー９およびベース１に用いられている樹脂は、共に液晶ポリマー（ユニチカ社製 ロッドラン ＬＣ−５０００）である。かかる樹脂を用いることにより、肉厚が薄くても成形することができるため、カバー９およびベース１の小型化を実現することができる。
また、カバー９およびベース１は、成形する際に、長手方向の両端部から溶融樹脂を金型内に射出するため、長手方向の成形収縮率を小さくすることができる。このため、発光素子３の発熱によりベース１の温度が上昇しても、ベース１が長手方向に延びにくくなっている。 The resin used for the cover 9 and the base 1 is a liquid crystal polymer (Rodlan LC-5000 manufactured by Unitika). By using such a resin, the cover 9 and the base 1 can be miniaturized because the resin can be molded even if it is thin.
Further, when the cover 9 and the base 1 are molded, the molten resin is injected from both ends in the longitudinal direction into the mold, so that the molding shrinkage rate in the longitudinal direction can be reduced. For this reason, even if the temperature of the base 1 rises due to heat generation of the light emitting element 3, the base 1 is difficult to extend in the longitudinal direction.

さらに、ベース１は、図２及び図３に示すように、３７０ｍｍの長さのガラエポからなる基板２と、多角形の金属棒４（４００ｍｍの長さのアルミニウム合金、例えば、Ａ６０６３等）とを前記した樹脂１０により一体的に成形したものであるので、樹脂１０は、基板２を構成するガラエポと線膨張係数が等しいことが望ましい。なぜなら、発光素子（例えば、ＬＥＤ等）の発熱により、基板２とベース１が同じ寸法だけ膨張させることができ、基板２のソリを防止できるからである。   Further, as shown in FIGS. 2 and 3, the base 1 includes a substrate 2 made of glass epoxy having a length of 370 mm and a polygonal metal rod 4 (a 400 mm long aluminum alloy such as A6063). Since the resin 10 is integrally molded with the resin 10 described above, it is desirable that the resin 10 has the same linear expansion coefficient as that of the glass epoxy forming the substrate 2. This is because the substrate 2 and the base 1 can be expanded by the same dimension due to heat generation of the light emitting element (for example, LED), and the warpage of the substrate 2 can be prevented.

尚、図１および図３に示すように、ベース１は、六角形の金属棒４の６つの角部に存在する６つの稜線の内の１つの稜線１１と、基板２の裏面１２が対向するように構成されている。これは、基板２の裏面１２と金属棒４の間に樹脂１０が入り込み易くし、裏面１２と金属棒４の間に気泡ができないようにするためである。もし、裏面１２と金属棒４の間に樹脂１０が入りにくい場合は、この場所に気泡ができ、かかる気泡が断熱層の働きをするため、発光素子３の発光により生じた熱を基板２から金属棒４に伝えにくくなるので、ベース１の放熱効率が低くなるのである。   As shown in FIGS. 1 and 3, in the base 1, one ridge line 11 among the six ridge lines existing at the six corners of the hexagonal metal rod 4 and the back surface 12 of the substrate 2 face each other. It is configured as follows. This is because the resin 10 can easily enter between the back surface 12 of the substrate 2 and the metal rod 4 and air bubbles are not formed between the back surface 12 and the metal rod 4. If it is difficult for the resin 10 to enter between the back surface 12 and the metal rod 4, air bubbles are formed in this place, and the air bubbles act as a heat insulating layer, so that heat generated by light emission of the light emitting element 3 is transmitted from the substrate 2. Since it becomes difficult to transmit to the metal rod 4, the heat dissipation efficiency of the base 1 becomes low.

以下に、ベース１の製造方法について説明する。
まず、射出成形用の金型のキャビティ内に発光素子３が実装されていない基板２（ベアボード）の表面（上面）を、キャビティを構成する基板吸着面にセットし、この基板吸着面の複数箇所からバキューム装置にて基板を吸引吸着する。こうすることにより、長尺の基板２は、金型キャビティ内で高い真直度及び平面度を出すことができる。 Below, the manufacturing method of the base 1 is demonstrated.
First, the surface (upper surface) of the substrate 2 (bare board) on which the light emitting element 3 is not mounted in the cavity of the injection mold is set on the substrate adsorption surface constituting the cavity, and a plurality of locations on the substrate adsorption surface The substrate is sucked and adsorbed by a vacuum device. By doing so, the long substrate 2 can exhibit high straightness and flatness in the mold cavity.

次に、六角形の金属棒４を、その両端がキャビティ内で固定されるようにセットする。このとき、金属棒４の１つの稜線１１は、基板２の裏面１２に対向するように位置決めする。   Next, the hexagonal metal rod 4 is set so that both ends thereof are fixed in the cavity. At this time, one ridge line 11 of the metal bar 4 is positioned so as to face the back surface 12 of the substrate 2.

そして、金型を閉じて、キャビティ内に溶融樹脂を、金型の長手方向の両側から射出し、溶融樹脂がキャビティ内に満ちた後、金型を冷却して溶融樹脂を硬化させる。そうすると、基板２と金属棒４と樹脂１０が一体的に成形されたベース１の成形が完了する。   Then, the mold is closed and molten resin is injected into the cavity from both sides in the longitudinal direction of the mold. After the molten resin fills the cavity, the mold is cooled to cure the molten resin. Then, the molding of the base 1 in which the substrate 2, the metal rod 4, and the resin 10 are integrally molded is completed.

そして、金型を開き、ベース１を取り出して、発光素子３を公知の実装装置により実装すると、ベース１の製造が完了する。
発光素子３の実装は、ベース１の長手方向の端面６を基準として、基板２に発光素子３を４２．３μｍ間隔で７４２４個実装し、その後ワイヤボンディングすることにより行う。 Then, when the mold is opened, the base 1 is taken out, and the light emitting element 3 is mounted by a known mounting apparatus, the manufacture of the base 1 is completed.
The light emitting element 3 is mounted by mounting 7424 light emitting elements 3 on the substrate 2 at intervals of 42.3 μm with reference to the end face 6 in the longitudinal direction of the base 1 and then wire bonding.

このようにして製造されたベース１は、図３に示したように、基板２の表面にも一部の樹脂５が存在するため、成形後に基板２が剥がれることがない。
また、金属棒４の稜線１１と基板２の裏面１２が対向しているので、金属棒４と基板２の裏面１２の間に溶融樹脂が入り込み易いため、金属棒４と基板２の裏面１２の間に空気層（気泡）ができることがない。このため、ベース１は、発光素子３の発光により生じた熱を基板２の裏面１２から金属棒４に伝え易いので、放熱効率を高くすることができる。 As shown in FIG. 3, the base 1 manufactured in this way has a portion of the resin 5 on the surface of the substrate 2, so that the substrate 2 does not peel off after molding.
In addition, since the ridge line 11 of the metal bar 4 and the back surface 12 of the substrate 2 face each other, the molten resin easily enters between the metal bar 4 and the back surface 12 of the substrate 2. There is no air layer (bubble) between them. For this reason, since the base 1 can easily transmit the heat generated by the light emission of the light emitting element 3 from the back surface 12 of the substrate 2 to the metal rod 4, the heat dissipation efficiency can be increased.

さらに、図２に示したように、金属棒４は、ベース１の長手方向の一端６および他端１５から突出しているので、発光素子３の熱を基板４および金属棒４を介して放熱し易い構造になっている。具体的には、ベース１の長手方向の両端から突出している金属棒４の突出部１３および突出部１４を、画像形成装置にセットする際に、画像形成装置の金属部材に接触させる等することにより、放熱効率をさらに向上させることができる。   Further, as shown in FIG. 2, since the metal rod 4 protrudes from the one end 6 and the other end 15 in the longitudinal direction of the base 1, the heat of the light emitting element 3 is radiated through the substrate 4 and the metal rod 4. Easy structure. Specifically, when the protruding portion 13 and the protruding portion 14 of the metal rod 4 protruding from both ends in the longitudinal direction of the base 1 are set in the image forming apparatus, they are brought into contact with the metal member of the image forming apparatus. Thus, the heat dissipation efficiency can be further improved.

前記した基板１に、レンズアレイ８が配設された長尺のカバー９を、一端６を基準としてベース１上に紫外線硬化型接着剤（独立ア化学産業製 Ｎｏ８３８Ａ／Ｂ）及びシリコン系接着剤（信越化学工業製 ＫＥ３４９４）を併用して固定し、６００ｄｐｉの解像力を有するＬＥＤプリントヘッドを製造することができる。
本実施例においては、カバー９として、レンズアレイ８と液晶ポリマーからなる樹脂を一体成形するものを示したが、液晶ポリマーからなる成形品に、接着剤等を用いてレンズアレイ８を固定しても良い。 A long cover 9 in which a lens array 8 is disposed on the substrate 1 described above, an ultraviolet curable adhesive (No. 838A / B manufactured by Independent Chemical Industries) and a silicon-based adhesive on the base 1 with one end 6 as a reference. It is possible to manufacture an LED print head having a resolution of 600 dpi by fixing together (KE3494 manufactured by Shin-Etsu Chemical Co., Ltd.).
In this embodiment, the cover 9 is formed by integrally molding the lens array 8 and a resin made of liquid crystal polymer. However, the lens array 8 is fixed to a molded product made of liquid crystal polymer using an adhesive or the like. Also good.

図４〜図６に、本発明に係るＬＥＤプリントヘッドの別の実施例を示す。
尚、実施例１に係るＬＥＤプリントヘッドと同一の部分については、同一の符号を付して説明を省略し、実施例２との主な相違点についてのみ詳細に説明する。 4 to 6 show another embodiment of the LED print head according to the present invention.
The same parts as those of the LED print head according to the first embodiment are denoted by the same reference numerals and the description thereof is omitted, and only main differences from the second embodiment will be described in detail.

図４は、ＬＥＤプリントヘッド７のベース１の側面図であり、図５はベース１の平面図、図６はベース１の正面図である。図４〜図６に示すように、実施例１との相違点は、金属棒４を５角形にした点と、この金属棒４の稜線の一部を基板２の裏面１２に接触させた点と、ベース１に複数の切り欠き４２を設けた点である。
図示を省略するが、かかる切り欠き４２を設けたベース１に、図１で示したカバー９を接着剤等で取り付けることにより、図１に示すようなＬＥＤプリントヘッド７を構成することができる。 4 is a side view of the base 1 of the LED print head 7, FIG. 5 is a plan view of the base 1, and FIG. 6 is a front view of the base 1. As shown in FIGS. 4 to 6, the difference from the first embodiment is that the metal bar 4 is pentagonal and a part of the ridgeline of the metal bar 4 is brought into contact with the back surface 12 of the substrate 2. And the base 1 is provided with a plurality of notches 42.
Although not shown, the LED print head 7 as shown in FIG. 1 can be configured by attaching the cover 9 shown in FIG. 1 to the base 1 provided with the notches 42 with an adhesive or the like.

切り欠き４２は、図６に示すように、一定の間隔Ｃごとに長さＤで設けられている。すなわち、一定の長さＣを有する樹脂４１は、同じ材質からなる樹脂により連結部４３で各々連結されている。   As shown in FIG. 6, the notch 42 is provided with a length D for each constant interval C. That is, the resin 41 having a certain length C is connected to each other at the connecting portion 43 by a resin made of the same material.

このような構成をとることにより、基板２、金属棒４及びベース１の収縮率の相違によるベース１のソリを少なくすることができるだけでなく、基板２及び金属棒４の露出により、ベース１の放熱効率を向上させることができる。   By adopting such a configuration, not only the warping of the base 1 due to the difference in contraction rate between the substrate 2, the metal rod 4 and the base 1 can be reduced, but also the exposure of the substrate 2 and the metal rod 4 allows the base 1 to Heat dissipation efficiency can be improved.

また、金属棒４の稜線１１の一部が、基板２の裏面１２に接触しているので、発光素子３の熱を基板２を介して直接金属棒４に伝えることができる。このため、ベース１の放熱効率を向上させることができる。   Further, since a part of the ridge line 11 of the metal bar 4 is in contact with the back surface 12 of the substrate 2, the heat of the light emitting element 3 can be directly transmitted to the metal bar 4 through the substrate 2. For this reason, the heat dissipation efficiency of the base 1 can be improved.

前記した実施例は、説明のために例示したものであって、本発明としてはそれらに限定されるものではなく、特許請求の範囲、発明の詳細な説明および図面の記載から当業者が認識することができる本発明の技術的思想に反しない限り、変更および付加が可能である。   The above-described embodiments are illustrated for explanation, and the present invention is not limited thereto, and those skilled in the art will recognize from the claims, the detailed description of the invention, and the description of the drawings. Modifications and additions are possible without departing from the technical idea of the present invention.

ベース１を構成する樹脂は、他に難燃ＨＩＰＳ（ＰＳジャパン製 ＰＳＪ-ポリスチレン ＶＳ１４２）、ＡＢＳ（ＵＭＧＡＢＳ製 サイコラック ＥＸ１１４）、難燃ＡＢＳ（ＵＭＧＡＢＳ製 サイコラック ＥＸ５２０）、硝子繊維２０質量％入りＡＢＳ（旭化成工業製 スタイラック Ｒ２４０Ａ）、変性ＰＰＥ（旭化成工業製 Ｘｙｒｏｎ １００Ｚ）、硝子繊維２０質量％入り変性のＰＰＥ（旭化成工業製 Ｘｙｒｏｎ ＡＧ５１２）、ポリカーボネート（日本ジーイープラスチックス製 レキサン １４１Ｒ，レキサン２４１Ｒ）、硝子繊維１０、及び２０質量％入りＰＣ、ＰＣ／ＡＢＳ（日本ジーイープラスチックス製 レキサン５００Ｒ ３４１２）、硝子繊維入りＰＣ／ＡＢＳ（日本エイアンドエル製 テクニエース Ｆ７６０）を用いても良い。   Resin which comprises base 1 is flame retardant HIPS (PSJ-polystyrene VS142 made by PS Japan), ABS (Psycholac EX114 made by UMGABS), flame retardant ABS (Psycholac EX520 made by UMGABS), ABS containing 20% by mass of glass fiber. (Asahi Kasei Kogyo Stylac R240A), modified PPE (Asahi Kasei Kogyo Xyron 100Z), glass fiber 20% by mass modified PPE (Asahi Kasei Kogyo Xyron AG512), polycarbonate (Nihon GE Plastics Lexan 141R, Lexan 241R), Glass fiber 10 and PC containing 20% by mass, PC / ABS (Nihon GE Plastics Lexan 500R 3412), Glass fiber containing PC / ABS (Nippon A & L Techniace F760) May be.

いずれの樹脂を用いてもベースとしての機能上は問題ない。樹脂の色は、光の乱反射を防止する目的でいずれも黒色にすることが望ましい。   Even if any resin is used, there is no problem in the function as a base. The resin color is desirably black for the purpose of preventing irregular reflection of light.

また、前記カバーを構成する樹脂は、他にＰＳＪ-ポリスチレン ＶＳ１４２、サイコラック ＥＸ１１４、サイコラック ＥＸ５２０、スタイラック Ｒ２４０Ａ、Ｘｙｒｏｎ １００Ｚ、レキサン １４１Ｒ，レキサン２４１Ｒ、レキサン５００Ｒ、３４１２、テクニエース Ｆ７６０を用いても良い。   The resin constituting the cover may also be PSJ-polystyrene VS142, Psycolac EX114, Psycolac EX520, Stylac R240A, Xylon 100Z, Lexan 141R, Lexan 241R, Lexan 500R, 3412, Techniace F760. good.

いずれの樹脂を用いても機能上は問題ない。樹脂の色は、樹脂の色は、光の乱反射を防止する目的でいずれも黒色にすることが望ましい。   There is no problem in function even if any resin is used. The resin color is preferably black for the purpose of preventing irregular reflection of light.

また、金属棒４として、例えばＳＵＳや、防食を目的に電気、或いは化学Ｎｉ鍍金された鉄を主成分とする合金、真鍮などに代表される銅合金等を用いても良い。曲げ強度等が要求される場合であって、アルミニウム合金や銅だけでは不足する場合は、高強度であるＳＵＳや鉄合金とのサンドイッチ構造や、２層構造等で複合化してもよい。   Further, as the metal rod 4, for example, SUS, an alloy mainly composed of iron plated with electricity or chemical Ni for the purpose of corrosion prevention, a copper alloy represented by brass, or the like may be used. In the case where bending strength or the like is required and the aluminum alloy or copper alone is insufficient, it may be combined with a sandwich structure with a high strength SUS or iron alloy, a two-layer structure, or the like.

さらに、カバーを製造するにあたり、最初にレンズアレイに部分的に熱可塑性樹脂を成形接着させ、其々の樹脂の収縮の影響を少なくさせ、次に金型の一部（固定側金型）変更し続いて再び同じ、又は異種の樹脂を射出成形して、樹脂未充填の部分に充填してもよい。   Furthermore, when manufacturing the cover, the thermoplastic resin is first partially molded and bonded to the lens array to reduce the effects of shrinkage of each resin, and then a part of the mold (fixed side mold) is changed. Subsequently, the same or different resin may be injection-molded again to fill the resin-unfilled portion.

また、本発明で用いる成形方法は、圧縮成形法、トランスファー成形法、射出成形法、射出圧縮成形機が一般的であり、旭化成工業のＡＧＩ，ＧＰＩ，ＣＧＭ、出光石油化学のＧＩＭ、新日鉄化学のＰＦＰ、英国のシンプレス社、米国のＧＡＩＮ Ｔｅｃｈｎｏｌｏｇｙ 独国のエアーモールド，コンツールなどに代表されるガスアシスト成形法（中空射出成形法）、及び米国のＵＣＣ法、ＵＳＭ法、或いは、東芝機械と旭ダウのＴＡＦ法、ＥＸ−ＣＥＬＬ-Ｏ社法、ヘッティンガーの発泡成形や、Ｎｅｗ−ＳＦ、ＧＣＰ法、アライドケミカル社の技法等、更に超臨界状態の気態（体）を用いた米国 トレクセル社のＭｕＣｅｌｌ（ミューセル）や旭化成工業のＡＭＯＴＥＣに代表される発泡成形法（発泡射出成形法）や、発泡成形法と前記ガスアシスト成形法と融合された方法、更には住友化学のＳＰモールド、射出圧縮成形法との前記ガスアシスト成形法及び／又は発泡成形法とを融合させた方法を用いることもできる。   The molding method used in the present invention is generally compression molding method, transfer molding method, injection molding method, injection compression molding machine, AGI, GPI, CGM of Asahi Kasei Kogyo, GIM of Idemitsu Petrochemical, Nippon Steel Chemical PFP, UK-based Simpress, US GAIN Technology Gas-assisted molding method (hollow injection molding method) represented by Germany's air mold, contool, etc., U.S. UCC method, USM method, or Toshiba Machine Asahi Dow's TAF method, EX-CELL-O method, Hettinger's foam molding, New-SF, GCP method, Allied Chemical's technique, etc. The foam molding method (foam injection molding method) represented by MuCell (Mucell) of Asahi Kasei Co., Ltd. It is also possible to use a method fused with the assist molding method, or a method in which the gas assist molding method and / or the foam molding method with Sumitomo Chemical's SP mold and injection compression molding method are fused.

ＬＥＤプリントヘッドを安価に製造することができるため、画像形成装置を安価に製造することができる。   Since the LED print head can be manufactured at low cost, the image forming apparatus can be manufactured at low cost.

本発明に係るＬＥＤプリントヘッドの側面図である。（実施例１）It is a side view of the LED print head concerning this invention. Example 1 本発明に係るＬＥＤプリントヘッドを構成するベースの平面図である。（実施例１）It is a top view of the base which comprises the LED print head concerning this invention. Example 1 本発明に係るＬＥＤプリントヘッドを構成するベースの断面図である。（実施例１）It is sectional drawing of the base which comprises the LED print head concerning this invention. Example 1 本発明に係るＬＥＤプリントヘッドを構成するベースの側面図である。（実施例２）It is a side view of the base which comprises the LED print head concerning this invention. (Example 2) 本発明に係るＬＥＤプリントヘッドを構成するベースの平面図である。（実施例２）It is a top view of the base which comprises the LED print head concerning this invention. (Example 2) 本発明に係るＬＥＤプリントヘッドを構成するベースの正面図である。（実施例２）It is a front view of the base which comprises the LED print head concerning this invention. (Example 2)

符号の説明Explanation of symbols

１ ベース
２ 基板
３ 発光素子
４ 金属棒
７ ＬＥＤプリントヘッド
８ レンズアレイ
９ カバー DESCRIPTION OF SYMBOLS 1 Base 2 Board | substrate 3 Light emitting element 4 Metal rod 7 LED print head 8 Lens array 9 Cover

Claims (4)

複数の発光素子を実装した基板と、
該基板を配設したベースと、
該ベースに固定されたカバーと、
前記発光素子に対向した位置で、前記カバーに固定されたレンズアレイとを有するＬＥＤプリントヘッドにおいて、
前記ベースは、多角形の金属棒と、前記基板とを樹脂により一体的に成形したものであり、前記金属棒のいずれかの稜線が、前記基板の裏面と対向していることを特徴とするＬＥＤプリントヘッド A substrate on which a plurality of light emitting elements are mounted;
A base on which the substrate is disposed;
A cover fixed to the base;
In an LED print head having a lens array fixed to the cover at a position facing the light emitting element,
The base is formed by integrally forming a polygonal metal rod and the substrate with a resin, and any one of the ridge lines of the metal rod faces the back surface of the substrate. LED print head 前記金属棒のいずれかの稜線の全部または一部が、前記基板の裏面と接触していることを特徴とする請求項１に記載のＬＥＤプリントヘッド   2. The LED print head according to claim 1, wherein all or part of a ridge line of the metal bar is in contact with a back surface of the substrate. 前記金属棒は、前記ベースの長手方向の一端または両端から突出していることを特徴とする請求項１または請求項２に記載のＬＥＤプリントヘッド   3. The LED print head according to claim 1, wherein the metal bar protrudes from one end or both ends of the base in the longitudinal direction. 前記樹脂は、液晶ポリマーであることを特徴とする請求項１〜３に記載のＬＥＤプリントヘッド   The LED print head according to claim 1, wherein the resin is a liquid crystal polymer.
JP2005115343A 2005-04-13 2005-04-13 LED print head Expired - Fee Related JP4289503B2 (en)

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JP2009154327A (en) * 2007-12-25 2009-07-16 Kyocera Corp Optical printer head and image forming apparatus
US20090169260A1 (en) * 2007-12-27 2009-07-02 Brother Kogyo Kabushiki Kaisha Image Forming Apparatus
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US8773488B2 (en) 2010-04-02 2014-07-08 Fuji Xerox Co., Ltd. Exposure head and producing method thereof, cartridge, and image forming apparatus
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