JP2006287260A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric component capable of performing fine control of inductance values easily. <P>SOLUTION: This electronic component has a lamination 100 formed by laminating multiple sheets of substrate layers 1-6 and 8-10. Inside the lamination 100, arrangement is made for a floating electrode 61 formed on a substrate layer 6, coil conductors 20 with inductance components configured by mutual interlayer conduction between conductive patterns 11, 21, 31 and 41 which are arranged on the substrate layers 1-4 adjacent in the laminating direction of the lamination 100, and capacitor conductors 30 with inductance components configured as they are formed on the substrate layers 8 and 9. The floating electrode 61, coil conductors 20 and capacitor conductors 30 are laminated in the above order. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component having an inductance component suitable for use in a filter circuit of an electronic device.

Conventionally, as an electronic component of this type, for example, conductor patterns are formed on each of insulating base layers, and the conductor patterns are formed so as to be conductive between layers. By forming a laminated body by laminating, an element in which an inductance component is formed by each conductor pattern in the laminated body is provided.
Such an electronic component can be used as various filter elements by providing a capacitor conductor constituting a capacitance component together with a coil conductor constituting an inductance component.

  By the way, the conventional electronic parts shown above are performed by changing the number of turns of the coil conductor or changing the area of the coil conductor when changing the inductance value important for determining the characteristics. When the number of turns of the coil conductor is changed, the inductance value changes greatly. Therefore, when fine adjustment is required, the area of the coil conductor is changed.

  However, in order to change the area of the coil conductor, the pattern shape of the coil conductor provided on the base layer must be changed each time, so that it is difficult to achieve mass production and there is a problem that the cost increases accordingly. .

  The present invention has been made in consideration of such circumstances, and the purpose thereof is to easily adjust the inductance value without changing the coil pattern, and to achieve mass production. An object of the present invention is to provide an electronic component that can prevent an increase in cost.

  The present invention employs the following configuration in order to solve the above problems. That is, the electronic component of the present invention has a laminate formed by laminating a plurality of substrate layers, and a floating electrode formed in the substrate layer and a laminate of the laminate in the laminate. A coil conductor in which an inductance component is formed by electrically connecting conductor patterns arranged in the base layer adjacent in a direction between layers, and a capacitor conductor in which a capacitance component is formed in the base layer; The floating electrode, the coil conductor, and the capacitor conductor are laminated in this order.

  In this invention, the floating electrode is provided at a position spaced apart from the base layer on which the coil conductor is formed, and the value of the inductance changes according to the position of the floating electrode. Therefore, the inductance value can be finely adjusted by adjusting the position of the floating electrode. Moreover, since it has a capacitance component, it can be used with versatility.

In the electronic component of the present invention, it is preferable that the floating electrode is disposed at a position overlapping the coil conductor in the stacking direction of the stacked body.
In this invention, since the floating electrode is disposed at a position overlapping the coil conductor, fine adjustment of the inductance value can be performed reliably.

In the electronic component of the present invention, it is preferable that the floating electrode is disposed in a region in a traveling direction of a magnetic field generated by the coil conductor.
In this invention, since the floating electrode is disposed in the region in the direction of travel of the magnetic field generated by the coil conductor, fine adjustment of the inductance value can be performed reliably.

In the electronic component of the present invention, it is preferable that a resistive conductor having a resistance component is disposed in the laminate.
In this invention, since it has a resistance component, versatile use is possible.

  According to the electronic component of the present invention, since the floating electrode that shields the magnetic field generated by the coil conductor is provided, the inductance value that the coil conductor originally has can be reduced and finely adjusted by the floating electrode, Since the coil conductor can be formed as it is, it is possible to achieve mass production as an electronic component and to prevent an increase in cost.

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing an essential part of an electronic component according to a first embodiment of the present invention.
In the electronic component of the embodiment shown in FIG. 1, a laminated body 100 is formed by laminating a plurality of insulating base layers 1 to 6 between two upper and lower cover sheets 71 and 72.
The insulating base layers 1 to 6 are composed of a dielectric magnetic material mixed layer made of a composite material in which, for example, a dielectric ceramic powder and a magnetic ferrite powder are mixed at a predetermined ratio, and the cover sheets 71 and 72 are also basic. Specifically, it is formed in substantially the same manner as the base layers 1 to 6.

  Among these base layers 1 to 6, conductor patterns 11, 21, 31, and 41 each having a belt-like shape are provided on the top surfaces of the base layers 1, 2, 3, and 4, respectively. In this case, a through hole 1a is provided at a predetermined position between the conductive pattern 11 of the base layer 1 and the conductive pattern 21 of the base layer 2, and a predetermined position between the conductive pattern 21 of the base layer 2 and the conductive pattern 31 of the base layer 3 Are provided with through holes 2a at predetermined positions between the conductor pattern 31 and the conductor pattern 41 of the base layer 4, and these through holes 1a, 2a, 3a are filled with a conductive paste. .

  And when each base layer 1-4 is laminated | stacked on the up-down direction (lamination direction) mutually, the conductor patterns 11, 21, 31, and 41 are mutually connected electrically, and the coil conductor 20 which comprises a coil component is comprised. Are formed along the stacking direction.

  Of the base layers 1 to 4 forming the coil conductor 20, a terminal pattern 4 a connected to the conductor pattern 41 is formed on the uppermost base layer 4, and a conductor pattern 41 is connected to the lowermost base layer 1. A terminal pattern 1b connected to the pattern 11 is formed, and the terminal patterns 4a and 1b constitute terminal electrodes connected to the circuit.

  Furthermore, a floating electrode 61 is provided on the upper surface of the base layer 6 disposed above the base layer 4, that is, on the base layer 6 disposed on the base layer 4 with the base layer 5 being separated. The floating electrode 61 is provided independently by being electrically insulated from the circuit of the coil conductor 20. When a magnetic field is generated in the stacking direction by the coil conductor 20, It functions to adjust the inductance value of the coil component forming the conductor 20.

  At that time, the floating electrode 61 is arranged at a position overlapping with any one of the conductor patterns 11, 21, 31, and 41 forming the coil conductor 20 in the stacking direction of the base layers 1 to 6, and the coil conductor 20 is formed. The uppermost conductive pattern 41 is provided at a predetermined distance via the base layer 5 and the base layer 6.

  The base layers 1 to 4 having the conductor patterns 11, 21, 31, and 41, the base layer 5 having no pattern thereon, and the base layer 6 having the floating electrode 61 are laminated to each other. After the cover sheets 71 and 72 are laminated on the upper and lower sides of these, the bare chips forming the rectangular parallelepiped laminated body 100 are obtained by firing, and then the exposed terminal patterns 4a and 1b are formed on the bare chips. An electronic component as a chip inductor is formed by applying a conductive paste and baking it to form terminal electrodes and the like.

When a voltage (or current) is applied to the terminal patterns 4a and 1b of the coil conductor 20 via the terminal electrode, the electronic component configured in this manner generates a magnetic field along the lamination direction of each base layer on the coil conductor 20. Occurs and functions as an inductance component.
In that case, a floating electrode 61 that is electrically insulated from the coil conductor 20 is provided at a position spaced apart from the coil conductor 20 and the base layers 5 and 6, and when a magnetic field is generated by the coil conductor 20, Since the floating electrode 61 blocks the magnetic field, the inductance value inherent in the coil conductor 20 can be reduced by the floating electrode 61.

  As a result, since the inductance value of the coil conductor 20 can be finely adjusted by the floating electrode 61, it is not necessary to change the shape and structure of the coil conductor, and the coil conductor 20 can be used as it is, so that it can be mass-produced as an electronic component. In addition, it is possible to prevent an increase in cost.

  Moreover, the floating electrode 61 is not only arranged at a position overlapping the conductor patterns 11, 21, 31, 41 forming the coil conductor 20, but also the base layer 5 with respect to the uppermost conductor pattern 41 forming the coil conductor 20. In addition, since the predetermined distance is provided via the base layer 6, the inductance value can be changed slightly depending on the distance.

Incidentally, FIG. 2 shows the results when the distance of the floating electrode 61 and the overlapping area of the coil conductor 20 and the overlapping area were changed and the change of the inductance value at that time was tested.
In FIG. 2, in Experiment 1, the distance between the floating electrode 61 and the coil conductor 20 is 60 μm, the overlapping area ratio between them is 100%, and in Experiment 2, the distance between the two is 60 μm. The area of 61 is the half area (50%) of the overlap ratio with the coil conductor 20, and in Experiment 3, the distance is 30 μm, and the inductance value at 1 MHz is shown when the overlap area ratio is 100%. Yes. Moreover, in order to compare those measured values, the measured value of the prior art example which does not provide the floating electrode 61 was also described.

  According to FIG. 2, the inductance L (nH) of the coil conductor 20 is 200 in the conventional example, whereas the value is 174 in Experiment 1, 190 in Experiment 2, and 166 in Experiment 3. Therefore, it can be seen from FIG. 2 that the inductance value can be reduced as the distance between the coil conductor 20 and the floating electrode 61 becomes smaller, and the distance can be reduced as the overlapping area of the floating electrode 61 with respect to the coil conductor 20 increases. As a result, it was confirmed that the inductance value can be reduced when the insulation distance is small and the overlapping area is large.

  In addition, after adding additives, such as a ferrite, PVB, a dispersing agent, and a plasticizer, and mixing with the ball mill, the green sheet as a base layer was produced. In order to create a spiral three-dimensional structure that forms a conductor pattern on this green sheet, a through hole is formed in a green sheet that requires a through hole, and then a conductor pattern made of Ag is printed, and a predetermined number of green sheets are laminated. Then, the laminate is formed by pressurizing and firing, and the laminate is cut into chips of a predetermined size to obtain green chips. Then, after debinding and firing the green chip, a terminal electrode paste is applied and baked to form a terminal electrode, thereby obtaining an electronic component.

FIG. 3 is an exploded perspective view showing a main part in which an electronic component according to the second embodiment of the present invention is applied to an LC composite component.
This embodiment is different from the above-described embodiment in that base layers 8 and 9 having capacitor conductors 81 and 91 having capacitance components are provided in addition to the coil conductor.

  That is, in this laminated body, the base body in which the capacitor conductors 81 and 91 are provided below the base layer 1 disposed in the lowermost layer of the base layers 1 to 4 constituting the coil conductor 20 via the base layer 10. When the laminated body 100 is formed by laminating the layers 8 and 9, the capacitor conductor 30 constituting the capacitor component is formed by the capacitor conductors 81 and 91, and therefore both the capacitor conductor 30 and the coil conductor 20 are formed. The LC composite part is formed. Reference numerals 8a and 9a are terminal patterns connected to the circuit.

  Also in this embodiment, the floating electrode 61 is provided on the upper surface of the base layer 6 that is disposed above the base layer 6 above the base layer 4 with the base layer 5 therebetween, in the same manner as described above.

  According to this embodiment, since the floating electrode 61 independent of the coil conductor 20 is formed, basically the same function and effect as the above-described embodiment can be obtained, and the capacitor conductor 30 having a capacitor component can be obtained. Since it is formed, a so-called LC composite component having the coil conductor 20 and the capacitor conductor 30 can be formed.

The illustrated embodiment shows an example in which the coil conductor 20 and the capacitor conductor 30 are formed. However, the present invention is not limited to this, and the present invention can be similarly applied to one having a resistance conductor constituting a resistance component. it can.
Further, in the illustrated embodiment, in the region of the magnetic field generated in the coil conductor 20, the base layer 4 and the base are formed so that the inductance value can be reduced as the distance between the coil conductor 20 and the floating electrode 61 increases. The example in which the base layer 5 having no conductive pattern is provided between the base layer 6 and the base layer 5 is not necessarily required depending on the thickness of each base layer.
Furthermore, a dielectric magnetic material mixture made of a composite material in which a dielectric ceramic powder and a magnetic ferrite powder are mixed at a predetermined ratio was used as the insulating base layer. Or other magnetic substance instead of magnetic ferrite powder, or a resin or the like can be used. Of course, the substrate layer may be formed of only a dielectric or a magnetic material instead of the substrate layer made of a composite material, and the substrate layer may be formed of only glass.

It is a disassembled perspective view which shows the principal part of the electronic component concerning the 1st Embodiment of this invention. It is explanatory drawing which shows the measurement result when experimenting the change of the inductance value at that time, changing the distance and overlap area between the floating and the coil conductor in the electronic component of FIG. It is a disassembled perspective view which shows the principal part of the electronic component concerning 2nd Embodiment of this invention.

Explanation of symbols

1 to 6, 8 to 10 Base layer 1a, 2a, 3a Through hole 1b, 4a Terminal pattern 11, 21, 31, 41 Conductor pattern 20 Coil conductor 30 Capacitor conductor 61 Floating electrode 71, 72 Cover sheet 81, 91 Capacitor conductor 100 Laminated body

Claims (4)

Having a laminate formed by laminating a plurality of substrate layers;
A coil in which an inductance component is formed by electrically connecting a floating electrode formed in the base layer and a conductor pattern disposed in the base layer adjacent in the stacking direction of the stack to each other inside the stack. A conductor and a capacitor conductor formed in the base layer to form a capacitance component;
The electronic component, wherein the floating electrode, the coil conductor, and the capacitor conductor are laminated in this order.   The electronic component according to claim 1, wherein the floating electrode is disposed at a position overlapping the coil conductor in a stacking direction of the stacked body.   The electronic component according to claim 1, wherein the floating electrode is disposed in a region in a traveling direction of a magnetic field generated by the coil conductor. The electronic component according to any one of claims 1 to 3, wherein a resistance conductor having a resistance component is disposed in the multilayer body.

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