JP2006287214A5 - - Google Patents

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Publication number
JP2006287214A5
JP2006287214A5 JP2006062375A JP2006062375A JP2006287214A5 JP 2006287214 A5 JP2006287214 A5 JP 2006287214A5 JP 2006062375 A JP2006062375 A JP 2006062375A JP 2006062375 A JP2006062375 A JP 2006062375A JP 2006287214 A5 JP2006287214 A5 JP 2006287214A5
Authority
JP
Japan
Prior art keywords
chamber
manufacturing apparatus
semiconductor manufacturing
ionizer
sheath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006062375A
Other languages
Japanese (ja)
Other versions
JP4767046B2 (en
JP2006287214A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2006062375A priority Critical patent/JP4767046B2/en
Priority claimed from JP2006062375A external-priority patent/JP4767046B2/en
Publication of JP2006287214A publication Critical patent/JP2006287214A/en
Publication of JP2006287214A5 publication Critical patent/JP2006287214A5/ja
Application granted granted Critical
Publication of JP4767046B2 publication Critical patent/JP4767046B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (6)

円柱状のチャンバーと、
前記チャンバー内に回転可能に設けられたキャリア載置体と、
前記キャリア載置体に設けられたキャリア固定治具と、
前記チャンバーに近接して設けられたイオナイザーと、
前記チャンバーに近接し、前記イオナイザーを内包するように設けられたシースと、
前記チャンバー及び前記シースに形成された開口部と、
を有し、
前記開口部は、前記イオナイザーで発生したイオンが前記チャンバー内に拡散するように設けられている
ことを特徴とする半導体製造装置
A cylindrical chamber;
A carrier mounting body rotatably provided in the chamber;
A carrier fixing jig provided on the carrier mounting body;
An ionizer provided close to the chamber;
A sheath provided close to the chamber and enclosing the ionizer;
An opening formed in the chamber and the sheath;
Have
The semiconductor manufacturing apparatus , wherein the opening is provided so that ions generated by the ionizer diffuse into the chamber .
円柱状のチャンバーと、
前記チャンバー内に回転可能に設けられたキャリア載置体と、
前記キャリア載置体に設けられたキャリア固定治具と、
前記チャンバーに近接して設けられた軟X線イオナイザーと、
前記チャンバーに近接し、前記軟X線イオナイザーを内包するように設けられたシースと、
前記チャンバー及び前記シースに形成された開口部と、
を有し、
前記開口部は、前記軟X線イオナイザーで発生したイオンは前記チャンバー内に拡散し、前記軟X線イオナイザーから照射される軟X線は遮蔽するように遮蔽板が設けられている
ことを特徴とする半導体製造装置
A cylindrical chamber;
A carrier mounting body rotatably provided in the chamber;
A carrier fixing jig provided on the carrier mounting body;
A soft X-ray ionizer provided close to the chamber;
A sheath provided close to the chamber and enclosing the soft X-ray ionizer;
An opening formed in the chamber and the sheath;
Have
The opening is provided with a shielding plate so that ions generated by the soft X-ray ionizer diffuse into the chamber and shield soft X-rays emitted from the soft X-ray ionizer. A semiconductor manufacturing apparatus .
請求項2において、In claim 2,
前記遮蔽板は、ポリ塩化ビニルまたはアルミニウムからなるThe shielding plate is made of polyvinyl chloride or aluminum.
ことを特徴とする半導体製造装置。A semiconductor manufacturing apparatus.
請求項1乃至請求項3のいずれか一項において、
前記キャリア固定治具は可動である
ことを特徴とする半導体製造装置
In any one of Claims 1 thru | or 3,
The semiconductor manufacturing apparatus, wherein the carrier fixing jig is movable .
請求項1乃至請求項のいずれか一項において、
前記チャンバー内、若しくは前記チャンバーに近接して設けられた液体供給手段、気体供給手段、または被処理物感知手段を有する
ことを特徴とする半導体製造装置
In any one of Claims 1 thru | or 4 ,
A semiconductor manufacturing apparatus comprising: a liquid supply means , a gas supply means, or an object sensing means provided in the chamber or in the vicinity of the chamber.
請求項1乃至請求項5のいずれか一項において、In any one of Claims 1 thru | or 5,
前記シースは、ガラス、金属、ポリプロピレン、ポリエチレン、またはポリテトラフルオロエチレンからなるThe sheath is made of glass, metal, polypropylene, polyethylene, or polytetrafluoroethylene.
ことを特徴とする半導体製造装置。A semiconductor manufacturing apparatus.
JP2006062375A 2005-03-11 2006-03-08 Semiconductor manufacturing equipment Expired - Fee Related JP4767046B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006062375A JP4767046B2 (en) 2005-03-11 2006-03-08 Semiconductor manufacturing equipment

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005068473 2005-03-11
JP2005068473 2005-03-11
JP2006062375A JP4767046B2 (en) 2005-03-11 2006-03-08 Semiconductor manufacturing equipment

Publications (3)

Publication Number Publication Date
JP2006287214A JP2006287214A (en) 2006-10-19
JP2006287214A5 true JP2006287214A5 (en) 2009-03-19
JP4767046B2 JP4767046B2 (en) 2011-09-07

Family

ID=37408720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006062375A Expired - Fee Related JP4767046B2 (en) 2005-03-11 2006-03-08 Semiconductor manufacturing equipment

Country Status (1)

Country Link
JP (1) JP4767046B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007113979A1 (en) * 2006-03-30 2007-10-11 Mitsubishi Electric Corporation Power converter and its assembling method
WO2023150161A1 (en) * 2022-02-07 2023-08-10 Applied Materials, Inc. Chamber ionizer for reducing electrostatic discharge

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0845894A (en) * 1994-07-29 1996-02-16 Nec Yamagata Ltd Wafer drying apparatus
JP3121520B2 (en) * 1995-04-24 2001-01-09 高砂熱学工業株式会社 Local clean space
JP3471543B2 (en) * 1996-11-07 2003-12-02 大日本スクリーン製造株式会社 Rotary substrate drying equipment
JP4698871B2 (en) * 2001-04-06 2011-06-08 一雄 岡野 Soft X-ray ionizer
JP2005044975A (en) * 2003-07-28 2005-02-17 Dainippon Screen Mfg Co Ltd Equipment and method for substrate processing

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