JP2006287181A5 - - Google Patents

Claims (62)

  A substrate processing apparatus,
  The exposure processing apparatus is disposed between an exposure processing apparatus that performs exposure processing on a substrate to be processed and a resist processing apparatus that supplies and processes a resist solution to the substrate to be processed and / or supplies a developing solution to the substrate to be processed. A transport mechanism that substantially transports the substrate to be processed between the apparatus and the resist processing apparatus;
  A heating mechanism for performing a heat treatment at a predetermined temperature on the substrate to be processed processed by the exposure processing apparatus;
  A control mechanism that delivers signals to and from the exposure processing apparatus and the resist processing apparatus, and is substantially under the control of a control device on the exposure processing apparatus side;
  Comprising
  The atmospheric pressure in the substrate processing apparatus is set to an atmospheric pressure in the resist processing apparatus or / and an atmospheric pressure lower than the atmospheric pressure in the exposure processing apparatus.
  Substrate processing equipment.   The substrate processing apparatus according to claim 1,
  A gas supply mechanism for supplying a gas set to at least a predetermined temperature and humidity in the substrate processing apparatus;
  The gas supply to the gas supply mechanism is configured to be supplied from the exposure processing apparatus side.
  Substrate processing equipment.   The substrate processing apparatus according to claim 1 or 2, wherein
  The transport mechanism is configured to be self-propelled,
  The heating mechanism is disposed on one end side in the self-running direction of the transport mechanism,
  The substrate processing apparatus further includes a positioning mechanism that further positions the substrate to be processed positioned by the resist processing apparatus on the other end side in the self-running direction of the transport mechanism.
  Substrate processing equipment.   A substrate processing apparatus according to any one of claims 1 to 3, wherein
  The transport mechanism is configured to be self-propelled,
  The exposure processing apparatus is disposed on one end side in a direction orthogonal to the self-running direction of the transport mechanism,
  The resist processing apparatus is disposed on the other end side in a direction orthogonal to the self-running direction of the transport mechanism.
  Substrate processing equipment.   The substrate processing apparatus according to any one of claims 1 to 4, wherein:
  The delivery position of the substrate to be processed with the exposure processing apparatus and the delivery position of the substrate to be processed with the resist processing apparatus are arranged at different height positions and / or asymmetric positions with the transport mechanism in between.
  Substrate processing equipment.   The substrate processing apparatus according to claim 3, wherein
  The conveyance height position by the conveyance position with respect to the heating mechanism is set to a position higher than the conveyance height position by the conveyance mechanism with respect to the positioning mechanism.
  Substrate processing equipment.   The substrate processing apparatus according to claim 1 or 2, wherein
  A substrate delivery position to be processed with the resist processing apparatus is disposed below the heating mechanism.
  Substrate processing equipment.   The substrate processing apparatus according to claim 1 or 2, wherein
  Arrangement unit for arranging at least one storage body configured to store a plurality of the substrates to be processed.
  A substrate processing apparatus further comprising:   A substrate processing apparatus according to any one of claims 1 to 3, wherein
  The atmospheric temperature in the apparatus is set to be lower than the atmospheric temperature in the resist processing apparatus or / and substantially the same as the atmospheric temperature in the exposure processing apparatus.
  Substrate processing equipment.   The substrate processing apparatus according to claim 1 or 2, wherein
  Resist processing apparatus for processing by supplying a resist solution to a substrate to be processed and / or supplying a developing solution to the substrate to be processed
  A substrate processing apparatus further comprising:   The substrate processing apparatus according to claim 1 or 2, wherein
  Exposure processing apparatus for performing exposure processing on a substrate to be processed
  A substrate processing apparatus further comprising:   In a substrate processing apparatus for processing a substrate to be processed, a substrate loading / unloading unit configured to be able to load / unload the substrate to be processed from outside the apparatus from one direction and a direction substantially perpendicular to the one direction of the substrate loading / unloading unit A reduced-pressure transfer chamber provided with a transfer mechanism for transferring the substrate to be processed in a reduced-pressure atmosphere, and an exposure processing chamber for performing exposure processing on the substrate to be processed provided in a direction parallel to the one direction of the reduced-pressure transfer chamber. A substrate processing apparatus comprising the substrate processing apparatus.   In a substrate processing apparatus for processing a substrate to be processed, an interface unit including a transport mechanism configured to be able to load and unload the substrate to be processed from another device, and the substrate to be processed from one direction by the transport mechanism of the interface unit. A vacuum preliminary chamber configured to be able to carry in and out, a vacuum transport chamber provided with a transport mechanism that transports the substrate to be processed in a decompressed atmosphere, which is provided in a direction substantially perpendicular to the one direction of the vacuum preliminary chamber, and the decompression chamber A substrate processing apparatus comprising: an exposure processing chamber that is provided in a direction parallel to the one direction of the transfer chamber and performs exposure processing on the substrate to be processed.   In a substrate processing apparatus for processing a substrate to be processed, an interface unit including a transport mechanism configured to be able to load and unload the substrate to be processed from another device, and a position for aligning the substrate to be processed provided in the interface unit An alignment mechanism, a vacuum preparatory chamber configured such that the substrate to be processed aligned by the alignment mechanism can be loaded and unloaded from one direction by the transport mechanism, and the vacuum preparatory chamber substantially in the one direction. A decompression transport chamber provided with a transport mechanism for transporting the substrate to be processed in a reduced pressure atmosphere, which is provided in a direction perpendicular to the substrate, and an exposure for performing exposure processing on the substrate to be processed provided in a direction parallel to the one direction of the decompression transport chamber. A processing chamber, a heat treatment section provided in the interface section for heat-treating a substrate to be processed that has been subjected to exposure processing in the exposure processing chamber, treatment in the heat treatment section, and the transfer device A substrate processing apparatus, characterized in that provided with the at least one control mechanism performs control of conveyance of the.   In a substrate processing apparatus for processing a substrate to be processed, a substrate loading / unloading unit configured to be able to load / unload the substrate to be processed from one direction, and a detection mechanism that is provided in the substrate loading / unloading unit and detects the alignment of the substrate to be processed A reduced-pressure transfer chamber provided with a transfer mechanism that is provided in a direction substantially perpendicular to the one direction of the substrate carry-in / out section and transfers the substrate to be processed in a reduced-pressure atmosphere, and parallel to the one direction of the reduced-pressure transfer chamber And an exposure processing chamber for performing an exposure process on the substrate to be processed, and a position where the substrate to be processed is transported from the transport mechanism based on the detection data of the detection mechanism. And a stage provided on the substrate.   In a substrate processing apparatus for processing a substrate to be processed, a substrate loading / unloading section configured to be able to load / unload a substrate to be processed positioned with a predetermined accuracy in another apparatus from one direction, and the substrate loading / unloading section A decompression transport chamber provided with a transport mechanism that transports the substrate to be processed under a reduced pressure atmosphere in a direction substantially perpendicular to one direction, and exposure to the substrate to be processed disposed in a direction parallel to the one direction of the decompression transport chamber. A substrate processing apparatus comprising: an exposure processing chamber that performs processing; and a positioning mechanism that is provided in a substrate carry-in / out section or / and a decompression transfer chamber and performs positioning with higher accuracy than the predetermined accuracy.   In a substrate processing apparatus for processing a substrate to be processed, an interface unit having a transfer mechanism configured to be able to load and unload a substrate to be processed, and the substrate to be processed can be loaded and unloaded from one direction by the transfer mechanism of the interface unit. A vacuum preparatory chamber configured, a decompression transport chamber provided with a transport mechanism for transporting the substrate to be processed in a decompressed atmosphere, which is provided in a direction substantially perpendicular to the one direction of the vacuum preparatory chamber, and the vacuum transport chamber Positioning of the substrate to be processed provided in at least two sections of the exposure processing chamber which is provided in parallel with one direction and performs exposure processing on the substrate to be processed, the interface unit, the vacuum preliminary chamber, the decompression transfer chamber, and the exposure processing chamber And a positioning mechanism for applying the substrate.   In a substrate processing apparatus for processing a substrate to be processed, an interface unit having a transfer mechanism configured to be able to load and unload a substrate to be processed, and the substrate to be processed can be loaded and unloaded from one direction by the transfer mechanism of the interface unit. A vacuum preparatory chamber configured, a decompression transport chamber provided with a transport mechanism for transporting the substrate to be processed in a decompressed atmosphere, which is provided in a direction substantially perpendicular to the one direction of the vacuum preparatory chamber, and the vacuum transport chamber An exposure processing chamber which is provided in parallel with one direction and performs exposure processing on the substrate to be processed; a first positioning mechanism which is disposed in the interface unit and performs positioning of the substrate to be processed with first accuracy; and a decompression transfer chamber A substrate processing apparatus comprising: a second positioning mechanism that performs positioning with a second accuracy higher than the first accuracy in the exposure processing chamber.   In a substrate processing apparatus for processing a substrate to be processed, an interface unit including a transport mechanism configured to be able to load and unload the substrate to be processed from another device, and the substrate to be processed from one direction by the transport mechanism of the interface unit. A vacuum preparatory chamber that is configured to be able to carry in and out and that is disposed on the work space side of the other device of the interface unit, and decompresses the substrate to be processed in a direction substantially perpendicular to the one direction of the vacuum preparatory chamber A decompression transport chamber having a transport mechanism for transporting in an atmosphere; an exposure processing chamber provided in parallel with the one direction of the decompression transport chamber for performing an exposure process on the substrate to be processed; and the vacuum preliminary of the interface unit A positioning mechanism disposed on the chamber side for positioning the substrate to be processed, and a side of the transport mechanism that faces the positioning mechanism provided in the interface unit The substrate processing apparatus characterized by being arranged to anda heat treatment mechanism for performing heat treatment on the target substrate.   From a device for applying a resist solution to a substrate to be processed and a device for performing exposure processing on a substrate to be processed on which a resist film is formed, a transport mechanism configured to transport the substrate to be processed, and a device for performing exposure processing A substrate comprising: a heat treatment section that performs a predetermined heat treatment on the received substrate to be processed; and a positioning mechanism that positions the substrate relative to the substrate to be processed received from an apparatus side that applies a resist solution to the substrate to be processed. Processing equipment. A linear space, and a positioning mechanism that is provided on one end of the space and is positioned with respect to the substrate to be processed received from the apparatus side that applies the resist solution to the substrate to be processed;
A heat treatment unit that is provided on the other end side of the space portion and that performs a predetermined heat treatment on the substrate to be processed received from the apparatus side that performs exposure processing, and a substrate to be processed that is disposed between the heat treatment unit and the positioning mechanism. A substrate processing apparatus comprising: a transport mechanism configured to be transportable.   Positioning the substrate to be processed with a first accuracy in an air atmosphere or a positive pressure atmosphere, and positioning the substrate to be processed with a second accuracy higher than the first accuracy in a reduced pressure atmosphere A substrate processing method comprising: a step; and a step of performing a predetermined process on a substrate to be processed after this step.   A step of positioning the substrate to be processed with a first control mechanism in an air atmosphere or a positive pressure atmosphere with a first accuracy; and a second method for controlling the first control mechanism in a reduced pressure atmosphere. And a step of positioning with a second accuracy higher than the first accuracy by the control mechanism, and a step of performing a predetermined process on the substrate to be processed after this step. Substrate processing method.   A process of loading a substrate to be processed from another apparatus side by a transport mechanism controlled by a first control mechanism, and an exposure process for the substrate to be processed by a second control mechanism that manages the first control mechanism A step of transporting to the heat treatment apparatus by the transport mechanism controlled by the first control mechanism, and a transport mechanism controlled by the first control mechanism. And a step of unloading the substrate to be processed from the apparatus side.   Positioning process for positioning with respect to the substrate to be processed received from the apparatus side for applying the resist solution to the substrate to be processed, and information from the apparatus side for performing the exposure process on the substrate to be processed received from the apparatus side for performing the exposure process And a step of performing a heat treatment at a predetermined temperature based on the substrate processing method.   Positioning process for positioning with respect to the substrate to be processed received from the apparatus side for applying the resist solution to the substrate to be processed, and information from the apparatus side for performing the exposure process on the substrate to be processed received from the apparatus side for performing the exposure process And a step of performing a heat treatment at a predetermined temperature based on the temperature and a step of transmitting temperature information of the heat treatment and / or information relating to the end time of the heat treatment to the apparatus side for applying the resist solution to the substrate to be processed. A substrate processing method.   Substrate processing for performing exposure processing on a substrate to be processed, which is configured to be substantially connectable to another substrate processing apparatus for supplying a resist solution to a substrate to be processed and / or supplying a developer to a substrate to be processed and processing the substrate. A device,
  A reduced pressure processing chamber for performing predetermined processing by irradiating the substrate to be processed under reduced pressure with an electron beam;
  A decompression transfer chamber provided in the decompression processing chamber and having a transport mechanism configured to be able to transport the substrate to be processed;
  An alignment mechanism that performs alignment with higher accuracy than alignment accuracy of a substrate to be processed positioned by the other substrate processing apparatus before the substrate to be processed is transferred to the transfer chamber and / or the decompression processing chamber A temperature setting mechanism for setting the temperature of the substrate to be processed after being transferred to or before being transferred to a temperature lower than the ambient temperature of the other substrate processing apparatus;
  A substrate processing apparatus comprising:   The substrate processing apparatus according to claim 27, wherein
  The alignment mechanism is provided in the decompression transfer chamber, and is provided in a spare chamber provided with a detection mechanism that detects position information of the substrate to be processed related to alignment of the substrate to be processed.
  The temperature setting mechanism includes the temperature of the substrate to be processed after being transferred to the decompression processing chamber or before being transferred, the atmospheric temperature of the other substrate processing apparatus, the atmospheric temperature of the processing chamber in which the coating processing is performed, and the processing for the development processing. Set at least one ambient temperature or lower than all ambient temperatures in the room
  Substrate processing equipment.   The substrate processing apparatus according to claim 27 or claim 28, wherein:
  A control mechanism for controlling the movement position of the substrate to be processed, which is transferred to the decompression processing chamber of the transfer mechanism, based on the detection information of the detection mechanism for each transfer of the substrate to be processed.
  A substrate processing apparatus further comprising:   A substrate processing apparatus according to any one of claims 27 to 29, wherein
  Magnetic shield disposed at least around the decompression chamber
  A substrate processing apparatus further comprising:   A substrate processing apparatus according to any one of claims 27 to 29, wherein
  Further comprising an electron beam irradiation mechanism disposed at an upper position of the vacuum processing chamber;
  The degree of vacuum increases toward the upper part of the electron beam path of the electron beam irradiation mechanism.
  Substrate processing equipment.   The substrate processing apparatus according to claim 28, wherein
  An arrangement portion of a storage body provided in the vicinity of the preliminary chamber and configured to be capable of storing a plurality of substrates to be processed.
  A substrate processing apparatus further comprising:   The substrate processing apparatus according to claim 32, comprising:
  The storage body of the arrangement unit can be carried in and out from a work area outside the apparatus.
  Substrate processing equipment.   A substrate processing apparatus according to any one of claims 27 to 29, wherein
  A space that is provided in the horizontal position in the decompression transfer chamber and is configured to be substantially evacuated in the decompression transfer chamber.
  A substrate processing apparatus further comprising:   The substrate processing apparatus according to claim 34, comprising:
  An exhaust path connected to the space and collectively decompresses the decompression transfer chamber together with the space by the exhaust mechanism.
  A substrate processing apparatus further comprising:   A substrate processing apparatus according to any one of claims 27 to 29, wherein
  The temperature setting of the substrate to be processed by the temperature setting mechanism is performed in a pressure atmosphere lower than the atmospheric pressure of the other substrate processing apparatus.
  Substrate processing equipment.   Substrate processing that exposes a substrate to be processed that is configured to be substantially connectable to another substrate processing apparatus that processes the substrate by supplying a resist solution to the substrate to be processed and / or supplying a developer to the substrate to be processed. A substrate processing method for processing a substrate to be processed in an apparatus,
  The substrate to be processed positioned by the other substrate processing apparatus is carried into or carried into the apparatus,
  For the loaded or loaded substrate to be processed, alignment with higher accuracy than the alignment accuracy positioned by the other substrate processing apparatus is performed,
  Thereafter, the substrate to be processed is subjected to exposure processing in a reduced pressure processing chamber.
  Substrate processing method.   38. The substrate processing method according to claim 37, further comprising:
  When the substrate to be processed is transferred to the decompression processing chamber, the movement position of the substrate to be processed is set above the mounting table on which the processing substrate is placed in the decompression processing chamber.
  Substrate processing method.   38. The substrate processing method according to claim 37, further comprising:
  The temperature of the substrate to be processed after being transferred to the decompression chamber or before being transferred is set to a temperature lower than the ambient temperature of the other substrate processing apparatus.
  Substrate processing method.   38. The substrate processing method according to claim 37, further comprising:
  The temperature of the substrate to be processed after being transferred to the decompression processing chamber or before being transferred is set to a temperature lower than the atmospheric temperature of the other substrate processing apparatus in a pressure atmosphere lower than the atmospheric pressure of the other substrate processing apparatus.
  Substrate processing method.   38. The substrate processing method according to claim 37, further comprising:
  The temperature of the substrate to be processed after being transferred to the decompression chamber or before being transferred is at least one of the atmospheric temperature of another substrate processing apparatus, the atmospheric temperature in the processing chamber for the coating treatment, and the atmospheric temperature in the processing chamber for the development processing. Set to one ambient temperature or lower than all ambient temperatures
  Substrate processing method.   38. The substrate processing method according to claim 37, further comprising:
  A magnetic shield is disposed at least around the decompression chamber.
  Substrate processing method.   38. The substrate processing method according to claim 37, further comprising:
  An electron beam irradiation mechanism is disposed at the upper position of the vacuum processing chamber,
  Set so that the degree of vacuum increases toward the upper part of the electron beam passage of the electron beam trading company mechanism.
  Substrate processing method.   38. The substrate processing method according to claim 37, further comprising:
  In order to obtain positional information of the substrate to be processed, image data at a plurality of peripheral portions of the substrate to be processed is collected after the alignment is performed and before the substrate to be processed is carried into the decompression processing chamber.
  Substrate processing method.   38. The substrate processing method according to claim 37, further comprising:
  Before performing the exposure processing, the two decompression chambers are configured to be openable and closable, and the two spaces communicating with each other are exhausted collectively.
  Substrate processing method.   The substrate processing method according to claim 45, further comprising:
  One space part of the two space parts is provided with a transport mechanism for transporting the substrate to be processed with respect to the decompression processing chamber, and holds and moves the substrate to be processed by the transport mechanism for positioning.
  Substrate processing method.   A substrate processing apparatus for processing a substrate to be processed,
  A plurality of flow mechanisms arranged in at least one side surface of the substrate processing apparatus, each configured with a linear space portion in which a flow of airflow is formed in a vertical direction;
  A gas supply mechanism for supplying a gas having at least a temperature or / and a humidity set to at least one of the plurality of flow mechanisms;
  A recovery mechanism for recovering a gas from at least one of the plurality of flow mechanisms;
  A substrate processing apparatus comprising:   The substrate processing apparatus according to claim 47, wherein
  A heating element of a control mechanism provided in at least one flow mechanism of the plurality of flow mechanisms and related to control in the apparatus
  A substrate processing apparatus further comprising:   A substrate processing apparatus according to claim 47 or claim 48, wherein:
  The gas flow direction of the flow mechanism supplied with the gas from the gas supply mechanism is opposite to the gas flow direction of the flow mechanism where the gas is recovered by the recovery mechanism.
  Substrate processing equipment.   A substrate processing apparatus according to claim 47 or claim 48, wherein:
  The gas flow direction of the flow mechanism supplied with gas from the gas supply mechanism is formed downward,
  The gas flow direction of the flow mechanism recovered by the recovery mechanism is formed upward.
  Substrate processing equipment.   A substrate processing apparatus according to claim 47 or claim 48, wherein:
  The supply port of the flow mechanism to which gas is supplied from the gas supply mechanism and the recovery port of the flow mechanism from which the gas is recovered by the recovery mechanism are arranged at the upper part of each flow mechanism.
  Substrate processing equipment.   52. The substrate processing apparatus according to claim 51, comprising:
  The lower position of each flow mechanism is configured so that gas can be supplied from the flow mechanism supplied with gas from the gas supply mechanism to the flow mechanism where gas is recovered by the recovery mechanism.
  Substrate processing equipment.   A substrate processing apparatus according to claim 47 or claim 48, wherein:
  A supply path that is provided at an upper portion of the plurality of flow mechanisms and supplies gas to the flow mechanism that is supplied with gas from the gas supply mechanism;
  A recovery path provided at an upper part of a plurality of flow mechanisms and recovering gas from a recovery port of a flow mechanism in which gas is recovered by the recovery mechanism;
  A substrate processing apparatus further comprising:   A substrate processing apparatus according to claim 47 or claim 48, wherein:
  A unit provided at the upper part of a plurality of flow mechanisms and configured to be connectable to another substrate processing apparatus for supplying a processing solution to a substrate to be processed and / or supplying a developing solution to the substrate to be processed. Supply path for supplying a gas whose temperature and humidity are adjusted to at least a part
  A substrate processing apparatus further comprising:   A substrate processing apparatus according to claim 47 or claim 48, wherein:
  The temperature of the gas is substantially the same as the temperature of the atmosphere in another substrate processing apparatus for supplying a resist solution to the substrate to be processed and / or supplying a developing solution to the substrate to be processed. Set to low temperature
  Substrate processing equipment.   A substrate processing apparatus according to claim 47 or claim 48, wherein:
  Magnetic shield arranged at an internal position from the arrangement position of the mechanism
  A substrate processing apparatus further comprising:   A substrate processing method for processing a substrate to be processed in a processing chamber,
  A gas is supplied to at least one opposing side surface that surrounds the periphery of the processing chamber so as to form a gas flow in which temperature or / and humidity is set in a predetermined vertical direction,
  A gas flow in which temperature or / and humidity is set in a direction opposite to a predetermined direction in the vertical direction is formed to collect the gas.
  Substrate processing method.   58. The substrate processing method according to claim 57, further comprising:
  The temperature of the gas is substantially the same as the ambient temperature in another substrate processing apparatus that supplies or processes a resist solution to the substrate to be processed and / or supplies a developer to the substrate to be processed, or the temperature thereof. Set to low temperature
  Substrate processing method.   58. The substrate processing method according to claim 57, further comprising:
  The supply port of the flow mechanism that is supplied with gas from the gas supply mechanism and the recovery port of the flow mechanism that recovers the gas by the recovery mechanism are disposed above each flow mechanism.
  Substrate processing method.   58. A substrate processing method according to claim 57, comprising:
  When supplying a gas to form a gas flow with a temperature or / and humidity set in a predetermined direction in the vertical direction, the gas is supplied from the top to the bottom,
  When a gas flow with temperature or / and humidity set in a direction opposite to the predetermined direction in the vertical direction is formed and gas is recovered, the gas is recovered from the lower part to the upper part.
  Substrate processing method.   58. The substrate processing method according to claim 57, further comprising:
  At least the temperature of a unit portion configured to be connectable to another substrate processing apparatus for processing by supplying a resist solution to the substrate to be processed and / or supplying a developer to the substrate to be processed at the upper part of the processing chamber And gas with adjusted humidity
  Substrate processing method.   The substrate processing method according to claim 61, further comprising:
  The temperature of the gas is set to a temperature substantially equal to or lower than the ambient temperature in the other substrate processing apparatus.
  Substrate processing method.