JP2006287149A - Heat sink device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce irregularity of a heat radiation effect and to improve cooling performance by improving adhesiveness with the upper surface of a heater since a heat sink device can be fixed, while a radiator keeps a parallel degree easily following the upper surface of the heater such as a CPU while freely moving with the pressing point of a pressing part of a fixing tool as a fulcrum. <P>SOLUTION: The heat sink device is provided with a heat reception integrated pump 5 and the fixing tool 1. The fixing tool 1 is provided with a pressing part 2 forming an applying point of pressing loading, a connection part 3 having the pressing part 2 arranged nearly in its center, and one or more supporting parts 4 which is connected with the outer periphery side of the connection part 3 and the other side of each which is connected with a substrate, a casing or a holding member. In order to make the pump 5 parallel to the upper surface of the CPU 6, the fixing tool 1 presses the center of the pump 5. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention uses a heating element such as a central processing unit (hereinafter referred to as a CPU) disposed inside an electronic device casing in a liquid cooling method using a heat sink provided with heat radiating fins or circulation of liquid refrigerant. The present invention relates to a heat radiating device including various kinds of heat radiators such as a heat receiving portion and a fixing tool that fixes and holds the heat radiating device on an upper surface of a heating element mounted on a substrate.

  Recently, the speed of data processing in computers has been very rapid, and the clock frequency of the CPU has become much larger than before.

  As a result, the amount of heat generated by the CPU increases, and not only the conventional method of dissipating heat by contacting the heat receiving surface of a heat sink such as a heat sink or heat radiating fin to the heat generating element, but also forcibly cooling the heat sink or radiating fin with a fan A method of cooling the heat dissipating part in a heat sink module thermally connected to the heat dissipating part using a heat pipe from the heat receiving part, and further forcibly circulating a liquid refrigerant having high thermal conductivity by a pump. Liquid cooling systems that transport heat to and dissipate heat are indispensable, and further improvements in cooling capacity and miniaturization are required in the future.

  Therefore, as a mechanism for attaching the above-described radiator to a substrate on which a heating element such as a CPU is mounted, a method using an attachment / fixing tool made of a spring material utilizing elastic force is known (for example, a patent) Reference 1).

  FIG. 10A is a perspective view of a fixing tool described in (Patent Document 1), and FIG. 10B is a cross-sectional view of the fixing tool described in (Patent Document 1).

  The fixing tool includes a first arm part 111A, a second arm part 111B, and a ring part 111C, and the first arm part 111A forms an acute angle with the reference plane X′-X ′ from one end of the ring part 111C. In other words, the ring portion 111C is bent so as to gradually move away from the central axis, and has a hook 112A at the tip thereof.

  Further, the first arm portion 111A has a tag 113A between a portion in contact with the ring portion and the tip, and the tag 113A extends at a predetermined angle with the first arm portion 111A.

  Further, the second arm portion 111B has substantially the same shape as the first arm portion 111A, is arranged symmetrically with the first arm portion 111A with respect to the central axis of the ring 111C, and is the same as the first arm portion 111A. 112B and tag 113B.

  And as shown in (B), the ring part 111C constitutes a curved surface whose section is convex downward.

  Further, the mounting is performed by placing the ring portion 111C of the fixing tool 111 on a CPU cooler (not shown) as a radiator and pressing the tags 113A and 113B toward the CPU socket (not shown).

  Then, the tips of the first arm portion 111A and the second arm portion 111B of the fixing tool 111 collide with the hooks of the CPU socket, respectively.

  Thereafter, when the fixing tool 111 is further pressed, the tips of the first arm portion 111A and the second arm portion 111B move outside the CPU socket along the inclination of the hook of the CPU socket, which is a holding member. During this movement, the tips of the first arm portion 111A and the second arm portion 111B are open with respect to the ring, so that they collide at an angle close to the horizontal along the inclination of the hook of the CPU socket, and the fixing tool 111 The force required for mounting the CPU cooler is small.

  When the hooks 112A and 112B reach the tips of the hooks of the CPU socket, the hooks 112A and 112B are hooked on the hooks of the CPU socket, respectively, and the tips of the first arm part 111A and the second arm part 111B again face inward. The CPU cooler can be fixed to the upper surface of the CPU.

On the other hand, as another prior art, although not shown, a metal clip that is locked to the side surface of a retention module that is a holding member of a heat sink that is a radiator and that uses the elastic force to press and fix the heat sink is used. A simple fixing method has also been proposed (see, for example, Patent Document 2).
Japanese Patent Application Laid-Open No. 11-305876 (page 6, FIG. 8) Japanese Patent Laying-Open No. 2004-71839 (page 10, FIG. 3)

  However, in the conventional heat radiating device as described above, as a result of the large contact between the upper surface of the radiator and the contact portion of the fixing tool, the pressing load applied by the fixing tool acts uniformly on the entire contact portion. Therefore, the radiator is fixed following the mounting position of the fixing tool.

  In other words, the radiator is fixed based on the mounting position of the fixing tool, and the fixing tool is locked to the side surface of the holding member such as the CPU socket or the retention module, so the position of the holding member becomes the reference. In addition, for example, the unevenness of the length of the two arms, the error of the hook, the error of the convex shape of the ring part, the mounting condition of the mounting member to the CPU socket or the retention module as the holding member, etc. When various error factors such as dimensional accuracy and work accuracy are included, the parallelism between the heat receiving surface of the heat sink such as CPU cooler or heat sink and the upper surface of the heat generating body such as CPU cannot be secured, and the heat receiving surface of the heat sink It becomes difficult to make it adhere to the upper surface of the heating element with high accuracy, resulting in variations in the cooling effect and lowering the cooling performance.

  In order to solve the above problems, the present invention is a heat dissipation device including a heat radiator that dissipates heat in contact with a heat generating element mounted on a substrate, and a fixing tool that fixes the heat radiator. The fixing tool has a heat receiving surface that comes into contact with the body, and includes a pressing portion that applies a pressing load to the radiator, a connecting portion in which the pressing portion is arranged at a substantially center, and an outer peripheral edge of the connecting portion, the other being a substrate And one or a plurality of support portions connected to the housing or the holding member, and the fixing tool presses the central portion of the radiator so that the radiator is parallel to the upper surface of the heating element. This is the main feature.

  According to the radiator fixing device of the present invention, the radiator can be easily fixed in a state where it follows the upper surface of a heating element such as a CPU, regardless of the mounting accuracy, dimensional accuracy, or skill level of the installation operator. Therefore, the adhesion with the heating element is improved, the variation in cooling effect is reduced, and the cooling performance is improved.

  The invention according to claim 1 is a heat radiating device including a heat radiator that radiates heat in contact with a heat generating element mounted on a substrate, and a fixing device that fixes the heat radiating element. The fixing tool includes a pressing portion that applies a pressing load to the radiator, a connecting portion in which the pressing portion is arranged at the center, and an outer peripheral edge of the connecting portion, the other being a substrate and a housing Or a support member connected to the holding member, and the fixing tool presses the central portion of the radiator so that the radiator is parallel to the upper surface of the heating element. Can be fixed while ensuring parallelism while following the top surface of a heating element such as a CPU. As a result, the adhesion to the top surface of the heating element is improved and the variation in cooling effect is reduced. To improve.

  The invention according to claim 2 is an invention dependent on the invention according to claim 1, and since the pressing portion is formed by a separate pressing member, a fixing device having a simple configuration is obtained and formed by a separate pressing member. It is possible to provide a heat dissipating device that is easy to manufacture for joining the pressing portion to the connecting portion by press-fitting, welding, or bonding, and that has a large cost merit.

  The invention according to claim 3 is an invention dependent on the invention according to claim 1, and since the pressing portion is formed of a separate elastic member, a fixing device having a simple structure can be obtained, and can be easily manufactured with great cost merit. Not only can the fixing tool be provided, but a large pressing load can be obtained on the radiator due to the elastic force of the pressing portion.

  The invention according to claim 4 is an invention dependent on the invention according to any one of claims 1 to 3, and since the shape of the pressing portion is spherical, conical, or polygonal pyramid, the pressing portion and heat dissipation The heat sink can easily follow the upper surface of a heating element such as a CPU while securing the parallelism with the pressing point, which is the contact point of the heater, as a fulcrum, and can be fixed with high accuracy.

  The invention according to claim 5 is an invention subordinate to the invention according to claim 1, and has four support portions, so that it can be connected to a substrate, a housing of an electronic device, or a holding member such as a CPU socket or a retention module. Not only becomes stronger, but a more stable pressing load can be secured to the radiator.

  The invention according to claim 6 is an invention subordinate to the invention according to claim 1 and is provided with an elastic generating portion that generates a pressing load on the radiator, so that the radiator can be pressed with a larger pressing load, and the size of the radiator is increased. A more stable pressing load can be secured according to the sheath weight.

  The invention according to claim 7 is an invention dependent on the invention according to claim 6, and since the elastic generating portion is a coil spring provided in a part of the support portion, the radiator is pressed with a predetermined excess weight in a more stable state. It is possible to control the pressing load according to the size and weight of the radiator, and it becomes easy to obtain a larger pressing load by increasing the number of support portions.

  The invention according to claim 8 is an invention dependent on the invention according to claim 6, and since the elastic generating portion is a coil spring provided between the pressing portion and the connecting portion, heat is radiated with a predetermined excess weight in a more stable state. In addition to being able to control the pressing load according to the size and weight of the radiator, the pressing load can be set by a single coil spring, so that the fixing tool can be simplified and its design is easy.

  The invention according to claim 9 is an invention dependent on the invention according to claim 7 or 8, and the pressing load is controlled by selecting the spring constant, so that the pressing load can be easily adjusted according to the size and weight of the radiator. Not only can it be controlled, but it is possible to deal with a wide variety of heatsinks only by changing the springs only by setting the springs, making it easy to share the fixture itself. Also effective in reducing the number of points.

  The invention described in claim 10 is an invention dependent on the invention described in claim 1 and is provided with a radiator restricting portion for preventing the position of the radiator from being displaced. When the position of the radiator is shifted beyond a predetermined range, the radiator restricting portion acts as a stopper, so that it is possible to prevent a large displacement of the radiator and impair the cooling effect.

  The invention described in claim 11 is an invention dependent on the invention described in claim 1, and is a heat dissipation device including a radiator that dissipates heat by contacting a heating element mounted on a substrate, and a fixing tool that fixes the radiator. The radiator has a heat receiving surface that contacts the heating element and a convex pressed part, and the fixing tool includes a connecting part that applies a pressing load to the convex pressed part, and an outer part of the connecting part. Convex pressed pressure of the radiator so that the radiator is parallel to the upper surface of the heating element, the other having one or more support parts connected to the periphery and connected to the substrate, housing, or holding member Since the fixing tool is pressed by the fixing tool, the upper surface of the heating element such as a CPU can be easily operated while the radiator moves more freely with the pressing point being the contact point between the connecting portion and the convex pressed portion as a fulcrum. Can be fixed while ensuring parallelism in the state of following, as a result, close contact with the upper surface of the heating element There is improved, to reduce the variation in the cooling effect to improve the cooling performance.

  The invention described in claim 12 is an invention dependent on the invention described in claim 11, and has four support portions, so that it can be connected to a substrate, a housing of an electronic device, or a holding member such as a CPU socket or a retention module. Not only becomes stronger, but a more stable pressing load can be secured to the radiator.

  The invention described in claim 13 is an invention dependent on the invention described in claim 11 and is provided with an elastic generating section that generates a pressing load on the radiator, so that the radiator can be pressed with a larger pressing load, and the size of the radiator is increased. A more stable pressing load can be secured according to the sheath weight.

  The invention described in claim 14 is an invention dependent on the invention described in claim 13, and since the elastic generating portion is a coil spring provided in a part of the support portion, the radiator is pressed with a predetermined excess weight in a more stable state. It is possible to control the pressing load according to the size and weight of the radiator, and it becomes easy to obtain a larger pressing load by increasing the number of support portions.

  The invention according to claim 15 is an invention dependent on the invention according to claim 14, and the pressing load is controlled by selecting the spring constant, so that the pressing load can be easily controlled according to the size and weight of the radiator. Not only that, it is possible to handle a wide variety of heatsinks only by changing the springs by simply setting the springs, and it is easy to share the fixtures themselves, which simplifies the manufacturing process and reduces the number of parts. Also effective for reduction.

  The invention described in claim 16 is an invention dependent on the invention described in claim 11, and is provided with a radiator restricting portion for preventing the positional deviation of the radiator. When the position of the radiator is shifted beyond a predetermined range, the radiator restricting portion acts as a stopper, so that it is possible to prevent a large displacement of the radiator and impair the cooling effect.

  Embodiments of the present invention will be described below with reference to the drawings.

Example 1
FIG. 1 is a perspective view from below of a fixing tool 1 according to a first embodiment of the present invention, and FIG. 2A is a front view of the fixing tool 1 provided with a spherically shaped pressing portion 2, and FIG. Fig. 3 is a bottom view of the fixing tool 1 provided with a spherically shaped pressing portion 2, Fig. 3 (a) is a front view of the fixing tool 1 provided with a conical pressing portion 2, and Fig. 3 (b) is a conical shape. FIG. 4A is a front view of the fixing tool 1 provided with the quadrangular pyramid-shaped pressing part 2, and FIG. 4B is a quadrangular pyramid-shaped pressing. FIG. 5A is a plan view showing a fixing state of the heat receiving integrated pump 5, and FIG. 5B is a front view showing the fixing state of the heat receiving integrated pump 5. 6 is a front view of the fixing tool 1 in which the coil spring 10 is provided on a part of the support portion 4, and FIG. 7 is a fixing tool 1 in which the coil spring 10 is provided between the pressing portion 2 and the connecting portion 3. It is a front view.

  First, as shown in FIG. 1, the fixing tool 1 is connected to a pressing portion 2 that applies a pressing load to a radiator (not shown), a connecting portion 3 in which the pressing portion 2 is disposed substantially at the center, and an outer peripheral edge of the connecting portion 3. The other has a substrate (not shown), a housing of an electronic device, or a support member 4 connected to a holding member such as a CPU socket or a retention module via a connection hole 4a. The fixing tool 1 is configured to press the central portion so as to be parallel to the upper surface.

  The fixing tool 1 is preferably made of metal, but other materials may be used as long as the material can maintain rigidity during holding and fixing. Further, the shape of the pressing portion 2 can be fixed while ensuring the parallelism by easily following the upper surface of a heating element such as a CPU while the radiator freely moves with the pressing portion 2 as a fulcrum. In the apparatus, the heat receiving surface of the radiator is improved in adhesion with the upper surface of a heating element such as a CPU, thereby reducing the variation in cooling effect and improving the cooling performance.

  The shape of the pressing portion 2 may be any shape as long as it is a shape that presses the central portion of the radiator so that it can move freely and follow the upper surface of a heating element such as a CPU. ) And (b) are preferable as shown in the front view and the bottom view of the fixing tool 1 in which the spherically shaped pressing portion 2 is provided at the approximate center of the connecting portion 3, for example, FIG. 3 (a). 4 (a) and 4 (b), and FIG. 4 (a) and FIG. 4 (b) show a conical pressing portion 2 as shown in FIG. Further, the pressing portion 2 having a quadrangular pyramid shape may be the one shown in the front view and the bottom view of the fixing tool 1 provided at substantially the center of the connecting portion 3, and such a spherical shape, a conical shape, or a polygonal pyramid shape. By doing so, the radiator moves more freely with the pressing point that is the contact point between the pressing part 2 and the radiator as a fulcrum. And easily follow the upper surface of the heating element such as a PU can be accurately secured while securing the parallelism.

  Further, by forming the pressing portion 2 with a separate pressing member, a fixing tool 1 having a simple configuration is obtained, and the pressing portion 2 formed with a separate pressing member is press-fitted, welded, Alternatively, it is possible to provide a heat dissipation device that is easy to manufacture for bonding by bonding or the like and has great cost merit.

  However, if rigidity and durability can be obtained with respect to the required pressing load, the pressing portion 2 and the connecting portion 3 are integrally formed by mechanical processing such as press processing or cutting processing or resin molding using a resin material. It doesn't matter.

  Moreover, although the connection part 3 and the support part 4 are formed by the bending process of a metal material, if rigidity and durability are similarly obtained with respect to a required pressing load, it will be connected by resin molding using a resin material, etc. The part 3 and the support part 4 may be formed integrally.

  Further, when the pressing portion 2 is a single elastic member such as a coil spring or a leaf spring, the fixing tool 1 having a simple configuration can be obtained, and the fixing tool 1 that can be easily manufactured and has great cost merit can be provided. Furthermore, since a large pressing load is obtained with respect to the radiator due to the elastic force of the pressing part 2, the variation in cooling effect is reduced and the cooling performance is improved.

  FIG. 5A is a plan view showing a fixed state of the heat receiving integrated pump 5 of the liquid cooling device as a radiator, and FIG. 5B is a front view showing a fixing state of the heat receiving integrated pump 5 of the liquid cooling device as a radiator. Thus, the heat receiving integrated pump 5 is positioned on the upper surface of the CPU 6 held by the CPU socket 7 as a holding member, and the heat receiving surface 5a of the heat receiving integrated pump 5 is in contact with the upper surface of the CPU 6.

  That is, in the heat radiating device including the heat receiving integrated pump 5 that contacts the CPU 6 mounted on the substrate 8 and radiates heat, and the fixing device 1 that fixes the heat receiving integrated pump 5, the heat receiving integrated pump 5 contacts the CPU 6. The fixing tool 1 has a heat receiving surface 5a, and is connected to a pressing portion 2 for applying a pressing load to the heat receiving integrated pump 5, a connecting portion 3 in which the pressing portion 2 is arranged substantially at the center, and an outer peripheral edge of the connecting portion 3. The other has four support portions 4 connected to the substrate 8, and the fixing tool 1 is configured to press the central portion of the heat receiving integrated pump 5 so that the heat receiving integrated pump 5 is parallel to the upper surface of the CPU 6. ing.

  Further, the fixing tool 1 is disposed on the upper part of the heat receiving integrated pump 5, and four support parts 4 are connected to the outer peripheral edge of the connecting part 3 of the fixing tool 1, and the other of the four support parts 4 is connected. Is fixed to the substrate 8 via the fixing screw 9 and the coil spring 10 that have passed through the connection hole 4a.

  Here, each of the four support portions 4 is pushed down by a predetermined overload by a coil spring 10 serving as an elastic generating portion that generates a pressing load on the heat receiving integrated pump 5. The tip of the portion 2 presses the central portion of the upper surface of the heat receiving integrated pump 5 with its predetermined pressing weight.

  In addition, since the pressing load can be set to a predetermined pressing load by selecting the spring constant of the coil spring 10, it is possible to select the pressing load by considering the size and weight of the heat receiving integrated pump 5 or the transportation vibration. The pressing load can be controlled.

  Further, the pressing unit 2 presses the central portion of the S region indicated by the broken line, which is the entire region of the upper surface of the heat receiving integrated pump 5, and the central portion serving as the pressing position is integrated with the upper surface of the CPU 6 and the heat receiving integrated unit. In the P region indicated by the broken line in FIG. 5A in which the contact region with the heat receiving surface 5a of the pump 5 extends in the vertical direction as indicated by the one-dot chain line with respect to the upper surface of the CPU 6, that is, in FIG. The P region indicated by the thick solid line on the upper surface of the heat receiving unit integrated pump 5 is preferable, and by pressing inside this P region, the heat receiving integrated pump 5 freely follows the upper surface of the CPU 6 with the pressing point as a fulcrum. Thus, the effect of close contact so as to be parallel is obtained, so that the adhesion is improved, the variation in cooling effect is reduced, and the cooling performance is improved.

  That is, since the radiator such as the heat receiving integrated pump 5 has an outer shape larger than the contact area with the upper surface of the heating element such as the CPU 6, the pressing portion 2 presses the central portion of the radiator.

  In this case, the support portion 4 of the fixing tool 1 is connected to the substrate 8 via a fixing screw 9 and a coil spring 10 that have passed through the connection hole 4a. Or a retention module that is a holding member of the heat sink.

  In addition, when the substrate is placed in the vertical direction and the radiator is likely to be displaced in the direction perpendicular to the pressing direction, or when the weight of the radiator is large and it is necessary to apply a sufficient pressing load, this embodiment Thus, it is desirable to provide the coil springs 10 in each of the plurality of support parts. For example, the coil springs 10 that are elastic generating parts may be provided in the vicinity of the connection part 3 of the support part 4 as shown in FIG.

  In addition, in the present embodiment, the coil spring 10 is provided as an elastic generating portion that generates a pressing load on the heat receiving integrated pump 5. However, if the coupling portion 3 and the support portion 4 of the fixing tool are metal materials, a part thereof It is also preferable to form an elasticity generating portion that is bent into a bent shape or a bent shape.

  On the other hand, when the substrate is placed horizontally and it is difficult for the radiator to be displaced, or when the weight of the radiator is small and a small pressing load is sufficient, one elastic generating portion as shown in FIG. Since the coil spring 10 may be provided between the pressing portion 2 and the connecting portion 3 and the pressing load can be set by one coil spring, the fixing tool 1 can be simplified and its design is easy.

  Further, in the heat dissipation device in this embodiment, the connection to the substrate, the housing of the electronic device, or the holding member such as the CPU socket or the retention module is further strengthened, and a more stable pressing load is secured to the radiator. Although four support portions are provided, one to three support portions 4 may be employed as long as a necessary pressing load can be secured and the fixing tool 1 has no problem in terms of strength and durability.

(Example 2)
FIG. 8 is a partially cutaway view of an electronic device showing a fixed state of the heat receiving integrated pump 5 according to the second embodiment of the present invention. A substrate 8 is fixed to the bottom surface 11a of the casing of the electronic device. The heat receiving integrated pump 5 is fixed in contact with the upper surface of the CPU 6 mounted on the surface of the CPU 8. The central portion of the heat receiving integrated pump 5 is connected to the upper surface 11 b of the housing by the fixing screw 9. The pressing portion 2 of the fixing tool 1 is pressed.

  In this case, since the mounting density of the peripheral area where the CPU 6 is mounted on the substrate 8 is high and an area where the support portion 4 of the fixing tool 1 can be connected cannot be secured, it faces the bottom surface 11a of the casing to which the substrate 8 is fixed. Although the fixing tool 1 is connected to the upper surface 11b of the housing, the pressing load necessary to fix and hold the heat receiving integrated pump 5 is obtained as in the case of the first embodiment.

  Further, since the radiator restricting portions 12 are provided at the respective peripheral portions in the four directions of the connecting portion 3, for example, the position of the heat receiving integrated pump 5 is shifted beyond a predetermined range with respect to the CPU 6 and the fixing tool 1 due to transportation vibration or the like. In such a case, since the radiator restricting portion 12 acts as a stopper, it is possible to prevent the displacement of the heat receiving integrated pump 5 and impair the cooling effect.

  Further, in this case, the radiator restricting portion 12 is provided at each of the peripheral portions in the four directions of the connecting portion 3. It doesn't matter.

  In the above description of the first and second embodiments, the case where the radiator of the heat radiating device is the heat receiving integrated pump 5 has been described. Of course, the present invention is not limited to this, and various other types such as a heat sink provided with heat radiating fins. It is possible to fix and hold the radiator.

(Example 3)
FIG. 9 is a front view showing a fixed state of the heat sink 13 provided with the convex pressed portion 13b according to the third embodiment of the present invention. The fixing tool 1 is in contact with the upper surface of the CPU 6 mounted on the substrate 8. A heat sink 13 for radiating heat is fixed, a plurality of heat radiating fins 13a are provided on the upper surface, and a convex pressed portion 13b having a spherical upper end is formed at the approximate center thereof.

  That is, using the fixing tool 1 that is placed on and fixed to the heat sink 13 that dissipates heat in contact with the CPU 6 mounted on the substrate 8, the pressed portion 13 b positioned at the center portion of the heat sink 13 is abbreviated as the connection portion 3. By pressing at the center, the heat sink 13 can easily follow the upper surface of the CPU 6 while freely moving with the pressing point as a fulcrum, so that it can be fixed while ensuring parallelism. As a result, the adhesion to the upper surface of the CPU 6 is improved. The cooling performance can be improved by reducing the variation in cooling effect.

  In addition, since the pressed portion 13b has the same heat radiation effect as the heat radiation fin 13a of the heat sink 13, the fixing method can be simplified without impairing the heat radiation performance. Therefore, the heat sink provided with the heat radiation fin 13a. It is easy to apply to 13 etc.

  Further, in this case, as a radiator regulating portion for preventing the displacement of the heat sink 13, for example, a circular groove is formed in a contact portion with the pressed portion 13b of the connecting portion 3 other than the one described above in the description of FIG. May be provided, or a circular opening may be provided, and any other form may be used as long as it is a radiator restricting part that can prevent the heat sink 13 from being displaced beyond a predetermined range with respect to the CPU 6 and the fixing tool 1. .

  In the above description of the third embodiment, the case where the radiator of the heat radiating device is the heat sink 13 provided with the heat radiating fins has been described. However, the present invention is not limited to this. It can be applied to various types of heat dissipation devices.

  The heat dissipating device of the present invention is a heat receiving unit or a heat receiving integrated pump used in a liquid cooling system utilizing circulation of liquid refrigerant as a heat radiator for cooling a heating element such as a CPU disposed inside a housing of an electronic device. Not only can it be applied to various types of heat dissipation devices such as a heatsink with heat dissipation fins used in combination with an air cooling system that uses a fan.

The perspective view from the downward direction of the fixing tool in Example 1 of this invention (A) is a front view of a fixing tool provided with a spherically shaped pressing part, (b) is a bottom view of the fixing tool provided with a spherically shaped pressing part. (A) is a front view of a fixing tool provided with a conical-shaped pressing part, (b) is a bottom view of the fixing tool provided with a conical-shaped pressing part. (A) is a front view of a fixing tool provided with a quadrangular pyramid-shaped pressing portion, and (b) is a bottom view of the fixing tool provided with a quadrangular pyramid-shaped pressing portion. (A) is a top view which shows the fixed state of a heat receiving integrated pump, (b) is a front view which shows the fixing state of a heat receiving integrated pump Front view of a fixing tool provided with a coil spring in a part of the support part Front view of a fixing tool provided with a coil spring between the pressing portion and the connecting portion The partially cutaway view of the electronic device which shows the fixed state of the heat receiving integrated pump in Example 2 of this invention The front view which shows the fixing state of the heat radiator which provided the convex to-be-pressed part in Example 3 of this invention. (A) is a perspective view of the fixing tool described in the prior art (Patent Document 1), and (b) is a sectional view of the fixing tool described in the prior art (Patent Document 1).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Fixing tool 2 Press part 3 Connection part 4 Support part 5 Heat receiving integrated pump 5a Heat receiving surface 6 CPU
7 CPU socket 8 Substrate 9 Fixing screw 10 Coil spring 11a Bottom surface of housing 11b Top surface of housing 12 Radiator restricting portion 13 Heat sink 13a Radiation fin 13b Pressed portion P Central portion of heat receiving integrated pump S Upper surface of heat receiving integrated pump

Claims (16)

A heat dissipating device comprising a heat dissipator that contacts and dissipates heat generated on a substrate, and a fixing tool that fixes the heat dissipator, the heat dissipator having a heat receiving surface that contacts the heat dissipator. The fixing tool includes a pressing portion that applies a pressing load to the radiator, a connecting portion in which the pressing portion is disposed substantially at the center, and an outer peripheral edge of the connecting portion, the other being the substrate and the housing Or one or a plurality of support portions connected to the holding member, and the fixing tool presses the central portion of the radiator so that the radiator is parallel to the upper surface of the heating element. A heat dissipation device characterized by that. The heat radiating device according to claim 1, wherein the pressing portion is formed of a separate pressing member. The heat radiating device according to claim 1, wherein the pressing portion is formed of a separate elastic member. The heat radiating device according to any one of claims 1 to 3, wherein the pressing portion has a spherical shape, a conical shape, or a polygonal pyramid shape. The heat radiating device according to claim 1, wherein the number of the support portions is four. The heat radiating device according to claim 1, further comprising an elastic generating portion that generates a pressing load on the heat radiator. The heat dissipation device according to claim 6, wherein the elasticity generating portion is a coil spring provided in a part of the support portion. The heat dissipation device according to claim 6, wherein the elasticity generating portion is a coil spring provided between the pressing portion and the connecting portion. The heat dissipating device according to claim 7 or 8, wherein the pressing load is controlled by selecting a spring constant. The heat radiating device according to claim 1, further comprising a heat radiating restricting portion for preventing a position shift of the heat radiating device. A heat dissipating device comprising a heat dissipator that contacts a heat generating element mounted on a substrate and dissipates heat, and a fixing tool that fixes the heat dissipator, wherein the heat dissipator has a heat receiving surface that contacts the heat generating element and a convex surface. The fixing tool includes a connecting portion that applies a pressing load to the convex pressed portion and an outer peripheral edge of the connecting portion, the other being the substrate, housing, or holding One or a plurality of support portions connected to the member, and the fixing tool presses the convex pressed portion of the radiator so that the radiator is parallel to the upper surface of the heating element. A heat radiating device characterized by comprising. The heat radiating device according to claim 11, wherein the number of the support portions is four. The heat dissipation device according to claim 11, further comprising an elastic generating portion that generates a pressing load on the heat radiator. The heat dissipation device according to claim 13, wherein the elasticity generating portion is a coil spring provided in a part of the support portion. The heat radiating device according to claim 14, wherein the pressing load is controlled by selecting a spring constant. The heat dissipation device according to claim 11, further comprising a radiator restricting portion that prevents a position shift of the radiator.

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