JP2006287092A - Inductance component and its manufacturing process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small and low profile inductance component exhibiting superior high-frequency characteristics, and to provide its manufacturing process. <P>SOLUTION: The inductance component comprises a coil 11, a through-hole portion 16 formed in the core portion of the coil 11, and a multilayer magnetic body layer 1 where the multilayer magnetic body layer 1 is arranged continuously to the inner wall of the through hole portion 16 and the upper and lower surfaces of the coil 11. The multilayer magnetic body layer 1 has a multilayer structure, consisting of a first metal layer 3, a first metal magnetic body layer 4, an intermediate layer 5, and a second metal magnetic body layer 6 where the first and second metal magnetic body layers 4 and 6 are constituted of a granular film comprising a magnetic phase and a metal oxide phase. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an inductance component used in, for example, a power circuit of an electronic device and a manufacturing method thereof.

  Conventionally, a power supply circuit of this type, for example, a power supply circuit used for a mobile phone is as shown in FIG. As shown in FIG. 5, the battery 101 uses a 4V battery as an input voltage, and this power supply circuit can obtain an output voltage of 2V as an output of the power supply circuit. Here, the coil 102 is called a choke coil, and a stable output voltage can be obtained by inserting this coil into a power supply circuit. Further, in order to further stabilize the output voltage, it is necessary to increase the inductance of the coil 102. As a result, the power supply circuit shown in FIG. 5 can supply a more direct-current stabilized output voltage.

  In general, in order to increase the inductance of the coil 102, it is necessary to increase the core cross-sectional area of the coil 102 and to increase the number of turns. As a result, the coil 102 has a large volume. It was. Furthermore, the switching frequency has been increased, and a power supply circuit used at several MHz has come out. Reduction of the core loss is demanded as the switching frequency is increased.

  Further, in response to the demand for a smaller and lower profile of electronic equipment, there is a demand for further reduction in the size and height of inductance components. For example, an inductance component having an installation area on a substrate of 5 mm × 5 mm or less and a thickness of 1 mm or less is required. There is a growing demand for inductance components with a large allowable current that can cope with the low voltage and large current of electronic devices.

In order to solve the problem, an inductance component as shown in FIG. 6 has been proposed. This inductance component has a configuration in which a coil 111 is sandwiched between multilayer magnetic films 112 in an insulating state, and through-hole portions 114 filled with a magnetic body 113 are arranged on the side surface and the center of the coil 111. Since the high conductivity material such as copper is formed in a plate shape, the coil 111 can be thinned (see, for example, Patent Document 1).
JP-A-9-223636

  However, since the through hole 114 is formed of the magnetic body 113 in the conventional configuration, the cross-sectional area of the magnetic body 113 is large. When a current is passed through the coil 111, a magnetic flux penetrating the through hole portion 114 in the vertical direction is generated, and an eddy current is generated in the horizontal plane of the magnetic body 113. However, since the cross-sectional area of the magnetic body 113 is large, this eddy current is increased, and as a result, the magnetic flux penetrating the through-hole portion 114 in the vertical direction is canceled. As a result, there is a problem that it is difficult to use in a high frequency band.

  SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object of the present invention is to provide an inductance component that has low eddy current loss and that has excellent high-frequency characteristics even when it is reduced in size and height, and a method for manufacturing the same.

  In order to solve the above-described conventional problems, the present invention provides a coil, a through hole portion formed in the core portion of the coil, and a multilayer magnetic layer arranged continuously on the inner wall of the through hole portion and the upper and lower surfaces of the coil. The multilayer magnetic layer has a laminated structure including a first metal layer, a first metal magnetic layer, an intermediate layer, and a second metal magnetic layer, and the first and second layers The magnetic metal layer is an inductance component composed of a granular film composed of a magnetic phase and a metal oxide phase.

  The inductance component and the manufacturing method thereof according to the present invention can reduce the cross-sectional area in the thickness direction of the magnetic phase by forming the magnetic phase formed on the inner wall of the through-hole portion of the coil as a multi-layer magnetic layer. By configuring the magnetic layer with a high-resistance granular film to achieve a multi-layered magnetic layer with low eddy current loss, it is possible to suppress eddy currents generated by magnetic flux passing through the center of the coil. Thus, it is possible to realize an inductance component having excellent high-frequency characteristics and a method for manufacturing the same even when the size and height are reduced.

(Embodiment 1)
Hereinafter, an inductance component and a manufacturing method thereof according to Embodiment 1 of the present invention will be described with reference to the drawings.

  1 is a perspective view of an inductance component according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view taken along a line AA in FIG. FIG. 3 is an enlarged cross-sectional view of the multilayer magnetic body layer 1 of the inductance component.

  1 to 3, the structure of the inductance component according to the first embodiment has a coil 11 disposed so as to be incorporated in the coil insulating portion 2, and the coil insulating portion 2 is short-circuited by the coil 11. Is to prevent. The coil 11 can be formed by patterning a high conductivity material such as copper or silver on the coil insulating portion 2 made of a resin film or the like by plating or the like. In addition, a thin planar coil pattern can be formed by sputtering or vapor deposition.

  The coil 11 is formed of a two-stage planar coil. The upper coil 11 is spirally wound from the terminal portion 10b on one side of the inductance component toward the core portion, and then at the center portion. It moves to the lower coil 11 via the through-hole electrode 15, and is formed so as to spread in a spiral shape toward the terminal portion 10a provided on the other side surface.

  The winding axis of the upper and lower coil patterns of the coil 11 must be in the same direction. As a result, a current flows from the upper stage to the lower stage of the coil 11 via the through-hole electrode 15 without canceling out the magnetic flux between the upper stage and the lower stage of the coil 11, and a large inductance value can be realized.

  Note that a thin planar coil having a larger inductance can be realized by sequentially laminating planar coil patterns having such a configuration.

  In addition to this, as another method for forming the coil 11, in order to realize a coil capable of handling a large current, after processing a copper wire or processing a thin metal plate, it is embedded in the coil insulating portion 2. It is also possible to form the coil 11. And although the thickness (cross-sectional area) of this coil 11 changes with electronic devices of the use used, in order to respond | correspond at least to a large electric current, the thickness of 10 micrometers or more is preferable.

  Next, a through hole 16 is provided in the core of the coil 11, and the multilayer magnetic material layer 1 is provided on the inner wall of the through hole 16. Further, the multilayer magnetic layer 1 is continuously provided on the upper and lower surfaces of the coil 11 in succession to the multilayer magnetic layer 1 provided in the through hole 16.

  Next, the configuration of the multilayer magnetic layer 1 will be described in detail with reference to FIG. This multilayer magnetic layer 1 is provided with a first metal layer 3 by electroless plating or the like on a coil insulating part 2 in which a planar coil is embedded, and a magnetic phase is formed on the first metal layer 3 by electrolytic plating or the like. A first metal magnetic layer 4 which is a granular film composed of 8 and a metal oxide phase 9 is formed. The first metal layer 3 is provided to facilitate the formation of the first metal magnetic layer 4 by the electrolytic plating method. A metal such as Cu having excellent conductivity is preferable, and a magnetic Fe film is also provided. It is more preferable to use Ni, Co from the viewpoint of magnetic characteristics. Accordingly, when a metal such as Cu that does not have magnetism is used, the first metal layer 3 is desirably thin.

  The granular film has a film structure in which, for example, a magnetic phase 8 and an insulating metal oxide phase 9 exist in a phase-separated state. In particular, the granular film structure here is a ferromagnetic metal phase. Represents a film structure that exists in a state where the particles are dispersed as fine particles in the insulator phase, or in a state where a ferromagnetic metal phase is encapsulated in the insulator phase. As the granular film having such a structure, a granular film represented by “Fe-MO” (M is one or more elements selected from Group 3A elements and Group 4A elements), “Co-MO”, (M is one or more elements selected from Group 3A elements, Group 4A elements and Group 5A elements), and the magnetic phase 8 included in the first metal magnetic layer 4 is particularly The magnetic phase 8 having a composition containing at least one of the group consisting of Fe, Ni, and Co is preferable from the viewpoint of magnetic flux density and magnetic loss.

  In particular, a high magnetic permeability can be realized by using a magnetic alloy 8 containing at least one of the group consisting of Fe, Ni, and Co, that is, a composition containing at least one of FeNi, FeCo, and FeNiCo. Therefore, an inductance component having a larger inductance can be obtained. Furthermore, when the average particle size of the magnetic phase 8 is 1000 Å or less, more preferably 500 Å or less, the first that can realize excellent magnetic properties (low coercive force; Hc <10 Oe, high magnetic permeability; μ> 500). Since the metal magnetic layer 4 can be formed, an inductance component having a larger inductance can be obtained.

  In addition, as the metal oxide phase 9 included in the first metal magnetic layer 4, the metal oxide includes at least one of the group consisting of Zn, Ce, Mn, Cu, Fe, Ni, and Co. By adopting the composition, these metal oxide phases 9 can be formed by plating, and can be collectively formed on the inner wall of the through-hole portion 16 and the upper and lower surfaces of the coil 11. From the viewpoint of this, it is preferable. In addition, it is possible to realize the first metal magnetic layer 4 having a large specific resistance of 100 μΩcm or more as the specific resistance value of the first metal magnetic layer 4. As a result, an inductance component having excellent high frequency characteristics can be realized.

  Next, the intermediate layer 5 is formed on the first metal magnetic layer 4 by electrolytic plating or electrodeposition. The intermediate layer 5 is provided so as to separate the first metal magnetic layer 4 and the second metal magnetic layer 6, and the specific resistance of the intermediate layer 5 is set to the first and second metal magnetic layers 4. , 6 can block eddy currents across the first metal magnetic layer 4 and the second metal magnetic layer 6. At that time, if the specific resistance value of the intermediate layer 5 is 500 μΩcm or more, the effect is particularly remarkable. Therefore, the intermediate layer 5 is preferably an organic resin material or an inorganic material such as a metal oxide or a metal-oxide composite material.

Here, in particular, when copper oxide is used as the intermediate layer 5, the intermediate layer 5 can be formed by a plating method, and the specific resistance of the intermediate layer 5 can be set to 500 μΩcm or more. Further, the second metal magnetic material layer 6 formed on the intermediate layer 5 is formed by the same plating method as the first metal magnetic material layer 4 by reducing the copper oxide as the intermediate layer 5. It can serve as a power feeding layer. As the copper oxide contained in the intermediate layer 5, Cu ₂ O is more desirable from the viewpoint of film forming speed and film quality uniformity.

  Furthermore, it is desirable that the thickness of the intermediate layer 5 is thin from the viewpoint of magnetic characteristics. For example, when a current of about 30 A is flowed by a choke coil, the thickness of the intermediate layer 5 is sufficient if it has a thickness of 1 μm. can do.

  Next, a second metal magnetic layer 6, which is a granular film composed of a magnetic phase 8 and a metal oxide phase 9, is formed on the intermediate layer 5 by electrolytic plating, and the configuration is the first metal magnetic layer. The same as 4. Here, the composition of the first and second metal magnetic layers 4 and 6 of the multilayer magnetic layer 1 is not necessarily the same, and as described above, at least of the group consisting of Fe, Ni and Co as the main component The effect is acquired by including one.

  Needless to say, the same effect can be obtained no matter how the multilayer magnetic layer 1 is laminated.

  In addition, based on a laminate of the intermediate layer 5 and the second metal magnetic layer 6, this laminate is laminated into two or more layers, thereby providing an inductance component having a larger inductance value and excellent high frequency characteristics. be able to.

  The operation of the inductance component having the above configuration will be described below.

  The coil 11 has a sufficiently long conductive path, and further has a two-stage structure and the winding axis direction also coincides. Therefore, when a current is passed through the coil 11, a strong magnetic flux can be obtained. The inductance of the inductance component can be increased. As a result, an inductance component having a sufficiently large inductance can be obtained even if the size and height are reduced.

  In addition, since the coil 11 has a quadrangular cross-section, the coil 11 having a high space factor is realized by increasing the cross-sectional area of the coil 11, and loss (copper) generated in the coil 11 is realized. Loss).

  When a current is passed through the coil 11, a magnetic flux is generated in the inductance component. This magnetic flux is generated in the in-plane directions of the inner wall of the through-hole portion 16 and the upper and lower surfaces of the coil 11 to generate eddy currents. However, in the inductance component of the present invention, the inner wall of the through-hole portion 16 and the upper and lower surfaces of the coil 11 are formed of the multilayer magnetic layer 1, and the multilayer magnetic layer 1 is composed of the first metal layer 3, the magnetic phase, and the like. A laminated structure of a first metal magnetic layer 4 made of a granular film made of a metal oxide phase, an intermediate layer 5, and a second metal magnetic layer 6 made of a granular film made of a magnetic phase and a metal oxide phase, By doing so, eddy currents generated in the thickness direction of the multilayer magnetic layer 1 can be suppressed, so that a small and low-profile inductance component having excellent high frequency characteristics can be realized.

  Further, the multilayer magnetic material layer 1 provided separately on the upper and lower surfaces of the coil 11 is connected via the multilayer magnetic material layer 1 provided on the inner wall of the through-hole portion 16, eliminating the magnetic gap and leaking magnetic flux. Therefore, an inductance component having a larger inductance value can be obtained.

  In FIG. 2, the gap between the through-hole portions 16 is filled with the insulating layer 7. However, it can be filled with a magnetic material, resin ferrite, or the like, and further improvement in magnetic properties can be expected.

  In addition, eddy current loss in a high-frequency region can be reduced by making slits and notches in a part of the upper and lower multilayer magnetic layers 1 or a part of the multilayer magnetic layer 1 provided on the inner wall of the through hole portion 16. Further suppression is possible, and higher frequency characteristics can be expected to be improved.

  Moreover, since the multilayer magnetic body layer 1 having such a configuration can be easily formed in a lump by a plating method, an inductance component having excellent productivity can be provided. For example, although it is difficult to form the multilayer magnetic layer 1 by sputtering, vapor deposition, or the like on the through hole portion 16 having a diameter of the through hole portion 1 of 1 mm or less and a depth of 0.1 mm or more, it is formed by a plating method. Thus, an inductance component that can be easily formed can be obtained.

  Needless to say, the coil 11 may be one stage or three stages or more instead of the two stages shown in FIG.

  Moreover, the insulating layer 7 should just coat | cover at least the surface layer of the multilayer magnetic body layer 1 from the role of ensuring insulation. This insulating layer 7 is for preventing short-circuiting when the inductance component is mounted on a mounting board or the like. The insulating layer 7 is preferably made of an organic resin material such as an epoxy resin, a silicon resin, an acrylic resin, or a mixture thereof. Furthermore, you may mix an inorganic filler in order to improve heat resistance and mechanical strength.

  With the above configuration, eddy currents generated in the thickness direction of the multilayer magnetic layer 1 can be suppressed, so that the inductance value can be increased and heat generation from the inductance component can also be suppressed. it can. By forming the coil 11 in a flat plate shape, a lower-inductance component can be realized, and an inductance component having a sufficiently large inductance value can be realized even if the height is reduced by making the coil 11 multistage. be able to.

  In addition, the coil 11 can be formed by plating using copper, silver or the like, and since the coil 11 has a quadrangular cross section, a low profile coil 11 having a high space factor can be obtained.

  In particular, since a fine electrode pattern can be formed on a plane by such a patterning technique, a low-profile inductance component can be realized as compared with the configuration of the first embodiment.

  Next, a method for manufacturing the inductance component will be described in detail.

  The manufacturing method of the inductance component having the above-described configuration can be manufactured through a manufacturing process shown in the manufacturing flowchart of FIG.

  First, as a first step A, a resist film is formed on one side of a substrate such as a polyimide film so as to form a lower coil pattern of the coil 11, and then a metal having high conductivity such as copper or silver is plated by a plating method. A lower coil pattern of the coil 11 is formed by plating so as to have a thickness of several tens of μm. Next, a resist film is provided again on the lower coil pattern of the formed coil 11, and a hole is formed by etching or the like at a position where the through-hole electrode 15 is to be formed. A resist film for forming the through-hole electrode 15 is formed on the other surface of the substrate, and a metal such as copper or silver is again formed by the plating method so as to have a thickness of several tens of μm. A through-hole electrode 15 is formed.

  Thereafter, a coil 11 embedded in the sheet-like coil insulating portion 2 shown in FIG. 2 can be manufactured by forming a protective film for insulating the coil 11.

  Next, as the second step B, after the sheet-like coil 11 is formed, the through-hole portion 16 is formed in the core portion of the coil 11 by punching, laser processing, etching, or the like.

  Next, as the third step C, the multilayer magnetic material layer 1 is formed continuously on the upper and lower surfaces of the coil insulating portion 2 and the inner wall of the through hole portion 16. For this purpose, a Ni layer having a thickness of 0.2 to 0.5 μm is formed on the coil insulating part 2 in which the planar coil is embedded by using electroless plating as the first metal layer 3.

  Next, a granular film composed of a magnetic phase 8 and a metal oxide phase 9 having a thickness of 20 μm is formed as a first metal magnetic layer 4 by electrolytic plating on the first metal layer 3 as a power feeding layer. In the plating bath used for forming the granular film, metal ions necessary for forming the magnetic phase 8 and metal ions necessary for forming the metal oxide phase 9 are mixed and dissolved. Furthermore, it is preferable to add a stress relaxation agent, a pit inhibitor, and a complexing agent as various additives for the plating bath. As this stress relaxation agent, saccharin is well known, and its effect can be exhibited by a substance containing a sulfonate. In addition, as a complexing agent, in order to stabilize various metal ions, organic and inorganic molecules such as amino acids, monocarboxylic acids, dicarboxylic acids, and tricarboxylic acids are included to form stable complexes with metal ions. be able to.

  Using such a plating bath, the pH in the vicinity of the deposited film is set to pH 3.5 or more at which a metal oxide is easily generated, and is −0.4 V (Ag) which is an electrolytic potential at which a metal such as Fe, Co, Ni is deposited. It is desirable to set a negative potential (using / AgCl as a reference potential). By performing potential electrolysis and constant current electrolysis under such conditions, both the magnetic phase 8 and the metal oxide phase 9 can be precipitated simultaneously from the solution, so that a granular film can be formed.

Next, the intermediate layer 5 is formed on the first metal magnetic layer 4 made of the granular film. As a method for forming the intermediate layer 5, it is preferable to use a solution method such as a wet electrodeposition method or a plating method. For example, the intermediate layer 5 can be formed by depositing copper oxide from a plating bath. By including the copper oxide in the intermediate layer 5, the second metal magnetic layer 6 can be made the same as the first metal magnetic layer 4 by devising a plating bath on the copper oxide. It becomes possible to manufacture by the electrolytic plating method, and the multilayer magnetic body layer 1 can be manufactured. As the copper oxide contained in the intermediate layer 5, Cu ₂ O is more preferable from the viewpoints of film forming speed and film quality uniformity.

  In order to secure the adhesion between the first metal magnetic layer 4 and the intermediate layer 5, a buffer layer is inserted between the layers, or the composition of the first metal magnetic layer 4 is devised. Adhesion can be ensured by devising various means such as introducing a treatment process on the surface of the metal magnetic layer 4.

  Next, the second metal magnetic layer 6 is formed, and can be formed by the same manufacturing method as the method for forming the first metal magnetic layer 4.

  Further, by repeating the film forming process for forming the laminated body of the intermediate layer 5 and the second metal magnetic layer 6, the multilayered magnetic layer 1 having a more multilayered structure can be manufactured. Large inductance components can be manufactured.

  Although the thickness per layer of the first and second metal magnetic layers 4 and 6 varies depending on the switching frequency, it is preferably 1 μm to 50 μm when several hundred kHz to several tens of MHz is assumed. The thickness per layer depends on the specific resistance value of the intermediate layer 5, but is preferably 0.01 to 5 μm.

Further, the higher the specific resistance value of the intermediate layer 5 is, the better. However, the ratio of the specific resistance values to the first and second metal magnetic layers 4 and 6 is more preferably 10 ³ or more.

  After that, when an inductance component is mounted on a mounting board or the like by forming an insulating protective film by coating an epoxy resin or the like on the surface of the multilayer magnetic layer 1 as an insulating layer 7 as necessary. It is possible to provide a method for manufacturing an inductance component that is not short-circuited.

  Next, through the first step to the third step, an individual inductance component can be obtained by performing singulation processing using a dicing method or an etching method.

  By realizing the manufacturing method as described above, the equipment can be manufactured by a relatively inexpensive plating apparatus. That is, the first metal layer 3 is formed by electroless plating, the first metal magnetic layer 4 which is a granular film is formed by electrolytic plating using the first metal layer 3 as a power feeding layer, and then copper oxide is formed. All the steps of the multilayer magnetic layer 1 are plated by forming the intermediate layer 5 containing electroplating by electroplating and further forming the second metal magnetic layer 6 by electroplating using the intermediate layer 5 as a power feeding layer. It is possible to form a film by a process. Furthermore, by using this plating method, the film forming speed can be increased, and the multilayer magnetic material layer 1 having a uniform film quality can be continuously formed on the inner wall of the through hole portion 16.

  As described above, according to the inductance component of the present invention and the manufacturing method thereof, the first and second metal magnetic layers 4 and 6 are formed of a high-resistance granular film while being inexpensive and excellent in mass productivity. As a result, the eddy current loss is reduced, so that it is possible to provide a small and low-profile type inductance component having excellent high-frequency characteristics and a method for manufacturing the same.

  As described above, the inductance component and the manufacturing method thereof according to the present invention can realize an inductance component that has excellent high-frequency characteristics and has a sufficient inductance even if it is reduced in size and height, and the manufacturing method thereof. This is useful for power supply circuits.

The perspective view of the inductance component in Embodiment 1 of this invention Cross section Expanded cross-sectional view of the same magnetic layer Manufacturing flowchart for explaining the manufacturing method Circuit diagram of conventional power supply circuit Sectional view of a conventional inductance component

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Multilayer magnetic body layer 2 Coil insulation part 3 1st metal layer 4 1st metal magnetic body layer 5 Intermediate layer 6 2nd metal magnetic body layer 7 Insulating layer 8 Magnetic phase 9 Metal oxide phase 10a Terminal part 10b Terminal Part 11 Coil 15 Through-hole electrode 16 Through-hole part

Claims (13)

A coil, a through hole formed in the core of the coil, and a multilayer magnetic body layer disposed continuously on the inner wall of the through hole and the upper and lower surfaces of the coil, the multilayer magnetic body layer being a first metal A laminated structure comprising a layer, a first metal magnetic layer, an intermediate layer, and a second metal magnetic layer, and the first and second metal magnetic layers are composed of a magnetic phase and a metal oxide phase. Inductance component with a granular film. The inductance component according to claim 1, wherein the multilayer magnetic body layer is a multilayer magnetic body layer in which a multilayer body including an intermediate layer and a second metal magnetic body layer is stacked in two or more layers. The inductance component according to claim 1, wherein the first metal layer is a metal layer containing at least one of Fe, Ni, and Co. The inductance component according to claim 1, wherein the magnetic phase of the granular film is a magnetic phase containing at least one of Fe, Ni, and Co. The inductance component according to claim 1, wherein the magnetic phase of the granular film is a magnetic phase made of an Fe-based alloy containing at least one of Fe, Ni, and Co. The inductance component according to claim 1, wherein the metal oxide phase of the granular film is a metal oxide phase containing at least one of Zn, Ce, Mn, Cu, Fe, Ni, and Co. The inductance component according to claim 1, wherein the specific resistance of the first and second metal magnetic layers is 100 μΩcm or more. The inductance component according to claim 1, wherein the outermost surface of the multilayer magnetic layer is covered with an insulating layer. A first step of forming a coil, a second step of forming a through-hole portion in the core of the coil, and a multilayer magnetic material layer so as to be continuously disposed on the inner wall of the through-hole portion and the upper and lower surfaces of the coil In the method of manufacturing an inductance component including at least a third step of forming a multilayer magnetic body layer, the step of forming the multilayer magnetic body layer includes a first metal layer, a first metal magnetic body layer, an intermediate layer, and a second layer. A method for manufacturing an inductance component, wherein a metal magnetic layer is formed and the first and second metal magnetic layers are formed of a granular film composed of a magnetic phase and a metal oxide phase. The inductance component manufacturing method according to claim 9, wherein, in the third step, a laminate of the intermediate layer and the second metal magnetic layer is formed on the first metal magnetic layer by laminating two or more layers. Method. The method for manufacturing an inductance component according to claim 9, wherein in the third step, the multilayer magnetic layer is formed by a plating method. The method for manufacturing an inductance component according to claim 9, wherein, in the third step, the first metal layer is formed by a plating method using a plating solution containing at least one of Fe, Ni, and Co. The method for manufacturing an inductance component according to claim 9, wherein in the third step, a granular film composed of a magnetic phase and a metal oxide phase is formed by a plating method.

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