JP2006286087A - Substrate tilt controller unit, substrate tilt control method, and substrate tilt control program - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate tilt control device, substrate tilt control method, and substrate tilt control program, which correct a warp of a substrate depending on a warp level without exchanging a member. <P>SOLUTION: A device has a turntable 1 on which disk substrates P1 and P2 are placed, a bonding section 2 for bonding the substrates P1 and P2 superimposed to each other, and an ultraviolet ray radiation section 3 for radiating ultraviolet rays. A contact portion 41 is provided on a susceptor 4 for sandwiching and bonding the substrates P1 and P2 between the susceptor and a bonding plate 21 provided in the bonding section 2 in an up and down movable manner. Tilt measuring sensors 51 and 52 for measuring warp levels of the substrates P1 and P2 are provided. A control device 6 is provided, which is for controlling current application to the contact portion 41 depending on measurement values of the tilt measuring sensors 51 and 52. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate tilt control device, a control method, and a control program for adjusting warpage of a substrate when a flat recording medium such as an optical disk is manufactured.

  Optical reading type disk-shaped recording media such as an optical disk and a magneto-optical disk are widely used in various standards such as a reproduction-only medium and a medium in which recorded information can be rewritten. Such a recording medium is manufactured by bonding a pair of substrates via an adhesive layer in order to protect the recording surface formed on the substrate or to realize high-density recording by multilayering the recording surface. There are many cases.

  Such a bonded disc is manufactured as follows, for example. That is, two polycarbonate substrates are injection-molded, and a metal film (recording film) for laser reflection is formed by sputtering in a sputtering chamber. Then, an ultraviolet curable adhesive is applied to the bonding surfaces of the two substrates, and the adhesive is spread by spin coating. Spin coating is to form a thin film (adhesive layer) with an adhesive on the substrate by applying an adhesive around the center of the substrate and then spinning the substrate at a high speed.

  The pair of substrates having the adhesive layer formed in this manner is inserted into a vacuum chamber, and the adhesive layers are bonded to each other in a vacuum. Further, the adhesive bonded is cured by bringing the substrates bonded together to atmospheric pressure from the vacuum chamber and irradiating the whole with ultraviolet rays. As a result, the two substrates are firmly bonded to complete the disc.

  By the way, the substrate bonded as described above is flat without warping (tilt) or distortion so that a spot is stably formed when a laser used for reading and writing information is irradiated on the disk. It is desirable that For example, if there is a tilt exceeding the allowable amount on the disc, there is a possibility that a predetermined position on the recording surface may not be reached accurately when a laser used for reading and writing information is irradiated on the disc. Therefore, in such an optical disc, it is important to eliminate the tilt in order to ensure stable quality of the product.

  There are various causes of such warpage, but for example, the adhesive applied by the above spin coating or the like tends to be thin on the center side and thick on the outer peripheral side, and this causes warping of the disk. There is a case. In order to cope with this, as described in Patent Document 1, when bonding substrates, a method of forcibly bending by vacuum suction so that the distance between the center sides of the pair of substrates is larger than the outer peripheral side. Has been proposed.

  Further, each of the pair of substrates has a warp, and this may reflect the warp of the disc after bonding. In order to cope with this, as described in Patent Document 2, there is a method in which a step is intentionally provided on the table on which the disk is placed at the time of bonding so that the warp is corrected in a desired direction. Proposed.

JP-A-11-203738 JP 2004-103050 A

  By the way, there is a specific amount of warpage given from the steps of molding, dye coating, film formation, etc., to the single substrate to be bonded as described above, and this tilt has a different value even after being overlapped with each other. For this reason, it is not possible to effectively correct individual warps simply by bending a predetermined portion or providing a fixed step. In view of this, it is conceivable to provide a removable step on the susceptor on which the substrate is placed at the time of bonding.

  For example, by providing a detachable frame-like contact portion at the center of the susceptor, it is possible to correct the center portion of the disk so that it rises (by giving a -tilt) by bonding. It is also possible to adjust the degree of correction by preparing frames of various heights and exchanging the frames according to the amount of warpage of the substrate in the previous process. However, in this method, it is necessary to determine the conditions again when the conditions of the previous process change, and when changing the amount of warp, it is necessary to stop the apparatus and replace the susceptor piece with a different height. Further, even when tilt correction is performed at the time of bonding, the disk tends to return to the original state in the process until curing by ultraviolet irradiation. For this reason, when the tact of the device becomes an uneasy point, the amount of warpage becomes unstable.

  The present invention has been proposed in order to solve the above-described problems of the prior art, and an object of the present invention is to perform correction according to the amount of warpage of the substrate without replacing the member. A substrate tilt control device, a substrate tilt control method, and a substrate tilt control program are provided.

  In order to achieve the above object, the invention of claim 1 has a pair of pressing portions for holding the substrate, and the tilt of the substrate is controlled by at least one of the pressing portions pressing the substrate. In the substrate tilt control device, the contact portion whose length in the thickness direction of the substrate is variable is provided at a position where at least one of the pressing portions can contact and separate from a part of the substrate.

  According to a fourth aspect of the present invention, there is provided a substrate tilt control method in which at least one of the pair of pressing portions presses the substrate and is sandwiched between the other pressing portions, whereby the substrate is controlled by the pressing portion. The contact portion that is provided on at least one of the pressing portions and has a variable length in the thickness direction of the substrate is in contact with a part of the substrate.

  In the inventions of claims 1 and 4 as described above, the warpage of the substrate when sandwiched by the pressing portion can be adjusted by changing the length of the contact portion in the thickness direction of the substrate. Therefore, it is possible to perform correction according to the amount of warpage of the substrate without replacing the member.

  According to a second aspect of the present invention, in the substrate tilt control device according to the first aspect, the abutting portion is a piezoelectric element, a storage means for storing a reference tilt value as a control target, and before or after pressing by the pressing portion. Measuring means for measuring the tilt value of the substrate, adjusting means for adjusting the energization to the contact portion based on the tilt value measured by the measuring means and the reference tilt value stored in the storage means; It is characterized by having.

  According to a fifth aspect of the present invention, the contact portion is a piezoelectric element whose energization can be controlled by a computer, and the computer includes input means, storage means, measurement means, and adjustment means, and the input means is a control target. The storage means stores the reference tilt value input by the input means, and the measurement means measures the tilt value of the substrate before or after being pressed by the pressing portion, The adjusting unit adjusts the energization to the piezoelectric element based on the tilt value measured by the measuring unit and the reference tilt value stored in the storage unit.

  According to a sixth aspect of the present invention, there is provided a substrate controlled by a computer, wherein the substrate tilt control device that controls the tilt of the substrate is controlled by at least one of the pair of pressing portions pressing the substrate and sandwiching between the other pressing portions. In the tilt control program, a contact portion whose length in the thickness direction of the substrate is variable is provided at a position where at least one of the pressing portions can be brought into contact with or separated from the substrate, and the contact portion is formed by the computer. A piezoelectric element capable of controlling energization, allowing the computer to input a reference tilt value as a control target, store the input reference tilt value, and measure the tilt value of the substrate pressed by the pressing unit, The energization to the piezoelectric element is adjusted based on the measured tilt value and the stored reference tilt value.

  In the inventions of claims 2, 5 and 6 as described above, since the amount of warpage of the substrate can be controlled using the piezoelectric element, the tilt value of the substrate is automatically set to an optimum value in a small required space. Can be adjusted.

  According to a third aspect of the present invention, in the substrate tilt control device according to the first or second aspect, at least one of the pressing portions is formed of a material that transmits light.

  In the invention of claim 3 as described above, since at least one of the pressing portions is formed of a material that transmits light, the light beam for curing the adhesive is irradiated while correcting the warp by clamping the substrate. Can do. Therefore, it is possible to correct the warp generated after the bonding at the time of curing.

  As described above, according to the present invention, there is provided a substrate tilt control device, a substrate tilt control method, and a substrate tilt control program capable of performing correction according to the amount of warpage of a substrate without replacing members. Can be provided.

[First Embodiment]
Next, embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.
[Device configuration]
First, an example of what constituted this invention as a bonding apparatus (henceforth this apparatus) is demonstrated with reference to FIG. The apparatus constitutes a part of a disk manufacturing apparatus. A substrate molding apparatus and a metal film forming apparatus disposed in an upstream process of the apparatus, and a mechanism for transferring a substrate between the apparatuses. Since any known technique can be applied to the above, the description thereof is omitted.

  That is, as shown in FIGS. 1-7, this apparatus irradiates the turntable 1 on which the board | substrates P1 and P2 for disks are mounted, the bonding part 2 which bonds the laminated | stacked board | substrates P1 and P2, and an ultraviolet-ray. An ultraviolet irradiation unit 3 and a control device 6 for controlling each unit are provided. The turntable 1 has a first loading position 11 for loading the substrate P1, a second loading position 12 for loading the substrate P2, a bonding position 13 corresponding to the bonding unit 2, and an irradiation position corresponding to the ultraviolet irradiation unit 3. 14. It has an unloading position 15 for unloading the completed disk D to the next process. Further, the turntable 1 is configured to intermittently rotate in accordance with each position as described above by a drive source (not shown).

  In the vicinity of the first loading position 11 and the second loading position 12, tilt measurement sensors 51 and 52 for measuring the warpage amounts of the substrates P1 and P2 before bonding are provided. The tilt measuring sensors 51 and 52 are generally optical sensors that detect the degree of warping based on the difference in distance according to the position of the plate surface, but are not limited to specific ones.

  As shown in FIG. 2, the bonding unit 2 includes a bonding plate 21 that is a pressing unit that presses the substrate P <b> 2 downward, a cylinder 22 that raises and lowers the bonding plate 21, and the periphery of the substrates P <b> 1 and P <b> 2 to be bonded. A vacuum chamber (not shown) is provided. The bonding plate 21 is a circular plate disposed on the upper part of the turntable 1 and includes a pair of pressing portions that sandwich and press the substrates P1 and P2 together with the susceptor 4 on which the substrates P1 and P2 are placed. It is composed.

  The cylinder 22 is configured such that the lower end of the suspended drive arm 22a is attached to the center of the upper surface of the bonding plate 21 and drives the bonding plate 21 up and down. The vacuum chamber has a container shape that covers the substrates P1 and P2 on the susceptor 4 and the bonding plate 21, and is provided so as to be moved up and down by a lifting mechanism (not shown). The vacuum chamber is connected to a vacuum source (not shown), and is configured to be able to evacuate the space around the substrates P1 and P2.

  As shown in FIGS. 3 and 4, the susceptor 4 is provided with a contact portion 41 at a position corresponding to the center hole of the placed substrates P <b> 1 and P <b> 2. The abutting portion 41 is a piezoelectric element such as a piezo that expands and contracts when energized. The contact portion 41 includes a cylindrical portion 42 that is inserted through the center holes of the substrates P1 and P2, and a ring-shaped flange portion 43 that is provided around the center portion and contacts the lower surface around the center hole of the substrate P1. Yes. When the current value applied to the contact portion 41 changes, the height of the flange portion 43 (the length in the thickness direction of the horizontal substrates P1 and P2) changes, and the mounting surface of the susceptor 4 and the substrate The distance between P1 and P2 is changed.

  For example, as shown in FIG. 3, the contact portion 41 in this embodiment is the same height as the placement surface of the susceptor 4 in the initial state, and when the applied current is turned on, as shown in FIG. It is designed such that the flange portion 43 extends to lift the central portion of the susceptor 4 and, when turned off, returns to the original state and the upper surface of the susceptor 4 becomes horizontal. Since the amount of elongation of the contact portion 41 can be controlled by the current value, the amount of warping when the substrates P1 and P2 are pressed and bonded together can be made variable. The contact portion 41 is connected to a control device 6 to be described later, and the control device 6 adjusts the current ON / OFF and the current value. Furthermore, the ultraviolet irradiation unit 3 includes a light source (not shown) that cures the adhesive by irradiation of ultraviolet rays to the substrates P1 and P2 after bonding.

  The contact part 41 and the tilt measurement sensors 51 and 52 as described above are connected to the control device 6 that controls energization to the contact part 41. As illustrated in the functional block diagram of FIG. 6, the control device 6 includes an input unit 61, a storage unit 62, and an adjustment unit 63. The input unit 61 is a means for the user to input a reference tilt value that is a correction target, such as a keyboard or a touch panel. The storage unit 62 is a unit such as a memory that stores the reference tilt value input from the input unit 61. The adjustment unit 63 is a unit that compares the measured values from the tilt measurement sensors 51 and 52 with the reference tilt value stored in the storage unit 62 and adjusts the energization amount to the contact unit 41.

  Various methods of adjustment by the adjustment unit 63 are conceivable. In the present embodiment, the adjustment unit 63 determines whether the energization is ON or OFF depending on whether the difference between the reference tilt value and the measurement value exceeds a threshold value set in the storage unit 62 or the like in advance. Based on the determination unit 63a, the difference between the reference tilt value and the measured value, the adjustment value calculation unit 63b that calculates the energization amount, and the adjustment instruction unit 63c that instructs the energization of the contact portion 41 with the calculated energization amount And have. The calculation of the energization amount by the adjustment value calculation unit 63b may be performed by changing the energization amount in proportion to the difference between the reference tilt value and the measurement value, or may be obtained by another function or empirical rule. The measurement values of the tilt measurement sensors 51 and 52 can be freely used. For example, a value (average value or the like) obtained by adopting a larger value or a smaller value, or performing a predetermined calculation on both of them. ) May be considered.

  The control device 6 can be realized by, for example, a dedicated electronic circuit or a computer that operates with a predetermined program. Therefore, a computer program for controlling the operation of the apparatus according to the procedure described below and a recording medium recording the computer program are also one aspect of the present invention. Further, the control device 6 also adjusts the rotation and speed of the turntable 1, the raising and lowering of the bonding plate 21 by the cylinder 22, the raising and lowering mechanism for raising and lowering the vacuum chamber, the operation timing of the vacuum source, the light emission amount and the light emission timing of the ultraviolet irradiation unit. However, description of the configuration for that purpose is omitted.

[Action]
A method of bonding the substrates P1 and P2 using the present apparatus as described above will be described with reference to the configuration diagrams of FIGS. 1 to 6 and the flowchart of FIG. First, the substrates P1 and P2 are loaded into the turntable 1 that rotates intermittently as follows. That is, as shown in FIG. 1, the turntable 1 starts from the first loading position 11 in a state where the substrate P1 on which the recording film is formed in the previous process and the adhesive is applied on the upper surface is placed on the susceptor 4. (Step 701). At this time, the amount of warpage of the substrate P1 is measured by the tilt measurement sensor 51 (step 702).

  In addition, the substrate P2 on which the recording film is formed and the adhesive is applied in the previous process is loaded onto the substrate P1 at the second loading position with the adhesive coating surface down (step 703). At this time, the amount of warpage of the substrate P2 is measured by the tilt measurement sensor 52 (step 704).

  The measured value is input to the control device 6, and the adjustment determining unit 63a determines whether energization is necessary based on the reference tilt value and the measured value stored in advance (step 705). When energization is necessary, the adjustment value calculation unit 63b calculates the energization amount (step 706), and the adjustment instruction unit 63c instructs energization to the contact portion 41 based on the calculated energization amount (step 706). Step 707). By this energization, as shown in FIGS. 3 and 4, the height of the flange portion 43 of the contact portion 41 changes (step 708). On the other hand, when energization is unnecessary (step 705), the height of the contact portion 41 is not changed (no energization), and the process proceeds to bonding.

  As shown in FIGS. 1 and 2, the substrates P <b> 1 and P <b> 2 stacked on the susceptor 4 move to the bonding unit 2 according to the rotation of the turntable 1. Then, the vacuum chamber is lowered to cover the substrates P1 and P2 on the susceptor 4 (step 709). After the vacuum chamber is evacuated by the vacuum source (step 710), as shown in FIG. 5, the cylinder 22 is driven, the bonding plate 21 is lowered, and the substrate P2 is pressed downward (step 711). ). Then, the substrates P1 and P2 are bonded in a warped state according to the height of the flange 43 (step 712). Since the height of the contact portion 41 is adjusted according to the amount of warpage that the substrates P1 and P2 have in advance, they are bonded together so as to correct the warpage.

  Next, the bonding plate 21 is raised (step 713), the atmosphere is introduced (step 714), and the vacuum chamber is raised, so that the bonded substrates P1 and P2 (hereinafter referred to as disk D) are brought into the atmosphere. It is released (step 715). When the turntable 1 rotates in this state, the disk D moves to the ultraviolet irradiation unit 3, and the ultraviolet light is irradiated from the light source, and the adhesive is cured (step 716). Then, the disk D moved to the unloading position 15 is unloaded together with the susceptor 4 to another process (step 717).

[effect]
According to the present embodiment as described above, when the substrate P1 and the substrate P2 are bonded together, the thickness of the contact portion 41 provided in the susceptor 4 is changed according to the amount of warpage measured in advance. Further, it is possible to correct the warp without exchanging parts, and it is possible to suppress the tilt within a desired range. In particular, by using a piezoelectric element for the contact portion 41, it is possible to perform automatic control while minimizing the required space of the member for correction.

[Second Embodiment]
[Constitution]
The present embodiment is an example in which the ultraviolet irradiation unit 3 in the first embodiment is configured as a substrate tilt control device. That is, as shown in FIG. 8, the ultraviolet irradiating unit 3 is provided with a pressing plate 31 for pressing the bonded disc D from above. The pressing plate 31 is provided so as to be movable up and down by a cylinder 32, and is formed of a material that can transmit ultraviolet rays (white arrows) from a light source, for example, quartz glass. Other configurations are the same as those in the first embodiment.

[Action]
A method of correcting the disk D by the present apparatus as described above will be described with reference to FIGS. The upstream and downstream processes of the ultraviolet irradiation unit 3 are the same as those in the first embodiment. Correction may or may not be performed at the time of bonding. That is, the disc D after being bonded in the bonding unit 2 is determined by the adjustment determination unit 63a whether or not energization is necessary. If necessary, the adjustment value calculation unit 63b calculates the energization amount and adjusts it. The instructing unit 63c instructs energization to the contact portion 41 based on the calculated energization amount. By this energization, the height of the flange portion 43 of the contact portion 41 changes. On the other hand, when energization is unnecessary, the height of the contact portion 41 is not changed.

  As in the first embodiment, the measurement value that is a criterion for determining whether or not energization is necessary may be the amount of warpage of the substrates P1 and P2 before bonding, or the bonding portion 2 or the like. A tilt measurement sensor may be provided on the disk D, and the warp amount of the disk D measured by this may be used. Then, the bonded disk D is carried into the ultraviolet irradiation unit 3 by the turntable 1. As shown in FIG. 9, the disk D is irradiated with ultraviolet rays from the light source, the cylinder 32 is driven, and the pressing plate 31 is lowered to press the disk D downward. Then, according to the height of the collar part 43, the disk D is bonded in a warped state. Since the height of the contact portion 41 is adjusted, the adhesive is cured by ultraviolet rays while being bonded so as to correct the warp of the disk D.

[effect]
According to the present embodiment as described above, even when the disk D is warped after being bonded, the adhesive can be cured while correcting the disk D, so that the disk can be tilted as desired. Can be controlled to a range. In particular, since the pressing plate 31 is made of a material that transmits ultraviolet rays, it does not hinder the curing.

[Other Embodiments]
The present invention is not limited to the embodiment as described above. In the above embodiment, the contact portion is arranged at the center of the susceptor so that the center side of the disk rises, so-called -tilt device is provided. For example, as shown in FIG. By disposing the contact portion in an annular shape on the outer periphery of the susceptor, a so-called + tilt device in which the outer peripheral side of the disk D is raised can be configured.

  Further, as the position of the tilt measurement sensor, it is only necessary to be able to measure the warpage amount of the substrates P1 and P2 and the warpage amount of the disk D. Therefore, the tilt measurement sensor may be arranged in the pre-process, the post-process, or the transport path. Further, feedback control for controlling the energization amount of the contact portion may be performed so that the warpage amount of the disc after bonding or ultraviolet curing is measured and this becomes the target warpage amount. The target reference tilt value does not necessarily have to be a horizontal value or a value close thereto, and may be a value that takes into account the curing shrinkage of the adhesive, the shrinkage of the label to be applied, and the like. The energization amount may not be calculated each time, but may be a setting in which a plurality of energization amounts registered in advance as defaults are selected according to the measured value.

  Further, the size, type, number, arrangement, and the like of the contact portion are not limited to those exemplified in the above embodiment. A plurality of arrangements (for example, both on the center portion side and the outer peripheral side) and adjusting the heights of each may be used to enable more precise adjustment. The member for providing the contact portion is not limited to the susceptor, and any member such as a fixed base, a turntable, or a conveyor may be used as long as the substrate can be placed thereon. The contact portion may be provided on the upper bonding plate or pressing plate side, or may be provided vertically. The pressing part that sandwiches the substrate and the disk may have a structure in which either one moves or a structure in which both move.

  In addition, the size, shape, material, number of recording layers, and the like of the disk to be manufactured according to the present invention are free, and are not limited to existing standards such as CD and DVD, but any standard that will be adopted in the future. It is applicable to. Furthermore, the present invention can be applied not only to an information recording disk but also to any substrate that is bonded using an adhesive. That is, the material and shape of the substrate and the type of adhesive are not limited to those exemplified in the above embodiment. For example, as a material of the substrate, resins such as acrylic and epoxy can be considered in addition to general polycarbonate, but the material is not limited thereto. Also, any material that can be used at present or in the future can be used as the adhesive. It is also possible to apply a material that is cured by irradiating a broad electromagnetic wave from the outside, such as a radiation curable resin, or by applying a temperature change, such as a thermosetting resin.

It is a top view which shows the simple structure of the apparatus which implement | achieves the 1st Embodiment of this invention. It is a perspective view which shows the state before bonding of the bonding part in embodiment of FIG. It is a longitudinal cross-sectional view which shows the state before electricity supply of the contact part in embodiment of FIG. It is a longitudinal cross-sectional view which shows the state after electricity supply of the contact part in embodiment of FIG. It is a longitudinal cross-sectional view which shows the bonding state of the bonding part in embodiment of FIG. It is a functional block diagram which shows the control apparatus in embodiment of FIG. It is a flowchart which shows the procedure of the process in embodiment of FIG. It is a longitudinal cross-sectional view which shows the state before the board | substrate press of the 2nd Embodiment of this invention. It is a longitudinal cross-sectional view which shows the state at the time of the board | substrate press in embodiment of FIG. It is a longitudinal cross-sectional view which shows the bonding part in other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Turntable 2 ... Bonding part 3 ... Ultraviolet irradiation part 4 ... Susceptor 6 ... Control apparatus 11 ... 1st throwing position 12 ... 2nd throwing position 13 ... Bonding position 14 ... Irradiation position 15 ... Unloading position 21 ... Laminating plates 22, 32 ... Cylinder 22a ... Driving arm 31 ... Holding plate 32 ... Cylinder 41 ... Abutting part 42 ... Cylindrical part 43 ... Gutter 51, 52 Tilt measurement sensor 61 ... Input part 62 ... Storage part 63a ... Adjustment judgment Unit 63b ... Adjustment value calculation unit 63c ... Adjustment instruction units P1, P2 ... Substrate D ... Disc

Claims (6)

In a substrate tilt control device that has a pair of pressing portions for holding a substrate and controls the tilt of the substrate by pressing at least one of the pressing portions on the substrate,
A substrate tilt control device, wherein a contact portion whose length in the thickness direction of the substrate is variable is provided at a position where at least one of the pressing portions can come into contact with or separate from a part of the substrate. The contact portion is a piezoelectric element;
Storage means for storing a reference tilt value as a control target;
Measuring means for measuring the tilt value of the substrate before or after being pressed by the pressing portion;
Adjusting means for adjusting energization to the contact portion based on the tilt value measured by the measuring means and the reference tilt value stored in the storage means;
The substrate tilt control apparatus according to claim 1, further comprising:   The substrate tilt control device according to claim 1, wherein at least one of the pressing portions is formed of a material that transmits light. In the substrate tilt control method for controlling the tilt of the substrate by at least one of the pair of pressing portions pressing the substrate and sandwiching between the other pressing portions,
When the substrate is sandwiched by the pressing portion, a contact portion provided on at least one of the pressing portions and having a variable length in the thickness direction of the substrate is in contact with a part of the substrate. Tilt control method. The contact portion is a piezoelectric element whose energization can be controlled by a computer,
The computer includes input means, storage means, measurement means, adjustment means,
The input means inputs a reference tilt value as a control target,
The storage means stores a reference tilt value input by the input means,
The measuring means measures the tilt value of the substrate before or after being pressed by the pressing portion;
5. The adjustment unit according to claim 4, wherein the adjustment unit adjusts energization to the piezoelectric element based on a tilt value measured by the measurement unit and a reference tilt value stored in the storage unit. Substrate tilt control method. In a substrate tilt control program in which a substrate tilt control device that controls the tilt of a substrate by at least one of a pair of pressing portions pressing the substrate and sandwiching between the other pressing portions is controlled by a computer.
A contact portion having a variable length in the thickness direction of the substrate is provided at a position that can be contacted and separated from a part of the substrate in at least one of the pressing portions,
The contact portion is a piezoelectric element whose energization can be controlled by the computer,
In the computer,
Enter the reference tilt value that is the control target,
Store the input reference tilt value,
The tilt value of the substrate pressed by the pressing unit is measured,
A substrate tilt control program for adjusting energization to the piezoelectric element based on a measured tilt value and a stored reference tilt value.

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