JP2006285380A - Contactless ic tag sheet, and method for manufacturing the same, and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To flatly and evenly load contactless IC tag sheets so that IC tag inlet parts thereof are not higher than other parts of the inlet parts, when a plurality of sheets of the IC tag sheets are loaded by overlapping them vertically, and so that the IC tag sheets do not effect on data signal communication performance, recording performance and durability of the inlets due to the curvatures and deformations in shape of antennas and IC chips mounted on the IC tag sheets. <P>SOLUTION: In each contactless IC tag sheet 18, where each IC tag inlet 1a with a single unit of an IC module, consisting of a flat small piece-like IC chip 2 having an antenna mounted thereon is attached and arranged on a single face or inner face of a support sheet 15 made by die-cut in a small piece shape, the IC tag inlets 1a are arranged respectively, at different positions that regularly shift in a one-dimensional or two-dimensional direction, in the region of the support sheet 15 formed by die-cutting in the small piece shape. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention is a non-contact type IC tag sheet equipped with an IC tag inlet 1a equipped with a non-contact type IC module capable of recording and reading information data on a support sheet such as paper, plastic film, sheet or label. The present invention also relates to a method of manufacturing a non-contact type IC tag sheet and a manufacturing apparatus thereof.

  In general, manufacturers / sellers can provide customers and consumers with information such as product names and product information, product manufacturing information, sales information, manufacturer / seller information, etc. In the case of providing information such as miss-winning information and campaign application information, various catalogs, information service sheets, information cards, etc. on which such information is posted and direct mail are distributed.

  In addition, as these service sheets and cards for providing information, information data is recorded as electronic data and can be read by a dedicated reading means, or a magnetic card or IC card, or an IC module (or IC chip, IC chip and antenna). Alternatively, an IC tag sheet mounted with an IC tag inlet mounted with an IC module in which a unit IC module including an IC chip and an antenna is mounted on a small piece support sheet may be issued.

  An IC doug sheet with the above IC module (or IC chip, hereinafter referred to as IC tag inlet) is used, for example, for product information providing services such as product name, product information, product manufacture / information, manufacture / seller information, etc. , Recorded and recorded by the manufacturer / seller on the IC chip memory for use in information provision services such as information about winning prizes during campaigns, campaign application information, etc., and issued and used for customers and consumers .

  Without using these IC tag sheets, the above product information and campaign information other than the product information can be displayed on a sheet surface of normal paper or the like by printing. In print display and design display on the surface, there are restrictions on seat space, and when customers apply for campaigns etc. using the information provision service sheet, the application ticket section of the sheet is cut out and the application ticket It takes time and effort to peel off the seal part, collect the application ticket, attach it to the application sheet mount, or mail the application ticket and the seal.

  In addition, if information other than product information such as prize information, gift ticket marks at the time of campaign, stickers, etc. is presented by printing on the information service sheet as currently, There is also a risk that troubles such as copying, counterfeiting, or unauthorized use of tickets and application stickers may occur, or the occurrence may be overlooked.

  In addition, for manufacturers and distributors that implement product sales campaigns, it takes time and effort to process application data submitted by a large number of customers, and the response after the data processing, as well as customer information data obtained through application, etc. However, there are also inconveniences that it is difficult to use them well.

Therefore, in recent years, in order to eliminate the above inconveniences, it is possible to write and record product information, information other than product information such as missed ticket information, application ticket marks, application stickers, etc. as electronic data on the information providing service sheet. A technique for attaching and mounting an IC tag inlet (IC module, IC chip with antenna) has been developed. For example, Japanese Patent Laid-Open No. 2001-19555
6, JP-A-2002-342728, JP-A-2003-11914, JP-A-2004-202894, and the like.

  However, if the IC module to be mounted on the sheet is a small size such as 2 mm square or less, for example, it is difficult to obtain a good mounting position accuracy to be attached to the article. There is a problem that the apparatus becomes very large and the mounting speed becomes slow.

  Therefore, an IC tag inlet in which a 1-unit non-contact IC module consisting of a small-sized IC chip of 2 mm square or less and an antenna is mounted on a small piece of substrate, information service sheet, card, label, etc. Technology has been developed that can be efficiently mounted with good accuracy for mounting on the surface of the small support sheet or the inner surface of the support sheet. Non-contact type IC tag sheets manufactured by mounting tag inlets (IC modules, IC chips with antennas) have come to be used as information providing service sheets, cards, labels, and the like.

Below, a conventionally well-known patent document is described.
JP 2001-195556 A JP 2002-342728 A JP 2003-11914 A JP 2004-202894 A

  However, the non-contact type IC tag sheet manufactured by mounting an IC tag inlet (IC module, IC chip with antenna) on the surface or inner surface of a small piece of support sheet is only the thickness of the portion where the IC tag inlet is mounted. As shown in the side view of FIG. 8A, the IC tag inlet I of the non-contact type IC tag sheet S is disposed at the same position of the non-contact type IC tag sheet S of the same size. Therefore, when a plurality of IC tag sheets S are stacked in the vertical direction, as shown in the side view of FIG. The IC tag inlet I IC chip or antenna mounted on the IC tag sheet S is planar or flat because the part rises higher than the other part (sheet end part), for example, has a bow shape. And or geometrically curved or deformed, affecting the data signal communication performance or recording performance and durability of the IC tag inlet I.

  Further, in order to absorb the thickness of the IC tag inlet mounting portion in the non-contact type IC tag sheet, a pad or the like is put around the IC tag inlet of the support sheet, or the cushion material is used to absorb the thickness of the IC chip. It is possible to make the thickness of the IC tag sheet uniform by putting in, but since it becomes a thick IC tag sheet as a whole, it is used as a sheet for information provision services, cards, labels, etc. There are aspects that are difficult to use.

The present invention relates to a non-contact type IC tag sheet manufactured by mounting an IC tag inlet (IC module, IC chip with antenna) on the surface or inner surface of a small support sheet, and the thickness of the portion where the IC tag inlet is mounted Even if the IC tag sheet swells and becomes thicker, the IC tag inlet portion of the stacked IC tag sheet does not rise higher than the other parts when stacked in a stacking direction. By enabling flat and even stacking, IC tag inlet data signal communication performance, recording performance, and durability without causing IC chips and antennas mounted on IC tag sheets to bend or deform in terms of surface or shape. The purpose is not to affect sex.

  The invention according to claim 1 of the present invention is an IC tag inlet in which one unit of an IC module composed of an IC chip 2 with a flat small piece of antenna is mounted on one side or the inner surface of a support sheet 15 cut into a small piece. In each non-contact type IC tag sheet 18 to which 1a is attached, the IC tag inlets 1a are arranged one by one at different positions that are regularly displaced in the region of the support sheet 15 that has been die-cut. Is a non-contact type IC tag sheet.

  According to a second aspect of the present invention, in the non-contact type IC tag sheet according to the first aspect, each of the IC tag inlets 1a arranged on the IC tag sheet 18 is provided on each of the IC tag sheets 18. It is a non-contact type IC tag sheet characterized by being arranged to overlap or be adjacent to different positions regularly displaced in a one-dimensional direction.

  The invention according to claim 3 of the present invention is the method of manufacturing a non-contact type IC tag sheet according to claim 1, wherein each of the IC tag inlets 1a arranged on each IC tag sheet 18 is an IC tag. The non-contact type IC tag sheet is characterized in that it is arranged to overlap or be adjacent to different positions regularly displaced in the two-dimensional direction of the sheet 18.

The invention according to claim 4 of the present invention is
An IC that intermittently feeds an IC module supply TAB tape 4 in which a plurality of units of one unit of IC modules composed of IC chips 2 with flat and small antennas are regularly arranged on the upper surface of the tape-like substrate 1. TAB tape feeding process for module supply;
The tape-like substrate 1 on which the 1-unit IC module at the tip of the TAB tape 4 is formed is suctioned and held horizontally on the lower surface thereof by the first horizontal suction holding plate 10 and horizontally moved by the first suction holding means 11. TAB tape tip horizontal movement process,
An IC tag that forms an IC tag inlet 1a with one unit of IC module by sequentially cutting the tape-like substrate 1 held horizontally by the first suction holding unit 11 for each unit of IC module by the cutting unit 12. An inlet forming step;
A unit of IC tag inlet 1a with an IC module that is cut and fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11 is suctioned horizontally from above by the second horizontal suction holding plate 13. IC tag inlet vertical movement process for holding and moving vertically;
At the IC tag inlet supply position on the continuous or single-wafer support sheet 15 where the adhesive is applied to the upper surface of the second horizontal suction holding plate 13 that is spaced apart and parallel to the lower surface, the second horizontal suction holding plate 13 is intermittently supplied. An IC tag inlet mounting step in which the IC tag inlets 1a sucked and held by the suction holding plate 13 are sequentially supplied one by one by the second suction holding means 14 and pressed or heated and pressed; and
Production of IC tag sheets for producing small IC tag sheets 18 each having a single IC tag inlet 1a by sequentially punching the support sheet 15 with the IC tag inlet 1a mounted thereon by a die cutting means 19 Including a process,
In the IC tag inlet mounting step, the IC tag inlets 1a are sequentially supplied to the IC tag inlet supply position on the continuous or single wafer support sheet 15 one by one at regular intervals, and are pressed or heated and mounted. Further, in the IC tag sheet manufacturing process, the support sheet 15 to which the IC tag inlet 1a is mounted is die-cut at different positions that are sequentially and regularly shifted by the die-cutting means 19, and differently shifted regularly. A manufacturing method of a non-contact type IC tag sheet, characterized in that each IC tag sheet 18 in a small piece shape, in which one IC tag inlet 1a is arranged at a position, is manufactured.

The invention according to claim 5 of the present invention is
An IC that intermittently feeds an IC module supply TAB tape 4 in which a plurality of units of one unit of IC modules composed of IC chips 2 with flat and small antennas are regularly arranged on the upper surface of the tape-like substrate 1. TAB tape feeding process for module supply;
The tape-like substrate 1 on which the 1-unit IC module at the tip of the TAB tape 4 is formed is suctioned and held horizontally on the lower surface thereof by the first horizontal suction holding plate 10 and horizontally moved by the first suction holding means 11. TAB tape tip horizontal movement process,
An IC tag that forms an IC tag inlet 1a with one unit of IC module by sequentially cutting the tape-like substrate 1 held horizontally by the first suction holding unit 11 for each unit of IC module by the cutting unit 12. An inlet forming step;
A unit of IC tag inlet 1a with an IC module that is cut and fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11 is suctioned horizontally from above by the second horizontal suction holding plate 13. IC tag inlet vertical movement process for holding and moving vertically;
At the IC tag inlet supply position on the continuous or single-wafer support sheet 15 where the adhesive is applied to the upper surface of the second horizontal suction holding plate 13 that is spaced apart and parallel to the lower surface, the second horizontal suction holding plate 13 is intermittently supplied. An IC tag inlet mounting step in which the IC tag inlets 1a sucked and held by the suction holding plate 13 are sequentially supplied one by one by the second suction holding means 14 and pressed or heated and pressed; and
Production of IC tag sheets for producing small IC tag sheets 18 each having a single IC tag inlet 1a by sequentially punching the support sheet 15 with the IC tag inlet 1a mounted thereon by a die cutting means 19 Including a process,
In the IC tag inlet mounting step, the IC tag inlet 1a is supplied to the IC tag inlet supply position on the continuous or single-wafer support sheet 15 at a different position which is regularly shifted one by one in order. In the IC tag sheet manufacturing process, the support sheet 15 to which the IC tag inlet 1a is mounted is die-cut sequentially at regular intervals by the die-cutting means 19 in the IC tag sheet manufacturing step, A method of manufacturing a non-contact type IC tag sheet, characterized in that each IC tag sheet 18 is manufactured in small pieces in which one IC tag inlet 1a is disposed at a different position.

The invention according to claim 6 of the present invention is
An IC that intermittently feeds an IC module supply TAB tape 4 in which a plurality of units of one unit of IC modules composed of IC chips 2 with flat and small antennas are regularly arranged on the upper surface of the tape-like substrate 1. TAB tape feeding process for module supply;
The tape-like substrate 1 on which the 1-unit IC module at the tip of the TAB tape 4 is formed is suctioned and held horizontally on the lower surface thereof by the first horizontal suction holding plate 10 and horizontally moved by the first suction holding means 11. TAB tape tip horizontal movement process,
An IC tag that forms an IC tag inlet 1a with one unit of IC module by sequentially cutting the tape-like substrate 1 held horizontally by the first suction holding unit 11 for each unit of IC module by the cutting unit 12. An inlet forming step;
A unit of IC tag inlet 1a with an IC module that is cut and fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11 is suctioned horizontally from above by the second horizontal suction holding plate 13. IC tag inlet vertical movement process for holding and moving vertically;
At the IC tag inlet supply position on the continuous or single-wafer support sheet 15 where the adhesive is applied to the upper surface of the second horizontal suction holding plate 13 that is spaced apart and parallel to the lower surface, the second horizontal suction holding plate 13 is intermittently supplied. An IC tag inlet mounting step in which the IC tag inlets 1a sucked and held by the suction holding plate 13 are sequentially supplied one by one by the second suction holding means 14 and pressed or heated and pressed; and
Another support sheet is superimposed on the support sheet 15 to which the IC tag inlet 1a is mounted, and is pressed or heated and pressed by the pressure bonding means 17 to bond the overlapped sheets to form a plurality of IC tag inlets 1a, etc. An overlapping support sheet manufacturing step for manufacturing the overlapping support sheet 15 sandwiched between the intervals;
An IC tag sheet producing step of producing the respective IC tag sheets 18 in the form of small pieces in which the IC tag inlets 1a are arranged one by one by sequentially punching the overlapping support sheet 15 by the die cutting means 19;
In the IC tag inlet mounting step, the IC tag inlets 1a are sequentially supplied to the IC tag inlet supply position on the continuous or single wafer support sheet 15 one by one at regular intervals, and are pressed or heated and mounted. Further, in the IC tag sheet manufacturing process, the support sheet 15 to which the IC tag inlet 1a is mounted is die-cut at different positions that are sequentially and regularly shifted by the die-cutting means 19, and differently shifted regularly. A manufacturing method of a non-contact type IC tag sheet, characterized in that each IC tag sheet 18 in a small piece shape, in which one IC tag inlet 1a is arranged at a position, is manufactured.

The invention according to claim 7 of the present invention is
An IC that intermittently feeds an IC module supply TAB tape 4 in which a plurality of units of one unit of IC modules composed of IC chips 2 with flat and small antennas are regularly arranged on the upper surface of the tape-like substrate 1. TAB tape feeding process for module supply;
The tape-like substrate 1 on which the 1-unit IC module at the tip of the TAB tape 4 is formed is suctioned and held horizontally on the lower surface thereof by the first horizontal suction holding plate 10 and horizontally moved by the first suction holding means 11. TAB tape tip horizontal movement process,
An IC tag that forms an IC tag inlet 1a with one unit of IC module by sequentially cutting the tape-like substrate 1 held horizontally by the first suction holding unit 11 for each unit of IC module by the cutting unit 12. An inlet forming step;
A unit of IC tag inlet 1a with an IC module that is cut and fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11 is suctioned horizontally from above by the second horizontal suction holding plate 13. IC tag inlet vertical movement process for holding and moving vertically;
At the IC tag inlet supply position on the continuous or single-wafer support sheet 15 where the adhesive is applied to the upper surface of the second horizontal suction holding plate 13 that is spaced apart and parallel to the lower surface, the second horizontal suction holding plate 13 is intermittently supplied. An IC tag inlet mounting step in which the IC tag inlets 1a sucked and held by the suction holding plate 13 are sequentially supplied one by one by the second suction holding means 14 and pressed or heated and pressed; and
Another support sheet is superimposed on the support sheet 15 to which the IC tag inlet 1a is mounted, and is pressed or heated and pressed by the pressure bonding means 17 to bond the overlapped sheets to form a plurality of IC tag inlets 1a, etc. An overlapping support sheet manufacturing step for manufacturing the overlapping support sheet 15 sandwiched between the intervals;
An IC tag sheet producing step of producing the respective IC tag sheets 18 in the form of small pieces in which the IC tag inlets 1a are arranged one by one by sequentially punching the overlapping support sheet 15 by the die cutting means 19;
In the IC tag inlet mounting step, the IC tag inlet 1a is supplied to the IC tag inlet supply position on the continuous or single-wafer support sheet 15 at a different position which is regularly shifted one by one in order. In the IC tag sheet manufacturing process, the support sheet 15 to which the IC tag inlet 1a is mounted is die-cut sequentially at regular intervals by the die-cutting means 19 in the IC tag sheet manufacturing step, A method of manufacturing a non-contact type IC tag sheet, characterized in that each IC tag sheet 18 is manufactured in small pieces in which one IC tag inlet 1a is disposed at a different position.

According to an eighth aspect of the present invention, in the non-contact type IC tag sheet manufacturing method according to the sixth or seventh aspect, the intermittently supplied continuous or single-wafer support sheet 15 is a second horizontal suction holding. A support sheet 15 in which an adhesive is applied to an upper surface that is spaced apart and parallel to the lower side of the plate 13, and a fold a (perforation) that can be folded in half along the supply direction is formed. In the IC tag inlet mounting step, the IC tag inlet 1a sucked and held by the second horizontal suction holding plate 13 is held at the second half suction holding plate 13 at the half-size-side IC tag inlet supply position on the support sheet 15. After supplying one sheet at a time by means 14 and mounting by pressing or heating and pressing, the support sheet 15 is folded in two via a fold a (perforation) and overlapped by the folding means 16. Adhesive means 17 Is a non-contact IC tag sheet manufacturing method, characterized by making a plurality of IC tag inlet 1a overlay support sheet 15 to sandwich the bonded between pressing or hot-pressing to overlay sheet Te.

  The invention according to claim 9 of the present invention is the method of manufacturing a non-contact type IC tag sheet according to any one of claims 4 to 8, wherein one IC tag is disposed on each IC tag sheet 18. A method of manufacturing a non-contact type IC tag sheet, wherein the inlets 1a are arranged so as to overlap or be adjacent to different positions regularly shifted in the one-dimensional direction of the IC tag sheet 18 respectively.

  The invention according to claim 10 of the present invention is the non-contact type IC tag sheet manufacturing method according to any one of claims 4 to 8, wherein one IC tag is disposed on each IC tag sheet 18. A method of manufacturing a non-contact type IC tag sheet, wherein the inlets 1a are arranged so as to overlap or be adjacent to different positions regularly shifted in the two-dimensional direction of the IC tag sheet 18 respectively.

  According to an eleventh aspect of the present invention, there is provided an IC in which a plurality of units of one unit of an IC module composed of IC chips 2 with flat and small pieces of antennas are regularly arranged on the upper surface of the tape-like substrate 1 at equal intervals. A first horizontal suction capable of moving horizontally by holding the lower surface of the tape-like substrate 1 on which the 1 unit IC module of the TAB tape 4 is formed while the module-feeding TAB tape 4 is intermittently fed. A first suction holding means 11 having a holding plate 10 and a tape-like substrate 1 held horizontally by the first suction holding means 11 are sequentially cut for each unit of IC module, and a unit of IC module is attached. Inlet forming cutting means 12 for forming the IC tag inlet 1a, and the tape-shaped base material 1 by the horizontal movement of the first suction holding means 11 after cutting. There is provided a second horizontal suction holding plate 13 that can hold the IC tag inlet 1a with one unit of IC module to be pulled out horizontally and hold it from above, and is parallel to the lower side of the second horizontal suction holding plate 13. The IC tag inlet sucked and held by the second horizontal suction holding plate 13 at the IC tag inlet supply position on the continuous or single-wafer support sheet 15 where the adhesive is applied to the upper surface facing and separated from each other and intermittently supplied. 1a is supplied one by one, and the second suction holding means 14 to be attached by pressing or heating and pressing, and the support sheet 15 to which the IC tag inlet 1a is attached are sequentially cut out so that one IC tag inlet 1a is provided. A non-contact type IC tag sheet manufacturing apparatus provided with die-cutting means 19 for producing each IC tag sheet 18 in the form of small pieces arranged one by one. The second horizontal suction is provided at the IC tag inlet supply position on the continuous or single-piece support sheet 15 where adhesive is applied to the upper surface of the second horizontal suction holding plate 13 that is spaced apart and parallel to the lower surface and intermittently supplied. The IC tag inlets 1a adsorbed and held by the holding plate 13 are sequentially supplied one by one at equal intervals and are attached by pressing or heating and pressing, and the die cutting means 19 is a support sheet on which the IC tag inlet 1a is attached. 15 are sequentially punched at different positions that are regularly displaced, and each IC tag sheet 18 in the form of small pieces in which one IC tag inlet 1a is arranged at different positions that are regularly displaced is produced. This is a feature of a non-contact type IC tag sheet manufacturing apparatus.

According to the twelfth aspect of the present invention, there is provided an IC in which a plurality of units of one unit of an IC module consisting of IC chips 2 with flat and small pieces of antennas are regularly arranged on the upper surface of the tape-like substrate 1 at equal intervals. A first horizontal suction capable of moving horizontally by holding the lower surface of the tape-like substrate 1 on which the 1 unit IC module of the TAB tape 4 is formed while the module-feeding TAB tape 4 is intermittently fed. A first suction holding means 11 having a holding plate 10 and a tape-like substrate 1 held horizontally by the first suction holding means 11 are sequentially cut for each unit of IC module, and a unit of IC module is attached. Inlet forming cutting means 12 for forming the IC tag inlet 1a, and the tape-shaped base material 1 by the horizontal movement of the first suction holding means 11 after cutting. There is provided a second horizontal suction holding plate 13 that can hold the IC tag inlet 1a with one unit of IC module to be pulled out horizontally and hold it from above, and is parallel to the lower side of the second horizontal suction holding plate 13. The IC tag inlet sucked and held by the second horizontal suction holding plate 13 at the IC tag inlet supply position on the continuous or single-wafer support sheet 15 where the adhesive is applied to the upper surface facing and separated from each other and intermittently supplied. 1a is supplied one by one, and the second suction holding means 14 to be attached by pressing or heating and pressing, and the support sheet 15 to which the IC tag inlet 1a is attached are sequentially cut out so that one IC tag inlet 1a is provided. A non-contact type IC tag sheet manufacturing apparatus provided with die-cutting means 19 for producing each IC tag sheet 18 in the form of small pieces arranged one by one. The second horizontal suction is provided at the IC tag inlet supply position on the continuous or single-piece support sheet 15 where adhesive is applied to the upper surface of the second horizontal suction holding plate 13 that is spaced apart and parallel to the lower surface and intermittently supplied. The IC tag inlets 1a adsorbed and held by the holding plate 13 are sequentially supplied one by one at different positions that are regularly shifted and are attached by pressing or heating and pressing, and the die cutting means 19 is connected to the IC tag. The support sheets 15 fitted with the inlets 1a are sequentially punched at equally spaced positions, and the IC tag sheets 18 in the form of small pieces in which the IC tag inlets 1a are arranged one by one at different positions that are regularly displaced. An apparatus for manufacturing a non-contact type IC tag sheet, which is characterized by being manufactured.

  According to the thirteenth aspect of the present invention, there is provided an IC in which a plurality of units of one unit of an IC module composed of IC chips 2 with flat and small pieces of antennas are regularly arranged on the upper surface of the tape-like substrate 1 at equal intervals. A first horizontal suction capable of moving horizontally by holding the lower surface of the tape-like substrate 1 on which the 1 unit IC module of the TAB tape 4 is formed while the module-feeding TAB tape 4 is intermittently fed. A first suction holding means 11 having a holding plate 10 and a tape-like substrate 1 held horizontally by the first suction holding means 11 are sequentially cut for each unit of IC module, and a unit of IC module is attached. Inlet forming cutting means 12 for forming the IC tag inlet 1a, and the tape-shaped base material 1 by the horizontal movement of the first suction holding means 11 after cutting. There is provided a second horizontal suction holding plate 13 that can hold the IC tag inlet 1a with one unit of IC module to be pulled out horizontally and hold it from above, and is parallel to the lower side of the second horizontal suction holding plate 13. The IC tag inlet sucked and held by the second horizontal suction holding plate 13 at the IC tag inlet supply position on the continuous or single-wafer support sheet 15 where the adhesive is applied to the upper surface facing and separated from each other and intermittently supplied. 1a is supplied one by one, and the second suction holding means 14 is mounted by pressing or heating and pressing, or the other supporting sheet is superimposed on the supporting sheet 15 to which the IC tag inlet 1a is mounted. The pressure bonding means 17 for producing the overlapping support sheet 15 having a plurality of IC tag inlets 1a sandwiched at equal intervals by bonding the overlapping sheets, and the overlapping Manufacturing of a non-contact type IC tag sheet comprising die cutting means 19 for sequentially punching the support sheet 15 and producing each IC tag sheet 18 in the form of small pieces in which one IC tag inlet 1a is arranged. The second suction holding means 14 is a continuous or single-piece support sheet 15 that is intermittently supplied by applying an adhesive to the upper surface of the second horizontal suction holding plate 13 that is spaced apart and parallel to the lower side. At the upper IC tag inlet supply position, the IC tag inlets 1a sucked and held by the second horizontal sucking and holding plate 13 are sequentially supplied one by one at equal intervals, and are attached by pressing or heating and pressing. The means 19 cuts the support sheet 15 to which the IC tag inlet 1a is attached in order at different positions that are regularly displaced, and the IC tag inlets 1a are arranged one by one at different positions that are regularly displaced. The non-contact type IC tag sheet manufacturing apparatus is characterized in that each IC tag sheet 18 in the form of a small piece is produced.

According to the fourteenth aspect of the present invention, there is provided an IC in which a plurality of units of one unit of an IC module consisting of IC chips 2 with flat and small pieces of antennas are regularly arranged on the upper surface of the tape-like substrate 1 at equal intervals. A first horizontal suction capable of moving horizontally by holding the lower surface of the tape-like substrate 1 on which the 1 unit IC module of the TAB tape 4 is formed while the module-feeding TAB tape 4 is intermittently fed. A first suction holding means 11 having a holding plate 10 and a tape-like substrate 1 held horizontally by the first suction holding means 11 are sequentially cut for each unit of IC module, and a unit of IC module is attached. Inlet forming cutting means 12 for forming the IC tag inlet 1a, and the tape-shaped base material 1 by the horizontal movement of the first suction holding means 11 after cutting. There is provided a second horizontal suction holding plate 13 that can hold the IC tag inlet 1a with one unit of IC module to be pulled out horizontally and hold it from above, and is parallel to the lower side of the second horizontal suction holding plate 13. The IC tag inlet sucked and held by the second horizontal suction holding plate 13 at the IC tag inlet supply position on the continuous or single-wafer support sheet 15 where the adhesive is applied to the upper surface facing and separated from each other and intermittently supplied. 1a is supplied one by one, and the second suction holding means 14 is mounted by pressing or heating and pressing, or the other supporting sheet is superimposed on the supporting sheet 15 to which the IC tag inlet 1a is mounted. The pressure bonding means 17 for producing the overlapping support sheet 15 having a plurality of IC tag inlets 1a sandwiched at equal intervals by bonding the overlapping sheets, and the overlapping Manufacturing of a non-contact type IC tag sheet comprising die cutting means 19 for sequentially punching the support sheet 15 and producing each IC tag sheet 18 in the form of small pieces in which one IC tag inlet 1a is arranged. The second suction holding means 14 is a continuous or single-piece support sheet 15 that is intermittently supplied by applying an adhesive to the upper surface of the second horizontal suction holding plate 13 that is spaced apart and parallel to the lower side. At the upper IC tag inlet supply position, the IC tag inlets 1a sucked and held by the second horizontal sucking and holding plate 13 are sequentially fed one by one at different positions that are regularly shifted and attached by pressing or heating and pressing. In addition, the die cutting means 19 sequentially punches the support sheet 15 on which the IC tag inlet 1a is mounted at equally spaced positions, and the IC tag inlets 1a one by one at different regularly displaced positions. It is a non-contact type IC tag sheet manufacturing apparatus characterized in that each IC tag sheet 18 in the form of a small piece is arranged.

  According to a fifteenth aspect of the present invention, in the non-contact type IC tag sheet manufacturing apparatus according to the thirteenth or fourteenth aspect, the continuous or single-wafer support sheet 15 that is intermittently supplied is a second horizontal suction holding. A support sheet 15 in which an adhesive is applied to an upper surface that is spaced apart and parallel to the lower side of the plate 13, and a perforation a that can be folded in half along the supply direction is formed on the support sheet 15. The IC tag inlets 1a sucked and held by the second horizontal suction holding plate 13 are sequentially supplied to the one half size side IC tag inlet supply position by the second suction holding means 14 one by one at regular intervals. After being mounted by pressing or heating and pressing, the support sheet 15 is folded in two by the folding means 16 through the perforation a, and overlapped by pressing or heating and pressing by the pressing and bonding means 17. Bonded between a non-contact IC apparatus for manufacturing a tag sheet, which comprises preparing a plurality of IC tag inlet 1a superimposition is sandwiched at regular intervals support sheet 15.

  The invention according to claim 16 of the present invention is the non-contact type IC tag sheet manufacturing apparatus according to any one of claims 11 to 15, wherein one IC tag is disposed on each IC tag sheet 18. The non-contact type IC tag sheet manufacturing apparatus is characterized in that the inlets 1a are arranged so as to overlap or be adjacent to different positions regularly shifted in the one-dimensional direction of the IC tag sheet 18 respectively.

  The invention according to claim 17 of the present invention is the non-contact type IC tag sheet manufacturing apparatus according to any one of claims 11 to 15, wherein one IC tag is disposed on each IC tag sheet 18. The non-contact type IC tag sheet manufacturing apparatus is characterized in that the inlets 1a are arranged so as to overlap or be adjacent to different positions regularly shifted in the two-dimensional direction of the IC tag sheet 18 respectively.

  According to an eighteenth aspect of the present invention, in the non-contact type IC tag sheet manufacturing apparatus according to any one of the eleventh to seventeenth aspects, the die cutting means for producing the small piece IC tag sheet 18. The recording data reading means 22 for reading each recording data recorded in the IC tag inlet 1a, and the printing means 23 for outputting and printing each identification symbol corresponding to each of the read recording data, at the front stage or the rear stage of 19 And an individual sheet determining means 24 for reading each printed identification symbol as an image and performing a process of associating or matching each IC tag inlet 1a with each identification symbol. It is a manufacturing apparatus of a type | formula IC tag sheet.

  According to a nineteenth aspect of the present invention, in the non-contact type IC tag sheet manufacturing apparatus according to any one of the eleventh to eighteenth aspects, the continuous or single-wafer support sheet 15 is a paper such as thin paper or cardboard. An apparatus for producing a non-contact type IC tag sheet, which is a sheet made of plastic or a sheet made of plastic.

  The invention according to claim 20 of the present invention is the non-contact type IC tag sheet manufacturing apparatus according to any one of claims 11 to 19, wherein the IC module performs intermittent feeding before the first suction holding means 11. An inspection means 4a for inspecting an IC module for each unit is provided above the supply TAB tape 4, and an IC module discharge section 9 is provided at the subsequent stage of the first suction holding means 11, which is a non-contact type This is an IC tag sheet manufacturing apparatus.

  According to the non-contact type IC tag sheet of the present invention and the manufacturing method and apparatus thereof, after mounting a plurality of non-contact type IC tag inlets 1a on the support sheet 15 at equal intervals, The support sheet 15 is folded in two from another IC sheet inlet 1a via another support sheet 15 or a fold line a (perforation), and the overlap sheets are bonded together to form a plurality of non-contact types. The non-contact type IC tag sheet is obtained by punching out the overlapping support sheet 15 produced by sandwiching the IC tag inlets 1a at equal intervals into different pieces which are sequentially shifted by the punching means 19 in order. 18, one non-contact type IC tag inlet 1 a is not provided at different positions on the sheet surface or the inner surface of each of the non-contact type IC tag sheets 18 that have been die-cut. In which the non-contact IC tag sheet 18 disposed can be obtained.

  As a result, the IC tag inlets 1a of the non-contact type IC tag sheets 18 are arranged at different positions that are regularly shifted on the surface or inner surface of the sheet, for example, in the one-dimensional direction or the two-dimensional direction of the IC tag sheet 18, respectively. , Placed at different positions that are regularly offset and overlap or adjacent.

  For this purpose, the non-contact type IC tag sheet has an IC tag inlet 1a (IC module, IC chip with antenna) having a predetermined thickness mounted on the surface or inner surface of the sheet, and a portion where the IC tag inlet 1a is mounted. The IC tag inlet 1a of each non-contact type IC tag sheet 18 is a sheet when a plurality of non-contact type IC tag sheets are aligned and stacked and stacked. To be arranged at different positions regularly displaced on the surface or the inner surface, for example, overlapping or adjacent to different positions regularly displaced in the one-dimensional direction or two-dimensional direction of the IC tag sheet 18 respectively. The IC tag inlet 1a portion of the loaded IC tag sheet can be stacked flatly and uniformly without being raised higher than other portions. IC chip and antenna mounted on the IC tag sheet for does not cause surface or geometrically curved or deformed, it is possible to avoid adverse effects on the performance and durability of the IC tag inlet 1a.

  The embodiment of the non-contact type IC tag sheet of the present invention will be described in detail below. FIG. 1A is a schematic side view in which a plurality of non-contact type IC tag sheets 18 are stacked and stacked flatly. FIG. 1B is a plan view thereof, and each of a plurality of non-contact type IC tag sheets S is a flat piece IC with an antenna on one side or the inner surface of a support sheet 15 die-cut. An IC tag inlet 1a on which an IC module of one unit composed of a chip 2 is mounted is attached and arranged.

  In each non-contact type IC tag sheet 18 according to the present invention, as shown in FIGS. 1A to 1B, a plurality of the non-contact type IC tag sheets 18 are flattened with their ends aligned. When stacked and stacked, the IC tag inlets 1a arranged one by one on the non-contact type IC tag sheet 18 are arranged at different positions that are regularly shifted in the region of the support sheet 15 that has been die-cut. It is what has been.

  Each of the IC tag inlets 1a arranged on each IC tag sheet 18 is, for example, as shown in FIG. 1B, at different positions that are regularly shifted in the X direction of the one-dimensional direction of each IC tag sheet 18. They are arranged so as to overlap each other or arranged adjacent to each other at a predetermined interval.

  In addition, the IC tag inlets 1a arranged on the IC tag sheets 18 according to the present invention are respectively arranged in the two-dimensional X direction and Y direction of the IC tag sheet 18 as shown in FIG. They are arranged so as to overlap each other at different positions, or arranged adjacent to each other at a predetermined interval.

  The support sheet 15 used for the non-contact type IC tag sheet 18 may be a paper sheet such as thin paper or thick paper, or may be a plastic sheet or a resin film.

  About the manufacturing method and manufacturing apparatus of the non-contact type IC tag sheet of the present invention, the embodiment will be described below based on the whole plan view of the manufacturing apparatus shown in FIG. 2 and the perspective view of the manufacturing apparatus shown in FIGS. Will be described in detail.

  The IC tag sheet manufacturing apparatus according to the present invention has a unit IC module comprising an IC chip 2 with antennas that is regularly flat and small on the upper surface of a tape-like substrate 1 as shown in the overall plan view of FIG. The IC module supply TAB tape in which a plurality of units are arranged at equal intervals is unwound, and the tape-like substrate 1 is sequentially cut for each unit of IC module at the tip of the tape, and one unit of IC module is mounted. IC tag inlet supply part A for supplying sheet-like IC tag inlets 1a one by one, and support sheet 15 for mounting the IC tag inlets 1a supplied from the IC tag inlet supply part A one by one (later information Supplying non-contact type IC tag sheet equipped with IC tag inlet 1a used as a service service sheet, card, label, etc.) That a support sheet feeding unit B.

  Further, in the subsequent stage of the support sheet supply unit B, as shown in FIGS. 3 and 4, the other support sheet 15 is supplied and superposed on the support sheet 15 supplied by the supply unit B. As shown in FIG. 5 and FIG. 6, the support sheet 15 supplied by the supply unit B is folded at a folding portion (perforation). ) And an overlapped support sheet preparation part C and an overlapped support sheet adhesion part D, which are folded in two along the line, as necessary.

Further, in the subsequent stage of the support sheet supply part B or the subsequent stage of the sheet adhering part D, the support sheet 15 to which the IC tag inlet 1a is attached is die-cut at different positions which are sequentially shifted regularly. There are provided sheet die-cutting portions E for producing the respective IC tag sheets 18 in small pieces in which one IC tag inlet 1a is arranged at a different position.

  Further, a recording data reading unit F, a printing unit G, a sheet individual determination unit H, and a sheet carry-out unit I are arranged in this order in the subsequent stage of the sheet die-cutting unit E.

  The IC tag inlet supply part A of the IC tag sheet manufacturing apparatus of the present invention includes a feeding means 5 for intermittently feeding the IC module supply TAB tape 4 as shown in the perspective views of FIGS. 5 includes a pair of infeed nip rolls and an outfeed nip roll that operate intermittently, and one unit of flat chip-like IC chip 2 with an antenna is used as one unit of IC module. The IC module supply TAB tape 4 regularly arranged at equal intervals on the upper surface of the tape-shaped substrate 1 is intermittently fed horizontally for each unit of IC module.

  A horizontal guide plate 6 (base) for guiding the IC module supply TAB tape 4 in the horizontal direction is provided at the rear stage of the outfeed nip roll 5, and the tip of the horizontal guide plate 6 is provided at the rear stage of the horizontal guide plate 6. There is provided a first suction holding means 11 provided with a first horizontal suction holding plate 10 that reciprocates from the portion to the position of the broken line in the horizontal arrow direction.

  The first horizontal suction holding plate 10 of the first suction holding means 11 is provided with a suction holding portion 10a formed of an air suction hole on the upper surface portion, and is guided by the feeding guide plate 6 by the air suction operation of the suction holding portion 10a. A unit IC module consisting of the tape-like substrate 1 at the tip of the TAB tape 4 supplied and the IC chip 2 with an antenna for one unit is placed horizontally on the lower surface together with the tape-like substrate 1. Hold by adsorption.

  Above the first horizontal suction holding plate 10 is provided with a cutting means 12 having a cutting blade portion 12a that repeatedly moves in the vertical direction, with respect to the rear edge of the first horizontal suction holding plate 10 An IC module for one unit at the tip of the TAB tape 4 held horizontally by the first horizontal suction holding plate 10 while sliding from above is cut together with the tape-like substrate 1 to which the IC module is attached. Then, a sheet-like IC tag inlet with one unit of IC module is sequentially produced one by one.

  The first horizontal suction holding plate 10 is fed out while sucking and holding the sheet-like IC tag inlet 1a with an IC module cut from the front end of the TAB tape 4, and moves forward to the position of the broken line in the horizontal arrow direction. Stop temporarily.

  At the temporary stop position after the first horizontal suction holding plate 10 is moved forward, second suction holding means 14 including a second horizontal suction holding plate 13 that can reciprocate in the direction of the vertical arrow is provided.

  The second horizontal suction holding plate 13 is provided with a suction holding portion 13a formed of an air Q suction hole in the lower horizontal surface portion thereof, and by the downward movement of the second horizontal suction holding plate 13, the suction holding portion 13a is temporarily The second suction holding means 11 approaches or contacts the upper surface of one unit of the IC tag inlet 1a on the first horizontal suction holding plate 10 fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11, and the second The horizontal suction holding plate 13 temporarily stops the lowering operation, and the suction holding portion 13a of the second horizontal suction holding plate 13 is moved by the air suction operation of the suction holding portion 13a and the air suction stop operation of the suction holding portion 10a. One unit of the IC tag inlet 1a is suctioned and held horizontally and received from the first horizontal suction holding plate 10.

  After the sheet-like IC tag inlet 1a (one unit of IC module) is sucked and held by the second horizontal suction holding plate 13, the first horizontal suction holding plate 10 immediately moves backward in the horizontal arrow direction. Thus, the horizontal guide plate 6 returns to the original position (solid line position) at the tip.

  By the returning operation of the first horizontal suction holding plate 10 to the original position (solid line position), the second horizontal suction holding plate 13 moves downward while vertically holding the IC tag inlet 1a for one unit.

  Subsequently, a module (tag) on a transparent or opaque continuous or single sheet 15 that is intermittently supplied as shown in FIGS. 3 and 5 by a support sheet supply means (nip roll 7) described later as a support sheet supply unit B. ) One unit of the IC tag inlet 1a is sequentially supplied to the supply position, and is pressed or heated and attached to the surface of the sheet 15 via an adhesive (or temporarily fixed) and attached. After the pressing or heating pressing, the second horizontal suction holding plate 13 moves up and returns to the original position (broken line position).

  In the support sheet supply part B, the support sheet 15 is a continuous or single sheet so that the IC tag inlet supply position of the support sheet 15 reaches directly below the lowering stop point of the second horizontal suction holding plate 13 that moves vertically. Support sheet supply means for supplying 15 intermittently (for example, the nip roll 7) is provided below the first and second horizontal suction holding plates 10 and 13.

  After the second horizontal suction holding plate 13 moves upward and returns to the original position (broken line position), the support sheet 15 is moved to the second IC tag inlet supply position on the sheet 15 at the second position. The sheet is moved intermittently by a support sheet supply means (for example, nip roll 7 or the like) so as to reach just below the lowering stop point of the horizontal suction holding plate 13.

  Subsequently, the IC module supply TAB tape 4 is fed by using each means in the IC tag inlet supply section A and each means in the sheet supply section B, and one unit is formed on the tape-shaped substrate 1. As shown in FIG. 2, the sheet-like IC tag inlet 1a on which the IC module composed of the IC chip 2 with the antenna is mounted is sequentially placed on the surface of the support sheet 15 for each unit of the IC tag inlet 1a. The IC tag inlet 1a for a plurality of units is stuck on the surface of the support sheet 15 by sticking (or temporarily fixing).

  In the IC tag sheet manufacturing apparatus of the present invention, as shown in FIGS. 3 and 5, 1 is provided above the IC module supply TAB tape 4 that intermittently feeds upstream of the first suction holding means 11. An inspection means 4a for inspecting the quality and performance of the IC module (IC chip 2 and antenna 3) portion to be the IC tag inlet 1a on which the unit IC module is mounted is provided. An IC tag inlet discharge portion 9 for discharging the defective IC tag inlet 1a on which the IC module (IC chip 2 and antenna 3) is mounted may be provided.

  The inspection means 4a is provided for each unit of the IC module composed of the IC chip 2 and the antenna unit 3 arranged on the IC module supply TAB tape 4, and the circuit of the IC chip 2 and the quality of the antenna unit 3 are determined. Inspecting disconnection, communication distance incompatibility, and the like, and the inspection method is not particularly limited in the present invention. For example, it includes a light projecting unit and a light receiving sensor unit, and each unit is an IC module. It is possible to inspect by a transmitted light inspection method, a contact current inspection method, a non-contact dielectric inspection method, etc. for inspecting the occurrence of a defect hole (light transmission) in the circuit of the IC chip 2 and the antenna unit 3 for each 1a. Is possible.

As a result of the inspection, if a defect has occurred in the IC module, the IC tag inlet 1a for one unit is formed by the suction holding portion 13a on the lower end surface of the second vertical suction holding plate 13 of the second suction holding means 14. Immediately after the first horizontal suction holding plate 10 of the first suction holding means 11 is returned to the original position after being sucked and held, the IC module discharge portion 9 is immediately below the lower end surface of the second vertical suction holding plate 13. The IC tag inlet 1a as a defective product that has been sucked and held by horizontally moving and subsequently stopping the air suction operation of the sucking and holding portion 13a falls into the IC tag inlet discharge portion 9, and then immediately the IC The tag inlet discharge portion 9 moves horizontally and returns to the original position, so that the IC tag inlet 1a as a defective product can be eliminated.

  The structure and mechanism of the support sheet supply means in the support sheet supply step B are not particularly limited. For example, as shown in FIGS. 3 and 5, the support sheet 15 is intermittently rotated with the support sheet 15 sandwiched from both sides. An infeed nip roll 7 and an outfeed nip roll 7 including a pair of nip rolls that operate and a supply table 8 may be used. The pair of opposed nip rolls 7 may be provided over the entire width of the support sheet 15 in the feed width direction, as shown in FIG. 3, or two portions at both ends of the support sheet 15 in the feed width direction. Or you may provide in three places of both ends and the width direction center part.

  As shown in FIGS. 3 and 5, the support sheet 15 to be used may be either a continuous sheet (long roll sheet) or a single sheet, and is an opaque paper sheet such as thin paper or thick paper, or a plastic sheet. A fold a (perforation) capable of folding the support sheet 15 in half along the sheet feeding direction may or may not be formed, and the second horizontal suction holding plate 13 is equivalent to one unit. The IC tag inlet 1a is vertically moved downward onto the supply table 8 while being held by suction, and the support sheet 15 is pressed or heated to press the IC tag inlet 1a via an adhesive on the surface of the support sheet 15. Attach and attach.

  When the continuous or single sheet 15 used in the apparatus of the present invention does not have a fold that can be folded in half along the sheet feeding direction as shown in FIG. The IC tag inlet 1a is supplied at a substantially central portion, and an adhesive such as a pressure sensitive adhesive (adhesive) is applied in advance to the IC tag inlet 1a supply position on the upper surface of the support sheet 15. Or an adhesive with a heat sensitive adhesive (solvent volatilization type adhesive) is applied to the supply position of the IC tag inlet 1a on the upper surface of the support sheet 15 or the entire upper surface of the support sheet 15; The IC tag inlet 1a is supplied to the upper surface of the supporting sheet 15 one by one while holding and holding the IC tag inlet 1a for one unit horizontally. The support sheet 15 with the IC tag inlet 1a in which a plurality of IC tag inlets 1a are attached at predetermined intervals (equal intervals or different intervals that are regularly displaced) Become.

  Subsequently, the support sheet 15 with the IC tag inlet 1a and another support sheet 15 are introduced into the nip roll 7 in an overlapping manner, and a plurality of units of the IC tag inlet 1a are placed between the support sheets 15 and 15 at a predetermined interval ( The support sheet 15 with the IC tag inlet 1a is inserted and mounted at equal intervals or different intervals that are regularly shifted.

Further, as shown in FIG. 5, the continuous or single-piece support sheet 15 used in the apparatus of the present invention has a fold a (perforation) that can be folded in half along the support sheet supply direction. In the case where it is formed, the half-size side of either one of the single-width sheets 15a and 15b on both sides across the perforation a of the support sheet 15 is defined as the supply position of the IC tag inlet 1a. The pressure sensitive adhesive (pressure-sensitive adhesive) or the heat sensitive property is provided on the both ends of the feeding width direction on the upper surface of the support sheet 15 or on the entire surface excluding both ends and the center in the width direction, or on the entire upper surface of the support sheet 15. Adhesive by an adhesive (solvent volatilization type adhesive) is applied, and the second horizontal suction holding plate 13 holds the IC tag inlet 1a for one unit horizontally while supporting it one by one sequentially. On sheet 15 After the IC tag inlet 1a is supplied to and attached through the adhesive, the superimposed support sheet shown in FIG. 6 (a) is arranged after the support sheet supply part B shown in FIG. A plurality of units can be obtained by folding the support sheet 15 by folding it through the perforation a by means of folding the part C (to be described later, for example, a folding guide plate), and bonding the overlapped inner surface with the adhesive. The IC tag inlet 1a is sandwiched between the support sheets 15 and 15 at a predetermined interval (equal intervals or different intervals that are regularly shifted) to become the support sheet 15 with the IC tag inlet 1a.

  As shown in FIG. 6 (a), the folding means 16 of the overlapped support sheet preparation section C is composed of, for example, a horizontal holding plate 16a and an inclined folding plate 16b, and the support sheet feeding means 16c feeds the support sheet 15. However, either one of the single-width support sheets 15a and 15b on both sides of the support sheet 15 across the perforation a is introduced below the horizontal holding plate 16a along the perforation a. Then, the sheet is fed while being held horizontally, and the other half-width support sheet is introduced below the inclined folding plate 16b with the perforation a interposed therebetween, and gradually passes through the perforation a along the inclined folding plate 16b. Fold it in half and overlap. The support sheet feeding means 16c is not particularly limited in its structure and mechanism. For example, the support sheet feeding means 16c pushes the rear end portion of the support sheet 15 with feed claws attached at equal intervals to the endless chain that performs round transfer. In addition, there is a conveyor belt system in which the support sheet 15 is sandwiched and fed by two upper and lower belts.

  Subsequently, as shown in FIGS. 4A and 6B, a pressure bonding means 17 is provided as a support sheet bonding portion D, and the support sheet 15 with the IC tag inlet 1a is used as a pressure bonding means 17 as a pair of opposing surfaces. It is introduced between nip rolls (or between flat pressure plates (not shown)) and pressed or heated and pressed, and the IC tag inlet 1a and the support sheet 15 are bonded to each other. Alternatively, the adhesive inner surface of the overlapping support sheet 15 is permanently bonded to produce the support sheet 15 that supports (or sandwiches) the plurality of units of the IC tag inlet 1a.

  Subsequently, as shown in FIGS. 4B and 6C, the plurality of units of IC modules 1a (a plurality of IC tag inlets 1a) are provided with a die cutting means 19 as a support sheet die cutting portion E. The support sheet 15 that supports (or pinches) is introduced onto the die-cutting base 20 and die-cut by the flat pressure press method along the die-cutting line 15c by the die-cutting blade of the die-cutting means 19, or As the die cutting means 19, it is introduced between a die cutting roll having a die cutting blade on its peripheral surface and a press roll, and is die-cut by a rotary press method, and a plurality of small pieces of IC tags are sequentially formed. A sheet 18 is produced.

  In the manufacture of the non-contact type IC tag sheet and the manufacturing apparatus therefor according to the present invention, the IC tag inlet 1a is placed at the IC tag inlet supply position on the continuous or single wafer support sheet 15 in the IC tag inlet mounting step. Sequentially feeding one by one at regular intervals, pressing or heating and pressing to mount, and in the IC tag sheet manufacturing process, the support sheet 15 with the IC tag inlet 1a mounted is sequentially ordered by the die cutting means 19 When the IC tag sheet 18 is manufactured in the form of small pieces in which the IC tag inlets 1a are arranged one by one at different positions that are regularly shifted, the IC tag inlet In the mounting step, the support sheet 15 is fed at a constant speed (a constant feed sheet amount) by the continuous or single-wafer support sheet feeding means. The IC tag inlet 1a is supplied to the IC tag inlet supply position on the IC tag inlet 1a one by one at regular intervals, and is attached by pressing or heating and pressing, and in the next IC tag sheet manufacturing step, the mold The IC tag inlets 1a of the support sheets 15 are arranged at different positions which are sequentially shifted one by one by changing the die cutting position of the punching means 19 to different positions which are sequentially shifted one after another. can do.

In the non-contact type IC tag sheet manufacturing method and the manufacturing apparatus therefor according to the present invention, the IC tag inlets 1a are regularly arranged one by one at the IC tag inlet supply position on the continuous or single-wafer support sheet 15. In the IC tag sheet manufacturing process, the support sheets 15 to which the IC tag inlets 1a are mounted are sequentially spaced at equal intervals by the die-cutting means 19. When manufacturing each IC tag sheet 18 in the form of small pieces in which IC tag inlets 1a are arranged one by one at different positions that are regularly displaced, the IC tag inlet mounting process is performed. Then, the support sheet 15 is fed by the continuous or single-wafer support sheet feeding means at a constant speed (a constant feeding sheet amount), and the I tag by the IC tag inlet holding means. By changing the supply position of the tag inlet 1a to different positions which are sequentially shifted in order, the IC tag inlets 1a are sequentially shifted one by one in order to the IC tag inlet supply position on the support sheet 15. Each of the support sheets is supplied by pressing at a position and mounted by pressing or heating, and in the next IC tag sheet manufacturing process, the molds are sequentially punched at regular and evenly spaced punching positions by the punching means 19. Fifteen IC tag inlets 1a can be arranged one by one at different positions that are regularly shifted.

  In the above manufacturing method and manufacturing apparatus, each of the non-contact type IC tag sheets of the present invention is continuously supported during one manufacturing operation (one manufacturing line, one manufacturing line). The IC tag inlet 1a may be manufactured so as to be arranged at different positions which are sequentially shifted with respect to the sheet 15, or two or more plural parts are in production operation (in plural production lines, or The IC tag inlets 1a are arranged at different positions that are regularly shifted in order with respect to each support sheet 15 that is manufactured with respect to each support sheet 15 that is continuously manufactured during a plurality of manufacturing lines). You may manufacture as follows.

  Further, in the present invention, a recording data reading unit 22 is provided as a recording data reading unit F as shown in FIG. Each IC tag sheet 18 to be manufactured is intermittently conveyed by the sheet conveying means 21 one by one, and each IC module 1a mounted on each IC tag sheet 18 while the conveyance of the sheet 18 is stopped. Recorded data recorded in the (IC tag inlet 1a) (for example, data for identifying each IC tag sheet 18 such as a code and a serial number unique to the IC tag inlet 1a) is stored in the antenna of the IC tag inlet 1a. Recording data that can be read from the IC chip memory of the IC module 1a by inputting radio signals to the The data reading means 22 is intended to read in a non-contact manner.

  As the sheet conveying means 21, the IC tag sheet 18 is sandwiched between two upper and lower belts, for example, a feeding method in which the rear end portion of the IC tag sheet 18 is pushed by a pushing claw attached to an endless chain that performs forward transfer at equal intervals. For example, there is a conveyor belt system that feeds the vehicle.

  Subsequently, as shown in FIG. 7, the recording data reading unit F is provided with printing means 23 by an ink jet method, a laser printer method, or the like for output printing, as shown in FIG. Each time the IC tag inlet 1a of each IC tag sheet 18 is read, the number of intermittent feedings by the sheet conveying means 21 is counted by a shift register, and a predetermined count N (intermittent between the reading means 22 and the printing means 23) is counted. Each time the number of times of transmission, N = 2 in the case of FIG. 4 is reached, the recording data (unique code) recorded in the IC tag inlet 1a for each IC tag sheet 18 read by the recording data reading means 22 is read. Identification data (unique code, serial number, identification code, identification) Members, and identification code), and outputs printed by each IC tag sheet 18 side to the printing means 23 corresponding thereto.

Subsequently, as shown in FIG. 7, a sheet individual confirmation unit 24 using a CCD camera or the like is provided as a sheet individual confirmation unit H at the subsequent stage of the printing unit G. Each time printing is completed, the number of intermittent feedings by the sheet conveying unit 21 is counted by a shift register, and a predetermined count number N (the number of intermittent feedings between the printing unit 23 and the inspection unit 24, N = 1 in the case of FIG. 4). Each of the identification data (numbers, symbols, marks, etc.) output and printed by the printing means 23 is picked up as an image by the CCD camera or the like of the sheet individual confirmation means 24 every time the printing means 23 is reached.

  Then, numbers, symbols, marks and the like appearing in the image are read, and the IC tag memory recording data (IC data) of each IC tag inlet 1a for each IC tag sheet 18 and each IC tag sheet 18 are read. Are linked with each identification data (printed data such as numbers, symbols, marks, etc.) printed on (link, coupling, data combination) or consistency processing.

  Recording data (IC data) of the IC chip memory of the IC module (IC tag inlet 1a) of each IC tag sheet 18 in the individual sheet determining means 24, and identification data (printing data) printed on the sheet 18 Are associated with random (or serial) IC data recorded in the IC tag inlet 1a of each IC tag sheet 18 read and sent sequentially based on a predetermined association processing program, The print data printed on the sheet 18 is linked (linked, coupled, data combined), the IC data is recognized by what number is printed, and the IC data is processed by computer data processing. The data is linked (linked) to the print data, and the link between both data is confirmed and recorded And performs recording.

  The individual sheet determining means 24 inspects the print quality (such as missing characters and missing characters) of the numbers, symbols, marks, etc. printed on the IC tag sheet 18 as necessary, and the print quality is good. If there is, the IC tag sheet 18 is unloaded as a non-defective product from the non-defective product unloading section Ia of the sheet unloading section I. On the other hand, if the print quality is poor, the IC tag sheet 18 is unloaded from the sheet unloading section I. It is unloaded from the part Ib as a defective product.

  Further, the recording data (IC data) of the IC chip memory of the IC module (IC tag inlet 1a) of each IC tag sheet 18 and the identification data (printing data) printed on the sheet 18 in the sheet individual determination means 24 described above. ) Represents a correspondence (matching) relationship between a predetermined inspection control program and a predetermined management information correspondence table (IC data and print data management numbers, symbols, and codes, respectively) set in advance as a memory table. Based on the management information correspondence table), the IC data and the print data are compared and collated by data processing control by the consistency inspection control means 25 (computer).

  Then, based on the management information correspondence table, the presence or absence of consistency between the IC data and the print data is inspected. If there is consistency between the two data, the non-contact IC tag sheet 18 The product is transported as a non-defective product from the non-defective product unloading section Ia, and the data of the IC data and the print data are linked (linked) by computer data processing to confirm that both data are consistent and Record registration is performed.

  On the other hand, if there is no consistency between the two data, the non-contact IC tag sheet 18 is carried out as a defective product from the defective product carrying out portion Ib of the sheet carrying out portion I, and the IC data is obtained by computer data processing. The print data and the print data are determined to be inconsistent and the record registration is performed.

(A) is a schematic side view for explaining one embodiment of the non-contact type IC tag sheet of the present invention and its stacked state, (b) is a plan view thereof, and (c) is another embodiment and its stacked state. FIG. IC tag inlet supply part A, sheet supply part B, sheet folding part C, sheet bonding part D, sheet die cutting part E, recording data reading part F of the non-contact type IC tag sheet manufacturing method and manufacturing apparatus of the present invention FIG. 4 is an overall plan view illustrating the arrangement of the printing unit G, the consistency inspection unit H, and the sheet carry-out unit I. The perspective view explaining the IC tag inlet supply part A and the sheet | seat supply part B in the non-contact-type IC tag sheet manufacturing method and its manufacturing apparatus of this invention. (A) is a perspective view explaining the sheet | seat adhesion part D in the non-contact-type IC tag sheet manufacturing method and manufacturing apparatus of this invention, (b) is a perspective view explaining the sheet | seat die cutting part E. FIG. The perspective view explaining the IC tag inlet supply part A and the sheet | seat supply part B in the non-contact-type IC tag sheet manufacturing method and its manufacturing apparatus of this invention. (A) is a perspective view explaining the sheet folding part C in the non-contact type IC tag sheet manufacturing method and manufacturing apparatus of the present invention, (b) is a perspective view explaining the sheet bonding part D, (c) is The perspective view explaining the sheet die cutting part E. FIG. The perspective view explaining the recorded data reading part F, the printing part G, and the consistency test | inspection part H in the non-contact-type IC tag sheet manufacturing method and manufacturing apparatus of the present invention. (A)-(b) is a schematic side view explaining the conventional non-contact type IC tag sheet and its stacked state.

Explanation of symbols

A ... IC tag inlet supply part B ... Support sheet supply part C ... Support sheet bifold part D ... Support sheet adhesive part E ... Support sheet die cutting part F ... Recording data reading part G ... Printing part H ... Consistency inspection part I DESCRIPTION OF SYMBOLS Sheet unloading part Ia ... Non-defective article unloading part Ib ... Defective article unloading part 1 ... Tape-like base material 1a ... IC tag inlet 2 ... IC chip 3 ... Antenna part 4 ... TAB tape 4a ... IC module inspection means 5 ... Tape feeding means 6 DESCRIPTION OF SYMBOLS ... Tape guide plate 7 ... Support sheet sending means 8 ... Support sheet receiving part 9 ... IC module discharge | emission part 10 ... 1st horizontal suction holding plate 11 ... 1st suction holding means 12 ... Cutting means 13 ... 2nd horizontal suction holding plate DESCRIPTION OF SYMBOLS 14 ... 2nd adsorption | suction holding means 15 ... Support sheet 16 ... Folding means 17 ... Press adhesion means 18 ... IC chip mounting sheet 19 ... Die cutting means 22 ... Recording data reading means 23 ... Printing means 24 ... Consistency inspection means 25 ... Consistency inspection control means

Claims (20)

  Each non-contact type IC tag in which an IC tag inlet 1a mounted with one unit of an IC module comprising a flat chip-shaped IC chip 2 is attached to one side or the inner surface of a support sheet 15 that has been die-cut into small pieces. The non-contact type IC tag sheet according to claim 18, wherein the IC tag inlets 1a are arranged one by one at different positions in the region of the support sheet 15 in which the IC tag inlets 1a are cut into small pieces.   2. The non-contact type IC tag sheet according to claim 1, wherein the IC tag inlets 1 a arranged one by one on each IC tag sheet 18 are respectively arranged at different positions that are regularly shifted in the one-dimensional direction of the IC tag sheet 18. A non-contact type IC tag sheet that is arranged so as to overlap or be adjacent to each other.   2. The method of manufacturing a non-contact type IC tag sheet according to claim 1, wherein the IC tag inlets 1a arranged one by one on each IC tag sheet 18 are regularly displaced in the two-dimensional direction of each IC tag sheet 18. A non-contact type IC tag sheet characterized by being arranged to overlap or be adjacent to different positions. An IC that intermittently feeds an IC module supply TAB tape 4 in which a plurality of units of one unit of IC modules composed of IC chips 2 with flat and small antennas are regularly arranged on the upper surface of the tape-like substrate 1. TAB tape feeding process for module supply;
The tape-like substrate 1 on which the 1-unit IC module at the tip of the TAB tape 4 is formed is suctioned and held horizontally on the lower surface thereof by the first horizontal suction holding plate 10 and horizontally moved by the first suction holding means 11. TAB tape tip horizontal movement process,
An IC tag that forms an IC tag inlet 1a with one unit of IC module by sequentially cutting the tape-like substrate 1 held horizontally by the first suction holding unit 11 for each unit of IC module by the cutting unit 12. An inlet forming step;
A unit of IC tag inlet 1a with an IC module that is cut and fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11 is suctioned horizontally from above by the second horizontal suction holding plate 13. IC tag inlet vertical movement process for holding and moving vertically;
At the IC tag inlet supply position on the continuous or single-wafer support sheet 15 where the adhesive is applied to the upper surface of the second horizontal suction holding plate 13 that is spaced apart and parallel to the lower surface, the second horizontal suction holding plate 13 is intermittently supplied. An IC tag inlet mounting step in which the IC tag inlets 1a sucked and held by the suction holding plate 13 are sequentially supplied one by one by the second suction holding means 14 and pressed or heated and pressed; and
Production of IC tag sheets for producing small IC tag sheets 18 each having a single IC tag inlet 1a by sequentially punching the support sheet 15 with the IC tag inlet 1a mounted thereon by a die cutting means 19 Including a process,
In the IC tag inlet mounting step, the IC tag inlets 1a are sequentially supplied to the IC tag inlet supply position on the continuous or single wafer support sheet 15 one by one at regular intervals, and are pressed or heated and mounted. Further, in the IC tag sheet manufacturing process, the support sheet 15 to which the IC tag inlet 1a is mounted is die-cut at different positions that are sequentially and regularly shifted by the die-cutting means 19, and differently shifted regularly. A manufacturing method of a non-contact type IC tag sheet, characterized in that each IC tag sheet 18 in a small piece shape, in which one IC tag inlet 1a is arranged at a position, is manufactured. An IC that intermittently feeds an IC module supply TAB tape 4 in which a plurality of units of one unit of IC modules composed of IC chips 2 with flat and small antennas are regularly arranged on the upper surface of the tape-like substrate 1. TAB tape feeding process for module supply;
The tape-like substrate 1 on which the 1-unit IC module at the tip of the TAB tape 4 is formed is suctioned and held horizontally on the lower surface thereof by the first horizontal suction holding plate 10 and horizontally moved by the first suction holding means 11. TAB tape tip horizontal movement process,
An IC tag that forms an IC tag inlet 1a with one unit of IC module by sequentially cutting the tape-like substrate 1 held horizontally by the first suction holding unit 11 for each unit of IC module by the cutting unit 12. An inlet forming step;
A unit of IC tag inlet 1a with an IC module that is cut and fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11 is suctioned horizontally from above by the second horizontal suction holding plate 13. IC tag inlet vertical movement process for holding and moving vertically;
At the IC tag inlet supply position on the continuous or single-wafer support sheet 15 where the adhesive is applied to the upper surface of the second horizontal suction holding plate 13 that is spaced apart and parallel to the lower surface, the second horizontal suction holding plate 13 is intermittently supplied. An IC tag inlet mounting step in which the IC tag inlets 1a sucked and held by the suction holding plate 13 are sequentially supplied one by one by the second suction holding means 14 and pressed or heated and pressed; and
Production of IC tag sheets for producing small IC tag sheets 18 each having a single IC tag inlet 1a by sequentially punching the support sheet 15 with the IC tag inlet 1a mounted thereon by a die cutting means 19 Including a process,
In the IC tag inlet mounting step, the IC tag inlet 1a is supplied to the IC tag inlet supply position on the continuous or single-wafer support sheet 15 at a different position which is regularly shifted one by one in order. In the IC tag sheet manufacturing process, the support sheet 15 to which the IC tag inlet 1a is mounted is die-cut sequentially at regular intervals by the die-cutting means 19 in the IC tag sheet manufacturing step, A method of manufacturing a non-contact type IC tag sheet, characterized in that each IC tag sheet 18 is manufactured in small pieces in which one IC tag inlet 1a is disposed at a different position. An IC that intermittently feeds an IC module supply TAB tape 4 in which a plurality of units of one unit of IC modules composed of IC chips 2 with flat and small antennas are regularly arranged on the upper surface of the tape-like substrate 1. TAB tape feeding process for module supply;
The tape-like substrate 1 on which the 1-unit IC module at the tip of the TAB tape 4 is formed is suctioned and held horizontally on the lower surface thereof by the first horizontal suction holding plate 10 and horizontally moved by the first suction holding means 11. TAB tape tip horizontal movement process,
An IC tag that forms an IC tag inlet 1a with one unit of IC module by sequentially cutting the tape-like substrate 1 held horizontally by the first suction holding unit 11 for each unit of IC module by the cutting unit 12. An inlet forming step;
A unit of IC tag inlet 1a with an IC module that is cut and fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11 is suctioned horizontally from above by the second horizontal suction holding plate 13. IC tag inlet vertical movement process for holding and moving vertically;
At the IC tag inlet supply position on the continuous or single-wafer support sheet 15 where the adhesive is applied to the upper surface of the second horizontal suction holding plate 13 that is spaced apart and parallel to the lower surface, the second horizontal suction holding plate 13 is intermittently supplied. An IC tag inlet mounting step in which the IC tag inlets 1a sucked and held by the suction holding plate 13 are sequentially supplied one by one by the second suction holding means 14 and pressed or heated and pressed; and
Another support sheet is superimposed on the support sheet 15 to which the IC tag inlet 1a is mounted, and is pressed or heated and pressed by the pressure bonding means 17 to bond the overlapped sheets to form a plurality of IC tag inlets 1a, etc. An overlapping support sheet manufacturing step for manufacturing the overlapping support sheet 15 sandwiched between the intervals;
An IC tag sheet producing step of producing the respective IC tag sheets 18 in the form of small pieces in which the IC tag inlets 1a are arranged one by one by sequentially punching the overlapping support sheet 15 by the die cutting means 19;
In the IC tag inlet mounting step, the IC tag inlets 1a are sequentially supplied to the IC tag inlet supply position on the continuous or single wafer support sheet 15 one by one at regular intervals, and are pressed or heated and mounted. Further, in the IC tag sheet manufacturing process, the support sheet 15 to which the IC tag inlet 1a is mounted is die-cut at different positions that are sequentially and regularly shifted by the die-cutting means 19, and differently shifted regularly. A manufacturing method of a non-contact type IC tag sheet, characterized in that each IC tag sheet 18 in a small piece shape, in which one IC tag inlet 1a is arranged at a position, is manufactured. An IC that intermittently feeds an IC module supply TAB tape 4 in which a plurality of units of one unit of IC modules composed of IC chips 2 with flat and small antennas are regularly arranged on the upper surface of the tape-like substrate 1. TAB tape feeding process for module supply;
The tape-like substrate 1 on which the 1-unit IC module at the tip of the TAB tape 4 is formed is suctioned and held horizontally on the lower surface thereof by the first horizontal suction holding plate 10 and horizontally moved by the first suction holding means 11. TAB tape tip horizontal movement process,
An IC tag that forms an IC tag inlet 1a with one unit of IC module by sequentially cutting the tape-like substrate 1 held horizontally by the first suction holding unit 11 for each unit of IC module by the cutting unit 12. An inlet forming step;
A unit of IC tag inlet 1a with an IC module that is cut and fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11 is suctioned horizontally from above by the second horizontal suction holding plate 13. IC tag inlet vertical movement process for holding and moving vertically;
At the IC tag inlet supply position on the continuous or single-wafer support sheet 15 where the adhesive is applied to the upper surface of the second horizontal suction holding plate 13 that is spaced apart and parallel to the lower surface, the second horizontal suction holding plate 13 is intermittently supplied. An IC tag inlet mounting step in which the IC tag inlets 1a sucked and held by the suction holding plate 13 are sequentially supplied one by one by the second suction holding means 14 and pressed or heated and pressed; and
Another support sheet is superimposed on the support sheet 15 to which the IC tag inlet 1a is mounted, and is pressed or heated and pressed by the pressure bonding means 17 to bond the overlapped sheets to form a plurality of IC tag inlets 1a, etc. An overlapping support sheet manufacturing step for manufacturing the overlapping support sheet 15 sandwiched between the intervals;
An IC tag sheet producing step of producing the respective IC tag sheets 18 in the form of small pieces in which the IC tag inlets 1a are arranged one by one by sequentially punching the overlapping support sheet 15 by the die cutting means 19;
In the IC tag inlet mounting step, the IC tag inlet 1a is supplied to the IC tag inlet supply position on the continuous or single-wafer support sheet 15 at a different position which is regularly shifted one by one in order. In the IC tag sheet manufacturing process, the support sheet 15 to which the IC tag inlet 1a is mounted is die-cut sequentially at regular intervals by the die-cutting means 19 in the IC tag sheet manufacturing step, A method of manufacturing a non-contact type IC tag sheet, characterized in that each IC tag sheet 18 is manufactured in small pieces in which one IC tag inlet 1a is disposed at a different position.   8. The non-contact type IC tag sheet manufacturing method according to claim 6, wherein the continuous or single-piece support sheet 15 that is intermittently supplied is an upper surface that is spaced apart from and parallel to the lower side of the second horizontal suction holding plate 13. The support sheet 15 is formed with a fold a (perforation) that is coated with an adhesive and can be folded in half along the supply direction. In the IC tag inlet mounting step, the support sheet 15 The IC tag inlets 1a sucked and held by the second horizontal sucking and holding plate 13 are sequentially fed one by one by the second sucking and holding means 14 to the one half size side IC tag inlet supply position and pressed. Alternatively, after mounting by heating and pressing, the support sheet 15 is folded in two through the fold a (perforation) by the folding means 16 and overlapped by pressing or heating and pressing by the pressing adhesive means 17. Together Non-contact IC tag sheet manufacturing method, characterized by making a plurality of IC tag inlet 1a superimposition nipped support sheet 15 by bonding between over bets.   9. The method of manufacturing a non-contact type IC tag sheet according to claim 4, wherein each IC tag inlet 1 a disposed on each IC tag sheet 18 is a one-dimensional one of the IC tag sheets 18. A method of manufacturing a non-contact type IC tag sheet, wherein the IC tag sheets are arranged so as to overlap or be adjacent to different positions regularly displaced in a direction.   9. The non-contact type IC tag sheet manufacturing method according to claim 4, wherein the IC tag inlets 1 a arranged on the IC tag sheets 18 are two-dimensionally arranged on the IC tag sheets 18. A method of manufacturing a non-contact type IC tag sheet, wherein the IC tag sheets are arranged so as to overlap or be adjacent to different positions regularly displaced in a direction.   While intermittently feeding an IC module supply TAB tape 4 in which a plurality of units of one unit of IC modules composed of IC chips 2 with flat and small antennas are regularly arranged on the upper surface of the tape-like substrate 1. First adsorbing and holding means comprising a first horizontal adsorbing and holding plate 10 which can horizontally move by adsorbing and holding the tape-like base material 1 on which the one unit IC module at the tip of the TAB tape 4 is horizontally adsorbed and held on its lower surface. 11 and the inlet forming cutting means for forming the IC tag inlet 1a with an IC module by sequentially cutting the tape-like substrate 1 held horizontally by the first suction holding means 11 for each IC module. 12 and one unit of IC module that is cut and fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11. The attached IC tag inlet 1a is provided with a second horizontal suction holding plate 13 that can be horizontally moved by suction holding the adhesive from above, and an adhesive is provided on the upper surface of the second horizontal suction holding plate 13 that is spaced apart from and parallel to the lower side. The IC tag inlets 1a sucked and held by the second horizontal suction holding plate 13 are sequentially supplied one by one to the continuous or single-piece IC tag inlet supply position on which the sheet is applied and intermittently supplied. The second suction holding means 14 to be attached by pressing or heating and the support sheet 15 to which the IC tag inlet 1a is attached are sequentially cut out to form small pieces in which the IC tag inlets 1a are arranged one by one. A non-contact type IC tag sheet manufacturing apparatus provided with a die-cutting means 19 for producing each IC tag sheet 18, wherein the second suction holding means 14 is provided below the second horizontal suction holding plate 13. IC tag sucked and held by the second horizontal suction holding plate 13 at the IC tag inlet supply position on the continuous or single-wafer support sheet 15 in which adhesive is applied to the upper surface facing and spaced apart from the row and intermittently supplied. The inlets 1a are sequentially supplied one by one at equal intervals and are attached by pressing or heating and pressing, and the die-cutting means 19 places the support sheet 15 on which the IC tag inlets 1a are attached at different positions that are sequentially and regularly displaced. Manufacturing a non-contact type IC tag sheet, wherein each IC tag sheet 18 is formed in small pieces in which IC tag inlets 1a are arranged one by one at different positions that are regularly displaced. apparatus. While intermittently feeding an IC module supply TAB tape 4 in which a plurality of units of one unit of IC modules composed of IC chips 2 with flat and small antennas are regularly arranged on the upper surface of the tape-like substrate 1. First adsorbing and holding means comprising a first horizontal adsorbing and holding plate 10 which can horizontally move by adsorbing and holding the tape-like base material 1 on which the one unit IC module at the tip of the TAB tape 4 is horizontally adsorbed and held on its lower surface. 11 and the inlet forming cutting means for forming the IC tag inlet 1a with an IC module by sequentially cutting the tape-like substrate 1 held horizontally by the first suction holding means 11 for each IC module. 12 and one unit of IC module that is cut and fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11. The attached IC tag inlet 1a is provided with a second horizontal suction holding plate 13 that can be horizontally moved by suction holding the adhesive from above, and an adhesive is provided on the upper surface of the second horizontal suction holding plate 13 that is spaced apart from and parallel to the lower side. The IC tag inlets 1a sucked and held by the second horizontal suction holding plate 13 are sequentially supplied one by one to the continuous or single-piece IC tag inlet supply position on which the sheet is applied and intermittently supplied. The second suction holding means 14 to be attached by pressing or heating and the support sheet 15 to which the IC tag inlet 1a is attached are sequentially cut out to form small pieces in which the IC tag inlets 1a are arranged one by one. Each IC tag sheet 18
A non-contact type IC tag sheet manufacturing apparatus including a die-cutting means 19 for manufacturing the upper surface of the second suction holding means 14 that is spaced apart from and parallel to the lower side of the second horizontal suction holding plate 13. One IC tag inlet 1a sucked and held by the second horizontal suction holding plate 13 is sequentially placed at the IC tag inlet supply position on the continuous or single wafer support sheet 15 where the adhesive is applied intermittently. The mold release means 19 supplies the support sheets 15 with the IC tag inlets 1a to the molds at sequentially spaced positions. A non-contact type IC tag sheet manufacturing apparatus characterized in that each IC tag sheet 18 is manufactured as a small piece in which the IC tag inlets 1a are arranged one by one at different positions which are regularly displaced.   While intermittently feeding an IC module supply TAB tape 4 in which a plurality of units of one unit of IC modules composed of IC chips 2 with flat and small antennas are regularly arranged on the upper surface of the tape-like substrate 1. First adsorbing and holding means comprising a first horizontal adsorbing and holding plate 10 which can horizontally move by adsorbing and holding the tape-like base material 1 on which the one unit IC module at the tip of the TAB tape 4 is horizontally adsorbed and held on its lower surface. 11 and the inlet forming cutting means for forming the IC tag inlet 1a with an IC module by sequentially cutting the tape-like substrate 1 held horizontally by the first suction holding means 11 for each IC module. 12 and one unit of IC module that is cut and fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11. The attached IC tag inlet 1a is provided with a second horizontal suction holding plate 13 that can be horizontally moved by suction holding the adhesive from above, and an adhesive is provided on the upper surface of the second horizontal suction holding plate 13 that is spaced apart from and parallel to the lower side. The IC tag inlets 1a sucked and held by the second horizontal suction holding plate 13 are sequentially supplied one by one to the continuous or single-piece IC tag inlet supply position on which the sheet is applied and intermittently supplied. The second suction holding means 14 to be attached by pressing or heating and the support sheet 15 to which the IC tag inlet 1a is attached are overlapped with each other and pressed or heated to adhere the overlap sheets. Then, the pressing and adhering means 17 for producing the overlapping support sheet 15 sandwiching a plurality of IC tag inlets 1a at equal intervals, and the overlapping support sheet 15 are sequentially die-cut. A non-contact type IC tag sheet manufacturing apparatus, comprising: a die-cutting means 19 for producing each IC tag sheet 18 in the form of a small piece in which one IC tag inlet 1a is arranged, the second suction holding The means 14 is provided at the IC tag inlet supply position on the continuous or single-wafer support sheet 15 in which an adhesive is applied to the upper surface of the second horizontal suction holding plate 13 which is spaced apart from and parallel to the lower surface and intermittently supplied. The IC tag inlets 1a sucked and held by the second horizontal suction holding plate 13 are sequentially supplied one by one at equal intervals and pressed or heated and attached, and the die-cutting means 19 attaches the IC tag inlet 1a to the IC tag inlet 1a. The attached support sheets 15 are sequentially punched at different positions that are regularly displaced, and each IC tag sheet 18 in the form of a small piece is provided with one IC tag inlet 1a at different positions that are regularly displaced. An apparatus for manufacturing a non-contact type IC tag sheet, wherein While intermittently feeding an IC module supply TAB tape 4 in which a plurality of units of one unit of IC modules composed of IC chips 2 with flat and small antennas are regularly arranged on the upper surface of the tape-like substrate 1. First adsorbing and holding means comprising a first horizontal adsorbing and holding plate 10 which can horizontally move by adsorbing and holding the tape-like base material 1 on which the one unit IC module at the tip of the TAB tape 4 is horizontally adsorbed and held on its lower surface. 11 and the inlet forming cutting means for forming the IC tag inlet 1a with an IC module by sequentially cutting the tape-like substrate 1 held horizontally by the first suction holding means 11 for each IC module. 12 and one unit of IC module that is cut and fed forward together with the tape-like substrate 1 by the horizontal movement of the first suction holding means 11. The attached IC tag inlet 1a is provided with a second horizontal suction holding plate 13 that can be horizontally moved by suction holding the adhesive from above, and an adhesive is provided on the upper surface of the second horizontal suction holding plate 13 that is spaced apart from and parallel to the lower side. The IC tag inlets 1a sucked and held by the second horizontal suction holding plate 13 are sequentially supplied one by one to the continuous or single-piece IC tag inlet supply position on which the sheet is applied and intermittently supplied. 2nd to be attached by pressing or heating and pressing
Another supporting sheet is superimposed on the suction holding means 14 and the supporting sheet 15 on which the IC tag inlet 1a is mounted, and is pressed or heated to bond the overlapping sheets to form a plurality of IC tag inlets 1a, etc. Each of the IC tag sheets in the form of a small piece in which the IC tag inlets 1a are arranged one by one by sequentially pressing the overlapping support sheet 15 and pressing and adhering means 17 for producing the overlapping support sheet 15 sandwiched between the gaps. A non-contact type IC tag sheet manufacturing apparatus provided with a die cutting means 19 for producing 18, wherein the second suction holding means 14 is spaced apart from and parallel to the lower side of the second horizontal suction holding plate 13. I which is adsorbed and held by the second horizontal adsorbing and holding plate 13 at the IC tag inlet supply position on the continuous or single-wafer support sheet 15 on which the adhesive is applied and supplied intermittently. The tag inlets 1a are sequentially supplied one by one at different positions that are regularly shifted and attached by pressing or heating and pressing, and the die cutting means 19 sequentially applies the support sheets 15 to which the IC tag inlets 1a are attached, etc. Non-contact type IC characterized in that each IC tag sheet 18 is produced in small pieces in which IC tag inlets 1a are arranged one by one at different positions that are regularly deviated at intervals. Tag sheet manufacturing equipment.   The non-contact type IC tag sheet manufacturing apparatus according to claim 13 or 14, wherein the continuous or single-piece support sheet 15 intermittently supplied is an upper surface that is spaced apart and parallel to the lower side of the second horizontal suction holding plate 13. A support sheet 15 on which an adhesive is applied and a perforation a that can be folded in half along the supply direction is formed, and the IC tag inlet supply position on one half-size side on the support sheet 15 In addition, the IC tag inlets 1a sucked and held by the second horizontal suction holding plate 13 are sequentially supplied by the second suction holding means 14 one by one at regular intervals, and are attached by pressing or heating and pressing. The means 16 folds the support sheet 15 through the perforations a and overlaps them, and the pressing and adhering means 17 presses or heat-presses them to bond the overlapped sheets, so that a plurality of IC tag inlays are attached. Contactless IC tag sheet manufacturing apparatus characterized by making overlay support sheet 15 is sandwiched the door 1a at regular intervals.   16. The non-contact type IC tag sheet manufacturing apparatus according to any one of claims 11 to 15, wherein one IC tag inlet 1a arranged on each IC tag sheet 18 is a one-dimensional one of the IC tag sheets 18. An apparatus for producing a non-contact type IC tag sheet, wherein the apparatus is arranged so as to overlap or be adjacent to different positions regularly displaced in a direction.   16. The non-contact type IC tag sheet manufacturing apparatus according to any one of claims 11 to 15, wherein the IC tag inlets 1a arranged on the IC tag sheets 18 are two-dimensionally arranged on the IC tag sheets 18, respectively. An apparatus for producing a non-contact type IC tag sheet, wherein the apparatus is arranged so as to overlap or be adjacent to different positions regularly displaced in a direction.   The non-contact type IC tag sheet manufacturing apparatus according to any one of claims 11 to 17, wherein each of the IC tag inlets 1a is provided at a front stage or a rear stage of the die cutting means 19 for producing the small piece IC tag sheet 18. The recording data reading means 22 for reading the recorded data recorded in the printer, the printing means 23 for outputting and printing the identification symbols corresponding to the read recording data, and the output printed and printed identification codes as images. An apparatus for manufacturing a non-contact type IC tag sheet, comprising: an individual sheet determining means 24 for reading and linking or matching each IC tag inlet 1a with each identification symbol.   The non-contact type IC tag sheet manufacturing apparatus according to any one of claims 11 to 18, wherein the continuous or single sheet supporting sheet 15 is a paper sheet such as thin paper or cardboard, or a plastic sheet. Non-contact type IC tag sheet manufacturing apparatus. 20. The non-contact type IC tag sheet manufacturing apparatus according to claim 11, wherein each unit is disposed above the IC module supply TAB tape 4 that intermittently feeds upstream of the first suction holding unit 11. An apparatus for manufacturing a non-contact type IC tag sheet, characterized in that an inspection means 4a for inspecting an IC module is provided, and an IC module discharge section 9 is provided downstream of the first suction holding means 11.

Images