JP2006278701A5 - - Google Patents
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- Publication number
- JP2006278701A5 JP2006278701A5 JP2005095393A JP2005095393A JP2006278701A5 JP 2006278701 A5 JP2006278701 A5 JP 2006278701A5 JP 2005095393 A JP2005095393 A JP 2005095393A JP 2005095393 A JP2005095393 A JP 2005095393A JP 2006278701 A5 JP2006278701 A5 JP 2006278701A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- wafer according
- semiconductor wafer
- block
- smoothed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 21
- 238000004519 manufacturing process Methods 0.000 claims 9
- 239000003929 acidic solution Substances 0.000 claims 3
- 239000000243 solution Substances 0.000 claims 3
- 238000003486 chemical etching Methods 0.000 claims 1
- 238000009499 grossing Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Claims (10)
前記半導体インゴットを切断し半導体ブロックとする工程と、Cutting the semiconductor ingot into a semiconductor block;
前記半導体ブロックの切断面を化学エッチングにより平滑化する工程と、Smoothing the cut surface of the semiconductor block by chemical etching;
前記半導体ブロックの平滑化された前記切断面から、前記半導体ブロックのスライスを開始する工程と、を有することを特徴とする半導体ウェハの製造方法。And a step of starting slicing of the semiconductor block from the smoothed cut surface of the semiconductor block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005095393A JP2006278701A (en) | 2005-03-29 | 2005-03-29 | Manufacturing method for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005095393A JP2006278701A (en) | 2005-03-29 | 2005-03-29 | Manufacturing method for semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006278701A JP2006278701A (en) | 2006-10-12 |
| JP2006278701A5 true JP2006278701A5 (en) | 2008-02-07 |
Family
ID=37213146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005095393A Pending JP2006278701A (en) | 2005-03-29 | 2005-03-29 | Manufacturing method for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006278701A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010150080A (en) * | 2008-12-25 | 2010-07-08 | Disco Abrasive Syst Ltd | Method for processing silicon block |
| JP5493887B2 (en) * | 2010-01-12 | 2014-05-14 | 信越半導体株式会社 | Single crystal block cleaning apparatus and cleaning method |
| JP5534933B2 (en) * | 2010-05-17 | 2014-07-02 | 京セラ株式会社 | Method for manufacturing solar cell element |
| TWI510682B (en) * | 2011-01-28 | 2015-12-01 | Sino American Silicon Prod Inc | Modification process for nano-structuring ingot surface, wafer manufacturing method and wafer thereof |
| JP6045960B2 (en) * | 2013-03-29 | 2016-12-14 | 株式会社ノリタケカンパニーリミテド | Band saw |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3317839B2 (en) * | 1996-02-16 | 2002-08-26 | 花王株式会社 | Detergent composition and method for cleaning sliced wafer or plate |
| JPH10180747A (en) * | 1996-12-24 | 1998-07-07 | Tokyo Seimitsu Co Ltd | Wafer manufacturing system |
| JP2000323736A (en) * | 1999-05-10 | 2000-11-24 | Mitsubishi Electric Corp | Manufacture of silicon solar cell |
| JP2000323443A (en) * | 1999-05-14 | 2000-11-24 | Mitsubishi Materials Silicon Corp | Manufacture of semiconductor wafer |
| JP2003224289A (en) * | 2002-01-28 | 2003-08-08 | Sharp Corp | Solar cell, method for connecting solar cell, and solar cell module |
| JP2004106360A (en) * | 2002-09-19 | 2004-04-08 | Komatsu Electronic Metals Co Ltd | Slit wafer supporting component and wafer cleaning apparatus |
| JP2005064256A (en) * | 2003-08-12 | 2005-03-10 | Shin Etsu Handotai Co Ltd | Method of manufacturing epitaxial wafer |
| JP2005060168A (en) * | 2003-08-12 | 2005-03-10 | Shin Etsu Handotai Co Ltd | Method for producing wafer |
| JP2006073768A (en) * | 2004-09-02 | 2006-03-16 | Katsuyo Tawara | Processing method of silicon wafer |
-
2005
- 2005-03-29 JP JP2005095393A patent/JP2006278701A/en active Pending
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