JP2006278396A - Processor and program - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processor and a program capable of easily detecting the tipping of a substrate that may occur when a processed wafer is carried and mounted on a substrate mounting part of a temporary storage part, for preventing damage to the substrate in and after the next process. <P>SOLUTION: The processor comprises a placement stage on which a transportation container is placed in which a plurality of substrates w are stored, a process chamber to apply a specified process to the substrate w, a temporary storage 5 comprising a substrate mounting part 23 on which a plurality of processed substrates w are mounted in multistages, a transportation part comprising a transportation arm for transporting the substrates w among the transportation container, process chamber and temporary storage 5 on the placement stage, a vibration sensor 29 for detecting the vibration of the substrate mounting part 23, and a control unit which discriminates abnormal vibration by comparing the current detection value of the vibration sensor 29 with the pre-set, value and stops the transportation arm at abnormal vibration. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a processing apparatus and a program, and more particularly to a technique for detecting chipping of a substrate in a temporary storage unit.

  In the manufacture of a semiconductor device, there are processes for performing various processes such as an etching process on a substrate to be processed, for example, a semiconductor wafer (hereinafter referred to as a wafer), and a processing apparatus for executing these processes is used. Yes. The processing apparatus includes a FOUP mounting table on which a FOUP (Front Opening Unified Pod), which is a transport container storing a plurality of wafers, for example, 25 wafers, a processing chamber for performing a predetermined process on the wafers, and a plurality of processed wafers. A purge storage that is a temporary storage unit having substrate mounting units for mounting a plurality of wafers in multiple stages, and a transfer unit having a transfer arm that transfers the wafer between the hoop on the FOUP mounting table, the processing chamber, and the purge storage. And.

  The wafer is subjected to, for example, an etching process under a predetermined processing gas atmosphere in the processing chamber, and then transferred and mounted on the substrate mounting portion of the purge storage by the transfer arm, and the clean air circulated and exhausted in the purge storage, A processing gas (hereinafter referred to as residual gas) remaining near the surface of the wafer is removed (scavenged).

  By the way, in the processing apparatus, there is a case where the wafer jumps up and the wafer is misaligned due to failure of static elimination of the electrostatic chuck provided in the processing chamber for holding the wafer. Due to this misalignment, the wafer is also supported on the pick part, which is the wafer support part in the transfer arm, in a state shifted from the normal position. Therefore, when the wafer is mounted on the substrate mounting part by the transfer arm, A part of the peripheral portion may collide with the substrate mounting portion, and the impact may cause chipping (chip) at the peripheral portion of the wafer.

  The chipping of the wafer may cause damage to the wafer after the next process. In particular, in the heat treatment process, chipping is the starting point and wafer cracking is likely to occur. In the case of a 4-lot batch process type vertical heat treatment system that processes four wafers at a time, a maximum of 100 wafers can be mounted on a wafer boat. The lower wafers may be damaged one after another by the fall of this, which may cause a great loss.

  However, the conventional processing apparatus does not have a function of detecting wafer chipping. For this reason, the chipped wafer is transported without error and stored in the hoop, which may cause wafer cracks and lot defects in subsequent processes.

  As a related technique, a tweezer (corresponding to a pick unit) serving as a wafer support unit in a wafer transfer apparatus is damaged by a bend or adjustment failure, and the surface of the wafer is damaged. In order to suppress sticking, a semiconductor manufacturing apparatus in which a vibration sensor is provided in a tweezer has been proposed (see Japanese Patent Application Laid-Open No. 2001-223254). In this semiconductor manufacturing apparatus, the operation of the wafer transfer apparatus itself is accompanied. Not only is it difficult to discriminate between vibration and vibration caused by contact with the wafer, but also the wafer slides on the tweezers when the wafer collides, so that the vibration at the time of the wafer collision may not be transmitted to the tweezers.

  As another related technique, a boat provided as a carrier in a vertical heat treatment apparatus with a vibration sensor is proposed in order to prevent the occurrence of partying due to vibration (Korea, Japanese Patent Laid-Open No. 2001-2001). No. 45630).

JP 2001-223254 A Korean Patent Laid-Open No. 2001-45630

  As described above, in the processing apparatus, not only the positional deviation of the wafer generated in the processing chamber cannot be detected, but also the processed wafer from the processing chamber is transported and mounted on the substrate mounting portion of the temporary storage unit. It was not possible to detect the chipping of the wafer that occurred at the time. For this reason, the chipped wafer is transported without error and stored in the hoop, which may cause wafer cracking or wafer breakage in subsequent processes.

  The present invention has been made in consideration of the above circumstances, and can easily detect chipping of a substrate that may occur when a processed wafer is transported and mounted on a substrate mounting portion of a temporary storage unit. An object of the present invention is to provide a processing apparatus and a program capable of preventing the substrate from being damaged after the next step. It is another object of the present invention to provide a processing apparatus and a program that can easily detect a positional shift of a substrate that has occurred in a processing chamber or a transfer system path.

  In order to achieve the above object, the processing apparatus according to claim 1 of the present invention includes a mounting table on which a transport container storing a plurality of substrates is mounted, a processing chamber for performing a predetermined process on the substrates, A temporary storage unit having a substrate mounting unit for mounting a plurality of processed substrates in multiple stages, and a transfer unit having a transfer arm for transferring the substrate between the transport container on the mounting table, the processing chamber, and the temporary storage unit. A vibration sensor for detecting vibration of the board mounting portion, and a current detection value by the vibration sensor is compared with a preset setting value to determine whether or not the vibration is abnormal. And a control unit for stopping the transfer arm.

  The processing apparatus according to claim 2 is the processing apparatus according to claim 1, wherein the temporary storage unit is a purge storage that exhausts clean air flowing into the temporary storage unit to scavenge residual gas around the substrate. Features.

  The processing apparatus according to claim 3 is the processing apparatus according to claim 1, wherein the substrate mounting portion includes a plurality of supporting columns made of a heat-resistant material having multiple holding grooves for holding the peripheral edge of the substrate, and And a heating member provided inside for heating the support column to a predetermined temperature.

  According to a fourth aspect of the present invention, there is provided the processing apparatus according to the first aspect, further comprising a data collection and recording unit that collects and records data output from the vibration sensor over time.

  The program according to claim 5 is a program for causing a computer to transfer a substrate to a temporary storage unit by a transfer arm, and from the substrate mounting unit when the substrate is mounted on the substrate mounting unit of the temporary storage unit by the transfer arm. A vibration detection module that detects a generated vibration using a vibration sensor, a determination module that determines whether or not the vibration is abnormal by comparing a current detection value by the vibration sensor and a preset setting value, and abnormal vibration; A transfer arm stop module that stops the transfer arm when it is determined.

  The program according to claim 6 is a program for causing a computer to transfer a substrate to a temporary storage unit by a transfer arm, and from the substrate mounting unit when the substrate is mounted on the substrate mounting unit of the temporary storage unit by the transfer arm. A vibration detection module that detects a generated vibration using a vibration sensor, a determination module that determines whether or not the vibration is abnormal by comparing a current detection value of the vibration sensor with a preset setting value, And a chipping detection module for detecting that chipping has occurred in the substrate by the determination.

  The program according to claim 7 is a program for causing a computer to transfer a substrate to a temporary storage unit by a transfer arm, and from the substrate mounting unit when the substrate is mounted on the substrate mounting unit of the temporary storage unit by the transfer arm. A vibration detection module that detects a generated vibration using a vibration sensor, a determination module that determines whether or not the vibration is abnormal by comparing a current detection value of the vibration sensor with a preset setting value, And a misregistration detection module for detecting that the misregistration of the substrate has occurred on the processing chamber or the transfer path.

  According to the processing apparatus of claim 1, a mounting table for mounting a transport container storing a plurality of substrates, a processing chamber for performing a predetermined process on the substrates, and a plurality of processed substrates are mounted in multiple stages. A temporary storage unit having a substrate mounting unit, a transfer unit having a transfer arm for transferring the substrate between the transport container, the processing chamber, and the temporary storage unit on the mounting table, and vibration of the substrate mounting unit are detected. A vibration sensor and a control unit that compares the current detection value by the vibration sensor with a preset setting value to determine whether or not the vibration is abnormal, and stops the transfer operation of the transfer arm when it is determined as abnormal vibration; Therefore, it is possible to easily detect chipping of a substrate that may occur when a processed wafer is transported and mounted on the substrate mounting part of the temporary storage unit, and prevents damage to the substrate after the next process. can do.

  According to the processing apparatus of claim 2, since the temporary storage unit is a purge storage that exhausts clean air flowing into the temporary storage unit and scavenges residual gas around the substrate, the residual around the processed substrate Deterioration or contamination of the substrate due to gas can be prevented.

  According to the processing apparatus of claim 3, the substrate mounting portion includes a plurality of heat-resistant material columns having holding grooves for holding the peripheral edge of the substrate in multiple stages, and the columns provided inside each column are predetermined. Since a heating member for heating to a temperature is provided, adhesion of reaction by-products to the substrate mounting portion due to residual gas around the processed substrate can be suppressed, and the cleaning cycle can be shortened.

  According to the processing apparatus of claim 4, since the data collection and recording unit that collects and records the data output from the vibration sensor over time is provided, it is possible to easily analyze which substrate has caused chipping and when. it can.

  The program according to claim 5 is a program for causing a computer to transfer a substrate to a temporary storage unit by a transfer arm, and mounting the substrate when mounting the substrate on the substrate mounting unit of the temporary storage unit by the transfer arm. A vibration detection module for detecting vibration generated from a part using a vibration sensor, a determination module for comparing whether a current detection value by the vibration sensor and a preset set value are abnormal vibrations, Since it has a transfer arm stop module that stops the transfer arm when it is determined as vibration, chipping of the substrate that may occur when the processed substrate is transferred and mounted on the substrate mounting portion of the temporary storage unit While being able to detect easily, a conveyance arm can be stopped and the failure | damage of the board | substrate after the following process can be prevented.

  The program according to claim 6 is a program for causing a computer to transfer a substrate to a temporary storage unit by a transfer arm, and mounting the substrate when mounting the substrate on the substrate mounting unit of the temporary storage unit by the transfer arm. A vibration detection module for detecting vibration generated from a part using a vibration sensor, a determination module for comparing whether a current detection value by the vibration sensor and a preset set value are abnormal vibrations, Since it has a chipping detection module that detects that chipping has occurred on the substrate by the vibration determination, the substrate that may be generated when the processed substrate is transported and mounted on the substrate mounting portion of the temporary storage unit Chipping can be easily detected, and damage to the substrate after the next step can be prevented.

  The program according to claim 7 is a program for causing a computer to execute transport of a substrate to a temporary storage unit by a transport arm, and mounting the substrate when mounting the substrate on the substrate mounting unit of the temporary storage unit by the transport arm A vibration detection module for detecting vibration generated from a part using a vibration sensor, a determination module for comparing whether a current detection value by the vibration sensor and a preset set value are abnormal vibrations, Since it has a misalignment detection module that detects the occurrence of misalignment of the substrate on the processing chamber or the transport path based on the vibration determination, the misalignment of the substrate generated on the processing chamber or the transport path can be easily performed. Can be detected.

  The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a schematic configuration of a processing apparatus according to an embodiment of the present invention.

  In FIG. 1, reference numeral 1 denotes a single-wafer processing apparatus that transfers a semiconductor wafer (hereinafter referred to as a wafer) w, which is a substrate to be processed, one by one to perform a predetermined process. The processing apparatus 1 includes a plurality of, for example, four hoop mounting tables 3 on which a hoop 2 serving as a transport container storing a plurality of, for example, 25 wafers w is mounted, and a predetermined process such as an etching process on the wafer w. Three process ships 4A, 4B, and 4C including process units (processing chambers) for performing a process, and a purge storage 5 as a temporary storage unit for temporarily storing a plurality of processed wafers w mounted in multiple stages, A loader unit 6, which is a transfer unit that transfers the wafer w between the FOUP 2 on the FOUP mounting table 3, the process ships 4 </ b> A to 4 </ b> C, and the purge storage 5. The process ships 4A to 4C are composed of process units 7, 8, 9 and load lock units 10, 11, 12.

  The process ships 4A to 4C include process units 7, 8, 9 as processing chambers for performing predetermined processing on the wafer w, for example, vacuum processing chambers, and a transfer arm (not shown) for transferring the wafer w to the process units 7-9. ) Built-in load lock units 10, 11, and 12. The process units 7 to 9 each have a cylindrical processing chamber container (chamber) and upper and lower electrodes arranged in the chamber, and the distance between the upper and lower electrodes is etched on the wafer. For example, an appropriate interval for performing the reactive ion etching process is set. The lower electrode has an electrostatic chuck on its top for holding the wafer by Coulomb force or the like.

In the process units 7 to 9, a processing gas is introduced into the chamber, an electric field is generated at the electrode, and the processing gas is turned into plasma to generate ions and radicals. The ions and radicals are used to perform reactive ion etching on the wafer w. Apply. In the process units 7 to 9, a corrosive gas (for example, NH ₃ ) and HF are introduced into the chamber, and an isotropic etching process is performed on the wafer w by a COR (Chemical Oxide Removal) process without using an electric field. In the process ships 4A to 4C, the internal pressure of the loader unit 6 is maintained at atmospheric pressure, while the internal pressure of the process units 7 to 9 is maintained at vacuum. For this reason, the load lock units 10 to 12 include the gate valves 13, 14, and 15 at the connection portion with the loader unit, and the gate valves 16, 17, and 18 at the connection portion with the process units 7 to 9. Is configured as a vacuum preliminary transfer chamber whose internal pressure can be adjusted.

  The loader unit 6 has a box shape that is long in the lateral direction, and clean air is introduced into the interior from above via a filter. The loader unit 6 includes a transfer arm mechanism 18 disposed inside, and four load ports 19 serving as wafer loading ports disposed on one side wall (front surface portion) corresponding to the hoop mounting table 3. The number of load ports may be three, or four or more may be expanded corresponding to a mass production clean room. The three process ships 7 to 9 are connected to the other side wall (back surface portion) of the loader unit 6. The transfer arm mechanism 18 is provided with an x-axis moving part that can reciprocate by electromagnet drive along a guide rail (not shown) arranged in the longitudinal direction in the loader unit 6, and can be moved up and down on the x-axis moving part. And a multi-joint type transport arm 20 provided on the swivel base and capable of extending and contracting in the radial direction or the horizontal direction.

  The transfer arm 20 has a pick portion 21 that supports the wafer w at the tip. 2A and 2B are views showing a pick portion of the transfer arm, where FIG. 2A is a plan view and FIG. 2B is a front view. The pick portion 21 is made of, for example, a ceramic U-shaped thin plate, and a plurality of, for example, four tapered shapes for positioning the wafer at a predetermined position (regular position) in contact with the peripheral portion of the wafer w on the upper surface thereof. The regulation pin 22 is provided. Normally, the wafer w is regulated by the regulation pins 22 and supported horizontally on the pick unit 21. However, the wafer w is displaced due to, for example, the electrostatic chuck in the process units 7 to 9 being unsuccessful, and the wafer w is supported by the pick unit 21 of the transfer arm 20 in the displaced state. Then, as indicated by a virtual line in FIG. 2B, the wafer w may be supported in a state of projecting to one side or in a state of projecting to one side and being inclined.

  The purge storage 5 is connected to one end of the loader unit 6 in the longitudinal direction. An orienter 55 for pre-aligning the position of the wafer w carried into the loader unit 6 from the hoop 2 is also connected to one end of the loader unit 6 in the longitudinal direction. The orienter 55 and the purge storage 5 are (See FIG. 7). Either the orienter 55 and the purge storage 5 may be up and down, and are relatively in a vertical relationship. The wafer w is transferred to the orienter 55 by the transfer arm vertically.

  The transfer arm 20 can be moved up and down with a 25-pitch stroke so as to be able to transfer 25 wafers w stored in multiple stages in the FOUP 2. The number of mounted wafers w is limited to 19. If an orienter is disposed at one end of the loader unit 6 in the longitudinal direction and the purge storage 5 is disposed at the other end of the loader unit 6 in the longitudinal direction, the purge storage 5 is configured so that 25 wafers can be mounted. Can do.

  FIG. 3 is a plan view showing a schematic configuration of the purge storage, and FIG. 4 is a front view schematically showing a main part of the substrate mounting portion. The purge storage 5 has a box shape in which one end on the loader unit 6 side is opened, and has a substrate mounting portion 23 for mounting a plurality of, for example, 19 wafers w in multiple stages. The substrate mounting portion 23 includes a plurality of, for example, four ceramic columns 25 having holding grooves 24 for holding the peripheral edge of the wafer w, and the columns 25 provided inside each column 25 to heat the columns 25 to a predetermined temperature. And a rod-shaped heater 26 as a heating member. The column 25 is erected on a base plate 27 installed in the purge storage 5.

  In the substrate mounting portion 23, in order to prevent the reaction by-product from adhering and depositing due to the contact of the residual gas remaining around the wafer w after processing, and to extend the cleaning cycle of the purge storage 5, the support column 25 has a rod shape. The heater 26 is heated to a predetermined temperature, for example, about 60 ° C. The support column 25 is formed of a heat-resistant material such as ceramics so as to withstand this heating temperature. As the heat-resistant material for forming the support, in addition to ceramics, for example, carbon rod, quartz glass, glass fiber reinforced polyethylene terephthalate (GF-PET), heat-resistant resin (aromatic polyamide, PES, PEEK, PEK, LCP, heat Plastic PI, super heat-resistant silicon polymer, PCT resin, and nylon-based nanocomposite obtained by adding nanofillers such as nanoparticles, nanotubes, and nanohorns to the base material. The support columns 25 are preferably provided with holding grooves 24 substantially symmetrically on both sides so that warpage deformation hardly occurs.

  The purge storage 5 has an exhaust port 28 for exhausting clean air flowing from the loader unit 6 side, and scavenges residual gas around the wafer together with the clean air. The exhaust port 28 is connected to a factory exhaust system equipped with an exclusion device.

  As described above, when the wafer w is supported on the pick part 21 of the transfer arm 20 so as to protrude to one side, when the wafer w is mounted on the substrate mounting part 23, as indicated by a virtual line in FIG. A part of the peripheral portion of the wafer w may contact or collide with the substrate mounting portion 23, and the impact may cause pitching at the peripheral portion of the wafer. Therefore, in order to detect the vibration generated from the substrate mounting portion 23 and detect the pitching of the wafer w, the substrate mounting portion 23 is provided with a vibration sensor 29 that detects the vibration of the substrate mounting portion 23.

Supporting the wafer w by the transfer arm 20, the vibration acceleration at the time of conveyance or transfer operation compared to at 2m / s ² or less, the vibration acceleration at which the wafer w collides with the substrate mounting portion 23 is 20 m / s ^Since there is a large difference of ² or more (the S / N ratio is large), it is possible to easily detect the collision of the wafer w in the substrate mounting portion 23, and hence the occurrence of pitching of the wafer w due to the collision. The value detected by the vibration sensor is not limited to vibration acceleration, and a frequency component during vibration may be detected and compared with a set value.

  The processing device 1 compares the current detection value by the vibration sensor 29 with a preset setting value to determine whether or not there is abnormal vibration, and stops the operation of the transfer arm 20 when it is determined as abnormal vibration. An arm controller 30 as a control unit is provided. The vibration sensor 29 is preferably attached to the base (lower) side of each column 25. Further, in order to protect the vibration sensor 29 from residual gas having corrosive properties, the vibration sensor 29 is preferably provided with a protective cover 31. Unlike the optical sensor, the vibration sensor 29 has an advantage that it can be detected even when the protective cover 31 is attached and is not easily affected by adhesion of reaction byproducts.

  A detection signal (output signal) from each vibration sensor 29 is input to the sensor amplifier 32, and the sensor amplifier 32 compares the current detection value with a preset setting value to determine whether the detection value exceeds the setting value. It is determined whether it is abnormal vibration (NG) or not (OK). An output signal from the sensor amplifier 32 is input as a digital signal to the arm controller 30 via the interface board 33, and in the case of abnormal vibration, an interlock is applied to stop the transfer arm 20. At this time, an alarm may be activated at the same time. The interface board 33 includes an OR gate, a holding / resetting circuit, and a mask. For example, the mask is set so as to pass a signal only when the transfer arm 20 is extended.

  The processing apparatus 1 includes a system controller that controls the operation of the three process ships 4A to 4C and the loader unit 6, and an operation controller 40 that is disposed at one end of the loader unit 6 in the longitudinal direction. The operation controller 40 includes a display unit made up of, for example, an LCD (Liquid Crystal Display), and the display unit displays the operation status of each component of the processing apparatus 1.

  FIG. 5 is a diagram showing a schematic configuration of a system controller in the processing apparatus of FIG. As shown in FIG. 5, the system controller includes an EC (Equipment Controller) 41, four MC (Module Controllers) 42, 43, 44, and 45, and a switching hub 46 that connects the EC 41 and MCs 42 to 45. Yes. The system controller is connected from the EC 41 to a host computer 47 as a MES (Manufacturing Execution System) that manages the manufacturing process of the entire factory where the processing apparatus 1 is installed via a LAN (Local Area Network). The host computer 47 cooperates with the system controller to feed back real-time information related to the process in the factory to the core business system (not shown), and makes a determination regarding the process in consideration of the load of the entire factory.

  The EC 41 is a main control unit (master control unit) that controls each of the MCs 42 to 45 to control the operation of the entire processing apparatus. The EC 41 has a CPU, RAM, HDD, and the like, and the CPU transmits a control signal to each of the MCs 42 to 45 in accordance with a wafer processing method designated by the user or the like in the operation controller 40, that is, a program corresponding to the recipe. Thus, the operations of the process ships 4A to 4C and the loader unit 6 are controlled.

  The switching hub 46 switches the MCs 42 to 45 as connection destinations of the EC 41 according to a control signal from the EC 41. MCs 42 to 45 are sub-control units (slave control units) that control the operations of the process ships 4 </ b> A to 4 </ b> C and the loader unit 6. Each MC 42 to 45 is connected to each I / O (input / output) module 48 via a GHOST network. This is a network realized by an LSI called GHOST (general high-speed optimal scalable transceiver). In the GHOST network, MCs 42 to 45 correspond to masters, and the I / O module 48 corresponds to slaves.

  The I / O module 48 includes a plurality of I / O units 49 connected to each component (end device) of the loader unit 6, and transmits a control signal to the end device and an output signal from the end device. . An I / O board that controls input / output of digital signals, analog signals, and serial signals in the I / O unit 49 is also connected to the GHOST network.

  In the system controller of FIG. 5, the I / O unit 49 connected to the plurality of end devices is modularized to form the I / O module 48 without the plurality of end devices being directly connected to the EC 41. Since the I / O module 48 is connected to the EC 41 via the MCs 42 to 45 and the switching hub 46, the communication system can be simplified.

  The control signal transmitted by the CPU of the EC 41 refers to the address of the I / O unit connected to the desired end device and the address of the I / O module including the I / O unit. By referring to the address of the I / O unit in the control signal by GHOST, it is possible to eliminate the need for the switching hub 46 and MCs 42 to 45 to inquire the CPU about the transmission destination of the control signal. Transmission can be realized.

  The system controller also includes a data collection server 50 as a data collection / recording unit that collects and records data output from the vibration sensor 29 over time. In this case, the detection signal, which is data output from the vibration sensor 29, is extracted as an analog signal from the sensor amplifier 32, input to the I / O unit 49, and input to the data collection server 50 via the network.

  According to the processing apparatus 1 configured as described above, a process ship 4A to 4H includes a FOUP mounting table 3 on which a FOUP 2 storing a plurality of wafers w is mounted, and a process unit that performs a predetermined process on the wafer w. 4C, a purge storage 5 having a substrate mounting portion 23 for mounting a plurality of processed wafers w in multiple stages, a hoop 2 on the hoop mounting table 3, and process ships 4A to 4C including process units. And a loader unit 6 having a transfer arm 20 for transferring between the purge storage 5, a vibration sensor 29 for detecting vibration of the substrate mounting portion 23, a current detection value by the vibration sensor 29, and a preset set value, And an arm controller 20 that stops the operation of the transfer arm 20 when the abnormal vibration is determined. Therefore, chipping of the wafer w that may occur when the processed wafer w is transported and mounted on the substrate mounting portion 23 of the purge storage 5 can be easily detected, and the wafer w is damaged after the next process. Can be prevented. When the next process is a heat treatment process by a batch processing type vertical heat treatment apparatus, it is possible to prevent loss of 100 wafers at the maximum by one chipping detection.

  The purge storage 5 exhausts the clean air flowing into the purge storage 5 and scavenges the residual gas around the wafer. Therefore, before returning the processed wafer to the hoop, Residual gas can be removed, and alteration or contamination of the wafer due to residual gas around the processed wafer can be prevented. Further, the substrate mounting portion 23 heats the support posts 25 to a predetermined temperature provided in a plurality of ceramic support posts 25 having multiple holding grooves 24 for holding the peripheral edge of the wafer w, and the support posts 25 provided inside each support post 25. Since the rod-shaped heater 26 is provided, the adhesion of reaction by-products to the substrate mounting portion 23 due to residual gas around the processed wafer can be suppressed, and the cleaning cycle can be shortened. In addition, since the data collection server 50 is provided as a data collection / recording unit that collects and records data output from the vibration sensor 29 over time, it is possible to easily analyze which wafer w has caused chipping. It becomes possible.

  An object of the present invention is to supply a software program for realizing the functions of the above-described embodiments or a recording medium (storage medium) on which the program is recorded to the EC 41, and the CPU of the EC 41 stores the program stored on the recording medium. It is also achieved by reading and executing. In this case, the program situation read from the recording medium realizes the functions of the above-described embodiment, and the program and the recording medium on which the program is recorded constitute the present invention.

  In the program for causing the computer to transfer the wafer w to the purge storage 5 by the transfer arm 20, vibration generated from the substrate mounting portion 23 when the transfer arm 20 mounts the wafer w on the substrate mounting portion 23 of the purge storage 5. When the vibration sensor 29 detects abnormal vibration, a determination module that compares the current detection value by the vibration sensor 29 with a preset value and determines whether or not the vibration is abnormal. A transfer arm stop module for stopping the transfer arm 20. According to the program, it is possible to easily detect the chipping of the wafer w that may occur when the processed wafer is transferred and mounted on the substrate mounting portion 23 of the purge storage 5 and to stop the transfer arm 20. It is possible to prevent the wafer w from being damaged after the next process.

  As a recording medium for supplying the program, for example, floppy (registered trademark) disk, hard disk, magneto-optical disk, CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW Magnetic tape or the like can be used. The program may be downloaded via a network.

  As another example of the program, a vibration detection module that detects vibration generated from the substrate mounting portion when the wafer is mounted on the substrate mounting portion of the purge storage by the transfer arm, and a current detection value by the vibration sensor And a preset setting value to determine whether or not there is abnormal vibration, and a chipping detection module that indirectly detects that chipping has occurred on the wafer due to the determination of abnormal vibration. May be. According to this program, it is possible to easily detect chipping of a wafer that may occur when a processed wafer is transported and mounted on a substrate mounting portion of a purge storage, and to prevent damage to the substrate after the next process. be able to.

  As another example of the program, there is a vibration detection module (vibration detection step) that uses a vibration sensor to detect vibration generated from the substrate mounting portion when a wafer is mounted on the substrate mounting portion of the purge storage by the transfer arm. A determination module that compares the current detection value by the vibration sensor with a preset set value to determine whether or not there is abnormal vibration, and a wafer position shift occurs on the processing chamber or the transfer path due to the abnormal vibration determination It may have a misregistration detection module (misregistration detection step) that indirectly detects this. According to the program, it is possible to easily detect the positional deviation of the wafer generated on the processing chamber or the transfer system path.

  FIG. 6 is a plan view showing a schematic configuration of a modified example of the processing apparatus according to the embodiment of the present invention. In FIG. 6, the same components as those in the processing apparatus of FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

  In FIG. 6, the processing apparatus 100 includes a plane vertically long hexagonal transfer unit 60, six process units 61, 62, 63, 64, 65, 66, and a loader unit 6 that are arranged radially around the transfer unit 60. And two load lock units 67 and 68 that are arranged between the loader unit 6 and the transfer unit 60 and connect the loader unit 6 and the transfer unit 60. The internal pressure of the transfer unit 60 and each process unit 61 to 66 is maintained in a vacuum, and the transfer unit 60 and each process unit 61 to 66 are respectively connected through gate valves 70, 71, 72, 73, 74, and 75. It is connected.

  In the processing apparatus 100, the internal pressure of the loader unit 6 is maintained at atmospheric pressure, while the internal pressure of the transfer unit 60 is maintained at vacuum. Therefore, each load lock unit 67, 68 can be adjusted in its internal pressure by providing gate valves 76, 77, 78, 79 at the connecting portion with the transfer unit 60 and the connecting portion with the loader unit 6, respectively. It is configured as a vacuum preparatory chamber. The load lock units 67 and 68 have wafer mounting tables 80 and 81 for temporarily mounting the wafer w transferred between the loader unit 6 and the transfer unit 60.

  Each of the process units 61 to 66 includes wafer mounting tables 82, 83, 84, 85, 86, and 87 on which wafers to be processed are mounted. The transfer unit 60 includes a transfer arm unit 90 composed of two SCARA arm type transfer arms. The transfer arm unit 90 moves along a guide rail 91 disposed in the longitudinal direction in the transfer unit 60 so as to transfer the wafer w between the process units 61 to 66 and the load lock units 67 and 68. It has become. This processing apparatus 100 can achieve the same effects as the processing apparatus 1 of FIG.

  FIG. 8 is a diagram for explaining a series of processing flows in the processing apparatus. FIG. 8A is a flowchart in a normal case, and FIG. 8B is a flowchart in the case of abnormality detection. In the normal case, as shown in FIG. 8A, the wafer w is transferred from the FOUP 2 to the orienter as the alignment mechanism by the transfer arm 20 (S1), and the direction of the wafer w (that is, the position of the orientation flat or notch). ), The wafer is transferred to a process ship (S2), a predetermined process such as etching is performed, the processed wafer w is transferred to the purge storage 5 (S3), and the gas adsorbed on the wafer w is transferred. A scavenging process is performed, and the wafer w is transferred to the FOUP 2 (S4).

  When the processing apparatus is operating normally, the MC 42 and the EC 41 of the loader unit 6 perform the above-described processes in the normal mode. On the other hand, if the wafer is not normally placed on the temporary storage unit and an abnormality occurs, the process changes. This process will be described with reference to FIG. 8B. For example, when the wafer w is misaligned for some reason in the process ships 4A to 4C, the wafer w is transferred to the purge storage 5 by the transfer arm 20. When a part of the wafer collides with the substrate mounting portion 23 and abnormal vibration is detected by the vibration sensor 29 from the impact (vibration acceleration, vibration frequency, etc.) at that time (S4), the sensor amplifier 32 determines the abnormal vibration. The signal (NG) is output to the arm controller 30. The arm controller 30 selects the abnormal mode and temporarily stops driving the transfer arm 20, and the MC 42EC and EC of the loader unit 6 are changed to the maintenance mode. (S5).

  In the maintenance mode, the transfer arm 20 does not transfer the abnormal wafer to the originally planned FOUP, but transfers it to another FOUP and collects it (S6). In this case, the dummy wafer may be temporarily retracted to a dummy hoop or dummy stocker (not shown) in which the dummy wafer is waiting. Alternatively, an abnormal wafer may be taken out by an operator. In the maintenance mode, auto-setup processing is automatically performed to automatically inspect processing condition values such as pressure, processing gas flow rate, temperature, and power, and to return to normal values (initial setting values). .

  As mentioned above, although embodiment thru | or example of this invention has been explained in full detail with drawing, this invention is not limited to the said embodiment thru | or example, Various in the range which does not deviate from the summary of this invention. Design changes can be made. For example, as a process unit in the processing apparatus, a CVD process or the like may be performed, or a normal pressure process may be performed.

It is a top view which shows schematic structure of the processing apparatus which concerns on embodiment of this invention. It is a figure which shows the pick part of a conveyance arm, (a) is a top view, (b) is a front view. It is a top view which shows schematic structure of purge storage. It is a front view which shows roughly the principal part of a board | substrate mounting part. It is a figure which shows schematic structure of the system controller in the processing apparatus of FIG. It is a top view which shows schematic structure of the modification of the processing apparatus which concerns on embodiment of this invention. It is a figure which shows the one side part of a loader unit roughly. It is a figure for demonstrating a series of processing flows in a processing apparatus, (a) is a flowchart in the normal case, (b) is a flowchart in the case of abnormality detection.

Explanation of symbols

1,100 Processing equipment w Semiconductor wafer (substrate)
2 Hoop (conveying container)
3 Hoop mounting table (mounting table)
5 Purge storage (temporary storage)
6 Loader unit (conveyance unit)
7-9 Process unit (processing chamber)
20 Transfer arm 23 Substrate mounting portion 24 Holding groove 25 Post 26 Rod heater (heating member)
29 Vibration sensor 30 Arm controller (control unit)
50 Data collection and recording unit 61-66 Process unit (processing room)

Claims (7)

  A mounting table for mounting a transport container storing a plurality of substrates; a processing chamber for performing a predetermined process on the substrates; a temporary storage unit having a substrate mounting unit for mounting a plurality of processed substrates in multiple stages; A transport unit having a transport arm for transporting the substrate between the transport container on the mounting table, the processing chamber, and the temporary storage unit, a vibration sensor for detecting vibration of the substrate mounting unit, and current detection by the vibration sensor A processing apparatus comprising: a control unit that compares a value with a preset set value to determine whether or not the vibration is abnormal, and stops the transfer arm when the vibration is determined to be abnormal.   The processing apparatus according to claim 1, wherein the temporary storage unit is a purge storage that exhausts clean air flowing into the temporary storage unit to scavenge residual gas around the substrate.   The substrate mounting section includes a plurality of support columns made of a heat-resistant material having multiple holding grooves for holding the peripheral edge of the substrate, and a heating member that is provided inside each support column and heats the support column to a predetermined temperature. The processing apparatus according to claim 1.   The processing apparatus according to claim 1, further comprising a data collection and recording unit that collects and records data output from the vibration sensor over time.   A program for causing a computer to transfer a substrate to a temporary storage unit by a transfer arm, and using a vibration sensor to generate vibration from the substrate mounting unit when the substrate is mounted on the substrate mounting unit of the temporary storage unit by the transfer arm. A vibration detection module that detects the vibration, a determination module that compares the current detection value of the vibration sensor with a preset setting value to determine whether or not the vibration is abnormal, and stops the transfer arm when the vibration is determined to be abnormal And a transfer arm stop module.   A program for causing a computer to transfer a substrate to a temporary storage unit by a transfer arm, and using a vibration sensor to generate vibration from the substrate mounting unit when the substrate is mounted on the substrate mounting unit of the temporary storage unit by the transfer arm. A vibration detection module to be detected, a determination module that compares the current detection value of the vibration sensor with a preset setting value to determine whether or not there is abnormal vibration, and damage to the peripheral edge of the substrate due to the determination of abnormal vibration And a board damage detection module for detecting occurrence of the problem. A program for causing a computer to transfer a substrate to a temporary storage unit by a transfer arm, and using a vibration sensor to generate vibration from the substrate mounting unit when the substrate is mounted on the substrate mounting unit of the temporary storage unit by the transfer arm. A vibration detection module to be detected, a determination module for comparing the current detection value by the vibration sensor with a preset setting value to determine whether or not there is abnormal vibration, and on the processing chamber or the transfer path by the determination of abnormal vibration And a misregistration detection module for detecting that the misregistration of the substrate has occurred.

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