KR20060027626A - Purge storage of semiconductor device fabrication equipment - Google Patents

Purge storage of semiconductor device fabrication equipment Download PDF

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KR20060027626A
KR20060027626A KR1020040076502A KR20040076502A KR20060027626A KR 20060027626 A KR20060027626 A KR 20060027626A KR 1020040076502 A KR1020040076502 A KR 1020040076502A KR 20040076502 A KR20040076502 A KR 20040076502A KR 20060027626 A KR20060027626 A KR 20060027626A
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substrate
purge storage
cassette
storage
present
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KR1020040076502A
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Korean (ko)
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김용대
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삼성전자주식회사
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Publication of KR20060027626A publication Critical patent/KR20060027626A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 기판들을 캐리어에 수납하기 전에 기판들 표면에 잔류하는 가스(퓸)를 제거하는 반도체 제조 설비의 퍼지 스토리지에 관한 것이다. 본 발명의 반도체 제조 설비에서 공정처리된 기판 표면의 잔류 가스를 제거하는 퍼지 스토리지는 일측에 잔류가스가 배기되는 배기부를 갖는 케이스; 상기 케이스 내부에 설치되는 그리고 기판이 끼워지는 슬롯들을 갖는 적어도 3개의 로드들로 이루어지는 카세트; 상기 카세트에 부착되어 상기 기판이 상기 슬롯에 끼워지는 과정에서 발생되는 충돌을 감지하는 진동센서; 및 상기 진동센서로부터 출력되는 전기신호에 따라 알람을 발생하는 표시부를 포함한다.FIELD OF THE INVENTION The present invention relates to purge storage in semiconductor manufacturing equipment that removes gas (fume) from remaining on the surfaces of the substrates before storing the substrates in a carrier. The purge storage for removing residual gas on the surface of the substrate processed in the semiconductor manufacturing equipment of the present invention includes a case having an exhaust portion through which residual gas is exhausted; A cassette comprising at least three rods installed in the case and having slots into which a substrate is fitted; A vibration sensor attached to the cassette for detecting a collision generated in the process of inserting the substrate into the slot; And a display unit for generating an alarm in accordance with the electrical signal output from the vibration sensor.

Description

반도체 제조 설비의 퍼지 스토리지{PURGE STORAGE OF SEMICONDUCTOR DEVICE FABRICATION EQUIPMENT}PURGE STORAGE OF SEMICONDUCTOR DEVICE FABRICATION EQUIPMENT}

도 1은 본 발명의 바람직한 실시예에 따른 퍼지 스토리지가 적용된 멀티 챔버 시스템의 구성도;1 is a block diagram of a multi-chamber system to which purge storage is applied according to a preferred embodiment of the present invention;

도 2는 인덱스에 설치된 퍼지 스토리지의 구성을 보여주는 도면이다. 2 is a diagram illustrating a configuration of fuzzy storage installed in an index.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

200 : 퍼지 스토리지200: fuzzy storage

210 : 케이스210: case

220 : 카세트220: cassette

230 : 진동센서230: vibration sensor

232 : 표시부
232 display unit

본 발명은 반도체 제조 설비의 퍼지 스토리지에 관한 것으로, 기판들을 캐리어에 수납하기 전에 기판들 표면에 잔류하는 가스(퓸)를 제거하는 반도체 제조 설 비의 퍼지 스토리지에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to purge storage in semiconductor manufacturing facilities, and to purge storage in semiconductor manufacturing facilities that removes gas (fume) remaining on the surfaces of the substrates before storing the substrates in a carrier.

일반적으로, 퍼지 스토리지는 반도체 제조 설비의 EFEM(Equipment Front End Module) 사이드에 설치된다. 이 퍼지 스토리지는 예를 들어 Sin 막질에 HBr, C12를 사용하는 식각공정을 마친 기판의 표면에는 잔류 가스가 잔존하게 되는데, 이러한 기판이 곧바로 풉(FOUP) 카세트에 수납될 경우 그 주변 기판들은 CI 및 HBr에 의한 가스 응축(condensation)이 발생하여 공정 불량을 유발시킨다. 이러한 문제를 예방하기 위해 퍼지 스토리지에서는 기판 표면의 잔류 가스를 제거하게 된다.Typically, purge storage is installed on the Equipment Front End Module (EFEM) side of semiconductor manufacturing facilities. This purge storage retains residual gases on the surface of substrates that have been etched using, for example, HBr and C12 for Sin film quality. Condensation of gas by HBr occurs, causing process failure. To avoid this problem, purge storage removes residual gas from the substrate surface.

그러나, 기존의 퍼지 스토리지에서는 기판 이송 아암이 퍼지 스토리지의 로드에 형성된 슬롯에 기판을 로딩하는 과정에서 기판이 로드와 부딪치면서 치핑(chipping)이 발생하거나 스크래치가 종종 발생하고 있으나, 작업자는 그러한 문제가 발생되었는지를 전혀 알 수 없었다.However, in the conventional purge storage, while the substrate transfer arm loads the substrate into the slot formed in the rod of the purge storage, chipping and scratching often occur when the substrate collides with the rod, but the operator does not have such a problem. It was not known at all.

본 발명은 이와 같은 종래의 문제점을 해결하기 위한 것으로, 그 목적은 퍼지 스토리지의 기판을 로딩하는 과정에서 기판의 충돌을 감지하여 추가적으로 발생될 수 있는 기판의 스크래치를 예방할 수 있는 새로운 형태의 반도체 제조 설비의 퍼지 스토리지를 제공하는데 있다. The present invention is to solve such a conventional problem, an object of the present invention is to provide a new type of semiconductor manufacturing equipment that can prevent the scratch of the substrate that can additionally be detected by the collision of the substrate during the loading of the substrate of the purge storage To provide fuzzy storage.

상술한 목적을 달성하기 위한 본 발명의 반도체 제조 설비에서 공정처리된 기판 표면의 잔류 가스를 제거하는 퍼지 스토리지는 일측에 잔류가스가 배기되는 배기부를 갖는 케이스; 상기 케이스 내부에 설치되는 그리고 기판이 끼워지는 슬롯 들을 갖는 적어도 3개의 로드들로 이루어지는 카세트; 상기 카세트에 부착되어 상기 기판이 상기 슬롯에 끼워지는 과정에서 발생되는 충돌을 감지하는 진동센서; 및 상기 진동센서로부터 출력되는 전기신호에 따라 알람을 발생하는 표시부를 포함한다.The purge storage for removing the residual gas of the substrate surface processed in the semiconductor manufacturing equipment of the present invention for achieving the above object is a case having an exhaust portion to exhaust the residual gas on one side; A cassette consisting of at least three rods installed in the case and having slots into which a substrate is fitted; A vibration sensor attached to the cassette for detecting a collision generated in the process of inserting the substrate into the slot; And a display unit for generating an alarm in accordance with the electrical signal output from the vibration sensor.

예컨대, 본 발명의 실시예들은 여러 가지 형태로 변형될 수 있으며, 본 발명의 범위가 아래에서 상술하는 실시예들로 인해 한정되어 지는 것으로 해석되어져서는 안 된다. 본 실시예들은 당업계에서 평균적인 지식을 가진 자에게 본 발명을 보다 완전하게 설명하기 위해서 제공되어지는 것이다. 따라서, 도면에서의 요소의 형상 등은 보다 명확한 설명을 강조하기 위해서 과장되어진 것이다. For example, the embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. These examples are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings and the like are exaggerated to emphasize a clearer description.

이하, 본 발명의 실시예를 첨부된 도면 도 1 및 도 2에 의거하여 상세히 설명한다. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 1 and 2.

도 1은 본 발명의 바람직한 실시예에 따른 퍼지 스토리지가 적용된 멀티 챔버 시스템의 구성도이고, 도 2는 인덱스에 설치된 퍼지 스토리지(purge storage)의 구성을 보여주는 도면이다.FIG. 1 is a configuration diagram of a multi-chamber system to which purge storage is applied according to an exemplary embodiment of the present invention, and FIG. 2 is a diagram illustrating a configuration of purge storage installed at an index.

도 1을 참조하면, 반도체 제조 공정에서 사용되는 멀티 챔버 시스템(100)은 인덱스(110), 트랜스퍼챔버(120), 이 트랜스퍼챔버(120)와 연결된 복수의 공정챔버(130)들을 포함한다. Referring to FIG. 1, a multi-chamber system 100 used in a semiconductor manufacturing process includes an index 110, a transfer chamber 120, and a plurality of process chambers 130 connected to the transfer chamber 120.

상기 인덱스(110)는 퍼지 스토리지(200)와, 복수의 풉-오프너(또는 로드포트라고도 함;112) 그리고 기판이송로봇(114)을 갖는 통상적인 EFEM(Equipment Fron End Module)으로 구성될 수 있다. 상기 인덱스(110)의 풉-오프너(112)에는 기판 (w)들이 적재된 풉(FOUP)들이 안착된다. The index 110 may be composed of a conventional EFEM (Equipment Fron End Module) having a purge storage 200, a plurality of pull-openers (also called load ports) 112, and a substrate transfer robot 114. . The FOUPs on which the substrates w are mounted are mounted on the pull-openers 112 of the index 110.

본 발명의 바람직한 실시예에 따른 퍼지 스토리지(200)는 반도체 제조 설비의 EFEM(Equipment Front End Module;110)에 설치된다. 예를 들어 Sin 막질에 HBr,C12를 사용하는 식각공정을 마친 기판의 표면에는 잔류 가스가 잔존하게 되며, 이러한 기판은 곧바로 풉(FOUP) 카세트에 수납되지 않고 상기 퍼지 스토리지의 카세트에 수납되어 기판 표면의 잔류가스를 제거하게 된다. The purge storage 200 according to the preferred embodiment of the present invention is installed in an equipment front end module (EFEM) 110 of a semiconductor manufacturing facility. For example, residual gas remains on the surface of the substrate after the etching process using HBr, C12 for the Sin film quality, and the substrate is stored in the cassette of the purge storage rather than immediately stored in the FOUP cassette. To remove residual gas.

상기 퍼지 스토리지(200)는 일측에 잔류가스가 배기되는 배기부(212)를 갖는 케이스(210)를 갖는다. 이 케이스(210) 내부에는 기판이 끼워지는 슬롯(224)들을 갖는 적어도 3개의 로드(222)들로 이루어지는 카세트(220)가 설치된다. 그리고 이 카세트(220)에는 상기 기판이 상기 슬롯(224)에 끼워지는 과정에서 발생되는 충돌로 인한 흔들림을 감지하는 진동센서(230)가 설치된다. 한편, 설비 밖에는 상기 진동센서(230)로부터 출력되는 전기신호에 따라 알람을 발생하는 표시부(232)가 설치되어 있다. The purge storage 200 has a case 210 having an exhaust unit 212 through which residual gas is exhausted. Inside the case 210, a cassette 220 made up of at least three rods 222 having slots 224 into which a substrate is inserted is installed. In addition, the cassette 220 is provided with a vibration sensor 230 that detects shaking due to a collision generated in the process of inserting the substrate into the slot 224. On the other hand, outside the facility is provided with a display unit 232 for generating an alarm in accordance with the electrical signal output from the vibration sensor 230.

이와 같이, 본 발명의 퍼지 스토리지(200)는 기판 이송 아암(114)이 퍼지 스토리지의 카세트(220)에 형성된 슬롯(224)에 기판을 로딩하는 과정에서 기판이 로드(222)와 부딪치면서 치핑(chipping)이 발생하거나 스크래치가 발생할 경우 상기 진동센서(230)가 이를 감지하여 표시부(232)를 통해 표시된다. As described above, the purge storage 200 according to the present invention is chipped when the substrate bumps the rod 222 while the substrate transfer arm 114 loads the substrate into the slot 224 formed in the cassette 220 of the purge storage. When the chipping occurs or a scratch occurs, the vibration sensor 230 detects it and is displayed through the display unit 232.

이상과 같이, 상기 퍼지 스토리지는 여러 가지 모양을 가질 수 있으며, 본 실시예에서 도시된 형상에 국한되는 것은 아니며, 중요한 것을 퍼지 스토리지의 카세트에서 발생되는 진동을 감지하는 센서를 갖는데 그 특징이 있다. As described above, the purge storage may have a variety of shapes, and is not limited to the shape shown in the present embodiment, it is important to have a sensor for detecting the vibration generated in the cassette of the purge storage.                     

본 발명의 진동센서가 기판과 카세트간의 충돌 유무를 감지하여 그 이상 유무를 표시부를 통해 표시해 줌으로써 작업자가 신속하게 기판 충돌에 따른 적당한 조치를 취할 수 있는 것이다. The vibration sensor of the present invention detects the collision between the substrate and the cassette and displays the presence or absence through the display unit so that the operator can quickly take appropriate measures according to the substrate collision.

이상에서, 본 발명에 따른 퍼지 스토리지의 구성 및 작용을 상기한 설명 및 도면에 따라 도시하였지만 이는 예를 들어 설명한 것에 불과하며 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 다양한 변화 및 변경이 가능함은 물론이다. In the above, the configuration and operation of the fuzzy storage according to the present invention has been shown in accordance with the above description and drawings, but this is merely an example, and various changes and modifications are possible without departing from the spirit of the present invention. to be.

이와 같은 본 발명에 의하면, 진동센서가 기판과 카세트간의 충돌 유무를 감지하여 그 이상 유무를 표시부를 통해 표시해 줌으로써 작업자가 신속하게 기판 충돌에 따른 적당한 조치를 취할 수 있는 효과가 있다.
According to the present invention, the vibration sensor detects the collision between the substrate and the cassette and displays the presence or absence through the display unit, the operator can quickly take appropriate measures according to the substrate collision.

Claims (2)

반도체 제조 설비에서 공정처리된 기판 표면의 잔류 가스를 제거하는 퍼지 스토리지에 있어서:In purge storage, which removes residual gas from processed substrate surfaces in semiconductor manufacturing facilities: 일측에 잔류가스가 배기되는 배기부를 갖는 케이스;A case having an exhaust part through which residual gas is exhausted; 상기 케이스 내부에 설치되는 그리고 기판이 끼워지는 슬롯들을 갖는 적어도 3개의 로드들로 이루어지는 카세트;A cassette comprising at least three rods installed in the case and having slots into which a substrate is fitted; 상기 카세트에 부착되어 상기 기판이 상기 슬롯에 끼워지는 과정에서 발생되는 충돌을 감지하는 센서; 및A sensor attached to the cassette for detecting a collision generated while the substrate is inserted into the slot; And 상기 센서로부터 출력되는 전기신호에 따라 알람을 발생하는 표시부를 포함하는 것을 특징으로 하는 반도체 제조 설비의 퍼지 스토리지.And a display unit for generating an alarm in accordance with an electrical signal output from the sensor. 제1항에 있어서,The method of claim 1, 상기 센서는 진동센서인 것을 특징으로 하는 반도체 제조 설비의 퍼지 스토리지.The sensor is a fuzzy storage of the semiconductor manufacturing equipment, characterized in that the vibration sensor.
KR1020040076502A 2004-09-23 2004-09-23 Purge storage of semiconductor device fabrication equipment KR20060027626A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100745001B1 (en) * 2005-03-28 2007-08-02 동경 엘렉트론 주식회사 Processing apparatus and computer-readable recording medium

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100745001B1 (en) * 2005-03-28 2007-08-02 동경 엘렉트론 주식회사 Processing apparatus and computer-readable recording medium

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