JP2006278214A - Manufacturing method of functional board, functional board and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a functional board capable of flattening the top surfaces on the functional layers of all sizes even if the functional layers of different sizes are dried under the same condition, and to provide the functional board and electronic equipment. <P>SOLUTION: This invention relates to the manufacturing method of a functional board comprising a substrate and many functional layers of different sizes which are formed at each position corresponding to the multiple color elements on the substrate. This method includes the process wherein the substrate, on which many zones served as the color elements are formed, and the droplet discharge means having a nozzle for discharging liquid droplets are moved relatively, and liquid materials including solvents used for forming the predefined functional layers (spacer Ps, electron hole transport layer Ot, and light emitting layer Or) are discharged as liquid droplets from the nozzle to be selectively applied to those multiple zones; and the process wherein the functional layers are formed by drying the liquid materials applied to the zones for forming the functional layers. Depending on the size of the functional layers, the solvents with different vapor pressure at normal temperature are selectively used as those liquid materials for forming the functional layers. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a function plate manufacturing method, a function plate, and an electronic apparatus.

2. Description of the Related Art Conventionally, an organic EL (electroluminescence) display device (organic EL display) is mounted as a display module on a portable electronic device such as a mobile phone or a PDA.
The light emitting layer of such an organic EL display device is formed by a so-called ink jet method (see, for example, Patent Document 1). That is, it is formed by discharging and applying a liquid material for forming a light emitting layer as droplets from a nozzle and drying. Thereby, compared with the case where it forms by a photolithographic process, there exists an advantage that the number of manufacturing processes reduces and productivity can be improved.

In addition, for a light emitting layer with a low luminance or a light emitting layer with a short lifetime, the luminance and the lifetime are improved by increasing the pixel size as compared with the light emitting layers of other colors. It is known that it can be.
In the formation of the light emitting layer by the ink jet method, a plurality of light emitting layers having different sizes (pixel sizes) are simultaneously dried under the same conditions in order to shorten the manufacturing time.

By the way, it is preferable that the light emitting layer has a uniform thickness, and the upper surface (upper surface) of the light emitting layer is preferably a flat surface. However, if the size of the light emitting layer (pixel size) is different, the drying speed (drying) Easiness) is different (the larger the size of the light emitting layer, the slower the drying speed), so when there are multiple light emitting layers of different sizes, it is difficult to make all the upper surfaces of these light emitting layers flat. It is.
That is, for example, when there are large and small light emitting layers, if drying is performed under optimum drying conditions for the small light emitting layer, the drying speed is too slow for the large light emitting layer, and the large light emitting layer The upper surface does not become a flat surface but becomes a curved convex surface. On the other hand, when drying is performed under optimum drying conditions for a large light emitting layer, the drying speed is too high for a small light emitting layer, and the upper surface of the small light emitting layer is not a flat surface but a curved concave surface. End up.
Therefore, it is common to perform drying under a drying condition that is approximately intermediate between the optimal drying condition for the small light emitting layer and the optimal drying condition for the large light emitting layer. The upper surface of the small light emitting layer is a curved concave surface.

Japanese Patent Laid-Open No. 11-54270

  An object of the present invention is to provide a functional plate manufacturing method and a functional plate capable of making the upper surface (upper surface) of functional layers of all sizes flat even when functional layers of different sizes are dried under the same conditions. And providing electronic equipment.

Such an object is achieved by the present invention described below.
The method for producing a functional plate of the present invention is a method for producing a functional plate comprising a base and a plurality of functional layers having different sizes, each formed on a portion corresponding to a plurality of color elements on the base.
A liquid material for forming a predetermined functional layer containing a solvent is relatively moved by moving a substrate on which a plurality of sections to be color elements are formed and a droplet discharge means having a nozzle for discharging droplets, Selectively ejecting the plurality of compartments by discharging them as droplets from a nozzle;
Drying the liquid material for forming a functional layer applied to the section to form a functional layer,
Depending on the size of the functional layer, the solvent for the liquid material for forming the functional layer may be selected from those having different vapor pressures at room temperature.
As a result, even when functional layers of different sizes are dried under the same conditions, the upper surface (upper surface) of functional layers of all sizes is made flat, that is, the film thickness (layer thickness) varies. Can be prevented.

In the method for producing a functional plate of the present invention, it is preferable to select and use a solvent having a higher vapor pressure at room temperature as the solvent used for the liquid material for forming the functional layer as the size of the functional layer is larger.
Thereby, the upper surface (upper surface) of the functional layers of all sizes can be made flat more reliably.

In the method for producing a functional plate of the present invention, it is preferable that the liquid material for forming the functional layer provided to the section is dried under reduced pressure.
Thereby, the drying rate of a liquid material can be raised and the effect which prevents the variation in film thickness is exhibited more notably.
In the method for producing a functional plate of the present invention, the liquid material for forming the functional layer preferably contains two or more kinds of solvents as the solvent.
For example, by including two or more types having different boiling points, particularly those having a relatively high boiling point and those having a relatively high boiling point, it is possible to stably discharge droplets from the nozzle, Smooth drying of the (liquid material) can be achieved.

In the method for producing a functional plate of the present invention, the functional layer is a light emitting layer,
The liquid material for forming the functional layer is a liquid material for forming the light emitting layer,
The functional plate is preferably an organic electroluminescence display device.
The present invention is suitable for application to the production of various functional plates, but is particularly suitable for application to the production of an organic electroluminescence display device.

In the method for producing a functional plate of the present invention, the light emitting layers of red, green and blue are included,
It is preferable to select and use the solvent having the largest vapor pressure at room temperature as the solvent of the liquid material for forming the light emitting layer of the blue light emitting layer, which has the largest blue light emitting layer.
Since many constituent materials of the blue light-emitting layer, that is, the blue light-emitting material have a relatively short lifetime (durability), the present invention particularly forms the blue light-emitting layer larger than the light-emitting layers of other colors. It is suitable for application to an organic electroluminescence display device.

In the method for producing a functional plate of the present invention, the light emitting layers of red, green and blue are included,
It is preferable to select and use the solvent of the liquid material for forming the light emitting layer of the red light emitting layer having the largest vapor pressure at room temperature.
The present invention is suitable for application to an organic electroluminescence display device in which a light emitting layer of a specific color is formed larger than light emitting layers of other colors.

In the method for producing a functional plate of the present invention, the light emitting layers of red, green and blue are included,
It is preferable to select and use the solvent having the largest vapor pressure at room temperature as the solvent of the liquid material for forming the light emitting layer of the green light emitting layer, which has the largest green light emitting layer.
The present invention is suitable for application to an organic electroluminescence display device in which a light emitting layer of a specific color is formed larger than light emitting layers of other colors.
In the method for producing a functional plate of the present invention, the light emitting layer has a plurality of colors, and the size of the light emitting layer is different for each color.
As the solvent for the liquid material for forming the light emitting layer of the largest light emitting layer, it is preferable to select and use a solvent having the highest vapor pressure at room temperature.
The present invention is suitable for application to an organic electroluminescence display device in which a light emitting layer of a specific color is formed larger than light emitting layers of other colors.

In the method for producing a functional plate of the present invention, the functional layer is a color filter,
The liquid material for forming the functional layer is a liquid material for forming a color filter,
The functional plate is preferably a substrate with a color filter.
The present invention is suitable for application to the production of various functional boards, but is particularly suitable for application to the production of a substrate with a color filter.

The functional plate of the present invention is a functional plate comprising a base and a plurality of functional layers of different sizes, each formed on a portion corresponding to a plurality of color elements on the base,
The functional layer is formed by discharging a liquid material for forming a predetermined functional layer containing a solvent having a vapor pressure selected according to the size of the functional layer as droplets from a nozzle and drying the liquid material. It is characterized by that.
Thereby, the variation in the film thickness of each functional layer is prevented, and a highly reliable functional board is obtained.
The electronic device of the present invention includes a functional plate manufactured by the method for manufacturing a functional plate of the present invention.
As a result, a highly reliable electronic device can be obtained.

DESCRIPTION OF EMBODIMENTS Hereinafter, a method for manufacturing a functional plate, a functional plate, and an electronic device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
<First Embodiment>
FIG. 1 is a plan view showing an embodiment of an organic EL display module having an organic EL (electroluminescence) display device (organic EL display) to which the functional plate of the present invention is applied, and FIG. 2 is a first view of the organic EL display device. Sectional drawing which shows the sub pixel corresponding to red among the sub pixels corresponding to each color of red, green, and blue formed on the glass substrate in embodiment, FIG. 3 is in 1st Embodiment of an organic electroluminescence display. FIG. 4 is a cross-sectional view showing an organic EL element, and FIG. 4 is a diagram for explaining light emission from a pixel circuit (subpixel corresponding to each color) corresponding to each color in the first embodiment of the organic EL display device. FIG. 6 is a diagram for explaining a method for forming a spacer in the first embodiment of the organic EL display device, and FIG. 6 is a method for forming a light emitting layer in the first embodiment of the organic EL display device. Description is a diagram for.

In the following description, for convenience of explanation, the upper side in FIGS. 1 and 2 is referred to as “upper”, the lower side as “lower”, the right side as “right”, and the left side as “left”. The upper side in FIGS. 3 to 6 is referred to as “upper” and the lower side is referred to as “lower”.
As shown in FIG. 1, the organic EL display module 10 includes an organic EL (electroluminescence) display device (organic EL display) 11, and a flexible substrate 12 is disposed below the organic EL display device 11 in the figure. Is connected.

In the present embodiment, the organic EL display device 11 is a top emission type (top emission structure) display device (display), and includes a glass substrate (substrate) 13 as a flat plate-like substrate. A rectangular display region 14 is formed at a substantially central position on the surface of the glass substrate 13 (pixel formation surface 13a).
In the display area 14, a plurality of data lines Ld extending in the vertical direction (column direction) in FIG. 1 and power supply lines Lv provided alongside the data lines Ld are arranged at a predetermined interval. A plurality of scanning lines Ls extending in a direction (row direction) orthogonal to the data line Ld are arranged at a predetermined interval. Sub-pixels 15R, 15G, and 15B respectively corresponding to red (R), green (G), and blue (B) are formed at positions where the data lines Ld and the scanning lines Ls intersect. That is, the subpixels 15R, 15G, and 15B are repeatedly arranged in a matrix by being connected to the corresponding data line Ld, power supply line Lv, and scanning line Ls, respectively. Then, the pixel circuit 15 is configured with the sub-pixels 15R, 15G, and 15B corresponding to red, green, and blue arranged repeatedly in order on the scanning line Ls as one set.

The pixel circuit 15 includes an organic EL element (organic electroluminescence element) 16 as an electro-optical element that emits light when supplied with a drive current, a thin film transistor (TFT) 17 that controls light emission of the organic EL element 16, and It has a capacitor element (not shown).
In this embodiment, the organic EL element 16 for red and the organic EL element 16 for green are provided with substantially the same size (pixel size), and the organic EL element 16 for blue is larger than these (pixel size). (Pixel size).

  A scanning line driving circuit 18 mounted by a COG (Chip on glass) method is formed on one side end of the pixel formation surface 13 a and on the left side of the display region 14. The scanning line driving circuit 18 outputs a scanning signal for selecting the sub-pixels 15R, 15G, and 15B on the scanning line Ls with respect to each scanning line Ls. The scanning line driving circuit 18 is connected to a printed circuit board (not shown), and sends the scanning signal to a predetermined scanning line Ls at a predetermined timing based on a control signal output from a control IC or the like of the printed circuit board. It is designed to output. The scanning line driving circuit 18 and the display area 14 are protected by covering substantially the entire surface of the pixel formation surface 13a with a rectangular protective glass substrate 13b (two-dot chain line in FIG. 1).

  A data line terminal forming portion 19 is formed on one side end of the pixel forming surface 13a and below the display area. In the data line terminal forming portion 19, a plurality of data line terminals (not shown) corresponding to the respective data lines Ld are formed. Each data line terminal is, for example, a terminal formed of copper foil or the like, arranged at an equal pitch along the lower side 13c of the glass substrate 13, and electrically connected to the corresponding data line Ld. Yes. Each data line Ld can be electrically connected to the outside by exposing each data line terminal from the protective glass substrate 13b.

  As shown in FIG. 1, the flexible substrate 12 is connected to one side end of the pixel forming surface 13 a and the front side of the data line terminal forming portion 19. The flexible substrate 12 is provided with a substrate body 20. The substrate body 20 is a flexible substrate formed in a long shape in the vertical direction, and is formed of a polyimide resin or the like having electrical insulation. The flexible substrate 12 is arranged so that the surface (the back surface in FIG. 1) of the substrate body 20 faces the pixel forming surface 13a. An external terminal forming portion 23 is provided on the surface of the substrate body 20 at a position facing the data line terminal forming portion 19. In the external terminal forming portion 23, a plurality of connection terminals (not shown) are formed with a pitch width opposite to the data line terminals. The flexible substrate 12 is mounted on the organic EL display device 11 (organic EL display module 10) by electrically connecting each connection terminal and the corresponding data line terminal by a so-called anisotropic conductive film (ACF) method. The

A driving IC chip 27 is disposed below the external terminal forming portion 23. The driving IC chip 27 generates and supplies a driving signal and a driving voltage for causing the organic EL element 16 to emit light. The driving IC chip 27 is mounted on the substrate body 20 (flexible substrate 12) by the anisotropic conductive film (ACF) method.
Then, a connection terminal (not shown) formed on the output side (the organic EL display device 11 side) of the driving IC chip 27 and a connection terminal formed on the external terminal forming portion 23 are connected by the output wiring 30. Thus, the driving IC chip 27 is electrically connected to each data line Ld and the power supply line Lv. Further, a connection terminal (not shown) formed on the input side (lower side in FIG. 1) of the driving IC chip 27 and a control IC of a printed board (not shown) are connected by the input wiring 31, whereby the driving IC chip 27. Are electrically connected to the control IC.

The driving IC chip 27 supplies a driving voltage to the power supply line Lv and outputs a data signal to a predetermined data line Ld at a predetermined timing based on a control signal output from the control IC. That is, when the driving IC chip 27 outputs the data signal to the pixel circuit 15 (subpixels 15R, 15G, 15B) selected by the scanning signal, the organic EL of the pixel circuit 15 (subpixels 15R, 15G, 15B). The element 16 emits light based on the data signal.
As described above, the present embodiment is configured to perform full-color display by providing the subpixels 15R, 15G, and 15B corresponding to red, green, and blue, respectively.

Next, the sub-pixels 15R, 15G, and 15B will be described. These are the same except that the film thickness (thickness) of the anode Pc described later, that is, the spacer Ps, is different from each other and the constituent material of the light emitting layer Or is different. Therefore, the subpixel 15R will be typically described below (illustration and description of the subpixels 15G and 15B are omitted).
As shown in FIG. 2, the TFT 17 includes a channel film B1 in its lowermost layer. The channel film B1 is an island-shaped p-type polysilicon film formed on the pixel formation surface 13a, and activated n-type regions (source region and drain region) (not shown) are formed on the left and right sides in FIG. I have. That is, the TFT 17 is a so-called polysilicon type TFT.

  A gate insulating film D0, a gate electrode Pg, and a gate wiring M1 are formed in order from the pixel formation surface 13a side at the upper center position of the channel film B1. The gate insulating film D0 is a light-transmitting insulating film such as a silicon oxide film, for example, and is deposited on substantially the entire pixel formation surface 13a. The gate electrode Pg is, for example, a low-resistance metal film such as tantalum, and is formed at a substantially central position of the channel film B1. The gate wiring M1 is, for example, a transparent conductive film having optical transparency such as ITO, and electrically connects the gate electrode Pg and the driving IC chip 27 (see FIG. 1). When the driving IC chip 27 inputs a data signal to the gate electrode Pg via the gate wiring M1, the TFT 17 is turned on based on the data signal.

  A source contact Sc and a drain contact Dc extending upward in FIG. 2 are formed on the channel film B1 above the source region and the drain region. Each contact Sc, Dc is formed of, for example, a metal film such as a metal silicide that lowers the contact resistance with the channel film B1. The contacts Sc and Dc and the gate electrode Pg (gate wiring M1) are electrically insulated by a first interlayer insulating film D1 made of, for example, a silicon oxide film.

  On the upper side of each contact Sc and contact Dc, for example, a power supply line M2s and an anode line M2d made of a low-resistance metal film such as aluminum are formed. The power line M2s electrically connects the source contact Sc and a driving power source (not shown). The anode line M2d electrically connects the drain contact Dc and the organic EL element 16. The power supply line M2s and the anode line M2d are electrically insulated from each other by, for example, a planarizing film D2 made of an insulating material such as a silicon oxide film. Further, by forming the planarizing film D2, the organic EL element 16 formed on the planarizing film D2 can be planarized. When the TFT 17 is turned on based on the data signal, a drive current corresponding to the data signal is supplied from the power supply line M2s (drive power supply) to the anode line M2d (organic EL element 16).

As shown in FIG. 2, the organic EL element 16 is formed above the planarizing film D2. An anode (electrode) Pc is formed in the lowermost layer of the organic EL element 16.
As shown in FIG. 3, the anode Pc has a laminated structure of a reflective layer (light reflective layer) Pr and a spacer Ps as a light-transmitting conductive spacer laminated on the upper side.
Here, it is preferable that the light reflecting layer is arranged on the upper side of the planarizing film D2 and on the inner side of the partition wall D3a, on the anode Pc side (the electrode side located on the side opposite to the light emitting side). In the present embodiment, a part (a part of the lower layer) of the anode Pc (an electrode located on the side opposite to the light emission side) also serves as a light reflection layer. That is, a part of the reflective layer Pr constitutes a light reflective layer. In the present invention, the light reflecting layer may be composed of a member different from the anode Pc.

In the present embodiment, the reflective layer Pr is formed of a metal material such as Cr, for example. Although the film thickness (thickness) of the reflective layer Pr is appropriately set according to various conditions, for example, it is preferably about 20 to 500 nm, and more preferably about 50 to 200 nm.
The conductive spacer is preferably disposed on the upper side of the reflective layer Pr and on the inner side of the partition wall D3a and on the anode Pc side (the electrode side positioned opposite to the light emission side). In this embodiment, a part (upper layer) of the anode Pc (an electrode located on the side opposite to the light emission side) also serves as a conductive spacer. That is, the spacer Ps constitutes a conductive spacer. In the present invention, the conductive spacer may be composed of the anode Pc and a separate member.

  In the present embodiment, the spacer Ps is a transparent conductive film having optical transparency such as ITO, and is preferably formed with a film thickness of 10 nm or more, for example. In the present embodiment, the spacer Ps has a different thickness depending on each color. As shown in FIG. 4, the spacer Psb of the subpixel 15B corresponding to blue, and the spacer of the subpixel 15G corresponding to green. Psg is formed to be thicker in the order of the spacer Psr of the sub-pixel 15R corresponding to red.

  As shown in FIG. 2, one end of the anode Pc is connected to the anode line M2d. A third interlayer insulating film D3 is deposited on the upper outer periphery of the anode Pc so as to surround the anode Pc. The third interlayer insulating film D3 is formed of, for example, a resin film such as photosensitive polyimide or acrylic, and electrically insulates the anode Pc of each organic EL element 16. Further, the third interlayer insulating film D3 opens the upper side of the anode Pc to form a partition D3a composed of the inner peripheral surface thereof.

An organic electroluminescence layer (organic EL layer) Oe mainly made of an organic material is formed on the upper side of the anode Pc and inside the partition wall D3a. As shown in FIG. 3, the organic EL layer Oe is an organic compound layer composed of two layers of a hole transport layer Ot and a light emitting layer Or.
Although the film thickness of the positive hole transport layer Ot is suitably set according to various conditions, for example, it is preferably about 20 to 200 nm, and more preferably about 50 to 100 nm.

The light emitting layer Or is a light emitting layer that emits red light. Although the film thickness of the light emitting layer Or is suitably set according to various conditions, it is preferable to set it as about 20-200 nm, for example, and it is more preferable to set it as about 50-100 nm.
The light emitting layer Or of the subpixels 15G and 15B is a light emitting layer that emits green light and blue light, respectively.
Examples of the constituent material (light emitting material) of the light emitting layer Or include compounds as shown in the following chemical compounds 1 to 5, and the types of compounds to be used, the blending ratio when plural types are used, and the like. By setting, it is possible to have different emission colors, that is, red, green, and blue light emitting materials.

In the present embodiment, the red light emitting layer Or and the green light emitting layer Or have substantially the same size (planar area), and the blue light emitting layer Or has a larger size (planar area). Yes. Thereby, as described above, the organic EL element 16 for red and the organic EL element 16 for green are approximately equal in size, and the organic EL element 16 for blue is larger than these.
In other words, the space inside the red D3a and the space inside the green D3a are set to be approximately equal in size, and the space inside the blue D3a is set larger than this.

With such a configuration, even when a material having a relatively low life (durability) is used as a constituent material of the blue light emitting layer Or, the light emission luminance of the blue organic EL element 16 is different from that of other colors. It is possible to prevent the EL element 16 from decreasing earlier than the light emission luminance. As a result, it is possible to suitably prevent the display color of the organic EL display device 11 from changing over time.
In this embodiment, since the spacer Ps of the anode Pc and the hole transport layer Ot are also provided inside the partition wall D3a, these also correspond to the organic EL elements 16 (subpixels 15R, 15G, and 15B) of each color. And the size is different.

On the upper side of the organic EL layer Oe, a cathode (electrode) Pa is formed. The film thickness of the cathode Pa is appropriately set according to various conditions. For example, the thickness is preferably about 2 to 200 nm, and more preferably about 5 to 50 nm.
Moreover, the constituent material of cathode Pa will not be specifically limited if it has electroconductivity and light transmittance. In the present embodiment, the cathode Pa is configured, for example, by a laminated structure of a metal film such as an alloy of Mg and Ag in the lower layer and a transparent conductive film having light transmittance such as ITO in the upper layer.
In this case, the film thickness of the lower layer is appropriately set according to various conditions. For example, it is preferably about 2 to 200 nm, and more preferably about 5 to 50 nm. Moreover, although the film thickness of an upper layer is suitably set according to various conditions, it is preferable to set it as about 2-200 nm, for example, and it is more preferable to set it as about 5-50 nm.

As shown in FIG. 2, the cathode Pa is formed so as to cover the entire surface of the pixel formation surface 13 a and is shared by each pixel circuit 15 to supply a common potential to each organic EL element 16. .
As described above, the organic EL element 16 includes the anode Pc (the reflective layer Pr and the spacer Ps), the organic EL layer Oe, and the cathode Pa. A main portion of the color element is configured by a portion of the organic EL element 16 located inside the partition wall D3a. In the present embodiment, the spacer Ps, the hole transport layer Ot, and the light emitting layer Or located inside the partition wall D3a each constitute a functional layer.

As shown in FIG. 2, on the upper side of the cathode Pa, for example, a sealing part P1 is formed which is formed of a coating material such as resin and prevents oxidation of various metal films and the organic EL layer Oe. .
When a driving current corresponding to the data signal is supplied to the anode line M2d, the organic EL layer Oe emits light with a luminance corresponding to the driving current. At this time, the light emitted from the organic EL layer Oe toward the cathode Pa (upper side in FIG. 2) is transmitted (passed) through the cathode Pa and the sealing portion P1 (hereinafter referred to as transmitted light). In addition, light emitted from the organic EL layer Oe toward the anode Pc side (the lower side in FIG. 2) is reflected by the reflection layer Pr of the anode Pc (hereinafter referred to as reflected light), and the spacer Ps and the organic EL layer Oe. It passes through the cathode Pa and the sealing part P1. And the light which the said transmitted light and reflected light interfered is radiate | emitted toward the protective glass substrate 13b side.

  Since the wavelength λ of the spectrum of the emitted light depends on the optical distances Lr, Lg, and Lb (see FIG. 4) that are the distances between the reflective layer Pr and the cathode Pa, it depends on each color (red, green, and blue). Accordingly, by changing (changing) the optical distances Lr, Lg, and Lb, the wavelength λ of light corresponding to each color can be obtained. In this embodiment, the optical distances Lr, Lg, and Lb are changed by forming spacers Ps (Psr, Psg, Psb) having different thicknesses according to the respective colors, and the wavelength λ of light corresponding to each color is obtained. Yes.

  As a result, as shown in FIG. 4, in the subpixel 15R corresponding to red having the longest light wavelength, the spacer Psr is made thickest so that the optical distance Lr becomes the longest. On the other hand, in the subpixel 15B corresponding to blue having the shortest light wavelength, the film thickness of the spacer Psb is made the thinnest so that the optical distance Lb is the shortest. Then, in the subpixel 15G corresponding to green whose light wavelength is between them, the film thickness of the spacer Psg is between the two so that the optical distance Lg is between them.

Next, a method for manufacturing the organic EL display device 11 (method for manufacturing a functional plate of the present invention) will be described.
First, the glass substrate 13 is prepared. Then, an amorphous silicon film is deposited on the entire surface of the pixel formation surface 13a on the glass substrate 13 by a CVD method using disilane or the like as a source gas. Next, the amorphous silicon film is irradiated with ultraviolet light by an excimer laser or the like to form a crystallized polysilicon film over the entire pixel formation surface 13a. Subsequently, the polysilicon film is patterned by a photolithography method, an etching method, or the like to form a channel film B1.

  When the channel film B1 is formed, a gate insulating film D0 is formed by depositing a silicon oxide film or the like on the channel film B1 and the entire upper surface of the pixel formation surface 13a by a CVD method using silane or the like as a source gas. When the gate insulating film D0 is formed, a low-resistance metal film such as tantalum is deposited on the entire upper surface of the gate insulating film D0 by sputtering or the like, and the low-resistance metal film is patterned to form a gate on the upper side of the gate insulating film D0. An electrode Pg is formed. When the gate electrode Pg is formed, an n-type region (source region and drain region) is formed in the channel film B1 by an ion doping method using the gate electrode Pg as a mask. Subsequently, a light-transmitting transparent conductive film such as ITO is deposited on the entire upper surface of the gate electrode Pg and the gate insulating film D0 by sputtering or the like, and the transparent conductive film is patterned to form an upper surface of the gate electrode Pg. A gate wiring M1 is formed.

  When the gate wiring M1 is formed, a silicon oxide film or the like is deposited on the entire upper surface of the gate wiring M1 and the gate insulating film D0 by a CVD method using TEOS (tetraethoxysilane) or the like as a raw material to form a first interlayer insulating film D1. . When the first interlayer insulating film D1 is formed, a pair of circular holes (contact holes Hd) that open from the source region and the drain region to the upper side of the first interlayer insulating film D1 in FIG. , Hs). When the contact holes Hd and Hs are formed, a metal film is deposited on the entire upper surface of the first interlayer insulating film D1 while filling the contact holes Hd and Hs with metal silicide or the like by sputtering or the like. Then, the metal film other than those in the contact holes Hd and Hs is removed by an etching method or the like to form the source contact Sc and the drain contact Dc.

  When each contact Sc, Dc is formed, a metal film such as aluminum is deposited on the entire upper surface of each contact Sc, Dc and first interlayer insulating film D1 by sputtering or the like, and the metal film is patterned to form each contact Sc, Dc. A power supply line M2s and an anode line M2d connected to are formed. Next, a planarizing film D2 is formed by depositing a silicon oxide film or the like on the entire upper surface of the power supply line M2s, the anode line M2d, and the first interlayer insulating film D1 by a CVD method using TEOS (tetraethoxysilane) or the like as a raw material. Form. Subsequently, a circular hole (via hole Hv) that opens from a part of the anode line M2d to the upper side in FIG. 2 to the upper side of the planarizing film D2 is formed by a photolithography method, an etching method, or the like. When the via hole Hv is formed, a metal film such as chromium is deposited on the entire upper surface of the planarizing film D2 while filling the via hole Hv by sputtering or the like. Then, the metal film is patterned to form an anode Pc (reflection layer Pr) connected to the anode line M2d through the via hole Hv.

When the reflective layer Pr is formed, a mask such as a resist is formed on the reflective layer Pr, and a resin film such as photosensitive polyimide or acrylic is deposited on the entire upper surface of the reflective layer Pr and the planarizing film D2. Then, the resist and the like are removed to form a third interlayer insulating film D3 having a partition wall D3a.
Note that the glass substrate 13 and each component formed on the glass substrate 13 in each of the steps so far constitute a main part of the base on which a plurality of sections to be color elements are formed. Further, the inside of the partition wall D3a, that is, the recess defined (defined) by the partition wall D3a corresponds to the partition.

When the partition D3a is formed, the anode Pc (spacer Ps) is subsequently formed in the partition D3a.
Here, in this embodiment, the spacer Ps and the organic EL layer Oe (hole transport layer Ot, light emitting layer Or) are formed by a so-called inkjet method (droplet discharge method).
That is, the spacer Ps is formed by relatively moving the glass substrate 13 (base) and a droplet discharge head 44 described later, and for forming a spacer including a conductive material (for example, ITO) as a constituent material of the spacer Ps. The liquid material (liquid material for forming the functional layer) 51 is ejected as droplets from the nozzle N and selectively applied to the plurality of partitions D3a (partitions), and the spacers formed in the partitions D3a are formed. The liquid material 51 is dried and heated as necessary.

  Similarly, the hole transport layer Ot is formed by relatively moving the glass substrate 13 (base) and the droplet discharge head 44 to transport holes including an organic material as a constituent material of the hole transport layer Ot. A liquid material for forming a layer (a liquid material for forming a functional layer) is ejected as droplets from the nozzle N and selectively applied to the plurality of partition walls D3a (partitions), and holes are provided to the partition walls D3a. The liquid material for forming the transport layer is dried and heated as necessary.

  Similarly, the light emitting layer Or is formed by relatively moving the glass substrate 13 (base) and the droplet discharge head 44 to form a light emitting layer forming liquid containing an organic light emitting material as a constituent material of the light emitting layer Or. A material (liquid material for forming a functional layer) 52 is ejected as droplets from the nozzle N and selectively applied to the inside (partition) of the plurality of partition walls D3a. The liquid for forming the light emitting layer provided in the partition walls D3a. The material 52 is dried and heated as necessary.

First, the configuration of the droplet discharge device for forming the spacer Ps will be described. In addition, since the droplet discharge device for forming the organic EL layer Oe (hole transport layer Ot, light emitting layer Or) is the same as the droplet discharge device for forming the spacer Ps, the description thereof is as follows. Omitted.
As shown in FIG. 5, a droplet discharge head 44 constituting the main part of the droplet discharge means of the droplet discharge device is disposed above the glass substrate 13 (base). The droplet discharge head 44 is provided with a nozzle plate 45. A large number of nozzles N that discharge a liquid material 51 for forming a spacer containing a conductive material are provided on one side of the nozzle plate 45 on the side of the glass substrate 13 (nozzle formation surface 45a). Are formed so as to be substantially parallel to the vertical direction Z. The glass substrate 13 is placed on a stage (not shown) of the droplet discharge device so that the pixel formation surface 13a is parallel to the nozzle formation surface 45a. Then, the stage (glass substrate 13) and the droplet discharge head 44 are relatively moved so that the center positions of the partition walls D3a on the glass substrate 13 are opposed to the center positions of the nozzles N, respectively.

  On the upper side of each nozzle N, supply chambers 46R, 46G, and 46B that communicate with a storage tank (not shown) and can supply the liquid material 51 for forming spacers into the nozzle N correspond to red, green, and blue colors, respectively. Is formed. Above each of the supply chambers 46R, 46G, and 46B, a vibration plate 47 that reciprocally vibrates along the vertical direction Z to expand and reduce the volume in each of the supply chambers 46R, 46G, and 46B is disposed. Piezoelectric elements 48R, 48G, and 48B that expand and contract along the vertical direction Z to vibrate the diaphragm 47 are positioned above the diaphragm 47 and facing the supply chambers 46R, 46G, and 46B. They are arranged corresponding to the respective colors of red, green and blue.

Next, a method for forming the spacer Ps by the above-described droplet discharge device will be described.
First, a drive signal is input to form the spacer Ps in the droplet discharge head 44. Then, the piezoelectric elements 48R, 48G, and 48B are expanded and contracted based on the drive signal, and the volumes of the supply chambers 46R, 46G, and 46B are enlarged and reduced, respectively. At this time, when the volume of each of the supply chambers 46R, 46G, and 46B is reduced, the liquid material 51 for spacer formation corresponding to the reduced volume is discharged and applied as a droplet Ds from each nozzle N to the corresponding partition D3a. . Subsequently, when the volumes of the supply chambers 46R, 46G, and 46B are enlarged, the liquid material 51 for forming spacers corresponding to the enlarged volumes is supplied from supply tanks (not shown) into the supply chambers 46R, 46G, and 46B, respectively.

  In other words, the droplet discharge head 44 enlarges or reduces each of the supply chambers 46R, 46G, and 46B, thereby for each color, a predetermined amount corresponding to the target film thickness of the spacer Ps (Psr, Psg, Psb). The spacer forming liquid material 51 is discharged and applied into the partition wall D3a. The spacer forming liquid material 51 provided in the partition wall D3a is allowed to stand for a predetermined time to dry the spacer forming liquid material 51, and then the glass substrate 13 is conveyed to a baking chamber (not shown) and baked. By conducting (heating), conductive spacers Ps (Psr, Psg, Psb) are formed with different target film thicknesses for each color.

  As described above, by using the inkjet method, for example, a plurality of photolithography steps for changing the film thickness for each color can be performed as in the case of forming the spacers Ps (Psr, Psg, Psb) by the photolithography method. Since it becomes unnecessary, a manufacturing process can be reduced and productivity can be improved. Further, since a desired amount of the liquid material 51 for spacer formation can be applied to a desired position, the amount of the liquid material 51 for spacer formation to be used is larger than when the spacer Ps is formed by a photolithography process. (For example, it is not necessary to remove unnecessary portions by etching or the like), and the spacer Ps having a desired film thickness can be quickly and reliably formed at a desired position.

When the spacer Ps is formed, a liquid material for forming a hole transport layer containing an organic material as a constituent material of the hole transport layer Ot is ejected as droplets onto the spacer Ps surrounded by the partition wall D3a by the inkjet method. The hole transport layer Ot is formed by applying and drying and solidifying (heating) the liquid material.
Further, by the ink jet method, a light emitting layer forming liquid material 52 containing an organic light emitting material as a constituent material of the light emitting layer Or is formed on the hole transport layer Ot surrounded by the partition wall D3a as shown in FIG. The light emitting layer Or is formed by discharging and applying the droplet Ds and drying and solidifying (heating) the liquid material. Thereby, the organic EL layer Oe including the hole transport layer Ot and the light emitting layer Or is formed.

As described above, by using the ink jet method, the same effect as described in the formation of the spacer Ps can be obtained.
Here, in general, a liquid material for forming a functional layer (hereinafter simply referred to as “liquid material”) used for forming these functional layers (spacer Ps, hole transport layer Ot, organic EL layer Oe). The same solvent (or dispersion medium) is used regardless of the size (pixel size).

However, when the size of the functional layer is different, the drying speed of the liquid material is different for each functional layer. Therefore, when drying is performed under the same conditions (when dried simultaneously), the upper surface of the functional layer having a large size is flat. The tendency to not become high, and the characteristics of the functional layer tend to be lowered.
Therefore, in the present invention, depending on the size of the functional layer, the liquid material solvent is selected with a different vapor pressure at room temperature. In addition, a dispersion medium is also contained in the solvent said here. Hereinafter, “vapor pressure at normal temperature” is referred to as “vapor pressure (normal temperature)” or simply “vapor pressure”.

In this embodiment, the solvent having the highest vapor pressure is selected and used as the solvent for the liquid material used for forming the largest blue organic EL element 16. In addition, as the solvent of the liquid material used for forming the organic EL elements 16 for red and green having substantially the same size, those having the same or substantially the same vapor pressure are selected and used.
Thereby, even when these functional layers having different sizes are formed, it is possible to suppress a difference in the drying speed of the liquid material corresponding to each functional layer even if they are simultaneously dried. For this reason, in any functional layer having a different size, it is possible to prevent the upper surface from being closer to a plane, that is, to prevent variations in film thickness (layer thickness). As a result, it is possible to suitably prevent the deterioration of characteristics caused by the variation in film thickness.

In addition, since many constituent materials of the blue light-emitting layer Or, that is, the blue light-emitting material have a relatively short life (durability), the present invention is particularly suitable for the blue light-emitting layer Or to emit light of other colors. It is suitable for application to the organic EL display device 11 formed larger than the layer Or.
When the sizes of the red, green, and red organic EL elements 16 (functional layers) are all different, the larger the functional layer size, the more the vapor pressure ( What has a large (normal temperature) may be selected and used. Thereby, the same effect as described above can be obtained.

  Examples of the solvent include inorganic solvents such as water, carbon disulfide, and carbon tetrachloride, methyl ethyl ketone (MEK), acetone, diethyl ketone, methyl isobutyl ketone (MIBK), methyl isopropyl ketone (MIPK), cyclohexanone, and 3-heptanone. , Ketone solvents such as 4-heptanone, methanol, ethanol, n-propanol, isopropanol, n-butanol, i-butanol, t-butanol, 3-methyl-1-butanol, 1-pentanol, 2-pentanol, Al such as n-hexanol, cyclohexanol, 1-heptanol, 1-octanol, 2-octanol, 2-methoxyethanol, allyl alcohol, furfuryl alcohol, phenol, ethylene glycol, diethylene glycol (DEG), glycerin, etc. Solvent, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, 1,2-dimethoxyethane (DME), 1,4-dioxane, tetrahydrofuran (THF), tetrahydropyran (THP), anisole, diethylene glycol dimethyl ether ( Diglyme), ether solvents such as diethylene glycol ethyl ether (carbitol), 2-methoxyethanol, cellosolv solvents such as methyl cellosolve, ethyl cellosolve, phenyl cellosolve, hexane, pentane, heptane, cyclohexane, methylcyclohexane, octane, didecane, Aliphatic hydrocarbon solvents such as methylcyclohexane and isoprene, benzene, toluene, xylene, mesitylene (1,3,5-trimethylbenzene), 1 Aromatic hydrocarbon solvents such as 2,3,4-tetramethylbenzene, ethylbenzene, diethylbenzene, cyclohexylbenzene, dodecylbenzene, naphthalene, pyridine, pyrazine, furan, pyrrole, thiophene, 2-methylpyridine, 3-methylpyridine, Aromatic heterocyclic compound solvents such as 4-methylpyridine, methylpyrrolidone, furfuryl alcohol, amide solvents such as N, N-dimethylformamide (DMF), N, N-dimethylacetamide (DMA), dichloromethane, chloroform, Halogenated solvents such as 1,2-dichloroethane, trichloroethylene, chlorobenzene, acetylacetone, ethyl acetate, methyl acetate, isopropyl acetate, isobutyl acetate, isopentyl acetate, ethyl chloroacetate, butyl chloroacetate, Ester solvents such as isobutyl chloroacetate, ethyl formate, isobutyl formate, ethyl acrylate, ethyl methacrylate, ethyl benzoate, amine solvents such as trimethylamine, hexylamine, triethylamine, aniline, acetonitrile, propionitrile, acrylonitrile, etc. Examples include nitrile solvents, nitro solvents such as nitromethane and nitroethane, and organic solvents such as aldehyde solvents such as acetaldehyde, propionaldehyde, butyraldehyde, pentanal, and acrylic aldehyde. These are used alone or as a mixed solvent containing them. be able to.

From these, the solvent to be used may be appropriately selected according to the size of the functional layer.
In the case of a mixed solvent, the vapor pressure (mmHg) is represented by La Wool's law, that is, the sum of the products of the vapor pressure of each pure solvent and the molar fraction in the mixed solvent.
Further, it is preferable that one liquid material contains two or more kinds of solvents, that is, a mixed solvent is used as the solvent. Thereby, it becomes easy to set the difference in the drying speed of the liquid material in the functional layers having different sizes small. Further, in each functional layer, it is easy to prepare a solvent so that the film thickness can be prevented from varying.

When a mixed solvent is used as the solvent, it is particularly preferable to use a mixture of two or more solvents having different boiling points. For example, clogging of the nozzle N can be prevented by using a solvent having a relatively high boiling point (for example, 180 ° C. or higher). Further, by using a medium boiling point (for example, about 140 to 170 ° C.), the drying speed of the liquid material can be increased (improved). By mixing and using these two types, it is possible to stably discharge the droplets from the nozzle N due to their synergistic effect, and to smoothly discharge the droplets (liquid material). Drying can be achieved.
The applied liquid material may be dried under normal pressure, but is preferably performed under reduced pressure. Thereby, the drying rate of a liquid material can be raised and the effect which prevents the variation in film thickness is exhibited more notably.

  When the organic EL layer Oe is formed, a metal film such as aluminum is deposited on the entire upper surface of the organic EL layer Oe and the third interlayer insulating film D3 by sputtering or the like to form the cathode Pa. When the cathode Pa is formed, a sealing material P1 is formed and sealed by depositing a coating material such as resin on the entire upper surface of the cathode Pa by a CVD method or the like. As a result, the pixel circuit 15 (subpixels 15R, 15G, and 15B) including the organic EL element 16 is formed on the pixel formation surface 13a.

As described above, according to the present invention, even when functional layers such as the spacer Ps, the hole transport layer Ot, and the organic EL layer Oe have different sizes depending on the emission color, their upper surfaces are made flat. That is, it is possible to prevent variation in the film thickness, and to prevent deterioration in characteristics (light emission efficiency and durability) caused by the variation in film thickness.
In the above-described embodiment, the glass substrate (substrate) 13 has light transmission properties (although it is transparent), but the substrate is not limited thereto, and the substrate is made of, for example, light transmission made of stainless steel or the like. It may be a non-transparent (not transparent) substrate. Moreover, the constituent material of the substrate may have light transmissivity other than glass.

Further, in the present embodiment, the case where the blue organic EL element 16 (light emitting layer) is the largest has been described, but the present invention relates to a red organic EL element 16 (light emitting layer), a green organic EL element 16 ( The same applies to the case where the light emitting layer is the largest.
Furthermore, the present invention can also be applied to a case where the organic EL elements 16 (light emitting layers) of other colors such as white are provided and the sizes of the organic EL elements 16 are different.

<Second Embodiment>
Next, a second embodiment of an organic EL (electroluminescence) display device and a method for manufacturing the organic EL display device will be described.
FIG. 7 is a cross-sectional view showing a sub-pixel (organic EL element) corresponding to red in the second embodiment of the organic EL display device.

In the following description, for convenience of explanation, the upper side in FIG. 7 is referred to as “upper”, the lower side as “lower”, the right side as “right”, and the left side as “left”.
Hereinafter, the organic EL display device 11 of the second embodiment will be described with a focus on the differences from the first embodiment described above, and description of similar matters will be omitted.
As shown in FIG. 7, the organic EL display device 11 of the second embodiment is a bottom emission type (bottom emission structure) display device.

Further, the anode Pc is formed of, for example, ITO or the like, and is preferably formed with a film thickness of 10 nm or more, for example. The film thickness of the anode Pc is adjusted for each pixel circuit 15 (subpixel 15R, 15G, 15B) corresponding to each color by adjusting the discharge amount of the functional liquid discharged from the nozzle N of the droplet discharge device. Use different target film thicknesses.
Then, by varying (changing) the optical distances Lr, Lg, and Lb that are the distances between the cathode Pa and the anode Pc, the wavelength λ of light corresponding to each color can be obtained.

The film thickness of the cathode Pa is appropriately set according to various conditions. For example, it is preferably about 5 to 500 nm, and more preferably about 100 to 200 nm.
Moreover, the constituent material of cathode Pa will not be specifically limited if it has electroconductivity and light reflectivity. In the present embodiment, for example, the cathode Pa has a laminated structure of a metal film such as an alloy of Mg and Ag in the lower layer and a metal film such as Al in the upper layer.

In this case, although the film thickness of a lower layer is suitably set according to various conditions, for example, it is preferably about 2 to 50 nm, and more preferably about 5 to 30 nm. Moreover, although the film thickness of an upper layer is suitably set according to various conditions, it is preferable to set it as about 5-500 nm, for example, and it is more preferable to set it as about 50-200 nm.
Here, a part of the cathode Pa (electrode located on the side opposite to the light emitting side) also serves as the light reflecting layer. That is, a part of the cathode Pa constitutes a light reflection layer.

In the present invention, the light reflecting layer may be composed of a member different from the anode Pc. That is, in this bottom emission structure, the cathode Pa is composed of a light-transmitting electrode, and a reflection layer (light reflection layer) made of a metal material such as Cr is formed on the opposite side of the cathode Pa from the light emitting layer Or. Also good.
According to the second embodiment, the same effects as those of the first embodiment described above can be obtained.

<Third Embodiment>
Next, a third embodiment of an organic EL (electroluminescence) display device and a method for manufacturing the organic EL display device will be described.
FIG. 8 is a cross-sectional view showing an organic EL element in the third embodiment of the organic EL display device of the present invention.

In the following description, for convenience of explanation, the upper side in FIG. 8 is referred to as “upper” and the lower side is referred to as “lower”.
Hereinafter, the organic EL display device 11 of the third embodiment will be described focusing on the differences from the first embodiment described above, and the description of the same matters will be omitted.
As shown in FIG. 8, the organic EL display device 11 of the third embodiment is a multiphoton structure display device in which organic EL elements 16 having a top emission structure are stacked.

The film thickness of the spacer Ps is different for each pixel circuit 15 (subpixel 15R, 15G, 15B) corresponding to each color by adjusting the discharge amount of the functional liquid discharged from the nozzle N of the droplet discharge device. Target film thickness.
Then, by varying (changing) the optical distances Lr, Lg, and Lb that are the distances between the cathode Pa and the anode Pc, the wavelength λ of light corresponding to each color can be obtained.

Further, the amount of photons generated by overlapping the multi-photon structure, that is, the organic EL layer Oe (light emitting layer Or) is increased, and an internal quantum efficiency equivalent to more than 100% is possible. As a result, while improving the color reproducibility, the organic EL display device 11 (organic EL element 16) having high luminance (bright) and long life can be manufactured with a small number of manufacturing steps.
According to the third embodiment, the same effects as those of the first embodiment described above can be obtained.

<Embodiment of Electronic Device of the Present Invention>
An image display device (electro-optical device) 1000 such as an electroluminescence display device as described above can be used for display portions of various electronic devices.
FIG. 9 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied.

In this figure, a personal computer 1100 includes a main body 1104 having a keyboard 1102 and a display unit 1106. The display unit 1106 is supported by the main body 1104 via a hinge structure so as to be rotatable. Yes.
In the personal computer 1100, the display unit 1106 includes an image display device 1000.

FIG. 10 is a perspective view showing a configuration of a mobile phone (including PHS) to which the electronic apparatus of the invention is applied.
In this figure, a cellular phone 1200 is provided with an image display device 1000 in a display unit, together with a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206.
FIG. 11 is a perspective view showing the configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, connection with an external device is also simply shown.

Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.
On the back of a case (body) 1302 in the digital still camera 1300, an image display device 1000 is provided in the display unit, and is configured to display based on an imaging signal from the CCD, and a finder that displays a subject as an electronic image. Function as.

A circuit board 1308 is installed inside the case. The circuit board 1308 is provided with a memory that can store (store) an imaging signal.
A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side of the case 1302 (on the back side in the illustrated configuration).
When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory of the circuit board 1308.

  In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory of the circuit board 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.

  The electronic apparatus according to the present invention includes, for example, a television, a video camera, a viewfinder type, and a monitor direct-view type video tape recorder, in addition to the above-described personal computer (mobile personal computer), mobile phone, and digital still camera. , Laptop personal computers, car navigation systems, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game machines, word processors, workstations, video phones, security TV monitors, electronic binoculars, POS terminals , Devices equipped with touch panels (for example, cash dispensers of financial institutions, automatic ticket vending machines), medical devices (for example, electronic thermometers, sphygmomanometers, blood glucose meters, electrocardiographic display devices, ultrasonic diagnostic devices, endoscope display devices), Fish finder, various measuring instruments, instruments (eg If, gages for vehicles, aircraft, and ships), a flight simulator, can be applied to various monitors, and the like.

As mentioned above, although the manufacturing method of the functional plate of the present invention, the functional plate, and the electronic device of the present invention were explained based on the illustrated embodiment, the present invention is not limited to this, and the configuration of each part is the same. It can be replaced with any configuration having the above function. Moreover, other arbitrary structures and processes may be added to the present invention.
Further, the present invention is not limited to application to the manufacture of an organic EL display device, and can be applied to manufacture of a substrate with a color filter provided in a liquid crystal display device or the like, for example. In this case, the functional layer corresponds to a color filter, the liquid material for forming the functional layer corresponds to a liquid material for forming a color filter, and the functional plate corresponds to a substrate with a color filter.
Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.

Hereinafter, specific examples of the present invention will be described.
In addition, the vapor pressure (room temperature) and boiling point (normal pressure) of the solvent used below are as follows, respectively.
-Mesitylene Vapor pressure: 1.73 mmHg, Boiling point: 165 ° C
Diethylbenzene vapor pressure: 0.70 mmHg, boiling point: 184 ° C
・ 1,2,3,4-tetramethylbenzene Vapor pressure: 0.23 mmHg, Boiling point: 197 ° C

Example 1
As shown in FIG. 12, a test substrate having a bank 200 formed on a glass substrate 100 was prepared.
Note that the size of the space (area) inside the bank 200 is set to red for> green for = blue.
<Sample No. 1A>
First, liquid materials for forming the light emitting layer of each color were prepared using the compounds 1, 2, and 5 as described above as the light emitting material. The composition of the liquid material for forming the light emitting layer of each color is as shown in Table 1 below.

Next, the liquid materials for forming each light emitting layer were simultaneously supplied to predetermined regions by three colors by an inkjet method.
Next, the liquid materials for forming the three color light emitting layers were simultaneously dried.
<Sample No. 1B>
As the liquid material for forming the light emitting layer of each color, sample nos. A light emitting layer was formed in the same manner as in 1A.

The film thickness of each of the obtained light emitting layers was measured using a stylus type step gauge (manufactured by KLA-Tencor, “P-15”).
And in each light emitting layer, the maximum film thickness difference of a center part and an edge part was calculated | required.
The results are shown in Table 3.

  Sample No. In 1A (the present invention), no variation in film thickness was observed in the light emitting layers of the respective colors. In contrast, sample no. In 1B (comparative example), a clear variation in film thickness was confirmed in the red light emitting layer.

(Example 2)
A test substrate similar to the test substrate shown in FIG. 12 was prepared.
Note that the size of the space (region) inside the bank 200 is set for green = for blue> red.
<Sample No. 2A>
First, liquid materials for forming the light emitting layer of each color were prepared using the compounds 1, 2, and 5 as described above as the light emitting material. The composition of the liquid material for forming the light emitting layer of each color is as shown in Table 4 below.

Next, the liquid materials for forming each light emitting layer were simultaneously supplied to predetermined regions by three colors by an inkjet method.
Next, the liquid materials for forming the three color light emitting layers were simultaneously dried.
<Sample No. 2B>
As the liquid material for forming the light emitting layer of each color, sample nos. A light emitting layer was formed in the same manner as 2A.

The film thickness of each light emitting layer obtained was measured using the same stylus type step gauge as described above.
And in each light emitting layer, the maximum film thickness difference of a center part and an edge part was calculated | required.
The results are shown in Table 6.

  Sample No. In 2A (the present invention), no variation in film thickness was observed in the light emitting layers of the respective colors. In contrast, sample no. In 2B (comparative example), clear film thickness variations were confirmed in the green and blue light-emitting layers.

(Example 3)
A test substrate similar to the test substrate shown in FIG. 12 was prepared.
Note that the size of the space (area) inside the bank 200 was set to red color = green color> blue color.
<Sample No. 3A>
First, liquid materials for forming the light emitting layer of each color were prepared using the compounds 1, 2, and 5 as described above as the light emitting material. The composition of the liquid material for forming the light emitting layer of each color is as shown in Table 7 below.

Next, the liquid materials for forming each light emitting layer were simultaneously supplied to predetermined regions by three colors by an inkjet method.
Next, the liquid materials for forming the three color light emitting layers were simultaneously dried.
<Sample No. 3B>
As the liquid material for forming the light emitting layer of each color, sample nos. A light emitting layer was formed in the same manner as 3A.

The film thickness of each light emitting layer obtained was measured using the same stylus type step gauge as described above.
And in each light emitting layer, the maximum film thickness difference of a center part and an edge part was calculated | required.
The results are shown in Table 9.

  Sample No. In 3A (the present invention), no variation in film thickness was observed in the light emitting layers of the respective colors. In contrast, sample no. In 3B (comparative example), clear variations in film thickness were confirmed in the red and green light emitting layers.

Example 4
A test substrate similar to the test substrate shown in FIG. 12 was prepared.
Note that the size of the space (region) inside the bank 200 was set to red color = blue color> green color.
<Sample No. 4A>
First, liquid materials for forming the light emitting layer of each color were prepared using the compounds 1, 2, and 5 as described above as the light emitting material. The composition of the liquid material for forming the light emitting layer of each color is as shown in Table 10 below.

Next, the liquid materials for forming each light emitting layer were simultaneously supplied to predetermined regions by three colors by an inkjet method.
Next, the liquid materials for forming the three color light emitting layers were simultaneously dried.
<Sample No. 4B>
As the liquid material for forming the light emitting layer of each color, sample nos. A light emitting layer was formed in the same manner as 4A.

The film thickness of each light emitting layer obtained was measured using the same stylus type step gauge as described above.
And in each light emitting layer, the maximum film thickness difference of a center part and an edge part was calculated | required.
The results are shown in Table 12.

  Sample No. In 4A (the present invention), no variation in film thickness was observed in the light emitting layers of the respective colors. In contrast, sample no. In 4B (comparative example), a clear variation in film thickness was confirmed in the red and blue light-emitting layers.

(Example 5)
As shown in FIG. 2 and FIG. 3, a laminate was prepared in which each layer was sequentially laminated on the glass substrate 13 and formed up to the hole transport layer Ot inside the partition wall D3a of the third interlayer insulating film D3.
In addition, the size of the space inside the partition D3a was set for red> green = blue.
Then, using this laminate, a light emitting layer Or is formed in the same manner as in Example 1 (Sample Nos. 1A and 2A), and then a cathode Pa and a sealing portion P1 are formed, and an organic EL display is formed. The device was completed.

When the two organic EL display devices manufactured were subjected to constant current driving at a current value with an initial luminance of 400 cd / m ² , sample No. 1 was obtained. It was confirmed that the organic EL display device (comparative example) produced in the same manner as 2A had a faster change in display color (decrease in red emission luminance).
This result is presumed to be caused by the variation in film thickness in the red light emitting layer as described above.

The top view which shows embodiment of the organic electroluminescent display module which has the organic electroluminescent (electroluminescence) display apparatus (organic electroluminescent display) to which the functional version of this invention is applied. Sectional drawing which shows the sub pixel in 1st Embodiment of an organic electroluminescence display. Sectional drawing which shows the organic EL element in 1st Embodiment of an organic EL display apparatus. The figure for demonstrating emission of the light from the pixel circuit (subpixel) in 1st Embodiment of an organic electroluminescent display apparatus. The figure for demonstrating the formation method of the spacer in 1st Embodiment of an organic electroluminescence display. The figure for demonstrating the formation method of the light emitting layer in 1st Embodiment of an organic electroluminescence display. Sectional drawing which shows the sub pixel (organic EL element) corresponding to red in 2nd Embodiment of an organic electroluminescence display. Sectional drawing which shows the organic EL element in 3rd Embodiment of an organic EL display apparatus. FIG. 14 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the invention is applied. The perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device of this invention is applied. FIG. 14 is a perspective view illustrating a configuration of a digital still camera to which the electronic apparatus of the invention is applied. Sectional drawing which shows the structure of the board | substrate for a test.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Organic EL display module 11 ... Organic EL display apparatus 13 ... Glass substrate 15 ... Pixel circuit 15R, 15G, 15B ... Subpixel 16 ... Organic EL element 44 ... Droplet discharge head Ds ... Droplet Lr, Lg, Lb ... Optical Distance Oe ... Organic EL layer Or ... Light emitting layer Ot ... Hole transport layer Pa ... Cathode Pc ... Anode Pr ... Reflective layer Ps, Psr, Psg, Psb ... Spacer 51 ... Liquid material for spacer formation 52 ... For light emitting layer formation Liquid material N ... Nozzle 100 ... Glass substrate 200 ... Bank

Claims (12)

A method for producing a functional plate, comprising: a base body; and a plurality of functional layers having different sizes, each formed on a portion corresponding to a plurality of color elements on the base body,
A liquid material for forming a predetermined functional layer containing a solvent is relatively moved by moving a substrate on which a plurality of sections to be color elements are formed and a droplet discharge means having a nozzle for discharging droplets, and containing a solvent. Selectively ejecting the plurality of compartments by discharging them as droplets from a nozzle;
Drying the liquid material for forming a functional layer applied to the compartment to form a functional layer,
According to the size of the functional layer, as a solvent for the liquid material for forming the functional layer, a solvent having a different vapor pressure at room temperature is selected and used.   The method for producing a functional plate according to claim 1, wherein the larger the size of the functional layer, the more the solvent used in the liquid material for forming the functional layer is selected and used with a higher vapor pressure at room temperature.   The method for producing a functional plate according to claim 1 or 2, wherein drying of the liquid material for forming a functional layer applied to the section is performed under reduced pressure.   The method for producing a functional plate according to any one of claims 1 to 3, wherein the liquid material for forming the functional layer includes two or more kinds as the solvent. The functional layer is a light emitting layer,
The liquid material for forming the functional layer is a liquid material for forming the light emitting layer,
The method for producing a functional plate according to claim 1, wherein the functional plate is an organic electroluminescence display device. Having the light emitting layer of red, green and blue,
6. The method for producing a functional plate according to claim 5, wherein the blue light emitting layer is the largest, and the liquid material for forming the light emitting layer of the blue light emitting layer is selected and used as the solvent having the highest vapor pressure at room temperature. . Having the light emitting layer of red, green and blue,
6. The method for producing a functional plate according to claim 5, wherein the red light emitting layer is the largest, and the liquid material for forming the light emitting layer of the red light emitting layer is selected and used with the highest vapor pressure at room temperature. . Having the light emitting layer of red, green and blue,
6. The method for producing a functional plate according to claim 5, wherein the green light emitting layer is the largest, and the liquid material for forming the light emitting layer of the green light emitting layer is selected and used with the highest vapor pressure at room temperature. . Having the light emitting layer of a plurality of colors, the size of the light emitting layer is different for each color,
The method for producing a functional plate according to claim 5, wherein a solvent having a maximum vapor pressure at room temperature is selected and used as a solvent for a liquid material for forming a light emitting layer of the largest light emitting layer. The functional layer is a color filter,
The liquid material for forming the functional layer is a liquid material for forming a color filter,
The method for producing a functional plate according to claim 1, wherein the functional plate is a substrate with a color filter. A functional plate formed on a portion corresponding to a plurality of color elements on the substrate, and having a plurality of functional layers of different sizes,
The functional layer is formed by discharging a liquid material for forming a predetermined functional layer containing a solvent having a vapor pressure selected according to the size of the functional layer as droplets from a nozzle and drying the liquid material. Functional board, characterized by being An electronic apparatus comprising a functional plate manufactured by the method for manufacturing a functional plate according to claim 1.

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