JP2006276696A - Drawing shift measuring method, exposure method, graduated pattern, graduated pattern drawing method, and graduated pattern drawing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To measure an amount of drawing shift of an image to be drawn by a drawing head in a drawing slippage measuring method with higher accuracy. <P>SOLUTION: In the drawing shift measuring method, each of different graduated patterns U1, U2 is drawn on a recording medium 1 by each of the drawing heads 10a-10d so that each of the graduated patterns U1, U2 having predetermined different pitches is drawn on one recording medium 1 in parallel by the different exposure heads 10a-10d and the amount of drawing shift is measured by comparing the graduated patterns U1, U2 drawn on the recording medium 1 with each other. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a drawing deviation measuring method, an exposure method, a scale pattern, a scale pattern drawing method, and a scale pattern drawing apparatus, and more particularly, drawing for measuring a drawing deviation amount between images drawn by each of a plurality of drawing heads. The present invention relates to a deviation measuring method and an exposure method in which exposure is performed by applying the drawing deviation measuring method, a scale pattern, a scale pattern drawing method, and a scale pattern drawing apparatus.

  2. Description of the Related Art Conventionally, as an example of a drawing apparatus that draws an image on a recording medium, a drawing apparatus having a plurality of exposure drawing heads equipped with a DMD (digital micromirror device) is known (Patent Literature). 1). Also, such a drawing apparatus is known that draws an image on the photosensitive material by conveying a drawing table on which a photosensitive material as a recording medium is placed in one direction under a drawing head. Yes. In the drawing apparatus, each drawing area by each drawing head is a rectangular (stripe) area extending in the direction in which the drawing table is conveyed.

In the above drawing apparatus, since images are drawn on the same photosensitive material using a plurality of drawing heads, it is necessary to adjust the positional deviation between the images drawn by each drawing head or the magnification deviation between the images. It becomes. In such a case, a test pattern over each image drawn by each drawing head is drawn on the photosensitive material, and the photosensitive material on which the test pattern is drawn is developed and observed with a microscope. A positional shift amount and a magnification shift amount (hereinafter also referred to as a drawing shift amount) are obtained, and the drawing shift between the images is corrected based on the drawing shift amount.
JP 2004-001244 A

  By the way, there is a demand for drawing a higher quality image using the drawing apparatus. Accordingly, there is a demand for reducing the positional deviation amount and magnification deviation amount between the images, that is, the drawing deviation amount, for example, to be several microns or less. However, it is difficult to measure a drawing error of several microns by observation with a microscope, and there is a demand for measuring the drawing deviation amount with higher accuracy and efficiency.

  The present invention has been made in view of the above circumstances, and exposure is performed by applying a drawing deviation measuring method capable of measuring a drawing deviation amount of an image drawn by a drawing head with higher accuracy and the drawing deviation measuring method. It is an object of the present invention to provide an exposure method, a scale pattern, a scale pattern drawing method, and a scale pattern drawing apparatus.

  The drawing deviation measuring method of the present invention is a drawing deviation measuring method for measuring a drawing deviation amount between images drawn by each of a plurality of drawing heads, and each of graduation patterns having mutually different predetermined pitches. Each of the scale patterns is drawn on the recording medium by each drawing head so that the drawing heads are drawn side by side by different drawing heads, and the scale pattern drawn on the recording medium is drawn. The drawing deviation amount is measured by comparing each of them.

  The exposure method of the present invention spatially modulates light emitted from a light source by each of a plurality of exposure heads each having a spatial light modulator in which a large number of modulation elements that modulate incident light are two-dimensionally arranged. Each of the obtained images is formed on a photosensitive material and exposed to the photosensitive material, and the drawing misalignment measuring method is used when the photosensitive material is exposed by the plurality of exposure heads. The amount of drawing deviation between each image formed by each of the exposure heads is measured by applying to the measurement of the amount of deviation, and between each image formed on the photosensitive material by each exposure head based on the amount of drawing deviation. This is characterized in that exposure of the photosensitive material by the exposure head is executed after correcting the drawing deviation.

  The graduation pattern of the present invention includes a first graduation pattern drawn at a reference position on the recording medium and a first graduation pattern aligned with the first graduation pattern by a drawing head to be measured. Is constituted by a second scale pattern drawn on the recording medium so that the scale pitches are different. The second scale pattern is drawn so that it can be compared with the first scale pattern.

  The first scale pattern may be drawn by another drawing head adjacent to the drawing head.

  The first scale pattern and the second scale pattern may be drawn on the recording medium in a manner corresponding to each of a caliper main scale and a vernier scale.

  The scale pattern drawing method of the present invention is arranged so that the first scale pattern is aligned with the first scale pattern drawn at the reference position on the recording medium by the drawing head to be measured, and the first scale pattern is the pitch of the scale. Is characterized in that it includes a step of drawing a second scale pattern on the recording medium so as to be different from each other. The second scale pattern is drawn so that it can be compared with the first scale pattern.

  The scale pattern drawing method may further include a step of drawing the first scale pattern by another drawing head adjacent to the drawing head.

  The first scale pattern and the second scale pattern may be drawn on the recording medium in a manner corresponding to each of a caliper main scale and a vernier scale.

  The scale pattern drawing apparatus of the present invention is arranged so that it is aligned with the first scale pattern drawn at the reference position on the recording medium by the drawing head to be measured, and the first scale pattern is the pitch of the scale. Is provided with a second scale drawing means for drawing a second scale pattern on the recording medium so that they are different from each other. The second scale pattern is drawn so that it can be compared with the first scale pattern.

  The scale pattern drawing device may further include first scale drawing means for drawing the first scale pattern by another drawing head adjacent to the drawing head.

  The first scale pattern and the second scale pattern may be drawn on the recording medium in a manner corresponding to each of a caliper main scale and a vernier scale.

  The “drawing side by side” means that drawing is performed in a state in which the scales of the scale patterns are aligned. In other words, it means that the drawing is performed in a state in which the directions indicating the pitches of the scale patterns coincide with each other. Each scale pattern is desirably drawn with the scales close to each other.

  The drawing deviation amount means a positional deviation amount and a magnification deviation amount between images drawn by a plurality of drawing heads.

  According to the drawing misalignment measuring method of the present invention, each drawing head allows each of the scale patterns having different predetermined pitches to be drawn side by side on the same recording medium by different exposure heads. Since each of the scale patterns is drawn on the recording medium, and each of the scale patterns drawn on the recording medium is compared to measure the amount of drawing deviation, each image drawn by each of a plurality of drawing heads It is possible to measure the amount of drawing deviation between them with higher accuracy. In addition, measurement can be easily performed and man-hours can be reduced.

  That is, when measuring the amount of misalignment, which is an example of the amount of misalignment, for example, each of the lines drawn side by side so that the scale positions match when rendering is performed without causing any misalignment. A zero scale can be set in the scale pattern, so that the amount of misalignment can be measured on the same principle as the measurement using the caliper main scale and the vernier scale. Here, the first scale pattern drawn by one drawing head corresponds to the caliper main scale, and the second scale pattern drawn by the other drawing head corresponds to the caliper minor scale. It is. Thereby, it is possible to measure the amount of deviation of the zero scale in the second scale pattern relative to the zero scale in the first scale pattern.

  Further, when measuring the magnification displacement amount which is an example of the drawing displacement amount, for example, as described above, the positional displacement obtained by the measurement using the same principle as the measurement using the caliper main scale and the vernier scale. The amount of magnification shift can be obtained by converting the amount.

  Details of the measurement of the positional deviation amount and the magnification deviation amount will be described later.

  The scale pattern of the present invention includes a first scale pattern drawn at a reference position on the recording medium and a first scale pattern aligned with the first scale pattern by a drawing head to be measured. Since the second scale pattern is drawn on the recording medium so that the scale pitches are different, the drawing deviation amount of the image drawn by the drawing head can be measured with higher accuracy. In addition, measurement can be easily performed and man-hours can be reduced.

  The graduation pattern drawing method of the present invention is arranged so that it is aligned with the first graduation pattern drawn at the reference position on the recording medium by the drawing head to be measured, and the pitch of the graduation is different from the first graduation pattern. Since the second scale pattern is drawn on the recording medium differently, the drawing deviation amount of the image drawn by the drawing head can be measured with higher accuracy. In addition, measurement can be easily performed and man-hours can be reduced.

  The scale pattern drawing apparatus of the present invention is arranged so that it is aligned with the first scale pattern drawn at the reference position on the recording medium by the drawing head to be measured, and the first scale pattern has a scale pitch. Since the second scale drawing means for drawing the second scale pattern on the recording medium is provided differently, the drawing deviation amount of the image drawn by the drawing head can be measured with higher accuracy. In addition, measurement can be easily performed and man-hours can be reduced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a conceptual diagram showing a drawing misalignment measuring method according to an embodiment of the present invention, FIG. 2 is a diagram showing an example of an area of each image drawn on a recording medium by each drawing head, and FIG. FIG. 4 and FIG. 5 are diagrams showing a state of measuring a positional deviation, and FIGS. 4 and 5 are diagrams showing a state of measuring a magnification deviation between images.

  In the illustrated drawing misalignment measuring method according to the embodiment of the present invention, a drawing misalignment amount between the images Ga, Gb, Gc... Drawn by each of the plurality of drawing heads 10a, 10b, 10c. Is.

  In the drawing misalignment measuring method, the scale patterns U1, U2 having different predetermined pitches are drawn side by side on the same recording medium 1 by different drawing heads 10a, 10b, 10c,. In addition, each of the scale patterns U1, U2 is drawn on the recording medium 1 by each of the drawing heads 10a, 10b, 10c,..., And each of the scale patterns U1, U2 drawn on the recording medium 1 is compared. The amount of drawing deviation is measured.

  Note that the scale patterns U1 and U2 drawn side by side are drawn so that the direction in which the scale pattern U1 is aligned and the direction in which the scale pattern U2 is aligned coincide with each other. That is, the drawing is performed so that the direction indicating the scale pitch of the scale pattern U1 and the direction indicating the scale pitch of the scale pattern U2 coincide with each other.

  The image Ga drawn by the drawing head 10a and the image Gb drawn by the drawing head 10b overlap each other in the drawing region Rab (shown by hatching in the drawing). Two scale patterns U1 in the drawing area Rab are drawn by the drawing head 10a, and two scale patterns U2 in the drawing area Rab are drawn by the drawing head 10b. Here, the scale pattern U1 is drawn in the image Ga, and the scale pattern U2 is drawn in the image Gb.

  Further, the image Gb drawn by the drawing head 10b and the image Gc drawn by the drawing head 10c overlap each other in the drawing region Rbc (shown by diagonal lines). Two scale patterns U2 in the image Gb adjacent to the drawing area Rbc that are out of the drawing area Rbc are drawn by the drawing head 10b, and the two scales in the drawing area Rbc drawn in the image Gb are drawn. The pattern U1 is drawn by the drawing head 10c.

  The drawing deviation measuring method may be applied to a method of drawing a part of each image overlappingly when drawing an image with different drawing heads as described above, or with each drawing head different from each other. You may apply to the system which draws an image in the area | region which mutually adjoins, without mutually overlapping.

  That is, for example, as shown in FIG. 2, images Ja, Jb, Jc, and Jd drawn on the recording medium 1 by different drawing heads are adjacent to each other without overlapping each other. Then, each of the scale patterns U1 in the image Ja is drawn so that each of the scale patterns U2 in the image Jb and the image Jc is aligned, and each of the scale patterns U1 in the image Jd, the image Jb, and the image Jb. It is also possible to draw the scale patterns U2 in Jc so that they are arranged, and compare the scale patterns U1 and U2 to measure the drawing deviation amount. Note that the scale patterns U1 and U2 drawn so as to be arranged adjacent to each other are drawn so that the direction in which the scale pattern U1 is aligned and the direction in which the scale pattern U2 is aligned coincide with each other.

  The measurement of the drawing deviation amount will be described in detail below.

  Since the measurement principle of the drawing deviation amount is the same for the scale patterns U1 and U2 drawn in any of the above modes, the scale patterns U1 and U2 drawn in the drawing region Rab will be described as an example.

  First, the measurement of the positional deviation amount will be described. In the following description, it is assumed that the image Ga drawn by the drawing head 10a and the image Gb drawn by the drawing head 10b are both drawn without causing a magnification shift.

  As shown in FIG. 3, a scale pattern U1 (hereinafter referred to as a scale pattern U1y) indicating the pitch in the direction of arrow Y in the image Ga drawn by the drawing head 10a in the drawing area Rab on the recording medium 1, A scale pattern U2 (hereinafter referred to as a scale pattern U2y) indicating the pitch in the arrow Y direction in the drawing in the image Gb drawn by the drawing head 10b is arranged. The scale pattern U1y indicates a scale with a pitch of 45 μm composed of a line with a width of 20 μm and a space with a width of 25 μm. On the other hand, the scale pattern U2y indicates a scale with a pitch of 46 μm constituted by a line having a width of 20 μm and a space having a width of 26 μm.

  Also, the zero scale Y1 (0) in the scale pattern U1y and the zero scale Y2 (0) in the scale pattern U2y are positioned relative to each other when the images Ga and Gb are drawn without any drawing displacement. Are set to match.

  Here, according to the same principle as the measurement using the caliper main scale and the vernier scale, for example, the scale pattern U2y that coincides with the scale in the scale pattern U1y closest to the zero scale Y1 (0) in the scale pattern U1y. The middle scale is the scale Y2 (7). That is, the scale Y2 (7) is the seventh scale shifted by 7 scales from the zero scale Y2 (0) in the scale pattern U2y, whereby the image Gb is in the −Y direction with respect to the image Ga. It can be seen that the deviation is 7 μm.

  By the above method, it is possible to measure a relative positional deviation amount between images drawn by different drawing heads. For example, a main scale is drawn on the recording medium 1 in advance, and a vernier is drawn by the drawing head 10 to be measured in correspondence with the position of the main scale, so that the drawing head 10 to be measured is drawn. You may make it measure position shift.

  Next, an example of measuring the magnification deviation will be described.

  Here, the position of the edge Fga on the left side (the −X direction side in FIG. 1) of the image Ga drawn on the recording medium 1 by the drawing head 10a and the left side of the image Gb drawn on the recording medium 1 by the drawing head 10b. The positional relationship with the position of the edge Fgb on the −X direction side in FIG. 1 is always constant. That is, the edge Fga and the edge Fgb are reference positions when the images Ga and Gb are drawn, and are drawn on the recording medium 1 in parallel with each other so that the distance between them is 65 mm. Shall. Further, the scale pattern U1 drawn in the image Ga is located at the right end (+ X direction side in FIG. 1) in the image Ga and is away from the edge Fga. On the other hand, the scale pattern U2 drawn in the image Gb is located at the left end (−X direction side in FIG. 1) in the image Gb, and is located in the vicinity of the edge Fgb. The magnification shift amount of the image Ga is measured under the above conditions.

  As shown in FIG. 1 and FIG. 4 showing an enlarged part of FIG. 1, an arrow in the figure orthogonal to the Y direction in the image Ga drawn by the drawing head 10a in the drawing region Rab on the recording medium 1 A scale pattern U1 (hereinafter referred to as a scale pattern U1x) indicating the pitch in the X direction, and a scale pattern U2 (hereinafter referred to as a scale pattern U2x) indicating a pitch in the arrow X direction in the image Gb drawn by the drawing head 10b. Are lined up. The scale pattern U1x indicates a scale with a pitch of 45 μm composed of a line with a width of 20 μm and a space with a width of 25 μm when drawn without a magnification shift. On the other hand, the scale pattern U2x indicates a scale with a pitch of 46 μm composed of a line with a width of 20 μm and a space with a width of 26 μm when drawn without a magnification shift.

  Also, the zero scale X1 (0) in the scale pattern U1x and the zero scale X2 (0) in the scale pattern U2x are positioned relative to each other when the images Ga and Gb are drawn without any drawing deviation. It was set to match. The distance from the edge Fga of the image Ga to the zero scale X1 (0) when drawn without causing a drawing shift is 70 mm, and the distance from the edge Fgb of the image Gb to the zero scale X2 (0) is 5 mm. is there.

  Here, according to the same principle as the measurement using the caliper main scale and the vernier scale, for example, a scale pattern that coincides with the scale in the scale pattern U1x closest to the zero scale X1 (0) in the scale pattern U1x. The scale in U2x is the scale X2 (2). That is, the scale X2 (2) is a second scale that is shifted by 2 scales from the zero scale Y2 (0) in the scale pattern U2x. Thereby, it can be read that the position of the scale pattern U1x in the image Ga is shifted by 2 μm in the + X direction in the figure with respect to the position of the scale pattern U2x in the image Gb.

  Next, the positional deviation amount of the image Ga with respect to the image Gb in the + X direction is converted into a magnification deviation amount.

When the positional deviation amount is converted into the magnification deviation amount, errors due to the magnification deviation of the scale pitch of the scale pattern U1x and the scale pitch of the scale pattern U2x are negligible. Further, the position of the scale pattern U2x in the image Gb is located in the vicinity of the edge Fgb of the image Gb, and the amount of displacement of the position of the scale pattern U2x relative to the edge Fgb caused by the magnification shift of the image Gb is very small. As shown in FIG. 5, under the above conditions, the distance La1 from the edge Fga of the image Ga to the zero scale X1 (0) drawn in the image Ga under the above conditions is from the edge Fga of the image Ga to the image Gb. It can be seen that the distance La2 to the zero scale X2 (0) drawn inside is 2 μm larger. That is, La1 = La2 + 2 μm.

  The distance La2 from the edge Fga to the zero scale X2 (0) is a distance Lab (65 mm) from the edge Fga to the edge Fgb and a distance Lb2 (5 mm) from the edge Fgb to the zero scale X2 (0). It can be obtained by adding. That is, La2 = Lab + Lb2 = 70 mm, and the distance La1 from the edge Fga of the image Ga to the zero scale X1 (0) can be obtained as La1 = La2 + 2 μm = 70.002 mm.

  Therefore, the value of the magnification deviation amount Mg can be obtained as Mg = La1 / La2 = 70.002 / 70.

The magnification shift amount between images drawn by different drawing heads can be measured by the above method.

  In addition, each said image Ga, Gb ... may be drawn collectively by drawing head 10a, 10b ..., or each said image Ga, Gb ... is drawing head 10a. 10b... Draws a linear region extending in the direction of arrow X in the figure on the recording medium 1 while drawing the recording medium 1 relative to the drawing heads 10a, 10b. It may be one that has been transported and drawn.

  Further, the drawing head may be one that draws an image on the recording medium 1 by ejecting ink or the like onto the recording medium 1. Alternatively, an exposure head may be employed as the drawing head, and a photosensitive material may be employed as the recording medium 1.

  As described above, according to the present invention, it is possible to measure a drawing deviation amount between images drawn by each of a plurality of drawing heads with higher accuracy.

  Next, an exposure apparatus that implements an exposure method that performs exposure by applying the drawing deviation measuring method will be described.

  FIG. 6 is a diagram showing a schematic configuration of the optical system of the exposure apparatus, FIG. 7 is a perspective view showing the schematic configuration of the entire exposure apparatus, and FIG. 8 is a perspective view showing how the exposure head accommodated in the exposure unit exposes the photosensitive material. 9 is an enlarged perspective view showing the configuration of the DMD described later, FIG. 10 is a perspective view showing the operation of the micromirror, and FIG. 10A is a locus of the pixel light beam when the DMD is turned off. FIG. 10B is a plan view showing the trajectory of the pixel light beam when the DMD is turned on. FIG. 11A is a diagram showing a locus on a photosensitive material of a pixel light beam formed by reflecting each micromirror when the DMD is not tilted, and FIG. 11B is a pixel when the DMD is tilted. It is a figure which shows the locus | trajectory on the photosensitive material of a light beam.

  An exposure apparatus that performs an exposure method that performs exposure by applying the drawing deviation measuring method includes a plurality of DMDs that are spatial light modulators in which a large number of modulation elements that modulate incident light are two-dimensionally arranged. Each of the exposure heads is an exposure method in which light emitted from a light source is subjected to spatial light modulation, and an image pattern obtained by spatial light modulation is imaged on the photosensitive material to expose the photosensitive material. The drawing deviation measurement method is applied to the measurement of the drawing deviation amount when exposing a photosensitive material with multiple exposure heads, and the drawing deviation amount between each image pattern formed by each of the exposure heads is measured, and the drawing deviation is measured. Based on the amount, the exposure deviation between the image patterns formed on the photosensitive material by each exposure head is corrected, and the exposure of the photosensitive material by the exposure head is executed.

  The drawing heads 10a, 10b,... Correspond to exposure heads 230A, 230B,. The recording medium 1 corresponds to an optical material 201 described later. Further, the drawing areas on the recording medium 1 on which the images Ga, Gb,... Are drawn by the drawing heads 10a, 10b,... Correspond to the strip-shaped exposed areas 234A, 234B,. is there.

  As shown in the figure, the exposure apparatus 200 is a spatial light modulator formed by arranging a plurality of micromirrors M, which are microscopic light modulation elements, two-dimensionally, the light emitted from the light source 238 and emitted through the optical fiber 240. Spatial light modulation is performed by a certain DMD (digital micromirror device) 236, and a pixel light beam L corresponding to each micromirror M formed according to the light modulation state of each micromirror M is coupled onto the photosensitive material 201. An image, for example, a wiring pattern is exposed on the photosensitive material 201.

  The exposure apparatus 200 is configured in a so-called flatbed type, and includes a flat stage 214 that holds a photosensitive material 201 that is an exposure target to be exposed to the surface. Two guides 220 extending along the stage moving direction are installed on the upper surface of the thick plate-shaped installation base 218 supported by the four legs 216. The stage 214 is arranged so that the longitudinal direction thereof faces the stage moving direction, and is supported by the guide 220 so as to be reciprocally movable. The exposure apparatus 200 is provided with a driving device (not shown) for driving the stage 214 along the guide 220.

  A U-shaped gate 222 is provided at the center of the installation table 218 so as to straddle the moving path of the stage 214. Each of the end portions of the gate 222 is fixed to both side surfaces of the installation table 218. An exposure unit 224 is provided on one side of the gate 222, and a plurality of (for example, two) detection sensors 226 for detecting the front and rear ends of the photosensitive material 201 are provided on the other side. . The exposure unit 224 and the detection sensor 226 are respectively attached to the gate 222 and fixedly arranged above the moving path of the stage 214. The exposure unit 224 and the detection sensor 226 are connected to an exposure apparatus controller 228 that controls the synchronization and timing of each part of the exposure apparatus 200.

  In the exposure unit 224, as shown in FIG. 7, a plurality of (for example, eight) exposure heads 230A, 230B,... Arranged in a substantially matrix of i rows and j columns (for example, 2 rows and 4 columns). (Hereinafter, these are collectively referred to as exposure head 230).

  As shown in FIG. 8, each exposure area 232 by the exposure heads 230A, 230B,... Is configured in a rectangular shape having a long side in the transport direction (arrow Y direction in the figure), for example. In this case, in the photosensitive material 201, strip-shaped exposed regions 234A, 234B (hereinafter collectively referred to as exposed regions 234) are formed for each exposure head 230 in accordance with the exposure operation. .

  In addition, each of the exposure heads 230 in each row arranged so that the strip-shaped exposed regions 234 are arranged without gaps in an orthogonal direction (arrow X direction in the drawing) orthogonal to the transport direction is a predetermined interval ( The exposure area is shifted by a natural number times the long side). That is, for example, a portion that cannot be exposed between the exposure area 232A by the exposure head 230A and the exposure area 232B by the exposure head 230B can be an exposure area 232F by the exposure head 230F.

  As shown in FIG. 6, each exposure head 230 uses a digital micromirror device (DMD) as a spatial light modulator that spatially modulates a light beam emitted from a light source 238 and emitted through an optical fiber 240. 236. The DMD 236 is connected to the exposure apparatus controller 228 provided with an image data processing unit, a mirror drive control unit, and the like.

  The image data processing unit of the exposure apparatus controller 228 generates a control signal for driving and controlling the micromirrors to be controlled by the DMD 236 for each exposure head 230 based on the input image data. Further, the mirror drive control unit as the DMD controller controls the angle of the reflection surface of each micromirror in the DMD 236 for each exposure head 230 based on the control signal generated by the image data processing unit.

  As shown in FIG. 7, bundle-shaped optical fibers 240 respectively drawn from the light sources 238 are disposed on the light incident side of the DMD 236 disposed in each exposure head 230. The light source 238 may be constituted by an ultraviolet lamp (UV lamp), a xenon lamp, or the like that can be used as a general light source.

  Although not shown, the light source 238 is provided with a plurality of multiplexing modules that multiplex laser beams emitted from a plurality of semiconductor laser chips and input them to the optical fiber. The optical fiber extending from each multiplexing module is a multiplexing optical fiber that propagates the combined laser beam, and a plurality of optical fibers are bundled into one to form a bundle-shaped optical fiber 240.

  Further, as shown in FIG. 6, a mirror 242 that reflects the light emitted from the bundle optical fiber 240 toward the DMD 236 is disposed on the light incident side of each exposure head 230 in the DMD 236.

  As shown in FIG. 9, the DMD 236 has a rectangular shape in which a large number of micromirrors M arranged in a two-dimensional manner are supported on a SRAM cell (memory cell) 244 and supported by pillars (not shown). The mirror device is configured by arranging a large number (for example, 600 × 800) of micromirrors M constituting a pixel (pixel) in a grid pattern. A micromirror M supported by a support column is provided at the top of each pixel, and a material having high reflectance such as aluminum is deposited on the surface of the micromirror M.

  Directly below the micromirror M is a silicon gate CMOS SRAM cell 244 manufactured on a normal semiconductor memory manufacturing line via a post including a hinge and a yoke (not shown), and the whole is monolithic. (Integrated type).

  When a digital signal is written to the SRAM cell 244 of the DMD 236, the micromirror M supported by the support is tilted within a range of ± α degrees (for example, ± 10 degrees) with respect to the substrate side on which the DMD 236 is disposed with the diagonal line as the center. It is done. FIG. 10A shows a state where the micromirror M is tilted to + α degrees when the micromirror M is in the on state, and FIG. 10B shows a state where the micromirror M is tilted to −α degrees when the micromirror M is in the off state. Therefore, by controlling the inclination of the micromirror M in each pixel of the DMD 236 as described above according to the image signal, the light incident on the DMD 236 is reflected in a direction corresponding to the inclination of the micromirror M. It is done.

  FIG. 9 shows an example of a state in which a part of the DMD 236 is enlarged and the micromirror M is controlled to + α degrees or −α degrees. The on / off control of each micromirror M is performed by the exposure apparatus controller 228 connected to the DMD 236. For example, the light reflected by the micromirror M in the on state is the light emission side of the DMD 236. The photosensitive material 201 is exposed by being imaged through an imaging optical system 259 (see FIG. 6) provided later. Further, the light reflected by the off-state micromirror M enters a light absorber (not shown) and is absorbed and does not expose the photosensitive material 201.

  Further, the DMD 236 is arranged slightly inclined so that the long side direction of the rectangular shape forms a predetermined angle θ (for example, 0.1 ° to 0.5 °) with the transport direction (the arrow Y direction in the figure). It is preferable to do this. FIG. 11A shows a trajectory (hereinafter referred to as a transport trajectory) on the photosensitive material 201 by the above-described transport of the pixel light beam L formed by being reflected by each micromirror when the DMD 236 is not tilted. B) shows the transport locus of the pixel light beam L when the DMD 236 is tilted.

  As described above, by tilting the DMD 236, the transport line pitch P2 indicated by the transport trajectory of the pixel light beam L that has passed through each micromirror M (see FIG. 11B) is transported when the DMD 236 is not tilted. It can be made narrower than the line pitch Pl (see FIG. 11A), and the resolution of the image exposed on the photosensitive material 201 can be greatly improved. On the other hand, since the tilt angle of the DMD 236 is very small, the transport width W2 when the DMD 236 is tilted and the transport radiation W1 when the DMD 236 is not tilted are substantially the same.

  Moreover, it can also arrange | position so that the substantially same position (dot) on the same conveyance line may be accumulated and exposed (multiple exposure) by a different micro mirror row | line | column. In such a case, the same region on the photosensitive material is subjected to multiple exposure, exposure can be controlled with higher resolution, and high-definition exposure can be realized. In addition, such high-resolution exposure can make the connection between the exposure heads inconspicuous.

  Next, the imaging optical system 259 provided on the light emission side of the DMD 236 of the exposure head 230 will be described. As shown in FIG. 6, the imaging optical system 259 sequentially forms a lens system 250 along an optical path from the DMD 236 side to the photosensitive material 201 side in order to form an image of the light source on the photosensitive material 201. 252, microlens array 254, and objective lens systems 256 and 258 are arranged.

  Here, the lens systems 250 and 252 are configured as an enlargement optical system, and the area of the exposure area 232 on the photosensitive material 201 exposed by the pixel light beam reflected by the DMD 236 is enlarged to a required size. Yes.

  As shown in FIG. 6, the microlens array 254 is formed by integrally forming a plurality of microlenses 260 corresponding to the micromirrors M of the DMD 236 on a one-to-one basis. The pixel light beams that have passed through 250 and 252 are arranged to pass through.

  The entire microlens array 254 is formed in a rectangular flat plate shape, and apertures 262 (shown in FIG. 6) are integrally disposed in the portions where the microlenses 260 are formed. The aperture 262 forms an aperture stop that is arranged in one-to-one correspondence with each microlens 260.

  The objective lens systems 256 and 258 are configured as, for example, an equal magnification optical system. The photosensitive material 201 is disposed at a position where the pixel light beam L is imaged through the objective lens systems 256 and 258. The lens systems 250 and 252 and the objective lens systems 256 and 258 in the imaging optical system 259 are shown as one lens in FIG. 6, but a plurality of lenses (for example, a convex lens and a concave lens) are used. It may be a combination.

  With the exposure head 230 configured as described above, the light emitted from the light source 238 can be imaged on the surface of the photosensitive material 201 to form an image.

  Next, an operation for exposing an image on the photosensitive material 201 by the exposure apparatus 200 will be described.

  First, the above-described drawing deviation measurement method is applied to each of the exposure heads 230A, 230B,... To form an image on the photosensitive material 201 by the exposure heads 230A, 230B,. The amount of drawing deviation between images is measured. Then, based on the measured drawing deviation amount, the drawing deviation between the images formed on the photosensitive material is corrected by the exposure heads 230A, 230B,.

  Although not shown, the light source 238 collimates a laser beam such as ultraviolet light emitted from each of the laser light emitting elements in a divergent light state with a collimator lens and condenses it with a condenser lens. The light is incident on the incident end face, is combined in the optical fiber, and is incident on the optical fiber 240 coupled to the output end of the optical fiber.

  Image data corresponding to an image to be exposed is input to an exposure apparatus controller 228 connected to the DMD 236 and temporarily stored in a memory in the exposure apparatus controller 228. This image data is data representing the density of each pixel constituting the image by binary values (whether or not dots are recorded).

  The stage 214 having the photosensitive material 201 adsorbed on the surface thereof is transferred at a constant speed from the upstream side to the downstream side in the transport direction along the guide 220 by a driving device (not shown). When the leading end of the photosensitive material 201 is detected by the detection sensor 226 attached to the gate 222 when the stage 214 passes under the gate 222, the image data stored in the memory is sequentially read out for each of a plurality of lines. A control signal for controlling the micromirror M is generated for each exposure head 230 based on the image data read by the image data processing unit.

  Then, the mirror drive control unit of the exposure apparatus controller 228 performs on / off control of each micro mirror of the DMD 236 for each exposure head 230 based on a control signal in which the shading adjustment for uniformizing the light amount distribution and the adjustment of the exposure amount are performed. The

  When the light beam emitted from the optical fiber 240 and reflected by the mirror 242 is irradiated to the DMD 236, the laser light reflected when the micromirror of the DMD 236 is in the on state is reflected by the corresponding microlens 260 of the microlens array 254. An image is formed on the exposure surface of the photosensitive material 201 through a lens system including In this manner, the pixel light beam L emitted from the DMD 236 is turned on / off for each micromirror, and the photosensitive material 201 is exposed in pixel units (exposure areas) of approximately the same number as the number of used pixels of the DMD 236.

  Further, by moving the photosensitive material 201 together with the stage 214 at a constant speed, the photosensitive material 201 is relatively moved in the direction opposite to the stage moving direction by the exposure unit 224, and a strip-shaped exposure is completed for each exposure head 230. A region 234 is formed, and an image is exposed on the photosensitive material 201.

  That is, the image is formed on the photosensitive material 201 by irradiating the photosensitive material 201 with the pixel light beam L generated by performing the modulation corresponding to the image to be exposed and formed by the DMD 236.

  When exposure of the photosensitive material 201 by the exposure unit 224 is completed and the rear end of the photosensitive material 201 is detected by the detection sensor 226, the stage 214 is moved to the most upstream side in the transport direction along the guide 220 by a driving device (not shown). It is returned to a certain origin, and again moved along the guide 220 from the upstream side in the transport direction to the downstream side at a constant speed.

  In the exposure apparatus 200 according to the present embodiment, a DMD is used as a spatial light modulator used in the exposure head 230. For example, a spatial light modulator (SLM) of a MEMS (Micro E1ectro Mechanica 1 Systems) type is used. Reflective diffraction grating type grating light valve element (GLV element, manufactured by Silicon Light Machine Co., Ltd., for details of the GLV element, see US Pat. No. 5,311,360). Spaces other than MEMS types, such as optical elements (PLZT elements) that modulate transmitted light by the electro-optic effect, or transmissive spatial light modulators such as liquid crystal light shutters (FLC), etc. An optical modulator can be used in place of the DMD.

  Note that MEMS is a general term for a micro system that integrates micro-sized sensors, actuators, and control circuits based on a micro-machining technology based on an IC manufacturing process. A MEMS-type spatial light modulator is an electrostatic force. It means a spatial light modulator driven by electromechanical operation using

  Next, another embodiment for measuring the magnification deviation will be described.

  As shown in FIG. 12, the drawing heads 110a, 110b,... Equipped with the DMD have drawing ranges GGa, GGb,. And when drawing actually, it draws using a part of the drawable range. In this case, each drawing head 110a, 110b... Draws an actual drawing range GGa ′, GGb ′... Having a predetermined width Wx (for example, 65 mm), and these actual drawing ranges GGa ′, GGb ′. .. Need to be connected continuously between the drawing heads 110a, 110b.

  13, the drawing range is set with reference to the drawing surface 120, which is a stage surface on which the recording medium 1 on which an image is drawn by the drawing heads 110a, 110b,. First, the left end of each actual drawing range GGa ′, GGb ′... To be the actual drawing range on the drawing surface 120 is defined as the reference position X1 (0), X2 (0). At this time, each micro mirror which is a micro light modulation element arranged in the DMD corresponding to the reference positions X1 (0), X2 (0). .. Are also determined for each actual drawing range to be used when drawing the drawing ranges GGa ′, GGb ′.

  Next, connection positions X2 ′ (0), X3 ′ (0) at the right ends of the images drawn by the drawing heads 110a, 110b,..., Which are the right ends of the actual drawing ranges GGa ′, GGb ′,. Are adjusted to the reference positions X2 (0), X3 (0),... Of the drawing head on the right side. That is, an operation of determining a minute mirror corresponding to the right end of each actual drawing range GGa ′, GGb ′. At this time, each of the actual drawing ranges is accurately connected using the measurement method using the caliper main scale and the vernier scale of the present invention already described above.

  As shown in FIG. 14, in this embodiment, for example, in each of the drawing heads 110a, 110b,..., The main scale Hj is located near the reference positions X1 (0), X2 (0). 0), X3 ′ (0)..., And by drawing the vernier Fj in the vicinity, the connection state of the drawing range can be measured between all the drawing heads 110a, 110b. When the actual drawing ranges GGa ′, GGb ′,... Are correctly connected, the reference positions X2 (0), X3 (0),... And the connection positions X2 ′ (0), X3 ′ (0),. .. The positions in the direction of arrow X in each figure are in agreement with each other.

The conceptual diagram which shows the drawing misalignment measuring method by embodiment of this invention The figure which shows an example of the area | region of each image drawn on a recording medium by each drawing head The figure which shows a mode that the position shift between each image is measured Diagram showing how magnification deviation between images is measured Diagram showing how magnification deviation between images is measured The figure which shows schematic structure of the optical system of exposure apparatus The perspective view which shows schematic structure of the whole exposure apparatus The perspective view which shows a mode that the exposure head accommodated in the exposure unit exposes a photosensitive material The perspective view which expands and shows the structure of DMD Perspective view showing operation of micromirror (A) is a plan view showing the transport locus of the pixel light beam when the DMD is not tilted, and (B) is a plan view showing the transport locus of the pixel light beam when the DMD is tilted. The figure which shows the other example which measures the magnification gap between images The figure which shows the state where the magnification gap between images has arisen The figure which shows the state where the magnification gap between images has not arisen

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Recording medium 10a, 10b ... Drawing head Ga, Gb2 ... Image U1, U2 Scale pattern Rab Drawing area Rbc Drawing area

Claims (11)

A drawing deviation measuring method for measuring a drawing deviation amount between each image drawn by each of a plurality of drawing heads,
Each of the scale patterns is drawn on the recording medium by each drawing head so that each of the scale patterns having different predetermined pitches is drawn side by side on the same recording medium by different drawing heads. And
A drawing deviation measuring method comprising: comparing the scale patterns drawn on the recording medium to measure the drawing deviation amount. Each of the images obtained by spatially modulating the light emitted from the light source by each of a plurality of exposure heads each having a spatial light modulator in which a large number of modulation elements that modulate incident light are two-dimensionally arranged. An exposure method for exposing the photosensitive material by forming an image on the same photosensitive material,
The drawing displacement measuring method according to claim 1 is applied to measurement of a drawing displacement amount when the photosensitive material is exposed by the plurality of exposure heads, and the drawing displacement between each image formed by each of the exposure heads. Measuring the amount, correcting the drawing deviation between each image formed on the photosensitive material by each exposure head based on the drawing deviation amount, and performing exposure of the photosensitive material by the exposure head, Exposure method. A first scale pattern drawn at a reference position on the recording medium;
It is composed of a second scale pattern drawn on the recording medium so as to be aligned with the first scale pattern by the drawing head to be measured and so that the scale pitch is different from the first scale pattern. A scale pattern characterized by   The scale pattern according to claim 3, wherein the first scale pattern is drawn by another drawing head adjacent to the drawing head.   The said 1st scale pattern and the said 2nd scale pattern are drawn on the said recording medium in the aspect corresponding to each of a caliper's main scale and a vernier scale, The Claim 3 or 4 characterized by the above-mentioned. Tick pattern.   The drawing head to be measured is arranged on the recording medium so as to be aligned with the first scale pattern drawn at a reference position on the recording medium and so that the scale pitch is different from that of the first scale pattern. A scale pattern drawing method comprising a step of drawing a second scale pattern.   The scale pattern drawing method according to claim 6, further comprising a step of drawing the first scale pattern by another drawing head adjacent to the drawing head.   8. The scale pattern according to claim 6, wherein the first scale pattern and the second scale pattern are drawn on the recording medium in a manner corresponding to each of a caliper main scale and a vernier scale. Drawing method.   The drawing head to be measured is arranged on the recording medium so as to be aligned with the first scale pattern drawn at a reference position on the recording medium and so that the scale pitch is different from that of the first scale pattern. A scale pattern drawing apparatus comprising a second scale drawing means for drawing a second scale pattern.   10. The scale pattern drawing apparatus according to claim 9, further comprising first scale drawing means for drawing the first scale pattern by another drawing head adjacent to the drawing head.   The said 1st scale pattern and the said 2nd scale pattern are drawn on the said recording medium in the aspect corresponding to each of a caliper's main scale and a vernier scale, The Claim 9 or 10 characterized by the above-mentioned. Scale pattern drawing device.

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