JP2006272640A - Mold structure for resin molding - Google Patents

Mold structure for resin molding Download PDF

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JP2006272640A
JP2006272640A JP2005092441A JP2005092441A JP2006272640A JP 2006272640 A JP2006272640 A JP 2006272640A JP 2005092441 A JP2005092441 A JP 2005092441A JP 2005092441 A JP2005092441 A JP 2005092441A JP 2006272640 A JP2006272640 A JP 2006272640A
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mold
resin
slide
molding
cavity
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JP4521557B2 (en
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Hiroteru Takahashi
裕輝 高橋
Kazuhiko Tokutomi
和彦 徳富
Shinji Kasami
真司 賀佐見
Tomoji Mori
智司 森
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Nissan Motor Co Ltd
Daikyo Nishikawa Corp
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Nissan Motor Co Ltd
GP Daikyo Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold structure for resin molding featuring a structural simplicity and the non-generation of a drag in a slide mold during molding. <P>SOLUTION: This mold structure for resin molding comprises a cavity side part 3 retained on the underside and a force side part 5 configured movably to the cavity side part 3. A molten resin 35 is injected into a cavity 11 formed by molding surfaces 13 and 39 of the cavity side part 3/the force side part 5 and thereby, made to expand/harden and thus a resin substrate 49 can be molded. In this mold structure, a recessed part 15 is formed in the molding surface 13 on the cavity 11 side of the cavity side part 3, and in the recessed part 15, a freely movable slide mold 17 is installed to the cavity side part 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、樹脂成形用金型構造に関し、更に詳しくは、発泡樹脂製の成形品を成形する際に用いる金型の構造に関する。   The present invention relates to a resin molding mold structure, and more particularly to a mold structure used when molding a molded product made of foamed resin.

従来、発泡樹脂からなる樹脂製成形品を成形する際には、固定型と可動型とからなる金型のキャビティに溶融樹脂を注入及び充填させ、この溶融樹脂を発泡及び固化させることにより成形している。   Conventionally, when molding a resin molded product made of a foamed resin, the molten resin is injected and filled into a cavity of a mold composed of a fixed mold and a movable mold, and the molten resin is foamed and solidified. ing.

また、樹脂製成形品の各部位ごとに板厚を変える場合は、薄肉部に対応する金型の部位には、可動型と別途に摺動するスライド型を設け、該スライド型を可動型の成形面よりも突出して成形することにより、スライド型が当接する部位を他の一般部位よりも薄く成形することが行われている(例えば、特許文献1参照)。
特開2003−39511公報
In addition, when changing the plate thickness for each part of the resin molded product, a slide mold that slides separately from the movable mold is provided at the mold part corresponding to the thin portion, and the slide mold is a movable mold. By projecting from the molding surface and molding, the part with which the slide mold abuts is formed thinner than other general parts (for example, see Patent Document 1).
JP 2003-39511 A

しかしながら、前記従来例では、スライド型が金型の可動型に設けられていたため、可動型を上下移動させる機構と、スライド型を上下移動させる機構とをそれぞれ別途に設ける必要があり、金型構造が非常に複雑になるという問題があった。   However, since the slide mold is provided in the movable mold of the mold in the conventional example, it is necessary to separately provide a mechanism for moving the movable mold up and down and a mechanism for moving the slide mold up and down separately. There was a problem that became very complicated.

また、樹脂成形品の成形時に、スライド型と可動型との隙間内に樹脂が入り込み、スライド型にかじりが発生するおそれがあった。   Further, when the resin molded product is molded, the resin may enter the gap between the slide mold and the movable mold, and the slide mold may be galled.

そこで、本発明は、構造が簡単で、成形時にスライド型にかじりが発生することのない樹脂成形用金型構造を提供することを目的としている。   Accordingly, an object of the present invention is to provide a mold structure for resin molding that has a simple structure and does not cause galling in a slide mold during molding.

前記目的を達成するために、本発明は、所定位置に保持される固定型と、該固定型に対して移動自在に構成された可動型とを備え、これら固定型と可動型とで形成されるキャビティ内に溶融樹脂を注入して発泡及び固化させることにより、樹脂製の成形品を成形する樹脂成形用金型構造において、前記固定型のキャビティ側の成形面に凹部を設け、該凹部内に、固定型に対して移動自在のスライド型を設けたことを特徴としている。   In order to achieve the above object, the present invention includes a fixed mold that is held in a predetermined position, and a movable mold that is configured to be movable with respect to the fixed mold, and is formed by the fixed mold and the movable mold. In a resin molding mold structure for molding a resin molded product by injecting molten resin into a cavity to be foamed and solidified, a recess is provided on the molding surface on the cavity side of the fixed mold, Further, the present invention is characterized in that a slide mold that is movable with respect to the fixed mold is provided.

本発明に係る樹脂成形用金型構造によれば、金型の構造が簡素化されるため、金型の製造コストを大幅に低減することができる。   According to the mold structure for resin molding according to the present invention, since the structure of the mold is simplified, the manufacturing cost of the mold can be greatly reduced.

また、樹脂製成形品を成形する際、スライド型が摺動してもかじり等が発生することなく、円滑な成形作業を行うことができる。即ち、従来は、スライド型が可動型に設けられていたため、スライド型と可動型との隙間内に樹脂が入り込み、スライド型にかじりが発生するおそれがあったが、本実施形態によれば、スライド型を固定型に設けたため、従来のようにスライド型にかじりが発生することはなくなる。   Further, when molding a resin molded product, a smooth molding operation can be performed without causing galling or the like even if the slide mold slides. That is, conventionally, since the slide mold was provided in the movable mold, there was a possibility that the resin enters the gap between the slide mold and the movable mold, and the slide mold may be galling. Since the slide mold is provided in the fixed mold, no galling occurs in the slide mold as in the prior art.

以下、本発明の実施形態を図面と共に詳述する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図1は本発明の実施形態による金型の断面図である。   FIG. 1 is a sectional view of a mold according to an embodiment of the present invention.

この金型1は、下側に保持される固定型3と、該固定型3の上側に配置され、固定型3に対して上下方向に移動自在の可動型5とを備え、これらの固定型3及び可動型5は、ダイプレート7,9を介して図外の射出成形装置に取り付けられている。前記固定型3は凸状に形成され、可動型5は凹状に形成され、可動型5に固定型3が嵌合して上下にスライドするように構成されている。また、固定型3に可動型5が嵌合されたときに、固定型3の成形面(上面)13と可動型5の成形面(底面)39との間に、キャビティ(成形品空間)11が形成されている。   The mold 1 includes a fixed mold 3 held on the lower side, and a movable mold 5 disposed on the upper side of the fixed mold 3 and movable in the vertical direction with respect to the fixed mold 3. 3 and the movable mold 5 are attached to an injection molding apparatus (not shown) via die plates 7 and 9. The fixed mold 3 is formed in a convex shape, the movable mold 5 is formed in a concave shape, and the fixed mold 3 is fitted to the movable mold 5 and slides up and down. Further, when the movable mold 5 is fitted to the fixed mold 3, a cavity (molded product space) 11 is formed between the molding surface (upper surface) 13 of the fixed mold 3 and the molding surface (bottom surface) 39 of the movable mold 5. Is formed.

前記固定型3は、前述したように、ダイプレート9を介して射出成形装置に固定されており、その成形面13には、下方に凹んだ細長い凹部15が上下方向に沿って形成されている。この凹部15内にスライド型17が設けられ、該スライド型17は、駆動装置19を介して上下方向に摺動自在に設けられている。   As described above, the fixed mold 3 is fixed to the injection molding apparatus via the die plate 9, and the molding surface 13 is formed with a long and narrow recess 15 which is recessed downward along the vertical direction. . A slide die 17 is provided in the recess 15, and the slide die 17 is provided to be slidable in the vertical direction via a drive device 19.

前記固定型3には、溶融樹脂をキャビティ内に導入するための湯口(スプール)21、湯道(ランナー)23及び注入口(ゲート)25が形成されている。前記湯口21には、図外のノズルが取り付けられており、このノズルを介して湯口21に溶融樹脂35が注入されると、湯道23を通って注入口25から前記キャビティ11に溶融樹脂35が流れ込む。   The fixed mold 3 is formed with a sprue (spool) 21, a runner 23 and an injection port (gate) 25 for introducing the molten resin into the cavity. A nozzle (not shown) is attached to the gate 21, and when the molten resin 35 is injected into the gate 21 through this nozzle, the molten resin 35 passes from the inlet 25 to the cavity 11 through the runner 23. Flows in.

図2はスライド型の近傍部を示す断面図である。   FIG. 2 is a cross-sectional view showing the vicinity of the slide mold.

固定型3のキャビティ11側の成形面13に形成された凹部15内には、スライド型17が収納されている。このスライド型17の下部には、スライド型17を上下に摺動させる油圧式の駆動装置(駆動手段)19が配設されている。該駆動装置19は、凹部15の底部に固定された駆動装置本体27と、該駆動装置本体27に設けられ、上下に摺動自在に構成されたロッド29と、該ロッドの先端に設けられた押圧部31とを備えている。この押圧部とスライド型17との間には、中間部材33が設けられている。従って、ロッド29が上下に移動すると、押圧部31と共に中間部材33が上下移動することにより、スライド型17を前記可動型5とは別途に摺動させることができる。   A slide mold 17 is accommodated in a recess 15 formed in the molding surface 13 on the cavity 11 side of the fixed mold 3. A hydraulic driving device (driving means) 19 that slides the slide die 17 up and down is disposed below the slide die 17. The driving device 19 includes a driving device main body 27 fixed to the bottom of the recess 15, a rod 29 provided on the driving device main body 27 and configured to be slidable up and down, and provided at the tip of the rod. And a pressing portion 31. An intermediate member 33 is provided between the pressing portion and the slide mold 17. Therefore, when the rod 29 moves up and down, the intermediate member 33 moves up and down together with the pressing portion 31, so that the slide mold 17 can be slid separately from the movable mold 5.

次いで、図3及び図4を用いて、樹脂成形品の成形方法を簡単に説明する。  Next, a method for molding a resin molded product will be briefly described with reference to FIGS. 3 and 4.

図3は図1の金型に溶融樹脂を充填した状態を示す要部断面図、図4は図3の溶融樹脂が発泡した状態を示す要部断面図である。   FIG. 3 is a cross-sectional view of main parts showing a state in which the mold shown in FIG. 1 is filled with molten resin, and FIG.

図3に示すように、固定型3の注入口から溶融樹脂35が注入されると、該溶融樹脂35は左右に広がってキャビティ11内に充填される。この状態では、未だ溶融樹脂35は発泡しておらず、厚さDの状態になっている。   As shown in FIG. 3, when the molten resin 35 is injected from the injection port of the fixed mold 3, the molten resin 35 spreads left and right and is filled in the cavity 11. In this state, the molten resin 35 is not yet foamed and is in a state of thickness D.

次に、図4に示すように、可動型5を上方に移動させると共に、スライド型17も可動型5と同一長さ分だけ上方に移動させる。可動型5を上方に移動させると、溶融樹脂35が発泡して厚みHの発泡樹脂41となる。また、スライド型17を上方に移動させると、このスライド型17の上面37と可動型内の成形面39との上下高さはDとなるため、発泡樹脂41におけるスライド型17の当接部分は発泡することなく、固定型3の成形面13と可動型5の成形面39との上下高さHよりも小さく形成される。よって、発泡樹脂41のうち、スライド型17の上面37が当たる部分の板厚Dは、他の一般部位の板厚Hよりも薄く成形される。この状態で溶融樹脂35が冷却及び固化されたのち、可動型5をさらに上方に持ち上げると共にスライド型17を下降させると、発泡樹脂41からなる樹脂成形品が成形される。  Next, as shown in FIG. 4, the movable mold 5 is moved upward, and the slide mold 17 is also moved upward by the same length as the movable mold 5. When the movable mold 5 is moved upward, the molten resin 35 foams and becomes a foamed resin 41 having a thickness H. When the slide mold 17 is moved upward, the vertical height between the upper surface 37 of the slide mold 17 and the molding surface 39 in the movable mold becomes D. Therefore, the contact portion of the slide mold 17 in the foamed resin 41 is Without foaming, the molding surface 13 of the fixed mold 3 and the molding surface 39 of the movable mold 5 are formed smaller than the vertical height H. Therefore, the plate thickness D of the portion of the foamed resin 41 where the upper surface 37 of the slide mold 17 hits is formed thinner than the plate thickness H of other general parts. After the molten resin 35 is cooled and solidified in this state, when the movable mold 5 is further lifted upward and the slide mold 17 is lowered, a resin molded product made of the foamed resin 41 is molded.

図5は自動車用ドア部品である樹脂製基板を成形するための成形用金型に溶融樹脂を充填した状態を示す断面図である。   FIG. 5 is a cross-sectional view showing a state in which a molding die for molding a resin substrate, which is an automobile door part, is filled with molten resin.

この場合も、キャビティ11に溶融樹脂35が注入及び充填されると、スライド型17が当接する部位の溶融樹脂35の板厚はdとなり、スライド型17が当接しない一般部位の板厚はhになる。   Also in this case, when the molten resin 35 is injected and filled into the cavity 11, the thickness of the molten resin 35 at the portion where the slide mold 17 abuts becomes d, and the thickness of the general portion where the slide mold 17 does not abut is h. become.

図6は図5の溶融樹脂が発泡した状態を示す断面図である。   FIG. 6 is a cross-sectional view showing a state where the molten resin of FIG. 5 is foamed.

次いで、可動型5及びスライド型17を上方に移動させると溶融樹脂35が発泡して発泡樹脂41になる。このとき、発泡樹脂41のうち、スライド型17が当接している部位の板厚はdのままであり、スライド型17が当接していない一般部位の板厚はh’に膨張する。即ち、スライド型17が当接する部位の板厚dを他の一般部位の板厚h’よりも薄く成形される。   Next, when the movable mold 5 and the slide mold 17 are moved upward, the molten resin 35 foams to become the foamed resin 41. At this time, the thickness of the portion of the foamed resin 41 where the slide die 17 is in contact remains d, and the thickness of the general portion where the slide die 17 is not in contact expands to h ′. That is, the plate thickness d of the portion with which the slide mold 17 abuts is formed thinner than the plate thickness h ′ of other general portions.

図7は本発明の実施形態による樹脂製基板を含むドアの分解斜視図である。   FIG. 7 is an exploded perspective view of a door including a resin substrate according to an embodiment of the present invention.

このドア43は、ドアパネル45、ウィンドウパネル47、樹脂製基板49、ドアトリム51からなり、樹脂製基板49を介してドアトリム51をドアパネル45に組み付けている。   The door 43 includes a door panel 45, a window panel 47, a resin substrate 49, and a door trim 51, and the door trim 51 is assembled to the door panel 45 through the resin substrate 49.

図8は図7の樹脂製基板を示す斜視図、図9は図8の樹脂製基板の要部を拡大して示す斜視図、及び図10は図9の断面図である。   8 is a perspective view showing the resin substrate of FIG. 7, FIG. 9 is an enlarged perspective view showing the main part of the resin substrate of FIG. 8, and FIG. 10 is a sectional view of FIG.

図8に示すように、この樹脂製基板49には、図外のウィンドウパネル用昇降モータ等を組み付けてあり、その前側上部には、膨出部分53が形成されている。   As shown in FIG. 8, a window panel elevating motor (not shown) or the like is assembled to the resin substrate 49, and a bulging portion 53 is formed in the front upper portion thereof.

この膨出部分53は、上部側に形成された厚肉部55と、下部側に形成された薄肉部57とからなり、薄肉部57は、図6で説明したようにスライド型17が当接する部位に対応し、厚肉部55は、スライド型17が当接しない一般部位に対応している。   The bulging portion 53 includes a thick portion 55 formed on the upper side and a thin portion 57 formed on the lower side. The thin portion 57 contacts the slide mold 17 as described with reference to FIG. Corresponding to the part, the thick portion 55 corresponds to a general part where the slide mold 17 does not contact.

以下に、本発明の実施形態による作用効果について説明する。   Below, the effect by embodiment of this invention is demonstrated.

前記固定型3のキャビティ11側の成形面に凹部15を設け、該凹部15内に、固定型3に対して移動自在のスライド型17を設けているため、金型1の構造が簡素化され、金型1のコストを大幅に低減することができる。   Since the recess 15 is provided on the molding surface of the fixed mold 3 on the cavity 11 side, and the slide mold 17 movable with respect to the fixed mold 3 is provided in the recess 15, the structure of the mold 1 is simplified. The cost of the mold 1 can be greatly reduced.

また、スライド型17が摺動する際にかじり等が発生することなく、円滑な成形作業を行うことができる。即ち、従来は、スライド型17が可動型5に設けられていたため、スライド型17と可動型5との隙間内に樹脂が入り込み、スライド型17にかじりが発生するおそれがあったが、本実施形態によれば、スライド型17を固定型3に設けたため、従来のようにスライド型17にかじりが発生することはなくなる。   Further, a smooth molding operation can be performed without causing galling or the like when the slide mold 17 slides. That is, conventionally, since the slide mold 17 is provided on the movable mold 5, there is a possibility that resin enters the gap between the slide mold 17 and the movable mold 5, and the slide mold 17 may be galling. According to the embodiment, since the slide mold 17 is provided in the fixed mold 3, the slide mold 17 is not galling unlike the conventional technique.

前記スライド型17を、油圧式の駆動装置19を介して移動及び保持させるように構成しているため、スライド型17の押圧力の微調整が可能となり、最終的な樹脂成形品である樹脂製基板49の薄肉部57における板厚の寸法精度を向上させることができる。   Since the slide mold 17 is configured to be moved and held via a hydraulic drive unit 19, the pressing force of the slide mold 17 can be finely adjusted, and the final resin molded product is made of resin. The dimensional accuracy of the plate thickness in the thin portion 57 of the substrate 49 can be improved.

本発明の実施形態による金型の断面図である。It is sectional drawing of the metal mold | die by embodiment of this invention. 金型のスライド型近傍部を示す断面図である。It is sectional drawing which shows the slide mold vicinity part of a metal mold | die. 図1の金型内に溶融樹脂を充填した状態を示す要部断面図である。It is principal part sectional drawing which shows the state which filled the molten resin in the metal mold | die of FIG. 図3の溶融樹脂が発泡した状態を示す要部断面図である。It is principal part sectional drawing which shows the state which the molten resin of FIG. 3 foamed. 自動車用ドア部品である樹脂製基板を成形する成形用金型に溶融樹脂を充填した状態を示す要部断面図である。It is principal part sectional drawing which shows the state which filled the metal mold | die which shape | molds the resin-made board | substrates which are automobile door components with the molten resin. 図5の溶融樹脂が発泡した状態を示す要部断面図である。It is principal part sectional drawing which shows the state which the molten resin of FIG. 5 foamed. 本発明の実施形態による樹脂製基板を含むドアの分解斜視図である。It is a disassembled perspective view of the door containing the resin-made board | substrates by embodiment of this invention. 図7の樹脂製基板を示す斜視図である。It is a perspective view which shows the resin-made board | substrates of FIG. 図8の樹脂製基板の要部を拡大した斜視図である。It is the perspective view which expanded the principal part of the resin-made board | substrates of FIG. 図9の断面図である。FIG. 10 is a cross-sectional view of FIG. 9.

符号の説明Explanation of symbols

1…金型
3…固定型
5…可動型
11…キャビティ
13,39…成形面
15…凹部
17…スライド型
19…駆動装置(駆動手段)
35…溶融樹脂
DESCRIPTION OF SYMBOLS 1 ... Metal mold | dies 3 ... Fixed mold | type 5 ... Movable type | mold 11 ... Cavity 13,39 ... Molding surface 15 ... Recessed part 17 ... Slide type | mold 19 ... Drive apparatus (drive means)
35 ... Molten resin

Claims (2)

所定位置に保持される固定型と、該固定型に対して移動自在に構成された可動型とを備え、これら固定型と可動型とで形成されるキャビティ内に溶融樹脂を注入して発泡及び固化させることにより、樹脂製の成形品を成形する樹脂成形用金型構造において、
前記固定型のキャビティ側の成形面に凹部を設け、該凹部内に、固定型に対して移動自在のスライド型を設けたことを特徴とする樹脂成形用金型構造。
A fixed mold that is held at a predetermined position, and a movable mold configured to be movable with respect to the fixed mold. The molten resin is injected into a cavity formed by the fixed mold and the movable mold to foam and In the mold structure for resin molding that molds a resin molded product by solidifying,
A mold structure for resin molding, wherein a recess is provided on a cavity-side molding surface of the fixed mold, and a slide mold movable relative to the fixed mold is provided in the recess.
前記スライド型を、油圧式の駆動手段を介して移動及び保持させるように構成したことを特徴とする請求項1に記載の樹脂成形用金型構造。
2. The mold structure for resin molding according to claim 1, wherein the slide mold is configured to be moved and held via a hydraulic drive means.
JP2005092441A 2005-03-28 2005-03-28 Mold structure for resin molding Active JP4521557B2 (en)

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JP2007185841A (en) * 2006-01-12 2007-07-26 Daikyo Nishikawa Kk Mold

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JPH03254919A (en) * 1990-03-06 1991-11-13 Takata Kk Manufacture of module cover of air bag
JP2002067111A (en) * 2000-08-30 2002-03-05 Inoac Corp Foamed molding with solid part and its manufacturing method
JP2002160224A (en) * 2000-11-27 2002-06-04 Sumitomo Chem Co Ltd Mold for producing lightweight thermoplastic resin molding and method for producing the molding by using the mold
JP2003251669A (en) * 2002-02-28 2003-09-09 Takanichi Kk Molding base material for door trim and method for manufacturing the same
JP2004181759A (en) * 2002-12-03 2004-07-02 Kasai Kogyo Co Ltd Method and mold for molding foam resin molded body
JP2006130878A (en) * 2004-11-09 2006-05-25 Kasai Kogyo Co Ltd Shaping method and shaping mold of foamed resin article

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JPS58151015U (en) * 1982-03-31 1983-10-11 鐘淵化学工業株式会社 Foam molding equipment
JPH03254919A (en) * 1990-03-06 1991-11-13 Takata Kk Manufacture of module cover of air bag
JP2002067111A (en) * 2000-08-30 2002-03-05 Inoac Corp Foamed molding with solid part and its manufacturing method
JP2002160224A (en) * 2000-11-27 2002-06-04 Sumitomo Chem Co Ltd Mold for producing lightweight thermoplastic resin molding and method for producing the molding by using the mold
JP2003251669A (en) * 2002-02-28 2003-09-09 Takanichi Kk Molding base material for door trim and method for manufacturing the same
JP2004181759A (en) * 2002-12-03 2004-07-02 Kasai Kogyo Co Ltd Method and mold for molding foam resin molded body
JP2006130878A (en) * 2004-11-09 2006-05-25 Kasai Kogyo Co Ltd Shaping method and shaping mold of foamed resin article

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007185841A (en) * 2006-01-12 2007-07-26 Daikyo Nishikawa Kk Mold
JP4671869B2 (en) * 2006-01-12 2011-04-20 ダイキョーニシカワ株式会社 Mold

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