JP2006269083A - Ground structure of electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ground structure of electronic equipment capable of ground connection at a desired position by making an occupied region small. <P>SOLUTION: The electronic equipment 10 is provided with a frame 15, a circuit board 16, and a spring 60 or the like. The frame 15 has conductivity and is arranged in the neighborhood of the circuit board 16. The circuit board 16 is provided with mounting holes 41-44 and a land 51 or the like. The land 51 has conductivity and is installed at the circumference of the mounting holes 41-44. The spring 60 has conductivity and is provided with a coil part 61, a first end part 62, and a second end part 63 or the like. The coil part 61 is inserted into the mounting holes 41-44 in a direction that the center axis orthogonally crosses the normal line of the circuit board 16. The first end part 62 is contacted with the land 51, and the second end part 63 is crimped to the frame 15. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a grounding structure of an electronic device for grounding a circuit board provided in the electronic device such as a portable MD player and a portable hard disk player.

  FIG. 1 is an exploded perspective view showing a part of a configuration of an electronic apparatus to which a conventional ground structure is applied. A conventional electronic device 1 such as a portable MD player or a hard disk includes an upper cabinet 2 (see FIG. 2), a bottom cabinet 3, a frame 4, a circuit board 5, and the like. The bottom cabinet 3 and the frame 4 are conductive. The frame 4 is formed in a U shape in a plan view and is disposed so as to surround three sides of the circuit board 5.

  As shown in FIG. 2, in the conventional electronic device 1, the circuit board 5 is fixed to the frame 4 by screws 6 and is electrically connected to the frame 4 by screws 6. Further, as shown in FIG. 3, the frame 4 is fixed to the bottom cabinet 3 by screws 7 and is electrically connected to the bottom cabinet 3 by screws 7.

As described above, a ground structure in which the screws 6 and 7 are arranged in a direction in which the central axis is perpendicular to the circuit board 5 has been conventionally known (see, for example, Patent Documents 1 and 2).
JP 61-258797 A Japanese Utility Model Publication No. 58-152780

  By the way, in an electronic device compliant with a standard such as USB 2.0, the transfer speed is high, and therefore, it is necessary to connect each connector mounted on the circuit board 5 to the ground at a position adjacent to each connector.

  However, the conventional ground structure in which the screws 6 and 7 are arranged in the direction in which the central axis is perpendicular to the circuit board 5 requires a large area on the circuit board. For this reason, it is difficult to provide a region for screwing or the like for each connector, and it has not been possible to make a ground connection for each connector provided on the circuit board 5.

  An object of the present invention is to provide a grounding structure of an electronic device that can be grounded at a desired position by reducing an occupied area.

  In order to solve the above-described problems, the ground structure of the electronic device according to the present invention is configured as follows.

  (1) A circuit board having a mounting hole and a conductive thin film provided around the mounting hole, a conductive member disposed in the vicinity of the circuit board, and a central axis being a normal line of the circuit board A conductive wire having a coil portion inserted into the mounting hole in a direction orthogonal to the first electrode, a first end abutted against the thin film, and a second end abutted against the conductive member; It is characterized by providing.

  In this configuration, the thin film of the circuit board and the wire are conducted, and the wire and the conductive member are conducted. Since it is the wire that is inserted into the mounting hole of the circuit board and is in contact with the thin film, the area occupied by the ground structure on the circuit board is reduced.

  (2) The wire has further elasticity, and the outer diameter of the coil portion is larger than the dimension of the mounting hole.

  In this configuration, since the wire has elasticity and the outer diameter of the coil portion is larger than the size of the mounting hole, when the coil portion is inserted into the mounting hole, the coil portion and the mounting hole are engaged, and the wire rod is on the circuit board. It is held at the position for attaching the wire.

  (3) The wire has a bent portion between the coil portion and the second end portion.

  In this configuration, since the wire has a bent portion between the coil portion and the second end portion, the second end portion is easy when the conductive member is disposed perpendicular to the circuit board. Pressure contacted.

  According to the present invention, the following effects can be obtained.

  (1) Since the area occupied by the ground structure on the circuit board can be reduced, the ground connection can be made at a desired position on the circuit board. Therefore, each connector mounted on a circuit board of an electronic device compliant with a standard having a high transfer rate such as USB 2.0 can be grounded at a position adjacent to each connector.

  (2) Since the wire portion can be held at the position for attaching the wire on the circuit board by engaging the coil portion with the attachment hole, the first end portion or the coil portion of the wire is easily and reliably formed into a thin film. It can be bonded to the surface by soldering or the like.

  (3) By providing a bent portion between the coil portion of the wire rod and the second end portion, when the conductive member is disposed perpendicular to the circuit board, the second end portion is made conductive. It can be easily pressed against the member.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 4 is a perspective view showing a configuration of the electronic apparatus 10 to which the ground structure according to the embodiment of the present invention is applied. FIG. 5 is an exploded perspective view illustrating a partial configuration of the electronic device 10.

  The electronic device 10 is a portable audio reproducing / recording apparatus that reproduces and records an audio signal, such as a portable MD player or a portable hard disk player.

  The electronic device 10 includes an upper cabinet 12, a center cabinet 13, a bottom cabinet 14, a frame 15, a circuit board 16, and the like. The upper cabinet 12, the center cabinet 13, and the bottom cabinet 14 constitute a housing 11 of the electronic device 10. The frame 15 and the circuit board 16 are accommodated in the housing 11. In this embodiment, the frame 15 corresponds to the conductive member of the present invention.

  The frame 15 and the bottom cabinet 14 are made of a conductive material. The frame 15 is a plate-like member bent at two right angles so as to exhibit an inverted U-shape in plan view, and is disposed so as to surround three sides of the circuit board 16.

  The frame 15 is fixed to the bottom cabinet 14 by screws 17 and is electrically connected to the bottom cabinet 14 by screws 17.

  The frame 15 has screw fastening portions 18 and 19 extending in the horizontal direction (see FIG. 6 for the screw fastening portion 19), and the circuit board 16 is positioned corresponding to the screw fastening portions 18 and 19. Have screw holes 20 and 21. Then, the circuit board 16 is fixed to the frame 15 by tightening the screw 22 so as to penetrate the screw hole 20 and the screw fastening part 18 and further fastening the screw 23 so as to penetrate the screw hole 21 and the screw fastening part 19. Has been. The circuit board 16 is electrically connected to the frame 15 by screws 22 and 23.

  FIG. 6 is a cross-sectional plan view of the electronic device 10. A plurality of connectors 31, 32, 33, 34 and other circuit components are mounted on the circuit board 16 and soldered to the circuit board 16. Each of the connectors 31 to 34 is a terminal selected from, for example, a USB terminal, a headphone terminal, a microphone terminal, a signal input terminal, a cradle terminal, and the like, and is disposed on the peripheral portion of the circuit board 16.

  The circuit board 16 is further provided with mounting holes 41, 42, 43, and 44 corresponding to the connectors 31 to 34, respectively. The attachment holes 41 to 44 are provided adjacent to the corresponding connectors 31 to 34 so that no other circuit parts are interposed between the corresponding connectors 31 to 34. The attachment holes 41 to 44 penetrate the circuit board 16.

  FIG. 7 is a side sectional view showing a part of the electronic device 10, and FIG. 8 is a bottom sectional view showing a part of the electronic device 10.

  Around the mounting hole 41 on the back surface of the circuit board 16, there is provided a land 51 (corresponding to the thin film of the present invention) that has conductivity and can be soldered. The land 51 is electrically connected to the ground terminal 31 </ b> A of the corresponding connector 31. Specifically, the ground terminal 31 </ b> A of the connector 31 penetrates the circuit board 16 from the front surface side to the back surface side and is soldered to a part of the land 51. Similarly, lands that are conductive and can be soldered are also provided around the mounting holes 42 to 44 on the back surface of the circuit board 16. Each land is electrically connected to the ground terminal of the corresponding connector 32 to 34. Connected.

  The coil portion 61 of the spring 60 is inserted into the mounting hole 41. The spring 60 corresponds to the wire of the present invention. The spring 60 has conductivity and includes a coil portion 61, a first end portion 62, and a second end portion 63. The coil portion 61 is made of, for example, a single metal wire and has a small size in the central axis direction. For this reason, the occupation area on the circuit board 16 of the spring 60 becomes small. The outer diameter of the coil portion 61 is slightly larger than the longitudinal dimension of the mounting hole 41. The coil part 61 of the spring 60 is inserted into the mounting hole 41 from the back side of the circuit board 16 in a direction in which the central axis of the coil part 61 is orthogonal to the normal line of the circuit board 16.

  When the coil portion 61 is inserted into the mounting hole 41, the diameter of the coil portion 61 is reduced so that the central axis of the coil portion 61 passes through the mounting hole 41, and after the central axis passes through the mounting hole 41, the coil portion 61. The coil portion 61 engages with the attachment hole 41 by the elastic force that tends to return to the original diameter. As a result, the spring 60 is held at a position for attaching the spring 60 on the circuit board 16.

  The first end 62 of the spring 60 is in contact with the land 51 and is soldered to the land 51. Note that the coil portion 61 may be soldered to the land 51 instead of the first end portion 62 or together with the first end portion 62.

  A bent portion 64 is provided between the coil portion 61 and the second end portion 63. The bent portion 64 is bent at an obtuse angle close to 90 degrees. The second end portion 63 is in pressure contact with the frame 15 disposed in a direction perpendicular to the circuit board 16 by an elastic force.

  As described above, the connector 31 is electrically connected to the frame 15 via the land 51 and the spring 60. The ground structure of the present invention includes a circuit board 16, a frame 15, a spring 60, and the like.

  As in the case of the mounting hole 41, a coil portion of a spring similar to the spring 60 is inserted into the mounting holes 42 to 44, the first end is soldered to the land, and the second end Is in pressure contact with the frame 15. As a result, the connectors 32 to 34 are also electrically connected to the frame 15 via lands and springs arranged in the corresponding mounting holes 42 to 44, respectively.

  According to the grounding structure applied to the electronic device 10, the area occupied on the circuit board 16 of the grounding structure can be reduced, so that the ground connection can be made at a desired position on the circuit board 16. Therefore, each connector 31 to 34 mounted on the circuit board 16 of the electronic device 10 compliant with a high transfer speed standard such as USB 2.0 can be grounded at a position adjacent to each connector 31 to 34. For this reason, the overcurrent and static electricity which are going to enter into the circuit board 16 from each connector 31-34 can be spread | diffused quickly and accurately to the flame | frame 15 and the bottom cabinet 14, and the malfunctioning and damage of the electronic device 10 can be prevented. .

  In addition, the coil 60 and the mounting hole 41 can be engaged to hold the spring 60 at the mounting position of the spring 60 on the circuit board 16, so that the first end 62 of the spring 60 is connected to the land 51. Can be easily and reliably bonded by soldering or the like. The same effect can be obtained for the springs disposed in the other mounting holes 42 to 44.

  Further, by providing a bent portion 64 between the coil portion 61 and the second end portion 63 of the spring 60, the second end portion 63 is attached to the frame 15 arranged perpendicular to the circuit board 16. It can be easily pressed.

  Note that the second end 63 of the spring 60 may be pressed against the bottom cabinet 14 instead of the frame 15, and in this case, for example, the bent portion 64 is not provided. In this case, the bottom cabinet 14 corresponds to the conductive member of the present invention.

  The coil portion 61 is made of a single metal wire in the above-described embodiment, but is formed in a double or triple spiral shape as long as the area occupied by the spring 60 is allowed on the circuit board 16. May be. The attachment holes 41 to 44 are formed in a size corresponding to the size of the coil portion 61 of the spring 60.

It is a disassembled perspective view which shows the structure of a part of electronic device to which the conventional earth structure was applied. It is sectional drawing which shows the earth structure of the conventional electronic device. It is sectional drawing which shows the earth structure of the conventional electronic device. It is a perspective view which shows the structure of the electronic device to which the earth structure which concerns on embodiment of this invention was applied. It is a disassembled perspective view which shows the structure of a part of said electronic device. It is sectional drawing of the plane of the said electronic device. It is sectional drawing of the side surface which shows a part of said electronic device. It is sectional drawing of the bottom face which shows a part of said electronic device.

Explanation of symbols

10 Electronic equipment 15 Frame (conductive member)
16 Circuit board 41 to 44 Mounting hole 51 Land (thin film)
60 Spring (wire)
61 Coil portion 62 First end portion 63 Second end portion 64 Bending portion

Claims (3)

A circuit board comprising a mounting hole and a conductive thin film provided around the mounting hole;
A conductive member disposed in the vicinity of the circuit board;
A coil portion that is inserted into the mounting hole in a direction perpendicular to the normal line of the circuit board, a first end portion that is in contact with the thin film, and a second end portion that is in pressure contact with the conductive member A grounding structure for electronic equipment, comprising: a conductive wire comprising: The wire further has elasticity,
The ground structure of the electronic device according to claim 1, wherein an outer diameter of the coil portion is larger than a dimension of the mounting hole.   The ground structure of the electronic device according to claim 1, wherein the wire has a bent portion between the coil portion and the second end portion.

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