JP2006093475A - Grounding structure of electronic machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a grounding structure of an electronic machine capable of connecting each connector mounted on a substrate to the ground in its adjacent position. <P>SOLUTION: Electric conduction between a frame 4 and the substrate 5, that is grounding connection of the frame ground pattern, is attained by a ground spring 11 formed of a conductive material. The ground spring 11 is a U-shaped leaf spring including both end pieces folded to face each other. The spring 11 is pinched so that one of the pieces comes into contact with the external surface of the frame 4, and the other piece comes into contact with the inner peripheral surface on the side of the frame 4 of a ground spring attachment hole 10. The two pieces of the ground spring 11, while pinched, are biased to come closer to each other. One of the pieces is pressed against the external surface of the frame 4, and the other is pressed against the inner peripheral surface on the side of the frame 4 of the ground spring attachment hole 10. The FG pattern formed on the substrate 5 is thus electrically conductive with the frame 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a grounding structure for an electronic device, and more particularly to a grounding structure for an electronic device in which a substrate is grounded by connecting the substrate and a frame.

FIG. 5 is a cross-sectional view showing a configuration of a ground structure of a conventional electronic device.
In an electronic device such as a portable MD player or a portable hard disk player, the ground structure of the substrate 21 accommodated in the housing 20 is attached to the frame 22 as shown in FIG. The electrical connection between the substrate 21 and the frame 22 is achieved by the screws 23 for the frame 22, and the frame 22 and the housing are further secured by the screws 23 for attaching the frame 22 to the housing 20 as shown in FIG. 20 is configured to achieve electrical continuity with 20.

  As another grounding structure, a shelf board that supports the board, a through hole formed in the shelf board, a fixing bracket that is fixed to the shelf board, and a fixing bracket that is inserted into the through hole of the shelf board. A standing tongue piece protruding from the through hole and a spring member attached to the standing tongue piece, and arranging the board so as to elastically contact the spring member. It has been proposed to achieve electrical continuity between the rack and the shelf (see, for example, Patent Document 1).

However, in the case of an electronic device that supports USB 2.0, since the transfer speed is high, it is necessary to perform ground connection at the adjacent position for each connector mounted on the board. In the conventional technology for conducting electricity, it is difficult to secure an area for screwing at adjacent positions of all connectors, and ground connection cannot be made for each connector mounted on the board. In the prior art shown in FIG. 2, since the spring member is configured to elastically contact the board surface, the ground connection cannot be performed at a position adjacent to the connector mounted on the board. was there.
JP 2000-77868 A

  The present invention has been made in view of such problems, and an object of the present invention is to provide an electronic device capable of performing ground connection at an adjacent position for each connector mounted on a board. It is in.

In order to solve the above problems, the present invention has the following configurations.
An electronic device ground structure according to the present invention is an electronic device ground structure in which a substrate attached to a frame is housed in a housing, and the frame is disposed so as to surround a part of a peripheral portion of the substrate. And a U-shaped ground spring that is formed with a ground spring mounting hole adjacent to the connector mounted on the board at the peripheral edge of the board, and is bent so that both end pieces face each other, One piece is in contact with the outer surface of the frame, and the other piece is sandwiched so as to be in contact with the inner peripheral surface of the ground spring mounting hole on the frame side, and the ground spring provides electrical connection between the substrate and the frame. It is characterized by being.

  Furthermore, the ground structure of the electronic device according to the present invention is characterized in that a plurality of the connectors are mounted on the substrate, and the ground spring mounting holes are formed adjacent to the plurality of connectors, respectively.

  Furthermore, the ground structure of the electronic device according to the present invention is characterized in that the ground spring mounting hole is formed at a position where no other circuit component is interposed between the connectors.

  The ground structure of the electronic device according to the present invention includes a U-shaped ground spring bent so that both end pieces face each other, and a ground spring attached with one piece in contact with the outer surface of the frame and the other piece formed on the peripheral edge of the substrate By sandwiching the hole so that it contacts the inner peripheral surface of the frame side, it is possible to realize a ground structure with a small area by configuring it so as to achieve electrical conduction between the substrate and the frame. For each mounted connector, there is an effect that the ground connection can be performed at the adjacent position.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is an external view showing an external configuration of an embodiment of an electronic apparatus according to the present invention, and FIG. 2 is an exploded view showing an example of attachment of a frame and a substrate in the embodiment of the electronic apparatus according to the present invention. FIG. 3 is a top view showing the configuration of the substrate shown in FIG. 2, and FIG. 4 is a cross-sectional view showing the configuration of the embodiment of the earth structure of the electronic device according to the present invention.

  The electronic apparatus according to the present embodiment is a portable audio reproduction / recording device that reproduces / records an audio signal, such as a portable MD player or a portable hard disk player. Referring to FIG. As shown in FIG. 2, the frame 4 is attached to the bottom cabinet 3 with screws 6, and the substrate 5 is attached to the frame 4 with screws 6. .

  The frame 4 is a plate-like member that is bent in a U-shape, and is made of a conductive material. Further, the frame 4 is formed by extending a screw fastening portion 7 for attaching the substrate 5 with screws 6, and in a state where the substrate 5 is attached to the frame 4, the frame 4 is as shown in FIG. 3. Are disposed so as to surround the three directions of the peripheral edge of the substrate 5.

  Referring to FIG. 3, various circuit components 8 are mounted on the substrate 5 and soldered, and a connector 9 is mounted on the peripheral portion and soldered. As the connector 9, a USB terminal, a headphone terminal, a microphone terminal, a signal input terminal, a cradle terminal, and the like can be considered. Usually, a plurality of connectors 9 are mounted on the peripheral portion of the substrate 5.

  In addition, ground spring mounting holes 10 are respectively formed in the peripheral portion of the substrate 5 at positions adjacent to the respective connectors 9 mounted on the substrate 5, that is, positions where no other circuit components 8 are interposed between the connectors 9. A frame ground pattern (hereinafter referred to as FG pattern) drawn from the ground terminal of the adjacent connector 9 is formed on the inner peripheral surface of the ground spring mounting hole 10.

  The electrical connection between the frame 4 and the substrate 5, that is, the ground connection of the FG pattern is performed by a ground spring 11 formed of a conductive material. As shown in FIG. 4, the earth spring 11 is a U-shaped leaf spring that is bent so that both end pieces face each other. One piece contacts the outer surface of the frame 4, and the other piece is a frame of the earth spring mounting hole 10. It is clamped so as to come into contact with the inner peripheral surface on the 4 side. In the clamped state, as shown by arrows in FIG. 4, both end pieces of the ground spring 11 are urged toward each other, one piece is on the outer surface of the frame 4, and the other piece is on the frame 4 side of the ground spring mounting hole 10. The frame 5 is electrically connected to the substrate 5, that is, the FG pattern formed on the substrate 5.

  A larger contact area between the inner peripheral surface of the earth spring mounting hole 10 and the other piece of the ground spring 11 is desirable, and the shape of the contact surface of the other piece of the ground spring 11 is the same as the shape of the inner peripheral surface of the earth spring mounting hole 10. good. That is, as shown in FIG. 3, when the shape of the ground spring mounting hole 10 is circular, the shape of the contact surface in the other piece of the ground spring 11 is curved in accordance with the shape of the inner peripheral surface of the ground spring mounting hole 10. Thus, the contact area between the inner peripheral surface of the ground spring mounting hole 10 and the other piece of the ground spring 11 can be increased.

  As described above, according to the present embodiment, the U-shaped earth spring 11 bent so that both end pieces face each other is in contact with the outer surface of the frame 4 and the other piece is the peripheral edge of the substrate 5. The ground spring mounting hole 10 formed in the portion is sandwiched so as to be in contact with the inner peripheral surface on the frame side, and is configured to achieve electrical continuity between the substrate 5 and the frame 4, thereby reducing the grounding in a small area. The structure can be realized, and each connector 9 mounted on the substrate 5 can be grounded at an adjacent position.

  Note that the present invention is not limited to the above-described embodiments, and it is obvious that the embodiments can be appropriately changed within the scope of the technical idea of the present invention. In addition, the number, position, shape, and the like of the constituent members are not limited to the above-described embodiment, and can be set to a suitable number, position, shape, and the like in practicing the present invention. In each figure, the same numerals are given to the same component.

It is an external view which shows the external appearance structure of embodiment of the electronic device which concerns on this invention. It is an exploded view which shows the example of attachment of the flame | frame and board | substrate of embodiment of the electronic device which concerns on this invention. It is a top view which shows the structure of the board | substrate shown in FIG. It is sectional drawing which shows the structure of embodiment of the earth structure of the electronic device which concerns on this invention. It is sectional drawing which shows the structure of the earth structure of the conventional electronic device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Upper cavity 2 Center cavity 3 Bottom cavity 4 Frame 5 Board | substrate 6 Screw 7 Screw fastening part 8 Circuit component 9 Connector 10 Ground spring attachment hole 11 Ground spring

Claims (3)

An electronic equipment grounding structure in which a board attached to a frame is housed in a housing,
The frame is disposed so as to surround a part of the peripheral edge of the substrate,
In the peripheral part of the substrate, an earth spring mounting hole is formed adjacent to the connector mounted on the substrate,
A U-shaped earth spring bent so that both end pieces face each other is sandwiched so that one piece contacts the outer surface of the frame and the other piece contacts the inner peripheral surface of the earth spring mounting hole on the frame side. The ground structure of the electronic device is characterized in that the grounding spring provides electrical continuity between the substrate and the frame. A plurality of the connectors are mounted on the board,
The ground structure for an electronic device according to claim 1, wherein the ground spring mounting hole is formed adjacent to the plurality of connectors. 3. The ground structure for an electronic device according to claim 1, wherein the ground spring mounting hole is formed at a position where no other circuit component is interposed between the connectors.

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