JP2006264043A - Multilayered sheet and electronic part feeding container comprising it - Google Patents
Multilayered sheet and electronic part feeding container comprising it Download PDFInfo
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Abstract
Description
本発明は、打抜性に優れた多層シート、及びそれを成形してなる電子部品搬送用容器に関するものである。 The present invention relates to a multilayer sheet excellent in punchability and an electronic component transport container formed by molding the multilayer sheet.
従来、単層又は多層のシートに穴をあける際、バリや毛羽が発生するといった問題があった。特にキャリアテープ等の電子部品搬送用容器として使用する場合は、この発生したバリや毛羽の脱落物が内容物である電子部品等に付着し、絶緑されているべき箇所の間のショート（短絡）や、汚染の原因になるため、重大な問題となっている。またバリや毛羽の発生は外観的にも好ましくない。近年は、電子部品の微細化・高性能化により、バリや毛羽低減への要求がより強まってきている。そこで、バリや毛羽を低減するため手段として、穴をあける際に発生したバリや毛羽をプラズマ照射（特許文献１参照）や熱風（特許文献２参照）により除去する方法が取られているが、設備の改造には多大な費用が必要であった。設備の改造に多大な費用をかける事無く、バリや毛羽の発生が無く打抜性に優れた多層シートを使用することで、バリや毛羽の無い電子部品搬送用容器とすることが求められている。 Conventionally, there has been a problem that burrs and fluff are generated when a hole is made in a single-layer or multilayer sheet. In particular, when used as a container for transporting electronic parts such as carrier tape, the generated burrs and fluff fall off adhere to the electronic parts, etc., and short between the parts that should be green (short circuit) ) And pollution, which is a serious problem. Also, the occurrence of burrs and fluff is not preferable in terms of appearance. In recent years, demands for reducing burrs and fluff are increasing due to miniaturization and high performance of electronic components. Therefore, as a means for reducing burrs and fluff, a method of removing burrs and fluff generated when making a hole by plasma irradiation (see Patent Document 1) and hot air (see Patent Document 2) has been taken. It took a lot of money to modify the equipment. There is a need to use a multilayer sheet that does not generate burrs or fluff and has excellent punchability without costly remodeling equipment, so that it can be used as a container for transporting electronic components without burrs and fluff. Yes.
本発明は、バリや毛羽の発生が無く打抜性に優れた多層シート、及びそれからなる、バリや毛羽が無い電子部品搬送用容器を提供する事にある。 An object of the present invention is to provide a multilayer sheet that is free from burrs and fluff and has excellent punchability, and an electronic component transport container that is free from burrs and fluff.
本発明は、
（１）ポリスチレン（PSと記載する。）系樹脂を主成分とする層の両面に、単層でシーティングした際に打抜性に優れた、導電性PS系樹脂組成物からなる層を積層した多層シートであって、PS系樹脂を主成分とする層に、両面に積層している層の導電性PS系樹脂が１〜１０重量％含まれる事を特徴とする多層シート、
（２）前記導電性ＰＳ系樹脂に導電性フィラーが１０〜３０重量％含まれる（１）項記載の多層シート、
（３）前記多層シートの層構成及び層の厚み比率（％）が、導電性ＰＳ系樹脂組成物からなる層／ＰＳ系樹脂を主成分とする層／導電性ＰＳ系樹脂組成物からなる層＝３〜２０／９４〜６０／３〜２０である（１）又は（２）項記載の多層シート、
（４）（１）〜（３）項のいずれか記載の多層シートを成形してなる電子部品搬送用容器、
である。
The present invention
(1) A layer made of a conductive PS-based resin composition having excellent punchability when sheeted as a single layer was laminated on both surfaces of a layer mainly composed of polystyrene (PS). A multilayer sheet, characterized in that 1 to 10% by weight of the conductive PS resin of the layer laminated on both sides is contained in the layer mainly composed of PS resin,
(2) The multilayer sheet according to (1), wherein the conductive PS-based resin contains 10 to 30% by weight of a conductive filler,
(3) The layer structure of the multilayer sheet and the layer thickness ratio (%) are a layer composed of a conductive PS resin composition / a layer composed mainly of a PS resin / a layer composed of a conductive PS resin composition. = The multilayer sheet according to (1) or (2), wherein 3 to 20/94 to 60/3 to 20,
(4) Electronic component transport container formed by molding the multilayer sheet according to any one of (1) to (3),
It is.
本発明に従うと、バリや毛羽を低減するために設備の改造に多大な費用をかける事無く、バリや毛羽の発生が無く打抜性に優れた多層シートを使用することで、バリや毛羽が無い電子部品搬送用容器を提供できる。 According to the present invention, without using a large amount of cost for remodeling equipment in order to reduce burrs and fluff, the use of a multilayer sheet that is free of burrs and fluff and has excellent punchability, It is possible to provide a container for transporting no electronic parts.
以下、本発明を更に詳細に説明する。
本発明は、ＰＳ系樹脂を主成分とする層に、単層でシーティングした際に打抜性に優れた、導電性ＰＳ系樹脂組成物を、１〜１０重量％添加する点にある。この効果は少量の導電性ＰＳ系樹脂の添加で実現できることから、シート物性の変化を僅かに押えることが出来るため、打抜性の改善に非常に有効な方法である。また、ＰＳ系樹脂を主成分とする層に添加する導電性ＰＳ系樹脂組成物は、PS系樹脂を主成分とする層の両面に積層しているものを使用することにより、新たな樹脂等を調達する必要もなく、同じＰＳ系の樹脂を配合するため、多種類の樹脂を添加する場合に比べ、リサイクルも容易であり、環境負荷も少ない。
Hereinafter, the present invention will be described in more detail.
The present invention resides in that 1 to 10% by weight of a conductive PS resin composition having excellent punchability when sheeted as a single layer is added to a layer containing a PS resin as a main component. Since this effect can be realized with the addition of a small amount of conductive PS resin, the change in sheet physical properties can be suppressed slightly, which is a very effective method for improving punchability. In addition, the conductive PS resin composition added to the layer containing the PS resin as a main component is a new resin or the like by using a layer laminated on both sides of the layer containing the PS resin as a main component. Since the same PS resin is blended, recycling is easier and the environmental load is less than when adding many types of resins.
近年、ＰＳ系樹脂を主成分とする単層シートでは、静電気問題により、内容物である電子部品の静電気破壊や、実装不良の問題が起きており、導電処理をしたキャリアテープが求められている。一般に、導電性ＰＳ系樹脂組成物は高価であり、強度も弱いことから、安価で、強度も強いＰＳ系樹脂を主成分とする層に積層して用いることで、コストを押えることが出来る。また、ＰＳ系樹脂を主成分とする単層シートでは打抜性が悪いため、PS系樹脂を主成分とする層の両面に、単層でシーティングした際に打抜性に優れた導電性ＰＳ系樹脂組成物を、積層することでも、バリや毛羽の発生をある程度押えることが出来る。しかしながら、電子部品の微細化や高性能化により、近年は更にバリや毛羽に対する要求が更に高まっているので、その要求を満たすためには、高コストな導電性ＰＳ系樹脂組成物層を、厚くしたり、打抜機を改良したりと多大な費用がかかる。この本発明では、ＰＳ系樹脂を主成分とする層中に、単層でシーティングした際に打抜性に優れた導電性ＰＳ系樹脂組成物を、１〜１０重量％配合することで、コストの上昇を最小限に押えこの問題を解決した。 In recent years, single-layer sheets mainly composed of PS-based resins have caused problems such as electrostatic breakdown of electronic components that are contents and mounting defects due to static electricity problems, and there is a need for carrier tapes that have been subjected to conductive treatment. . In general, since conductive PS resin compositions are expensive and weak in strength, the cost can be suppressed by using a PS resin that is inexpensive and strong in a layer as a main component. In addition, since a single layer sheet mainly composed of PS resin has poor punchability, a conductive PS having excellent punchability when sheeted on both sides of a layer mainly composed of PS resin. The occurrence of burrs and fluff can be suppressed to some extent by laminating the resin composition. However, due to miniaturization and higher performance of electronic parts, the demand for burrs and fluff has increased further in recent years. To satisfy these demands, a thick conductive PS resin composition layer is made thicker. Or improving the punching machine. In this invention, the conductive PS resin composition having excellent punchability when sheeted as a single layer in the layer containing the PS resin as a main component is blended in an amount of 1 to 10% by weight. This problem has been solved by minimizing the rise.
PS系樹脂を主成分とする層とは、PSを主成分とするものであれば何でも良く、特には規定しないが、ABS、HIPS、等のPS系樹脂にゴム成分が配合されたものが好ましい。また、必要に応じて、PS、HIPS、AS、ABS、MS、MBS等のPS系樹脂を混合したり、これらのPS系樹脂とゴム成分を混合したりして用いても良い。ゴム成分は特に規定しないが、ブタジエン系のゴムが好ましい。耐熱性や、耐候性を向上させるために、ブタジエン系ゴムの二重結合部を、部分的に又は完全に水素添加したものを用いても良い。 The layer mainly composed of PS resin may be anything as long as it is composed mainly of PS, and is not particularly limited. However, a material in which a rubber component is blended with PS resin such as ABS, HIPS, etc. is preferable. . If necessary, PS resins such as PS, HIPS, AS, ABS, MS, and MBS may be mixed, or these PS resins and rubber components may be mixed and used. The rubber component is not particularly defined, but butadiene rubber is preferred. In order to improve heat resistance and weather resistance, a double bond portion of a butadiene rubber may be partially or completely hydrogenated.
単層でシーティングした際に打抜性に優れた導電性ＰＳ樹脂組成物とは、PS系樹脂を主成分とする樹脂組成物に、導電性フィラーを分散したものである。導電性フィラーとしては、特に規定はしないが、色等の指定がない場合はカーボンブラックが分散性やコストの点から好ましい。中間層に用いるＰＳ系樹脂を主成分とする層は一般に透明〜白色であるが、カーボンブラックが含まれる導電性ＰＳ系樹脂を用いることにより、ＰＳ系樹脂を黒色にすることが出来る。中間層が透明〜白色であると、延伸されたキャリアテープポケットが部分的に透けることがあるが、カーボンブラックを用いることにより、この現象を押えることも出来る。 The conductive PS resin composition excellent in punchability when sheeted with a single layer is obtained by dispersing a conductive filler in a resin composition containing a PS resin as a main component. The conductive filler is not particularly defined, but carbon black is preferable from the viewpoint of dispersibility and cost when there is no designation of color or the like. The layer mainly composed of a PS resin used for the intermediate layer is generally transparent to white, but the PS resin can be made black by using a conductive PS resin containing carbon black. If the intermediate layer is transparent to white, the stretched carrier tape pocket may be partially transparent, but this phenomenon can be suppressed by using carbon black.
打抜性向上効果の発現は、導電性ＰＳ系樹脂組成物中に含まれる導電性フィラーが、ＰＳ系樹脂中に分散する点にある。導電性フィラーとＰＳ系樹脂の界面は他の場所に比べ弱い力で接着している。そのため、シートを打抜く際に力がかかると、接着力の弱い界面が優先的に剥がれる。一般に、樹脂を打抜く際には、部分的に引き伸ばされたり、切れ残ったりしたＰＳ系樹脂がバリや毛羽となって残る。しかし、接着力が弱い導電性フィラーとＰＳ系樹脂の界面が剥がれ落ちるため、部分的に引き伸ばされたり、切れ残ったりすることがほとんどなく、打抜面はきれいなものとなる。これらの理由により、打抜性を飛躍的に向上することが出来る。 The effect of improving the punchability is that the conductive filler contained in the conductive PS resin composition is dispersed in the PS resin. The interface between the conductive filler and the PS resin is bonded with a weaker force than other places. Therefore, when a force is applied when punching the sheet, the interface having a weak adhesive force is peeled off preferentially. In general, when a resin is punched out, a partially stretched or uncut PS resin remains as burrs or fluff. However, since the interface between the conductive filler having a weak adhesive force and the PS-based resin is peeled off, it is hardly stretched or left uncut and the punched surface is clean. For these reasons, the punchability can be dramatically improved.
PS系樹脂を主成分とする層に配合する、単層でシーティングした際に打抜性に優れた導電性PS系樹脂組成物の配合量は１〜１０重量％である。導電性ＰＳ系樹脂組成物の配合量が下限値未満であると、ＰＳ系樹脂中に分散される導電性フィラーの量が不十分であり、打抜性向上にあまり効果なく、上限値を超えると、コストアップ、著しい物性の低下、シート側面からの導電性フィラーの脱落等の問題が起こる。 The blending amount of the conductive PS resin composition, which is blended in the layer containing PS resin as a main component and excellent in punching property when sheeted in a single layer, is 1 to 10% by weight. When the blending amount of the conductive PS resin composition is less than the lower limit value, the amount of the conductive filler dispersed in the PS resin is insufficient, and the upper limit value is exceeded with little effect on improving punchability. As a result, problems such as an increase in cost, a significant decrease in physical properties, and dropping of the conductive filler from the side surface of the sheet occur.
導電性ＰＳ系樹脂組成物として、シート耳等の廃棄物を利用することもできる。この方法は、廃棄物が減るため、環境負荷が少なくなると共に、歩留まり向上にもつながりコスト的にも有利である。 As the conductive PS resin composition, waste such as sheet ears can be used. Since this method reduces waste, the environmental load is reduced, and the yield is improved, which is advantageous in terms of cost.
導電性ＰＳ系樹脂組成物中には１０〜３０重量％の導電性フィラーを含有していることが好ましい。導電性フィラーの含有量が下限値未満であると、PS系樹脂を主成分とする層の両面に積層した場合、十分な静電気防止効果が得られないと共に、ＰＳ系樹脂中に配合した際に、導電性フィラーの分散量が少ないため、打抜性の改善にあまり効果がない。また、上限値を超えると、表面抵抗値の低下にほとんど効果がないばかりでなく、導電性ＰＳ系樹脂の著しい物性の低下（ワレ等）や導電性フィラーの脱落、コストアップ等の問題が起こる。 The conductive PS resin composition preferably contains 10 to 30% by weight of a conductive filler. When the content of the conductive filler is less than the lower limit, when laminated on both sides of the layer mainly composed of PS resin, sufficient antistatic effect cannot be obtained, and when blended in PS resin In addition, since the amount of conductive filler dispersed is small, it is not very effective in improving punchability. In addition, when the upper limit is exceeded, not only is there any effect in reducing the surface resistance value, but there are also problems such as a significant decrease in physical properties of the conductive PS resin (cracking, etc.), dropping of the conductive filler, and cost increase. .
多層シートの層構成及び層厚み比率（％）は、導電性ＰＳ系樹脂組成物からなる層／ＰＳ系樹脂を主成分とする層／導電性ＰＳ系樹脂組成物からなる層＝３〜２０／９４〜６０／３〜２０の範囲内であることが好ましい。導電性ＰＳ系樹脂組成物からなる層の比率が下限値未満になると、深いポケットを成形した際に、導電層が引き伸ばされ、表面抵抗値が上昇してしまい、静電気防止の効果が少なくなり、静電気起因の問題が起こりやすくなる。また、上限値を超えると導電性ＰＳ系樹脂組成物は一般に高価で、強度が低いため、コストアップやポケット潰れ等の問題が起こる。 The layer configuration and the layer thickness ratio (%) of the multilayer sheet are: layer composed of conductive PS resin composition / layer composed mainly of PS resin / layer composed of conductive PS resin composition = 3 to 20 / It is preferable to be within the range of 94-60 / 3 to 20. When the ratio of the layer made of the conductive PS resin composition is less than the lower limit, when forming a deep pocket, the conductive layer is stretched, the surface resistance value is increased, and the effect of preventing static electricity is reduced. Problems caused by static electricity are likely to occur. On the other hand, when the upper limit is exceeded, the conductive PS resin composition is generally expensive and has low strength, which causes problems such as cost increase and pocket collapse.
本発明に用いられるＰＳ系樹脂及び導電性ＰＳ系樹脂組成物は、数種類の樹脂等を配合して用いて良い。また、必要に応じて流動性や力学的特性を改善するために、滑剤、可塑剤、加工助剤、相容化剤及び補強剤等の各種添加剤や樹脂等を添加することが可能である。特に導電性ＰＳ系樹脂組成物には導電性フィラーを均一に分散させるために、加工助剤等を加える事ができる。 The PS resin and conductive PS resin composition used in the present invention may be used by blending several kinds of resins. In addition, various additives such as lubricants, plasticizers, processing aids, compatibilizers and reinforcing agents, resins, and the like can be added as necessary to improve fluidity and mechanical properties. . In particular, a processing aid or the like can be added to the conductive PS resin composition in order to uniformly disperse the conductive filler.
電子部品搬送用容器として用いる場合には、発生した静電気を拡散させるため、シートの全体又は表面に導電処理を施すことが好ましく、その表面抵抗値は１０２〜１０１１Ω／□が望ましい。表面抵抗値が下限値未満であると、導電性が良すぎて、外部で発生した電気が流れ込んでしまい、内容物である電子部品を破壊する恐れがある。また上限値を超えると、静電気の拡散にあまり効果がなく、発生した静電気で内容物である電子部品等を破壊する恐れがある。また、打抜機内の打抜カスつまり、微細な打抜カス（粉）のシートや打抜機への付着も低減できるため導電処理を施すことができる。 When used as a container for transporting electronic components, in order to diffuse the generated static electricity, it is preferable to subject the entire sheet or the surface to a conductive treatment, and the surface resistance value is desirably 10 2 to 10 11 Ω / □. If the surface resistance value is less than the lower limit value, the conductivity is too good, and electricity generated outside flows in, which may destroy the electronic component as the contents. If the upper limit is exceeded, there is not much effect on the diffusion of static electricity, and there is a risk that the electronic parts and the like that are the contents will be destroyed by the generated static electricity. In addition, since it is possible to reduce the punching residue in the punching machine, that is, the adhesion of fine punching dust (powder) to the sheet or the punching machine, the conductive treatment can be performed.
本発明を実施例により更に詳細に説明するが、これは単なる例示であり、本発明はこれにより限定されるものではない。
＜実施例１＞
ＡＢＳ樹脂（日本エイアンドエル（株）製 サンタックGＴ−１０）に対して、導電性フィラーとしてカーボンブラックを含有した導電性ＰＳ系樹脂組成物（大日精化（株）製 ネオコンＤ４４３）を5重量％配合したものを中間層として用い、層比率（％）が導電性ＰＳ系樹脂組成物からなる層／ＡＢＳ樹脂に導電性PS系樹脂組成物５重量％を配合したものからなる層／導電性ＰＳ系樹脂組成物からなる層＝１０／８０／１０である厚み０．３ｍｍのシートを得た。
＜比較例１＞
ＡＢＳ樹脂（日本エイアンドエル（株）製 サンタックGＴ−１０）の単層シートを得た。
＜比較例２＞
ＡＢＳ樹脂（日本エイアンドエル（株）製 サンタックGＴ−１０）、導電性ＰＳ系樹脂（大日精化（株）製 ネオコンＤ４４３）を用い、層比率（％）が導電性ＰＳ系樹脂組成物からなる層／ＡＢＳ樹脂からなる層／導電性ＰＳ系樹脂組成物からなる層＝１０／８０／１０である厚み０．３ｍｍのシートを得た。
＜比較例３＞
ＡＢＳ樹脂（日本エイアンドエル（株）製 サンタックGＴ−１０）に対して、導電性ＰＳ系樹脂（大日精化（株）製 ネオコンＤ４４３）を０．２重量％配合したものを中間層として用い、層比率（％）が導電性ＰＳ系樹脂組成物からなる層／ＡＢＳ樹脂に導電性PS系樹脂組成物０．２重量％を配合したものからなる層／導電性ＰＳ系樹脂組成物からなる層＝１０／８０／１０である厚み０．３ｍｍのシートを得た。
＜比較例４＞
ＡＢＳ樹脂（日本エイアンドエル（株）製 サンタックGＴ−１０）に対して、導電性ＰＳ系樹脂（大日精化（株）製 ネオコンＤ４４３）を２０重量％配合したものを中間層として用い、層比率（％）が導電性ＰＳ系樹脂組成物からなる層／ＡＢＳ樹脂に導電性PS系樹脂組成物２０重量％を配合したものからなる層／導電性ＰＳ系樹脂組成物からなる層＝１０／８０／１０である厚み０．３ｍｍのシートを得た。
The present invention will be described in more detail by way of examples, but this is merely illustrative and the present invention is not limited thereby.
<Example 1>
5% by weight of conductive PS resin composition containing carbon black as a conductive filler (Neocon D443 manufactured by Dainichi Seika Co., Ltd.) is added to ABS resin (Santac GT-10 manufactured by Nippon A & L Co., Ltd.) The layer ratio (%) is composed of a conductive PS resin composition / ABS resin and 5% by weight of a conductive PS resin composition / conductive PS system. A sheet having a thickness of 0.3 mm in which the layer made of the resin composition = 10/80/10 was obtained.
<Comparative Example 1>
A single layer sheet of ABS resin (Santac GT-10 manufactured by Nippon A & L Co., Ltd.) was obtained.
<Comparative example 2>
A layer composed of a conductive PS resin composition with a layer ratio (%) using ABS resin (Santac GT-10 manufactured by Nippon A & L Co., Ltd.) and conductive PS resin (Neocon D443 manufactured by Dainichi Seika Co., Ltd.). / A layer made of ABS resin / A layer made of a conductive PS resin composition = 10/80/10 A sheet having a thickness of 0.3 mm was obtained.
<Comparative Example 3>
A layer containing 0.2% by weight of a conductive PS resin (Neocon D443, manufactured by Dainichi Seika Co., Ltd.) as an intermediate layer with respect to ABS resin (Nihon A & L Co., Ltd., Santac GT-10) Ratio (%) layer composed of conductive PS resin composition / ABS resin layer composed of 0.2% by weight of conductive PS resin composition / Layer composed of conductive PS resin composition = A sheet having a thickness of 0.3 mm which is 10/80/10 was obtained.
<Comparative example 4>
A 20% by weight mixture of conductive PS resin (Neocon D443 manufactured by Dainichi Seika Co., Ltd.) to ABS resin (Santac GT-10 manufactured by Nippon A & L Co., Ltd.) is used as an intermediate layer. %) Layer composed of conductive PS resin composition / ABS resin layer composed of 20% by weight of conductive PS resin composition / layer composed of conductive PS resin composition = 10/80 / Thus, a sheet having a thickness of 0.3 mm was obtained.
表１に打抜性及びカーボン脱落に関して評価した結果を示した。
打抜性の評価としては、キャリアテープ成形機（住友ベークライト（株）製）で４ｍｍピッチ・直径１．５ｍｍφの穴を連続で１０００個空け、打抜後の穴を観察し、バリや毛羽がほとんど目立たないものを○、目立つものを×とした。
カーボン脱落に関しては、シートをロール状に巻き、その端面を拭いた際に、カーボンブラックがほとんど付着しないものを○、著しく付着するものを×とした。
Table 1 shows the results of evaluation regarding punchability and carbon dropout.
For evaluation of punchability, 1000 holes of 4mm pitch and 1.5mmφ diameter were continuously drilled with a carrier tape molding machine (manufactured by Sumitomo Bakelite Co., Ltd.), the holes after punching were observed, and burrs and fluff were observed. An inconspicuous one was marked with ◯, and a conspicuous one was marked with ×.
Regarding carbon drop-off, when the sheet was wound into a roll and the end face was wiped, the case where carbon black hardly adhered was marked with ○, and the case where markedly adhered was marked with ×.
本発明を用いることにより、バリや毛羽を低減するために設備の改造に多大な費用をかける事無く、バリや毛羽の発生が無く打抜性に優れた多層シートを使用することで、バリや毛羽が無い電子部品搬送用容器を好適に得ることができる。 By using the present invention, it is possible to reduce the burrs and fluffs without using a large amount of cost for remodeling the equipment, and by using a multilayer sheet that is free of burrs and fluffs and has excellent punchability, An electronic component carrying container free of fluff can be suitably obtained.
Claims (4)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2005083887A JP2006264043A (en) | 2005-03-23 | 2005-03-23 | Multilayered sheet and electronic part feeding container comprising it |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2005083887A JP2006264043A (en) | 2005-03-23 | 2005-03-23 | Multilayered sheet and electronic part feeding container comprising it |
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| JP2005083887A Pending JP2006264043A (en) | 2005-03-23 | 2005-03-23 | Multilayered sheet and electronic part feeding container comprising it |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57205145A (en) * | 1981-06-11 | 1982-12-16 | Denki Kagaku Kogyo Kk | Composite plastic sheet |
| JP2001334611A (en) * | 2001-03-22 | 2001-12-04 | Denki Kagaku Kogyo Kk | Conductive composite plastic sheet and container |
| JP2002292805A (en) * | 2001-03-30 | 2002-10-09 | Daicel Polymer Ltd | Conductive resin sheet |
| JP2003170547A (en) * | 2001-12-07 | 2003-06-17 | Sumitomo Bakelite Co Ltd | Conductive sheet and container for conveying electronic component |
| JP2004082497A (en) * | 2002-08-27 | 2004-03-18 | Sumitomo Bakelite Co Ltd | Surface conductive composite plastic sheet |
| JP2006137022A (en) * | 2004-11-10 | 2006-06-01 | Shin Etsu Polymer Co Ltd | Plastic sheet for packaging electronic part, electronic part packaging container using it and electronic part package |
-
2005
- 2005-03-23 JP JP2005083887A patent/JP2006264043A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57205145A (en) * | 1981-06-11 | 1982-12-16 | Denki Kagaku Kogyo Kk | Composite plastic sheet |
| JP2001334611A (en) * | 2001-03-22 | 2001-12-04 | Denki Kagaku Kogyo Kk | Conductive composite plastic sheet and container |
| JP2002292805A (en) * | 2001-03-30 | 2002-10-09 | Daicel Polymer Ltd | Conductive resin sheet |
| JP2003170547A (en) * | 2001-12-07 | 2003-06-17 | Sumitomo Bakelite Co Ltd | Conductive sheet and container for conveying electronic component |
| JP2004082497A (en) * | 2002-08-27 | 2004-03-18 | Sumitomo Bakelite Co Ltd | Surface conductive composite plastic sheet |
| JP2006137022A (en) * | 2004-11-10 | 2006-06-01 | Shin Etsu Polymer Co Ltd | Plastic sheet for packaging electronic part, electronic part packaging container using it and electronic part package |
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