JP2006253494A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of being mounted rationally on an instrument without spoiling heat dissipating function. <P>SOLUTION: The semiconductor device with a heat dissipating body 3 abutted against one surface of a device main body 2 is constituted of a plurality of circuits, a plurality of circuits classified into a circuit 4 having a large generating amount of heat and another circuit 5 having a small generating amount of heat while being arranged concentrically in every classifications, and the heat dissipating body 3 abutted against a local part on one surface of the device main body 2 opposed to the site of concentrated arrangement of the circuit 4 having a large amount of generated heat. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor device, and more particularly, to a semiconductor device that can be reasonably mounted on equipment without impairing a heat dissipation function.

  Since a semiconductor device such as a CPU (Central Processing Unit) is provided with a large number of semiconductor circuits, heat generation due to a large amount of power consumption cannot be avoided. When the CPU becomes high temperature, it becomes unstable, causing malfunction or failure.

Therefore, conventionally, a heating element cooling device that is mounted on a semiconductor device such as a CPU and radiates heat generated by the semiconductor device into the air has been proposed (see Patent Document 1).
JP 2003-282803 A

  However, as shown in FIG. 3, the semiconductor device 20 equipped with the above-described heating element cooling device is configured so that the rectangular parallelepiped heating element cooling device 21 is in contact with the entire upper surface of the rectangular parallelepiped semiconductor device body 22. The overall shape of the semiconductor device 20 is a rectangular parallelepiped shape.

  For this reason, if the semiconductor device 20 is to be mounted in a special-shaped mounting area (a mounting area that is not a rectangular parallelepiped shape, hereinafter referred to as a special mounting area), for example, an inclined-shaped mounting area in the device, the special mounting area. This special mounting area cannot be used effectively due to mismatch between the shape of the semiconductor device and the shape of the semiconductor device.

  That is, since the use of the special mounting area due to the mounting of the semiconductor device 20 is wasted, when the semiconductor device 20 is mounted in the special mounting area and other devices are mounted, the other devices are more than necessary. It must be installed in small and small numbers.

  In view of the above problems, an object of the present invention is to provide a semiconductor device that can be reasonably mounted on a device without impairing the heat dissipation function.

  The present invention is premised on a semiconductor device in which a heat radiating member is brought into contact with one surface of a device main body constituted by a plurality of circuits.

  The present invention relates to a plurality of circuits that are classified into a circuit having a large calorific value and a circuit having a small calorific value and are arranged in a concentrated manner for each type, and the apparatus main body corresponding to a concentrated arrangement part of the circuit having a large calorific value. It is set as the structure provided with the said thermal radiation body contact | abutted to the local part of one surface.

  In this way, by configuring the semiconductor device by contacting the heat-dissipating body to the required local area on one surface of the semiconductor device body, the shape of the entire semiconductor device can be changed to a special mounting area in the device, for example, an inclined mounting area. Therefore, it can be rationally mounted on equipment without impairing the heat dissipation function.

  Further, the circuit having a large heat generation amount may be configured to be concentrated on the end side of the apparatus main body. In this way, the shape of the entire semiconductor device can be made to match the mounting area having an inclined shape with a gentle inclination angle. The heat radiator may be a heat sink.

  A semiconductor device is configured by contacting a necessary heat sink on one surface of the semiconductor device main body, so that the shape of the entire semiconductor device matches a special mounting area in the device, for example, an inclined mounting area. Therefore, it can be rationally mounted on the device without impairing the heat dissipation function.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic perspective view showing a semiconductor device 1 according to an embodiment of the present invention.

  The semiconductor device 1 includes a semiconductor device body 2 in which a plurality of circuits are disposed, and a heat sink 3 made of metal such as aluminum having a plurality of protrusions and recesses formed on the exposed surface.

  The heat sink 3 efficiently dissipates heat generated by the semiconductor device body 2 into the air by increasing the contact area with the atmosphere due to the uneven structure in addition to the good thermal conductivity of the aluminum itself. To do.

  By the way, the semiconductor device main body 2 is formed in a rectangular parallelepiped shape as a whole, and the plurality of circuits are classified into a circuit with a large amount of heat generation and a circuit with a small amount of heat generation, and are concentratedly arranged for each type. . Examples of the circuit that generates a large amount of heat include a buffer circuit through which a large amount of current flows, a high-speed circuit that operates with a high-speed clock, or a circuit that operates for a long time.

  That is, the semiconductor device main body 2 includes a portion 4 having a large heat generation amount in which circuits having a large heat generation amount are concentratedly arranged on one end side of the semiconductor device main body 2 and a circuit having a small heat generation amount. 2 is distinguished from the portion 5 having a small calorific value that is concentrated on the other end side.

  The heat sink 3 is formed in a rectangular parallelepiped shape as a whole, and is adhered and fixed to the upper surface of the semiconductor device body 2 corresponding to the portion 4 having a large heat generation amount with a heat conductive adhesive. ing.

  At this time, the upper surface of the semiconductor device body 2 corresponding to the portion 4 with the large amount of heat generation is a loading portion, and the top surface of the semiconductor device body 2 corresponding to the portion 5 with the small amount of heat generation is a non-loading portion.

  The semiconductor device 1 has a configuration in which the heat sinks 3 are stacked as described above, so that the non-loading portion is formed in a step shape and the upper surface of the heat sink 3 loaded on the loading portion is formed in a step shape.

  Hereinafter, a case where the semiconductor device 1 of the present invention is mounted on the image forming apparatus 10 as an apparatus will be described as an example.

  The image forming apparatus 10 forms an operation panel 11 that is inclined with the front side of the main body of the image forming apparatus 10 facing down, and the image forming apparatus 10 is formed on the back side of the operation panel 11. The semiconductor device 1 is disposed in the inclined mounting region 12.

  At this time, as described above, since the semiconductor device 1 is formed in a stepped shape having an inclination angle connecting the lower front end angle and the upper front end angle, the inclination angle of the semiconductor device 1 and the above As shown in FIG. 2B, the inclined mounting region 12 is mounted in a state where the shape of the semiconductor device 1 and the shape of the inclined mounting region 12 are matched.

  By the way, considering the case where the conventional semiconductor device 20 in which the entire shape described above is formed in a rectangular parallelepiped shape is disposed in the inclined mounting region 12, as shown in FIG. The semiconductor device 20 is mounted in a state where a mismatch between the shape of the semiconductor device 20 and the shape of the inclined mounting region 12 occurs.

  As shown in FIG. 2, when the semiconductor device 1 is mounted on the inclined mounting region 12 and the semiconductor device 20 is mounted on the inclined mounting region 12, the semiconductor device 1 is compared. Is mounted on the operation panel 11 by a distance h in the vertical direction.

  Therefore, since another device can be mounted in the mounting area consisting of the distance h, it can be said that the mounting area 12 having the inclined shape is more effectively used when the semiconductor device 1 is mounted.

  In this way, by configuring the semiconductor device by contacting the heat-dissipating body to the required local area on one surface of the semiconductor device body, the shape of the entire semiconductor device can be changed to a special mounting area in the device, for example, an inclined mounting area. Therefore, it can be rationally mounted on equipment without impairing the heat dissipation function.

  Since the circuit having a large amount of heat generation is configured to be concentrated on the end side of the device main body, the shape of the entire semiconductor device can be made to match the mounting region having an inclined shape with a gentle inclination angle.

  It should be noted that the concentrated arrangement part of the circuit having a large calorific value is not limited to the end part side of the semiconductor device 2 and may be an arbitrary part of the semiconductor device 2. At this time, for example, in the case where the semiconductor device 1 is mounted in a mountain-shaped mounting region, if the concentrated arrangement portion of a circuit having a large calorific value is set at the central portion of the semiconductor device body 2, the semiconductor device 1. The shape can be made to match the mounting area of the mountain shape.

  The configuration described in the above embodiment is merely a specific example and does not limit the technical scope of the present invention. Any configuration can be employed within the scope of the effects of the present application.

  A semiconductor device is configured by contacting a necessary heat sink on one surface of the semiconductor device main body, so that the shape of the entire semiconductor device matches a special mounting area in the device, for example, an inclined mounting area. Therefore, it is useful as a semiconductor device that can be reasonably mounted on equipment without impairing the heat dissipation function.

1 is a schematic perspective view showing a semiconductor device in an embodiment of the present invention. It is a schematic diagram showing a comparison between a state in which the semiconductor device of the present invention is mounted on an image forming apparatus and a state in which a conventional semiconductor device is mounted on an image forming apparatus. It is a schematic perspective view which shows the conventional semiconductor device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Semiconductor device main body 3 Heat sink 4 Part with large calorific value 5 Part with small calorific value 10 Image forming apparatus 11 Operation panel 12 Inclined mounting area 20 Semiconductor device 21 Heating element cooling device 22 Semiconductor device main body

Claims (3)

In a semiconductor device in which a radiator is abutted against one surface of a device body composed of a plurality of circuits,
The plurality of circuits arranged in a concentrated manner for each type by classifying into a circuit with a large amount of heat generation and a circuit with a small amount of heat generation,
The heat dissipating member in contact with a local portion of one surface of the apparatus main body corresponding to a concentrated arrangement portion of a circuit having a large calorific value; and
A semiconductor device comprising:   The semiconductor device according to claim 1, wherein the circuit having a large amount of heat generation is concentrated on an end side of the device main body. The semiconductor device according to claim 1, wherein the heat radiator is a heat sink.

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