JP2006253472A - Apparatus for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting apparatus which can mount on a substrate a semiconductor chip sucked and held by a tool chip and thereafter can prevent the tool chip from being moved back while carrying the semiconductor chip together. <P>SOLUTION: In the mounting apparatus for mounting on a substrate a semiconductor chip 6 sucked and held by a mounting tool, the mounting tool has a tool chip 76 for sucking and holding the semiconductor chip 6 on one surface of a suction hole 77 provided in the center of the tool chip to be passed therethrough. The tool chip is provided in its one surface for sucking and holding of the semiconductor chip with annular projections 78, 79, 82 which reduce a contact surface with an electronic component sucked and held by the suction force of the suction hole. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate by, for example, thermocompression bonding.

  When a semiconductor chip, which is an electronic component, is mounted on a substrate, a so-called flip chip type mounting apparatus is used. This mounting apparatus includes a wafer stage. A semiconductor wafer affixed to the adhesive sheet is held on the wafer stage. This semiconductor wafer is cut into a large number of dice-shaped semiconductor chips.

  Semiconductor chips are taken out from the wafer stage one by one by a pickup tool. The pick-up tool takes out the semiconductor chip and then rotates 180 degrees in the vertical direction to invert the semiconductor chip. That is, the surface on which the bump is formed faces downward.

  The inverted semiconductor chip is delivered to a mounting tool that is driven in the X, Y, and Z directions with the surface on which the bumps are formed facing down. The mounting tool has a tool main body and a tool tip whose one surface is held on the lower end surface of the tool main body. The tool tip is formed in a rectangular plate shape using a material such as ceramic, and a suction hole penetrating in the thickness direction is formed in the center.

  By applying a suction force to the suction hole of the tool chip, the semiconductor chip is sucked and held on the other surface. Then, by moving the mounting tool that holds the semiconductor chip by suction above the mounting position of the substrate and then lowering it, the semiconductor chip is pressed against the substrate and mounted, for example, via a thermosetting adhesive I am doing so.

  Conventionally, when the semiconductor chip is pressed against the substrate by the tool chip, the tool chip is sized to be equal to or larger than the semiconductor chip in order to prevent the semiconductor chip from warping or the peripheral portion from being chipped. Thus, the entire surface of the semiconductor chip can be pressed uniformly.

  However, if the tool chip is made to have a size equal to or larger than that of the semiconductor chip, when a suction force is generated in the suction hole, the entire one surface of the semiconductor chip is in close contact with the surface of the tool chip. Therefore, even if the suction force acting on the suction hole is released after the semiconductor chip is mounted on the substrate, the suction force remains between the contact surfaces of the tool chip and the semiconductor chip. The semiconductor chip may not be separated from the tool chip due to the residual suction force, so-called take-back of the semiconductor chip may occur.

Patent Document 1 showing the above-described mounting technique describes forming suction grooves in a lattice shape on a surface of a tool chip on which a semiconductor chip is sucked and held.
JP 2002-134905 A

  In the invention disclosed in Patent Document 1, the entire surface of the semiconductor chip is held by the surface on which the suction grooves of the tool chip are formed. The suction groove is formed in a lattice shape and communicates with a suction hole formed in the center of the tool tip. For this reason, when the suction force acting on the suction hole is released, the suction force acting on the suction groove is likely to disappear.

  However, the semiconductor chip is in close contact with a portion of the tool chip on which the semiconductor chip is suctioned and held, that is, a rectangular flat portion. The area of the rectangular part where the tool chip suction groove is not formed is 70 to 80% of the area of the semiconductor chip. In addition, since the suction grooves are formed in a lattice shape in the tool chip, when the semiconductor chip is held by suction, a suction force acts between the semiconductor chip in surface contact and each rectangular part.

  That is, in Patent Document 1, the suction force acting on the semiconductor chip is distributed over the entire surface of the semiconductor chip, and the surface contact between the semiconductor chip and the tool chip is not reduced. For this reason, even if the suction force acting on the suction hole is removed, the suction force tends to remain between the contact surfaces of the semiconductor chip and the tool chip.

  It is an object of the present invention to provide an electronic component mounting apparatus in which it is difficult for the electronic component to be taken home by a tool chip.

The present invention is a mounting apparatus for mounting an electronic component sucked and held by a mounting tool on a substrate,
The mounting tool has a tool tip that sucks and holds the electronic component on one surface formed with a suction hole penetrating in the thickness direction in the center,
The tool tip is provided with an annular ridge on one surface for holding the electronic component by suction to reduce the contact area with the electronic component that is sucked and held by the suction force acting on the suction hole. The electronic component mounting apparatus is characterized.

  It is preferable that the tool tip is provided with a plurality of annular ridges that contact at least a central portion and a peripheral portion in the radial direction of the electronic component.

  The annular ridge has at least one continuous annular ridge that continuously surrounds the periphery of the suction hole, and at least one communication groove that is provided outside the continuous annular ridge and communicates between the inside and the outside. It is preferable to have a discontinuous annular ridge.

  The electronic component has a square shape, and among the plurality of annular ridges, the outermost annular ridge is a cylindrical shape continuous in the circumferential direction, and the inner diameter dimension of the annular ridge is the width dimension of the electronic component. It is preferable that the outer diameter dimension is smaller than the diagonal dimension of the electronic component.

  According to the present invention, since the annular protrusion that contacts the electronic component is formed on the surface of the tool tip that holds the electronic component, the ratio of the contact area of the electronic component to the size of the tool tip decreases. Therefore, the electronic component can be reliably separated from the tool chip after mounting.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 4 show an embodiment of the present invention. The mounting apparatus shown in FIG. 1 includes a wafer stage 1 as a component supply unit. The wafer stage 1 has an X table 3, a Y table 4 and a θ table 5 sequentially provided on a base 2, and a wafer holder 8 on which a semiconductor wafer 7 is held as described later is provided on the θ table 5. ing. That is, the wafer holder 8 is provided so as to be driven in the horizontal direction. The semiconductor wafer 7 is divided into a large number of rectangular semiconductor chips 6 as electronic parts, which are electronic components.

  The semiconductor chip 6 is taken out by a pickup tool 11 constituting a pickup device. The pickup tool 11 is L-shaped and can be driven to rotate within a range of 180 degrees between a position indicated by a chain line and a position indicated by a solid line in FIG. A suction nozzle 13 that vacuum-sucks 6 is provided. Further, the pickup tool 11 can be driven in the X, Y direction (horizontal direction) and Z direction (vertical direction) by a driving means (not shown).

  The base 2 is provided with a support 15 at a position facing the wafer stage 1. On the upper surface of the support 15, a first base 16 having one end fixed to the support 15 and the other end protruding in the direction of the wafer stage 1 is provided horizontally. A stage table 17 is provided on the upper surface of the other end of the first base 16.

  The stage table 17 is provided with a Y table 18, an X table 19 provided on the Y table 18 and driven in the X direction to be in contact with and away from the wafer stage 1, and the X and Y provided on the X table 19. The mounting stage 20 is driven in the direction. The mounting stage 20 can be driven in a Z direction orthogonal to a plane formed by the X and Y directions by a driving source (not shown).

  A conveyance guide 21 is provided above the mounting stage 20. A substrate 22 such as a lead frame on which the semiconductor chip 6 taken out from the wafer holder 8 is mounted on the conveyance guide 21 by a pitch as described later by the pickup tool 11 is pitch-fed in a predetermined direction.

  A second base 25 is provided horizontally at one end of the first base 16 with a first spacer fixed via a first spacer 24. The second base 25 is shorter in length than the first base 16, and the other end protrudes toward the wafer stage 1.

  A camera table 26 is provided on the upper surface of the other end of the second base 25. The camera table 26 has a Y table 27. On the Y table 27, an X table 28 driven in the X direction is provided. On the X table 28, an attachment member 29 driven in the X and Y directions is provided.

  The attachment member 29 is provided with a camera unit 31. The camera unit 31 has a case 31a formed in a hollow box shape as shown in FIG. 2, and a first camera that images the substrate 22 transported along the transport guide 21 in the case 31a. 32 and a second camera 33 that images the semiconductor chip 6 transferred from the pickup tool 11 to a mounting tool 49 described later. Each of the cameras 32 and 33 is composed of a CCD (solid state imaging device).

  Imaging windows 36 are respectively formed on the lower surface and the upper surface of the tip of the camera unit 31. A mirror 38 having two reflecting surfaces 37 inclined at an angle of 45 degrees with respect to the imaging window 36 is accommodated in the distal end portion of the camera unit 31. Light incident from the lower imaging window 36 and reflected by one reflecting surface 37 enters the first camera 32. Light incident from the upper imaging window 36 and reflected by the other reflecting surface 37 enters the second camera 33.

  As shown in FIG. 2, the image pickup signals from the cameras 32 and 33 are input to an image processing unit (not shown) provided in the control device 39, where they are processed and converted into digital signals. ing. The control device 39 is provided on the support 15 as shown in FIG.

  As shown in FIG. 1, a second spacer 41 is provided on the upper surface of one end of the second base 25. The second spacer 41 is provided with a third base 42 horizontally with one end fixed. A head table 43 is provided on the upper surface of the other end of the third base 42. The head table 43 has a Y table 44. An X table 45 driven in the X direction is provided on the upper surface of the Y table 44. An attachment body 46 that is driven in the X and Y directions is provided on the upper surface of the X table 45.

  A Z table 47 is provided on the front end surface of the mounting body 46, and a mounting head 48 driven in the Z direction perpendicular to the plane formed by the X direction and the Y direction is provided on the Z table 47. Yes. The mounting tool 49 having a rectangular cross-sectional shape is provided at the tip of the mounting head 48 by a θ table 50 so that the horizontal rotation angle can be adjusted.

  As shown in FIG. 3, the mounting tool 49 has a tool body 71 having an upper end attached to the θ table 50. A suction path 72 is formed in the tool body 71. The suction path 72 has one end opened at the center of the lower end surface of the tool body 71 and the other end opened at the outer peripheral surface of the tool body 71. A suction pump 73 is connected to the other end of the suction path 72 via a suction pipe 74.

  The tool body 71 is provided with a heat generating portion 75 at the tip, and one surface of a tool chip 76 formed in a rectangular shape slightly larger than the semiconductor chip 6 with a material such as ceramic is formed on the heat generating portion 75. The surface of the heat generating part 75 is detachably held by means such as suction. The suction tube 74 is also formed in the heat generating part 75.

  As shown in FIGS. 4 (a) and 4 (b), the tool tip 76 has a suction hole 77 communicating with the suction pipe 74 formed in the center thereof in the thickness direction. A first continuous annular ridge 78 that continuously surrounds the periphery of the suction hole 77 is provided in a cylindrical shape on the other surface as the lower surface of the tool tip 76. Thus, the inside of the first continuous annular ridge 78 becomes a suction portion 78 a that becomes negative pressure by the suction force generated in the suction hole 77.

  A cylindrical discontinuous annular ridge 79 having a diameter larger than that of the first continuous annular ridge 78 is provided outside the first continuous annular ridge 78. In the peripheral wall of the discontinuous annular ridge 79, four communication grooves 81 communicating the inside and the outside are provided at intervals of 90 degrees in the circumferential direction.

  A second continuous annular ridge 82 having a larger diameter than the discontinuous annular ridge 79 is provided outside the discontinuous annular ridge 79. The second continuous annular protrusion 82 has an inner diameter dimension set slightly larger than the width dimension of the semiconductor chip 6 having a square shape, and an outer diameter dimension set to be smaller than the diagonal dimension of the semiconductor chip 6.

  Accordingly, when the semiconductor chip 6 is sucked and held on the lower surface of the tool chip 76 as shown in FIGS. 4A and 4B with the center thereof aligned with the center of the suction hole 77, the semiconductor chip 6 is radially aligned. The central portion is supported by the end surface of the first continuous annular ridge 78, the midway portion is supported by the end surface of the discontinuous annular ridge 79, and the four corner portions of the peripheral portion are the second continuous annular grooves 82. Supported by the end face.

  The outer peripheral edges of the four sides of the semiconductor chip 6 supported by the tool chip 76 are located slightly inside the inner peripheral surface of the second continuous annular groove 82, and between the outer edge and the inner peripheral surface. A gap 83 that communicates the inner peripheral portion of the second continuous annular ridge 82 with the outside air is formed.

  At the four corners of the lower surface of the tool chip 76, support ridges 84 for supporting the corners of the semiconductor chip 6 protruding radially outward from the second continuous annular groove 82 are provided. In addition, the said 1st continuous annular protrusion 78, the discontinuous annular protrusion 79, the 2nd continuous annular protrusion 82, and the support protrusion 84 are set to the same height dimension of 0.5 mm, for example.

  For example, when the semiconductor chip 6 has a square shape with a side length of 20 mm, the outer diameter of the first continuous annular protrusion 78 is 10 mm, the outer diameter of the discontinuous annular protrusion 79 is 16 mm, and the second The outer diameter of the continuous annular ridge 82 is set to 21 mm, and the width of the end face of each of the ridges 78, 79, 82 is set to 1 mm. As a result, when the semiconductor chip 6 is attracted and held by the tool chip 76, about 16% of the area comes into contact with the end faces of the protrusions 78, 79, 82 and the support protrusions 84.

  Note that the tool chip 76 is exchanged according to the size of the semiconductor chip 6 mounted on the substrate 22, and the semiconductor chip 6 and the protrusions 78, 79, 78, 79, regardless of the size of the semiconductor chip 6. The contact area between the end face of 82 and the support protrusion 84 is preferably small. That is, it is preferable to support the semiconductor chip 6 with a plurality of annular ridges 78, 79, and 82 in order to keep the semiconductor chip 6 in a small contact area and not deformed during adsorption.

  When the pick-up tool 11 picks up the semiconductor chip 6 from the wafer holder 8, the pick-up tool 11 rotates about 180 degrees in the clockwise direction indicated by the arrow in FIG. The nozzle 13 is directed upward. That is, the semiconductor chip 6 is inverted so that the upper and lower surfaces are reversed.

  In this state, the head table 43 operates to position the mounting tool 49 above the suction nozzle 13 of the pickup tool 11. Next, when the pickup tool 11 is raised, the mounting tool 49 receives the semiconductor chip 6 sucked and held by the suction nozzle 13.

  The wafer stage 1, the pickup tool 11, the stage table 17 provided with the mounting stage 20, the camera table 26 provided with the camera unit 31, and the head table 43 provided with the mounting tool 49 are driven by the control device 39. Is to be controlled.

  The wafer holder 8 is held horizontally on the upper surface of a support 60 whose lower end is attached to the θ table 5. A wafer ring (both not shown) on which an adhesive sheet is stretched is detachably held on the wafer holder 8. The semiconductor wafer 7 diced into a large number of rectangular semiconductor chips 6 is attached to the upper surface of the adhesive sheet.

  On the lower surface side of the pressure-sensitive adhesive sheet, a backup body 65 fixed to a fixing portion (not shown) is arranged in a state not interlocking with the horizontal movement of the wafer holder 8. A suction hole 64 penetrating in the axial direction is formed in the central portion of the backup body 65. A vacuum pump 66 is connected to the suction hole 64.

  The wafer holder 8 is positioned at a height at which the lower surface of the adhesive sheet 61 contacts the upper surface of the backup body 65 where the suction hole 64 is opened. Furthermore, the semiconductor chip 6 attached to the upper surface of the adhesive sheet 61 is imaged by an imaging camera 67 disposed above the wafer holder 8.

  The control device 39 moves the wafer holder 8 in the horizontal direction so that the semiconductor chip 6 picked up by the suction nozzle 13 is positioned corresponding to the suction hole 64 of the backup body 65 based on the imaging signal from the imaging camera 67. To position.

  The positioned semiconductor chip 6 is sucked by the suction nozzle 13. The suction nozzle 13 that sucks the semiconductor chip 6 rotates 180 degrees from the state shown by the chain line in FIG. 1 and turns upward. In this state, the mounting tool 49 vacuum-sucks the semiconductor chip 6 with the tool chip 76 provided at the lower end of the tool body 71 and receives it from the suction nozzle 13.

  The mounting tool 49 that receives the semiconductor chip 6 from the suction nozzle 13 returns to the upper side of the substrate 22 and then descends to place the semiconductor chip 6 at a predetermined position on the substrate 22 and the bumps 6a formed on the semiconductor chip 6. It will be implemented via.

  The central portion of the semiconductor chip 6 is adsorbed and held by the suction force generated in the suction portion 78 a surrounding the suction hole 77 formed by the first continuous annular protrusion 78. At that time, the semiconductor chip 6 is supported by the end face of the first annular protrusion 78 at the center in the radial direction, supported by the end face of the discontinuous annular protrusion 79, and the second continuous annular protrusion at the periphery. 82.

  That is, the semiconductor chip 6 is adsorbed only at the center corresponding to the suction part 78a, but the tool chip 76 is supported by the end faces of the annular ridges 78, 79, 82 in the radial center, midway and Each peripheral part is supported. Therefore, even when the semiconductor chip 6 is mounted on the substrate 2, even when the semiconductor chip 6 is pressed against the substrate 22 by the tool chip 76, it is possible to prevent warping or chipping.

  In particular, since the four corners protruding from the outer peripheral surface of the second annular protrusion 82, which are likely to be chipped of the semiconductor chip 6, are supported by the support protrusions 84, it is possible to reliably prevent the chipping of the part. can do.

  When the semiconductor chip 6 is completely mounted on the substrate 22, the suction force acting on the suction hole 77 of the tool chip 76 is released, and the mounting tool 49 is raised. At this time, if a suction force remains between the tool chip 76 and the semiconductor chip 6, the mounting tool 49 may bring back the semiconductor chip 6 due to the suction force.

  However, the portion where the suction force acts on the semiconductor chip 6 is only a small portion corresponding to the suction portion 78 a inside the first continuous annular protrusion 78. In addition, the tool chip 76 is provided with three annular ridges 78, 79, 82, and the semiconductor chip 6 is supported by the end surfaces of the annular ridges 78, 79, 82. Therefore, since the contact area between the semiconductor chip 6 and the tool chip 76 can be reduced, the suction force hardly remains because the contact area is small.

  Further, when the semiconductor chip 6 is sucked and held on the tool chip 76, it is between the inner peripheral surface of the second continuous annular ridge 82 supporting the peripheral part of the semiconductor chip 6 and a part of the outer edge of the semiconductor chip 6. Produces a gap 83. A midway portion in the radial direction of the semiconductor chip 6 is supported by a discontinuous annular protrusion 79 whose outside and inside communicate with each other by a communication groove 81.

  The space between the outer peripheral surface of the first continuous annular ridge 78 and the inner peripheral surface of the second continuous annular ridge 82 holds the semiconductor chip 6 by suction and holds the gap 83 and the discontinuous annular shape. The air is communicated with the atmosphere by a communication groove 81 formed in the protrusion 79.

  Therefore, if the suction force acting on the suction hole 77 is released, the suction force hardly remains in the portion outside the first continuous annular ridge 78. That is, the suction force does not remain between the end surfaces of the discontinuous annular protrusion 79 and the second continuous annular protrusion 82 and the contact surface with the semiconductor chip 6.

  As a result, even if the tool chip 76 is driven in the upward direction after the semiconductor chip 6 is mounted on the substrate 22, it is possible to reliably prevent the semiconductor chip 6 from being taken home by the tool chip 76.

  5 (a) and 5 (b) show another embodiment of the present invention. This embodiment is a modification of the protrusion formed on the tool tip 76A, and a rectangular tube-like continuous annular protrusion having a suction hole 77 surrounded on one surface of the tool tip 76A and the inside being a suction portion 91a. Article 91 is provided. On the outside of the continuous annular ridge 91, a first discontinuous annular ridge 92 and a second discontinuous annular ridge 93 having a rectangular tube shape are formed. Four communication grooves 92a and 93a are formed in the middle of the four sides of the peripheral walls of the first and second discontinuous annular ridges 92 and 93 to communicate the inside and the outside.

  The outer diameter of the second discontinuous annular protrusion 93 is set slightly larger than the outer diameter of the semiconductor chip 6. Thereby, when the semiconductor chip 6 is sucked and held by the tool chip 76 </ b> A, the outer peripheral edge thereof is positioned on the end surface of the second discontinuous annular protrusion 93.

  The semiconductor chip 6 is supported at the center in the radial direction by the continuous annular ridge 91, and at the middle in the radial direction by the first discontinuous annular ridge 92. Furthermore, each annular protrusion 91, 92, 93 has an end face width dimension of 1 mm and a height of 0.5 mm, as in the first embodiment.

  According to the tool chip 76A having such a configuration, the semiconductor chip 6 attracted and held by the tool chip 76A is reliably supported at the center portion, midway portion, and peripheral portion by the end surfaces of the annular protrusions 91, 92, and 93. Therefore, it is possible to prevent warping or chipping during mounting.

  Moreover, since the semiconductor chip 6 is only in contact with the end surfaces of the annular grooves 91, 92, 93, the contact area with the tool chip 76A is reduced. Therefore, the suction force hardly remains when the suction force acting on the suction hole 77 is released, and the outer side of the continuous annular ridge 91 is formed on the peripheral walls of the first and second discontinuous annular ridges 92 and 93. Since the communication grooves 92 a and 93 a communicate with the atmosphere, a suction force remains between the end surfaces of the first and second discontinuous annular protrusions 92 and 93 and the contact surface of the semiconductor chip 6. There is nothing.

  Therefore, it is possible to reliably prevent the semiconductor chip 6 from being taken home by the tool chip 76A that rises after the semiconductor chip 6 is mounted on the substrate 22 by these things.

  In the above-described embodiment, the case where the tool chip is applied to a so-called flip chip type mounting apparatus in which the upper and lower surfaces of the semiconductor chip are reversed and mounted on the substrate has been described. The tool chip can be used as long as it is a mounting device that sucks and mounts a semiconductor chip on a substrate.

  Further, the width dimension, the outer diameter dimension, or the number of end faces of the annular ridge formed on the tool chip is not limited. In short, the contact area with the semiconductor chip is small, and at least the center of the semiconductor chip during adsorption It is only necessary to support the portion and the peripheral portion, and to prevent the suction force from remaining between the contact surfaces when the suction force is released.

  In other words, it is sufficient that at least two annular ridges are formed on the tool chip, the peripheral wall of the annular ridge that supports the central portion of the semiconductor chip is continuous, and the other annular ridges are continuous or discontinuous. Any may be sufficient, and in the case of continuous, the internal space may be communicated with the atmosphere.

  The electronic component is not limited to a semiconductor chip, but may be another electronic component such as TCP (Tape Carrier Package). It is possible to apply.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the mounting apparatus which shows one embodiment of this invention. Sectional drawing of the camera which images a board | substrate and a semiconductor chip at the time of mounting. Sectional drawing of a mounting tool. (A) is a top view of a tool tip, (b) is side sectional drawing similarly. (A) is a top view of the tool tip which shows other embodiment of this invention, (b) is side sectional drawing similarly.

Explanation of symbols

  49 ... Mounting tool, 76 ... Tool tip, 77 ... Suction hole, 78 ... First continuous annular ridge, 79 ... Discontinuous annular ridge, 81 ... Communication groove, 82 ... Second continuous annular ridge, 91 ... Continuous annular ridge, 92 ... first discontinuous annular ridge, 93 ... second discontinuous annular ridge.

Claims (4)

A mounting device for mounting electronic components sucked and held by a mounting tool on a substrate,
The mounting tool has a tool tip that sucks and holds the electronic component on one surface formed with a suction hole penetrating in the thickness direction in the center,
The tool tip is provided with an annular ridge on one surface for holding the electronic component by suction to reduce the contact area with the electronic component that is sucked and held by the suction force acting on the suction hole. A mounting apparatus for electronic components.   2. The electronic component mounting apparatus according to claim 1, wherein the tool tip is provided with a plurality of annular ridges that contact at least a central portion and a peripheral portion in the radial direction of the electronic component.   The annular ridge has at least one continuous annular ridge that continuously surrounds the periphery of the suction hole, and at least one communication groove that is provided outside the continuous annular ridge and communicates between the inside and the outside. 3. The electronic component mounting apparatus according to claim 1, further comprising a discontinuous annular protrusion.   The electronic component has a square shape, and among the plurality of annular ridges, the outermost annular ridge is a cylindrical shape continuous in the circumferential direction, and the inner diameter dimension of the annular ridge is the width dimension of the electronic component. 2. The electronic component mounting apparatus according to claim 1, wherein the outer diameter dimension is smaller than the diagonal dimension of the electronic component.

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