JP2006252283A - Ic module and ic card - Google Patents

Ic module and ic card Download PDF

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JP2006252283A
JP2006252283A JP2005069218A JP2005069218A JP2006252283A JP 2006252283 A JP2006252283 A JP 2006252283A JP 2005069218 A JP2005069218 A JP 2005069218A JP 2005069218 A JP2005069218 A JP 2005069218A JP 2006252283 A JP2006252283 A JP 2006252283A
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connection terminals
substrate
chip
wiring patterns
module
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Hidetaka Ikeda
英貴 池田
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Toshiba Corp
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Toshiba Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC module which can use a substrate in common without depending on the types of IC chip and an IC card which houses the IC module. <P>SOLUTION: The IC module 10 is made by mounting the IC chip 4 on the second surface 2b of the substrate 2. On the active face of the IC chip 4 facing the second surface 2b, a plurality of terminals 5 are formed collectively in the center of the IC chip 4, and on the place corresponding to the second surface 2b of the substrate 2, a wiring pattern 8 is formed by collecting the wires in the center of the substrate 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、ＩＣカード用のＩＣモジュール、およびこのＩＣモジュールを内蔵したＩＣカードに関する。   The present invention relates to an IC module for an IC card and an IC card incorporating the IC module.

従来、ＩＣカードに取り付けられるＩＣモジュールとして、第１面に外部接続端子を備えた基板の第２面にＬＳＩ（ＩＣチップ）をダイボンドし、ＬＳＩの接続端子と外部接続端子に導通した第２面のボンディングパッドとをワイヤボンディングにより接続し、ＬＳＩおよびワイヤを樹脂によりモールドしたタイプのＩＣモジュールが知られている（例えば、特許文献１参照。）。ワイヤボンディング方式によりＬＳＩを基板に接続したＩＣモジュールの一例を図７および図８に示してある。   Conventionally, as an IC module attached to an IC card, an LSI (IC chip) is die-bonded to a second surface of a substrate having an external connection terminal on the first surface, and the second surface is electrically connected to the LSI connection terminal and the external connection terminal. There is known an IC module of a type in which an LSI and a wire are molded with a resin by connecting the bonding pads to each other by wire bonding (see, for example, Patent Document 1). An example of an IC module in which an LSI is connected to a substrate by a wire bonding method is shown in FIGS.

このように、ＬＳＩ１０４の接続端子１０５と基板１０２のパッド１０３をワイヤボンディング１０６により接続することにより、種類（大きさ）の異なるＬＳＩ１０４であっても同一基板を用いて実装でき、基板１０２を兼用できる。   In this way, by connecting the connection terminal 105 of the LSI 104 and the pad 103 of the substrate 102 by the wire bonding 106, even the LSI 104 of different types (sizes) can be mounted using the same substrate, and the substrate 102 can also be used. .

しかし、たとえば、この種のワイヤボンディング用のＬＳＩ１０４を表裏反転して、図９および図１０に示すように、基板１０２の第２面１０２ｂに形成された配線パターン１０８上にフリップチップ方式によって実装しようとすると、図７、８で説明したワイヤボンディング方式と比較してＬＳＩ１０４の接続端子１０５の向きが逆になり、図９に示すように、基板１０２の第２面１０２ｂに形成する配線パターン１０８が複雑になる問題が生じる。   However, for example, this type of wire bonding LSI 104 is turned over and mounted on the wiring pattern 108 formed on the second surface 102b of the substrate 102 by a flip chip method as shown in FIGS. Then, the direction of the connection terminal 105 of the LSI 104 is reversed as compared with the wire bonding method described in FIGS. 7 and 8, and the wiring pattern 108 formed on the second surface 102b of the substrate 102 is formed as shown in FIG. A complication arises.

また、このように、フリップチップ方式を採用した場合、ＬＳＩ１０４の種類（すなわちＬＳＩ１０４の接続端子１０５の位置）に応じて基板１０２の配線パターン１０８が略一義的に決まるため、上述したワイヤボンディング方式を採用した場合のように基板１０２を兼用することができない。
特開平１１−１８５００２号公報 In addition, when the flip chip method is employed in this way, the wiring pattern 108 of the substrate 102 is determined almost uniquely according to the type of the LSI 104 (that is, the position of the connection terminal 105 of the LSI 104). The board | substrate 102 cannot be shared like the case where it employ | adopts.
Japanese Patent Laid-Open No. 11-185002

この発明の目的は、ＩＣチップの種類によらず基板を兼用できるＩＣモジュール、およびこのＩＣモジュールを内臓したＩＣカードを提供することにある。   An object of the present invention is to provide an IC module that can also be used as a substrate regardless of the type of IC chip, and an IC card incorporating the IC module.

上記目的を達成するため、本発明のＩＣモジュールは、第１面に複数の外部接続端子を有するとともに、第２面に上記複数の外部接続端子それぞれに導通した複数本の独立した配線パターンを有する基板と、上記複数本の配線パターンそれぞれに接続する複数の接続端子を有し、これら複数の接続端子を上記複数本の配線パターンそれぞれに接触させた状態で上記基板の第２面に実装されるＩＣチップと、を有し、上記ＩＣチップの複数の接続端子は、該ＩＣチップが上記第２面に対面する能動面の形状およびサイズによらず、同じパターンで該能動面の中央に集めて形成されていることを特徴とする。   In order to achieve the above object, the IC module of the present invention has a plurality of external connection terminals on the first surface and a plurality of independent wiring patterns that are electrically connected to the plurality of external connection terminals on the second surface. A plurality of connection terminals connected to the substrate and the plurality of wiring patterns, respectively, and the plurality of connection terminals are mounted on the second surface of the substrate in contact with the plurality of wiring patterns. An IC chip, and the plurality of connection terminals of the IC chip are gathered in the center of the active surface in the same pattern regardless of the shape and size of the active surface where the IC chip faces the second surface. It is formed.

上記発明によると、種類の異なるＩＣチップであっても、複数の接続端子が同じパターンを有するため、同じ配線パターンを有する同じ基板を兼用できる。   According to the above invention, even if different types of IC chips are used, since the plurality of connection terminals have the same pattern, the same substrate having the same wiring pattern can also be used.

また、本発明のＩＣモジュールは、第１面に複数の外部接続端子を有するとともに、第２面に上記複数の外部接続端子それぞれに導通した複数本の独立した配線パターンを有する基板と、上記複数本の配線パターンそれぞれに接続する複数の接続端子を有し、これら複数の接続端子を上記複数本の配線パターンそれぞれに接触させた状態で上記基板の第２面に実装されるＩＣチップと、を有し、上記基板の複数本の配線パターンは、種類の異なるＩＣチップを実装した場合であっても、各ＩＣチップの複数の接続端子をそれぞれ対応する配線パターンに接触可能な位置に同じパターンで配線されていることを特徴とする。   In addition, the IC module of the present invention has a plurality of external connection terminals on the first surface, a substrate having a plurality of independent wiring patterns electrically connected to each of the plurality of external connection terminals on the second surface, and the plurality of the plurality of external connection terminals. An IC chip mounted on the second surface of the substrate in a state in which the plurality of connection terminals are connected to each of the wiring patterns, and the plurality of connection terminals are in contact with the respective wiring patterns. The plurality of wiring patterns on the substrate have the same pattern at positions where the plurality of connection terminals of each IC chip can contact the corresponding wiring patterns even when different types of IC chips are mounted. It is characterized by being wired.

上記発明によると、種類の異なるＩＣチップに対応させて基板の配線パターンを形成したため、種類の異なるＩＣチップに対して同じ基板を兼用できる。   According to the above invention, since the wiring pattern of the substrate is formed corresponding to different types of IC chips, the same substrate can be used for different types of IC chips.

また、本発明のＩＣカードは、第１面に複数の外部接続端子を有するとともに、第２面に上記複数の外部接続端子それぞれに導通した複数本の独立した配線パターンを有する基板と、上記複数本の配線パターンそれぞれに接続する複数の接続端子を有し、これら複数の接続端子を上記複数本の配線パターンそれぞれに接触させた状態で上記基板の第２面に実装されるＩＣチップと、を有し、上記ＩＣチップの複数の接続端子が、該ＩＣチップが上記第２面に対面する能動面の形状およびサイズによらず、同じパターンで該能動面の中央に集めて形成されているＩＣモジュールと、このＩＣモジュールを内蔵するＩＣカード本体と、を有する。   In addition, the IC card of the present invention has a plurality of external connection terminals on the first surface, a substrate having a plurality of independent wiring patterns respectively connected to the plurality of external connection terminals on the second surface, and the plurality of the plurality of external connection terminals. An IC chip mounted on the second surface of the substrate in a state in which the plurality of connection terminals are connected to each of the wiring patterns, and the plurality of connection terminals are in contact with the respective wiring patterns. A plurality of connection terminals of the IC chip, wherein the IC chips are gathered at the center of the active surface in the same pattern regardless of the shape and size of the active surface that faces the second surface. A module, and an IC card body incorporating the IC module.

さらに、本発明のＩＣカードは、第１面に複数の外部接続端子を有するとともに、第２面に上記複数の外部接続端子それぞれに導通した複数本の独立した配線パターンを有する基板と、上記複数本の配線パターンそれぞれに接続する複数の接続端子を有し、これら複数の接続端子を上記複数本の配線パターンそれぞれに接触させた状態で上記基板の第２面に実装されるＩＣチップと、を有し、上記基板の複数本の配線パターンが、種類の異なるＩＣチップを実装した場合であっても、各ＩＣチップの複数の接続端子をそれぞれ対応する配線パターンに接触可能な位置に同じパターンで配線されているＩＣモジュールと、このＩＣモジュールを内蔵するＩＣカード本体と、を有する。   Furthermore, the IC card of the present invention has a plurality of external connection terminals on the first surface, a substrate having a plurality of independent wiring patterns respectively connected to the plurality of external connection terminals on the second surface, and the plurality of the plurality of external connection terminals. An IC chip mounted on the second surface of the substrate in a state in which the plurality of connection terminals are connected to each of the wiring patterns, and the plurality of connection terminals are in contact with the respective wiring patterns. Even when the plurality of wiring patterns on the substrate are mounted with different types of IC chips, the plurality of connection terminals of each IC chip are arranged in the same pattern at positions where they can contact the corresponding wiring patterns. A wired IC module and an IC card body incorporating the IC module are included.

この発明のＩＣモジュール、およびＩＣカードは、上記のような構成および作用を有しているので、ＩＣチップの種類によらず基板を兼用できる。   Since the IC module and IC card of the present invention have the above-described configuration and operation, they can be used as a substrate regardless of the type of IC chip.

以下、図面を参照しながらこの発明の実施の形態について詳細に説明する。
図１には、この発明の第１の実施の形態に係るＩＣモジュール１０の平面図を示してある。また、図２には、図１のＩＣモジュール１０を線II-IIに沿って切断した断面図を示してある。ここで説明するＩＣモジュールは、図示しないＩＣカード本体に内蔵されて図示しないＩＣカードを構成する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 shows a plan view of an IC module 10 according to the first embodiment of the present invention. FIG. 2 shows a cross-sectional view of the IC module 10 of FIG. 1 cut along the line II-II. The IC module described here is built in an IC card body (not shown) to constitute an IC card (not shown).

ＩＣモジュール１０は、４角が面取りされた略矩形板状の基板２と、ＩＣチップ４（ＬＳＩ）と、を有する。基板２の第１面２ａには、複数の外部接続端子６が設けられ、第２面２ｂには、複数本の配線パターン８が形成されている。各配線パターン８は、基板２を貫通した孔２ｃを介して対応する外部接続端子６に導通し、その先端８ａが基板２の中央に集められている。   The IC module 10 includes a substantially rectangular plate-like substrate 2 with four corners chamfered, and an IC chip 4 (LSI). A plurality of external connection terminals 6 are provided on the first surface 2 a of the substrate 2, and a plurality of wiring patterns 8 are formed on the second surface 2 b. Each wiring pattern 8 is electrically connected to a corresponding external connection terminal 6 through a hole 2 c penetrating the substrate 2, and its tip 8 a is collected at the center of the substrate 2.

ＩＣチップ４は、基板２の第２面２ｂに対面する能動面４ａを有し、この能動面４ａが第２面２ｂに対向するように基板２の第２面２ｂに実装される。ＩＣチップ４の能動面４ａには、上述した基板２の各配線パターン８それぞれに接続する複数の接続端子５が設けられている。各接続端子５には、厚さ２０μｍ程度の金メッキによりバンプが形成されている。   The IC chip 4 has an active surface 4a facing the second surface 2b of the substrate 2, and is mounted on the second surface 2b of the substrate 2 so that the active surface 4a faces the second surface 2b. The active surface 4a of the IC chip 4 is provided with a plurality of connection terminals 5 connected to the respective wiring patterns 8 of the substrate 2 described above. Bumps are formed on each connection terminal 5 by gold plating with a thickness of about 20 μm.

しかして、ＩＣチップ４を基板２に実装する場合、まず、異方導電性接着剤（ＡＣＰ；Anisotropic Conductive Paste）等の絶縁接着材料に導電性充填材（フィラー）を混合した接着剤７を基板２の配線パターン８上に塗布する。そして、ＩＣチップ４の複数の接続端子５が対応する配線パターン８に接触するように、ＩＣチップ４の能動面４ａを基板２の第２面２ｂに対向させ、フリップチップ方式により、接着剤７を加熱して接続端子５と配線パターン８を圧着する。   Therefore, when the IC chip 4 is mounted on the substrate 2, first, an adhesive 7 in which an electrically conductive filler (filler) is mixed with an insulating adhesive material such as anisotropic conductive adhesive (ACP) is used as the substrate. It is applied on the second wiring pattern 8. Then, the active surface 4a of the IC chip 4 is opposed to the second surface 2b of the substrate 2 so that the plurality of connection terminals 5 of the IC chip 4 are in contact with the corresponding wiring pattern 8, and the adhesive 7 is applied by a flip chip method. And the connection terminal 5 and the wiring pattern 8 are pressure-bonded.

このように、本実施の形態のＩＣモジュール１０は、基板２の配線パターン８を中央に集め且つＩＣチップ４の接続端子５を配線パターン８に合わせて中央に集めたことを特徴としている。これにより、例えば、図３に示すように能動面の形状や大きさが異なるＩＣチップ１２を実装する場合、図１で説明した基板２と全く同じ基板を使用でき、ＩＣチップの形状やサイズによらず基板２を兼用できる。   As described above, the IC module 10 according to the present embodiment is characterized in that the wiring patterns 8 of the substrate 2 are collected in the center and the connection terminals 5 of the IC chip 4 are collected in the center in accordance with the wiring patterns 8. Accordingly, for example, when mounting an IC chip 12 having a different shape and size of the active surface as shown in FIG. 3, the same substrate as the substrate 2 described in FIG. 1 can be used. Regardless, the substrate 2 can also be used.

言い換えると、ＩＣチップ４の接続端子５をＩＣチップの種類によらず同じパターンで且つ最小サイズのＩＣチップに合わせて能動面４ａの中央に集めて形成し、且つ、基板２の配線パターン８を接続端子５に合わせて同じパターンで基板中央に集めたことで、ＩＣチップ４の種類によらず同じ配線パターン８を有する基板２を兼用できるようになった。   In other words, the connection terminals 5 of the IC chip 4 are gathered and formed in the center of the active surface 4a so as to match the minimum size IC chip regardless of the type of the IC chip, and the wiring pattern 8 of the substrate 2 is formed. By collecting in the center of the substrate in the same pattern according to the connection terminal 5, the substrate 2 having the same wiring pattern 8 can be used regardless of the type of the IC chip 4.

或いは、図４および図５に示す、この発明の第２の実施の形態に係るＩＣモジュール２０のように、各配線パターン２８に、基板２の対向する一組の辺２１、２２と平行に延びた細長い接触領域２６を設けることで、種類の異なるＩＣチップを実装する場合であっても基板２を兼用できる。   Alternatively, as in the IC module 20 according to the second embodiment of the present invention shown in FIGS. 4 and 5, each wiring pattern 28 extends in parallel with the pair of sides 21 and 22 facing the substrate 2. By providing the long and narrow contact region 26, the substrate 2 can also be used even when different types of IC chips are mounted.

例えば、細長い接触領域２６を有する基板２を用いて図６に示す種類の異なるＩＣチップ３２を実装する場合、上述した基板２の向かい合う一組の辺２１、２２と直交する方向に延びたＩＣチップ３２の縁部３２ａ近くで且つ対応する接触領域２６に接触可能な位置に接続端子５を設ければよい。つまり、基板２の配線パターン２８に同じ方向に延びた接触領域２６を持たせ、且つＩＣチップの対応する縁部近くに接触領域２６に接触可能なピッチで接続端子５を設けることで、種類の異なるＩＣチップであっても同一基板２を用いて実装できる。   For example, when a different IC chip 32 of the type shown in FIG. 6 is mounted using the substrate 2 having the elongated contact region 26, the IC chip extending in the direction orthogonal to the pair of sides 21 and 22 facing the substrate 2 described above. The connection terminal 5 may be provided at a position near the edge 32a of 32 and capable of contacting the corresponding contact area 26. That is, by providing the contact pattern 26 extending in the same direction on the wiring pattern 28 of the substrate 2 and providing the connection terminals 5 near the corresponding edge of the IC chip at a pitch that allows the contact pattern 26 to be contacted. Even different IC chips can be mounted using the same substrate 2.

以上のように、本発明によると、種類の異なるＩＣチップを同一基板に実装でき、基板を兼用できる。   As described above, according to the present invention, different types of IC chips can be mounted on the same substrate, and the substrate can also be used.

なお、この発明は、上述した実施の形態そのままに限定されるものではなく、実施段階ではその要旨を逸脱しない範囲で構成要素を変形して具体化できる。また、上述した実施の形態に開示されている複数の構成要素の適宜な組み合わせにより種々の発明を形成できる。例えば、上述した実施の形態に示される全構成要素から幾つかの構成要素を削除しても良い。更に、異なる実施の形態に亘る構成要素を適宜組み合わせても良い。   Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments. For example, you may delete some components from all the components shown by embodiment mentioned above. Furthermore, you may combine the component covering different embodiment suitably.

この発明の第１の実施の形態に係るＩＣモジュールを示す平面図。1 is a plan view showing an IC module according to a first embodiment of the present invention. 図１のＩＣモジュールの断面図。Sectional drawing of the IC module of FIG. 図１のＩＣモジュールに種類の異なるＩＣチップを実装した変形例を示す平面図。The top view which shows the modification which mounted IC chip from which a kind differs in the IC module of FIG. この発明の第２の実施の形態に係るＩＣモジュールを示す平面図。The top view which shows the IC module which concerns on 2nd Embodiment of this invention. 図４のＩＣモジュールの断面図。Sectional drawing of the IC module of FIG. 図４のＩＣモジュールに種類の異なるＩＣチップを実装した変形例を示す平面図。The top view which shows the modification which mounted IC chip from which a kind differs in the IC module of FIG. ＩＣチップをワイヤボンディングにより接続した従来のＩＣモジュールの一例を示す平面図。The top view which shows an example of the conventional IC module which connected the IC chip by wire bonding. 図７のＩＣモジュールの断面図。Sectional drawing of the IC module of FIG. 図７のＩＣチップを反転してフリップチップ方式によって基板に取り付けた従来例を示す平面図。The top view which shows the prior art example which reversed the IC chip of FIG. 7 and attached to the board | substrate by the flip-chip system. 図９のＩＣモジュールの断面図。Sectional drawing of the IC module of FIG.

符号の説明Explanation of symbols

２…基板、２ａ…第１面、２ｂ…第２面、４…ＩＣチップ、４ａ…能動面、５…接続端子、６…外部接続端子、７…接着剤、８…配線パターン、１０…ＩＣモジュール、２６…接触領域。   DESCRIPTION OF SYMBOLS 2 ... Board | substrate, 2a ... 1st surface, 2b ... 2nd surface, 4 ... IC chip, 4a ... Active surface, 5 ... Connection terminal, 6 ... External connection terminal, 7 ... Adhesive, 8 ... Wiring pattern, 10 ... IC Module, 26 ... contact area.

Claims (8)

第１面に複数の外部接続端子を有するとともに、第２面に上記複数の外部接続端子それぞれに導通した複数本の独立した配線パターンを有する基板と、
上記複数本の配線パターンそれぞれに接続する複数の接続端子を有し、これら複数の接続端子を上記複数本の配線パターンそれぞれに接触させた状態で上記基板の第２面に実装されるＩＣチップと、を有し、
上記ＩＣチップの複数の接続端子は、該ＩＣチップが上記第２面に対面する能動面の形状およびサイズによらず、同じパターンで該能動面の中央に集めて形成されていることを特徴とするＩＣモジュール。 A substrate having a plurality of external connection terminals on the first surface and a plurality of independent wiring patterns that are electrically connected to each of the plurality of external connection terminals on the second surface;
An IC chip mounted on the second surface of the substrate with a plurality of connection terminals connected to each of the plurality of wiring patterns, the plurality of connection terminals being in contact with the plurality of wiring patterns; Have
The plurality of connection terminals of the IC chip are formed by collecting the IC chips in the center of the active surface in the same pattern regardless of the shape and size of the active surface facing the second surface. IC module. 上記基板の配線パターンは、実装するＩＣチップの種類によらず、同じパターンを有することを特徴とする請求項１に記載のＩＣモジュール。   2. The IC module according to claim 1, wherein the wiring pattern of the substrate has the same pattern regardless of the type of IC chip to be mounted. 第１面に複数の外部接続端子を有するとともに、第２面に上記複数の外部接続端子それぞれに導通した複数本の独立した配線パターンを有する基板と、
上記複数本の配線パターンそれぞれに接続する複数の接続端子を有し、これら複数の接続端子を上記複数本の配線パターンそれぞれに接触させた状態で上記基板の第２面に実装されるＩＣチップと、を有し、
上記基板の複数本の配線パターンは、種類の異なるＩＣチップを実装した場合であっても、各ＩＣチップの複数の接続端子をそれぞれ対応する配線パターンに接触可能な位置に同じパターンで配線されていることを特徴とするＩＣモジュール。 A substrate having a plurality of external connection terminals on the first surface and a plurality of independent wiring patterns that are electrically connected to each of the plurality of external connection terminals on the second surface;
An IC chip mounted on the second surface of the substrate with a plurality of connection terminals connected to each of the plurality of wiring patterns, the plurality of connection terminals being in contact with the plurality of wiring patterns; Have
Even when different types of IC chips are mounted, the plurality of wiring patterns on the substrate are wired in the same pattern at positions where the plurality of connection terminals of each IC chip can contact the corresponding wiring patterns, respectively. An IC module characterized by comprising: 上記基板の複数本の配線パターンは、該基板の対向する一組の辺と平行に延びた細長い接触領域をそれぞれ有し、上記ＩＣチップの複数の接続端子は、上記一組の辺と直交する方向に延びたＩＣチップの縁部近くで且つ対応する接触領域に接触可能な位置に設けられていることを特徴とする請求項３に記載のＩＣモジュール。   The plurality of wiring patterns of the substrate each have an elongated contact region extending in parallel with a pair of opposing sides of the substrate, and the plurality of connection terminals of the IC chip are orthogonal to the pair of sides. 4. The IC module according to claim 3, wherein the IC module is provided near an edge of the IC chip extending in the direction and at a position where it can come into contact with a corresponding contact area. 上記ＩＣチップの複数本の接続端子は、ＩＣチップの種類によらず、同じパターンで、該ＩＣチップが上記第２面に対面する能動面の中央に集めて形成されていることを特徴とする請求項３に記載のＩＣモジュール。   The plurality of connection terminals of the IC chip are formed by collecting the IC chips at the center of the active surface facing the second surface in the same pattern regardless of the type of the IC chip. The IC module according to claim 3. 上記ＩＣチップの複数の接続端子は、導電性を有する接着剤を介して、それぞれ対応する上記基板の配線パターンに、フリップチップ方式で接続されることを特徴とする請求項１乃至請求項５のいずれか１項に記載のＩＣモジュール。   6. The plurality of connection terminals of the IC chip are connected to the corresponding wiring patterns of the substrate by a flip-chip method via a conductive adhesive. The IC module according to any one of the above. 第１面に複数の外部接続端子を有するとともに、第２面に上記複数の外部接続端子それぞれに導通した複数本の独立した配線パターンを有する基板と、上記複数本の配線パターンそれぞれに接続する複数の接続端子を有し、これら複数の接続端子を上記複数本の配線パターンそれぞれに接触させた状態で上記基板の第２面に実装されるＩＣチップと、を有し、上記ＩＣチップの複数の接続端子が、該ＩＣチップが上記第２面に対面する能動面の形状およびサイズによらず、同じパターンで該能動面の中央に集めて形成されているＩＣモジュールと、
このＩＣモジュールを内蔵するＩＣカード本体と、
を有することを特徴とするＩＣカード。 A substrate having a plurality of external connection terminals on the first surface and having a plurality of independent wiring patterns electrically connected to each of the plurality of external connection terminals on the second surface, and a plurality connected to each of the plurality of wiring patterns. An IC chip mounted on the second surface of the substrate in a state where the plurality of connection terminals are in contact with each of the plurality of wiring patterns, and a plurality of the IC chips An IC module in which the connection terminals are formed by gathering at the center of the active surface in the same pattern regardless of the shape and size of the active surface where the IC chip faces the second surface;
An IC card body containing the IC module;
An IC card characterized by comprising: 第１面に複数の外部接続端子を有するとともに、第２面に上記複数の外部接続端子それぞれに導通した複数本の独立した配線パターンを有する基板と、上記複数本の配線パターンそれぞれに接続する複数の接続端子を有し、これら複数の接続端子を上記複数本の配線パターンそれぞれに接触させた状態で上記基板の第２面に実装されるＩＣチップと、を有し、上記基板の複数本の配線パターンが、種類の異なるＩＣチップを実装した場合であっても、各ＩＣチップの複数の接続端子をそれぞれ対応する配線パターンに接触可能な位置に同じパターンで配線されているＩＣモジュールと、
このＩＣモジュールを内蔵するＩＣカード本体と、
を有することを特徴とするＩＣカード。 A substrate having a plurality of external connection terminals on the first surface and having a plurality of independent wiring patterns electrically connected to each of the plurality of external connection terminals on the second surface, and a plurality connected to each of the plurality of wiring patterns. An IC chip mounted on the second surface of the substrate in a state where the plurality of connection terminals are in contact with each of the plurality of wiring patterns, and the plurality of connection terminals of the substrate. Even if the wiring pattern is a case where different types of IC chips are mounted, an IC module in which a plurality of connection terminals of each IC chip are wired in the same pattern at positions where they can contact the corresponding wiring patterns, and
An IC card body containing the IC module;
An IC card characterized by comprising:
JP2005069218A 2005-03-11 2005-03-11 Ic module and ic card Pending JP2006252283A (en)

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