JP2006229075A - Laser heating device - Google Patents

Laser heating device Download PDF

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Publication number
JP2006229075A
JP2006229075A JP2005042927A JP2005042927A JP2006229075A JP 2006229075 A JP2006229075 A JP 2006229075A JP 2005042927 A JP2005042927 A JP 2005042927A JP 2005042927 A JP2005042927 A JP 2005042927A JP 2006229075 A JP2006229075 A JP 2006229075A
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heated
laser
lens
heating apparatus
ring
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JP4247495B2 (en
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Toru Watanabe
徹 渡辺
Takashi Chiba
貴志 千葉
Masao Terada
昌男 寺田
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Sakaguchi Dennetsu KK
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Sakaguchi Dennetsu KK
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0734—Shaping the laser spot into an annular shape

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Semiconductor Lasers (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that a conventional laser heating device can not heat a work to be heated, such as a semiconductor substrate or the like, so as to have a required heating distribution. <P>SOLUTION: The laser heating device is constituted of a laser light source and curved surface lenses for collecting laser beams from the laser light source, so as to have an annular shape. The curved surface lens is a disc type lens consisting of a convex lens type annular body in the section of the radial direction thereof. A plurality of the annular bodies are neighbored concentrically in the radial direction thereof. The sectional configurations of respective annular bodies are different from each other. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明はレーザ加熱装置、特に大きな面積を有する半導体基板等を一度の照射で所望の加熱分布で加熱することができるレーザ加熱装置に関するものである。   The present invention relates to a laser heating apparatus, and more particularly to a laser heating apparatus capable of heating a semiconductor substrate having a large area with a desired heating distribution by one irradiation.

従来、レーザ加熱装置のレーザ光を直接半導体基板等の被加熱物に照射する場合は、被加熱物からの反射光が半導体レーザ加熱装置に戻り半導体レーザ素子が破損することがあり、これを防止するため、レーザ光を斜めから被加熱物に照射して、被加熱物を加熱していた（引用文献１）。
特開２００１−２５２７７６号公報 Conventionally, when directly irradiating an object to be heated, such as a semiconductor substrate, with laser light from a laser heating device, the reflected light from the object to be heated returns to the semiconductor laser heating device, preventing the semiconductor laser element from being damaged. For this reason, the object to be heated is irradiated with laser light from an oblique direction to heat the object to be heated (Cited document 1).
JP 2001-252776 A

然しながら、上記従来のレーザ加熱装置はレーザ光を斜めから被加熱物に照射していたので、被加熱物上に所望の温度分布を得ることが難しかった。   However, since the conventional laser heating apparatus irradiates the object to be heated obliquely with the laser beam, it is difficult to obtain a desired temperature distribution on the object to be heated.

なお、レーザによる被加熱物１の加熱は、小さい面積であれば図１３に示すようにレンズ３で集光したレーザ光照射で可能であるが、大面積の場合はミラーによるスキャニングレーザ照射のような大掛かりの装置が必要であった。   Note that the object 1 to be heated by the laser can be heated by laser light focused by the lens 3 as shown in FIG. 13 if the area is small, but in the case of a large area, the scanning laser is irradiated by a mirror. Large-scale equipment was necessary.

また、レーザ光をレンズでデフォーカスしたレーザ光照射では、被加熱物の熱分布は均一ではなく、被加熱物の中心の方が外周に比べて温度が高くなってしまうという欠点があった。   Further, in the laser beam irradiation in which the laser beam is defocused with a lens, the heat distribution of the object to be heated is not uniform, and the temperature at the center of the object to be heated becomes higher than the outer periphery.

本発明は上記の欠点を除くようにしたものである。   The present invention eliminates the above-mentioned drawbacks.

本発明のレーザ加熱装置は、レーザ光源と、このレーザ光源から出るレーザー光をリング状に集光せしめる曲面レンズとよりなることを特徴とする。   The laser heating apparatus according to the present invention includes a laser light source and a curved lens that condenses laser light emitted from the laser light source in a ring shape.

上記曲面レンズは半径方向断面が凸レンズ状のリング体より成る円板状レンズであることを特徴とする。   The curved lens is a disk-shaped lens made of a ring body having a convex lens-like cross section in the radial direction.

また、上記リング体が同心円状に半径方向に複数隣接されていることを特徴とする。   In addition, a plurality of the ring bodies are concentrically adjacent to each other in the radial direction.

また、上記各リング体の断面形状が互いに異なることを特徴とする。   The ring bodies may have different cross-sectional shapes.

本発明のレーザ加熱装置によれば、被加熱物にリング状にレーザ光を照射できるので、被加熱物の表面の加熱温度分布の制御が容易となる。   According to the laser heating apparatus of the present invention, the object to be heated can be irradiated with the laser beam in a ring shape, so that it becomes easy to control the heating temperature distribution on the surface of the object to be heated.

以下図面によって本発明の実施例を説明する。   Embodiments of the present invention will be described below with reference to the drawings.

本発明のレーザ加熱装置は図１及び図２に示すように、高出力半導体レーザ等のレーザ光源（図示せず）と、上記レーザ光源から出たレーザ光２を円板状の半導体基板等の被加熱物４の表面に円板状の曲面レンズ５を介して照射せしめる。上記曲面レンズ５は例えば図２に示すように半径方向断面が凸レンズ状のリング体５ａにより形成せしめる。   As shown in FIGS. 1 and 2, the laser heating apparatus of the present invention is configured to irradiate a laser light source (not shown) such as a high-power semiconductor laser and a laser beam 2 emitted from the laser light source into a disk-shaped semiconductor substrate or the like. The surface of the object to be heated 4 is irradiated through a disk-shaped curved lens 5. For example, as shown in FIG. 2, the curved lens 5 is formed by a ring body 5a having a convex cross section in the radial direction.

本発明のレーザ加熱装置は上記のような構成であるから、上記レーザ光源から出たレーザ光２は上記曲面レンズ５を通過して図３に示すようにリング状に集光され、上記レーザ光２の焦点位置に設置した被加熱物４の表面をリング状に照射し、上記被加熱物４を加熱する。   Since the laser heating apparatus of the present invention has the above-described configuration, the laser light 2 emitted from the laser light source passes through the curved lens 5 and is condensed into a ring shape as shown in FIG. The surface of the object to be heated 4 placed at the focal position 2 is irradiated in a ring shape to heat the object to be heated 4.

上記のように本発明のレーザ加熱装置によれば、被加熱物４の外縁付近にリング状にレーザ光２を照射せしめることができるので、被加熱物４の中心が高温となるという問題を解決できる。   As described above, according to the laser heating apparatus of the present invention, the laser beam 2 can be irradiated in a ring shape near the outer edge of the object to be heated 4, thereby solving the problem that the center of the object to be heated 4 becomes high temperature. it can.

また、上記曲面レンズ５と上記被加熱物４との位置を変え、上記被加熱物４に照射されるレーザ光２のリングの幅や、上記被加熱物４のレーザ光を照射せしめる場所を調整することにより基板を更に均一に加熱できるようになる。   Further, the positions of the curved lens 5 and the object to be heated 4 are changed, and the width of the ring of the laser beam 2 irradiated to the object to be heated 4 and the place where the laser beam of the object to be heated 4 is irradiated are adjusted. By doing so, the substrate can be heated more uniformly.

図４及び図５は本発明のレーザ加熱装置の第２の実施例を示し、この第２の実施例においては、第１の実施例の半径方向断面が凸レンズ状のリング体を同心円状に、半径方向に２個隣接して形成した曲面レンズ６を用いる。   4 and 5 show a second embodiment of the laser heating apparatus of the present invention. In this second embodiment, the radial cross section of the first embodiment is a concentric circle with a convex lens shape. Two curved lenses 6 formed adjacent to each other in the radial direction are used.

本発明の第２の実施例のレーザ加熱装置においては、上記レーザ光源から出たレーザ光２を上記曲面レンズ６を通過せしめて図６に示すように同心円状の２重のリング状に集光せしめ、上記レーザ光の焦点位置に設置した被加熱物４を２重のリング状に照射し、上記被加熱物４を加熱せしめる。   In the laser heating apparatus according to the second embodiment of the present invention, the laser light 2 emitted from the laser light source passes through the curved lens 6 and is condensed into a concentric double ring as shown in FIG. The object to be heated 4 placed at the focal position of the laser beam is irradiated in a double ring shape, and the object to be heated 4 is heated.

この第２の実施例においては、被加熱物４が大きい場合であっても、被加熱物に同心円状の２重のリング状のレーザ光２を照射せしめるので、被加熱物４の表面の加熱温度分布の制御が容易となり、また、上記曲面レンズ６と上記被加熱物４との位置を変え、上記被加熱物４に照射したレーザ光２のリングの幅や、上記被加熱物４のレーザ光を照射せしめる場所を調整することにより基板を均一に加熱できるようになる。   In this second embodiment, even if the object to be heated 4 is large, the object to be heated is irradiated with the concentric double ring-shaped laser beam 2, so that the surface of the object to be heated 4 is heated. The temperature distribution can be easily controlled, the position of the curved lens 6 and the object to be heated 4 is changed, and the width of the ring of the laser beam 2 irradiated to the object to be heated 4 or the laser of the object to be heated 4 is changed. The substrate can be heated uniformly by adjusting the place where the light is irradiated.

なお、図７及び図８に示すように、上記曲面レンズ６の内側のリング体６ａの厚さを、外側のリング体６ｂの厚さに比べて小さくし、上記曲面レンズ６の外側のリング体６ｂを通過したレーザ光２の焦点位置に被加熱物４を配置し、図９に示すように、上記外側のリング体６ｂを通過したレーザ光２による外側リング７と、上記内側のリング体６ａを通過したレーザ光２がデフォーカスして形成された内側リング８とによる２重のリング状のレーザ光を用いて、被加熱物４の表面の加熱温度分布を制御せしめてもよい。   7 and 8, the thickness of the inner ring body 6a of the curved lens 6 is made smaller than the thickness of the outer ring body 6b, so that the outer ring body of the curved lens 6 is reduced. The object to be heated 4 is arranged at the focal position of the laser beam 2 that has passed through 6b, and as shown in FIG. 9, the outer ring 7 by the laser beam 2 that has passed through the outer ring body 6b, and the inner ring body 6a. The heating temperature distribution on the surface of the article to be heated 4 may be controlled by using a double ring-shaped laser beam formed by the inner ring 8 formed by defocusing the laser beam 2 that has passed through.

また、同心円状の上記リング体を３個以上用いれば更に大きい被加熱物の表面の加熱温度分布を制御せしめることができる。   Further, if three or more concentric ring bodies are used, the heating temperature distribution on the surface of the object to be heated can be controlled.

この場合、上記曲面レンズの複数のリング体の厚さなどの断面形状を夫々異ならしめて被加熱物の表面の加熱温度分布を制御せしめてもよい。   In this case, the heating temperature distribution on the surface of the object to be heated may be controlled by changing the cross-sectional shapes such as the thicknesses of the plurality of ring bodies of the curved lens.

また、上記各リング体の半径方向の幅を異ならしめて被加熱物に照射される各リングの直径を調整せしめ、被加熱物の表面の加熱温度分布を制御せしめてもよい。   Moreover, the diameter of each ring irradiated to a to-be-heated material may be adjusted by varying the radial width of each ring body to control the heating temperature distribution on the surface of the to-be-heated material.

また、上記被加熱物に照射される各リングの直径は他のレンズを組み合わせることにより調整せしめてもよい。   Moreover, you may adjust the diameter of each ring irradiated to the said to-be-heated object by combining another lens.

また、上記曲面レンズは球面レンズ、非球面レンズ、円柱を軸方向に２つに割った形をしているシリンドリカルレンズであってもよく、またこれらを組み合わせたレンズであってもよい。   The curved lens may be a spherical lens, an aspherical lens, a cylindrical lens having a cylindrical shape divided into two in the axial direction, or a lens combining these.

本発明の第３の実施例においては図１０及び図１１に示すように、レーザ光源と被加熱物４との間に、上記レーザ光源から出たレーザ光２をリング状に集光せしめる、半径方向断面が凸レンズ状の曲面レンズ９と、上記曲面レンズ９を通過し上記リング状に集光されたレーザ光２をコリメート（平行光に）するリング状のシリンドリカルレンズ１０と、上記シリンドリカルレンズ１０を通過したリング状の上記レーザ光２のリング径を拡大せしめる凹レンズ１１を設ける。   In the third embodiment of the present invention, as shown in FIG. 10 and FIG. 11, the radius for condensing the laser light 2 emitted from the laser light source in a ring shape between the laser light source and the article 4 to be heated. A curved lens 9 having a convex cross section, a ring-shaped cylindrical lens 10 that collimates (collimates) the laser light 2 that passes through the curved lens 9 and is condensed into the ring shape, and the cylindrical lens 10 A concave lens 11 for enlarging the ring diameter of the laser beam 2 passing through the ring is provided.

本発明の第３の実施例においては、上記レーザ光源１から出たレーザ光２を上記曲面レンズ９を通過せしめてリング状に集光せしめ、この集光したリング状のレーザ光２を上記シリンドリカルレンズ１０により再びコリメートし、上記凹レンズ１１により上記リング状のレーザ光２のリング径を拡大せしめて、図１２に示すように、上記被加熱物４にリング状に照射し、被加熱物４を加熱せしめる。   In the third embodiment of the present invention, the laser beam 2 emitted from the laser light source 1 passes through the curved lens 9 and is condensed in a ring shape, and the condensed ring-shaped laser beam 2 is condensed into the cylindrical beam. The collimation is performed again by the lens 10, the ring diameter of the ring-shaped laser beam 2 is enlarged by the concave lens 11, and the object to be heated 4 is irradiated in a ring shape as shown in FIG. Let it heat.

この第３の実施例によっても被加熱物４の表面の加熱温度分布の制御が容易となる。   This third embodiment also makes it easy to control the heating temperature distribution on the surface of the article 4 to be heated.

なお、上記シリンドリカルレンズ１０を通過したレーザ光２のリングの直径が上記被加熱物よりも小さいような場合には、上記凹レンズ１１を省略せしめてもよい。   If the diameter of the ring of the laser beam 2 that has passed through the cylindrical lens 10 is smaller than the object to be heated, the concave lens 11 may be omitted.

また、上記凹レンズ１１を通過したレーザ光を更にコリメートするためのレンズ（図示せず）を設けてもよい。   Further, a lens (not shown) for further collimating the laser light that has passed through the concave lens 11 may be provided.

本発明のレーザ加熱装置の縦断側面図である。It is a vertical side view of the laser heating apparatus of this invention. 本発明のレーザ加熱装置の曲面レンズの一部を切除した斜視図である。It is the perspective view which excised part of the curved lens of the laser heating apparatus of this invention. 図１に示すレーザ加熱装置を用いて加熱した被加熱物の正面図である。It is a front view of the to-be-heated material heated using the laser heating apparatus shown in FIG. 本発明の他の実施例のレーザ加熱装置の縦断側面図である。It is a vertical side view of the laser heating apparatus of the other Example of this invention. 図４に示すレーザ加熱装置の曲面レンズの一部を切除した斜視図である。FIG. 5 is a perspective view in which a part of a curved lens of the laser heating apparatus shown in FIG. 4 is cut away. 図４に示すレーザ加熱装置を用いて加熱した被加熱物の正面図である。It is a front view of the to-be-heated material heated using the laser heating apparatus shown in FIG. 本発明の更に他の実施例のレーザ加熱装置の縦断側面図である。It is a vertical side view of the laser heating apparatus of further another Example of this invention. 図７に示すレーザ加熱装置の曲面レンズの一部を切除した斜視図である。FIG. 8 is a perspective view in which a part of a curved lens of the laser heating apparatus shown in FIG. 7 is cut away. 図７に示すレーザ加熱装置を用いて加熱した被加熱物の正面図である。It is a front view of the to-be-heated material heated using the laser heating apparatus shown in FIG. 本発明の更に他の実施例のレーザ加熱装置の縦断側面図である。It is a vertical side view of the laser heating apparatus of further another Example of this invention. 図１０に示すレーザ加熱装置のシリンドリカルレンズの一部を切除した斜視図である。It is the perspective view which excised part of the cylindrical lens of the laser heating apparatus shown in FIG. 図１０に示すレーザ加熱装置を用いて加熱した被加熱物の正面図である。It is a front view of the to-be-heated material heated using the laser heating apparatus shown in FIG. 従来のレーザ加熱装置の説明図である。It is explanatory drawing of the conventional laser heating apparatus.

符号の説明Explanation of symbols

１ 被加熱物
２ レーザ光
３ レンズ
４ 被加熱物
５ 曲面レンズ
５ａ 凸レンズ状のリング体
６ 曲面レンズ
６ａ 内側のリング体
６ｂ 外側のリング体
７ 外側リング
８ 内側リング
９ 曲面レンズ
１０ シリンドリカルレンズ
１１ 凹レンズ DESCRIPTION OF SYMBOLS 1 Object to be heated 2 Laser light 3 Lens 4 Object to be heated 5 Curved lens 5a Convex lens-shaped ring body 6 Curved lens 6a Inner ring body 6b Outer ring body 7 Outer ring 8 Inner ring 9 Curved lens 10 Cylindrical lens 11 Concave lens

Claims (4)

レーザ光源と、このレーザ光源から出るレーザー光をリング状に集光せしめる曲面レンズとよりなることを特徴とするレーザ加熱装置。   A laser heating apparatus comprising: a laser light source; and a curved lens that condenses laser light emitted from the laser light source in a ring shape. 上記曲面レンズは半径方向断面が凸レンズ状のリング体より成る円板状レンズであることを特徴とする請求項１記載のレーザ加熱装置。   2. The laser heating apparatus according to claim 1, wherein the curved lens is a disk-shaped lens made of a ring body having a convex lens-like cross section in the radial direction. 上記リング体が同心円状に半径方向に複数隣接されていることを特徴とする請求項２記載のレーザ加熱装置。   3. The laser heating apparatus according to claim 2, wherein a plurality of the ring bodies are concentrically adjacent to each other in the radial direction. 上記各リング体の断面形状が互いに異なることを特徴とする請求項２または３記載のレーザ加熱装置。   4. The laser heating apparatus according to claim 2, wherein the ring bodies have different cross-sectional shapes.
JP2005042927A 2005-02-18 2005-02-18 Laser heating device Expired - Fee Related JP4247495B2 (en)

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US9500781B2 (en) 2012-10-05 2016-11-22 Mitsubishi Heavy Industries, Ltd. Optical system and laser processing apparatus
JP2014151326A (en) * 2013-02-05 2014-08-25 V Technology Co Ltd Laser processing device, and laser processing method
JP2016001642A (en) * 2014-06-11 2016-01-07 坂口電熱株式会社 Laser heat treatment equipment
US10352545B2 (en) 2016-03-04 2019-07-16 Panasonic Intellectual Property Management Co., Ltd. Wavelength conversion device and lighting apparatus
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