JP2006229017A - Manufacturing method of thick-film electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thick-film electronic component for reducing a man day greatly by the decrease in the number of times of curing treatment of an insulating film, dispensing with an adhesive layer other than a conductive material and forming a reliable insulating film, while enabling high thick film conductor formation of a high aspect ratio which cannot be formed by a printing method. <P>SOLUTION: A conductive base film is formed on an insulating substrate. A first mask is formed in the surface of the conductive base film by using a predetermined pattern. The first conductive layer of the same thickness as a mask is formed in the surface of the conductive base film which is not covered with the mask. The second mask is formed in a part of the first conductive layer and the surface of the first mask. The second conductive layer is formed on the first conductive layer in which the second mask is not formed. The first and second masks are removed, the exposed portion of the conductive base film is removed, and the insulating substrate surface and the surface of the first conductive layer are covered with an insulating film so that a second conductive pattern may be formed on the insulating film. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a thick film electronic component in which a conductor pattern such as a thick film inductor is formed in multiple layers, and more particularly to a method for forming a conductor layer for interlayer connection of multilayer conductors.

  Conductor (Cu, Au, Ni, Al, Ag, Al-Si, Al-Cu, etc.) is formed on an insulating substrate such as silicon, glass, and alumina as a fine conductor pattern with thick curtains using a printing method or plating method. An electronic component such as an inductor connected to another conductor pattern layer through a film is used. The main objective is to obtain a small and highly accurate electronic component by obtaining a fine conductor pattern, and inductors, multilayer wiring boards, and the like are manufactured using these methods. When forming a fine pattern using the printing method or plating method, the following problems occur when polyimide or other organic insulating materials (polybenzoxazole, benzocyclobutene, etc.) are used for the interlayer insulating film Is generated.

  The problems of the printing method are as follows. First, the printing method has limitations in forming thick film conductors. In addition, when polyimide or an organic insulating material as described above is used as the insulating layer, the shape when it is made photosensitive and thick or when the opening is formed by dry etching is deteriorated, and the film thickness is limited. It is a problem.

The plating method has the following problems. In order to increase the adhesion between the polyimide or other organic insulating material and the base electrode for plating, another metal (Cr, Ti, TiW, Ta / TaN, etc.) is usually required as an adhesive layer. Therefore, since another metal is contained in the conductor layer, the conductor resistance increases. In addition, polyimide and other organic insulating materials described above are photosensitive and non-photosensitive, but it is difficult to form a fine pattern when they are thickened. In general, since it takes time to cure a polyimide-based material, productivity reduction is unavoidable in a method of repeating the embedding process between the electrodes and the thick film forming process.
JP-A-5-343262 JP 2000-323656 A Japanese Patent Laid-Open No. 2003-249408

  The present invention makes it possible to form a conductor with a high aspect ratio, which cannot be formed by a printing method, and is reliable without being affected by the pattern formation method of polyimide and other organic insulating materials (polybenzoxazole, benzocyclobutene, etc.). An insulating film having a high thickness is formed. Furthermore, the present invention provides a method of manufacturing a thick film electronic component that eliminates the need for an adhesive layer other than a conductor material, reduces the number of times of curing the insulating film, and greatly reduces the number of steps.

  This invention provides said subject by improving the formation method of the conductor layer for interlayer connection. That is, in a method for manufacturing a thick film electronic component in which a conductor pattern is formed on an insulating substrate and a conductor pattern connected through an opening formed in the insulating layer is formed on the insulating film, the underlying conductor is formed on the insulating substrate. A film is formed, a first mask is formed in a predetermined pattern on the surface of the underlying conductor film, and a first conductor layer having the same thickness as the mask is formed on the surface of the underlying conductor layer not covered with the mask. Forming a second mask on a portion of the first conductor layer and the surface of the first mask, forming a second conductor layer on the conductor first conductor layer on which the second mask is not formed, Remove the first and second masks, remove the exposed portion of the underlying conductor film, cover the surface of the insulating substrate and the surface of the first conductor layer with an insulating film, and form the second conductor pattern on the insulating film. It has the characteristics.

The effects of the present invention are as follows.
Since the pattern is formed by applying the second layer resist without removing the resist after forming the first layer plating pattern, plating up to the second layer is possible, and conductors can be formed by plating with different levels or special structures. It becomes.
Since the second layer can be formed as it is after the first layer is formed, an intermediate metal film for improving adhesion is not necessary, and a contact via can be formed without increasing the conductor resistance.
By using a resist or dry film resist for the second layer, the thickness of the second layer can be easily controlled, and a conductor can be formed from several μm to about 100 μm.
Since the insulating film is formed after the conductor formation up to the second layer is performed, the number of times of curing the organic insulating material such as polyimide can be reduced.

The main steps of the present invention are summarized as follows.
Formation of underlying conductor layer Formation of first mask (resist) Plating of first conductor layer (thick film formation)
Formation of second mask (resist) Plating of second conductor layer (thick film formation)
Mask (resist) removal Insulation film formation

  Before describing the embodiment of the present invention, a conventional general construction method will be described with reference to FIGS. 5 and 6 for comparison. A base conductor 12 made of Cu / Ti or the like is formed on the surface of the insulating substrate 11 by a method such as sputtering (FIG. 5A). A resist is applied to the surface of the underlying conductor, and a part of the resist is removed according to the conductor pattern to form a first mask 13 (FIG. 5B). The first conductor layer 14 is formed on the surface of the underlying conductor layer by electrolytic plating (FIG. 5C). Subsequently, the resist is removed (FIG. 5D), and the exposed underlying electrode is etched away (FIG. 5E). Thus, the first conductor pattern is completed.

  Next, an insulating layer is formed, and an organic insulating film 15 such as polyimide is applied to cover the insulating substrate 11 and the first conductor layer 14 (FIG. 5F). The surface of the first conductor layer 14 is exposed by polishing or etching the organic insulating film 15 (FIG. 5G). As a result, the first-layer conductor pattern and the insulating film are formed.

  Next, the second layer is formed. The second insulating layer 16 is formed over the entire surface, and an opening is formed only in a portion where the second conductive pattern for connection is formed (FIG. 6H). A base electrode layer 17 such as Cu / Ti is formed on the entire surface (FIG. 6I). This is an intermediate layer for improving the adhesion between the organic insulating film such as polyimide and the plated conductor. A resist pattern 18 is formed on the surface, excluding a portion where a conductor layer is to be formed (FIG. 6J), and a second conductor pattern 19 is formed by electrolytic plating (FIG. 6K). Further, the resist pattern is removed (FIG. 6L), and the base electrode layer is removed to complete the second conductor layer (FIG. 6M). By repeating the same process on this surface, a multilayer conductor pattern can be formed.

  Next, an embodiment of the present invention will be described with reference to FIG. The process up to the step shown in FIG. 5C is the same as the prior art. On the surface of the insulating substrate on which the mask 13 for forming the first conductor layer and the first conductor layer 14 formed by electrolytic plating are formed, The second mask 21 is formed (FIG. 1A). The second mask 21 has an opening only in a portion where the second conductor layer is formed. When electrolytic plating is performed in this state, a conductor is plated on the surface of the first conductor layer without a mask, and only that portion becomes thick (FIG. 1B). Here, the first resist film (mask) and the second resist film (mask) are simultaneously removed to leave only the conductor layer (FIG. 1C). Next, the base electrode film is etched away (FIG. 1D). . The entire surface is covered with an insulating film such as polyimide (FIG. 1E), and the surface of the second conductor layer is matched with the surface of the insulating film by polishing or etching (FIG. 1G). As a result, a conductor for connecting the conductor pattern covered with the insulating film and the conductor pattern on the insulating layer is formed.

  The present invention is not limited to the above example. As shown in FIG. 2, by appropriately selecting a resist or a dry film for forming the second conductor layer, it is arbitrarily selected from several μm to about 100 μm. You can choose. Further, as shown in FIG. 3, the first resist pattern is formed when the second resist pattern is formed, and a part of the first conductor pattern is formed when the second conductor is formed. You can also. Furthermore, as shown in FIG. 4, the conductor can also be formed on the wall surface of the conductor formed in the first layer by plating.

  The present invention can be used not only for the production of passive elements such as inductors, but also for circuit boards such as multilayer boards, and also for the production of composite electronic components.

Front sectional view showing an embodiment of the present invention Front sectional view showing another embodiment of the present invention Front sectional view showing another embodiment of the present invention Front sectional view showing another embodiment of the present invention Front sectional view showing a method of manufacturing a conventional thick film electronic component Front sectional view showing a method of manufacturing a conventional thick film electronic component

Explanation of symbols

11: Insulating substrate
12: Underlying conductor layer
13: First mask
14: First conductor layer
18, 21: Second mask
19: Second conductor layer
16, 22: Insulating film

Claims (5)

In a method for manufacturing a thick film electronic component, a conductive pattern is formed on an insulating substrate, and a conductive pattern connected through an opening formed in the insulating layer is formed on the insulating film.
A base conductor film is formed on an insulating substrate, a first mask is formed in a predetermined pattern on the surface of the base conductor film, and a first mask having the same thickness as the mask is formed on the surface of the base conductor layer not covered with the mask. Forming a conductor layer of
Forming a second mask on a portion of the first conductor layer and the surface of the first mask, forming a second conductor layer on the conductor first conductor layer on which the second mask is not formed,
Remove the first and second masks, remove the exposed portion of the underlying conductor film,
A method of manufacturing a thick film electronic component, wherein the surface of the insulating substrate and the surface of the first conductor layer are covered with an insulating film, and the second conductor pattern is formed on the insulating film. In a method for manufacturing a thick film electronic component, a conductive pattern is formed on an insulating substrate, and a conductive pattern connected through an opening formed in the insulating layer is formed on the insulating film.
A base conductor film is formed on an insulating substrate, a first resist is formed in a predetermined pattern on the surface of the base conductor film, and a first conductor having the same thickness as the resist is formed on the surface of the base conductor layer not covered with the resist. Forming a conductor layer of
Forming a second resist on a portion of the first conductor layer and the surface of the first resist, forming a second conductor layer on the conductor first conductor layer on which the second resist is not formed;
Remove the first and second resist, remove the exposed portion of the underlying conductor film,
A method of manufacturing a thick film electronic component, wherein the surface of the insulating substrate and the surface of the first conductor layer are covered with an insulating film, and the second conductor pattern is formed on the insulating film.   The method for manufacturing a thick film electronic component according to claim 1, wherein the first conductor layer and the second conductor layer are formed by electrolytic plating. In a method for manufacturing a thick film electronic component by forming a conductor pattern on an insulating substrate and drawing it to the surface through an opening formed in the insulating layer,
A base conductor film is formed on an insulating substrate, a first mask is formed in a predetermined pattern on the surface of the base conductor film, and a first mask having the same thickness as the mask is formed on the surface of the base conductor layer not covered with the mask. Forming a conductor layer of
Forming a second mask on a portion of the first conductor layer and the surface of the first mask, forming a second conductor layer on the conductor first conductor layer on which the second mask is not formed,
Remove the first and second masks, remove the exposed portion of the underlying conductor film,
A method for manufacturing a thick film electronic component, wherein the insulating substrate surface and the surface of the first conductor layer are covered with an insulating film. In a method for manufacturing a thick film electronic component by forming a conductor pattern on an insulating substrate and drawing it to the surface through an opening formed in the insulating layer,
A base conductor film is formed on an insulating substrate, a first resist is formed in a predetermined pattern on the surface of the base conductor film, and a first conductor having the same thickness as the resist is formed on the surface of the base conductor layer not covered with the resist. Forming a conductor layer of
Forming a second resist on a portion of the first conductor layer and the surface of the first resist, forming a second conductor layer on the conductor first conductor layer on which the second resist is not formed;
Remove the first and second resist, remove the exposed portion of the underlying conductor film,
A method for manufacturing a thick film electronic component, wherein the insulating substrate surface and the surface of the first conductor layer are covered with an insulating film.

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