JP2006227108A - Manipulation device for fine work of electron microscope - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manipulation device for fine work of an electron microscope constituted by mounting a dual probe which enables an operator not only to observe an extremely fine and minute sample but also to smoothly and surely perform electric measurement and further electric super-fine working while observing an image by the microscope. <P>SOLUTION: In the manipulation device for the minute work of the electron microscope, the dual probe 10 comprising a main probe 11 and a sub probe 12 bonded to the main probe 11 is provided to one or two or more manipulator units driven in X-axis, Y-axis and Z-axis directions and rotatable around a T-axis and/or an R-axis independently of each other. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an apparatus for capturing an extremely fine specimen sample under the field of view of an electron microscope and performing fine operations such as performance evaluation of the specimen specimen while observing the image. Provides a manipulation apparatus that performs work such as failure analysis of device micro-parts, performance evaluation, and the like by electrical measurement in a manufacturing process of a semiconductor integrated circuit or the like.

  Conventionally, a so-called fine operation in which a very small sample such as a semiconductor device is not only observed with a microscope but also subjected to extremely fine processing under the microscope has been generally performed. However, not only the objects are shifting to miniaturization every year, but the field is also diversifying from the electronics field to the bio field including technologies such as genetic recombination work. In particular, in response to the demands and importance of miniaturization and sophistication associated with high integration of semiconductor devices in recent years, micromachines are applied, and specimen samples are captured in the microscope field of view and electrically operated using a manipulator. The importance of techniques for accurate measurement and analysis work is increasing.

  In particular, there are many demands for developing a micromanipulation apparatus for semiconductor device failure analysis that performs fine work (probing) on a minute region of a semiconductor device. This kind of fine work is different from simple repetitive work in normal production or inspection processes, and each work is performed manually by the operator moving the manipulator under the microscope's field of view. It is the actual situation to work with (stylus).

  An apparatus for operating a microprobe attached to a manipulator to accurately move or process a specimen sample under the microscope's field of view is disclosed in, for example, Patent Document 1 and further electrically connected to the manipulator. For an apparatus that operates a microprobe having a function to measure the electrical characteristics of a specimen sample, for example, in Patent Document 2, the movement of the microprobe and the microprobe under the microscope is linked to provide a three-dimensional direction. An apparatus is disclosed that facilitates positioning, movement, and processing.

  In these devices, the movement of a manipulator equipped with a specimen and a probe, which are required for micro work, is detected by a work table on which the specimen is placed and a piezo element mounted on the manipulator for detecting displacement for feedback. A function-added one is used. According to this, a minute movement of several tens of μm is possible, and although depending on the displacement detection means, extremely high resolution can be realized relatively easily. . By making minute movements in the X, Y, and Z axis directions to each manipulator, that is, each probe, it is possible to reliably perform a fine work on a three-dimensional level.

  Conventionally, when this kind of micromanipulation device is applied to, for example, the biotechnology field, the movement of the microprobe and the specimen is freely controlled in the actual microfabrication work, and the movement of the microprobe is performed slowly and reliably. It is important that the sample is not damaged, so that basic operations such as movement, cutting, drilling, excision, peeling, pasting, and joining of the specimen can be reliably performed. The microprobe used here is for the purpose of suitably performing the above-mentioned basic work on the specimen by moving it, and can be used in various ways by changing the thickness, shape, and shape of the tip as appropriate. It is possible.

  As described above, from the viewpoint of expanding the application range, when these devices are applied to, for example, semiconductor-related technologies, that is, inspection processes for electronic components such as ICs and LSIs, the movement of specimens, cutting, drilling, Rather than basic work such as excision, peeling, pasting, and joining, it is performed by conventional semiconductor inspection equipment such as resistance value, conductivity, current value or current waveform measurement, voltage application, insulation confirmation, etc. For example, an operation having electrical functionality is required. However, a probe card used in a conventional semiconductor device inspection apparatus or the like has a probe having a plurality of electrical functionalities as shown in, for example, Patent Document 3, thereby inspecting a specific portion of a semiconductor element. Once the precise position of the probe has been determined, the predetermined inspection work can be repeated efficiently and simply by repeating the semiconductor element supplied by the flow work without changing the position. Is the biggest feature.

  In addition, in the conventional failure analysis apparatus, it was possible to measure whether the entire integrated circuit is normal, but it was not possible to perform measurement and inspection at a level for specifying the defective portion. Furthermore, analysis devices that can identify a defective part to some extent have been developed. However, it is difficult to cope with a circuit pattern of several tens of nanometers expected for next-generation devices. It was necessary to increase the resolution. Even when such a failure analysis drive mechanism is realized, when a circuit pattern of several tens of nm class is directly measured, the circuit pattern may be destroyed unless the contact pressure is controlled by the nN class. is there. Furthermore, even if the drive mechanism and contact pressure are controlled, there has been a problem that the work tool brought into contact with the circuit pattern is shifted out of the circuit pattern due to drift due to the influence of noise such as vibration coming from the outside or inside. . Furthermore, when applying and measuring voltage and current simultaneously at the tips of multiple microprobe needles, it is possible to project at least two or more microprobe needles in an electron microscope image when measuring over a wide area. The problem of being unable to do so was also pointed out.

  Furthermore, in the conventional stage apparatus, since the operability of the stage was poor, the skill of the operator was an indispensable condition for realizing a fine work on the nano order. Also, when working with an electron microscope, it was necessary to open the vacuum environment and the preliminary exhaust chamber provided in the electron microscope once when exchanging samples and electrodes. there were.

  In other words, the above-described conventional apparatus is suitable for work that continuously repeats measurement between fixed points of a minute part, but searches for an arbitrary work point on a certain surface and freely adjusts its position. However, it is not suitable for the purpose of moving the microprobe needle tip and performing necessary work. The work required for research and development of electronic parts such as new ICs and LSIs is, for example, that the operator freely operates the microprobe needle tip while observing the microscopic image over the entire surface of the silicon device wafer on which fine circuit patterns are integrated. The needle tip is positioned at an arbitrary position while visually confirming, and then the needle tip is finely moved to perform necessary fine work. In particular, the trend of nano-level circuit complexity, improvement in integration, and increase in the size of silicon wafers, which are raw materials, is remarkable. It was strongly requested by the development department.

In recent years, research on nanoscale-shaped micromaterials and their application to various fields have been actively pursued. Stages that enable nano-scale positioning have been commercialized for research and application of such micromaterials. However, all of them are expensive to introduce, and the current situation is that the amount of money (up to 100 million yen or more) equal to or higher than that of an electron microscope equipped with a stage is required. In addition, these positioning stages are not devices that have all of the contact pressure detection mechanism, the heating mechanism, the multiple electrode control, and the like.
JP 2000-221409 A JP 2002-365334 A JP-A-5-55317

  In view of the above problems, the present inventors efficiently move and position the microprobe over a wide range while simultaneously observing the specimen and the probe tip of the microprobe under the microscope observation image field of view. This is the result of earnest research on a manipulation device that can perform fine work with excellent reliability and reliability. In other words, the present inventors joined a micro-needle (sub-probe) with a nanoscale diameter to a micro-probe (main probe) of a micro-probe device in order to cope with functionality, particularly electrical functions and nano-level circuits. In other words, it has been found that electrical measurement and processing of a fine portion of a specimen sample can be efficiently performed by making a dual probe. The purpose of the present invention is not only to observe extremely fine and precise specimen samples such as semiconductor elements, but also to make electrical measurements and even electrical ultrafine processing smoothly and reliably while the operator observes the microscope image. An object of the present invention is to provide an electron microscope micromanipulation manipulator on which a dual probe is mounted.

  The above-described object is to provide one or more manipulator units each capable of driving in the X-axis, Y-axis, and Z-axis directions and rotating the T-axis and / or the R-axis independently of the main probe and the sub-joint connected thereto. This is achieved by an electron microscope micromanipulation manipulator characterized by mounting a dual probe comprising a probe. The sub-probe in this apparatus is preferably a nano-scale micro-diameter electrode having an electrical function. In electrical measurement, the sub-probe is directly joined to the measurement location of the sample, so that vibration noise from the outside, The dual probe is preferably attached to a dual probe unit that incorporates a heating mechanism for heating the probe and suppressing contamination.

The dual probe unit is equipped with a contact pressure detection mechanism and / or a heating mechanism, and the manipulator unit is mounted with a dual probe unit and / or a replacement sub-probe and / or a gas introduction microtube. It is desirable that the replacement sub-probe is replaceable under vacuum observation of a general-purpose electron microscope or during fine work.
Further, in the manipulation apparatus for fine operation of the electron microscope of the present invention, a sample stage unit capable of driving in the X-axis, Y-axis, and Z-axis directions and rotating the θ-axis is mounted, and the sample stage unit is replaced with a sample stage. A sub-probe is mounted.
In the above-described electron microscope fine work manipulation device, the fine work is performed under the observation of the vacuum environment of a general-purpose electron microscope. The general-purpose electron microscope here refers to, for example, a scanning electron microscope (SEM).

By using an electron microscope micromanipulation manipulator equipped with a dual probe electrode according to the present invention, a plurality of electrical functions between arbitrary specific points in a circuit pattern of tens of nm class, which has been impossible in the past, It is now possible to easily and quickly carry out electrical measurements directly with a probe needle having the above, or perform fine operations such as highly reliable electrical measurement and microfabrication of a circuit pattern of a conventional size.
Furthermore, by using the electron microscope micromanipulation manipulator equipped with the dual probe electrode according to the present invention, it is possible to measure the membrane pressure of cells, etc. for organic substances, which has been impossible in the past, and to perform micro-nano processing / experiments, and other inorganic substances. However, it has become possible to measure the strength and physical properties on the micro / nano order.

  The manipulation device for fine operation of an electron microscope according to the present invention will be described in detail. In the electron microscope micromanipulation manipulator, a replacement sub-probe is placed on the manipulator unit and / or the sample stage unit, and the sub-probe joined to the main probe of the dual probe can be replaced with the replacement sub-probe. Is possible. The joint work associated with the sub-probe replacement work can be driven locally by a gas-introducing micropipe placed on the manipulator unit, allowing local joint work. It can be done with. The sub-probe is preferably a nano-scale minute electrode having an electrical function.

  The manipulator unit referred to in the present invention is capable of rotating the T-axis and / or the R-axis so that the manipulator unit can be tilted up, down, left, and right freely around the θx axis, the θy axis, and / or the θz axis. In other words, the rotation of the θ axis of the sample stage unit means that the sample stage placed on the sample stage unit can rotate 360 degrees around the θz axis (vertical axis).

  The dual probe used in the manipulation apparatus for fine operation of the electron microscope of the present invention for the purpose of electrical measurement in a fine region is mounted on a dual probe unit, and the dual probe unit is mounted on the manipulator unit. The unit is provided separately from the sample stage and / or the sample stage unit on which the heating mechanism is placed, and each unit moves independently. Furthermore, a heating mechanism and a contact pressure detection mechanism are attached to the dual probe unit.

  The dual probe unit is provided with a heating mechanism using an insulation bonded heater. This heating mechanism not only heats the probe itself, but also can suppress and control the phenomenon (contamination) that hydrocarbons floating in the vacuum environment of the electron microscope are deposited and contaminated by the electron beam. For example, by using a non-inductively wound tungsten heater or film heater, heating at 0 ° C. to 200 ° C. and temperature control are possible.

  Further, a contact pressure detection mechanism is attached to the dual probe unit. The purpose of this mechanism is to prevent damage to the sample and probe during fine work and measurement work. For example, the contact pressure is directly detected by attaching a strain sensor or the like directly to the dual probe or to a place where the dual probe is fixed. The sensitivity is preferably a resolution of 100 nN or less. Furthermore, it is possible to measure the strength, film pressure, etc. of the sample by this contact pressure detection mechanism.

  In the present invention, the fine work is performed while observing the probe tip of the dual probe unit mounted on the manipulator unit and the specimen sample placed on the sample stage unit under the microscope field of view. It is performed while moving freely. Moreover, in the above-described electron microscope micromanipulation manipulator, it is important that one or two or more manipulator units equipped with a dual probe unit are installed.

  An exchange sub-probe can be placed on the manipulator unit and / or sample stage unit of the manipulation apparatus for fine operation of the electron microscope of the present invention. The sub-probe joined to the main probe of the dual probe can be replaced with the replacement sub-probe. As described above, since the manipulator unit and the sample stage unit move independently from each other, the dual probe and the replacement sub-probe placed on each move completely independently. Therefore, when replacing the sub-probe constituting the dual probe with another replacement sub-probe, the replacement work can be performed while checking the observation field of view without opening the vacuum in the observation chamber. Time can be shortened. When the replacement sub-probe is mounted on the manipulator unit, it is used for replacement with a dual probe sub-probe mounted on another manipulator unit.

  The dual probe referred to in the present invention is a probe in which two types of electrodes are integrated. The two types of electrodes are composed of a main probe (microprobe) corresponding to work / measurement in the micron order and a sub-probe (nanoprobe) corresponding to work / measurement in the nanoorder. Each main and sub probe can perform fine work and electrical measurement. In particular, electrical measurement refers to, for example, measurement and application of current and voltage, and performance evaluation of a capacitor using a large number of electrodes.

  The dual probe described above performs the electrical function with the main probe when performing electrical measurements in the micron-order region, and with a sub-probe of a small diameter material at the tip of the main probe when performing electrical measurements in the nano-order minute region. Install it while keeping it, and measure the electrical characteristics with the sub-probe. Specifically, in the measurement in the micron order region, the tip of the main probe is brought into contact with the measurement point. In this case, the sub probe is also in contact with the sample, but there is no problem. In the case of measurement in the nano-order region, the manipulator unit and the sample stage unit are operated so that the tip of the sub probe is in contact with the measurement point. At this time, the main probe is not in contact with the sample.

  When a circuit pattern of several tens of nm class is directly measured, a necessary measurement work can be performed by directly bonding (bonding) the sub-probe to the circuit pattern using the high-intensity characteristic of the sub-probe. In this case, since the measurement points of the main probe and the specimen are joined via the sub-probe, it is more accurate to ignore noise due to vibration, drift, etc. compared to the case of simply contacting. Measurements can be made. When measurement is performed by such a method, the sub-probe is cut and disposable when the measurement operation is completed.

  Furthermore, the electron microscope micromanipulation apparatus according to the present invention is capable of exchanging subprobes by a CVD bonding method using an electron beam composed of a gas introduction microtube mounted on a manipulator unit in an observation chamber under vacuum. Is possible. The main probe and the sub-probe can be selected and combined with different shapes, thicknesses, etc., to make various dual probes. In particular, the shape of the sub-probe can be selected within the observation field of the vacuum environment, and the probe most suitable for the sample can be used.

  As described above, the dual probe of the electron microscope micromanipulation device of the present invention has a nano-scale micro-electrode sub-probe (nanoprobe) attached to the tip of the main probe (microprobe) while maintaining its electrical characteristics. It is a configuration. The material of the main probe is preferably a non-magnetic and highly conductive material, such as tungsten, gold, platinum, phosphor bronze and the like. The material of the sub-probe is preferably a material having high strength and electrical characteristics on the nano order, such as carbon nanotubes, nanowires, nanosprings, and the like.

  The main probe and the sub-probe are joined by the apparatus of the present invention while observing in the electron microscope field of view. The conductive bonding method can be performed using a CVD bonding method or a contamination bonding method using an electron beam, a carbon or metal deposition (CVD) bonding method, a nanoparticle bonding method, or the like, and is not particularly limited. Absent. The joining direction is such that the end of the sub-probe is overlapped above the end of the main probe while maintaining the linearity of the main probe. That is, the junction is positioned opposite to the specimen sample across the main probe. If bonded in this way, the sub-probe always exists above the main probe, and when the main probe is used for measurement, it is possible to perform measurement without bringing the sub-probe bonding portion into contact. .

  The dual probe of the present invention can be exchanged for each dual probe unit holding the dual probe by the conventional exchange method of the electron microscope (the exchange method from the air lock). As described above, the sub-probe bonded to the main probe is a replacement sub-probe (for example, CNT: carbon nanotube) prepared in the manipulator unit or the sample stage unit. Bonding is performed using a gas introduction microtube mounted on a manipulator unit by a legal method, a carbon or metal deposition (CVD) bonding method, a nanoparticle bonding method, or the like. The sub-probe is almost disposable, and is exchanged when measurement reproducibility cannot be maintained. The replacement and cleaning conditions are the same for the main probe. In addition, the specimen specimen can also be exchanged from a preliminary exhaust chamber or the like by opening a conventional air lock.

  The manipulator unit and sample stage unit used in the electron microscope micromanipulation manipulator of the present invention can be independently moved independently, and one or more manipulator units can also be independently moved. The above-described movements are possible when the manipulator unit can perform coarse and fine movements in the X-axis, Y-axis, and Z-axis directions, and the T-axis and / or R-axis can be coarsely rotated. Coarse and fine movements in the Y-axis and Z-axis directions are possible, and the θ-axis coarse rotation is possible. Coarse movement can be driven by a micromotor or manually by a precision screw, and fine movement can be performed by using an electrostrictive element such as a piezo, an ultrasonic motor, a fine movement screw or a giant magnetostrictive actuator. By using an ultrasonic motor or a piezo element, the driving range is wide and the resolution is high. The coarse movement here refers to movement in mm, and the fine movement refers to movement in nm to μm.

  The material used for the electron microscope micromanipulation device of the present invention is basically a non-magnetic material. For example, aluminum, stainless steel, permalloy, copper, phosphor bronze, titanium, ceramic, and the like can be given. When using a material having magnetism as an exception, the part is used with a magnetic cover with permalloy or the like.

  Using the electron microscope micromanipulation device of the present invention to perform electrical measurement operations such as defect analysis and performance evaluation of minute parts of semiconductor devices, etc., on the sample stage of the sample stage unit under the microscope field of view. The sample placed and the dual probe placed on the dual probe unit on one or more manipulator units are driven, and the tip of the sub probe joined to the main probe of the dual probe or the main probe is placed on the sample. Move to the measurement position, position and perform the necessary measurements. The sample can be freely moved on a plane including rotation about the vertical axis, and can be displaced in the height direction. Since the dual probe can change the inclination in addition to the free movement on the plane and in the height direction, the relative position with respect to the sample and the angle in contact with the sample can also be freely changed. That is, the tip of the main probe or the sub probe joined to the main probe can be brought into contact with an arbitrary position at an arbitrary angle.

  When performing electrical measurement over a wide range or when performing electrical measurement on different samples, the positioning operation and probing operation for contact with the dual probe are taken into the memory after image processing. Compare and examine the information stored in the memory and the information after processing the newly captured image during positioning and probing operations in new work, and as new positioning control information and probing control information, Feedback is provided to the manipulator unit via the control BOX. In other words, the positioning information and probing information of the dual probe that has been measured and evaluated are stored in the memory as image information and / or control information, and stored in that memory when evaluating the electrical characteristics of another measurement location or another sample. Based on the obtained information, measurement evaluation can be realized by supporting reproducibility of the measurement location and contact pressure.

  In the present invention, the work can be performed using a multi-display function. The multi-display function displays information previously recorded during image processing, such as positioning operation, probing operation, and / or control information, as well as real-time images of the current positioning operation and probing operation. Information after image processing can be displayed simultaneously.

  In the dual probe of the present invention, when a circuit pattern of several tens of nanometers is directly measured, the above-mentioned nanoscale minute diameter electrode is directly electron beam bonded to the circuit pattern, so that the minute diameter electrode does not vibrate from the outside. It absorbs in the same way as a spring and solves the effects of noise such as vibration coming from outside or inside. Further, by introducing a heating and nN class contact pressure detection mechanism in the dual probe, it is possible to achieve stable electrical measurement even for circuit patterns of several tens of nm class.

  Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view of a manipulation apparatus for fine operation of an electron microscope according to the present invention. In the vacuum chamber 1, there are one or a plurality of manipulator units 2 and a sample stage unit 3, both of which are mounted on a fixed base 4. Reference numeral 5 denotes an electron microscope barrel. The sample stage unit 3 is placed under the field of view of the electron microscope, the manipulator unit 2 approaches the sample stage unit 3 as necessary, and the tip of the dual probe enters under the field of view of the electron microscope and is displayed on the monitor image. The operator performs the work manually by looking at the monitor image, but it may be performed automatically if it is a routine work.

  FIG. 2 is an explanatory diagram of the manipulator unit of the present invention. The manipulator unit 2 is based on a coarse movement stage 6 that can be freely driven in the rotation axis directions of the X axis, Y axis, Z axis and T axis and / or R axis, on which the X axis, Y axis, Z axis A fine movement stage 7 capable of fine movement in the axial direction is provided. A dual probe unit 8 is placed on the fine movement stage 7, and a dual probe 10 is placed on the dual probe unit 8. That is, the dual probe 10 can be freely driven in the X-axis, Y-axis, and Z-axis directions and tilted around the T-axis and R-axis independently of the specimen 9. The specimen 9 can be manipulated from any direction and any angle. The dual probe 10 includes a main probe 11 and a sub-probe 12 joined to the tip thereof. The heater 13 is installed near the dual probe 10 and the strain sensor 14 is installed around the base point of the main probe 11. The manipulator unit 2 can also be equipped with a sub-probe base 17 on which a gas introduction micropipe 15 and a replacement sub-probe 16 are mounted.

  FIG. 3 is an explanatory diagram of the sample stage unit 3 of the present invention. The sample stage unit 3 is based on a coarse movement stage 6 ′ that can be driven freely in the rotation axis directions of the X axis, Y axis, Z axis, and θ axis, and further in the X axis, Y axis, and Z axis directions. A fine movement stage 7 'capable of fine movement is placed. A sample stage 18 is provided on the fine movement stage 7 ′, and a sub-probe stage 17 on which the specimen 9 and the replacement sub-probe 16 are placed is placed thereon. Furthermore, a heater 19 is installed on the sample stage 18. That is, the specimen 9 can be freely driven in the X-axis, Y-axis, and Z-axis directions and can be rotated by the θ-axis.

  FIG. 4 is an explanatory diagram of the dual probe unit of the present invention. The dual probe 10 is mounted on the dual probe unit 8 on the manipulator unit, and is electrically connected. A heater 13 and a strain sensor 14 are installed around the base point of the main probe 11 of the dual probe 10. When performing the measurement or the like, the main probe 11 or the tip of the sub probe 12 joined to the main probe 11 is brought into contact with the measurement point of the sample 20 on the sample table. A sub-probe base 17 on which a replacement sub-probe 16 is placed is placed on the sample base 18. In order to replace the sub probe 12 with the replacement sub probe 16, the manipulator unit 2 and the sample stage unit 3 or the manipulator unit 2 other than the above are operated without using the sample stage unit 3, and the main probe 11 is replaced with the replacement sub probe 12. The probe 16 is brought close to the probe 16 while maintaining linearity, and, for example, a gas, a liquid metal, or the like is bonded using a CVD bonding method using an electron beam under observation of a vacuum region of a microscope. In addition, a contamination bonding method using an electron beam, a carbon or metal deposition (CVD) bonding method, a nanoparticle bonding method, or the like is also effective.

  FIG. 5 is a schematic view showing the movement of the dual probe during the measurement work by the manipulation apparatus for fine operation of the electron microscope of the present invention. Measurement is performed by bringing the tip of the main probe 11 into contact with the micron-order portion 22 on the circuit pattern 21 and bringing the tip of the sub-probe 12 into contact with the nano-order portion 23.

  FIG. 6 is an explanatory diagram showing an outline of image processing in the operation by the manipulation apparatus for fine operation of the electron microscope of the present invention. The SEM image data of the basic positioning environment is taken into the control PC 26 and used as a memory image (A) 24. The memory image (A) 24 and the SEM image (B) 25 that is actually working are image-processed and compared, and position control information is controlled based on the difference so that the same environment as the memory image (A) 24 is obtained. The measurement is fed back to the manipulator unit 2 with the BOX 27 and measurement is performed while maintaining the reproducibility of the measurement environment when the measurement location is changed.

FIG. 7 is a graph showing the results of a dual probe unit evaluation experiment using the electron microscope micromanipulation manipulation apparatus of the present invention. The results of measuring the contact pressure and the electrical current when the dual probe placed on the dual probe unit was pressed against the specimen were graphed. The result of the force displacement detected by the contact pressure detection mechanism at that time was 28, and force detection up to about 1000 nN was possible. Further, the current value measured when pressing was 29, and measurement at about -15 nA was possible.

1 is a schematic diagram of a manipulation device for fine operation of an electron microscope according to the present invention. Explanatory drawing of the manipulator unit of the manipulation apparatus for electron microscope fine work of this invention. Explanatory drawing of the sample stand unit of the manipulation apparatus for electron microscope fine work of this invention. Explanatory drawing of the dual probe unit of the manipulation apparatus for electron microscope fine work of this invention. The schematic diagram which shows the motion of the dual probe in the case of the measurement operation | work by the manipulation apparatus for electron microscope fine work of this invention. It is explanatory drawing which showed the outline of the image processing in the case of the operation | work by the manipulation apparatus for electron microscope fine work of this invention. The graph which showed the result of the dual probe unit evaluation experiment by the manipulation apparatus for electron microscope fine work of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Vacuum chamber 2 Manipulator unit 3 Sample stand unit 4 Fixed base 5 Electron microscope barrel 6 Coarse moving stage 7 Fine moving stage 8 Dual probe unit 9 Visual specimen 10 Dual probe 11 Main probe 12 Sub probe 13 Heater 14 Strain sensor 15 Gas introduction micro tube 16 Replacement sub probe 17 Sub probe table 18 Sample table 19 Heater 20 Sample 21 Circuit pattern 22 Micron order 23 Nano order 24 Memory image (A)
25 SEM image (B) 26 Control PC
27 Control BOX 28 Result of force displacement 29 Result of current value

Claims (8)

Dual probe comprising one or more manipulator units capable of driving in the X-axis, Y-axis, and Z-axis directions and rotation of the T-axis and / or R-axis, respectively, and a main probe and a sub-probe joined thereto. A manipulation apparatus for fine operation of an electron microscope, characterized in that The manipulation apparatus for fine operation of an electron microscope according to claim 1, wherein the sub-probe is a nanoscale minute-diameter electrode having an electrical function. 3. The manipulation apparatus for fine operation of an electron microscope according to claim 1, wherein the dual probe is attached to a dual probe unit incorporating a heating mechanism. The manipulation apparatus for fine operation of an electron microscope according to any one of claims 1 to 3, wherein a contact pressure detection mechanism is attached to the dual probe unit. A dual probe unit and / or a replacement sub-probe and / or a gas introduction microtube are mounted on the manipulator unit, and the replacement sub-probe can be replaced under vacuum observation of a general-purpose electron microscope or during micro work. The manipulation apparatus for fine operation of an electron microscope according to any one of claims 1 to 4. In the manipulation apparatus for fine operation of an electron microscope according to any one of claims 1 to 5, a sample stage unit capable of driving in the X-axis, Y-axis, and Z-axis directions and rotating the θ-axis is mounted, A manipulation apparatus for fine operation of an electron microscope, characterized in that a sample stage, a sub probe for replacement and / or a heating mechanism are mounted on the sample stage unit. When performing a fine work on a specimen using the electron microscope fine work manipulation device according to any one of claims 1 to 6, an image of a positioning operation or a probing operation in a previous work is processed. A fine work method characterized in that it can be taken into a memory and fed back to a positioning operation and a probing operation in a new fine work, and multi-display of these images is possible. A sub-probe that is a nanoscale micro-diameter electrode having an electrical function when performing electrical measurement using the dual probe of the manipulation apparatus for fine operation of an electron microscope according to any one of claims 1 to 6. An electrical measurement method characterized in that it is possible to perform measurement by directly bonding to a measurement sample and also performing electrical measurement using a main probe.

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