JP2006222174A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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JP2006222174A
JP2006222174A JP2005032479A JP2005032479A JP2006222174A JP 2006222174 A JP2006222174 A JP 2006222174A JP 2005032479 A JP2005032479 A JP 2005032479A JP 2005032479 A JP2005032479 A JP 2005032479A JP 2006222174 A JP2006222174 A JP 2006222174A
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substrate
transfer
unit
cassette
container
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JP4445407B2 (en
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Hiroyuki Iwakura
裕幸 岩倉
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Hitachi Kokusai Electric Inc
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Hitachi Kokusai Electric Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To improve a throughput by shortening the conveyance time duration of a cassette in a substrate processing apparatus. <P>SOLUTION: The substrate processing apparatus includes a heat treatment furnace 6; a substrate holder 8; a substrate conveyance vessel containing means 3; a material conveying/delivering unit 2; one set of conveying means 4 for performing the conveyance of a substrate vessel; a substrate transfer means 9; a control means 13 for controlling the conveying means and the substrate transfer means; a designating means for specifying the conveying operation mode which forbids the above conveying means from performing the conveyance of the above substrate conveyance vessel between a buffer container and the above material conveying/delivering unit; and a selecting means for selecting a conveyance operation mode specified by this designation means and a conveyance operation mode which can convey the substrate conveyance vessel between the above buffer container and the above material conveying/delivering unit, even during the periods of the need that the above conveying means performs the conveyance of the substrate conveyance vessel between an object to be transferred and the above buffer container or the above material conveying/delivering unit by the conveying means. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、シリコンウェーハ、ガラス基板等の基板に薄膜の生成、不純物の拡散、アニール処理、エッチング等の処理を行う基板処理装置に関するものである。   The present invention relates to a substrate processing apparatus for performing processes such as thin film generation, impurity diffusion, annealing, and etching on a substrate such as a silicon wafer and a glass substrate.

基板処理装置には、基板を1枚ずつ処理する枚葉式の基板処理装置、或は所定枚数を一度に処理するバッチ式の基板処理装置がある。又、バッチ式の基板処理装置には縦型の処理炉を具備する縦型基板処理装置、横型の処理炉を具備する横型の基板処理装置とがある。   The substrate processing apparatus includes a single-wafer type substrate processing apparatus that processes substrates one by one, or a batch type substrate processing apparatus that processes a predetermined number of sheets at a time. The batch type substrate processing apparatus includes a vertical substrate processing apparatus having a vertical processing furnace and a horizontal substrate processing apparatus having a horizontal processing furnace.

基板処理装置への基板の搬入出は、カセット等の基板搬送容器(以下、カセット)に基板を収納し、カセットを人、若しくは自動搬送機により搬送することで行っている。   The substrate is carried into and out of the substrate processing apparatus by storing the substrate in a substrate transport container (hereinafter referred to as a cassette) such as a cassette and transporting the cassette by a person or an automatic transport machine.

先ず、基板処理装置の1つである縦型炉を具備し、シリコンウェーハ等から半導体装置を製造する基板処理装置について、図3に於いて概略を説明する。   First, a substrate processing apparatus that includes a vertical furnace, which is one of the substrate processing apparatuses, and manufactures a semiconductor device from a silicon wafer or the like will be outlined with reference to FIG.

基板処理装置1は半導体製造ラインを構成する様に設置され、該基板処理装置1への基板の搬送は、カセット等の基板搬送容器に基板を収納して行われている。   The substrate processing apparatus 1 is installed so as to constitute a semiconductor manufacturing line, and the substrate is transferred to the substrate processing apparatus 1 by storing the substrate in a substrate transfer container such as a cassette.

図3中、2は前記基板処理装置1の前面に設けられた材料搬入出部(カセット授受ステージ)であり、3はカセットに装填された材料を一時的に収納する基板搬送容器収納手段(カセット棚)、4は前記カセット授受ステージ2と前記カセット棚3との間に設けられた1組のカセット搬送手段であり、該カセット搬送手段4は前記カセット授受ステージ2と前記カセット棚3との間でカセット5を搬送する。   In FIG. 3, 2 is a material loading / unloading section (cassette transfer stage) provided on the front surface of the substrate processing apparatus 1, and 3 is a substrate transfer container storage means (cassette) for temporarily storing the material loaded in the cassette. (Shelf) 4 is a set of cassette carrying means provided between the cassette delivery stage 2 and the cassette shelf 3, and the cassette carrying means 4 is located between the cassette delivery stage 2 and the cassette shelf 3. To transport the cassette 5.

前記基板処理装置1の後部上方にはヒータユニット、該ヒータユニット内部に設けられる反応室(いずれも図示せず)を有する縦型熱処理炉6が設けられている。該縦型熱処理炉6の下方には昇降手段であるボートエレベータ7が設けられ、該ボートエレベータ7は基板保持具であるボート8を昇降させ、前記反応室に前記ボート8を装入、引出しする。   A vertical heat treatment furnace 6 having a heater unit and a reaction chamber (both not shown) provided inside the heater unit is provided above the rear portion of the substrate processing apparatus 1. Below the vertical heat treatment furnace 6, there is provided a boat elevator 7 which is an elevating means. The boat elevator 7 raises and lowers a boat 8 which is a substrate holder, and the boat 8 is loaded into and extracted from the reaction chamber. .

前記ボートエレベータ7と前記カセット棚3との間に基板移載機9が設けられ、該基板移載機9は前記カセット棚3に収納された前記カセット5と降下状態の前記ボートエレベータ7との間でウェーハ等の基板(以下、ウェーハ)の移載を行う。   A substrate transfer device 9 is provided between the boat elevator 7 and the cassette shelf 3, and the substrate transfer device 9 is connected to the cassette 5 stored in the cassette shelf 3 and the boat elevator 7 in the lowered state. A substrate such as a wafer (hereinafter referred to as a wafer) is transferred between them.

人若しくは外部搬送装置により前記カセット5が前記カセット授受ステージ2に投入され、前記カセット搬送手段4が前記カセット授受ステージ2のカセット5を前記カセット棚3に搬送する。該カセット棚3は、単に前記カセット5を一時的に保管するバッファ収納部とウェーハの移載に供される前記カセット5を収納する移載対象部とを有している。   The cassette 5 is inserted into the cassette transfer stage 2 by a person or an external transfer device, and the cassette transfer means 4 transfers the cassette 5 of the cassette transfer stage 2 to the cassette shelf 3. The cassette shelf 3 simply has a buffer storage section for temporarily storing the cassette 5 and a transfer target section for storing the cassette 5 used for transferring wafers.

前記基板移載機9は前記カセット棚3の前記移載対象部のカセット5に対してウェーハの移載が可能であり、前記カセット搬送手段4は、前記バッファ収納部と移載対象部との間での前記カセット5の搬送も行う。即ち、ウェーハの移載に供される前記カセット5を前記バッファ収納部から前記移載対象部に移動し、又該移載対象部から前記バッファ収納部へ搬送する。例えば、1バッチで100枚のウェーハをボートに搭載して処理する場合は、25枚のウェーハの入ったカセットを4回、前記バッファ収納部から前記移載対象部へ搬送する必要がある。   The substrate transfer device 9 is capable of transferring wafers to the cassette 5 of the transfer target portion of the cassette shelf 3, and the cassette transfer means 4 includes a buffer storage portion and a transfer target portion. The cassette 5 is also transported between them. That is, the cassette 5 used for wafer transfer is moved from the buffer storage unit to the transfer target unit, and is transferred from the transfer target unit to the buffer storage unit. For example, when processing 100 wafers in a batch on a boat, it is necessary to transport a cassette containing 25 wafers from the buffer storage unit to the transfer target unit four times.

前記基板移載機9は前記カセット棚3のカセット5から未処理ウェーハを前記ボート8に移載し、未処理ウェーハは該ボート8に保持された状態で、前記ボートエレベータ7により前記反応室(図示せず)に装入される。前記ボート8が装入された状態では、前記反応室は気密状態であり、前記ヒータユニット(図示せず)でウェーハが加熱され、反応ガスが導入されつつ排気され、所定の処理圧力、処理温度に維持され、レシピに設定されたステップが実行されることでウェーハが処理される。   The substrate transfer machine 9 transfers unprocessed wafers from the cassette 5 of the cassette shelf 3 to the boat 8, and the unprocessed wafers are held in the boat 8, and the reaction chamber ( (Not shown). When the boat 8 is loaded, the reaction chamber is in an airtight state, the wafer is heated by the heater unit (not shown), the reaction gas is introduced and exhausted, and a predetermined processing pressure and processing temperature are set. The wafer is processed by executing the steps set in the recipe.

ウェーハの処理が完了すると、前記ボートエレベータ7により前記ボート8が引出され、処理済ウェーハが前記基板移載機9により、前記ボート8から前記カセット棚3に収納されている空のカセット5に移載され、処理済ウェーハを収納するカセット(以下、処理済カセット)5が前記カセット搬送手段4により前記カセット授受ステージ2に払出され、人又は外部搬送装置により該カセット授受ステージ2から前記処理済カセット5が搬出される。未処理ウェーハを収納するカセット(以下、未処理カセット)5が前記バッファ収納部から前記移載対象部へ前記カセット搬送手段4により搬送される。又、外部搬送装置により前記カセット授受ステージ2へ搬入された未処理カセット5を前記カセット授受ステージ2から前記カセット棚3のバッファ収納部へ搬送する。   When the processing of the wafer is completed, the boat 8 is pulled out by the boat elevator 7, and the processed wafer is transferred from the boat 8 to the empty cassette 5 stored in the cassette shelf 3 by the substrate transfer device 9. A cassette (hereinafter referred to as a processed cassette) 5 that is loaded and stores processed wafers is discharged to the cassette transfer stage 2 by the cassette transfer means 4, and the processed cassette is transferred from the cassette transfer stage 2 by a person or an external transfer device. 5 is carried out. A cassette 5 for storing unprocessed wafers (hereinafter referred to as “unprocessed cassette”) is transferred from the buffer storage unit to the transfer target unit by the cassette transfer means 4. Further, the unprocessed cassette 5 carried into the cassette transfer stage 2 by the external transfer device is transferred from the cassette transfer stage 2 to the buffer storage section of the cassette shelf 3.

前記基板処理装置1内で一度に処理可能なウェーハの枚数(材料の量)は上限があり、処理する枚数はウェーハ1枚から上限の間で所要枚数が処理される。上限は、前記ボート8がウェーハを保持可能な枚数、例えば数カセット分のウェーハである。   There is an upper limit on the number of wafers (amount of material) that can be processed at one time in the substrate processing apparatus 1, and the required number of wafers to be processed is processed between one wafer and the upper limit. The upper limit is the number of wafers that can be held by the boat 8, for example, several cassettes.

1バッチ分のウェーハの数が数カセット分に相当する場合、前記カセット搬送手段4は次バッチ処理準備工程で、処理済カセット5の前記カセット授受ステージ2への搬送動作、該カセット授受ステージ2からの未処理カセット5の前記バッファ収納部への搬送動作、未処理カセット5をバッファ収納部から移載対象部へ移動する搬送動作とをシリーズに順次行う。   When the number of wafers for one batch corresponds to several cassettes, the cassette transport means 4 is a next batch processing preparation step, and the transport operation of the processed cassette 5 to the cassette transfer stage 2 is performed from the cassette transfer stage 2. The transfer operation of the unprocessed cassette 5 to the buffer storage unit and the transfer operation of moving the unprocessed cassette 5 from the buffer storage unit to the transfer target unit are sequentially performed in series.

前記カセット5の投入時期(カセット5の前記カセット授受ステージ2への搬入時期)について、半導体製造ラインが自動化されていない場合は、作業者が前記基板処理装置1内に空き状態、例えば前記カセット棚3に空きがあるかどうか、又処理待ち材料発生(前記縦型熱処理炉6でウェーハが処理されておらず、ウェーハの装入待ち状態)であるかどうかを監視し、両方が揃った時点で、次処理の準備を開始する。   When the semiconductor production line is not automated with respect to the loading time of the cassette 5 (the loading time of the cassette 5 to the cassette transfer stage 2), the worker is in an empty state in the substrate processing apparatus 1, for example, the cassette shelf 3 is monitored to see if there is a vacant material and whether or not the material to be processed is generated (wafer is not being processed in the vertical heat treatment furnace 6 and the wafer is waiting to be loaded). Then, preparation for the next process is started.

従来、前記カセット搬送手段4による未処理カセット5の前記バッファ収納部から前記移載対象部への移動、処理済カセット5の前記移載対象部から前記カセット授受ステージ2への払出しは、並行処理、即ち交互に行われており、全ての処理済カセット5の払出しと全ての所定数の未処理カセット5の移載対象部への搬送が完了してから、次処理が行われる様になっている。   Conventionally, the movement of the unprocessed cassette 5 from the buffer storage unit to the transfer target unit by the cassette transport means 4 and the delivery of the processed cassette 5 from the transfer target unit to the cassette transfer stage 2 are performed in parallel. In other words, the processing is performed alternately, and after the processing of all the processed cassettes 5 and the transfer of all the predetermined number of unprocessed cassettes 5 to the transfer target portion is completed, the next processing is performed. Yes.

この為、カセット搬送作業は多くの時間を要しており、スループットの向上を妨げる要因となっていた。   For this reason, the cassette carrying work requires a lot of time, which has been a factor that hinders improvement in throughput.

本発明は斯かる実情に鑑み、次にバッチ処理するカセットを優先して搬送することにより、基板処理装置内に於けるカセットの搬送時間を短縮してスループットの向上を図ろうとするものである。   In view of such circumstances, the present invention intends to improve the throughput by shortening the transport time of the cassette in the substrate processing apparatus by transporting the cassette for batch processing with priority.

本発明は、熱処理炉と、該熱処理炉内で基板を保持する基板保持具と、装置内に設けられた基板搬送容器収納手段と、基板搬送容器を装置外部との間で搬入、払出しを行う為の材料搬入出部と、該材料搬入出部と前記基板搬送容器収納手段との間で基板搬送容器の搬送及び基板搬送容器収納手段内でのバッファ収納部と移載対象部間での基板搬送容器の搬送を行う1組の搬送手段と、前記移載対象部の前記基板搬送容器と前記基板保持具との間で基板の移載を行う基板移載手段と、前記搬送手段及び前記基板移載手段を制御する制御手段と、前記移載対象部の前記基板搬送容器から前記基板保持具へ次に処理する基板の移載を行う為に、前記搬送手段が前記移載対象部と前記バッファ収納部又は前記材料搬入出部との間で基板搬送容器の搬送を行う必要のある期間は、前記搬送手段が前記バッファ収納部と前記材料搬入出部との間で前記基板搬送容器の搬送を行うことを禁止する搬送作動態様を指定する指定手段と、該指定手段によって指定された搬送作動態様と、前記移載対象部の前記基板搬送容器から前記基板保持具へ次に処理する基板の移載を行う為に、前記搬送手段が前記移載対象部と前記バッファ収納部又は前記材料搬入出部との間で基板搬送容器の搬送を行う必要のある期間も、前記搬送手段が前記バッファ収納部と前記材料搬入出部との間で前記基板搬送容器の搬送を行うことを可能とする搬送作動態様とを選択する選択手段とを具備する基板処理装置に係るものである。   The present invention carries in and out of a heat treatment furnace, a substrate holder for holding the substrate in the heat treatment furnace, a substrate transport container storage means provided in the apparatus, and the substrate transport container to and from the outside of the apparatus. A material loading / unloading unit, a substrate conveying container between the material loading / unloading unit and the substrate transfer container storage means, and a substrate between the buffer storage unit and the transfer target part in the substrate transfer container storage means A set of transport means for transporting the transport container, a substrate transfer means for transferring a substrate between the substrate transport container and the substrate holder of the transfer target section, the transport means, and the substrate In order to transfer a substrate to be processed next from the substrate transfer container of the transfer target unit to the substrate holder, the transfer unit controls the transfer unit and the transfer target unit and the transfer target unit. Transfer of substrate transfer container to / from buffer storage unit or material loading / unloading unit A designation unit that designates a conveyance operation mode that prohibits the conveyance unit from conveying the substrate conveyance container between the buffer storage unit and the material loading / unloading unit, and the designation unit; In order to transfer the substrate to be processed next from the substrate transfer container of the transfer target portion to the substrate holder, the transfer means transfers the transfer target portion and the buffer. Even during a period in which the substrate transfer container needs to be transferred between the storage unit or the material loading / unloading unit, the transfer unit transfers the substrate transfer container between the buffer storage unit and the material loading / unloading unit. The present invention relates to a substrate processing apparatus including a selection unit that selects a transfer operation mode that can be performed.

又本発明は、熱処理炉と、該熱処理炉内で基板を保持する基板保持具と、装置内に設けられた基板搬送容器収納手段と、基板搬送容器を装置外部との間で搬入、払出しを行う為の材料搬入出部と、該材料搬入出部と前記基板搬送容器収納手段との間で基板搬送容器の搬送及び基板搬送容器収納手段内でのバッファ収納部と移載対象部間での基板搬送容器の搬送を行う1組の搬送手段と、前記移載対象部の前記基板搬送容器と前記基板保持具との間で基板の移載を行う基板移載手段と、前記搬送手段及び前記基板移載手段を制御する制御手段と、前記移載対象部の前記基板搬送容器から前記基板保持具へ次に処理する基板の移載を行う為に、前記搬送手段が前記移載対象部と前記バッファ収納部又は前記材料搬入出部との間で基板搬送容器の搬送を行う必要のある期間は、前記搬送手段が前記バッファ収納部と前記材料搬入出部との間で前記基板搬送容器の搬送を行うことを禁止する搬送作動態様を指定する指定手段と、該指定手段によって指定された搬送作動態様と、前記移載対象部の前記基板搬送容器から前記基板保持具へ次に処理する基板の移載を行う為に、前記搬送手段が前記移載対象部と前記バッファ収納部又は前記材料搬入出部との間で基板搬送容器の搬送を行う必要のある期間も、前記搬送手段が前記バッファ収納部と前記材料搬入出部との間で前記基板搬送容器の搬送を行うことを可能とする搬送作動態様とを選択する選択手段とを具備する基板処理装置に於いて、外部から投入され未処理基板を収納する基板搬送容器を前記バッファ収納部へ搬入する工程と、処理済基板を前記移載対象部の基板搬送容器に移載する工程と、処理済基板を収納する処理済基板搬送容器を前記移載対象部から前記バッファ収納部へ搬送する工程と、前記移載対象部の未処理基板搬送容器から前記基板保持具へ未処理基板を移載する工程とを有すると共に、次バッチ分の未処理基板を全て前記基板保持具に移載した後前記バッファ収納部から処理済基板搬送容器を払出す工程と前記基板保持具へ未処理基板を移載する間に前記バッファ収納部から処理済基板搬送容器を払出す工程とのいずれかを選択可能とした基板処理方法に係るものである。   The present invention also provides a heat treatment furnace, a substrate holder for holding the substrate in the heat treatment furnace, a substrate transport container storage means provided in the apparatus, and a substrate transport container carried in and out of the apparatus. A material loading / unloading unit for carrying out the substrate conveyance between the material loading / unloading unit and the substrate transfer container storage means, and between the buffer storage unit and the transfer target part in the substrate transfer container storage means; A set of transfer means for transferring the substrate transfer container; a substrate transfer means for transferring a substrate between the substrate transfer container and the substrate holder of the transfer target portion; the transfer means; Control means for controlling the substrate transfer means; and for transferring the substrate to be processed next from the substrate transfer container of the transfer target section to the substrate holder, the transfer means and the transfer target section Transporting the substrate transport container between the buffer storage unit and the material loading / unloading unit A designation means for designating a transport operation mode for prohibiting the transport means from transporting the substrate transport container between the buffer storage section and the material carry-in / out section; In order to transfer the substrate to be processed next from the substrate transfer container of the transfer target portion to the substrate holder, the transfer means and the transfer target portion and the transfer target portion specified by the means Even during a period in which the substrate transfer container needs to be transferred between the buffer storage unit or the material carry-in / out unit, the transfer unit transfers the substrate transfer container between the buffer storage unit and the material carry-in / out unit. In a substrate processing apparatus comprising a selection means for selecting a transfer operation mode that enables performing a transfer operation, a step of loading a substrate transfer container that is input from the outside and stores an unprocessed substrate into the buffer storage unit; ,processing A step of transferring a substrate to a substrate transfer container of the transfer target unit, a step of transferring a processed substrate transfer container storing a processed substrate from the transfer target unit to the buffer storage unit, and the transfer target A step of transferring the unprocessed substrates from the unprocessed substrate transfer container of the unit to the substrate holder, and processing from the buffer storage unit after transferring all the unprocessed substrates for the next batch to the substrate holder. A substrate processing method capable of selecting either a step of paying out a processed substrate transfer container or a step of discharging a processed substrate transfer container from the buffer storage unit while transferring an unprocessed substrate to the substrate holder. It is related.

本発明によれば、熱処理炉と、該熱処理炉内で基板を保持する基板保持具と、装置内に設けられた基板搬送容器収納手段と、基板搬送容器を装置外部との間で搬入、払出しを行う為の材料搬入出部と、該材料搬入出部と前記基板搬送容器収納手段との間で基板搬送容器の搬送及び基板搬送容器収納手段内でのバッファ収納部と移載対象部間での基板搬送容器の搬送を行う1組の搬送手段と、前記移載対象部の前記基板搬送容器と前記基板保持具との間で基板の移載を行う基板移載手段と、前記搬送手段及び前記基板移載手段を制御する制御手段と、前記移載対象部の前記基板搬送容器から前記基板保持具へ次に処理する基板の移載を行う為に、前記搬送手段が前記移載対象部と前記バッファ収納部又は前記材料搬入出部との間で基板搬送容器の搬送を行う必要のある期間は、前記搬送手段が前記バッファ収納部と前記材料搬入出部との間で前記基板搬送容器の搬送を行うことを禁止する搬送作動態様を指定する指定手段と、該指定手段によって指定された搬送作動態様と、前記移載対象部の前記基板搬送容器から前記基板保持具へ次に処理する基板の移載を行う為に、前記搬送手段が前記移載対象部と前記バッファ収納部又は前記材料搬入出部との間で基板搬送容器の搬送を行う必要のある期間も、前記搬送手段が前記バッファ収納部と前記材料搬入出部との間で前記基板搬送容器の搬送を行うことを可能とする搬送作業態様とを選択する選択手段とを具備するので、基板搬送容器の搬送作動態様を基板処理に応じた最適な状態とすることができ、スループットの向上を図ることができる。   According to the present invention, a heat treatment furnace, a substrate holder for holding a substrate in the heat treatment furnace, a substrate transfer container storage means provided in the apparatus, and the substrate transfer container are carried in and out of the apparatus. A material carrying-in / out part for carrying out the process, between the material carrying-in / out part and the substrate transfer container storage means, between the buffer transfer part and the transfer target part in the substrate transfer container storage means A pair of transfer means for transferring the substrate transfer container, a substrate transfer means for transferring a substrate between the substrate transfer container and the substrate holder of the transfer target portion, the transfer means, Control means for controlling the substrate transfer means, and the transfer means to transfer the substrate to be processed next from the substrate transfer container of the transfer target portion to the substrate holder. And a substrate transfer container between the buffer storage unit and the material carry-in / out unit A designation unit that designates a conveyance operation mode that prohibits the conveyance unit from conveying the substrate conveyance container between the buffer storage unit and the material loading / unloading unit during a period during which conveyance is required; In order to transfer the substrate to be processed next from the substrate transfer container of the transfer target unit to the substrate holder, the transfer unit is connected to the transfer target unit. Even during a period in which the substrate transport container needs to be transported between the buffer storage unit or the material carry-in / out unit, the transport means can move the substrate transport container between the buffer storage unit and the material carry-in / out unit. Since there is a selection means for selecting a transfer operation mode that enables transfer, the transfer operation mode of the substrate transfer container can be brought into an optimum state according to the substrate processing, and throughput is improved. Can Kill.

以下、図面を参照しつつ本発明を実施する為の最良の形態を説明する。   The best mode for carrying out the present invention will be described below with reference to the drawings.

図1は本発明に係る基板処理装置の概略を示しており、又基板処理装置の基本的な構成は図3で示したものと同等であり、又図1中、図3中で示したものと同等のものには同符号を付しその説明を省略する。   FIG. 1 shows an outline of a substrate processing apparatus according to the present invention, and the basic configuration of the substrate processing apparatus is the same as that shown in FIG. 3, and in FIG. 1 and FIG. The same symbols are attached to the same components and the description thereof is omitted.

図1中、11は、縦型熱処理炉6のヒータ、反応ガスの供給を制御する流量制御器、或は圧力制御弁等を制御する処理作動部、12は処理温度、ガス流量、圧力等を検出するセンサ部であり、カセット授受ステージ2にはカセット5の有無を検出するカセット検出器23が設けられている。又、13は基板処理装置1の制御手段としての制御装置であり、該制御装置13は主に制御部14、ハードディスク等の外部記憶手段15、メカ制御部16、入出力制御部17、ディスプレイ、操作盤等に設けられた表示部等のデータ表示部18、キーボード等の入力手段19、材料投入管理部21、主制御装置(図示せず)に対する主入出力部22から構成されている。   In FIG. 1, 11 is a heater for the vertical heat treatment furnace 6, a flow rate controller for controlling the supply of reaction gas, or a processing operation unit for controlling a pressure control valve, etc. 12 is a processing temperature, gas flow rate, pressure, etc. A cassette detector 23 for detecting the presence or absence of the cassette 5 is provided in the cassette transfer stage 2. Reference numeral 13 denotes a control device as a control means of the substrate processing apparatus 1. The control device 13 mainly includes a control unit 14, an external storage unit 15 such as a hard disk, a mechanical control unit 16, an input / output control unit 17, a display, It comprises a data display section 18 such as a display section provided on an operation panel, an input means 19 such as a keyboard, a material input management section 21, and a main input / output section 22 for a main control device (not shown).

前記外部記憶手段15にはカセット搬送手段4、ボートエレベータ7、基板移載機9等を駆動する為のカセット搬送手段駆動シーケンスプログラム、基板移載機駆動シーケンスプログラム等、又処理設定テーブルのデータに従って実行される駆動シーケンスプログラム、前記縦型熱処理炉6で基板を処理する為の処理シーケンスプログラム、基板を処理する場合の各種処理条件、処理を実行する為のステップを設定したプロセスレシピ、処理設定テーブル等が格納されている。該処理設定テーブルには、前処理時間、材料待ちテーブル、スタート指示待ちフラグが保持され、前処理時間は(材料準備時間、基板移載時間、カセット搬送時間、前洗浄時間等)の合計であり、予め計算されたものが前記入力手段19から入力され、或は前記基板処理装置1が稼働された場合の過去のデータを前記制御部14等が積算記録し、前記外部記憶手段15に格納する。材料待ちテーブル(材料待ちフラグ:待つ/待たない、材料量:材料量[基板枚数]が指定された値になる迄処理を開始しない)が保持され、スタート指示待ちフラグ(人若しくは主制御装置(図示せず)からのスタート指示がくる迄スタートしない)が保持されている。   The external storage means 15 includes a cassette conveying means drive sequence program for driving the cassette conveying means 4, the boat elevator 7, the substrate transfer machine 9, etc., a substrate transfer machine drive sequence program, etc., and data in the processing setting table. Drive sequence program to be executed, process sequence program for processing the substrate in the vertical heat treatment furnace 6, various processing conditions for processing the substrate, process recipe in which steps for executing the processing are set, processing setting table Etc. are stored. The processing setting table holds a preprocessing time, a material waiting table, and a start instruction waiting flag, and the preprocessing time is a total of (material preparation time, substrate transfer time, cassette transfer time, precleaning time, etc.). The previously calculated data is input from the input unit 19 or the past data when the substrate processing apparatus 1 is operated is integrated and recorded by the control unit 14 and stored in the external storage unit 15. . A material waiting table (material waiting flag: wait / do not wait, material amount: material amount [the number of substrates] does not start until the specified number of substrates is reached) is held, and a start instruction waiting flag (person or main controller ( (Not shown) is held until a start instruction is received from (not shown).

前記データ表示部18には、処理すべき基板(以下未処理基板)の投入時期、投入時期の適切なタイミング、前準備時間、処理終了予定時刻、未処理基板の投入要求、材料の投入状況、一括処理中か連続処理中か、或は実行されている駆動シーケンスプログラムの内容等が表示される。   The data display unit 18 includes a loading timing of a substrate to be processed (hereinafter referred to as an unprocessed substrate), an appropriate timing of the loading timing, a pre-preparation time, a scheduled processing end time, an unprocessed substrate loading request, a material loading status, Whether batch processing or continuous processing is being performed, or the contents of the drive sequence program being executed, etc. are displayed.

前記入力手段19は、実行する駆動シーケンスプログラムの選択、該駆動シーケンスプログラムに対する処理設定テーブルの設定、基板処理の処理条件(レシピ)の設定、処理設定テーブルについての項目設定、処理設定テーブルへの設定項目の書込みを前記制御部14を介して行う。又、前記処理設定テーブルの設定項目については異なる作動条件を設定し、選択可能としてもよい。前記処理設定テーブルの設定項目としては、例えば後述する払出し待ちステップの指定有り、無しがある。   The input means 19 selects a drive sequence program to be executed, sets a processing setting table for the driving sequence program, sets processing conditions (recipe) for substrate processing, sets items for the processing setting table, and sets the processing setting table. The item is written through the control unit 14. Further, different operation conditions may be set for the setting items in the processing setting table so that they can be selected. The setting items of the processing setting table include, for example, whether or not a payout waiting step described later is specified.

ここで、前記処理設定テーブル、該処理設定テーブルへの設定項目の書込みを行う前記入力手段19、前記制御部14等は、搬送態様指定手段を構成し、更に前記処理設定テーブルの設定項目の選択は前記入力手段19、前記制御部14によって行われ、前記入力手段19、前記制御部14等は搬送態様選択手段を構成する。   Here, the process setting table, the input means 19 for writing setting items to the process setting table, the control unit 14, etc. constitute a transport mode specifying means, and further select setting items in the process setting table. Is performed by the input unit 19 and the control unit 14, and the input unit 19, the control unit 14 and the like constitute a conveyance mode selection unit.

前記材料投入管理部21は前記カセット棚3に於ける前記カセット5の収納状態、未処理基板の投入状態を監視し、前記カセット5の前記カセット授受ステージ2から前記カセット棚3への搬送、該カセット棚3でのバッファ収納部・移載対象部間の搬送、前記カセット棚3から前記カセット授受ステージ2への搬送の可否、処理開始可能通知等を前記制御部14に通知する。   The material input management unit 21 monitors the storage state of the cassette 5 in the cassette shelf 3 and the input state of unprocessed substrates, transports the cassette 5 from the cassette transfer stage 2 to the cassette shelf 3, The control unit 14 is notified of the transfer between the buffer storage unit and the transfer target unit in the cassette shelf 3, whether the transfer from the cassette shelf 3 to the cassette transfer stage 2 is possible, the notification that processing can be started, and the like.

該制御部14は前記入力手段19からの指令、主制御装置(図示せず)からの指令に従って前記外部記憶手段15から所要のプログラムを起動し、又設定された条件でプログラムを実行し、又該外部記憶手段15からプロセスレシピ等、所要のデータを読込む。又、前記制御部14は、前記基板処理装置1でプロセスレシピを実行し、基板処理している状態で、プロセスレシピの実行状態を監視し処理の残存時間を演算し、該残存時間が前記前準備時間に等しくなった時点(未処理基板の適切な投入時期、タイミング)を判断し、この時点で判断結果を前記材料投入管理部21に送出する。   The control unit 14 starts a required program from the external storage means 15 according to a command from the input means 19 and a command from a main control device (not shown), executes the program under set conditions, The required data such as a process recipe is read from the external storage means 15. Further, the control unit 14 executes a process recipe in the substrate processing apparatus 1 and monitors the execution state of the process recipe in a state where the substrate is being processed, and calculates the remaining time of the process. When the time becomes equal to the preparation time (appropriate charging timing and timing of the unprocessed substrate), the determination result is sent to the material charging management unit 21 at this time.

又、前記制御部14は前記センサ部12からの信号を基に前記入出力制御部17を介して前記処理作動部11を制御し、処理温度、供給ガス流量、処理圧力、処理時間等レシピに設定された内容で基板の処理を行う。   Further, the control unit 14 controls the processing operation unit 11 via the input / output control unit 17 based on a signal from the sensor unit 12 to make a recipe such as processing temperature, supply gas flow rate, processing pressure, processing time, etc. The substrate is processed with the set contents.

前記材料投入管理部21は、前記制御部14から送出された判断に基づき、前記データ表示部18に基板投入要求を発して表示させ、又前記主入出力部22を介して主制御装置(図示せず)に投入要求を送信する。   The material input management unit 21 issues a substrate input request on the data display unit 18 based on the determination sent from the control unit 14 and displays the substrate input request via the main input / output unit 22. (Not shown).

本発明に於ける、前記縦型熱処理炉6での基板処理自体については従来と同様であるので説明を省略する。   In the present invention, the substrate processing itself in the vertical heat treatment furnace 6 is the same as the conventional one, and the description thereof is omitted.

以下、本発明の実施形態に於けるカセットの搬送作動について図2を参照して説明する。   Hereinafter, the cassette transport operation according to the embodiment of the present invention will be described with reference to FIG.

前記カセット搬送手段4の駆動シーケンスについては、複数の搬送作動態様が設定されており、搬送作動態様の選択は前記入力手段19により選択される。例えば、本実施の形態では搬送作動態様A、搬送作動態様Bが設定され、例えば前記処理設定テーブルの設定項目で払出し待ちステップの指定有り、無しを指定することで、搬送作動態様A、搬送作動態様Bのいずれかが選択される。前記制御装置13は、選択された搬送作動態様を実行する。ここで、払出し待ちステップ有りの指定は、処理済基板の払出し処理等よりも次バッチの未処理基板の前記ボート8への移載等を優先させる搬送作動態様であり、払出し待ちステップ無しの場合は従来と同様の搬送作動態様である。   A plurality of transport operation modes are set for the drive sequence of the cassette transport unit 4, and the selection of the transport operation mode is selected by the input unit 19. For example, in this embodiment, the transport operation mode A and the transport operation mode B are set. For example, by specifying whether or not the payout waiting step is specified in the setting item of the processing setting table, the transport operation mode A and the transport operation are specified. Any of the aspects B is selected. The control device 13 executes the selected transport operation mode. Here, the designation of having a payout waiting step is a transfer operation mode in which transfer of unprocessed substrates of the next batch to the boat 8 is prioritized over payout processing of processed substrates, etc., and there is no payout waiting step Is the same transport operation mode as before.

先ず、払出し待ちステップ有りの指定によって、例えば搬送作動態様Aが選択された場合を説明する。   First, a case where, for example, the transport operation mode A is selected by specifying that there is a payout waiting step will be described.

前記縦型熱処理炉6での基板処理が完了すると、処理済基板の前記縦型熱処理炉6からの搬出及び前記カセット棚3への搬送が行われる(STEP:01)。即ち、前記ボート8が降下され、前記基板移載機9により前記ボート8から処理済基板が移載対象部に収納されている空のカセット5に移載される。処理済カセット5が前記カセット搬送手段4によりバッファ収納部に搬送される。   When the substrate processing in the vertical heat treatment furnace 6 is completed, the processed substrate is carried out from the vertical heat treatment furnace 6 and transferred to the cassette shelf 3 (STEP: 01). That is, the boat 8 is lowered, and the processed substrate is transferred from the boat 8 to the empty cassette 5 accommodated in the transfer target portion by the substrate transfer device 9. The processed cassette 5 is transported to the buffer storage section by the cassette transport means 4.

前記カセット棚3内に次バッチ分の未処理カセットが収納されているかどうかが確認され、次バッチ分の未処理カセットが前記カセット棚3に収納されていない場合は、前記カセット搬送手段4による未処理カセットの前記カセット棚3への搬入が行われる(STEP:02、STEP:03)。尚、前記未処理カセットは、通常は前バッチ分の基板が熱処理されている間に、前記カセット棚3内に収納される。   It is confirmed whether or not unprocessed cassettes for the next batch are stored in the cassette shelf 3, and if unprocessed cassettes for the next batch are not stored in the cassette shelf 3, The processing cassette is carried into the cassette shelf 3 (STEP: 02, STEP: 03). The unprocessed cassette is usually stored in the cassette shelf 3 while the substrate for the previous batch is heat-treated.

前記カセット棚3に次バッチ分の未処理カセットが収納されている場合は、次バッチ処理の開始が指示され(STEP:04)、払出し待ちステップの指定有り、無しの判断が成される(STEP:05)。   When unprocessed cassettes for the next batch are stored in the cassette shelf 3, the start of the next batch process is instructed (STEP: 04), and it is determined whether or not a payout waiting step is specified (STEP 04). : 05).

払出し待ちステップの指定有りと判断されると、払出し指定ステップが実行され(STEP:06)、前記カセット搬送手段4により未処理カセット5が前記カセット棚3のバッファ収納部から移載対象部へ移動される。次に移載対象部の前記未処理カセット5から前記ボート8へ基板が移載される。そして、前記基板移載中或は前記カセット搬送手段4が前記移載対象部と前記バッファ収納部との間で前記未処理カセット5の搬送を行う必要がある期間は、前記バッファ収納部と前記カセット授受ステージ2間への前記処理済カセット5の搬送が禁止される。   If it is determined that a payout waiting step is specified, a payout specifying step is executed (STEP: 06), and the unprocessed cassette 5 is moved from the buffer storage portion of the cassette shelf 3 to the transfer target portion by the cassette carrying means 4. Is done. Next, the substrate is transferred from the unprocessed cassette 5 of the transfer target portion to the boat 8. During the substrate transfer or during a period when the cassette transfer means 4 needs to transfer the unprocessed cassette 5 between the transfer target unit and the buffer storage unit, the buffer storage unit and the buffer storage unit 4 Transport of the processed cassette 5 between the cassette transfer stages 2 is prohibited.

前記制御部14は、前記カセット搬送手段4の駆動状況を監視し、次に処理する未処理基板を全て前記ボート8に移載し終わったこと、又は移載し終わる為に最後の未処理カセット5が前記カセット棚3のバッファ収納部から移載対象部へ移動したことを確認すると、前記処理済カセット5を前記カセット授受ステージ2に払出すこと或はカセット授受ステージ2からカセット棚3へ搬送することを可能とする(STEP:07)。尚、本実施の形態では、未処理基板を前記ボート8に移載するステップの次のステップであるボートステップになったら、前記処理済カセット5を前記カセット授受ステージ2に払出す様にしているが、このタイミングに拘わらず、全ての未処理カセット5内の基板を前記ボート8に移載した後であればよい。   The control unit 14 monitors the driving state of the cassette conveying means 4 and has transferred all unprocessed substrates to be processed next to the boat 8 or the last unprocessed cassette to complete the transfer. When it is confirmed that 5 has moved from the buffer storage portion of the cassette shelf 3 to the transfer target portion, the processed cassette 5 is paid out to the cassette delivery stage 2 or transferred from the cassette delivery stage 2 to the cassette shelf 3. (STEP: 07). In the present embodiment, the processed cassette 5 is delivered to the cassette transfer stage 2 when the boat step is the next step after the step of transferring the unprocessed substrate to the boat 8. However, it suffices if all the substrates in the unprocessed cassette 5 are transferred to the boat 8 regardless of this timing.

払出し待ちステップの指定有りと判断され、払出し指定ステップが実行中には、レシピ実行に必要とされるカセット5の搬送が優先され、未処理カセット5の前記カセット授受ステージ2から前記カセット棚3への搬送、処理済カセット5の前記カセット棚3から前記カセット授受ステージ2への払出しは、レシピ実行に必要とされるカセット5の搬送後に可能とする。   When it is determined that a payout waiting step has been specified and the payout specifying step is being executed, transport of the cassette 5 required for recipe execution is prioritized, and the cassette transfer stage 2 of the unprocessed cassette 5 is transferred to the cassette shelf 3. The transfer of the processed cassette 5 from the cassette shelf 3 to the cassette transfer stage 2 is made possible after the cassette 5 required for executing the recipe is transferred.

而して、前記カセット搬送手段4の搬送作動に於いて、基板処理のレシピ実行に必要な前記カセット5の搬送、即ち前記基板移載機9による基板移載に関連するカセット5の搬送が優先して行われる。よって、次に処理する未処理基板の搬送を優先して行うことになり、スループット向上が見込まれる。   Thus, in the transport operation of the cassette transport means 4, priority is given to transport of the cassette 5 necessary for execution of the substrate processing recipe, that is, transport of the cassette 5 related to substrate transfer by the substrate transfer machine 9. Done. Therefore, priority is given to the transfer of the unprocessed substrate to be processed next, and an improvement in throughput is expected.

次に、払出し待ちステップ無しの指定によって、搬送作動態様Bが選択された場合を説明する。   Next, a case where the transport operation mode B is selected by specifying no payout waiting step will be described.

前バッチの処理が完了すると、前記ボート8が降下され、前記基板移載機9により処理済基板が前記移載対象部に収納されている空のカセット5に移載される。処理済カセット5が前記カセット搬送手段4により前記バッファ収納部に搬送される。   When the processing of the previous batch is completed, the boat 8 is lowered, and the processed substrate is transferred to the empty cassette 5 stored in the transfer target portion by the substrate transfer device 9. The processed cassette 5 is transported to the buffer storage unit by the cassette transport means 4.

STEP:05で払出し待ちステップの指定無しと判断されると、レシピのステップが順次実行されると共にステップの進行状態が監視される。未処理基板を前記ボート8に移載するステップが実行される状態となると、前記カセット搬送手段4により未処理カセット5が前記バッファ収納部から移載対象部へ搬送され、前記未処理カセット5内の基板が前記ボート8に移載される。前記ボート8への移載中にも必要に応じて、処理済カセット5がバッファ収納部から前記カセット授受ステージ2へ払出される。   If it is determined in STEP: 05 that no payout waiting step is specified, the recipe steps are sequentially executed and the progress of the steps is monitored. When the step of transferring the unprocessed substrate to the boat 8 is executed, the cassette transfer means 4 transfers the unprocessed cassette 5 from the buffer storage unit to the transfer target unit, and the inside of the unprocessed cassette 5 Are transferred to the boat 8. During the transfer to the boat 8, the processed cassette 5 is discharged from the buffer storage portion to the cassette transfer stage 2 as necessary.

上述した様に、搬送態様指定手段、搬送態様選択手段により、基板の処理条件に対応してスループットを向上させるに最適な搬送作動態様が選択できる。   As described above, the transfer mode designating unit and the transfer mode selection unit can select an optimal transfer operation mode for improving the throughput in accordance with the substrate processing conditions.

尚、上記では、前記ボート8へ基板を移載するの場合について説明したが、前記ボート8から基板を払出す際にも、本発明の適用は可能である。   In the above description, the case where the substrate is transferred to the boat 8 has been described. However, the present invention can also be applied when the substrate is discharged from the boat 8.

又、本発明は、CVD、酸化、拡散、アニール処理等、基板処理全般に実施可能であることは勿論である。更に、本実施例では、カセット棚にバッファ収納部と、移載対象部を有する装置として説明したが、特にバッファ収納部と移載対象部は1つのカセット棚にある必要はなく、個別に装置内に有してもよい。   Of course, the present invention can be implemented in general substrate processing such as CVD, oxidation, diffusion, and annealing. Further, in the present embodiment, the apparatus has the buffer storage unit and the transfer target unit on the cassette shelf, but the buffer storage unit and the transfer target unit do not have to be in one cassette shelf, and are individually installed. You may have in.

本発明の実施の形態を示すブロック図である。It is a block diagram which shows embodiment of this invention. 本発明の実施の形態を示すフローチャートである。It is a flowchart which shows embodiment of this invention. 半導体製造装置の概略斜視図である。It is a schematic perspective view of a semiconductor manufacturing apparatus.

符号の説明Explanation of symbols

1 基板処理装置
2 カセット授受ステージ
3 カセット棚
4 カセット搬送手段
5 カセット
6 縦型熱処理炉
9 基板移載機
11 処理作動部
12 センサ部
13 制御装置
14 制御部
15 外部記憶手段
16 メカ制御部
17 入出力制御部
18 データ表示部
19 入力手段
21 材料投入管理部
22 主入出力部
23 カセット検出器
DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Cassette transfer stage 3 Cassette shelf 4 Cassette conveyance means 5 Cassette 6 Vertical heat treatment furnace 9 Substrate transfer machine 11 Processing operation part 12 Sensor part 13 Control apparatus 14 Control part 15 External storage means 16 Mechanical control part 17 Input Output control unit 18 Data display unit 19 Input means 21 Material input management unit 22 Main input / output unit 23 Cassette detector

Claims (1)

熱処理炉と、該熱処理炉内で基板を保持する基板保持具と、装置内に設けられた基板搬送容器収納手段と、基板搬送容器を装置外部との間で搬入、払出しを行う為の材料搬入出部と、該材料搬入出部と前記基板搬送容器収納手段との間で基板搬送容器の搬送及び基板搬送容器収納手段内でのバッファ収納部と移載対象部間での基板搬送容器の搬送を行う1組の搬送手段と、前記移載対象部の前記基板搬送容器と前記基板保持具との間で基板の移載を行う基板移載手段と、前記搬送手段及び前記基板移載手段を制御する制御手段と、前記移載対象部の前記基板搬送容器から前記基板保持具へ次に処理する基板の移載を行う為に、前記搬送手段が前記移載対象部と前記バッファ収納部又は前記材料搬入出部との間で基板搬送容器の搬送を行う必要のある期間は、前記搬送手段が前記バッファ収納部と前記材料搬入出部との間で前記基板搬送容器の搬送を行うことを禁止する搬送作動態様を指定する指定手段と、該指定手段によって指定された搬送作動態様と、前記移載対象部の前記基板搬送容器から前記基板保持具へ次に処理する基板の移載を行う為に、前記搬送手段が前記移載対象部と前記バッファ収納部又は前記材料搬入出部との間で基板搬送容器の搬送を行う必要のある期間も、前記搬送手段が前記バッファ収納部と前記材料搬入出部との間で前記基板搬送容器の搬送を行うことを可能とする搬送作動態様とを選択する選択手段とを具備することを特徴とする基板処理装置。   A heat treatment furnace, a substrate holder for holding the substrate in the heat treatment furnace, a substrate transport container storage means provided in the apparatus, and material loading for carrying the substrate transport container in and out of the apparatus Transporting the substrate transport container between the exit section, the material loading / unloading section and the substrate transport container storage means, and transporting the substrate transport container between the buffer storage section and the transfer target section in the substrate transport container storage means A pair of transfer means, a substrate transfer means for transferring a substrate between the substrate transfer container and the substrate holder of the transfer target portion, and the transfer means and the substrate transfer means. In order to transfer a substrate to be processed next from the substrate transfer container of the transfer target unit to the substrate holder, the transfer unit includes the transfer target unit and the buffer storage unit or It is necessary to transfer the substrate transfer container to / from the material loading / unloading unit For a certain period, a designation unit that designates a conveyance operation mode that prohibits the conveyance unit from conveying the substrate conveyance container between the buffer storage unit and the material loading / unloading unit, and the designation unit designates the period. In order to transfer the substrate to be processed next from the substrate transfer container of the transfer target portion to the substrate holder, the transfer means includes the transfer target portion and the buffer storage portion or Even during a period in which the substrate transfer container needs to be transferred to and from the material loading / unloading unit, the transfer means transfers the substrate transfer container between the buffer storage unit and the material loading / unloading unit. A substrate processing apparatus comprising: a selecting unit that selects a transfer operation mode to be enabled.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102427A (en) * 1999-10-01 2001-04-13 Hitachi Ltd Process treating method, device thereof, semicoductor manufacturing line and transfer method of substrate to be treated in semiconductor manufacturing line
JP2004014984A (en) * 2002-06-11 2004-01-15 Hitachi Kokusai Electric Inc Substrate treatment equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102427A (en) * 1999-10-01 2001-04-13 Hitachi Ltd Process treating method, device thereof, semicoductor manufacturing line and transfer method of substrate to be treated in semiconductor manufacturing line
JP2004014984A (en) * 2002-06-11 2004-01-15 Hitachi Kokusai Electric Inc Substrate treatment equipment

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